Electronic modulation device

Abstract

Some embodiments of the present invention provide an electronic device. The electronic device includes a first substrate having a first portion and a second portion. The electronic device also includes a second substrate facing the first substrate. The electronic device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps with the first portion and does not overlap with the second portion. In addition, the electronic device includes a first spacer disposed between the first portion of the first substrate and the second substrate. The first spacer has a first thickness. The electronic device also includes a second spacer disposed between the second portion of the first substrate and the second substrate. The second spacer has a second thickness. The electronic device also includes a plurality of third spacers disposed between the first substrate and the second substrate. At least one of the plurality of third spacers has a third thickness. The first spacer is disposed between two of the third spacers. The first thickness is less than the second thickness, and the third thickness is less than the first thickness.

Description

[0001] This application is a divisional application of a Chinese invention patent application filed on December 3, 2018, with application number "201811465528.0" and invention name "Electronic Modulation Device" Technical Field

[0002] The present invention relates to an electronic modulation device, and in particular to an electronic modulation device comprising an adjustment unit. Background Art

[0003] Electronic products, such as smartphones, tablets, laptops, monitors and televisions, have become an indispensable necessity in modern society. With the booming development of such portable electronic products, consumers have high expectations for the quality, functionality and price of these products. These electronic products can often be used as electronic modulation devices at the same time, such as modulating electromagnetic waves.

[0004] However, developing electronic modulation devices that can be applied to various environments is still a research topic in the industry. Summary of the invention

[0005] Some embodiments of the present invention provide an electronic device. The electronic device includes a first substrate having a first portion and a second portion. The electronic device also includes a second substrate facing the first substrate. The electronic device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps with the first portion and does not overlap with the second portion. In addition, the electronic device includes a first spacer disposed between the first portion of the first substrate and the second substrate. The first spacer has a first thickness. The electronic device also includes a second spacer disposed between the second portion of the first substrate and the second substrate. The second spacer has a second thickness. The electronic device also includes a plurality of third spacers disposed between the first substrate and the second substrate. At least one of the plurality of third spacers has a third thickness. The first spacer is disposed between two of the third spacers. The first thickness is less than the second thickness, and the third thickness is less than the first thickness.

[0006] Some embodiments of the present invention provide an electronic device. The electronic device has a working area and a non-working area, and the non-working area is adjacent to the working area. The electronic device includes a first substrate and a second substrate, which faces the first substrate. The electronic device further includes at least one working device, which is arranged between the first substrate and the second substrate. This working device is arranged in the working area and is not arranged in the non-working area. In addition, the electronic device includes a first spacer, which is arranged in the working area and between the first substrate and the second substrate. The first spacer has a first thickness. The electronic device also includes a second spacer arranged in the non-working area and between the first substrate and the second substrate. The second spacer has a second thickness. The electronic device also includes a third spacer arranged between the first substrate and the second substrate. At least one of the third spacers has a third thickness, wherein the first spacer is arranged between two of the third spacers, wherein the first thickness is less than the second thickness, and the third thickness is less than the first thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:

[0008] Figure 1 is a schematic top view of an electronic modulation device according to some embodiments of the present invention;

[0009] Figure 2 According to some embodiments of the present invention, Figure 1 An enlarged schematic diagram of region A of the electronic modulation device;

[0010] Figure 3A , 3B According to some embodiments of the present invention, Figure 1 The process flow chart of the electronic modulation device shown;

[0011] Figure 4 is a cross-sectional schematic diagram of an electronic modulation device according to some embodiments of the present invention;

[0012] Figure 5A , 5B is a process flow chart of an electronic modulation device according to some embodiments of the present invention;

[0013] Figure 6 is a cross-sectional schematic diagram of an electronic modulation device according to some embodiments of the present invention;

[0014] Figure 7 is a cross-sectional schematic diagram of an electronic modulation device according to some embodiments of the present invention;

[0015] Fig. 8A , 8BSchematic cross-sectional view of a first part and a second part of an electronic modulation device according to some embodiments of the present invention.

[0016] Reference numerals

[0017] 10 Part 1

[0018] 20 Part 2

[0019] 100 Electronic modulation device

[0020] 100A working area

[0021] 100B Non-working area

[0022] 102 first substrate

[0023] 104, 104a, 104b Adjustment unit

[0024] 106, 106a, 106b Adjustment unit

[0025] 108 Adjustment unit

[0026] 110 Modulation material layer

[0027] 112 Second substrate

[0028] 200 Electronic modulation device

[0029] 204, 204a, 204b Adjustment unit

[0030] 206, 206a, 206b Adjustment unit

[0031] 300 Electronic modulation device

[0032] 304 Adjustment Unit

[0033] 306 Adjustment Unit

[0034] 308 Spacer

[0035] 310 Spacer

[0036] 500 Electronic modulation device

[0037] 502 substrate

[0038] 504 Insulation layer

[0039] 506 protection layer

[0040] 508 drive assembly

[0041] 510 Source

[0042] 512 Drain

[0043] 514 Gate electrode

[0044] 516 Active layer

[0045] 518 Channel Area

[0046] 520 Wire

[0047] 522 first electrode

[0048] 524 Second Electrode

[0049] 526 Modulation Material Layer

[0050] 528 Display component layer

[0051] 530 base plate

[0052] 532 Adjustment unit

[0053] 534 Adjustment Unit

[0054] 536 Adjustment Unit

[0055] 540 Working device DETAILED DESCRIPTION

[0056] The following is a detailed description of the component substrate, electronic modulation device and manufacturing method of the electronic modulation device of some embodiments of the present invention. It should be understood that the following description provides many different embodiments or examples for implementing different modes of some embodiments of the present invention. The specific components and arrangements described below are only for simple and clear description of some embodiments of the present invention. Of course, these are only used for example and not for limitation of the present invention. In addition, repeated numbers or marks may be used in different embodiments. These repetitions are only for simple and clear description of some embodiments of the present invention, and do not represent any correlation between the different embodiments and / or structures discussed. Furthermore, when it is mentioned that a first material layer is located on or above a second material layer, it includes the situation where the first material layer is in direct contact with the second material layer. Alternatively, there may be a situation where there are one or more other material layers in between, in which case the first material layer and the second material layer may not be in direct contact.

[0057] In addition, relative terms, such as "lower" or "bottom" and "higher" or "top", may be used in the embodiments to describe the relative relationship of one component of the drawings to another component. It is understood that if the device of the drawings is turned upside down, the component described on the "lower" side will become the component on the "higher" side. Here, the terms "about", "approximately", and "roughly" usually mean within 20% of a given value or range, such as within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. The number given here is an approximate number, that is, in the absence of a specific description of "about", "approximately", or "roughly", the meaning of "about", "approximately", or "roughly" can still be implied.

[0058] It is worth noting that the term "substrate" in the following text may include components formed on a transparent substrate and various film layers covering the substrate, on which any desired multiple active components (transistor components) may have been formed. However, in order to simplify the drawings, only a flat substrate is shown here.

[0059] See also Figure 1 , Figure 1 FIG. 1 is a top view of an electronic modulation device 100 according to some embodiments of the present invention. Figure 1 As shown, the electronic modulation device 100 includes a working area 100A and a non-working area 100B. The working area 100A may include a working device 540 (shown in FIG. Fig. 8A ), the non-working area 100B may be adjacent to the working area 100A. The electronic modulation device 100 may include an integrated circuit, such as a microprocessor, a storage element, and / or other components. The electronic modulation device 100 may also include different passive, active components, and wires. The passive and active components may be, for example, thin film transistors (thin film transistors), thin-film resistors (thin-film resistors), other types of capacitors such as metal-insulator-metal capacitors (MIMCAP), inductors, diodes, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor field-effect transistors, MOSFETs), complementary MOS transistors (CMOSFETs), bipolar junction transistors (bipolar junction transistors, BJTs), lateral diffused MOS transistors (LDMOSFETs), high-power MOS transistors, or other types of transistors.

[0060] See also Figure 2 , Figure 2 for Figure 1 An enlarged view of region A of the electronic modulation device 100. Figure 2 As shown, the working area 100A may include a plurality of first parts 10 and a plurality of second parts 20. In some embodiments, the first part 10 may include at least one working device 540. The first part 10 may be an M×N array, where M and N are both positive integers, but the present invention is not limited thereto. The second part 20 may be disposed adjacent to the first part 10, such as the area between two adjacent first parts 10, and may have any size and may be arranged in any manner. In some embodiments, the second part 20 may not have a working device 540. In some embodiments, an adjustment unit with a smaller restoring force may be provided per unit area (shown in FIG. Figure 3B ) is formed on the first portion 10, and an adjustment unit having a larger restoring force per unit area (shown in FIG. Figure 3B ) is formed on the second portion 20.

[0061] Back to Figure 1 The non-working area 100B may include a plurality of second portions 20. The second portions 20 may have any size and may be arranged in any manner, and the present invention is not limited thereto.

[0062] See also Figure 3A , 3B , Figure 3A , 3B is a process flow chart of the electronic modulation device 100 according to some embodiments of the present invention. Figure 3A The cross-section shown corresponds to Figure 2 The line segment R-R' of the working area 100A is shown in FIG. Figure 3A As shown, firstly, a first substrate 102 is provided. It is worth noting that the first substrate 102 may include multiple layers, and various components disposed in and / or on the multiple layers. For simplicity, only one layer is shown here. The area of ​​the first substrate 102 corresponding to the first part 10 may have at least one working device 540 disposed on the first substrate 102. The area of ​​the first substrate 102 corresponding to the second part 20 may not have a working device 540 disposed in the first substrate 102.

[0063] like Figure 3AAs shown, at least one adjustment unit 104 is disposed on the first portion 10 of the first substrate 102, and at least one adjustment unit 106 is disposed on the second portion 20 of the first substrate 102. In some embodiments, the materials of the adjustment units 104 and 106 include photoresist or other suitable materials, but the present invention is not limited thereto. In some embodiments, the adjustment units 104 and / or the adjustment units 106 may be in the shape of long strips in the top view direction. The adjustment units 104 and / or the adjustment units 106 may be arranged along one or more directions, wherein there may be a gap between two adjacent adjustment units 104 and / or the adjustment units 106 so that the modulation material layer 110 (shown in FIG. 1 ) is not limited thereto. Figure 3B ) material can flow. In the present embodiment, the adjustment unit 104 and the adjustment unit 106 can be spacers formed by photoresist respectively. The adjustment unit 104 and the adjustment unit 106 can have a thickness H1. In the present invention, the thickness and / or height can be measured in the center area along the normal direction of the substrate 102, which can be the value of a single point or the average value of multiple points. In some embodiments, the thickness and / or height can measure the maximum thickness or the maximum height. In some embodiments, the adjustment unit 104 has a first elastic coefficient K1, and the adjustment unit 106 has a second elastic coefficient K2, wherein the second elastic coefficient K2 is greater than the first elastic coefficient K1. Here, the elastic coefficient can be a spring constant (spring constant), and its unit is Newton / meter (N / m). The elastic coefficient can also be a Young's modulus (Young's modulus), and its unit is Newton / square meter (N / m 2 ). In this embodiment, the material of the adjustment unit 104 may be the same as the material of the adjustment unit 106, but the density of the two may be different. In some embodiments, the density of the adjustment unit 106 may be greater than the density of the adjustment unit 104, so that the elastic coefficient of the adjustment unit 106 is greater than the elastic coefficient of the adjustment unit 104, but it is not limited thereto. In other embodiments, the material of the adjustment unit 104 may be different from the material of the adjustment unit 106. For example, the adjustment unit 104 and the adjustment unit 106 may be formed of different types of photoresists, so that the adjustment unit 104 and the adjustment unit 106 may have different elastic coefficients, but it is not limited thereto. Other methods that can make the elastic coefficient of the adjustment unit 104 different from the elastic coefficient of the adjustment unit 106 can also be used.

[0064] In some embodiments, a plurality of adjustment units 108 may be disposed on the first portion 10 and / or the second portion 20 of the first substrate 102. The material of the adjustment unit 108 includes photoresist or other suitable materials, but the present invention is not limited thereto. Figure 3AAs shown, the adjustment unit 108 may have a thickness H2. In some embodiments, the adjustment unit 108 has a third elastic coefficient K3. The third elastic coefficient K3 may be greater than the second elastic coefficient K2. In some embodiments, at least one adjustment unit 108 may be disposed between the adjustment unit 104 and the adjustment unit 106. The adjustment unit 104 may be disposed between two adjacent adjustment units 108. The adjustment unit 106 may also be disposed between two adjacent adjustment units 108. Figure 3A As shown, there may be a thickness difference X1 between the adjustment unit 104 and the adjustment unit 108 , and there may be a thickness difference X1 between the adjustment unit 106 and the adjustment unit 108 .

[0065] In some embodiments, the adjustment unit 104 , the adjustment unit 106 , and the adjustment unit 108 have different sizes, for example, different areas or shapes of top surfaces, or different areas or shapes of side surfaces.

[0066] Next, if Figure 3B As shown, the second substrate 112 is disposed on the first substrate 102 so that the adjustment unit 104 and the adjustment unit 106 are compressed to form the electronic modulation device 100. Figure 3B As shown, the adjustment unit 104a, the adjustment unit 106a, and the adjustment unit 108 are disposed between the first substrate 102 and the second substrate 112. In addition, the adjustment unit 104a, the adjustment unit 106a, and the adjustment unit 108 may have a thickness H2', wherein the thickness H2' may be less than or equal to H2. In some embodiments, the electronic modulation device 100 may include a modulation material layer 110, and the modulation material layer 110 is disposed between the first substrate 102 and the second substrate 112. The material of the modulation material layer 110 may include liquid crystal or other appropriate modulation materials.

[0067] It is worth noting that the second substrate 112 may include multiple layers and various components disposed in and / or on the multiple layers. For simplicity, only one layer is shown here. In some embodiments, the second substrate 112 may include at least one flexible layer film, so that the second substrate 112 may have a concave-convex or inclined surface.

[0068] In some embodiments, the distance between the first substrate 102 and the second substrate 112 is substantially the same in different regions. For example, the distance between the first portion 10 of the first substrate 102 and the second substrate 112 is the distance D1, and the distance between the second portion 20 of the first substrate 102 and the second substrate 112 is also the distance D1. Figure 3A , 3BAs shown, there is a thickness difference X1 between the compressed adjustment unit 104a and the adjustment unit 104 before compression, and there is a thickness difference X1 between the compressed adjustment unit 106a and the adjustment unit 106 before compression. In this embodiment, the adjustment unit 108 is substantially not compressed. The compressed adjustment unit 104a and the adjustment unit 106a may respectively have a first restoring force F1 and a second restoring force F2 (the restoring force may be, for example, an elastic force). The first restoring force F1 and the second restoring force F2 may satisfy Hooke's law, as expressed by the following formula (1):

[0069] F=-K△X Formula (1)

[0070] In formula (1), K is the spring constant, ΔX is the compressed length or thickness, and the negative sign is because the restoring force can be opposite to the direction in which the adjustment unit is compressed or stretched.

[0071] In this embodiment, F1=-K1X1, F2=-K2X1. That is, the magnitude of the restoring force of the adjustment unit 104a may be substantially equal to K1X1, and the magnitude of the restoring force of the adjustment unit 106a may be substantially equal to K2X1. Since the compressed lengths of the adjustment unit 104a and the adjustment unit 106a are substantially equal, the magnitudes of the restoring forces of the adjustment unit 104a and the adjustment unit 106a may depend on the spring constants of the adjustment unit 104a and the adjustment unit 106a. Because the second elastic coefficient K2 of the adjustment unit 106a may be greater than the first elastic coefficient K1 of the adjustment unit 104a, the second restoring force F2 may be greater than the first restoring force F1. It is worth noting that Figure 3B The second restoring force F2 and the first restoring force F1 are shown for illustration only. In practice, the directions of the restoring forces generated by the adjustment units 104a and 106a may not be limited to one direction. In some embodiments, the directions of the first restoring force F1 and the second restoring force F2 may be along the normal direction of the substrate 102. In addition, since the compressed length of the adjustment unit 108 is substantially 0, the restoring force generated by the adjustment unit 108 is substantially 0.

[0072] See also Figure 4 , Figure 4 FIG. 1 is a cross-sectional schematic diagram of an electronic modulation device 100' according to some embodiments of the present invention. When the volume of the electronic modulation device 100 changes, it may become as follows: Figure 4The electronic modulation device 100' is shown. According to the above, the second restoring force F2 may be greater than the first restoring force F1. Therefore, the restoring force received by the second substrate 112 in the area corresponding to the second part 20 is greater than the restoring force received by the second substrate 112 in the area corresponding to the first part 10. As a result, the distance between the first substrate 102 and the second substrate 112 in the area corresponding to the first part 10 may be the distance Z1 plus the thickness H2, and the distance between the first substrate 102 and the second substrate 112 in the area corresponding to the second part 20 may be the distance Z2 plus the thickness H2, and the distance Z1 plus the thickness H2 may be less than the distance Z2 plus the thickness H2. The distance Z1 may be less than the distance Z2. In other embodiments, at this time, the adjustment unit 104b has a thickness H3, and the adjustment unit 106b has a thickness H4. As Figure 4 In this embodiment, the distance between the first portion 10 of the first substrate 102 and the second substrate 112 is substantially equal to the thickness H3, and the distance between the second portion 20 of the first substrate 102 and the second substrate 112 is substantially equal to the thickness H4.

[0073] In some cases, for example, when the electronic modulation device changes in volume due to heat, the second substrate 112 may be deformed, so that the distance between the first substrate 102 and the second substrate 112 increases. As a result, the capacitance value in the electronic modulation device may change, thereby affecting the performance of the electronic modulation device. In this embodiment, an adjustment unit 104 with a smaller elastic coefficient is provided in the first part 10 where the working device 540 is provided, and an adjustment unit 106 with a larger elastic coefficient is provided in the second part 20 where the working device 540 is not provided. Figure 4 As shown, when the electronic modulation device changes in volume due to heat, for example, the distance change between the first portion 10 of the first substrate 102 and the second substrate 112 is smaller than the distance change between the second portion 20 of the first substrate 102 and the second substrate 112. That is, the distance change at the location where the working device 540 is provided is smaller, and the working device 540 can be made more stable under the condition of temperature change, thereby improving the reliability of the electronic modulation device 100.

[0074] Various changes and modifications can be made to the embodiments of the present invention. Figure 5A , 5B , Figure 5A , 5B FIG. 2 is a process flow chart of the electronic modulation device 200 according to some other embodiments of the present invention. Figure 5A The structure shown can be used with Figure 3AThe structures shown are the same or similar, with one difference being that the adjustment unit 104 is replaced by the adjustment unit 204, and the adjustment unit 106 is replaced by the adjustment unit 206. In some embodiments, the material of the adjustment unit 204 and the material of the adjustment unit 206 may be substantially the same, and may have substantially the same density. Therefore, the adjustment unit 204 and the adjustment unit 206 may have substantially the same elastic coefficient. In some embodiments, the adjustment unit 204 and the adjustment unit 206 have a fourth elastic coefficient K4. Figure 5A As shown, the adjustment unit 204 has a thickness H5, and the adjustment unit 206 has a thickness H6, wherein the thickness H6 may be greater than the thickness H5. In addition, the adjustment unit 108 has a thickness X7 and may have a third elastic coefficient K3 greater than the fourth elastic coefficient K4. Figure 5A As shown, there is a thickness difference X3 between the adjustment unit 204 and the adjustment unit 108, and there is a thickness difference X4 between the adjustment unit 206 and the adjustment unit 108, and the thickness difference X4 may be greater than the thickness difference X3. In some embodiments, the adjustment unit 204, the adjustment unit 206, and the adjustment unit 108 may have different sizes, for example, different upper surface areas or shapes, or different side surface areas or shapes.

[0075] Next, if Figure 5B As shown, a modulation material layer 110 is filled on the first substrate 102, and a second substrate 112 is disposed on the first substrate 102, so that the adjustment unit 204 and the adjustment unit 206 are compressed to form the electronic modulation device 200. Figure 5B As shown, the adjustment unit 204a, the adjustment unit 206a, the adjustment unit 108 and the modulation material layer 110 are disposed between the first substrate 102 and the second substrate 112. Moreover, the adjustment unit 204a, the adjustment unit 206a, the adjustment unit 108 may have a thickness H7', wherein the thickness H7' may be less than or equal to the thickness H7.

[0076] In some embodiments, in the electronic modulation device 200, the distance between the first substrate 102 and the second substrate 112 is substantially the same in different regions. For example, the distance between the first portion 10 of the first substrate 102 and the second substrate 112 is the distance D2, and the distance between the second portion 20 of the first substrate 102 and the second substrate 112 is also the distance D2. Figure 5A , 5BAs shown, there is a thickness difference X3 between the compressed adjustment unit 204a and the adjustment unit 204 before compression, and there is a thickness difference X4 between the compressed adjustment unit 206a and the adjustment unit 206 before compression. The adjustment unit 108 may be substantially uncompressed. The compressed adjustment unit 204a and the adjustment unit 206a may have a third restoring force F3 and a fourth restoring force F4, respectively. The third restoring force F3 and the fourth restoring force F4 may satisfy Hooke's law. In this embodiment, F3=-K4X3, F4=-K4X4. That is, the magnitude of the restoring force of the adjustment unit 204a may be substantially equal to K4X3, and the magnitude of the restoring force of the adjustment unit 206a may be substantially equal to K4X4. Since the elastic coefficients of the adjustment unit 204a and the adjustment unit 206a may be substantially equal, the magnitude of the restoring force of the adjustment unit 204a and the adjustment unit 206a may depend on the compressed lengths of the adjustment unit 204a and the adjustment unit 206a. Because the thickness difference X4 may be greater than the thickness difference X3, the fourth restoring force F4 may be greater than the third restoring force F3. It is worth noting that Figure 5B The fourth restoring force F4 and the third restoring force F3 are shown for illustration only. In fact, the restoring forces generated by the adjustment units 204a and 206a may be directed in more than one direction. In some embodiments, the third restoring force F3 and the fourth restoring force F4 may be directed in the normal direction of the substrate 102 .

[0077] See also Figure 6 , Figure 6 FIG. 2 is a cross-sectional view of an electronic modulation device 200' according to some embodiments of the present invention. When the electronic modulation device 200 expands, it may become as follows: Figure 6 The electronic modulation device 200' is shown. According to the above, the fourth restoring force F4 may be greater than the third restoring force F3. Therefore, the restoring force received by the second substrate 112 in the area corresponding to the second part 20 may be greater than the restoring force received by the second substrate 112 in the area corresponding to the first part 10. As a result, the distance between the first substrate 102 and the second substrate 112 in the area corresponding to the first part 10 may be the distance Z3 plus the thickness H7, and the distance between the first substrate 102 and the second substrate 112 in the area corresponding to the second part 20 may be the distance Z4 plus the thickness H7, and the sum of the distance Z3 plus the thickness H7 may be less than the sum of the distance Z4 plus the thickness H7. The distance Z3 may be less than the distance Z4. At this time, the adjustment unit 204b may have a thickness H8, and the adjustment unit 206b may have a thickness H9. As Figure 6 In this embodiment, the distance between the first portion 10 of the first substrate 102 and the second substrate 112 may be substantially the same as the thickness H8, and the distance between the second portion 20 of the first substrate 102 and the second substrate 112 may be substantially the same as the thickness H9, wherein the thickness H9 may be greater than the thickness H8.

[0078] The adjustment unit 204 and the adjustment unit 206 may be modified and adjusted in various ways in the embodiments of the present invention. Figure 7 , Figure 7 3 is a cross-sectional schematic diagram of an electronic modulation device 300 according to some embodiments of the present invention. The electronic modulation device 300 is the same as or similar to the electronic modulation device 100, and one difference therebetween is that the adjustment unit 104 is replaced by the adjustment unit 304, and the adjustment unit 106 is replaced by the adjustment unit 306. Figure 7 As shown, the adjustment unit 304 includes a plurality of spacers 308. The adjustment unit 306 includes a plurality of spacers 310. The materials of the spacers 308 and 310 may be the same or similar to those of the adjustment unit 104 and the adjustment unit 106, respectively, and will not be described in detail herein. In other embodiments, the material of the spacers 308 may be different from the material of the spacers 310. Figure 7 The adjustment unit 304 is shown to include two spacers 308, and the adjustment unit 306 includes two spacers 310. In other embodiments, the adjustment unit 304 may include at least one or more spacers 308, and the adjustment unit 306 may include at least one or more spacers 310. The number of spacers 308 in a unit area may also be different from the number of spacers 310 in the above unit area. For example, the number of spacers 308 in a unit area may also be greater than or less than the number of spacers 310 in the above unit area. The unit area may be, for example, a rectangular area of ​​5 cm by 5 cm, a rectangular area of ​​3 cm by 3 cm, a rectangular area of ​​1 cm by 1 cm, or other appropriate areas, but is not limited thereto. In this embodiment, the second substrate 112 is subjected to two first restoring forces F1 at a location corresponding to the first portion 10, and is subjected to two second restoring forces F2 at a location corresponding to the second portion 20. Since the second restoring force F2 is greater than the first restoring force F1 , when the electronic modulation device 300 changes volume due to heat, the distance change between the first portion 10 of the first substrate 102 and the second substrate 112 will be smaller than the distance change between the second portion 20 of the first substrate 102 and the second substrate 112 .

[0079] In other embodiments, the adjustment unit 304 may include a plurality of spacers 308, wherein the elastic coefficients of the plurality of spacers 308 are K n1 , K n2 , K n3 ……, the compression amounts of the plurality of spacers 308 are respectively X n1 , X n2 , X n3 The adjustment unit 306 includes a plurality of spacers 310, and the elastic coefficients of the plurality of spacers 310 are K m1 , K m2 , K m3……, the compression amounts of the plurality of spacers 310 are respectively X m1 , X m2 , X m3 ……. The above compression amount and elastic coefficient may be at least partially different. The number of spacers 308 may also be different from the number of spacers 310. The magnitude of the restoring force of the adjustment unit 304 may be substantially equal to K n1 X n1 +K n2 X n2 +K n3 X n3 + ……, the restoring force of the adjustment unit 306 can be substantially equal to K m1 X m1 +K m2 X m2 +K m3 X m3 + …… The magnitude of the restoring force of the adjustment unit 304 may be smaller than the magnitude of the restoring force of the adjustment unit 306 .

[0080] See also Fig. 8A and Figure 8B , Fig. 8A is a cross-sectional schematic diagram of a first portion 10 of an electronic modulation device 500 according to some embodiments of the present invention, Figure 8B FIG. 5 is a schematic cross-sectional view of the second portion 20 of the electronic modulation device 500 according to some embodiments of the present invention. Fig. 8A , 8B The electronic modulation device 500 shown is only an example, and the present invention is not limited thereto. Fig. 8A , 8B Some components are omitted. In some embodiments, Fig. 8A , 8B The first part 10 shown in the electronic modulation device 500 may correspond to the first part 10 shown in the electronic modulation devices 100, 200, 300, and the second part 20 shown in the electronic modulation device 500 may correspond to the second part 20 shown in the electronic modulation devices 100, 200, 300.

[0081] like Fig. 8A and Figure 8BAs shown, the electronic modulation device 500 may include a substrate 502. The substrate 502 is used to set the working device 540 or other components. The substrate 502 may be, for example, a glass substrate, a ceramic substrate, a polymer substrate, or any other suitable substrate. The electronic modulation device 500 may include an insulating layer 504 and a protective layer 506. The insulating layer 504 may be disposed on the substrate 502, and the protective layer 506 may be disposed on the insulating layer 504. The material of the insulating layer 504 may include silicon oxide, silicon nitride, or other suitable insulating materials, but is not limited thereto. The material of the protective layer 506 may include phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), a low-k dielectric material, or other suitable dielectric materials. The low-k dielectric material may include fluorinated silica glass (FSG), carbon doped silicon oxide, amorphous fluorinated carbon, parylene, bis-benzocyclobutenes (BCB), polyimide, and is not limited thereto.

[0082] like Fig. 8AAs shown, in the first part 10, at least one working device 540 is formed on the substrate 502. The working device 540 may include a driving component 508, a first electrode 522, a second electrode 524, and a modulation material layer 526. In some embodiments, the driving component 508 may include a source 510, a drain 512, a gate electrode 514, and an active layer 516. The gate electrode 514 may include polysilicon, metal or other conductive materials, and is not limited thereto. The above-mentioned metal includes copper (Cu), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt) or titanium (Ti), and is not limited thereto. The active layer 516 may be disposed on the insulating layer 504. The material of the active layer 516 may include an amorphous semiconductor, a polycrystalline semiconductor, and / or a metal oxide. The semiconductor may include germanium (Ge), silicon (Si), tin (Sn), antimony (Sb), selenium (Se) and / or tellurium (Te). The metal oxide may be, for example, indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZTO), and is not limited thereto. The source 510 and the drain 512 are disposed on the insulating layer 504 and are located on both sides of the gate electrode 514. In addition, portions of the source 510 and the drain 512 are disposed on the active layer 516. The material of the source 510 and the drain 512 may include metals, such as copper (Cu), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt) or titanium (Ti), and is not limited thereto. In addition, the active layer 516 may include a channel region 518, and the channel region 518 may be located between the source 510 and the drain 512. As Figure 8B As shown, the working device 540 may not be disposed in the second portion 20 .

[0083] Although Fig. 8A The gate electrode 514 is shown as being disposed under the insulating layer 504, but various changes and adjustments may be made in the embodiments of the present invention. In some embodiments, the gate electrode 514 may be disposed on the active layer 516. The gate electrode 514 may also have two parts, wherein the first part is formed on the substrate 502 and the second part is formed on the protective layer 506, but the present invention is not limited thereto.

[0084] like Fig. 8A As shown, in the first portion 10, the electronic modulation device 500 may include a wire 520, a first electrode 522, a second electrode 524 and a modulation material layer 526. The wire 520, the first electrode 522 and the second electrode 524 may be made of metal, metal oxide, or other suitable conductive materials.

[0085] like Fig. 8A As shown, the modulation material layer 526 is disposed between the first electrode 522 and the second electrode 524. In some embodiments, the first electrode 522 and / or the second electrode 524 may be patterned to have a plurality of openings. The electric field between the first electrode 522 and the second electrode 524 may regulate the properties of the modulation material layer 526. In some embodiments, the first electrode 522 and / or the second electrode 524 do not extend to the second portion 20. In other embodiments, the first electrode 522 and / or the second electrode 524 may extend to the second portion 20.

[0086] In addition, the electronic modulation device 500 may include a display component layer 528 and / or a substrate 530. The display component layer 528 may be disposed on the second electrode 524. The display component layer 528 may include a filter layer, a light shielding layer, a protective layer and / or other components, and is not limited thereto. The substrate 530 may be, for example, a glass substrate, a ceramic substrate, a plastic substrate or any other suitable substrate. In some embodiments, the electronic modulation device 10 may include an electromagnetic component (not shown) for transmitting and / or receiving electromagnetic signals.

[0087] In some embodiments, in the first part 10 of the electronic modulation device 500, the electronic modulation device 500 may include an adjustment unit 532 and an adjustment unit 534. Fig. 8A As shown, the adjustment unit 532 and the adjustment unit 534 are disposed between the substrate 502 and the substrate 530. In the second portion 20 of the electronic modulation device 500, the electronic modulation device 500 may include the adjustment unit 534 and the adjustment unit 536. Figure 8B As shown, the adjustment unit 534 and the adjustment unit 536 are disposed between the substrate 502 and the substrate 530. In some embodiments, the adjustment unit 532, the adjustment unit 534 and the adjustment unit 536 may correspond to Figure 3B However, the present invention is not limited thereto.

[0088] According to some embodiments of the present invention, the electronic modulation device may include a first adjustment unit having a first restoring force per unit area, and a second adjustment unit having a second restoring force per unit area, wherein the first restoring force is greater than the second restoring force. The unit area may be, for example, a rectangular area of ​​5 cm by 5 cm, a rectangular area of ​​3 cm by 3 cm, a rectangular area of ​​1 cm by 1 cm, or other appropriate areas, but is not limited thereto. The first adjustment unit may be disposed on an area having a working device 540, and the second adjustment unit may be disposed on an area not having a working device 540. When the volume of the electronic modulation device changes, the distance between the two substrates in the area having a larger restoring force changes larger and / or faster. In this embodiment, the distance between the two substrates in the area having the working device 540 changes smaller and / or slower. Therefore, the stability of the electronic modulation device can be improved. In some embodiments, the restoring force of the adjustment unit may be adjusted by changing the elastic coefficient, material, number of spacers, compression length (thickness difference), density, other appropriate parameters, or a combination thereof of the adjustment unit. In addition, adjusting the elastic coefficient includes adjusting the spring coefficient or Young's modulus, but the present invention is not limited thereto. In the present invention, the above-mentioned various properties can be measured by disassembling the electronic modulation device before or after assembly, but are not limited thereto. The electronic modulation device of the present invention can include a display device, an antenna device, a car electronic device, a touch device, a sensing device, other appropriate devices, or a combination thereof.

[0089] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that any technician in the relevant technical field can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any technician in the relevant technical field can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of some embodiments of the present invention. As long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can be used according to some embodiments of the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes the combination of each claim and embodiment.

Claims

1. An electronic device, characterized in that: include: A first substrate having a first portion and a second portion; a second substrate, disposed opposite to the first substrate; At least one working device is disposed between the first substrate and the second substrate, wherein the at least one working device overlaps with the first portion and does not overlap with the second portion, wherein the at least one working device comprises a driving assembly, wherein the at least one working device comprises: a first electrode, a second electrode and a modulation material layer; a first spacer disposed between the first portion of the first substrate and the second substrate and at least partially overlapping the driving component, wherein the first spacer has a first thickness; a second spacer disposed between the second portion of the first substrate and the second substrate, wherein the second spacer has a second thickness; and A plurality of third spacers are disposed between the first substrate and the second substrate, wherein at least one of the third spacers has a third thickness, wherein the first spacer is disposed between two of the third spacers, The first thickness is smaller than the second thickness, and the third thickness is smaller than the first thickness.

2. The electronic device according to claim 1, wherein: The drive assembly includes: A source; a drain; a gate electrode; and An active layer.

3. The electronic device according to claim 1, wherein: The modulation material layer includes liquid crystal.

4. The electronic device according to claim 1, wherein: The materials of the first electrode and the second electrode include metal oxide.

5. The electronic device as claimed in claim 4, characterized in that: One of the first electrode and the second electrode has a plurality of openings.

6. The electronic device as claimed in claim 1, characterized in that: It further comprises a display component layer disposed on the at least one working device.

7. The electronic device according to claim 6, wherein: The display component layer includes at least one of a filter layer, a light shielding layer, and a protection layer.

8. An electronic device having a working area and a non-working area, wherein the non-working area is adjacent to the working area, wherein: include: a first substrate; a second substrate, disposed opposite to the first substrate; At least one working device is disposed between the first substrate and the second substrate, wherein the at least one working device is disposed in the working area and is not disposed in the non-working area, wherein the at least one working device includes a driving component, wherein the at least one working device includes: a first electrode, a second electrode and a modulation material layer; a first spacer disposed in the working area, disposed between the first substrate and the second substrate and at least partially overlapping the driving component, wherein the first spacer has a first thickness; a second spacer disposed in the non-working area and between the first substrate and the second substrate, wherein the second spacer has a second thickness; and A plurality of third spacers are disposed between the first substrate and the second substrate, wherein at least one of the third spacers has a third thickness, wherein the first spacer is disposed between two of the third spacers, The first thickness is smaller than the second thickness, and the third thickness is smaller than the first thickness.

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