Electronic component storage package, electronic device and electronic module

Abstract

The electronic component storage package includes: an insulating substrate including a first surface having a mounting area for mounting an electronic component, a second surface located on the opposite side of the first surface, a plurality of side surfaces located between the first surface and the second surface, and a corner located between two of the side surfaces; an external connection conductor located on the second surface; and a corner conductor connected to the external connection conductor. The corner conductor is arranged so that the interval between the corner conductor and the second surface becomes larger from the external connection conductor to the corner.

Description

Technical Field

[0001] The present invention relates to an electronic component housing package for housing electronic components such as piezoelectric vibration elements, etc. Background Art

[0002] Conventionally, as an electronic component storage package for mounting electronic components such as piezoelectric vibration elements or semiconductor elements, a package having a concave mounting portion for accommodating electronic components on an insulating substrate has been used. A cover is joined to the upper surface of the insulating substrate in a manner that blocks the mounting portion. Such an electronic component storage package is composed of an insulating substrate and a wiring conductor, the insulating substrate having a flat base having a mounting portion for the electronic component on the upper surface, and a frame-like frame stacked on the upper surface of the base to surround the mounting portion, and the wiring conductor is arranged from the mounting portion to the lower surface of the base.

[0003] In recent years, each wiring substrate has become smaller and smaller. When manufacturing such a small wiring substrate, it is known that a wiring substrate is divided by providing boundary dividing grooves arranged at adjacent wiring substrate regions (regions that become electronic component storage packages) of a mother substrate. In addition, a method of providing the dividing grooves using a laser with excellent positional accuracy has been proposed (see Japanese Patent Laid-Open No. 2005-50935). Summary of the invention

[0004] The electronic component storage package of the present invention comprises: an insulating substrate, which comprises a first surface having a mounting area for mounting electronic components, a second surface located on the opposite side of the first surface, a plurality of side surfaces located between the first surface and the second surface, and a corner located between the two side surfaces; an external connecting conductor located on the second surface; and a corner conductor connected to the external connecting conductor, wherein the corner conductor is arranged in such a manner that the interval between the second surface and the corner conductor becomes larger from the external connecting conductor to the corner between the two side surfaces of the insulating substrate.

[0005] An electronic device according to the present invention includes the electronic component storage package described above and an electronic component mounted in the electronic component storage package.

[0006] The electronic module of the present invention comprises the electronic device described above and a module substrate connected to the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a plan view showing the electronic component storage package according to the embodiment of the present invention.

[0008] Figure 2 yes Figure 1 Cross-sectional view at line A-A.

[0009] Figure 3It is a cross-sectional view showing a main part of the electronic component storage package according to the embodiment of the present invention.

[0010] Figure 4 It is a perspective view showing a main part of the electronic component storage package according to the embodiment of the present invention.

[0011] Figure 5 It is a bottom view showing the electronic component storage package according to the embodiment of the present invention.

[0012] Figure 6 This is a bottom view showing a multi-piece wiring board when manufacturing the electronic component storage package according to the embodiment of the present invention.

[0013] Figure 7 yes Figure 6 Cross-sectional view at line B-B.

[0014] Figure 8 2 is a cross-sectional view showing an electronic device and an electronic module according to an embodiment of the present invention.

[0015] Fig. 9 It is a cross-sectional view showing another example of the electronic component storage package and the electronic device according to the embodiment of the present invention. DETAILED DESCRIPTION

[0016] An electronic component housing package 100 (hereinafter also referred to as a wiring substrate) and the like according to the present invention will be described with reference to the drawings. Figure 1 1 is a plan view showing an example of an embodiment of an electronic component storage package 100 according to the present invention. Figure 2 yes Figure 1 Cross-sectional view at line A-A. Figure 3 1 is a cross-sectional view showing a main part of an electronic component storage package 100 according to an embodiment of the present invention. Figure 2 Part A in the figure is enlarged. Figure 4 It is shown Figure 1 1 is a perspective view of the main parts of the electronic component storage package 100. Figure 5 It is shown Figure 1 FIG. 1 is a bottom view of an electronic component storage package 100 . Figure 6 This is a bottom view showing a part of a multi-piece wiring substrate (mother substrate 200) when manufacturing the electronic component storage package 100 according to the embodiment of the present invention. Figure 7 yes Figure 6 A cross-sectional view of the mother substrate 200 taken along line BB. Figure 8 is a cross-sectional view showing an electronic device 300 and an electronic module 500 according to an embodiment of the present invention, showing Figures 1 to 5The electronic component storage package 100 shown is an example in which an electronic component 112 is mounted thereon and sealed with a lid 116 . Fig. 9 1 is a cross-sectional view of another example of an electronic device 300 using the electronic component storage package 100 according to an embodiment of the present invention. The first surface 102 of the insulating substrate 101 of the electronic component storage package 100 is used as the upper surface, and the second surface 103 is used as the lower surface, and the up and down direction is described, but this up and down direction is not necessarily the same as the up and down direction when the electronic component storage package 100 is used. It should be noted that Figure 1 , Figure 4 , Figure 5 and Figure 6 In order to easily distinguish it from other components, the conductors such as the external connection conductor 108 are painted with a dot pattern.

[0017] exist Figure 1 to Figure 5 In the embodiment, the electronic component storage package 100 has a first surface 102 which is a sealing surface, a second surface 103 which is a mounting surface for mounting on the module substrate 400, and a cavity 104 located on the first surface 102, and a mounting area 102A is located at the bottom of the cavity 104. An electronic component 112 such as a piezoelectric vibration element is mounted on the mounting area 102A. Figure 1 As shown in the example of the wiring substrate, a frame-shaped metallization layer 113 is arranged at the outer edge of the first surface 102 of the insulating substrate 101, and a pair of connection pads 114 connected to the electronic component 112 are located in the mounting area 102A inside the frame-shaped metallization layer 113. The electronic component 112 is connected to the connection pads 114, and the cover 116 is bonded to the frame-shaped metallization layer 113 of the insulating substrate 101 by a solder 118 such as a gold-tin alloy, thereby the electronic component 112 is hermetically sealed.

[0018] exist Figure 1 to Figure 5 In the example shown, the insulating substrate 101 has an upper insulating layer 106 and a lower insulating layer 107 stacked on each other. The insulating substrate 101 has a frame-shaped upper insulating layer 106 having an opening corresponding to the cavity 104 stacked on the flat lower insulating layer 107. In addition, in a plan view, the upper insulating layer 106 surrounds the mounting area 102A on the upper surface of the lower insulating layer 107. The inner side surface of the upper insulating layer 106 and the lower insulating layer 107 exposed inside the mounting area 102A provide a concave cavity 104 including the mounting area 102A for mounting the electronic component 112. By accommodating the electronic component 112 in the cavity 104, the electronic component 112 is surrounded and protected by the insulating layers 106 and 107. Furthermore, the electronic component 112 is hermetically sealed by the cover 116 that blocks the opening of the cavity 104. The cover 116 at this time can be set to a flat plate shape.

[0019] The frame-shaped metallization layer 113 is located on the first surface 102 of the insulating substrate 101 (the upper surface of the upper insulating layer 106), and inside the upper insulating layer 106, for example, a through conductor 117 is arranged from the upper surface to the lower surface. In addition, the through conductor 117 is also located directly below the through conductor 117 in the lower insulating layer 107. In this example, the through conductor 117 is located at the corner of the frame-shaped metallization layer 113 of the insulating substrate 101, but it may also be that, for example, a strip-shaped wiring conductor is located on the outer side surface of the insulating substrate 101 and the inner side surface of the cavity 104 as a conducting path.

[0020] The through conductor 117 of the upper insulating layer 106 and the through conductor 117 of the lower insulating layer 107 are overlapped and electrically connected to each other in a plan view. Figure 2 As shown in the example, a relay conductor (without reference numeral) may be located between the upper insulating layer 106 and the lower insulating layer 107. Furthermore, the through conductor 117, the relay conductor, and the through conductor 117 of the lower insulating layer 107 are connected from the frame-shaped metallization layer 113 to the upper insulating layer 106, and the through conductor 117 of the lower insulating layer 107 is connected to the external connection conductor 108 located on the second surface 103. Furthermore, the structure is such that the frame-shaped metallization layer 113 is connected to the through conductor 117, the relay conductor, and the external connection conductor 108. The cover 116 made of a conductive material such as metal is bonded to the frame-shaped metallization layer 113 using a conductive bonding material such as solder 118, and the external connection conductor 108 electrically connected to the frame-shaped metallization layer 113 is connected to the ground potential, so that the cover 116 can function as a shield against electromagnetic noise.

[0021] In the lower insulating layer 107, the connection pad 114 is located in the mounting region 102A as a conduction path for electrically connecting the mounted electronic component 112 to the external circuit of the module substrate 400, and the through conductor 117 and the relay conductor are located in the mounting region 102A. In addition, the external connection conductor 108 is located on the lower surface (second main surface 103) of the lower insulating layer 107.

[0022] The electronic component storage package 100 is, for example, Figure 6 and Figure 7As shown in the example, after manufacturing a multi-piece wiring substrate (mother substrate 200) in which wiring substrate regions 100A of electronic component storage packages 100 are arranged and each of which becomes a single piece, it is divided into single pieces for manufacturing. The mother substrate 200 has: a flat insulating layer having a plurality of regions that become mutually stacked lower insulating layers 107; and an insulating layer having a plurality of regions that become upper insulating layers 106. The insulating layer has openings that become cavities 104 in the regions that become the upper insulating layers 106. Hereinafter, the upper insulating layers 106 and the lower insulating layers 107 are also respectively formed in the mother substrate 200.

[0023] The insulating substrate 101 (upper insulating layer 106 and lower insulating layer 107) is made of ceramic materials such as alumina sintered body, aluminum nitride sintered body, mullite sintered body, or glass-ceramic sintered body. The insulating substrate 101 has a rectangular shape with a side length of about 1.2 to 10 mm and a plate-like thickness of about 0.3 to 2 mm when viewed from above, and the cavity 104 has a rectangular shape with a side length of about 1 to 9 mm and a depth of about 0.1 to 1.5 mm when viewed from above.

[0024] If the upper insulating layer 106 and the lower insulating layer 107 are composed of an alumina sintered body, the insulating substrate 101 can be manufactured as follows. First, a suitable organic binder, solvent, plasticizer, etc. are added and mixed to raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide to support a slurry, and it is formed into a sheet by a sheet forming method such as a doctor blade method and a roll rolling method, thereby manufacturing a plurality of ceramic green sheets. Next, a portion of the ceramic green sheets is subjected to appropriate punching processing to form a frame shape, and the frame-shaped ceramic green sheets are stacked up and down in a manner such that the frame-shaped ceramic green sheets are located on the upper surface of the flat ceramic green sheets to manufacture a laminate. For example, the laminate can be manufactured by firing at 1200°C to 1600°C. The above description of the manufacturing method of the insulating substrate 101 is explained with an eye on a portion of a wiring substrate area 100A in a multi-piece substrate (mother substrate 200), in other words, it is a description of whether it is a multi-piece substrate. The same description is sometimes made in the manufacturing method described later.

[0025] In addition, the conductors such as the connection pads 114 exposed on the surface of the electronic component storage package 100 may be covered with a nickel plating layer and a gold plating layer in sequence to prevent oxidative corrosion and facilitate connection with the electronic component 112 and connection with the module substrate 400 using solder or the like.

[0026] When the electronic device 300 has a plurality of electronic components 112 mounted in the mounting region 102A, the upper insulating layer 106 serving as a frame may be formed of two or more insulating layers in order to provide a stepped inner side surface for mounting the plurality of electronic components.

[0027] The mounting area 102A is rectangular in plan view, for example, to match the rectangular plate-shaped electronic component 112. Figure 1 In FIG. 1 , the mounting area 102A is virtually indicated by a two-dot chain line. The rectangular shape mentioned here includes not only a strict rectangle but also a rectangle with rounded corners. Figure 1 In the example, a pair of connection pads 114 are respectively arranged at two corners at both ends of a short side of the rectangular mounting area 102A. The connection pad 114 functions as a conductor layer for connecting electrodes (not shown) of electronic components 112 such as piezoelectric vibration elements mounted on the mounting area 102A. If the electronic component 112 is a piezoelectric vibration element, its shape is usually rectangular when viewed from above, and a pair of electrodes for connection (not shown) are provided at the corners of its surface. In order to easily and reliably connect such electrodes, the connection pad 114 is located at a position biased towards the corner of the mounting area 102A.

[0028] It should be noted that the number and arrangement of the connection pads 114 described above are described for the case where the piezoelectric vibration element described above is used as the electronic component 112. The number and arrangement of the connection pads 114 can be set according to the number and arrangement of electrodes of the mounted electronic component 112 and the number of mounted electronic components 112.

[0029] The above is the basic structure of the electronic component storage package 100, but the electronic component storage package 100 of the present invention further includes a corner conductor 109. That is, the electronic component storage package 100 of the present invention includes: an insulating substrate 101, which includes a first surface 102 having a mounting area 102A for mounting an electronic component 112, a second surface 103 located on the opposite side of the first surface 102, a plurality of side surfaces 105 located between the first surface 102 and the second surface 103, and a corner located between the two side surfaces 105; an external connection conductor 108 located on the second surface 103; and a corner conductor 109 connected to the external connection conductor 108. In addition, the corner conductor 109 is arranged in a manner that the interval with the second surface 103 becomes larger from the external connection conductor 108 to the corner (edge) between the two side surfaces 105 of the insulating substrate 101.

[0030] In recent years, electronic component storage packages have been increasingly miniaturized, and as a result, the area of ​​the external connection conductor located on the lower surface of the electronic component storage package has become smaller. Therefore, when the electronic device is connected to the module substrate using a bonding material such as solder, the bonding strength between the insulating substrate and the external connection conductor may be reduced. In such a significantly miniaturized electronic component storage package, the bonding strength between the insulating substrate and the external connection conductor may be reduced, especially at the end portion of the lower surface side of the corner between the two side surfaces of the insulating substrate.

[0031] According to the electronic component storage package 100 of the present invention, the strength of the insulating substrate 101 can be improved and the possibility of defects and cracks can be reduced. This is because the end portion of the second surface 103 side of the corner between the side surfaces 105 of the insulating substrate 101 that is most susceptible to stress when the electronic component storage package 100 (electronic device 300) is installed on the module substrate 400 (the corner formed by the two side surfaces 105 and the second surface 103) is clamped and protected by the external connection conductor 108 and the corner conductor 109. Since the possibility of defects or cracks at the corner of the insulating substrate 101 is reduced, the external connection conductor 108 is prevented from peeling off from the insulating substrate 101, and the bonding strength between the insulating substrate 101 and the external connection conductor 108 is high.

[0032] The corner conductor 109 is located at a position where the interval with the second surface 103 gradually increases from the second surface 103 around the corner of the insulating substrate 101 toward the corner of the insulating substrate 101. In addition, the corner conductor 109 can also be a sector shape that is 1 / 4 of a circle when viewed from above. The sector shape refers to not only a complete sector shape, but also a shape in which the arc portion of the sector shape is not a complete arc and the lengths of the two radius portions extending from the center angle are not exactly the same. The shape of the external connection conductor 108 when viewed from above is, for example, a rectangle such as a square, and can also be located at the corner of the second surface 103 of the rectangular shape, and the two adjacent sides of the external connection conductor 108 are located at a position overlapping with the two sides of the second surface 103. Alternatively, the corner conductor 109 overlaps with a corner portion of the external connection conductor 108 in a top perspective view, the central angle of the sector of the corner conductor 109 overlaps with a corner of the second surface 103 and a corner of the external connection conductor 108, and the radius portion extending from the central angle of the sector overlaps with two sides of the external connection conductor 108 disposed between the one corner. In addition, when observing the electronic component storage package 100 from the side, the shape of the corner conductor 109 exposed on the side 105 of the insulating substrate 101 is an arc shape. The shape is an arc centered on the corner between the other side surfaces 105 and the second surface 103 in one side surface 105. The arc can be not only a perfect circle, but also a Figure 3The arc of an ellipse as in the example shown. In addition, the connection portion between the external connection conductor 108 and the corner conductor 109 is in the shape of an arc convex toward the center (inside) of the second surface 103 when viewed from above. The corner conductor 109 extends in a convex arc shape toward the first surface 102 from the arc-shaped connection portion to 1 point at the corner in a manner that the distance from the second surface 103 (the distance from the external connection conductor 108) becomes larger. That is, the three-dimensional shape of the external connection conductor 108 is a shape such as a hemispherical shape (dome shape) is set to 1 / 4, a 1 / 4 dome shape. It is a 1 / 4 dome shape extending from the arc on the external connection conductor 108 to 1 point at the corner. The corner conductor 109 is in such a shape that the corner between the second surface 103 and the two side surfaces 105 of the insulating substrate 101 is clamped (surrounded) by the external connection conductor 108 and the corner conductor 109.

[0033] In addition, an insulator 110 is provided which is sandwiched between the external connection conductor 108 and the corner conductor 109 and is located at a corner portion on the second surface 103 side of the insulating substrate 101. Figure 2 , Figure 3 In the figure, as an insulator 110, a region sandwiched between an external connection conductor 108 and a corner conductor 109 in a corner portion on the second surface 103 side of the insulating substrate 101 is indicated by applying a different shadow from that of the upper insulating layer 106 and the lower insulating layer 107. The insulator 110 is a portion that is sandwiched between the external connection conductor 108 and the corner conductor 109 and is protected. Since the insulator 110 is surrounded by the external connection conductor 108 and the corner conductor 109, which are mainly composed of metals that have high elasticity and are easy to absorb stress compared to the ceramic of the insulating substrate 101, even if stress is applied to the package 100 for storing electronic components, it is difficult for the insulator 110 located at the corner to be defective or cracked. Furthermore, even if it is assumed that cracks or defects occur in the corner portion of the insulating substrate 101, the cracks or defects are likely to remain within the range sandwiched between the external connection conductor 108 and the corner conductor 109. Therefore, the possibility of disconnection of the conductive path such as the through conductor 117 due to cracking of the insulating substrate 101 is reduced, and the electrical connection between the module substrate 400 and the external connection conductor 108 is maintained, so that the connection reliability is excellent.

[0034] In order to form the electronic component storage package 100 having such a corner conductor 109, the following method can be used. For example, on the ceramic green sheet for the upper insulating layer 106, an opening to become the cavity 104 is formed by punching or the like, and the metallization paste to become the frame-shaped metallization layer 113, the through conductor 117, etc. is located at a predetermined position. The metallization paste to become the through conductor 117 can be filled into the through hole formed at a predetermined position on the ceramic green sheet by punching or the like. In addition, on the ceramic green sheet to become the lower insulating layer 107, the metallization paste to become the connection pad 114, the external connection conductor 108, the corner conductor 109, the through conductor 117, etc. is located at a predetermined position. Then, after the ceramic paste to become the insulator 110 is located at a predetermined position in a manner that covers the upper surface of the metallization paste to become the corner conductor 109, the ceramic green sheet with the metallization paste and the ceramic paste set at the predetermined position can be pressurized. The metallization paste that becomes the external connection conductor 108 overlaps on the ceramic paste that becomes the insulator 110. It is sufficient to set the ceramic paste that becomes the insulator 110 on a part of the external connection conductor 108 (the part that is closer to the inside than the corner conductor 109) and the metallization paste that becomes the corner conductor 109, and then set the metallization paste that becomes the remaining part of the external connection conductor 108 (the part that overlaps with the corner conductor 109) thereon and press-process it. Alternatively, it is sufficient to set the ceramic paste that becomes the insulator 110 on the metallization paste that becomes the corner conductor 109, and then set the metallization paste that becomes the external connection conductor 108 thereon and press-process it. The ceramic green sheets for the upper insulating layer 106 and the ceramic green sheets for the lower insulating layer 107 processed in this way are stacked, and the stacked body is fired, thereby making it possible to produce a package 100 for storing electronic components.

[0035] Here, the ceramic paste that becomes the insulator 110 can use substantially the same material as the ceramic green sheet. The same material means a material that contains the same ceramic components as the upper insulating layer 106 and the lower insulating layer 107 after firing. The ceramic paste is adjusted in the amount of binder and solvent mixed with the ceramic according to the specification of the coating method (for example, screen printing, etc.). In addition, the coating shape of the ceramic paste (ceramic paste that becomes the insulator 110) is, for example, Figure 5As shown, it is sufficient to apply the coating in a 1 / 4 sector shape of a circle (circular in the mother substrate 200) and to make the thickness of the coating be at the maximum position at the corner of the insulating substrate 101. Thus, in the pressurizing process, the corner conductor 109 from the outer peripheral end of the external connection conductor 108 to the end of the corner of the insulating substrate 101 can be configured so that the corner conductor 109 is easily curved in a convex shape toward the first surface 102 side when observed in a longitudinal section, and the distance from the second surface 103 in the thickness direction of the insulating substrate 101 gradually increases. That is, the portion where the insulator 110 is located at a thicker position before pressurization is to press the metallization paste that becomes the corner conductor 109 during pressurization deeper into the ceramic green sheet that becomes the insulating substrate 101.

[0036] It should be noted that the above-mentioned manufacturing method is a method of stacking a frame-shaped ceramic green sheet for the upper insulating layer 106 and a flat-plate-shaped ceramic green sheet for the lower insulating layer 107, but is not limited to this method. For example, a pressurizing jig having a protruding portion (convex portion) and a concave portion may be used to pressurize the ceramic green sheet so that the concave cavity 104 is located on the surface of the ceramic green sheet that is the insulating substrate 101 coated with the metallization paste and the ceramic paste. At this time, by determining the position of the pressurizing jig in such a manner as to pressurize the portion that becomes the bottom of the cavity 104, the portion of the ceramic green sheet pressed by the protruding portion of the pressurizing jig becomes the cavity 104, and the portion pressed by the concave portion of the pressurizing jig becomes the frame portion (upper insulating layer 106) surrounding the mounting area 102A. In addition, on the second surface 103 side of the ceramic green sheet, the ceramic paste that becomes the insulator 110 is pressed by the clamp together with the metallized paste that becomes the external connection conductor 108, and the metallized paste that becomes the corner conductor 109 becomes a structure that is bent into a convex shape toward the first surface 102 side. Moreover, as a result of the metallized paste that becomes the external connection conductor 108 being pressed by the clamp, the exposed surface of the external connection conductor 108 and the second surface 103 of the insulating substrate 101 become the same plane. It should be noted that as an adhesive added to the ceramic green sheet, metallized paste, and ceramic paste used, an adhesive whose glass transition temperature is lower than the temperature when the mold is pressed. If such an adhesive is used, when the ceramic green sheet is pressed by the pressurizing clamp, the frame, the exposed surface of the external connection conductor 108, and the second surface 103 of the insulating substrate 101 can be well formed into the same plane.

[0037] At this time, the width and depth of the recessed portion of the press jig are constant, and the width and height of the frame portion after the press processing can also be constant. Therefore, the width of the frame portion after the press processing can be made constant and the dimensional accuracy can be improved. In addition, by firing the molded body formed by integrating the lower insulating layer 107 provided with the external connection conductor 10 and the upper insulating layer 106 provided with the frame-shaped metallization layer 113 and the like, a mother substrate 200 in which a plurality of wiring substrate areas 100A that become the electronic component storage package 100 are arranged can be manufactured.

[0038] The electronic component storage package 100 of the present invention may also include a covered conductor 120. The covered conductor 120 is located at a position closer to the first surface 102 than the corner conductor 109 at the corner of the insulating substrate 101. The covered conductor 120 covers a portion of the corner that is closer to the first surface 102 than the corner conductor 109. With such a structure, the corner of the side surface 105 of the insulating substrate 101 is covered by the covered conductor 120, so that the strength of the corner of the side surface 105 of the insulating substrate 101 can be improved, and defects and cracks can be suppressed.

[0039] As described above, the package 100 for storing electronic components is produced by dividing a plurality of connected wiring substrates (mother substrate 200). The mother substrate 200 has a plurality of wiring substrate areas 100A in the vertical and horizontal directions (X direction, Y direction) of the substrate surface. The mother substrate 200 has a dividing groove (hereinafter also referred to as the groove) at the boundary between two adjacent wiring substrate areas 100A in the first surface 102 and the second surface 103, and a single piece of the package 100 for storing electronic components is obtained by breaking along the groove. The groove can be formed by cutting the first surface 102 and the second surface 103 with respect to the mother substrate 200 or with respect to the mother substrate before firing using a laser or a cutting knife. The inner surface of the groove is the cut surface 122, which is a portion (inclined portion 111) inclined with respect to the first surface 102 and the second surface 103. Therefore, as Figure 4 As shown, the side surface 105 of the insulating substrate 101 has a fracture surface 121 and a cut surface 122 (inclined portion 111). The fracture surface 121 is a concave-convex portion 126 with many concave and convex portions caused by the fracture, so it is possible that defects and cracks will occur at the corners of the side surface of the insulating substrate 101.

[0040] As described above, the end portion adjacent to the second surface 103 in the corner portion sandwiched by the two side surfaces 105 in the package 100 for storing electronic components of the present invention is surrounded and protected by the external connection conductor 108 and the corner conductor 109. The portion of the corner portion located closer to the first surface 102 than the corner conductor 109 becomes the above-mentioned concave-convex portion 126. In the case where the package 100 for storing electronic components has a covered conductor 120 covering the corner portion of the insulating substrate 101, the corner portion located at the concave-convex portion 126 is protected by the covered conductor 120 mainly composed of metal, so that cracks and defects can be suppressed in the corner portion of the insulating substrate 101. As a result, for example, when the package 100 for storing electronic components is stored in a tray for transportation, the contact with the tray, the clamping when the package 100 for storing electronic components is transported, etc., the corner portion of the insulating substrate 101 is difficult to be damaged, and the entry of foreign matter into the cavity 104 caused by the defect of the insulating substrate 101 can be suppressed. It should be noted that the covered conductor 120 is the same as the corner conductor 109 and other wiring conductors, and is a metal sintered body with a metal such as tungsten or molybdenum as a main component, and has excellent protection performance for the insulating substrate 101. "With a metal as a main component" means that it contains more than 90% of a metal, and in addition to the above-mentioned metal, it may contain a ceramic component or a glass component in order to improve sinterability or improve bonding with the insulating substrate 101. It should be noted that the covered conductor 120 protrudes from the corner conductor 109 to the first surface 102 side.

[0041] As described above, the exposed surfaces of the corner conductor 109, the frame-shaped metallization layer 113, the connection pad 114, and the external connection conductor 108 may also have a plated film on their exposed surfaces. This can prevent oxidation corrosion and make the connection between the connection pad 114 and the electrode of the electronic component 112, or the connection between the external connection conductor 108 and the module substrate 400 easier or stronger. The plated film may also be a plated layer composed of a nickel plated layer with a thickness of about 1 to 20 μm and a gold plated layer with a thickness of about 0.1 to 3.0 μm in sequence.

[0042] In this way, in order to cover each wiring substrate with a plating layer, for example, an electroplating method can be used. A supply conductor for supplying current during electroplating is arranged outside the plurality of wiring substrate regions 100A arranged on the mother substrate 200, and a connection conductor that connects the supply conductor to the wiring substrate region 100A located at the outermost periphery and a connection conductor that connects each wiring to each other across adjacent wiring substrate regions 100A can be arranged. If such a structure is set, when current is supplied to the supply conductor, electricity can be supplied to all wiring conductors of each wiring substrate region 100A, and the exposed wiring conductors of each wiring substrate region 100A can be covered with a plating layer.

[0043] In the mother substrate 200 for obtaining the electronic component storage package 100, the corner conductor 109 functions as the above-mentioned connection conductor. In the mother substrate 200, the portions of the corner conductor 109 located in the adjacent wiring substrate area 100A are connected to each other, and are circular in a top perspective view. As long as the corner conductor 109 functions as a connection conductor, it can also be a strip-shaped wiring conductor with a small width, but as described above, in order to surround the corner (insulator 110) of the insulating substrate 101 together with the external connection conductor 108 for protection, it becomes the above-mentioned shape.

[0044] In addition, the covered conductor 120 may also be connected to the corner conductor 109. In other words, the covered conductor 120 may also extend from the corner conductor 109 toward the first surface 102. By setting such a structure, the connection reliability of the above-mentioned connection conductor is improved. When a monolithic electronic component storage package 100 is obtained from the mother substrate 200, it is possible to cut to the corner conductor 109 by groove processing using a laser or the like. The corner conductor 109 is cut off, which means that the connection conductor is disconnected, so it is possible that a plated film cannot be formed on the wiring conductor. The vicinity of the boundary of the adjacent wiring substrate area of ​​the corner conductor 109 is farthest from the second surface 103, and when the second surface 103 is grooved, the corner conductor 109 is difficult to be disconnected. When the covered conductor 120 is connected to the corner conductor 109, the connection conductor is composed of the corner conductor 109 and the covered conductor 120. The covered conductor 120 is connected to the top of the dome-shaped corner conductor 109 in the mother substrate 200, so the thickness of the central part of the connection conductor becomes thicker. Therefore, even when a groove is processed from the second surface 103 of the mother substrate 200 to a depth exceeding that of the corner conductor 109 , the covered conductor 120 is not cut and the conduction between the corner conductors 109 of the adjacent wiring board region 100A is maintained.

[0045] like Figure 6 and Figure 7 As shown, in the second surface 103 of the mother substrate 200, the external connection conductor 108 is located at the corner of each wiring substrate area 100A. In addition, the circular insulator 110 spanning the adjacent wiring substrate areas 100A is located on the first surface 102 side of the external connection conductor 108. The dome-shaped corner conductor 109 covering the insulator 110 is located on the first surface 102 side of the insulator 110. Furthermore, near the boundary of the four adjacent wiring substrate areas 100A in a top perspective view, the covered conductor 120 is located on the first surface 102 side of the corner conductor 109.

[0046] In this way, in order to position the covered conductor 120 at the corner of the insulating substrate 101, the following process can be added to the above-mentioned manufacturing method. For example, in the area of ​​the second surface 103 side of the ceramic green sheet that becomes the lower insulating layer 107 and becomes the corner of each wiring substrate area 100A, a plurality of holes can be formed using a pressing jig having a plurality of protrusions, and the holes can be filled with a metallization paste that becomes the covered conductor 120. The metallization paste that becomes the corner conductor 109 is applied thereon. Instead of filling the holes with the metallization paste that becomes the covered conductor 120, the holes can be filled at the same time as the metallization paste that becomes the corner conductor 109 is applied.

[0047] In the electronic component storage package 100 of the present invention, the width of the covered conductor 120 on the first surface 102 side may be smaller than the width on the corner conductor 109 side. In other words, the width of the covered conductor 120 at a position close to the first surface 102 may also be smaller than the width at a position close to the second surface 103. With such a structure, the positional offset of the groove when the mother substrate 200 used to make the electronic component storage package 100 is divided can be easily determined by the shape of the covered conductor 120. That is, if the shape of the covered conductor 120 is smaller than the prescribed shape of the covered conductor 120, it means that the groove is offset from the prescribed position. If the shape of the covered conductor 120 is within an appropriate range, the groove is located at a prescribed position, and it can be easily confirmed that the size of the insulating substrate 101 is appropriate.

[0048] like Figure 6 As shown in the example, when the dividing grooves extending vertically and horizontally formed on the second surface 103 of the mother substrate 200 pass through the center of the covered conductor 120 in a plan view, as shown in FIG. Figure 4As shown, at the corner of the insulating substrate 101, the shape and size of the portion appearing on the two side surfaces 105 sandwiching the corner of the covered conductor 120 are substantially the same. In addition, the shape and size of the covered conductor 120 appearing on the side surface 105 of the electronic component storage package 100 obtained from the adjacent wiring substrate area 100A are substantially the same. On the other hand, in the case where the covered conductor 120 is not divided at the center, the shape and size of the covered conductor 120 appearing on the two side surfaces 105 sandwiching the corner and the shape and size of the covered conductor 120 appearing on the side surface 105 of the electronic component storage package 100 obtained from the adjacent wiring substrate area 100A are different. In the case where the position of the groove is greatly offset, the covered conductor 120 is not exposed on the side surface 105. The width of the covered conductor 120 on the first surface 102 side is the same as the width on the second surface 103 side. In other words, even in the case where the covered conductor 120 on the mother substrate 200 is cylindrical, the size of the portion appearing on the side surface 105 is different. On the other hand, when the width of the covered conductor 120 on the first surface 102 side is smaller than the width on the second surface 103 side, in other words, when the covered conductor 120 on the mother substrate 200 is a conical shape with a rounded tip, the difference in shape becomes more significant. Therefore, it is easy to select electronic component storage packages 100 with large positional deviations and large dimensional deviations of the grooves, and it is possible to efficiently manufacture electronic component storage packages 100 with excellent dimensional accuracy.

[0049] As described above, the side surface 105 of the insulating substrate 101 has the cut surface 122 and the fracture surface 121. Figure 4As shown, the fracture surface 121 is located in the center of the thickness direction of the insulating substrate 101, and the cut surface 122 is located on the upper side (first surface 102 side) and the lower side (second surface 103 side) across the fracture surface 121. The upper dividing line 123 is located at the boundary between the fracture surface 121 and the cut surface 122 on the upper side, and the lower dividing line 124 is located at the boundary between the fracture surface 121 and the cut surface 122 on the lower side. The upper dividing line 123 is a portion corresponding to the bottom of the groove provided on the first surface 102 of the mother substrate 200, and the lower dividing line 124 is a portion corresponding to the bottom of the groove provided on the second surface 103. The upper dividing line 123 extends approximately parallel to the first surface 102, and has a portion that is convexly curved toward the second surface 103 at the corner of the insulating substrate 101. The lower dividing line 124 extends approximately parallel to the second surface 103, and has a portion that is convexly curved toward the first surface 102 at the corner of the insulating substrate 101. The curved portion of the upper dividing line 123 and the lower dividing line 124 is a recessed portion 125 where the depth of the groove becomes deeper. When the groove is formed by laser processing, the portion where the groove in the X direction and the groove in the Y direction intersect is irradiated with laser twice, when the groove in the X direction and the groove in the Y direction are formed. And the groove in the portion where the groove in the X direction and the groove in the Y direction intersect is deeper than the other portion. Therefore, the upper dividing line 123 and the lower dividing line 124 have a recessed portion 125 at the corner of the insulating substrate 101 in the electronic component storage package 100.

[0050] When the recessed portion 125 of the upper dividing line 123 is deep, if the coated conductor 120 is exposed in the recessed portion 125 when viewed from the first surface 102 in the mother substrate 200 state, it can be confirmed that a groove is formed at a predetermined position. In addition, when the width of the coated conductor 120 on the first surface 102 side is smaller than the width on the second surface 103 side, the position of the groove can be determined with higher accuracy.

[0051] The electronic component storage package 100 of the present invention may be such that the side surface 105 has an inclined portion 111 located near the second surface 103 and a concave-convex portion 126 extending from the inclined portion 111 in the thickness direction of the insulating substrate 101, and the covered conductor 120 is located at the concave-convex portion 126. With such a structure, for example, the possibility of short circuiting through the covered conductor 120 by the solder joined to the external connection conductor 108 and the solder 118 when the cover 116 is joined is reduced. The covered conductor 120 being located at the concave-convex portion 126 means that the covered conductor 120 is located at the fracture surface 121. This means that in the mother substrate 200 used to manufacture the electronic component storage package 100, the covered conductor 120 is not exposed on the outer surface of the mother substrate 200. Therefore, the metal layer (plated film) formed on the surface of the wiring conductor and the like exposed on the surface in the state of the mother substrate 200 is not formed on the surface of the covered conductor 120. Therefore, in the electronic component storage package 100 obtained by singulating the mother substrate 200, the metal layer (plating layer) is not arranged on the surface of the covered conductor 120 between the external connection conductor 108 and the frame-shaped metallization layer 113 connected to the cover body 116. Therefore, the solder when the external connection conductor 108 is joined to the module substrate 400, the brazing material 118 when the cover body 116 is joined, etc., are difficult to join with the covered conductor 120, and the possibility of short circuit between the external connection conductor 108 and the frame-shaped metallization layer 113 via the covered conductor 120 is reduced. In addition, the inclined portion 111 is located between the concave-convex portion 126 and the second surface 103 on the side surface 105, and is adjacent to the second surface 103. The angle between the inclined portion 111 and the second surface 103 is larger than a right angle (90 degrees). Therefore, compared with the case where the angle between the second surface 103 and the side surface 105 is a right angle, the distance along the side surface 105 from the external connection conductor 108 of the second surface 103 to the covered conductor 120 and further to the frame-shaped metallization layer 113 of the first surface 102 becomes longer. That is, by having the inclined portion 111, the possibility of the above-mentioned short circuit can be further reduced. In the case where the inclined portion 111 is also located between the first surface 102 and the concave-convex portion 126, the distance along the side surface 105 from the external connection conductor 108 to the frame-shaped metallization layer 113 becomes further longer, further reducing the possibility of a short circuit between them.

[0052] The electronic device 300 of the present invention has the electronic component storage package 100 described above and the electronic component 112 mounted on the electronic component storage package 100. With such a structure, it is possible to provide an electronic device 300 in which defects and cracks of the electronic component storage package 100 during handling are suppressed and the dimensional accuracy is excellent. That is, by using the electronic component storage package 100 in which defects and cracks of the corners on the second surface 103 side of the insulating substrate 101 in the electronic component storage package 100 are suppressed, an electronic device with excellent dimensional accuracy can be manufactured. In addition, the possibility of disconnection of the conductive path of the through conductor 117 and the like due to cracks, defects, etc. and the possibility of peeling of the external connection conductor 108 from the insulating substrate 101 are reduced, and an electronic device with excellent electrical connection reliability between the electronic component storage package 100 and the module substrate 400 can be realized.

[0053] The electronic component 112 may include, in addition to piezoelectric resonators such as quartz resonator elements of TCXO (Temperature Compensated Crystal Oscillator), piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, semiconductor elements, capacitor elements, and resistor elements.

[0054] like Figure 8 and Fig. 9 As shown, each electrode (not shown) of the electronic component 112 and the connection pad 114 are connected via a bonding material 115 such as a conductive adhesive.

[0055] The electronic module 500 of the present invention includes the electronic device 300 described above and a module substrate 400 connected to the electronic device 300. Since the bonding strength of the external connection conductor 108 of the electronic component storage package 100 is high, the reliability of the electrical connection between the electronic device 300 and the module substrate 400 is high, and thus the electronic module 500 having excellent operation reliability can be provided.

[0056] It should be noted that the present invention is not limited to the above-mentioned example of the embodiment, and various changes can be made as long as they do not deviate from the scope of the main purpose of the present invention. For example, the package 100 for storing electronic components is formed with a concave cavity 104 on the side of the first surface 102, but it can also be a structure with multiple cavities, and each of the multiple cavities has a mounting area. In addition, a pair of rectangular connecting pads 114 for connecting electronic components are located in the cavity 104, but they can also be provided in other shapes and other numbers according to the shape and type of the electronic components carried. In addition, an example is shown in which the rectangular external connecting conductor 108 is located at four locations of the corners of the second surface 103, but it is not limited to this. According to the size of the package 100 for storing electronic components, the type of electronic device, the electronic components carried, etc., the external connecting conductor 108 other than the four locations can also be a shape other than a rectangle and located outside the corner.

[0057] In addition, the case where the insulating substrate 101 of the electronic component storage package 100 has a shape having the cavity 104 has been described, but it is also possible to Fig. 9 As shown in the example, the insulating substrate 101 is a flat plate. In this case, the first surface 102 of the insulating substrate 101 also has a mounting area 102A for mounting the electronic component 112. The cover 116 in this case is, for example, a box-shaped body that covers the mounting area 102A and can accommodate the electronic component 112 inside. Fig. 9 As shown, the electronic device 300 may also be as follows: an electronic component 112 is mounted in the mounting area 102A of the electronic component storage package 100, the electronic component 112 is covered with a box-shaped (hat-shaped) cover 116 with a flange, and the flange portion of the cover 116 is bonded to the periphery of the first surface 102 of the insulating substrate 101 using a bonding material. Fig. 9 The insulating substrate 101 in the electronic component housing package 100 is composed of a single insulating layer, but a plurality of insulating layers may be stacked.

[0058] Description of reference numerals:

[0059] 100···Packaging for storing electronic components

[0060] 100A···Wiring board area

[0061] 101···Insulating substrate

[0062] 102···Page 1

[0063] 102A···Carrying area

[0064] 103···Side 2

[0065] 104···Cavity

[0066] 105···Side

[0067] 106···Upper insulation layer

[0068] 107···Lower insulation layer

[0069] 108···External connecting conductor

[0070] 109···Corner conductor

[0071] 110···Insulator

[0072] 111···Inclined part

[0073] 112···Electronic components

[0074] 113···Frame-shaped metallization layer

[0075] 114···Connection pad

[0076] 115···Jointing materials

[0077] 116···Cover

[0078] 117···Through conductor

[0079] 118···Braze

[0080] 120···Coated conductor

[0081] 121···Fracture surface

[0082] 122···Cut surface

[0083] 123···upper secant line

[0084] 124···lower secant line

[0085] 125···Depression

[0086] 126···Concave and convex part

[0087] 200···Mother substrate

[0088] 300···Electronic Devices

[0089] 400···Module substrate

[0090] 500···Electronic module.

Claims

1. A package for storing electronic components, wherein: The electronic component storage package comprises: An insulating substrate having a first surface having a mounting area for mounting an electronic component, a second surface located on the opposite side of the first surface, a plurality of side surfaces located between the first surface and the second surface, and a corner portion located between two of the side surfaces; an external connecting conductor located on the second surface; as well as a corner conductor connected to the outer connecting conductor, The corner conductor is arranged so that the distance between the corner conductor and the second surface becomes larger from the outer connecting conductor to the corner. A corner between the second face of the insulating substrate and the two side faces is sandwiched by the outer connecting conductor and the corner conductor.

2. The electronic component storage package according to claim 1, wherein: The electronic component storage package further comprises a covered conductor, The covered conductor is located at a position closer to the first surface than the corner conductor in the corner portion.

3. The electronic component storage package according to claim 2, wherein: The covered conductor is connected to the corner conductor.

4. The electronic component storage package according to claim 2 or 3, wherein: The covered conductor has a smaller width at a position close to the first surface than at a position close to the second surface.

5. The electronic component storage package according to claim 2 or 3, wherein: The side surface has an inclined portion located near the second surface, and a concave-convex portion extending from the inclined portion in the thickness direction of the insulating substrate. The covered conductor is located at the concave-convex portion.

6. An electronic device, wherein: The electronic device comprises: The electronic component storage package according to any one of claims 1 to 5; and An electronic component is mounted on the electronic component housing package.

7. An electronic module, wherein: The electronic module comprises the electronic device according to claim 6 and a module substrate connected to the electronic device.

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