LED Holder and Lighting Device

Abstract

An LED bracket includes at least a pair of conductive terminals, an insulating body that holds the pair of conductive terminals together, and an encapsulation cavity formed by enclosing the conductive terminals and the insulating body. Each of the conductive terminals includes a connection area and a lead extending out of the insulating body. The insulating body includes a base that holds the conductive terminals together and an outer peripheral wall extending upward from the outer periphery of the base. The encapsulation cavity is located above the base and within the outer peripheral wall. The insulating body further includes a dam formed by protruding upward from the base and located within the encapsulation cavity. The connection area of the conductive terminal is exposed within the dam, and white glue is covered within the dam, and the white glue covers the surface of the connection area except for the welding position. This application further includes a light-emitting device.

Description

Technical Field

[0001] The present invention relates to the field of LEDs (Light Emitting Diodes), and particularly to an LED bracket and a lighting device. Background Art

[0002] An LED bracket is a carrier for encapsulating an LED chip. The LED chip emits light within the LED bracket, and reflectivity is one of the important indicators for measuring an LED bracket. An LED bracket generally includes at least a pair of conductive terminals and an insulating body that integrally forms the pair of conductive terminals. The LED chip is lapped on the pair of conductive terminals to connect to a power source for emitting light. As Figure 1 shown, the LED bracket includes a pair of conductive terminals 10 and an insulating body 20 that holds the pair of conductive terminals 10 together. The insulating body 20 includes a base 21 and an outer wall 22 that extends upward from the outer periphery of the base 21. At least a part of the upper surface of the conductive terminal 10, the surface of the base 21 of the insulating body 20, and the outer wall 22 enclose an encapsulation cavity 30 for encapsulating the LED chip. The bottom surface of the encapsulation cavity 30 is partially the surface of the conductive terminal 10 and partially the surface of the base of the insulating body 20, and the surface of the conductive terminal 10 is silver-plated, and the reflectivity of the silver-plated surface is not good.

[0003] In order to improve the reflectivity, the applicant now adopts a technical means of coating a layer of white glue on the bottom of the encapsulation cavity to increase the emissivity. At the same time, in order to reduce the area of glue coating, a dam 23 is provided at the bottom of the encapsulation cavity. The dam 23 includes a higher outer dam 232 and a lower inner dam 231. The inside of the inner dam 231 is the bottom surface of the encapsulation cavity 30. The bottom surface of the encapsulation cavity 30 is lower than the upper surface of the inner dam 231. When applying glue, control the glue to be applied to the bottom surface of the encapsulation cavity 30 enclosed by the inner dam 231. However, in actual operation, there will be deviations in the control of the glue output. If it is too little, the effect cannot be achieved. If it is too much, it will contaminate the side of the LED chip and affect the light-emitting effect of the chip. Summary of the Invention

[0004] Based on this, the present invention provides an LED bracket and a lighting device, which can effectively improve the reflectivity by covering the surface of the conductive terminal connection area within the dam with white glue.

[0005] To solve the above technical problems, the present application provides an LED bracket, which includes at least a pair of conductive terminals, an insulating body that holds the pair of conductive terminals together, and an encapsulation cavity formed by surrounding the conductive terminals and the insulating body. Each conductive terminal includes a connection area and a solder leg extending out of the insulating body. The insulating body includes a base that holds the conductive terminals together and an outer peripheral wall extending upward from the outer periphery of the base. The encapsulation cavity is located above the base and within the outer peripheral wall. The insulating body further includes a dam formed by protruding upward from the base and located within the encapsulation cavity. The connection area of the conductive terminal is exposed within the dam, and white glue is covered within the dam, and the white glue covers the surface of the connection area except for the welding position.

[0006] Preferably, the dam divides the encapsulation cavity into an inner cavity located within the dam and an outer cavity located between the dam and the outer peripheral wall. The inner cavity is used to accommodate an LED chip, and the LED chip is welded to the connection area to form the welding position.

[0007] Preferably, a drainage opening is formed on the dam to communicate the inner cavity and the outer cavity, and the excess white glue overflows from the inner cavity to the outer cavity. The drainage opening is formed by being recessed downward from the surface of the dam.

[0008] Preferably, the drainage opening has a drainage inclined surface on the bottom side and a drainage opening side wall. The drainage opening side wall has an outwardly flared structure, and the drainage inclined surface is an inclined surface extending obliquely downward from the inner cavity towards the outer cavity.

[0009] Preferably, the dam includes a first dam located within the inner cavity and a second dam located outside the first dam. The horizontal plane of the first dam is higher than the horizontal plane of the bottom surface of the encapsulation cavity, and the horizontal plane of the second dam is higher than the horizontal plane of the first dam. The drainage opening is formed by being recessed downward from the surface of the second dam. The inlet of the drainage opening is not higher than the surface of the first dam, and the outlet of the drainage opening is lower than the surface of the first dam.

[0010] Preferably, the inclination angle of the drainage inclined surface of the drainage opening is not less than 5 degrees, and an included angle of 5 - 160 degrees is formed between a pair of the drainage opening side walls.

[0011] Preferably, an isolation gap is formed between a pair of the conductive terminals. Each conductive terminal includes the connection area, heat dissipation areas connected to the longitudinal two ends of the connection area, and the solder legs formed at the longitudinal two ends of the heat dissipation areas. The width of the isolation gap between the connection areas of a pair of the conductive terminals is smaller than the isolation gap between the heat dissipation areas of a pair of the conductive terminals. The surface of the connection area is exposed within the inner cavity, and the surface of the heat dissipation area is exposed within the outer cavity.

[0012] Preferably, a transverse outer portion of the connection region is cut away to form a cut groove, the cut groove separating two heat dissipation regions of the same conductive terminal. A cut is provided between the connection region and the heat dissipation region, the cut being opened from one side of the isolation gap towards the transverse outside, and the cut being open towards the isolation gap side.

[0013] Preferably, a depression groove extending in the longitudinal direction is formed by downward depression at a position near the edge of the cut groove on the upper surface of the connection region. A middle portion of the depression groove overlaps with the cut groove, and the dam is formed by upward convex extension around the depression groove and the cut position.

[0014] Preferably, a stepped portion is formed by thinning the bottom of the conductive terminal at the periphery of the cut groove, the periphery of the connection region, the periphery of the cut, and the periphery of the heat dissipation region. The base of the insulating body further includes a terminal groove, and the terminal groove includes a wrapping portion that wraps the bottom surface of the stepped portion, a first exposure hole that exposes the upper surface of the heat dissipation region, and a second exposure hole that exposes the upper and lower surfaces of the connection region.

[0015] To solve the above technical problems, the present application further provides a light-emitting device, including the aforementioned LED bracket and an LED chip encapsulated in the encapsulation cavity of the LED bracket. The LED chip includes a core body and a connection pin located below the core body. The core body is located above the inner cavity and the first dam, and there is a gap between the core body and the upper surface of the first dam. The connection pin is welded to the connection region of the conductive terminal.

[0016] Preferably, there is a certain gap between the core body and the second dam, and the upper surface of the second dam is higher than the lower surface of the core body. The drainage slope is lower than the lower surface of the core body. After the LED chip is first welded to the connection region, white glue is injected into the gap between the second dam and the core body. The white glue flows into the inner cavity through the gap between the lower surface of the core body and the surface of the second dam and covers the connection region. Finally, transparent resin is injected into the encapsulation cavity to encapsulate the LED chip.

[0017] In the LED bracket and the light-emitting device of the present application, by providing an upward convex dam in the encapsulation cavity and then injecting white glue that covers the connection region of the conductive terminal in the dam, the reflectivity of the inner cavity in the dam can be effectively improved.

[0018] Meanwhile, a drainage port is provided on the second dam, and excess white glue flows into the outer cavity outside the dam through the drainage port, preventing the white glue from excessively covering the outer sidewall of the LED chip and affecting the light extraction efficiency. Description of the Drawings

[0019] Figure 1 Is a perspective view of an LED bracket in the prior art;

[0020] Figure 2 is a perspective view of the light-emitting device of the present application;

[0021] Figure 3 is a perspective view of the LED bracket of the present application;

[0022] Figure 4 is an exploded perspective view of the light-emitting device of the present application;

[0023] Figure 5 is an exploded perspective view of the light-emitting device from another angle of the present application;

[0024] Figure 6 is along Figure 2 the cross-sectional view and its partial enlarged view along the dashed line A-A shown;

[0025] Figure 7 is along Figure 2 the cross-sectional view along the dashed line B-B shown.

[0026] Reference signs in the drawings:

[0027] Conductive terminal - 10; Heat dissipation area - 11; Soldering foot - 12; Connection area - 18; Cutting groove - 13; Inner cutting groove - 131; Outer cutting groove - 132; Notch - 14; Concave groove - 15; Isolation gap - 16; Step portion - 17; First step portion - 171; Second step portion - 172; Third step portion - 173; Insulating body - 20; Substrate - 21; Peripheral wall - 22; Reflective inclined surface - 221; Transition arc surface - 222; Concave edge - 223; Dam - 23; First dam - 231; Second dam - 232; Drainage port - 233; Drainage inclined surface - 2331; Drainage port side wall - 2332; Terminal groove - 24; First exposure hole - 241; Second exposure hole - 242; Wrapping portion - 243; Encapsulation cavity - 30; Inner cavity - 301; Outer cavity - 302; Encapsulation cavity bottom - 31; LED chip - 40; Core body - 41; Connection pin - 42. Detailed implementation manners

[0028] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used in the description of the present invention herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention.

[0031] This application takes Figure 2 the X direction shown as the transverse direction, the Y direction as the longitudinal direction, and the Z direction as the upper part in the vertical direction.

[0032] Please refer to Figure 2 、 Figure 3 As shown, the light-emitting device of this application includes an LED bracket, an LED chip 40 encapsulated in the LED bracket, and a power source (not shown). The LED chip is encapsulated in the LED bracket through a transparent material, and the LED chip is completely wrapped in the transparent material. The power source provides electrical energy to the LED chip 40 through the LED bracket and makes it emit light.

[0033] Please continue to refer to Figure 4 、 Figure 5 As shown, the LED bracket of this application includes at least a pair of conductive terminals 10, an insulating body 20 that forms the pair of conductive terminals 10 into one body, and a packaging cavity 30 that is recessed downward from the insulating body 20 to the surface of the conductive terminals 10.

[0034] The pair of conductive terminals 10 are isolated from each other and form an isolation gap 16. Each conductive terminal 10 includes a connection area 18, a heat dissipation area 11 that extends longitudinally from both longitudinal ends of the connection area 18, and a solder leg 12 that continues to extend from the heat dissipation area 11. The connection area 18 is located between the two heat dissipation areas 11. In the transverse direction, the width of the isolation gap 16 between the connection areas 18 of the pair of conductive terminals 10 is smaller than the width of the isolation gap 16 between the heat dissipation areas 11 of the pair of conductive terminals 10.

[0035] The transverse outer part of the connection area 18 is cut to form a cut groove 13 and separates the two heat dissipation areas 11 of the same conductive terminal 10. The cut groove 13 includes an inner cut groove 131 close to the connection area 18 and an outer cut groove 132 far from the connection area 18. The cut groove 13 penetrates the transverse outer side of the conductive terminal 10 in the transverse direction, making the cut groove 13 in an open state on the transverse outer side. The width of the inner cut groove 131 is smaller than the width of the outer cut groove 132.

[0036] A cut 14 is formed between the connection area 18 and the heat dissipation area 11. The cut 14 is formed from one side of the isolation gap 16 towards the lateral outside, and the cut 14 is in an open state towards the lateral inside. When observed in the longitudinal direction, at least a part of the end of the cut 14 coincides with the inner cut groove 131. A recessed groove 15 extending in the longitudinal direction is formed by downward depression on the upper surface of the connection area 18 near one side of the inner cut groove 131. The middle part of the recessed groove 15 overlaps with the inner cut groove 131, that is, in the longitudinal direction, the recessed groove 15 overlaps with the end of the cut 14. In this embodiment, the recessed groove 15 is not connected to the cut 14, and at least a part of the upper surface of the connection area 18 between the recessed groove 15 and the cut 14 is not depressed downward to form a barrier. In another embodiment, the recessed groove 15 extends longitudinally and is connected to the cut 14.

[0037] Four cuts 14 and two recessed grooves 15 of a pair of the conductive terminals 10 form a substantially rectangular area. The bottom edge of the conductive terminal 10 is thinned upward to form a stepped portion 17. The stepped portion 17 includes a first stepped portion 171 formed at the lateral inner edge of the connection area 18 and the heat dissipation area 11, a second stepped portion 172 formed on the outer periphery of the cut groove 13, and a third stepped portion 173 formed at the lateral outside of the heat dissipation area 11. In specific implementation, the second stepped portion 172 and the third stepped portion 173 can be connected or independent of each other. The first stepped portion 171 is formed at the periphery of the notch 14, the lateral inner edge of the connection area 18, and the lateral inner edge of the heat dissipation area 11. The solder leg 12 is formed longitudinally from the longitudinal outer end of the heat dissipation area 11 and extends at a position laterally outside the heat dissipation area 11.

[0038] Please continue to refer to Figures 2 to 7 As shown, the insulating body 20 includes a base 21, a peripheral wall 22 extending upward from the outer periphery of the base 21, an encapsulation cavity 30 formed by enclosing the base 21, the conductive terminal 10, and the peripheral wall 22, and a dam 23 protruding upward from the surface of the base 21 and located in the encapsulation cavity 30.

[0039] The surface of the base 21 is flush with the upper surfaces of the heat dissipation area 11 and the connection area 18 of the conductive terminal 10. The upper and lower surfaces of the connection area 18 and the heat dissipation area 11 are exposed to the outside, that is, at least a part of the upper surfaces of the connection area 18 and the heat dissipation area 11 are exposed in the encapsulation cavity 30, the lower surfaces of the connection area 18 and the heat dissipation area 11 are exposed outside the lower surface of the base 21, and the bottom surfaces of the connection area 18 and the heat dissipation area 11 are flush with the bottom surface of the base 21.

[0040] The design of the recessed groove 15 and the notch 14 of the conductive terminal 10 is to facilitate the flow of plastic and integrally form the dam 23 when the insulating body 20 is molded. The dam 23 extends upward from the surface of the base 21, and the dam 23 is embedded in the groove 15, the inner cut groove 131, and the notch 14, so that the dam 23 and the base 21 form a whole to increase the strength of the dam 23. The encapsulation cavity 30 includes an encapsulation cavity bottom 31, and the encapsulation cavity bottom 31 is jointly formed by the connection area 18 and the heat dissipation area 11 surfaces of the base 21 and the conductive terminal 10 on the same horizontal plane. The dam 23 includes a first dam 231 with a surface higher than the encapsulation cavity bottom 31, a second dam 232 located outside the first dam 231, and a plurality of drainage openings 233 formed in the second dam 232. The surface of the second dam 232 is higher than the surface of the first dam 231, and the surface of the first dam 231 is higher than the surface of the encapsulation cavity bottom 31. The dam 23 divides the encapsulation cavity 30 into an inner cavity 301 and an outer cavity 302. The inner cavity 301 is located inside the first dam 231, and the outer cavity 302 is located between the second dam 232 and the outer wall 22.

[0041] The dam 23 is generally in a square structure, and the drainage openings 233 are formed on all four sides of the second dam 232. The drainage opening 233 includes a drainage slope 2331 and a drainage opening side wall 2332. The drainage opening side wall 2332 is in an outward flared structure, and the width of the drainage opening 233 is not less than 0.05 mm. An included angle of 5 - 160 degrees is formed between the two drainage opening side walls 2332 of one drainage opening 233. The drainage slope 2331 is the bottom surface of the drainage opening 233. The drainage slope 2331 extends outward from the surface of the first dam 231 and continuously slopes downward, and the inclination of the drainage slope 2331 is not less than 5 degrees. The inner cavity 301 communicates with the outer cavity 302 through the drainage opening 233. In an embodiment, the surface of the first dam 231 at the position corresponding to the drainage opening 233 may be appropriately recessed downward to facilitate the flow of liquid.

[0042] The inner surface of the peripheral wall 22 serves as the outer wall of the encapsulation cavity 30. The inner surface of the peripheral wall 22 includes a reflective inclined surface 221, a transition arc surface 222 that smoothly connects the reflective inclined surface 221 and the bottom 31 of the encapsulation cavity, and a recessed edge 223 formed by recessing downward from the inner edge of the top of the peripheral wall 22. When the base 21 is formed to hold the conductive terminal 10, a terminal groove 24 is formed. The terminal groove 24 includes a first exposure hole 241 that exposes the upper and lower surfaces of the heat dissipation area 11, a second exposure hole 242 that exposes the upper and lower surfaces of the connection area 18, and a wrapping portion 243 that wraps around the lower side of the stepped portion 17. The presence of the wrapping portion 243 and the stepped portion 17 can make the combination of the conductive terminal 10 and the insulating body 20 more compact and not easily loosened. The upper side of the first exposure hole 241 is exposed within the outer cavity 302, the upper side of the second exposure hole 242 is exposed within the inner cavity 301, the upper surface of the connection area 18 is exposed within the inner cavity 301 through the second exposure hole 242, and the upper surface of the heat dissipation area 11 is exposed within the outer cavity 302 through the first exposure hole 241.

[0043] The LED chip 40 includes a core body 41 and a connection pin 42 located on the lower side of the core body 41.

[0044] For key reference Figure 6 As shown, when manufacturing the light-emitting device of the present application by encapsulation, first place the LED chip 40 in the area where the first dam 231 and the inner cavity 301 are located. At this time, the connection pin 42 contacts downward and is welded to the connection area 18 of a pair of conductive terminals 10, and a welding position is formed at the surface welding position of the connection pin 42 and the connection area 18. The core body 41 covers the inner cavity 301 and partially covers the first dam 231, and there is a gap h between the bottom surface of the core body 41 and the upper surface of the first dam 231. The outer dimension of the core body 41 is smaller than that of the second dam 232, so there is still a gap between the second dam 232 and the core body 41, and the lower surface of the core body 42 is lower than the upper surface of the second dam 232. Subsequently, white glue (mainly composed of SIO2) is injected onto the surface of the first dam 231 around the core body 41. The white glue enters the inner cavity 301 along the gap h between the core body 41 and the surface of the first dam 231 and fills the surface of the inner cavity 301, mainly covering the surface of the connection area 18 of the conductive terminal 10 except for the welding position, so that the surface of the silver-plated conductive terminal 10 is covered to have a better reflectivity. Finally, the encapsulation cavity 30 is filled with transparent resin to encapsulate the LED chip 40 within the encapsulation cavity 30 to form the light-emitting device of the present application.

[0045] When the white glue is injected, if the amount of glue is insufficient, it is not enough to cover the connection area of the inner cavity 301. If the amount of glue is excessive, it is likely to overflow to the surface of the first dam 231 and may exceed a certain height of the first dam 231, resulting in covering the side surface of the core 41, thereby affecting the light extraction efficiency of the core 41. The reason for this problem is that the size of the LED bracket itself is very small, and it is difficult to precisely control the amount of glue. In the present application, the drainage opening 233 provided on the second dam 232 will cause the excess white glue to flow out from the drainage opening 233 into the outer cavity 302, so as to ensure that the outer side surface of the core 41 in the inner cavity 301 will not be covered by the white glue. The outwardly flared structure of the drainage opening 233 can prevent the white glue from flowing back, and at the same time, the presence of the drainage slope 2331 also plays a role in preventing backflow and guiding the white glue to flow outwards.

[0046] In the LED bracket and the light-emitting device of the present application, by providing an upwardly protruding dam 23 in the encapsulation cavity 30 and then injecting white glue in the dam 23 to cover the connection area 18 of the conductive terminal 10, the reflectivity of the inner cavity 301 in the dam 23 can be effectively improved. At the same time, a drainage opening 233 is provided on the second dam 232, and the excess white glue flows into the outer cavity 302 outside the dam 23 through the drainage opening 233, avoiding the excessive coverage of the outer side wall of the LED chip by the white glue and affecting the light extraction efficiency.

[0047] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0048] The above embodiments only express the preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. An LED bracket, comprising at least a pair of conductive terminals, an insulating body that holds the pair of conductive terminals together, and an encapsulation cavity formed by enclosing the conductive terminals and the insulating body. Each of the conductive terminals includes a connection area and a lead extending out of the insulating body. The insulating body includes a base that holds the conductive terminals together and a peripheral wall extending upward from the outer periphery of the base. The encapsulation cavity is located above the base and within the peripheral wall, and is characterized in that, The insulating body further includes a dam protruding upward from the base and located within the encapsulation cavity. The connection area of the conductive terminal is exposed within the dam. White glue covers the inside of the dam, covering the surface of the connection area except for the welding position. The dam divides the encapsulation cavity into an inner cavity within the dam and an outer cavity between the dam and the outer wall. The inner cavity is used to accommodate the LED chip, and the LED chip is welded to the connection area to form the welding position. A drainage opening is formed in the dam to communicate the inner cavity with the outer cavity, and excess white glue overflows from the inner cavity to the outer cavity.

2. The LED bracket according to claim 1, wherein The drainage opening is formed by a depression on the surface of the dam.

3. The LED bracket according to claim 2, wherein The drainage opening has a drainage slope on the bottom side and side walls of the drainage opening. The side walls of the drainage opening are in an outwardly flared structure, and the drainage slope is a slope extending obliquely downward from the inner cavity towards the outer cavity.

4. The LED bracket according to claim 3, wherein, The dam includes a first dam within the inner cavity and a second dam surrounding the first dam. The horizontal plane of the first dam is higher than the horizontal plane of the bottom surface of the encapsulation cavity, and the horizontal plane of the second dam is higher than the horizontal plane of the first dam. The drainage opening is formed by a depression on the surface of the second dam. The inlet of the drainage opening is not higher than the surface of the first dam, and the outlet of the drainage opening is lower than the surface of the first dam.

5. The LED bracket according to claim 4, wherein, The inclination angle of the drainage slope of the drainage opening is not less than 5 degrees, and an angle of 5 - 160 degrees is formed between a pair of side walls of the drainage opening.

6. The LED bracket according to claim 4, wherein, An isolation gap is formed between a pair of conductive terminals. Each conductive terminal includes the connection area, heat dissipation areas connected to the longitudinal ends of the connection area, and solder feet formed at the longitudinal ends of the heat dissipation areas. The width of the isolation gap between the connection areas of a pair of conductive terminals is smaller than the isolation gap between the heat dissipation areas of a pair of conductive terminals. The surface of the connection area is exposed within the inner cavity, and the surface of the heat dissipation area is exposed within the outer cavity.

7. The LED bracket according to claim 6, characterized in that, The lateral outer part of the connection area is cut to form a cut groove, which separates the two heat dissipation areas of the same conductive terminal. A notch is formed between the connection area and the heat dissipation area, and the notch is opened laterally outward from one side of the isolation gap, and the notch is open towards the isolation gap side.

8. The LED bracket according to claim 7, wherein A depression groove extending in the longitudinal direction is formed by a depression at the position near the edge of the cut groove on the upper surface of the connection area. The middle part of the depression groove overlaps with the cut groove, and the dam is formed by protruding upward around the depression groove and the notch.

9. The LED bracket according to claim 8, wherein, Steps are formed by thinning the bottom of the conductive terminal at the peripheries of the cut groove, connection area, notch, and heat dissipation area. The base of the insulating body further includes a terminal groove, which includes a wrapping portion wrapping the bottom surface of the step, a first exposure hole exposing the upper surface of the heat dissipation area, and a second exposure hole exposing the upper and lower surfaces of the connection area.

10. A light-emitting device, characterized in that, It includes an LED bracket as described in any one of claims 4-9 and an LED chip encapsulated in the encapsulation cavity of the LED bracket. The LED chip includes a core body and a connecting pin located below the core body. The core body is located above the inner cavity and the first dam, and there is a gap between the core body and the upper surface of the first dam. The connecting pin is welded to the connecting area of the conductive terminal.

11. The light-emitting device according to claim 10, characterized in that, There is a certain gap between the core body and the second dam, and the upper surface of the second dam is higher than the lower surface of the core body. The drainage slope is lower than the lower surface of the core body. After the LED chip is first welded to the connecting area, white glue is injected into the gap between the second dam and the core body. The white glue flows into the inner cavity through the gap between the lower surface of the core body and the surface of the second dam and covers the connecting area. Finally, transparent resin is injected into the encapsulation cavity to encapsulate the LED chip.

Images