Camera module, spacer assembly, and method for manufacturing a camera module

Abstract

A camera module according to an embodiment of the present application has a first component mounting substrate, a second component mounting substrate, and a spacer component. The first component mounting substrate has an imaging element. The second component mounting substrate is electrically connected to the first component mounting substrate. The spacer component is provided between the first component mounting substrate and the second component mounting substrate. The spacer component has a component body made of a first insulating material. The component body has a first main surface portion having three or more first reference surfaces and being in contact with the first component mounting substrate, a second main surface portion having three or more second reference surfaces and being in contact with the second component mounting substrate, and a component housing portion with or without a bottom provided to at least one of the first and second main surface portions.

Description

Technical Field

[0001] This technology relates to camera modules, spacer assemblies, and methods for manufacturing camera modules that can be applied to, for example, vehicle cameras and cellular phones. Background Technology

[0002] For example, in the case of vehicle cameras and cellular phones, board-to-board (hereinafter referred to as B-to-B) connectors are used to connect multiple boards (e.g., patent documents 1 and 2). It is important to ensure that the distance (parallelism) between the boards remains constant to prevent the load applied to the multiple boards during connection, the installation of multiple boards, and damage caused by vibration after the installation of multiple boards.

[0003] Furthermore, in cases such as automotive cameras, it is difficult to ensure space for adding small, high-density components to maintain the parallelism of the plates.

[0004] Citation List

[0005] Patent documents

[0006] Patent Document 1: WO2012 / 081051

[0007] Patent Document 2: Japanese Patent Application Publication No. 2013-135405 Summary of the Invention

[0008] Technical issues

[0009] Typically, to ensure flatness, multiple block spacer assemblies are arranged away from the B-to-B connectors. However, when multiple spacer assemblies are used for assembly due to space constraints, the cumulative tolerances, including individual differences between the spacer assemblies and assembly variations, increase, thus reducing parallelism. This can lead to board damage.

[0010] Furthermore, maintaining sufficient clearance (distance) between boards to avoid short circuits caused by boards increases the difficulty of performing the design (including designing peripheral components). In addition, due to the small size of the components, processing will be difficult.

[0011] In view of the above, one object of the present technology is to provide a camera module, a spacer assembly, and a method for manufacturing the camera module, which facilitates the execution of processes and enables the improvement of the parallelism of the plates.

[0012] Solutions to the problem

[0013] To achieve the above objectives, the camera module according to this technical embodiment includes a first component mounting plate, a second component mounting plate, and a spacer assembly.

[0014] The first component mounting plate includes the imaging device.

[0015] The second component mounting plate is electrically connected to the first component mounting plate.

[0016] A spacer assembly is disposed between a first component mounting plate and a second component mounting plate. The spacer assembly includes a component body made of a first insulating material. The component body includes a first main surface portion, a second main surface portion, and a component receiving portion with or without a bottom. The first main surface portion includes a plurality of first reference surfaces, including at least three first reference surfaces. The second main surface portion includes a plurality of second reference surfaces, including at least three second reference surfaces. The first main surface portion contacts the first component mounting plate, and the second main surface portion contacts the second component mounting plate. The component receiving portion is disposed in at least one of the first main surface portion or the second main surface portion.

[0017] The plurality of first reference surfaces and the plurality of second reference surfaces may be respectively disposed at the outer edge of the first main surface portion and the outer edge of the second main surface portion.

[0018] The component receiving portion may include a first component receiving portion as a through hole, the first component mounting plate may also include a first connector assembly received in the component receiving portion, and the second component mounting plate may include a second connector assembly received in the component receiving portion and connected to the first connector assembly.

[0019] The main body of the component may also include multiple engagement protrusions that control the misalignment between the spacer component and the first component mounting plate.

[0020] Each of the plurality of engagement protrusions may include: a rod portion disposed on a corresponding side edge of two side edges of the first main surface portion, the two side edges facing each other, and a claw portion disposed on the top end of the rod portion, the claw portion engaging with a surface of the first component mounting plate opposite to the surface of the first component mounting plate facing the spacer assembly.

[0021] The first component mounting plate may include a plurality of recesses, each recess being disposed on a corresponding side edge of one of the two side edges of the first component mounting plate, and the rod being inserted into the recess.

[0022] The component receiving portion may further include a second component receiving portion having a bottom, and the spacer assembly may further include a covering layer made of a second insulating material different from the first insulating material, the covering layer forming the inner surface of the second component receiving portion.

[0023] The second insulating material can be a composite material containing electromagnetic absorbing materials.

[0024] The second component housing portion can be positioned on the portion of the spacer assembly facing the imaging device in the thickness direction.

[0025] The second insulating material can have higher thermal conductivity than the first insulating material.

[0026] The spacer assembly may also include an interlayer connection portion disposed within the assembly body, the interlayer connection portion being electrically connected between the first assembly mounting plate and the second assembly mounting plate.

[0027] It may also include a housing that integrally houses a multilayer body of a first component mounting plate, a spacer assembly, and a second component mounting plate.

[0028] The spacer assembly according to this technical embodiment includes an assembly body made of insulating material.

[0029] The component body includes a first main surface portion containing a plurality of first reference surfaces, a second main surface portion containing a plurality of second reference surfaces, and a component receiving portion having or not having a bottom. The first main surface portion is in contact with a first component mounting plate, the second main surface portion is in contact with a second component mounting plate, and the component receiving portion is disposed on at least one of the first main surface portion or the second main surface portion.

[0030] A method for manufacturing a camera module according to an embodiment of the present technology includes:

[0031] A spacer assembly made of insulating material is provided. The spacer assembly includes a first main surface portion comprising a plurality of first reference surfaces, a second main surface portion comprising a plurality of second reference surfaces, and a component receiving portion without a bottom. The first main surface portion contacts a first component mounting plate including an imaging device, the second main surface portion contacts a second component mounting plate, and the component receiving portion is disposed on at least one of the first main surface portion or the second main surface portion.

[0032] The first component mounting plate is arranged to snap-fit ​​with the spacer component;

[0033] The first component mounting plate is placed on the plurality of first reference surfaces such that the first connector assembly is accommodated in the component accommodating portion and the first connector assembly is mounted on the first component mounting plate.

[0034] Invert the spacer assembly; and

[0035] The second component mounting plate is placed on the plurality of second reference surfaces to connect the second connector assembly to the first connector assembly in the component receiving portion, the second connector assembly being mounted on the second component mounting plate. Attached Figure Description

[0036] Figure 1This is an exploded perspective view of a camera module according to an embodiment of the present technology.

[0037] Figure 2 This schematically illustrates the assembly of the spacer assembly into... Figure 1 A cross-sectional side view of the state of the front and rear panels in the camera module.

[0038] Figure 3 yes Figure 1 Top perspective view of the spacer component in the camera module.

[0039] Figure 4 (A) illustrates the assembly of the spacer assembly into Figure 1 Bottom perspective view of the state of the front panel in the camera module. Figure 4 (B) illustrates the assembly of the spacer assembly into Figure 1 A top perspective view of the state of the rear panel in the camera module.

[0040] Figure 5 (A) illustrates assembling the spacer assembly into Figure 1 Top perspective view of the state of the front and rear panels. Figure 5 (B) is a cross-sectional perspective view showing the state of (A). Figure 5 (C) is a cross-sectional side view showing the state of (A).

[0041] Figure 6 This shows how to assemble the front panel to... Figure 1 A perspective view of the spacer component.

[0042] Figure 7 (A) shows the assembly of the rear panel to... Figure 6 A perspective view of the state of the spacer assembly and the front panel. Figure 7 (B) is to show that Figure 7 A perspective view of the state of the multilayer assembly of (A) into the lens assembly, shielding housing and dustproof sheet.

[0043] Figure 8 (A) shows the assembly of heat sinks and spacer pads. Figure 7 A perspective view of the state of the multi-layer body of (B) assembled into the rear shell. Figure 8 (B) shows the assembly of the O-rings. Figure 8 A perspective view of the state of the multi-layer body of (A) assembled into the front housing.

[0044] Figure 9 This is a schematic cross-sectional side view showing the state in which a spacer assembly according to another embodiment of the present technology is assembled to the front and rear panels.

[0045] Figure 10This is a schematic cross-sectional side view showing the state in which a spacer assembly according to another embodiment of the present technology is assembled to the front and rear panels.

[0046] Figure 11 This is a schematic cross-sectional side view showing the state in which a spacer assembly according to another embodiment of the present technology is assembled to the front and rear panels and housed in an outer casing. Detailed Implementation

[0047] Embodiments according to the present technology will now be described with reference to the accompanying drawings.

[0048] [Camera module configuration]

[0049] Figure 1 This is an exploded perspective view of a camera module according to an embodiment of the present technology. The camera module 100 is used, for example, as a vehicle-mounted camera. Of course, the technology described below can also be applied to any camera module for other purposes.

[0050] In the following description, the left-right direction, front-back direction (optical axis direction), and height direction of the camera module 100 are set as the X direction, Y direction, and Z direction, respectively. Of course, such directional settings are not restrictive.

[0051] The camera module 100 includes a front housing 10, an O-ring 6, a camera component 4, and a rear housing 13 in the positive Y-axis direction in the order listed.

[0052] Camera component 4 includes, in the positive Y-axis direction, a lens assembly 7, a shielding housing 8 for electromagnetic shielding, a dustproof sheet 9, a plate unit 5, a heat sink 18, and a spacer pad 19, arranged in the order listed. Plate unit 5 includes a front plate (first component mounting plate) 2, a spacer assembly 1, and a rear plate (second component mounting plate) 3, arranged in the positive Y-axis direction.

[0053] The front housing 10 includes a front surface portion 101 formed almost orthogonal to the front-rear direction (Y direction) and a side surface portion 102 extending rearward from the peripheral edge of the front surface portion 101.

[0054] In this embodiment, the front surface portion 101 is generally rectangular when viewed from the Y direction. The front housing 10 is hollow and includes a spatial portion, which is the area surrounded by the front surface portion 101 and the side surface portion 102.

[0055] The rear housing 13 is a shielding housing for electromagnetic shielding, including a rear surface portion 131 arranged almost orthogonal to the front-rear direction (Y direction), and a side surface portion 132 extending forward from the peripheral edge of the rear surface portion 131. Viewed in the Y direction, the rear surface portion 131 is generally rectangular, and its shape is almost identical to that of the front surface portion 101. The rear housing 13 is hollow and includes a spatial portion, which is the area surrounded by the rear surface portion 131 and the side surface portion 132. In this embodiment, the front housing 10 and the rear housing 13 correspond to outer shells, respectively.

[0056] The front housing 10 and the rear housing 13 are typically connected to each other by ultrasonic welding. This results in the formation of an internal space comprising the spatial portion of the front housing 10 and the spatial portion of the rear housing 13. The camera component 4 is arranged within the internal space.

[0057] like Figure 1 As shown, a through hole 103 is formed in the middle portion of the front surface portion 101 of the front housing 10, and the lens portion 71 of the lens assembly 7 is inserted into the through hole 103 to assemble the lens assembly 7 to the front housing 10. The camera component 4 is arranged such that the optical axis O for image capture approximately passes through the center of the lens assembly 7. The camera component 4 can capture images based on the light entering through the lens assembly 7.

[0058] For example, a digital camera including an image sensor (such as a complementary metal-oxide-semiconductor (CMOS) sensor or a charge-coupled device (CCD) sensor) is used as camera component 4. Alternatively, any camera can be used. In this embodiment, camera component 4 corresponds to the image capturing component.

[0059] Connector 135 is disposed on the rear surface portion 131 of the rear housing 13. Connector 135 is, for example, a coaxial connector for flexible printed circuits (FPC) or flexible flat cables (FFC). For example, power is supplied to camera component 4, and image signals are output from camera component 4 via a cable (not shown) connected to connector 135. The configuration of connector 135 can be arbitrarily designed.

[0060] O-rings 6 are arranged inside the front housing 10, surrounding the entire circumference of the inner circumference surface of the front housing 10. The O-rings 6 are used to form a seal between the front housing 10 and the camera component 4 (lens assembly 7). For example, this prevents raindrops from entering the housing through the through-hole 103 of the front housing 10.

[0061] Any elastic material, such as rubber or plastic, can be used as the material for the O-ring 6. In this embodiment, the O-ring 6 corresponds to an elastic member.

[0062] The front housing 10 and the rear housing 13 are formed using insulating materials such as resin or ceramic. For example, engineering plastics, such as general-purpose resins (e.g., acrylonitrile-butadiene-styrene (ABS) resin), polycarbonate (PC) resin, or a mixture of ABS and PC resins, are used as resin materials. The resin used for forming is not limited to these, and the material and color (transparency) of the resin used for forming can be selected as needed.

[0063] Note that this technology is not limited to the use of resin materials; for example, die-cast components made of metal materials can be used as the front housing 10 and the rear housing 13.

[0064] Furthermore, the methods used to form the front housing 10 and the rear housing 13 are not limited, and, for example, any molding technique can be used to perform the formation.

[0065] [Board Unit]

[0066] Figure 2 This is a cross-sectional side view schematically showing the state in which the spacer assembly 1 is assembled to the front panel 2 and the rear panel 3.

[0067] The spacer assembly 1 is disposed between the front plate 2 and the rear plate 3. The spacer assembly 1 includes a front surface 11 (first main surface portion) supporting the front plate 2 and a rear surface 12 (second main surface portion) supporting the rear plate 3, and holds the front plate 2 and the rear plate 3 at a constant distance from each other, the constant distance corresponding to the thickness T of the spacer assembly 1.

[0068] The spacer assembly 1 is a single layer of a plate-shaped assembly body 110, which has a specified shape and a thickness T in the Y direction. The assembly body 110 is an insulator and is, for example, an injection molded body of a synthetic resin material (first insulating material) (e.g., ABS resin molding, polycarbonate (PCB)) or ceramic.

[0069] In this embodiment, the spacer assembly 1 is a single layer of the assembly body 110. Therefore, unless otherwise specified, the spacer assembly 1 is also referred to hereinafter as the assembly body 110. Note that the spacer assembly may be configured to include the assembly body and a layer integrally formed with the assembly body and made of a material of a different type than that of the assembly body. This will be described later.

[0070] Front panel 2 is a rectangular rigid double-sided assembly mounting plate. Electronic components, including the imaging device 22, are mounted on the front surface of front panel 2. Figure 2 The various electronic components for driving the imaging device 22 and the first connector assembly 23 for making B-to-B connections are mounted on the upper surface of the front panel 2. Figure 2On the lower surface of the front panel 2. The imaging device 22 is a solid-state imaging device such as a CMOS or CCD image sensor.

[0071] The rear plate 3 is a rectangular rigid double-sided assembly mounting plate. The dimensions of the rear plate 3 are typically the same as the front plate 2. Another electronic component for driving the imaging device 22 and a second connector assembly 31 electrically connected to the first connector assembly 23 are mounted on the front surface of the rear plate 3. Figure 2 On the upper surface of the rear plate 3 in the middle.

[0072] In addition to the imaging device 22 and connector assemblies 23 and 31 described above, the electronic components mounted on the front panel 2 and the rear panel 3 also include: IC components, which are included in, for example, digital signal processors (DSPs), central processing units (CPUs) and power supply circuits; and passive components such as coils, resistors and capacitors.

[0073] The spacer assembly 1 includes a component receiving portion 115, which accommodates a first connector assembly 23 and a second connector assembly 31. The component receiving portion 115 is either a recess without a bottom or a through hole with a specified shape that passes through the component body 110. Furthermore, escape portions (recesses) are provided on the front and rear surfaces of the spacer assembly 1 to prevent interference between the spacer assembly 1 and various electronic components mounted on the rear surface of the front plate 2 and the front surface of the rear plate 3.

[0074] The front plate 2 and the rear plate 3 are mechanically and electrically connected to each other via the first connector assembly 23 and the second connector assembly 31. When the first connector assembly 23 and the second connector assembly 31 are connected to each other, the front plate 2 contacts the front surface 11 of the spacer assembly 1, and the rear plate 3 contacts the rear surface 14 of the spacer assembly 1.

[0075] Next, the spacer component 1 will be described in detail. Figure 3 This is the top perspective view of spacer component 1. Figure 4 (A) is a bottom perspective view showing the spacer assembly 1 assembled to the front panel 2. Figure 4 (B) is a top perspective view showing the state of the spacer assembly 1 assembled to the rear plate 3. Figure 5 (A) is a top perspective view showing the state in which the spacer assembly 1 is assembled to the front panel 2 and the rear panel 3. Figure 5 (B) is a cross-sectional perspective view showing the state of (A). Figure 5 (C) is a cross-sectional side view showing the state of (A).

[0076] The spacer assembly 1 is generally rectangular in shape. The size of the spacer assembly 1 is not particularly limited and is usually formed to be almost equal in size to the front panel 2 and the rear panel 3.

[0077] The surface 11 of the spacer assembly 1 is formed by multiple reference planes (first reference planes). For example... Figure 3 and Figure 4 As shown in (B), the plurality of reference planes includes four reference planes 111, 112, 113, and 114. Reference planes 111 to 114 are coplanar planar portions (belonging to the front surface 11) and contact the rear surface of the front plate 2 when the spacer assembly 1 and the front plate 2 are arranged in a stacked configuration (see reference). Figure 5 (C)).

[0078] Note that datum planes 111 to 114 among the multiple datum planes can be in different planes and not coplanar with each other.

[0079] The positions of the reference surfaces 111 to 114 are not particularly limited and can be appropriately set according to the position and size of the components mounted on the rear surface of the front panel 2. Reference surfaces 111 to 114 are typically formed in the peripheral edge of the front surface 11 of the spacer assembly 1 to support areas on the rear surface of the front panel 2 where no components are mounted. In this embodiment, reference surfaces 111 to 114 are formed at the four corners of the front surface 11 of the spacer assembly 1, respectively.

[0080] The shape and size of reference surfaces 111 to 114 are not particularly limited, and reference surfaces 111 to 114 are generally formed with different shapes and different sizes. In this embodiment, reference surfaces 111 and 113 are each formed as rectangular islands, reference surface 112 is formed linearly, and reference surface 114 is formed with a shape including curved portions.

[0081] Note that the front surface 11 of the spacer assembly 1 is not limited to being formed by the four reference surfaces 111 to 114 mentioned above, but can be formed by at least three reference surfaces. This allows for stable support of the front panel 2.

[0082] Each of the reference surfaces 111 to 114 is formed by creating a notch of any depth in any region of the front surface 11 of the spacer assembly 1. In this embodiment, two notches 161 and 162 are primarily formed. The regions forming notches 161 and 162 correspond to the thin portions of the spacer assembly 1.

[0083] Notch 161 is formed to be deeper than notch 162. Notch 161 is formed to connect datum surface 111, datum surface 112 and datum surface 114. Notch 162 is formed to connect datum surface 112, datum surface 113 and datum surface 114.

[0084] Spacer assembly 1 includes an assembly receiving portion 130 (first assembly receiving portion) in which the first connector assembly 23 and the second connector assembly 31 (see reference) are received. Figure 2 ).like Figure 3As shown, the component receiving portion 130 is a generally rectangular through-hole passing through the notch 162. The component receiving portion 130 corresponds to... Figure 2 The component housing part 115.

[0085] Furthermore, the spacer assembly 1 includes an assembly receiving portion 133, which can accommodate electronic components other than the first connector assembly 23 and the second connector assembly 31. Figure 3 As shown, the component receiving portion 133 is a generally rectangular through-hole passing through the notch 161.

[0086] Furthermore, the spacer assembly 1 includes a missing portion 136 obtained by removing a portion from the notch 161. The missing portion 136 is disposed between the reference plane 111 and the reference plane 114.

[0087] The notches 161 and 162 and the missing portion 136 serve as escape portions to prevent interference between the spacer assembly 1 and a set of components mounted on the rear surface of the front panel 2.

[0088] (refer to Figure 4 (A)).

[0089] On the other hand, the component housing portion 133 serves as an escape portion to prevent interference between the spacer assembly 1 and the electronic components mounted on the front surface of the rear plate 3 (see reference). Figure 4 (B)

[0090] Multiple engaging protrusions 116 and 117 for controlling the misalignment between the spacer assembly 1 and the front plate 2 are disposed on the front surface 11 of the spacer assembly 1. Engaging protrusion 116 includes a rod portion 116a and a claw portion 116b. The rod portion 116a is disposed at a side edge 126, which is one of the two side edges of the main surface 11 of the spacer assembly 1. The claw portion 116b is disposed at the tip of the rod portion 116a. Engaging protrusion 117 includes a rod portion 117a and a claw portion 117b. The rod portion 117a is disposed at a side edge 127, which is the other of the two side edges of the main surface 11 of the spacer assembly 1. The claw portion 117b is disposed at the tip of the rod portion 117a. The side edges 126 and 127 face each other in the X direction.

[0091] The rods 116a and 116b can be configured to face each other in the X direction, or they can be configured to be offset from each other in the Z direction, such as... Figure 3 As shown.

[0092] Claws 116b and 117b are respectively formed to extend from the respective tips of rods 116a and 116b parallel to the X direction, such that claws 116b and 117b can engage with the front surface of the front plate 2. The configuration of claws 116b and 117b is not particularly limited, and it is sufficient if claws 116b and 117b are arranged such that the spacer assembly 1 can be snap-fitted to the front plate 2.

[0093] The number of juncture protrusions is not limited to two; it can be three or more.

[0094] Recesses 201 and 202 are respectively provided on the facing side edges of the front panel 2 (see reference). Figure 4 (A) and Figure 5 (B) The rod portions 116a and 117a of the engaging protrusions 116 and 117 are inserted into the recesses 201 and 202, respectively. The recesses 201 and 202 have opening widths that are approximately equal in size to the rod diameters of the rod portions 116a and 117a, respectively, and the misalignment of the front plate 2 relative to the spacer assembly 1 in the XZ plane is controlled by inserting the rod portions 116a and 117a into the recesses 201 and 202, respectively.

[0095] Receiving portions 118 and 119 are formed near the rod portion 116a of the engaging protrusion 116, and receiving portions 120 and 121 are formed near the rod portion 117a of the engaging protrusion 117 (see reference). Figure 3 and Figure 4 (B)). The receiving portions 118 to 121 are coplanar with the reference surfaces 111 to 114, and when the engagement protrusions 116 and 117 engage with the front plate 2, the receiving portions 118 to 121 together with the reference surfaces 111 to 114 support the rear surface of the front plate 2.

[0096] Similarly, multiple reference planes (second reference planes) are disposed on the rear surface 14 of the spacer assembly 1. For example... Figure 4 As shown in (A), the plurality of reference planes includes four reference planes 141, 142, 143, and 144. Reference planes 141 to 144 are planar portions that are coplanar with each other and contact the front surface of the rear plate 3 when the spacer assembly 1 and the rear plate 3 are arranged in a stacked configuration (see reference). Figure 5 (C)).

[0097] Note that datum planes 141 to 144 among the multiple datum planes can be in different planes and not coplanar with each other.

[0098] The positions of the reference surfaces 141 to 144 are not particularly limited and can be appropriately set according to the position and size of the components mounted on the front surface of the rear plate 3. Reference surfaces 141 to 144 are typically formed in the peripheral edge of the rear surface 12 of the spacer assembly 1 to support areas on the front surface of the rear plate 3 where no components are mounted. In this embodiment, reference surfaces 141 to 144 are formed at the four corners of the rear surface 14 of the spacer assembly 1, respectively.

[0099] The shape and size of the reference surfaces 141 to 144 are not particularly limited, and in this embodiment, each of the reference surfaces 141 to 144 is formed as a seat surface portion in the form of a circular plate, the seat surface portion extending from the rear surface 14 at a specified height in the Y direction.

[0100] Note that the number of reference planes 141 to 144 is not limited to four, and at least three reference planes are sufficient. This allows for stable support of the rear plate 3.

[0101] By assembling the aforementioned spacer assembly 1 to the front panel 2 and the rear panel 3 (described later), the parallelism of the front panel 2 and the rear panel 3 can be improved and maintained.

[0102] The number of components can be reduced (reducing the number of components and variables in assembly) by reducing the number of components used to control the distance between the front panel 2 and the rear panel 3 to one (spacer component 1). By forming the spacer block between panels 2 and 3 into a single component, the height of the component can be controlled as a whole. This facilitates control over the tilt of panels 2 and 3 relative to each other and allows for a larger component size. This facilitates assembly operations.

[0103] By designing the spacer assembly 1 according to the layout of the front plate 2 and the rear plate 3, the contact area of ​​the portions that receive the front plate 2 and the rear plate 3 is increased. This prevents the plates 2 and 3 from tilting relative to each other. This results in a reduction of the load applied to the connector during B-to-B connection operations. It also reduces damage caused by vibrations generated by the camera module 100 after the connector is installed.

[0104] The addition of each snap-fit ​​protrusion 116 and 117 eliminates the need to use, for example, adhesive or sticky paper to fix the spacer assembly 1 to the front panel 2, making the process easier.

[0105] The rods 116a and 116b of the engaging protrusions 116 and 117, which are respectively assembled into the recesses 201 and 202 of the front plate 2, serve as guides during assembly, which makes it easier to handle when making B-to-B connections between plates 2 and 3 (facilitating assembly operations).

[0106] [Camera Module Manufacturing Method]

[0107] Next, a method (assembly method) for manufacturing a camera module according to embodiments of the present technology will be described. Figures 6 to 8 This is a perspective view showing the various steps and used to describe the method for manufacturing the camera module 100.

[0108] First, such as Figure 6 As shown in (A) and (B), the spacer assembly 1 is assembled to the front plate 2, thereby placing the front plate 2 on the main surface 11 (reference surfaces 111 to 114) of the spacer assembly 1. Here, the rod portions of the engaging protrusions 116 and 117 of the spacer assembly 1 are inserted into the recesses 201 and 202 of the front plate 2 along the Y-axis direction, respectively, to assemble into the recesses 201 and 202 (snap-fit ​​connection). The claw portions 116b and 117b of the engaging protrusions 116 and 117 engage with the surface of the front plate 2, which is opposite to the surface of the front plate 2 facing the spacer assembly 1, thus integrating the spacer assembly 1 and the front plate 2 together. This prevents the front plate 2 from detaching from the spacer assembly 1 even when the spacer assembly 1 is inverted, thereby making it easier to handle (facilitating assembly operations).

[0109] Next, as Figure 7 As shown in (A), the spacer assembly 1 is inverted, and the multilayer body 501 of the spacer assembly 1 and the front plate 2 is assembled to the rear plate 2. Thus, the rear plate 3 is placed on the rear surface 14 (reference planes 141 to 144) of the spacer assembly 1, and the front plate 2 and the rear plate 3 are electrically and mechanically connected to each other through the first connector assembly 23 and the second connector assembly 31.

[0110] Next, as Figure 7 As shown in (B), the multilayer body 502 (plate unit 5) of spacer assembly 1, front plate 2 and rear plate 3 is assembled to lens assembly 7 through shielding housing 8 and dustproof sheet 9 (the resulting body is called multilayer body 503).

[0111] Next, as Figure 8 As shown in (A), the multilayer body 503 is assembled to the rear housing 13 via heat sink 18 and spacer pad 19.

[0112] Then, as Figure 8 As shown in (B), a camera module 100 is manufactured by assembling a composite 504, obtained by combining a multilayer body 503 and a rear housing 13, to the front housing 10 via an O-ring 6. In this embodiment, the rear housing 13 and the front housing 10 are integrated with each other by ultrasonic welding to form a housing in which various components such as the plate unit 5 are integrally housed.

[0113] Inside the housing, the plate unit 5 is sandwiched between the front housing 10 and the rear housing 13 due to the elastic force of the spacer pad 19. Here, the front plate 2 is supported by a plurality of reference surfaces 111 to 114 of the front surface 11 of the spacer assembly 1, and the rear plate 3 is supported by a plurality of reference surfaces 141 to 144 of the rear surface 14 of the spacer assembly 1.

[0114] [Other embodiments of the spacer assembly]

[0115] As an alternative embodiment, the material of the spacer assembly may be partially changed to include additional functions as shown below.

[0116] Figures 9 to 11 This is a schematic cross-sectional side view of a spacer assembly according to another embodiment. Front plate 2 and rear plate 3 are assembled to each spacer assembly. Note that... Figures 9 to 11 The various embodiments can be combined with each other.

[0117] Figure 9 A plate unit 5A including a spacer assembly 1A is shown.

[0118] The spacer assembly 1A includes an assembly body 110 and a cover layer 151. The assembly body 110 includes an assembly receiving portion 134 (a second assembly receiving portion) having a bottom on its rear surface 14. The cover layer 154 covers the assembly receiving portion 134 to form the inner surface of the assembly receiving portion 134.

[0119] The cover layer 151 is made of an insulating material (second insulating material) different from the material of the component body 110 (first insulating material). In this embodiment, the cover layer 151 is made of an electromagnetically absorbing insulating material. Examples of such materials include composite materials such as synthetic resins or elastomers containing electromagnetically absorbing materials (e.g., soft magnetic particles). This prevents electromagnetic waves radiated from the electronic component 32 housed in the component housing portion 134 from leaking out of the component housing portion 134. Therefore, as shown, even if the component housing portion 134 is positioned on the portion facing the imaging device 22 in the thickness direction of the spacer assembly 1A, the impact of electromagnetic noise originating from the electronic component 32 on the imaging device 22 can be reduced.

[0120] The method for forming the cover layer 151 is not particularly limited. In this embodiment, the cover layer 151 is integrally molded with the component body 110 by double molding. In addition, the pre-molded cover layer 151 can be bonded to the inner surface of the component receiving portion 134.

[0121] Figure 10 A plate unit 5B including a spacer assembly 1B is shown.

[0122] The spacer assembly 1B includes an assembly body 110 and an interlayer connection portion 152. The interlayer connection portion 152 extends through the assembly body 110 along its thickness direction and provides an electrical connection between a front plate 2 supported on the front surface 11 of the assembly body 110 and a rear plate 3 supported on the rear surface 14 of the assembly body 110. The interlayer connection portion 152 is formed using a conductive plastic material including metallic materials or metal particles and is integrally molded with the assembly body 110 by, for example, insert molding or double molding. The interlayer connection portion 152 can be configured as part of the wiring of the front plate 2 and the rear plate 3, and, for example, as the ground wire of the board unit 5.

[0123] Figure 11 A plate unit 5C including a spacer assembly 1C is shown.

[0124] The spacer assembly 1C includes an assembly body 110 and a cover layer 153. The assembly body 110 includes an assembly receiving portion 138 (second assembly receiving portion) having a bottom on its rear surface 14. The cover layer 154 covers the assembly receiving portion 138 to form the inner surface of the assembly receiving portion 138.

[0125] The cover layer 153 is made of an insulating material (a second insulating material) that is different from the material of the component body 110 (the first insulating material). In this embodiment, the cover layer 153 is made of an insulating material with higher thermal conductivity than the component body 110. Examples of such materials include composite materials such as synthetic resins or elastomers containing metallic fillers. This results in an electronic component 33 with superior heat dissipation properties, which is housed in the component housing portion 138 and generates relatively large amounts of heat.

[0126] The method of forming the cover layer 153 is not particularly limited. In this embodiment, the cover layer 153 is integrally molded with the component body 110 by double molding. In addition, the pre-molded cover layer 151 can be bonded to the inner surface of the component receiving portion 134.

[0127] <Application Example>

[0128] The technology disclosed herein can be applied to a variety of products. For example, the technology disclosed herein can be provided as a camera module, which is included in one of various types of mobile bodies such as vehicles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, robots, construction machinery, and agricultural machinery (tractors).

[0129] The various configurations of the camera module, front housing, rear housing, packaging, etc., described with reference to the accompanying drawings are merely embodiments and can be modified in any way without departing from the spirit of this technology. In other words, any other configuration for implementing this technology can be used.

[0130] In this disclosure, expressions such as “approximately center,” “central portion,” “middle portion,” “almost identical,” “orthogonal,” “approximately orthogonal,” “rectangle,” “generally rectangular,” and “circle” conceptually include expressions such as “basically center,” “basically middle,” “basically identical,” and “basically approximately middle.” For example, expressions such as “approximately center,” “central portion,” “middle portion,” “almost identical,” “orthogonal,” “approximately orthogonal,” “rectangle,” “generally rectangular,” and “circle” also include states within a specified range (e.g., a range of + / -10%) based on expressions such as “exactly center,” “exactly middle,” “identical,” “completely approximately middle,” “completely orthogonal,” “completely rectangular,” and “completely circular,” respectively.

[0131] Note that this technology can also be configured as follows.

[0132] (1) A camera module, comprising:

[0133] Including the first component mounting plate of the imaging device;

[0134] The second component mounting plate is electrically connected to the first component mounting plate; and

[0135] A spacer assembly disposed between the first component mounting plate and the second component mounting plate.

[0136] The spacer assembly includes an assembly body made of a first insulating material. The assembly body includes a first main surface portion, a second main surface portion, and an assembly receiving portion with or without a bottom. The first main surface portion includes a plurality of first reference surfaces, including at least three first reference surfaces. The second main surface portion includes a plurality of second reference surfaces, including at least three second reference surfaces. The first main surface portion is in contact with a first assembly mounting plate, and the second main surface portion is in contact with a second assembly mounting plate. The assembly receiving portion is disposed in at least one of the first main surface portion or the second main surface portion.

[0137] (2) The camera module according to (1), wherein

[0138] The plurality of first reference surfaces and the plurality of second reference surfaces are respectively disposed at the outer periphery of the first main surface portion and the outer periphery of the second main surface portion.

[0139] (3) The camera module according to (1) or (2), wherein

[0140] The component receiving portion includes a first component receiving portion that serves as a through-hole.

[0141] The first component mounting plate also includes a first connector assembly housed within a component housing portion, and

[0142] The second component mounting plate includes a second connector assembly housed in the component housing portion and connected to the first connector assembly.

[0143] (4) The camera module according to any one of (1) to (3), wherein

[0144] The main body of the component also includes multiple engagement protrusions that control the misalignment between the spacer assembly and the first component mounting plate.

[0145] (5) The camera module according to (4), wherein

[0146] Each of the plurality of engaging protrusions includes

[0147] The rod portion is disposed on one of the corresponding side edges of the two side edges of the first main surface portion, the two side edges facing each other, and

[0148] A claw is disposed at the top of the rod and engages with the surface of the first component mounting plate opposite to the surface of the first component mounting plate facing the spacer assembly.

[0149] (6) The camera module according to (4) or (5), wherein

[0150] The first component mounting plate includes a recess located on one of the two side edges of the first component mounting plate, and the rod is inserted into the recess.

[0151] (7) The camera module according to any one of (1) to (6), wherein

[0152] The component housing also includes a second component housing with a bottom, and

[0153] The spacer assembly also includes a cover layer made of a second insulating material different from the first insulating material, the cover layer forming the inner surface of the second assembly receiving portion.

[0154] (8) The camera module according to (7), wherein

[0155] The second insulating material is a composite material that includes electromagnetic absorbing materials.

[0156] (9) The camera module according to (7) or (8), wherein

[0157] The second component housing is located on the portion of the spacer assembly facing the imaging device in the thickness direction.

[0158] (10) The camera module according to any one of (7) to (9), wherein

[0159] The second insulating material has higher thermal conductivity than the first insulating material.

[0160] (11) The camera module according to any one of (1) to (10), wherein

[0161] The spacer assembly also includes an interlayer connection portion disposed within the assembly body, which provides an electrical connection between the first assembly mounting plate and the second assembly mounting plate.

[0162] (12) The camera module according to any one of (1) to (11) further includes:

[0163] The housing is a multi-layered structure that integrally houses the first component mounting plate, the spacer assembly, and the second component mounting plate.

[0164] (13) A spacer assembly comprising:

[0165] The component body is made of insulating material and includes a first main surface portion having a plurality of first reference surfaces, a second main surface portion having a plurality of second reference surfaces, and a component receiving portion having or not having a bottom. The first main surface portion is in contact with a first component mounting plate, the second main surface portion is in contact with a second component mounting plate, and the component receiving portion is disposed on at least one of the first main surface portion or the second main surface portion.

[0166] (14) A method for manufacturing a camera module, comprising:

[0167] A spacer assembly made of insulating material is provided. The spacer assembly includes a first main surface portion comprising a plurality of first reference surfaces, a second main surface portion comprising a plurality of second reference surfaces, and a component receiving portion without a bottom. The first main surface portion contacts a first component mounting plate including an imaging device, the second main surface portion contacts a second component mounting plate, and the component receiving portion is disposed on at least one of the first main surface portion or the second main surface portion.

[0168] The first component mounting plate is arranged to snap-fit ​​with the spacer component;

[0169] The first component mounting plate is placed on the plurality of first reference surfaces such that the first connector assembly is accommodated in the component accommodating portion and the first connector assembly is mounted on the first component mounting plate.

[0170] Invert the spacer assembly; and

[0171] The second component mounting plate is placed on the plurality of second reference surfaces to connect the second connector assembly to the first connector assembly in the component receiving portion, the second connector assembly being mounted on the second component mounting plate.

[0172] Reference Mark List

[0173] 1. 1A, 1B, 1C spacer assemblies

[0174] 2. Front panel (first component mounting plate)

[0175] 3. Rear Panel (Second Component Mounting Plate)

[0176] 5, 5A, 5B, 5C board units

[0177] 10. Front housing (outer shell)

[0178] 11. Front surface of the spacer assembly (first main surface portion)

[0179] 13. Rear housing (outer shell)

[0180] The rear surface (second main surface portion) of the 14 spacer assembly

[0181] 22 Imaging Devices

[0182] 23 First connector assembly

[0183] 31 Second connector assembly

[0184] 100 camera module

[0185] 110-component main body

[0186] 111 to 114 First Reference Surface

[0187] Component housing section for 115 and 130 (first component housing section)

[0188] 116 and 117 joint protrusions

[0189] Component housing section for 134 and 138 (second component housing section)

[0190] Second reference planes 141 to 144

[0191] 151 and 153 cover layers

[0192] Inter-floor connection section 152

Claims

1. A camera module, comprising: Including the first component mounting plate of the imaging device; A second component mounting plate electrically connected to a first component mounting plate; as well as A spacer assembly disposed between the first component mounting plate and the second component mounting plate. The spacer assembly includes an assembly body made of a first insulating material. The assembly body includes a first main surface portion and a second main surface portion. An assembly receiving portion, with or without a bottom, is formed in the assembly body. The first main surface portion includes a plurality of first reference surfaces that contact the surface of a first assembly mounting plate, the plurality of first reference surfaces including at least three. The second main surface portion includes a plurality of second reference surfaces that contact the surface of a second assembly mounting plate, the plurality of second reference surfaces including at least three. The first main surface portion contacts the first assembly mounting plate, the second main surface portion contacts the second assembly mounting plate, and the assembly receiving portion is disposed in at least one of the first main surface portion or the second main surface portion. The main body of the component is a single layer in the form of a plate, the plurality of first reference surfaces and the plurality of second reference surfaces are planar portions, and the spacer assembly is a single component integrally formed. The component body contains a first component receiving portion that serves as a through-hole. The first component mounting plate also includes a first connector assembly housed within the first component receiving portion, and The second component mounting plate includes a second connector assembly that is housed in the first component housing portion and connected to the first connector assembly. The component body also includes a second component receiving portion with a bottom. The spacer assembly also includes a cover layer made of a second insulating material different from the first insulating material, the cover layer forming the inner surface of the second assembly receiving portion. Each of the plurality of first reference surfaces is formed by creating a notch of any depth in any region of the first main surface portion of the spacer assembly. The notch includes a first notch and a second notch, the first notch being deeper than the second notch. The first notch is formed to connect the plurality of first reference surfaces, and the second notch is formed to connect the plurality of first reference surfaces. A portion of the first reference surfaces to which the first notch is connected differs from the first reference surface to which the second notch is connected. The spacer assembly includes a missing portion obtained by removing a portion from a first notch, the first notch, the second notch, and the missing portion serving as an escape portion.

2. The camera module according to claim 1, wherein The plurality of first reference surfaces and the plurality of second reference surfaces are respectively disposed at the outer periphery of the first main surface portion and the outer periphery of the second main surface portion.

3. The camera module according to claim 1, wherein The main body of the component also includes multiple engagement protrusions that control the misalignment between the spacer assembly and the first component mounting plate.

4. The camera module according to claim 3, wherein Each of the plurality of engaging protrusions includes The rod portion is disposed on one of the corresponding side edges of the two side edges of the first main surface portion, the two side edges facing each other, and A claw is disposed at the top of the rod and engages with the surface of the first component mounting plate opposite to the surface of the first component mounting plate facing the spacer assembly.

5. The camera module according to claim 4, wherein The first component mounting plate includes a recess located on one of the two side edges of the first component mounting plate, and the rod is inserted into the recess.

6. The camera module according to claim 1, wherein The second insulating material is a composite material that includes electromagnetic absorbing materials.

7. The camera module according to claim 6, wherein The second component housing is located on the portion of the spacer assembly facing the imaging device in the thickness direction.

8. The camera module according to claim 1, wherein The second insulating material has higher thermal conductivity than the first insulating material.

9. The camera module according to claim 1, wherein The spacer assembly also includes an interlayer connection portion disposed within the assembly body, which provides an electrical connection between the first assembly mounting plate and the second assembly mounting plate.

10. The camera module according to claim 1, further comprising: The housing is a multi-layered structure that integrally houses the first component mounting plate, the spacer assembly, and the second component mounting plate.

11. A spacer assembly, comprising: A component body made of a first insulating material includes a first main surface portion comprising a plurality of first reference surfaces in contact with a surface of a first component mounting plate, and a second main surface portion comprising a plurality of second reference surfaces in contact with a surface of a second component mounting plate. A component receiving portion, having or not having a bottom, is formed in the component body. The first main surface portion contacts the first component mounting plate, the second main surface portion contacts the second component mounting plate, and the component receiving portion is disposed on at least one of the first main surface portion or the second main surface portion. The main body of the component is a single layer in the form of a plate, the plurality of first reference surfaces and the plurality of second reference surfaces are planar portions, and the spacer assembly is a single component integrally formed. The component body contains a first component receiving portion that serves as a through-hole. The first component mounting plate also includes a first connector assembly housed within the first component receiving portion, and The second component mounting plate includes a second connector assembly that is housed in the first component housing portion and connected to the first connector assembly. The component body also includes a second component receiving portion with a bottom. The spacer assembly also includes a cover layer made of a second insulating material different from the first insulating material, the cover layer forming the inner surface of the second assembly receiving portion. Each of the plurality of first reference surfaces is formed by creating a notch of any depth in any region of the first main surface portion of the spacer assembly. The notch includes a first notch and a second notch, the first notch being deeper than the second notch. The first notch is formed to connect the plurality of first reference surfaces, and the second notch is formed to connect the plurality of first reference surfaces. A portion of the first reference surfaces to which the first notch is connected differs from the first reference surface to which the second notch is connected. The spacer assembly includes a missing portion obtained by removing a portion from a first notch, the first notch, the second notch, and the missing portion serving as an escape portion.

12. A method for manufacturing a camera module, comprising: A component body is provided for a spacer assembly made of a first insulating material. The spacer assembly includes a first main surface portion containing a plurality of first reference surfaces in contact with a surface of a first component mounting plate and a second main surface portion containing a plurality of second reference surfaces in contact with a surface of a second component mounting plate. A component receiving portion having or not having a bottom is formed in the spacer assembly. The first main surface portion is in contact with a first component mounting plate including an imaging device, and the second main surface portion is in contact with a second component mounting plate. The component receiving portion is disposed in at least one of the first main surface portion or the second main surface portion. The first component mounting plate is arranged to snap-fit ​​with the spacer component; The first component mounting plate is placed on the plurality of first reference surfaces such that the first connector assembly is accommodated in the component accommodating portion and the first connector assembly is mounted on the first component mounting plate. Invert the spacer assembly; as well as A second component mounting plate is placed on the plurality of second reference surfaces to connect the second connector assembly to the first connector assembly in the component receiving portion, the second connector assembly being mounted on the second component mounting plate. The spacer assembly is a single layer in the form of a plate, and the plurality of first reference surfaces and the plurality of second reference surfaces are planar portions. The spacer assembly is a single component integrally formed. The spacer assembly includes a first assembly receiving portion that serves as a through hole. The first component mounting plate also includes a first connector assembly housed within the first component receiving portion, and The second component mounting plate includes a second connector assembly that is housed in the first component housing portion and connected to the first connector assembly. The spacer assembly also includes a second component receiving portion having a bottom, and The spacer assembly also includes a cover layer made of a second insulating material different from the first insulating material, the cover layer forming the inner surface of the second assembly receiving portion. Each of the plurality of first reference surfaces is formed by creating a notch of any depth in any region of the first main surface portion of the spacer assembly. The notch includes a first notch and a second notch, the first notch being deeper than the second notch. The first notch is formed to connect the plurality of first reference surfaces, and the second notch is formed to connect the plurality of first reference surfaces. A portion of the first reference surfaces to which the first notch is connected differs from the first reference surface to which the second notch is connected. The spacer assembly includes a missing portion obtained by removing a portion from a first notch, the first notch, the second notch, and the missing portion serving as an escape portion.

Images