Display module and method for manufacturing the same

Abstract

The embodiments of the present application provide a display module and a method for manufacturing the same, relating to the field of display technology. In this embodiment, a layer of encapsulation material is provided on at least part of the side surfaces of the display module. The layer of encapsulation material extends from the edge of the surface of the encapsulation cover plate away from the display substrate, through the side surfaces of the encapsulation cover plate and the side surfaces of the display substrate, to the edge of the surface of the display substrate away from the encapsulation cover plate, so as to encapsulate the side surfaces of the display substrate, the side surfaces of the encapsulation cover plate, and the partial areas of the surfaces of the encapsulation cover plate and the display substrate facing away from each other. The solution provided by the embodiments of the present application can improve the sealing performance and structural strength of the film layer in the peripheral encapsulation area of ​​the display module, prevent water vapor from invading the display module and causing poor display, and improve the yield rate of the display module in drop testing when applied to terminal equipment.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more particularly, to a display module and a method for manufacturing the display module. Background Art

[0002] OLED display modules are increasingly favored by end-users due to their advantages, including requiring no backlight, high contrast, thinness, wide viewing angle, and fast response time. However, OLED display modules face technical challenges, such as the lateral regions being susceptible to cracking during drop tests and being susceptible to moisture intrusion, which can affect display quality. Therefore, improving the structural strength and moisture resistance of the lateral regions of OLED display modules is a pressing technical issue facing those skilled in the art. Summary of the Invention

[0003] In order to overcome the technical problems mentioned in the above technical background, embodiments of the present application provide a display module and a method for manufacturing the display module.

[0004] In a first aspect of the present application, a display module is provided, comprising a display substrate and a packaging cover plate disposed opposite to the display substrate;

[0005] A packaging material layer is provided on at least part of the side surfaces of the display module. The packaging material layer extends from the edge of the surface of the packaging cover plate away from the display substrate, through the side surfaces of the packaging cover plate and the side surfaces of the display substrate, to the edge of the surface of the display substrate away from the packaging cover plate, so as to wrap and encapsulate the side surfaces of the display substrate, the side surfaces of the packaging cover plate, and part of the surfaces of the packaging cover plate and the display substrate facing away from each other.

[0006] In the above structure, the packaging material layer wraps the side of the packaging display substrate, the side of the packaging cover plate, and part of the surface of the display substrate and the packaging substrate facing away from each other, so that the packaging material layer is equivalent to a clip, clamping the edges of the display substrate and the packaging substrate. It can simultaneously improve the sealing performance and structural strength of the film layer in the packaging area around the display module, prevent water vapor from invading the display module and causing poor display, and improve the yield of the display module in the drop test after it is applied to the terminal device.

[0007] In a possible embodiment of the present application, the packaging material layer includes a first portion, a second portion, a third portion, and a fourth portion;

[0008] The first portion is located at an edge of the surface of the packaging cover away from the display substrate, the second portion is located at an edge of the surface of the display substrate away from the packaging cover, and the third portion is located between the display substrate and the packaging cover;

[0009] The fourth portion contacts the side surface of the package cover plate and the side surface of the display substrate; the fourth portion connects the first portion, the second portion and the third portion;

[0010] Preferably, the orthographic projection of the third portion on the display substrate is located within the orthographic projection of the first portion on the display substrate, and the orthographic projection of the third portion on the display substrate is located within the orthographic projection of the second portion on the display substrate;

[0011] Preferably, the packaging material layer includes a laser-curable packaging material.

[0012] In a possible embodiment of the present application, at least one side surface of the display substrate is flush with a side surface of the package cover plate;

[0013] The packaging material layer is used to wrap the flush side surfaces of the display substrate and the packaging cover in the packaged display module;

[0014] Preferably, three side surfaces of the display substrate and the package cover plate are flush, and the remaining side of the display substrate protrudes relative to the package cover plate.

[0015] In one possible embodiment of the present application, a display substrate includes a substrate and a circuit layer located on a side of the substrate close to a packaging cover plate, wherein the circuit layer is spaced apart from the packaging material layer; at least a portion of an orthographic projection of the circuit layer on the substrate overlaps with an orthographic projection of the first portion on the substrate; and at least a portion of an orthographic projection of the circuit layer on the substrate overlaps with an orthographic projection of the second portion on the substrate.

[0016] The material of the encapsulation material layer includes a light shielding material.

[0017] In a possible embodiment of the present application, the display module includes a display area and a non-display area surrounding the display area, and the orthographic projection of the packaging material layer on the display substrate is located in the non-display area; the orthographic projection of the packaging material layer on the display substrate is spaced apart from the display area.

[0018] A second aspect of the present application provides a method for manufacturing a display module, the method comprising:

[0019] providing a display substrate;

[0020] Providing a packaging cover;

[0021] The display substrate and the package cover are arranged relative to each other;

[0022] A packaging material layer is formed on the display substrate and the packaging cover plate so that at least part of the side surface of the display module is provided with the packaging material layer. The packaging material layer extends from the edge of the surface of the packaging cover plate away from the display substrate, through the side surface of the packaging cover plate and the side surface of the display substrate, to the edge of the surface of the display substrate away from the packaging cover plate.

[0023] In a possible embodiment of the present application, forming an encapsulation material layer on the display substrate and the encapsulation cover plate includes:

[0024] A carrier is provided, wherein the carrier includes a first carrying surface, a second carrying surface, and a third carrying surface connecting the first carrying surface and the second carrying surface, and the first carrying surface is parallel to the second carrying surface;

[0025] Applying packaging material on the first carrying surface, the second carrying surface, and the third carrying surface of the carrier;

[0026] Place the edges of the display substrate and the packaging cover plate that are arranged opposite to each other into the accommodation space surrounded by the first carrying surface, the second carrying surface, and the third carrying surface, so that the packaging material layer on the first carrying surface is laminated to the edge of the surface of the packaging cover plate away from the display substrate, the packaging material layer on the second carrying surface is laminated to the edge of the surface of the display substrate away from the packaging cover plate, and the packaging material layer on the third carrying surface is laminated to the side surface of the display substrate and the side surface of the packaging cover plate;

[0027] The carrier is separated from the packaging material layer to remove the carrier.

[0028] In a possible embodiment of the present application, coating the packaging material on the first carrying surface, the second carrying surface, and the third carrying surface of the carrier to form the packaging material layer includes:

[0029] forming an adhesive layer on the first carrying surface, the second carrying surface, and the third carrying surface of the carrier;

[0030] forming a packaging material layer on the adhesive layer;

[0031] Accordingly, separating the carrier from the packaging material layer to remove the carrier includes:

[0032] reducing the viscosity of the adhesive layer to separate the carrier from the packaging material layer to remove the carrier;

[0033] Preferably, the material of the adhesive layer includes ultraviolet light-reducing adhesive, and the carrier is light-transmissive;

[0034] In a possible embodiment of the present application, after removing the carrier, the method further includes:

[0035] Remove the glue layer on the packaging material layer.

[0036] In a possible embodiment of the present application, the material of the encapsulation material layer includes a laser-curable encapsulation material; after forming the encapsulation material layer on the display substrate and the encapsulation cover plate, the method further includes:

[0037] The packaging material layer is irradiated with laser.

[0038] According to a third aspect of the present application, a terminal device is provided, which includes a display module manufactured using the method for manufacturing the display module according to the second aspect.

[0039] Compared with the prior art, the embodiments of the present application provide a display module and a method for manufacturing a display module, wherein a packaging material layer is provided on at least part of the side surfaces of the display module, and the packaging material layer is used to wrap the side surfaces of the packaging display substrate, the side surfaces of the packaging cover plate, and part of the surface areas of the display substrate and the packaging substrate facing away from each other, so that the packaging material layer is equivalent to a clip, clamping and fixing the edges of the display substrate and the packaging substrate, which can simultaneously improve the sealing performance and structural strength of the film layer in the packaging area around the display module, prevent water vapor from invading the display module and causing poor display of the display module, and improve the yield of the display module when it is applied to the terminal device for drop test. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 A schematic diagram of a partial membrane structure of a display module in the prior art;

[0042] Figure 2 A schematic diagram of a partial film structure of a display module provided in an embodiment of the present application;

[0043] Figure 3 A top view of a display module provided in an embodiment of the present application;

[0044] Figure 4 A schematic flow chart of a method for manufacturing a display module provided in an embodiment of the present application;

[0045] Figure 5 A process diagram corresponding to the manufacturing method of the display module provided in an embodiment of the present application;

[0046] Figure 6 for Figure 4 Schematic diagram of the sub-step flow chart of step S14.

[0047] Icons: 10-display module; 110-display substrate; 1101-substrate; 1102-array drive layer; 1103-pixel device layer; 1104-circuit layer; 120-packaging cover; 130-packaging material layer; 1301-first part; 1302-second part; 1303-third part; 1304-fourth part; 20-carrier; 201-first carrying surface; 202-second carrying surface; 203-third carrying surface; 210-glue layer; 220-packaging material layer. DETAILED DESCRIPTION

[0048] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0049] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0050] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0051] In the description of this application, it should be noted that the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" and the like are used solely for distinction and should not be construed as indicating or implying relative importance.

[0052] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.

[0053] In response to the technical problems mentioned in the background technology, the inventors disassembled and analyzed a large number of display modules with the above defects to find the relevant causes. Figure 1 , Figure 1The schematic diagram of a partial film layer structure of an existing display module is shown, in which the display module 10 includes a display substrate 110, an encapsulation cover plate 120, and an encapsulation material layer 130. The display substrate 110 includes a substrate 1101, an array drive layer 1102, a pixel device layer 1103, and a circuit layer 1104. The array drive layer 1102 and the circuit layer 1104 are located on the substrate 1101, the pixel device layer 1103 is located on the side of the array drive layer 1102 away from the substrate 1101, and the circuit layer 1104 is located around the array drive layer 1102. The encapsulation cover plate 120 is located on the display substrate 110, and the encapsulation material layer 130 is located between the display substrate 110 and the encapsulation cover plate 120. For example, the encapsulation material layer 130 can be located outside the display area (display area C in the figure) of the display module 10 to prevent ambient moisture from entering the display area through the gap between the display substrate 110 and the encapsulation cover plate 120, thereby affecting the normal display of the display module 10. The packaging material layer 130 is generally formed by a Frit (glass glue) packaging method. For example, the process of the Frit packaging method can be as follows: first, glass glue is applied on the packaging cover plate 120; then, the display substrate 110 is placed on the packaging cover plate 120; finally, the glass glue between the packaging cover plate 120 and the display substrate 110 is sintered to obtain the packaging material layer 130. After disassembly and analysis, the inventor found that the packaging cover plate 120 and the display substrate 110 are generally made of glass. When the glass glue is sintered by laser, the sintering temperature can reach 300°C to 400°C, which will cause the packaging cover plate 120 and the display substrate 110 located in the glass glue position area (packaging area B in the figure) to be damaged by high temperature. As a result, cracks are easily formed on the packaging cover plate 120 and the display substrate 110 in the packaging area B after sintering, increasing the risk of environmental moisture entering the interior of the display module 10. In addition, to prevent the circuit layer 1104 from being affected by the melted glass glue, a transition area (area A in the figure) is set between the packaging area B and the display area C. Since the packaging cover plate 120 and the display substrate 110 in the packaging area B are supported by the packaging material layer 130, the packaging cover plate 120 and the display substrate 110 in the display area C can be supported by the support columns (SPC) of the display area C, while there is no supporting structure between the packaging cover plate 120 and the display substrate 110 in the transition area A. At the same time, the packaging cover plate 120 and the display substrate 110 in the transition area A will be affected by high temperature and change their structural characteristics, causing stress concentration on the packaging cover plate 120 and the display substrate 110 in this area. It can be seen that the film layer structure strength in the transition area A is weaker than that in the packaging area B and the display area C, which will cause the display module to easily form cracks in the transition area A during a drop test after being used on a terminal device.

[0054] To address the aforementioned technical issues, the embodiments of the present application innovatively wrap the side surfaces of the encapsulated display substrate, the side surfaces of the encapsulated cover plate, and portions of the surfaces of the display substrate and the encapsulated substrate facing away from each other. The encapsulation material layer acts as a clamp, clamping the edges of the display substrate and the encapsulated substrate to improve the structural strength of the display module 10 in the peripheral area. Furthermore, the display module 10 can be made more resistant to water vapor intrusion, ensuring that the display module 10 can display normally. The specific implementation scheme of the present application will be described in detail below with reference to the accompanying drawings.

[0055] To better describe the technical solutions provided by the embodiments of this application, please refer to Figure 2 , Figure 2 A schematic diagram of a partial film layer structure of a display module provided in an embodiment of the present application is shown.

[0056] In this embodiment, the display module 10 may include a display substrate 110 and a packaging cover plate 120. The display substrate 110 includes a substrate 1101, an array drive layer 1102, a pixel device layer 1103, and a circuit layer 1104. The array drive layer 1102 and the circuit layer 1104 are located on the substrate 1101. The pixel device layer 1103 is located on the side of the array drive layer 1102 away from the substrate 1101. The circuit layer 1104 is located around the array drive layer 1102. For example, the substrate 1101 may be a rigid substrate, such as a glass substrate. The packaging cover plate 120 is disposed above the display substrate 110. For example, the packaging cover plate 120 is located on the light-emitting surface of the display substrate 110. The packaging cover plate 120 may be a rigid cover plate, such as a glass cover plate. The display substrate 110 may be a rigid display substrate. The display module 10 may have a rectangular, polygonal, circular, or elliptical shape.

[0057] In this embodiment, a packaging material layer 130 is provided on at least part of the side surface of the display module 10. The packaging material layer 130 is used to wrap and encapsulate the display substrate 110 and the packaging cover plate 120 located on at least one side surface of the display module 10 (for example, the left side and / or the right side in the figure). Exemplarily, the packaging material layer 130 can extend from the edge of the surface of the packaging cover plate 120 away from the display substrate 110, through the side surface of the packaging cover plate 120 and the side surface of the display substrate 110, to the edge of the surface of the display substrate 110 away from the packaging cover plate 120, so as to wrap and encapsulate the side surface of the display substrate 110, the side surface of the packaging cover plate 120, and the partial area of ​​the surface opposite to each other of the packaging cover plate 120 and the display substrate 110. During the sintering process to form the packaging material layer 130, even if cracks are generated in the display substrate 110 and the packaging cover plate 120 at the wrapping position due to high temperature, the cracks can be filled by the sintered and melted packaging material layer 130, thereby ensuring that the display module 10 has good sealing performance. In addition, the packaging material layer 130 can increase the film thickness of the packaging area, and the packaging structure formed by the packaging material layer 130 can fix the display substrate 110 and the packaging cover plate 120 to improve the film structure strength at the packaging position.

[0058] In the above structure, the encapsulation material layer 130 extends from the edge of the surface of the encapsulation cover plate 120 away from the display substrate 110, through the side surfaces of the encapsulation cover plate 120 and the side surfaces of the display substrate 110, to the edge of the surface of the display substrate 110 facing away from the encapsulation cover plate 120, so as to wrap and encapsulate the side surfaces of the display substrate 110, the side surfaces of the encapsulation cover plate 120, and the partial areas of the surfaces of the encapsulation cover plate 120 and the display substrate 110 facing away from each other. Compared with the prior art solution of providing the encapsulation material layer 130 between the display substrate 110 and the encapsulation cover plate 120 for encapsulation, the solution provided in the embodiment of the present application can wrap and encapsulate the side surfaces of the display substrate 110, the side surfaces of the encapsulation cover plate 120, and the partial areas of the surfaces of the display substrate and the encapsulation substrate facing away from each other, so that the encapsulation material layer acts as a clip, clamping and fixing the edges of the display substrate and the encapsulation substrate, thereby improving the sealing performance and structural strength of the film layer in the encapsulation area around the display module 10, preventing water vapor from intruding into the display module 10 and causing display defects, and improving the yield of the display module 10 in a drop test when applied to a terminal device.

[0059] Please refer again Figure 2In one possible implementation of the embodiment of the present application, the encapsulation material layer 130 may include a first portion 1301, a second portion 1302, and a fourth portion 1304, wherein the first portion 1301 is located at the edge of the surface of the encapsulation cover plate 120 away from the display substrate 110, and the second portion 1302 is located at the edge of the surface of the display substrate 110 away from the encapsulation cover plate 120. The fourth portion 1304 contacts the side surface of the encapsulation cover plate 120 and the side surface of the display substrate 110, respectively, and the fourth portion 1304 connects the first portion 1301 and the second portion 1302. It will be understood that the above division of the encapsulation material layer 130 into the first portion 1301, the second portion 1302, and the fourth portion 1304 is merely for the purpose of clearly describing the structure of the encapsulation material layer 130. In actual production, the first portion 1301, the second portion 1302, and the fourth portion 1304 may be an integrally formed structure.

[0060] Optionally, the encapsulation material layer 130 may further include a third portion 1303, the third portion 1303 being located between the display substrate 110 and the encapsulation cover plate 120, and a fourth portion 1304 contacting the side surfaces of the encapsulation cover plate 120 and the display substrate 110, respectively. The fourth portion 1304 connects the first portion 1301, the second portion 1302, and the third portion 1303. It will be understood that the above division of the encapsulation material layer 130 into the first portion 1301, the second portion 1302, the third portion 1303, and the fourth portion 1304 is merely for the purpose of clearly describing the structure of the encapsulation material layer 130. In actual production, the first portion 1301, the second portion 1302, the third portion 1303, and the fourth portion 1304 may be an integrally formed structure.

[0061] Furthermore, in this embodiment, the orthographic projection of the third portion 1303 on the display substrate 110 lies within the orthographic projection of the first portion 1301 on the display substrate 110, i.e., the orthographic projection area of ​​the third portion 1303 on the display substrate 110 is smaller than the orthographic projection area of ​​the first portion 1301 on the display substrate 110. Furthermore, the orthographic projection of the third portion 1303 on the display substrate 110 lies within the orthographic projection of the second portion 1302 on the display substrate 110, i.e., the orthographic projection area of ​​the third portion 1303 on the display substrate 110 is smaller than the orthographic projection area of ​​the second portion 1302 on the display substrate 110. Optionally, the encapsulation material layer 130 comprises a laser-curable encapsulation material. Due to the siphon effect and / or laser irradiation of the encapsulation material used to form the fourth portion 1304, a portion of the encapsulation material used to form the fourth portion 1304 enters the gap between the display substrate and the encapsulation substrate, forming the third portion 1303. Therefore, the size of the third portion 1303 in the direction from the non-display area to the display area is very small, significantly impacting the narrow bezel.

[0062] Furthermore, the display substrate 110 may include a substrate 1101 and a circuit layer 1104 located on a side of the substrate 1101 proximal to the encapsulation cover plate 120. The circuit layer 1104 and the encapsulation material layer 130 are spaced apart to prevent the melted encapsulation material layer 130 from damaging the circuit layer 1104. Optionally, at least a portion of the orthographic projection of the circuit layer 1104 on the substrate 1101 overlaps with the orthographic projection of the first portion 1301 on the substrate 1101. Optionally, at least a portion of the orthographic projection of the circuit layer 1104 on the substrate 1101 overlaps with the orthographic projection of the second portion 1302 on the substrate 1101. Optionally, the material of the encapsulation material layer 130 may include a light-shielding material. It is understood that the light-shielding material may be a laser-curable material. In the above design, the first portion 1301 and the second portion 1302 are respectively arranged on the surface of the packaging substrate 120 and the display substrate 110 away from the circuit layer 1104. When the packaging material layer 130 is cured by laser, the packaging material layer 130 is not light-transmissive and the laser has good directionality, so the circuit layer 1104 will not be damaged. Figure 2 As shown, the circuit layer 1104 can be moved to the peripheral side of the display substrate 110, so as to increase the area of ​​the display area (area C in the figure) and reduce the width of the frame. Figure 1 As shown in the solution, the solution provided in the embodiment of the present application can narrow the frame by about 0.4 mm, which can further increase the screen-to-body ratio of the display module 10.

[0063] Furthermore, at least one side surface of the display substrate 110 is flush with the side surface of the encapsulation cover plate 120, wherein the side surfaces being flush may mean that the two side surfaces are coplanar or parallel to each other, and when the two side surfaces are parallel to each other, the distance between the two side surfaces is within a preset range (for example, the distance is less than 0.1 mm). In this embodiment, the encapsulation material layer 130 is used to encapsulate the side surfaces of the display substrate 110 and the encapsulation cover plate 120 in the display module 10. As an example, please refer to Figure 3 , Figure 3 A top view of a display module 10 is shown. In this example, the display module 10 may be rectangular, and the display substrate 110 and the package cover 120 may be rectangular. The display substrate 110 and the package cover 120 have three flush sides ( Figure 3 The remaining side of the display substrate 110 ( Figure 3The lower side of the display module 10) extends relative to the packaging cover plate 120, wherein the area (including the bonding area) of the display substrate 110 extending relative to the packaging cover plate 120 can be used for layout routing and bonding the display driver chip and / or the flexible circuit board. In the structure of the display module 10, the packaging material layer 130 provided in the embodiment of the present application can be used for packaging on the upper side, left side and right side of the display module 10, and the packaging material layer on the lower side of the display module 10 is located between the display substrate 110 and the packaging cover plate 120.

[0064] Optionally, the display module includes a display area C and a non-display area surrounding the display area. The display substrate 110 may further include an array drive layer 1102 and a pixel device layer 1103, wherein the array drive layer 1102 is located between the substrate 1101 and the pixel device layer 1103. The pixel device layer 1103 may be located in the display area. The display substrate 110 may further include a support column (SPC). The support column (SPC) may be located in the display area. The display substrate 110 may further include a pixel defining layer. The pixel defining layer may be provided with a plurality of pixel openings. The pixel device layer 1103 may include a light-emitting material layer. The light-emitting material layer may be located within the pixel opening. The support column may be located on the side of the pixel defining layer away from the substrate. The orthographic projection of the circuit layer 1104 on the substrate 1101 does not overlap with the orthographic projection of the support column (SPC) on the substrate 1101. There is a hollow area between the circuit layer 1104 and the packaging cover 120, and there is a hollow area between the circuit layer 1104 and the packaging material layer 130. The clip-shaped packaging material layer 130 can improve the structural strength and improve the yield of the display module when it is applied to the terminal device for drop test, and reduce the probability of the display module being unsupported in the hollow area during the drop test, which is prone to stress concentration and leads to cracking.

[0065] Furthermore, in the embodiment of the present application, in order to prevent the encapsulation material layer 130 from blocking the display area and affecting the display effect, the orthographic projection of the encapsulation material layer 130 on the display substrate 110 is located in the non-display area, and the orthographic projection of the encapsulation material layer 130 on the display substrate 110 is spaced apart from the display area C. By setting a safety distance between the first portion 1301 and the display area C, and setting a safety distance between the second portion 1302 and the display area C, the molten encapsulation material layer 130 is prevented from flowing into the display area C, blocking the display area, and affecting the display. In addition, considering the accuracy of pad printing, a safety distance is also required. Among them, the non-display area surrounds the peripheral side of the display area C.

[0066] The present application also provides a method for manufacturing a display module. Figure 4 and Figure 5 , Figure 4 A schematic diagram showing a process of manufacturing a display module is shown. Figure 5The manufacturing method of the display module provided in this application can be used to manufacture the display module provided in the above embodiment. Figure 4 and Figure 5 A detailed introduction to the manufacturing method of the display module is given.

[0067] Step S11 : providing a display substrate 110 .

[0068] The display substrate 110 may include a substrate 1101 , an array driving layer 1102 and a pixel device layer 1103 . The array driving layer 1102 and the pixel device layer 1103 are sequentially fabricated on the substrate 1101 . For example, the substrate 1101 may be a glass substrate.

[0069] Step S12: providing a packaging cover plate 120 .

[0070] The packaging cover plate 120 may be a glass cover plate.

[0071] In step S13 , the display substrate 110 and the package cover 120 are disposed opposite to each other.

[0072] Specifically, the packaging cover plate 120 is disposed opposite to the light-emitting side of the display substrate 110 .

[0073] In step S14, a packaging material layer 130 is formed on the display substrate 110 and the packaging cover plate 120, so that at least part of the side surface of the display module is provided with the packaging material layer 130. The packaging material layer 130 extends from the edge of the surface of the packaging cover plate 120 away from the display substrate 110, through the side surface of the packaging cover plate 120 and the side surface of the display substrate 110, to the edge of the surface of the display substrate 110 away from the packaging cover plate 120.

[0074] The packaging material may be a material that has the ability to isolate water and oxygen and has a certain degree of rigidity, and the rigidity can improve the strength of the side.

[0075] Please refer to Figure 6 In this embodiment, step S14 can be implemented through the following sub-steps.

[0076] Sub-step S141, providing a carrier 20, which includes a first bearing surface 201, a second bearing surface 202 and a third bearing surface 203 connecting the first bearing surface 201 and the second bearing surface 202 located on its inner side, wherein the first bearing surface 201 and the second bearing surface 202 can be parallel. The first bearing surface 201 and the second bearing surface 202 can be arranged relative to each other. Exemplarily, the first bearing surface 201 and the second bearing surface 202 are parallel to each other, and the third bearing surface 203 is vertically connected to the first bearing surface 201 and the second bearing surface 202, respectively. Through pad printing technology, the packaging material is directly fixed to the edge of the panel, and the side edge is wrapped as a whole. Pad printing technology can well ensure the thickness and packaging shape of the packaging layer and ensure the consistency of the packaging.

[0077] In sub-step S142 , packaging material is coated on the first carrying surface 201 , the second carrying surface 202 , and the third carrying surface 203 of the carrier.

[0078] Optionally, sub-step S142 may be implemented in the following manner: the packaging material on the first carrying surface 201 corresponds to the first portion 1301 , the packaging material on the second carrying surface 202 corresponds to the second portion 1302 , and the packaging material on the third carrying surface 203 corresponds to the fourth portion 1304 .

[0079] First, the adhesive layer 210 is formed on the first carrying surface 201 , the second carrying surface 202 and the third carrying surface 203 of the carrier 20 .

[0080] Then, a packaging material layer 130 is formed on the glue layer 210 .

[0081] As an example, the packaging material layer 130 may be manufactured by spraying glass frit slurry on the viscosity-reducing adhesive layer 210 .

[0082] The glass powder slurry can be formed by adding glass powder to a binder (eg, ethyl cellulose or acrylate) and a solvent (eg, alcohols or lipids).

[0083] In sub-step S143, the edges of the relatively arranged display substrate 110 and the packaging cover plate 120 are placed into the accommodating space surrounded by the first carrying surface 201, the second carrying surface 202 and the third carrying surface 203, so that the packaging material layer on the first carrying surface 201 is adhered to the edge of the surface of the packaging cover plate 120 away from the display substrate 110, the packaging material layer on the second carrying surface 202 is adhered to the edge of the surface of the display substrate 110 away from the packaging cover plate 120, and the packaging material layer on the third carrying surface 203 is adhered to the side surface of the display substrate 110 and the side surface of the packaging cover plate 120.

[0084] In this embodiment, sub-step S113 can be implemented in the following manner.

[0085] First, a retractable clamping fixture (not shown) is used to clamp the relatively arranged display substrate 110 and packaging cover plate 120 or carrier 20. The edges of the relatively arranged display substrate 110 and packaging cover plate 120 are placed into the accommodation space surrounded by the first supporting surface 201, the second supporting surface 202, and the third supporting surface 203 by the retractable clamping fixture. Due to the siphon effect, the packaging material layer 220 can be partially sucked into the space between the display substrate 110 and the packaging cover plate 120, forming a third portion 1303, and forming a packaging material layer 220 with a narrow width (the dimension in the direction from the non-display area to the display area) between the display substrate 110 and the packaging cover plate 120. Due to the siphon effect, the packaging material will enter the gap between the two layers of glass structure, reducing the path for water and oxygen to enter.

[0086] Then, remove the retractable clamping fixture.

[0087] In sub-step S144 , the carrier 20 is separated from the packaging material layer 130 to remove the carrier 20 .

[0088] In the embodiment of the present application, the viscosity of the adhesive layer 210 can be reduced, and the carrier 20 can be separated from the packaging material layer to remove the carrier 20. The adhesive layer 210 can reduce its viscosity and solidify under the action of special light. As an example, the material of the adhesive layer 210 can include ultraviolet light-reducing glue. The curing principle of the ultraviolet light-reducing glue is that the photoinitiator (or photosensitizer) in the ultraviolet light-reducing glue absorbs ultraviolet light under ultraviolet light irradiation and generates active free radicals or cations, which trigger monomer polymerization, cross-linking and branching chemical reactions, causing the ultraviolet light-reducing glue to transform from liquid to solid within seconds.

[0089] The material of the adhesive layer 210 includes ultraviolet light-reducing adhesive, and the carrier 20 may be light-transmissive. Exemplarily, sub-step S114 may be implemented in the following manner.

[0090] First, a specific light is used to irradiate the area where the viscosity-reducing adhesive layer 210 is located to solidify the viscosity-reducing adhesive layer 210 and reduce the viscosity between the viscosity-reducing adhesive layer 210 and the carrier 20 , so as to facilitate separation of the viscosity-reducing adhesive layer 210 from the carrier 20 .

[0091] Then, the carrier 20 is removed, and the cured viscosity-reducing adhesive layer 210 is removed.

[0092] In an embodiment of the present application, the packaging material is coated on the carrier 20 through the above-mentioned sub-steps, and then the packaging pattern formed by the packaging material is accurately transferred to the display module through the carrier 20. Compared with the method of directly coating on the display module, the shape and size of the packaging pattern can be precisely controlled, so that the packaging width around the display module is uniform, thereby improving the overall appearance of the display module after packaging.

[0093] Please refer again Figure 4After step S14, the method for manufacturing a display module provided in the embodiment of the present application may further include step S15.

[0094] Step S15: irradiating the packaging material layer with laser.

[0095] Optionally, the material of the packaging material layer includes a laser-curable packaging material. The area where the packaging material layer 220 is located is irradiated with a laser, and the packaging material layer 220 is sintered to form a packaging material layer 130 in the packaging area of ​​the display module, which wraps the side of the display substrate 110, the side of the packaging cover plate 120, and the partial area of ​​the surface of the display substrate and the packaging substrate facing away from each other. When the packaging material layer is irradiated with a laser, the packaging material layer 220 will melt and partially flow into between the display substrate 110 and the packaging cover plate 120 to form a third part 1303, or further cause the width of the third part 1303 in the direction from the non-display area to the display area to increase. The size of the third part 1303 in the direction from the non-display area to the display area is smaller, so the border width of the display module can be reduced.

[0096] The embodiment of the present application does not limit the execution order of the steps in the method for manufacturing a display module, and can be adjusted as needed. It is understood that the order of some steps in the method for manufacturing a display module in the embodiment of the present application can be interchanged according to actual needs. For example, the order of steps S11 to S13 and step S14 can be interchanged or performed simultaneously. Step S11 can be performed before, after, or simultaneously with step S12.

[0097] An embodiment of the present application also provides a terminal device, which may include a display module 10 manufactured by the display module manufacturing method described above. The display module 10 can provide the terminal device with a stable display effect and strong anti-drop performance, so as to improve the user experience during use and increase the market competitiveness of the terminal device.

[0098] The display module provided in the above embodiment can be manufactured by the manufacturing method of the display module provided in the present application. Therefore, the manufacturing method of the display module provided in the present application has the technical effect of the above display module and will not be repeated here.

[0099] An embodiment of the present application provides a display module and a method for manufacturing a display module, wherein a packaging material layer is provided on at least part of the side surfaces of the display module, and the packaging material layer extends from the edge of the surface of the packaging cover plate away from the display substrate, through the side surface of the packaging cover plate and the side surface of the display substrate, to the edge of the surface of the display substrate away from the packaging cover plate, so as to wrap and encapsulate the side surface of the display substrate, the side surface of the packaging cover plate, and the partial area of ​​the surface of the display substrate and the packaging substrate facing away from each other. Compared with the prior art solution of providing a packaging material layer between the display substrate and the packaging cover plate for packaging, the solution provided by the embodiment of the present application can wrap and encapsulate the side surface of the display substrate, the side surface of the packaging cover plate, and the partial area of ​​the surface of the display substrate and the packaging substrate facing away from each other, so that the packaging material layer is equivalent to a clip, clamping and fixing the edges of the display substrate and the packaging substrate, and can simultaneously improve the sealing performance and structural strength of the film layer in the packaging area around the display module, prevent water vapor from invading the display module and causing poor display, and improve the yield of the display module when applied to a terminal device for drop testing.

[0100] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A display module, characterized in that: It includes a display substrate and a packaging cover plate arranged opposite to the display substrate; A packaging material layer is provided on at least part of the side surface of the display module, and the packaging material layer extends from the edge of the surface of the packaging cover plate away from the display substrate, through the side surface of the packaging cover plate and the side surface of the display substrate, to the edge of the surface of the display substrate away from the packaging cover plate, so as to wrap and encapsulate the side surface of the display substrate, the side surface of the packaging cover plate, and a portion of the surface of the packaging cover plate and the display substrate facing away from each other; The encapsulation material layer includes a first portion, a second portion, and a third portion, wherein the first portion is located at an edge of a surface of the encapsulation cover plate on a side away from the display substrate, the second portion is located at an edge of a surface of the display substrate on a side away from the encapsulation cover plate, and the third portion is located between the display substrate and the encapsulation cover plate; an orthographic projection of the third portion on the display substrate is located within an orthographic projection of the first portion on the display substrate, and an orthographic projection of the third portion on the display substrate is located within an orthographic projection of the second portion on the display substrate; The orthographic projection area of ​​the third portion on the display substrate is smaller than the orthographic projection area of ​​the first portion on the display substrate, and the orthographic projection area of ​​the third portion on the display substrate is smaller than the orthographic projection area of ​​the second portion on the display substrate; The display substrate includes a substrate and a circuit layer located on a side of the substrate close to the packaging cover plate, wherein the circuit layer is spaced apart from the packaging material layer; at least a portion of the orthographic projection of the circuit layer on the substrate overlaps with the orthographic projection of the first portion on the substrate; At least a portion of an orthographic projection of the circuit layer on the substrate overlaps with an orthographic projection of the second portion on the substrate.

2. The display module according to claim 1, wherein: The packaging material layer further includes a fourth portion; the fourth portion contacts a side surface of the packaging cover plate and a side surface of the display substrate; and the fourth portion connects the first portion, the second portion, and the third portion.

3. The display module according to claim 1, wherein: The packaging material layer includes a laser-cured packaging material.

4. The display module according to any one of claims 1 to 3, wherein: At least one side surface of the display substrate is flush with a side surface of the packaging cover plate; The packaging material layer is used to wrap and package the sides of the display substrate and the packaging cover plate in the display module.

5. The display module according to claim 4, wherein: The display substrate has three side surfaces flush with the package cover plate, and the remaining side of the display substrate protrudes relative to the package cover plate.

6. The display module according to any one of claims 1 to 3, wherein: The material of the packaging material layer includes a light-shielding material.

7. The display module according to claim 1, wherein: The display module includes a display area and a non-display area surrounding the display area. The orthographic projection of the packaging material layer on the display substrate is located in the non-display area. The orthographic projection of the packaging material layer on the display substrate is spaced apart from the display area.

8. A method for manufacturing a display module, characterized in that: The method comprises: providing a display substrate; Providing a packaging cover; Arranging the display substrate and the packaging cover plate opposite to each other; forming an encapsulation material layer on the display substrate and the encapsulation cover plate, so that at least a portion of the side surface of the display module is provided with the encapsulation material layer, and the encapsulation material layer extends from an edge of the surface of the encapsulation cover plate away from the display substrate, through a side surface of the encapsulation cover plate and a side surface of the display substrate, to an edge of the surface of the display substrate away from the encapsulation cover plate; Wherein, forming the packaging material layer on the display substrate and the packaging cover comprises: A carrier is provided, wherein the carrier comprises a first carrying surface, a second carrying surface, and a third carrying surface connecting the first carrying surface and the second carrying surface, wherein the first carrying surface is parallel to the second carrying surface; Applying packaging material on the first carrying surface, the second carrying surface, and the third carrying surface of the carrier; Placing the edges of the display substrate and the packaging cover plate, which are arranged opposite to each other, into the accommodation space surrounded by the first carrying surface, the second carrying surface, and the third carrying surface, so that the packaging material layer on the first carrying surface is in contact with the edge of the surface of the packaging cover plate away from the display substrate, the packaging material layer on the second carrying surface is in contact with the edge of the surface of the display substrate away from the packaging cover plate, and the packaging material layer on the third carrying surface is in contact with the side surface of the display substrate and the side surface of the packaging cover plate; The carrier is separated from the packaging material layer to remove the carrier.

9. The method for manufacturing a display module according to claim 8, wherein: Coating the packaging material on the first carrying surface, the second carrying surface, and the third carrying surface of the carrier includes: forming an adhesive layer on the first carrying surface, the second carrying surface, and the third carrying surface of the carrier; forming the packaging material layer on the adhesive layer; Accordingly, separating the carrier from the packaging material layer to remove the carrier includes: The viscosity of the adhesive layer is reduced, and the carrier is separated from the packaging material layer to remove the carrier.

10. The method for manufacturing a display module according to claim 9, wherein: The material of the adhesive layer includes ultraviolet light-reducing adhesive, and the carrier is light-transmissive.

11. The method for manufacturing a display module according to claim 9, wherein: After removing the carrier, the method further comprises: The glue layer on the packaging material layer is removed.

12. The method for manufacturing a display module according to claim 8, wherein: The material of the packaging material layer includes a laser-curing packaging material; After forming a packaging material layer on the display substrate and the packaging cover plate, the method further includes: The packaging material layer is irradiated with laser.

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