Heat dissipation back clip and electronic equipment components

Abstract

The embodiment of the present application provides a heat dissipation back clip and an electronic device assembly. By setting a cooling channel in the cavity of the heat dissipation back clip, the heat dissipation air can be cooled in the cooling channel to become low-temperature heat dissipation air. By connecting the cooling channel with the air inlet, the heat dissipation air can be easily entered into the cooling channel from the outside. By connecting the cooling channel with the air outlet, the low-temperature heat dissipation air can be easily discharged from the air outlet. By setting a gas driving device, the flow rate of the heat dissipation air can be increased, and the efficiency of forced convection heat dissipation can be improved. The air outlet is located on the installation surface of the electronic device, which can make the low-temperature heat dissipation air have a better cooling effect on the electronic device, thereby improving the heat dissipation efficiency of the heat dissipation back clip and improving the heat dissipation effect of the electronic device.

Description

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 29, 2021, with application number 202110127984.X and application name “Heat dissipation back clip and electronic device assembly”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of terminal technology, and in particular to a heat dissipation back clip and an electronic device assembly. Background Art

[0003] As terminal electronic devices become more and more advanced in configuration and performance, the integration level and assembly density of electronic components continue to increase. While providing powerful functions, this also leads to more and more heat generated during operation, which has an increasingly serious impact on terminal electronic devices. Therefore, the heat dissipation of terminal electronic devices is becoming more and more important.

[0004] The terminal electronic device dissipates heat by installing a heat dissipation back clip. The heat dissipation back clip includes a housing with a recess for accommodating the terminal electronic device. A semiconductor cooling fin and a fan are located at the bottom of the recess. The fan's air outlet faces the hot end of the semiconductor cooling fin. The cold end of the semiconductor cooling fin contacts a portion of the outer surface of the terminal electronic device, creating a heat exchange process that reduces the outer surface temperature of the terminal electronic device. The air blown by the fan cools the hot end of the semiconductor cooling fin.

[0005] However, the heat dissipation efficiency of the above-mentioned heat dissipation back clip is low, resulting in poor heat dissipation effect of the terminal electronic device. Summary of the Invention

[0006] The present application provides a heat dissipation component and an electronic device component, which improves the heat dissipation efficiency of the heat dissipation back clip and solves the technical problem that the heat dissipation efficiency of the heat dissipation back clip is low, resulting in poor heat dissipation effect of the electronic device.

[0007] A first aspect of an embodiment of the present application provides a heat dissipation assembly for use in electronic equipment, which includes a shell having a cavity inside, a gas drive device and a cooling channel arranged in the cavity, and an air inlet and an air outlet provided on the shell, both of which are connected to the cooling channel.

[0008] At least one outer wall of the shell has a mounting surface for mounting the electronic device, the air outlet is located on the mounting surface, and the gas driving device is used to drive the air flow in the refrigeration channel to flow toward the electronic device through the air outlet.

[0009] The heat dissipation assembly provided by the present application sets a cooling channel in the cavity, so that the heat dissipation air can be cooled in the cooling channel to become low-temperature heat dissipation air. By connecting the cooling channel with the air inlet, the heat dissipation air can be easily entered into the cooling channel from the outside. The cooling channel and the air outlet are connected, so that the low-temperature heat dissipation air can be easily discharged from the air outlet. By setting a gas driving device, the flow rate of the heat dissipation air can be increased, and the efficiency of forced convection heat dissipation can be enhanced. The air outlet is located on the installation surface of the electronic device, which can make the low-temperature heat dissipation air have a better cooling effect on the electronic device, thereby improving the heat dissipation efficiency of the heat dissipation back clip.

[0010] In a possible implementation of the first aspect, a refrigeration component is disposed in the cavity, and the refrigeration component surrounds the refrigeration channel.

[0011] In this way, on the one hand, a channel for heat dissipation air circulation can be formed by the refrigeration component, and on the other hand, the refrigeration component can serve as a cold source to cool the heat dissipation air, so that the heat dissipation air becomes low-temperature heat dissipation air after flowing through the refrigeration channel.

[0012] In a possible implementation of the first aspect, the refrigeration element is a semiconductor refrigeration plate, which has a hot end and a cold end, and the hot end and the cold end are respectively located on opposite sides of the semiconductor refrigeration plate; the cold end faces the refrigeration channel, the hot end faces away from the refrigeration channel, and the hot end is in contact with the inner wall surface of the shell.

[0013] Setting the refrigeration component as a semiconductor refrigeration plate will not cause refrigerant pollution, and it also has the advantages of high reliability and does not take up space. The cold end can cool the heat dissipation air, and the hot end and the shell are fitted together so that the shell can dissipate heat to the hot end through natural convection. There is no need to use a fan to dissipate heat to the hot end, reducing the loss of fan energy efficiency.

[0014] In a possible implementation of the first aspect, the shell includes an upper cover, a lower cover, and a middle frame, the middle frame is connected between the upper cover and the lower cover, and inner walls of the upper cover, the lower cover, and the middle frame form the cavity.

[0015] The air inlet is arranged on the lower cover, the air outlet is arranged on the upper cover, and the outer wall surface of the upper cover has the mounting surface.

[0016] In this way, it is convenient to assemble the components inside the cavity of the heat dissipation back clip, and it is also convenient to perform energy management of hot and cold separation of the heat dissipation back clip, thereby improving the heat dissipation efficiency of the heat dissipation back clip.

[0017] In a possible implementation manner of the first aspect, the middle frame is made of a heat-conductive material, and the upper cover and the lower cover are made of a heat-insulating material.

[0018] In this way, the heat at the hot end of the semiconductor refrigeration chip can be transferred to the middle frame, and then the middle frame performs natural convection heat dissipation. There is no need to use a fan to dissipate heat from the hot end, which improves the utilization rate of the fan energy efficiency. In addition, the upper cover and the lower cover are both insulated to prevent heat transfer between the cooling channel and the outside, avoiding cold loss in the cooling channel.

[0019] In a possible implementation of the first aspect, all the hot ends of the semiconductor refrigeration plate are in contact with the inner wall surface of the middle frame.

[0020] This can maximize the space of the cooling channel, increase the cooling area of ​​the semiconductor refrigeration plate, and increase the cooling capacity of the cooling channel.

[0021] In a possible implementation of the first aspect, the hot end of a portion of the semiconductor refrigeration plate is in contact with the inner wall surface of the middle frame, at least one partition is provided in the cavity, and the hot end of another portion of the semiconductor refrigeration plate is in contact with the partition.

[0022] A heat insulating member is provided on a side of the partition away from the refrigeration channel.

[0023] In this way, the heat dissipation back clip's cavity can be divided into at least one cooling cavity and at least one storage cavity by the partition, facilitating the placement and arrangement of other components within the cavity. Furthermore, by providing the partition, the optimal heat dissipation area directly facing the heat dissipation back clip's air outlet can be adjusted, allowing the heat dissipation back clip to be adapted to different models of electronic devices and achieve optimal heat dissipation. Furthermore, the provision of thermal insulation prevents heat transfer between the cooling cavity and the storage cavity, preventing heat transferred from the hot end to the partition from being transferred to the storage cavity, and preventing heat from affecting the components within the storage cavity.

[0024] In a possible implementation of the first aspect, there is one partition, which divides the cavity into a refrigeration cavity and a receiving cavity that are independent of each other, and the air inlet and the air outlet are both connected to the refrigeration cavity.

[0025] The refrigeration channel is located in the refrigeration cavity, a portion of the hot end is in contact with the partition, and another portion of the hot end is in contact with the inner wall surface of the middle frame located in the refrigeration cavity.

[0026] In this way, the refrigeration chamber can be located at one end of the cavity, and the accommodating chamber can be located at the other end of the cavity, which is convenient for the arrangement of the internal components of the cavity. In this way, the optimal heat dissipation area can be located at the end of the heat dissipation back clip, which can meet the heat dissipation needs of electronic equipment with higher end temperatures.

[0027] In a possible implementation of the first aspect, there are two partitions, and the two partitions separate the cavity into a refrigeration cavity and two accommodating cavities that are independent of each other. The refrigeration cavity is located between the two accommodating cavities, and the air inlet and the air outlet are both connected to the refrigeration cavity.

[0028] The refrigeration channel is located in the refrigeration cavity, a portion of the hot end is in contact with the partition, and another portion of the hot end is in contact with the inner wall surface of the middle frame located in the refrigeration cavity.

[0029] In this way, the cooling cavity can be located in the middle of the cavity, and the optimal heat dissipation area can be located in the middle of the heat dissipation back clip, which can meet the heat dissipation needs of electronic equipment with higher temperature in the middle.

[0030] In a possible implementation of the first aspect, a circuit board is provided in the accommodating cavity, and the gas driving device and the semiconductor refrigeration plate are both electrically connected to the circuit board.

[0031] In this way, the gas drive device and the semiconductor refrigeration plate can be powered and the operating status managed through the circuit board, which facilitates the cooperation between the gas drive device and the semiconductor refrigeration plate and improves the stability of the heat dissipation back clip.

[0032] In a possible implementation manner of the first aspect, a power storage device is provided in the accommodating cavity, and the power storage device is electrically connected to the circuit board.

[0033] In this way, on the one hand, the power storage device can supply power to the circuit board, and on the other hand, the power storage device can store electrical energy as an emergency backup power supply for electronic equipment and the heat dissipation back clip.

[0034] In a possible implementation manner of the first aspect, the circuit board includes a power input interface and a power output interface, and both the power input interface and the power output interface are mounted on the middle frame.

[0035] In this way, the circuit board can be powered directly through the power input interface, or the power storage device can be used to store electrical energy, and the electronic equipment can be powered through the power output interface.

[0036] In a possible implementation of the first aspect, the gas driving device is a fan, at least part of the fan is located in the refrigeration channel, the air inlet of the fan faces the air inlet hole, and the air outlet of the fan faces the air outlet hole.

[0037] In this way, the gas drive device can occupy a smaller space, the fan's air inlet facing the air inlet can minimize the wind resistance of the cooling air entering the fan, and the fan's air outlet facing the air outlet can reduce the wind resistance of the cooling air outflow, thereby ensuring to the greatest extent that the fan will not suffer energy efficiency loss.

[0038] In a possible implementation manner of the first aspect, a mounting member is provided on the mounting surface, and the mounting member is used to mount the electronic device.

[0039] In this way, the electronic device can be mounted firmly on the heat dissipation back clip and will not fall off.

[0040] In a possible implementation manner of the first aspect, a magnetic component is provided on the mounting component, and the magnetic component is used to magnetically attract the electronic device.

[0041] And / or, an anti-slip member is provided on the surface of the mounting member.

[0042] In this way, the electronic device can be adsorbed by magnetic force to increase the assembly stability of the electronic device on the heat dissipation back clip, and the anti-slip part can increase the friction between the electronic device and the back clip to prevent the electronic device and the back clip from sliding relative to each other.

[0043] In a possible implementation manner of the first aspect, a clamping member is provided on the housing, and the clamping member includes a clamping claw, and the clamping claw is used to clamp the electronic device.

[0044] In this way, the electronic device can be firmly clamped on the heat dissipation back clip by the clamping piece to prevent it from falling.

[0045] The second aspect of an embodiment of the present application also provides an electronic device assembly, including an electronic device and the heat dissipation back clip as described above, wherein the electronic device is mounted on the mounting surface of the heat dissipation back clip, the electronic device is connected to the mounting part of the mounting surface, and there is a gap between the electronic device and the mounting surface.

[0046] By setting a heat dissipation back clip in the electronic equipment component and setting a cooling channel in the cavity of the heat dissipation back clip, the heat dissipation air can be cooled in the cooling channel to become low-temperature heat dissipation air. By connecting the cooling channel with the air inlet, the heat dissipation air can be conveniently entered into the cooling channel from the outside. The cooling channel and the air outlet are connected, which can facilitate the low-temperature heat dissipation air to flow out of the air outlet. By setting a gas drive device, the flow rate of the heat dissipation air can be increased and the efficiency of forced convection heat dissipation can be enhanced. The air outlet is located on the installation surface of the electronic equipment, which can make the low-temperature heat dissipation air have a better cooling effect on the electronic equipment, improve the heat dissipation efficiency of the heat dissipation back clip, and improve the heat dissipation effect of the electronic equipment.

[0047] In a possible implementation manner of the second aspect, a support frame is included, and a connecting portion of the support frame is connected to the electronic device or the heat dissipation back clip.

[0048] In this way, the electronic device and the heat dissipation back clip are supported by the support frame, which makes it convenient for users to use them in different scenarios.

[0049] In a possible implementation manner of the second aspect, an audio component is included, and the audio component is connected to the electronic device wirelessly or by wire.

[0050] In this way, louder and higher-quality sound can be provided to electronic devices, thereby expanding the capabilities of electronic device speakers. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 A schematic diagram of the structure of a heat dissipation back clip provided in one embodiment of the present application;

[0052] Figure 2A A schematic diagram of the disassembled structure of the heat dissipation back clip provided in one embodiment of the present application;

[0053] Figure 2B A schematic diagram of the heat dissipation air flow direction of a heat dissipation back clip provided in one embodiment of the present application;

[0054] Figure 3 This is a schematic structural diagram of a heat dissipation back clip provided in one embodiment of the present application without a clamping member;

[0055] Figure 4 A schematic structural diagram of the lower cover and middle frame of the heat dissipation back clip provided in one embodiment of the present application;

[0056] Figure 5 A schematic structural diagram of the upper cover of the heat dissipation back clip provided in one embodiment of the present application;

[0057] Figure 6 A schematic structural diagram of the lower cover, middle frame, and clamping member of the heat dissipation back clip provided in one embodiment of the present application from a first viewing angle;

[0058] Figure 7 A schematic structural diagram of the lower cover, middle frame, and clamping member of the heat dissipation back clip provided in one embodiment of the present application from a second viewing angle;

[0059] Figure 8 This is a schematic structural diagram of the lower cover, middle frame and clamping parts of the heat dissipation back clip provided in one embodiment of the present application from a third perspective.

[0060] Description of reference numerals:

[0061] 100 - heat dissipation back clip; 10 - housing; 11 - top cover; 12 - middle frame;

[0062] 13-Lower cover; 14-Air inlet; 15-Air outlet; 16-Mounting surface;

[0063] 17-mounting member; 20-cavity; 21-refrigeration chamber; 22-accommodation chamber;

[0064] 30-gas drive device; 40-refrigeration channel; 50-semiconductor refrigeration chip; 51-hot end;

[0065] 52-cold end; 60-partition; 70-circuit board; 71-power input interface;

[0066] 72 - power output interface; 80 - power storage device; 90 - clamping member; 91 - clamping claw;

[0067] 92-Splint. DETAILED DESCRIPTION

[0068] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0069] The heat dissipation back clip generally mainly includes a shell, which is provided with a groove for accommodating terminal electronic equipment. A semiconductor refrigeration plate and a fan are provided at the bottom of the groove. The cold end of the semiconductor refrigeration plate is in contact with the terminal electronic equipment. The temperature of the cold end is lower and the temperature of the terminal electronic equipment is higher. The two perform heat exchange to reduce the temperature of the terminal electronic equipment. The fan drives the heat dissipation air to flow, so that the heat dissipation air flows through the hot end of the semiconductor refrigeration plate. The heat dissipation air takes away the heat from the hot end to cool the hot end of the semiconductor refrigeration plate. In addition, the heat dissipation air will also flow through the electronic equipment to directly dissipate heat to the terminal electronic equipment.

[0070] However, this heat dissipation back clip has the following disadvantages: First, because the hot end of the semiconductor refrigeration plate needs to dissipate heat, part of the fan's energy efficiency needs to be used to dissipate the hot end of the semiconductor refrigeration plate, and the remaining energy efficiency is used to blow air to cool the electronic equipment, which weakens the fan's heat dissipation capacity. Second, because the fan's air outlet is directly facing the semiconductor refrigeration plate, the fan's air cannot be directly discharged to act on the electronic equipment, reducing the efficiency of forced convection heat dissipation. The above two disadvantages result in low heat dissipation efficiency of the heat dissipation back clip.

[0071] Example 1

[0072] In order to solve the above problems, Figure 1 As shown, the first embodiment of the present application provides a heat dissipation back clip 100 for use in electronic devices, wherein the electronic devices may include but are not limited to mobile or fixed terminals such as mobile phones, tablet computers, laptop computers, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, and virtual reality devices. In addition, the electronic devices may also include electronic components such as chips and circuit boards. In this embodiment, the electronic devices are described using a mobile phone as an example.

[0073] like Figure 2A As shown, the heat dissipation assembly may include a housing 10, which has a cavity 20 inside. A gas drive device 30 and a cooling channel 40 are provided in the cavity 20. The housing 10 is provided with an air inlet 14 and an air outlet 15, both of which are connected to the cooling channel 40. At least one outer wall of the housing 10 has a mounting surface 16 for mounting electronic equipment. The air outlet 15 is located on the mounting surface 16. The gas drive device 30 is used to drive the air flow in the cooling channel 40 to flow to the electronic equipment through the air outlet 15. Figure 2B As shown in the figure, the arrows represent the flow direction of the cooling air. The normal temperature cooling air flows into the refrigeration channel 40 through the air inlet 14. After being cooled and cooled by the refrigeration channel 40, the normal temperature cooling air becomes low temperature cooling air. The low temperature cooling air flows out from the air outlet 15 under the drive of the gas drive device 30 and flows to the electronic equipment. Heat exchange is formed between the low temperature cooling air and the electronic equipment, and the temperature of the electronic equipment is reduced.

[0074] By setting a cooling channel 40 in the cavity 20, the heat dissipation air can be cooled in the cooling channel 40 to become low-temperature heat dissipation air. By connecting the cooling channel 40 with the air inlet 14, the heat dissipation air can be conveniently entered into the cooling channel 40 from the outside. The cooling channel 40 is connected with the air outlet 15, which can facilitate the low-temperature heat dissipation air to flow out of the air outlet 15. By setting a gas drive device 30, the flow rate of the heat dissipation air can be increased and the efficiency of forced convection heat dissipation can be enhanced. The air outlet 15 is located on the mounting surface 16 of the electronic device, which can make the low-temperature heat dissipation air have a better cooling effect on the electronic device, thereby improving the heat dissipation efficiency of the heat dissipation back clip 100.

[0075] It should be noted that the gas drive device 30 can be any one of a fan, an air pump, or an air bag. The air pump and air bag are primarily composed of a cylinder and a push rod. The cylinder is fixedly connected to the housing 10 of the heat dissipation back clip 100, and the push rod moves relative to the cylinder, thereby driving the flow of the heat dissipation air. A fan transfers energy to the heat dissipation air by the dynamic action of the blades on the rotating impeller, thereby driving the flow of the heat dissipation air. The embodiments of this application do not limit the specific type of gas drive device 30, and users can select one based on their actual needs.

[0076] In one possible implementation, a refrigeration element can be placed within cavity 20, forming a refrigeration channel 40. This allows the refrigeration element to form a channel for cooling airflow. Furthermore, the refrigeration element can serve as a cooling source to cool the cooling air, reducing it to low-temperature cooling air after passing through refrigeration channel 40. Specifically, the refrigeration element can be an absorption refrigeration device, a heat pump refrigeration device, or an electric heating refrigeration device, although this embodiment of the present application does not limit this.

[0077] It should be noted that the "enclosed" in this application can refer to the refrigeration components being connected in sequence to form a channel with closed sides, or it can refer to the refrigeration components being located on the four sides of the channel without being connected to each other. The embodiment of this application does not limit the specific formation of the refrigeration channel 40.

[0078] In one possible implementation, the cooling element may be a semiconductor cooling plate 50 having a hot end 51 and a cold end 52, with the hot end 51 and the cold end 52 located on opposite sides of the semiconductor cooling plate 50. Specifically, the cold end 52 faces the cooling channel 40, while the hot end 51 faces away from the cooling channel 40, and the hot end 51 is in contact with the inner wall surface of the housing 10.

[0079] It should be noted that the semiconductor refrigeration sheet 50 is also called a thermoelectric refrigeration sheet. The semiconductor refrigeration sheet 50 is a refrigeration technology that produces negative thermal resistance. It is characterized by having no moving parts and relatively high reliability. The semiconductor refrigeration sheet 50 is composed of many N-type semiconductor and P-type semiconductor particles arranged in parallel, and the NPs are connected to each other by a general conductor to form a complete circuit, usually copper, aluminum or other metal conductors. Finally, it is sandwiched between two ceramic sheets like a sandwich biscuit. The ceramic sheets must be insulated and have good thermal conductivity. The advantage of the semiconductor refrigeration sheet 50 is that it has no sliding parts and can be used in some places where space is limited, reliability is high, and there is no refrigerant pollution. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple respectively, thereby achieving the purpose of cooling.

[0080] Among them, the Peltier effect refers to the fact that when an electric current passes through a loop composed of different conductors, in addition to generating irreversible Joule heat, heat absorption and heat release will occur at the joints of different conductors depending on the direction of the current.

[0081] In the principle of the semiconductor refrigeration plate 50, when current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends, and heat is transferred from one end to the other, thereby generating a temperature difference to form the cold end 52 and the hot end 51. However, the semiconductor itself has resistance, and when current passes through the semiconductor, it generates heat, which affects heat transfer. In addition, heat between the two plates is also transferred in the reverse direction through the air and the semiconductor material itself. When the temperature difference between the cold end 52 and the hot end 51 reaches a certain level, the amount of these two types of heat transfer is equal, and an equilibrium point is reached, where the positive and reverse heat transfer cancel each other out. At this point, the temperature of the cold end 52 and the hot end 51 will not continue to change. To achieve a lower temperature, the temperature of the hot end 51 can be reduced by heat dissipation or other methods.

[0082] It should be noted that the temperature difference between the cold end 52 and the hot end 51 of the semiconductor refrigeration plate 50 can usually reach between 40 and 65 degrees. If the temperature of the hot end 51 is lowered by active heat dissipation, the temperature of the cold end 52 will also drop accordingly, thereby reaching a lower temperature.

[0083] In this embodiment, by fitting the hot end 51 to the shell 10, the hot end 51 transfers heat to the shell 10, and the shell 10 dissipates heat through natural convection. It should be emphasized that the "fitting" in this embodiment can be that the hot end 51 directly contacts the shell 10 for heat transfer, or a heat conductor can be provided between the hot end 51 and the shell 10 to indirectly transfer heat between the hot end 51 and the shell 10 through the heat conductor. The heat conductor can be made of a heat-conducting silicone material or a heat-conducting metal material. The embodiment of the present application does not limit the specific implementation method of heat transfer between the hot end 51 and the shell 10, and the user can make a choice based on actual needs.

[0084] In one possible implementation, the housing 10 may include an upper cover 11, a lower cover 13, and a middle frame 12. The middle frame 12 is connected between the upper cover 11 and the lower cover 13. The inner walls of the upper cover 11, the lower cover 13, and the middle frame 12 form a cavity 20. The air inlet 14 is provided on the lower cover 13, the air outlet 15 is provided on the upper cover 11, and the outer wall surface of the upper cover 11 has a mounting surface 16. By providing the upper cover 11, the lower cover 13, and the middle frame 12, it is not only convenient to assemble the components inside the cavity 20 of the heat dissipation back clip 100, but also convenient to disassemble and assemble the heat dissipation back clip 100. Specifically, when a component needs to be replaced, it can be replaced by disassembling the upper cover 11 or the lower cover 13. In addition, the upper cover 11, the lower cover 13, and the middle frame 12 can be made of different materials to perform heat and cold separation energy management on the heat dissipation back clip 100, thereby improving the heat dissipation efficiency of the heat dissipation back clip 100.

[0085] Among them, the material of the middle frame 12 can be a thermally conductive material, and the material of the upper cover 11 and the lower cover 13 can be a thermally insulating material. Among them, the thermally conductive material can be a metal with relatively good thermal conductivity, such as: aluminum, copper or copper-aluminum alloy, etc., and the thermally insulating material can be a plastic, rubber or resin with poor thermal conductivity, such as: polystyrene foam plastic, rigid polyurethane foam plastic or high-temperature resistant phenolic resin, etc. The embodiment of the present application does not limit the specific types of thermally conductive materials and thermally insulating materials, and users can make choices according to actual needs.

[0086] In this application, the heat of the hot end 51 of the semiconductor refrigeration sheet 50 is transferred to the middle frame 12, and then the outside of the middle frame 12 is exposed to natural wind, and the middle frame 12 performs natural convection heat dissipation. When the middle frame dissipates heat, Figure 4As shown, the arrows in the figure indicate the heat transfer from the middle frame to the outside. The advantage of this method is that there is no need to use a fan to dissipate heat from the hot end 51. In this way, the entire energy efficiency of the fan is applied to the surface of the electronic device, eliminating energy loss and improving the utilization rate of the fan energy efficiency. In addition, the thermal insulation of the upper cover 11 and the lower cover 13 prevents heat transfer between the cooling channel 40 and the outside, thus avoiding cooling loss within the cooling channel 40.

[0087] As a feasible embodiment, all hot ends 51 of the semiconductor cooling plate 50 are bonded to the inner wall surface of the middle frame 12. In this way, the inner wall surface of the middle frame 12 located inside the cavity 20 is bonded to the hot ends 51 of the semiconductor cooling plate 50. After bonding, the entire space of the cavity 20 becomes the space of the cooling channel 40. This not only maximizes the space of the cooling channel 40, but also increases the cooling area of ​​the semiconductor cooling plate 50, further increasing the cooling capacity of the cooling channel 40. The increased space of the cooling channel 40 can increase the storage capacity of low-temperature cooling air, thereby avoiding insufficient low-temperature cooling air volume that affects the heat dissipation effect of the heat dissipation back clip 100.

[0088] As another possible implementation method, Figure 4 and Figure 6 As shown, a portion of the hot end 51 of the semiconductor refrigeration plate 50 is in contact with the inner wall surface of the middle frame 12, and at least one partition 60 is provided in the cavity 20, and another portion of the hot end 51 of the semiconductor refrigeration plate 50 is in contact with the partition 60. In this way, the cavity 20 of the heat dissipation back clip 100 can be divided into at least one refrigeration cavity 21 and at least one accommodating cavity 22 by the partition 60, which facilitates the arrangement and layout of other components in the cavity 20 of the heat dissipation back clip 100. In addition, the position of the refrigeration cavity 21 on the heat dissipation back clip 100 can be adjusted by providing the partition 60. Since the refrigeration cavity 21 is connected to the air outlet 15, the optimal heat dissipation area facing the air outlet 15 of the heat dissipation back clip 100 can also be adjusted, so that the heat dissipation back clip 100 can be adapted to different models of electronic devices and can achieve the best heat dissipation effect.

[0089] In one possible implementation, the partition 60 can be made of a metal with relatively good thermal conductivity, such as aluminum, copper, or a copper-aluminum alloy. This allows the partition 60 to transfer heat transferred from the hot end 51 to the partition 60 to the middle frame 12. A thermal insulator is provided on the side of the partition 60 away from the refrigeration channel 40. The thermal insulator can be made of a plastic, rubber, or resin with poor thermal conductivity, such as polystyrene foam, rigid polyurethane foam, or high-temperature resistant phenolic resin. The thermal insulator prevents heat transfer between the refrigeration cavity 21 and the accommodating cavity 22, preventing heat transferred from the hot end 51 to the partition 60 from being transferred to the accommodating cavity 22, and preventing the heat from affecting the components in the accommodating cavity 22.

[0090] In a specific setting, a high-temperature resistant adhesive can be used to bond the thermal insulation component to the partition 60. The high-temperature resistant adhesive can be pressure-sensitive, hot-melt or water-based evaporative. Among them, the pressure-sensitive adhesive is relatively simple to operate and can generally be bonded by slightly pressing with the fingers. Hot-melt adhesives have certain requirements for operating temperature. Generally, the adhesive needs to be melted and evaporated first, and then cooled to a certain temperature for bonding. Water-based evaporative adhesives include polyvinyl alcohol aqueous solution, ethylene-ethyl acetate copolymer emulsion type, etc. The embodiment of the present application does not limit the type of high-temperature resistant adhesive, and the user can choose according to actual needs.

[0091] Specifically, the number and arrangement of the partitions 60 can be as follows:

[0092] In a first achievable embodiment, there is one partition 60. Thus, the partition 60 divides the cavity 20 into a mutually independent refrigeration cavity 21 and a receiving cavity 22. The air inlet 14 and the air outlet 15 on the housing 10 are both connected to the refrigeration cavity 21. The refrigeration channel 40 is located within the refrigeration cavity 21. A portion of the hot end 51 of the semiconductor cooling chip 50 is in contact with the partition 60, while another portion of the hot end 51 of the semiconductor cooling chip 50 is in contact with the inner wall surface of the middle frame 12 located within the refrigeration cavity 21.

[0093] It should be noted that, compared with the setting method of the prior art, the way of setting the semiconductor refrigeration plate 50 in this embodiment does not increase the area of ​​the semiconductor refrigeration plate 50, that is, it does not increase the additional power consumption. It can be understood that the "area" of the semiconductor refrigeration plate 50 can also be understood as the size of the semiconductor refrigeration plate 50. In this embodiment, it is only necessary to divide the original semiconductor refrigeration plate 50 into four pieces, and the four semiconductor refrigeration plates 50 are the four sides of the cooling channel 40 respectively.

[0094] It should be noted that a circuit board 70, a power storage device 80, etc. can be placed in the accommodating chamber 22, and a gas drive device 30 is placed in the refrigeration chamber 21. This arrangement makes the refrigeration chamber 21 located at one end of the cavity 20 and the accommodating chamber 22 located at the other end of the cavity 20, which facilitates the arrangement and connection of the internal components of the refrigeration chamber 21 and the accommodating chamber 22, so that the refrigeration chamber 21 and the accommodating chamber 22 avoid mutual interference. In addition, since the refrigeration chamber 21 is close to one end of the heat dissipation back clip 100, the optimal heat dissipation area can be located at the end of the heat dissipation back clip 100, which can meet the heat dissipation needs of electronic equipment with higher end temperatures.

[0095] As a second achievable embodiment, two partitions 60 may be provided. The two partitions 60 separate the cavity 20 into a mutually independent refrigeration cavity 21 and two accommodating cavities 22. The refrigeration cavity 21 is located between the two accommodating cavities 22, and the air inlet 14 and the air outlet 15 are both connected to the refrigeration cavity 21. The refrigeration channel 40 is located within the refrigeration cavity 21, with a portion of the hot end 51 in contact with the partition 60, and another portion of the hot end 51 in contact with the inner wall surface of the middle frame 12 located within the refrigeration cavity 21.

[0096] This arrangement allows the refrigeration chamber 21 to be located in the middle of the cavity 20. At this time, the air outlet 15 is also located in the middle of the heat dissipation back clip 100, and the optimal heat dissipation area is located in the middle of the heat dissipation back clip 100. During the use of the electronic device, the electronic components with the highest heat generation are usually the circuit board 70 and the battery. The circuit board 70 has a heating element, which can be the main chip on the electronic device, such as a power amplifier, an application processor (Central Processing Unit, CPU), a power management chip (Power Management IC, PMIC) or a radio frequency chip. Since the battery and circuit board 70 of different models of electronic devices are set in different positions, the high-temperature areas of the electronic devices are different. This arrangement can meet the heat dissipation needs of electronic devices with higher temperatures in the middle.

[0097] In one possible implementation, a circuit board 70 is disposed within the accommodating cavity 22, and both the gas drive device 30 and the semiconductor cooling plate 50 are electrically connected to the circuit board 70. This allows the circuit board 70 to provide power and manage the operating status of the gas drive device 30 and the semiconductor cooling plate 50, facilitating their coordinated operation and simultaneous operation, and further improving the operational stability of the heat dissipation back clip 100.

[0098] In a possible implementation, a power storage device 80 may be provided in the accommodating cavity 22 , and the power storage device 80 is electrically connected to the circuit board 70 .

[0099] The power storage device 80 can be a battery. Specifically, the battery can be a lithium ion cell and battery (Li-ion), a lithium polymer battery (Li-Po) or a nickel metal hydride battery (Ni-MH battery, Ni-MH). The embodiment of the present application does not limit the specific type of the power storage device 80.

[0100] In this way, on the one hand, the power storage device 80 can serve as the power source of the circuit board 70, and the circuit board 70 supplies power to the gas drive device 30 and the semiconductor refrigeration plate 50. On the other hand, the power storage device 80 can store electrical energy and serve as an emergency backup power source for electronic equipment and the heat dissipation back clip 100. Specifically, when storing electrical energy, electrical energy is input and stored in the form of chemical energy. When power supply is needed, the battery provides energy to generate electrical energy, which is converted to the required voltage through the voltage converter and supplied to the required equipment through the output port.

[0101] In one possible implementation, Figure 8 As shown, the circuit board 70 may include a power input interface 71 and a power output interface 72 . The middle frame 12 may be provided with mounting holes, and the power input interface 71 and the power output interface 72 are both mounted on the middle frame 12 .

[0102] Thus, the power input interface 71 can directly power the circuit board 70 or store energy in the power storage device 80, and the power output interface 72 can power the electronic device. It should be noted that the power input interface 71 and the power output interface 72 can be TYPE-C, micro-USB, or Lightning interfaces. In this way, the heat dissipation back clip 100 can be compatible with different types of mobile phones to meet the needs of different users.

[0103] In one possible implementation, due to the use of an air pump and an air bag, the shell 10 of the heat dissipation back clamp 100 needs to reserve sufficient space for the push rod to move, so the space inside the cavity 20 of the heat dissipation back clamp 100 is relatively large. Therefore, in an optional embodiment, the gas drive device 30 can be a fan. In this solution, the fan drives the heat dissipation air to move by the rotation of the blades, and the structural size of the fan is relatively small, so that the fan occupies a smaller space in the cavity 20 of the heat dissipation back clamp 100.

[0104] During installation, at least part of the fan can be located in the cooling channel 40, with the fan's air inlet facing the air inlet hole 14 and the fan's air outlet facing the air outlet hole 15. This can reduce the space occupied by the gas drive device 30. The fan's air inlet faces the air inlet hole 14, which can minimize the wind resistance of the cooling air entering the fan. The fan's air outlet faces the air outlet hole 15, which can reduce the wind resistance of the cooling air out. In addition, compared with the prior art, the arrangement of the embodiment of the present application does not have the problem of the semiconductor cooling plate 50 blocking the air outlet hole 15, nor does it have other components blocking the air outlet hole 15. This can maximize the guarantee that the fan will not suffer energy efficiency loss and improve the heat dissipation efficiency of the fan.

[0105] It should be noted that the fan can be an axial flow fan or a centrifugal fan. The main advantages of the axial flow fan are simple structure, large air volume, and the airflow direction is perpendicular to the rotation direction of the blades. The main advantages of the centrifugal fan are low noise, high pressure, and the airflow direction is tangential to the rotation direction of the blades.

[0106] In this embodiment, the fan is an axial flow fan, with the air inlet 14 and the air outlet 15 located at either end of the cooling channel 40, and the cooling channel 40 being a straight channel. This allows the axial flow fan to take advantage of its large air volume. As another feasible embodiment, the fan can also be a centrifugal fan, with the air outlet of the centrifugal fan facing the inner wall of the middle frame 12. After passing through the inner wall of the middle frame 12, the cooling air changes direction and flows out through the air outlet 15. In addition, the positions of the air inlet 14 and the air outlet 15 can be adjusted so that the air inlet of the centrifugal fan faces the air inlet 14 and the air outlet faces the air outlet 15. This can reduce the wind resistance of the cooling air. This embodiment of the application does not limit the type of fan, and users can select according to their needs.

[0107] In one possible implementation, Figure 3 As shown, a mounting member 17 may be provided on the mounting surface 16 for mounting an electronic device. This allows the electronic device to be securely mounted on the heat dissipation back clip 100 and prevent it from falling. Furthermore, the mounting member 17 may have a certain protrusion height relative to the mounting surface 16, which allows a gap to be created between the electronic device and the mounting surface 16. This allows the cooling air to flow from the air outlet 15 and impact the electronic device, where it will be deflected. The gap allows the cooling air to flow toward other surfaces of the electronic device, dissipating heat in other areas.

[0108] Specifically, the mounting member 17 may be a protrusion, such as Figure 5 As shown, this embodiment uses a circular protrusion, which can increase the contact surface between the housing 10 of the heat dissipation back clip 100 and the electronic device. In addition, the sidewall surface of the circular protrusion is curved, which facilitates the flow of heat dissipation air along the sidewall surface, reduces the resistance to the heat dissipation air flow, and improves the heat dissipation efficiency of the heat dissipation air. It should be noted that the shape of the protrusion can also be elliptical or other special shapes, and this embodiment of the application is not limited to this.

[0109] In one possible implementation, the mounting member 17 may be provided with a magnetic member for magnetically adsorbing the electronic device, and a non-slip member may be provided on the surface of the mounting member 17. Specifically, the magnetic member may be embedded in the circular protrusion or bonded to the surface of the circular protrusion, and the non-slip member may be bonded to the magnetic member.

[0110] It should be noted that some electronic devices have metal shells with relatively smooth surfaces. The magnetic parts can be used to adsorb the electronic devices through magnetic force, and the anti-slip parts can increase the friction between the electronic devices and the back clip to prevent the electronic devices and the back clip from sliding relative to each other. The above settings can increase the assembly stability of the electronic devices on the heat dissipation back clip 100.

[0111] In one possible implementation, a clamping member 90 may be provided on the shell 10, and the clamping member 90 may include a clamping claw 91, which is used to clamp the electronic device, wherein the number of the clamping claws 91 may be one or more, and one clamping claw 91 may cooperate with the mounting member 17 for clamping; multiple clamping claws 91 may be symmetrically arranged, and the clamping claws 91 cooperate with each other for clamping.

[0112] Specifically, such as Figure 7 As shown, the clamping member 90 can be installed on the lower cover 13. The mounting portion of the clamping member 90 is provided with a connecting rod for the two clamping claws 91 to extend and retract. The two clamping claws 91 are located on both sides of the heat dissipation back clip 100, and can clamp electronic devices of different sizes on the heat dissipation back clip 100. In this way, the electronic devices are firmly clamped on the heat dissipation back clip 100 and will not fall off.

[0113] In one possible implementation, the space between the clamping jaws 91 can be controlled by adjusting the telescopic length of the connecting rod. The clamping jaws 91 can be provided with soft rubber pads to prevent the clamping jaws 91 from scratching the surface of the electronic device. Using the telescopic function of the connecting rod to adjust the space for accommodating a mobile phone facilitates the operation of combining the electronic device with the heat dissipation back clip 100 and allows the heat dissipation back clip 100 to accommodate electronic devices of different sizes.

[0114] In one possible implementation, Figure 7 As shown, the clamping member 90 may further include a splint 92, which may be provided on the mounting portion of the clamping member 90. Through the splint 92 and the mounting portion, the heat dissipation back clip 100 may be clamped on a belt or pocket, making it convenient for users to use in different scenarios.

[0115] Example 2

[0116] Based on the above-mentioned embodiment 1, embodiment 2 of the present application provides an electronic device assembly, including an electronic device and the above-mentioned heat dissipation back clip 100, the electronic device is installed on the mounting surface 16 of the heat dissipation back clip 100, the electronic device is connected to the mounting part 17 of the mounting surface 16, and there is a gap between the electronic device and the mounting surface 16.

[0117] Specifically, the electronic device can be adsorbed on the mounting member 17 or clamped by the clamping claw 91. The housing of the electronic device abuts against the mounting member 17. The mounting member 17 can create a gap between the housing of the electronic device and the mounting surface 16. Since the air outlet 15 is located on the mounting surface 16, a large amount of heat dissipation air flows out from the air outlet 15, first acting on the electronic device near the air outlet 15, and then the heat dissipation air will be deflected. The gap can allow the heat dissipation air to have a flow channel between the electronic device and the heat dissipation back clip 100, which is convenient for the heat dissipation air to dissipate heat to other areas of the electronic device.

[0118] In one possible implementation, the electronic device assembly may include a support frame, and the connecting portion of the support frame is connected to the electronic device or the heat dissipation back clip 100. In this way, the electronic device and the heat dissipation back clip 100 are supported by the support frame, which can facilitate users to use in different scenarios.

[0119] For example, the support frame may be a triangular support frame, the height and angle of which are adjustable, so that the user can adjust the electronic device according to different occasions and meet the usage requirements of different users for different electronic devices.

[0120] In a possible implementation, the electronic device component may include an audio component, and the audio component is connected to the electronic device wirelessly or by wire.

[0121] It should be noted that the audio component can be connected to the electronic device via a wired connection or a wireless connection, wherein the wired connection can be a data cable, and the wireless connection can be Bluetooth and / or 2.4GHz and / or WiFi. Specifically, Bluetooth can be used to establish a pairing connection with the electronic device to transmit audio data; 2.4GHz and / or WiFi can be used to establish a wireless connection with the electronic device to achieve the same effect as described above, providing users with a variety of wireless connection options and enabling wireless connection in short-range situations.

[0122] Other technical features are the same as those in Example 1 and can achieve the same technical effects, so they will not be described in detail here.

[0123] The electronic device assembly provided in the second embodiment of the present application is provided with a heat dissipation back clip 100 in the electronic device assembly, and a cooling channel 40 is provided in the cavity 20 of the heat dissipation back clip 100, so that the heat dissipation air can be cooled in the cooling channel 40 to become low-temperature heat dissipation air. By connecting the cooling channel 40 with the air inlet 14, the heat dissipation air can be conveniently entered into the cooling channel 40 from the outside. The cooling channel 40 is connected with the air outlet 15, so that the low-temperature heat dissipation air can be conveniently discharged from the air outlet 15. By providing a gas drive device 30, the flow rate of the heat dissipation air can be increased, and the efficiency of forced convection heat dissipation can be enhanced. The air outlet 15 is located on the mounting surface 16 of the electronic device, which can make the low-temperature heat dissipation air have a better cooling effect on the electronic device, thereby improving the heat dissipation efficiency of the heat dissipation back clip 100 and improving the heat dissipation effect of the electronic device.

[0124] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0125] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation back clip, applied to electronic equipment, characterized in that: The invention comprises a shell, wherein the shell has a cavity inside, a gas driving device and a refrigeration channel are arranged in the cavity, and the shell is provided with an air inlet and an air outlet, wherein the air inlet and the air outlet are both connected to the refrigeration channel; At least one outer wall of the housing has a mounting surface for mounting the electronic device, the air outlet is located on the mounting surface, and the gas driving device is used to drive the air flow in the refrigeration channel to flow toward the electronic device through the air outlet; A refrigeration component is provided in the cavity, and the refrigeration component surrounds the refrigeration channel; The refrigeration element is a semiconductor refrigeration plate, which has a hot end and a cold end. The hot end and the cold end are respectively located on opposite sides of the semiconductor refrigeration plate; the cold end faces the refrigeration channel, the hot end faces away from the refrigeration channel, and the hot end is in contact with the inner wall surface of the shell.

2. The heat dissipation back clip according to claim 1, characterized in that: The housing includes an upper cover, a lower cover, and a middle frame, wherein the middle frame is connected between the upper cover and the lower cover, and the inner walls of the upper cover, the lower cover, and the middle frame form the cavity; The air inlet is arranged on the lower cover, the air outlet is arranged on the upper cover, and the outer wall surface of the upper cover has the mounting surface.

3. The heat dissipation back clip according to claim 2, characterized in that: The middle frame is made of heat-conducting material, and the upper cover and the lower cover are made of heat-insulating material.

4. The heat dissipation back clip according to claim 2 or 3, characterized in that: All the hot ends of the semiconductor refrigeration plate are in contact with the inner wall surface of the middle frame.

5. The heat dissipation back clip according to claim 2 or 3, characterized in that: The hot end of a portion of the semiconductor refrigeration sheet is in contact with the inner wall surface of the middle frame, and at least one partition is provided in the cavity, and the hot end of another portion of the semiconductor refrigeration sheet is in contact with the partition; A heat insulating member is provided on a side of the partition away from the refrigeration channel.

6. The heat dissipation back clip according to claim 5, characterized in that: There is one partition, which divides the cavity into a refrigeration cavity and a receiving cavity that are independent of each other, and the air inlet and the air outlet are both connected to the refrigeration cavity; The refrigeration channel is located in the refrigeration cavity, a portion of the hot end is in contact with the partition, and another portion of the hot end is in contact with the inner wall surface of the middle frame located in the refrigeration cavity.

7. The heat dissipation back clip according to claim 5, characterized in that: There are two partitions, which separate the cavity into a refrigeration cavity and two accommodating cavities that are independent of each other. The refrigeration cavity is located between the two accommodating cavities, and the air inlet and the air outlet are both connected to the refrigeration cavity. The refrigeration channel is located in the refrigeration cavity, a portion of the hot end is in contact with the partition, and another portion of the hot end is in contact with the inner wall surface of the middle frame located in the refrigeration cavity.

8. The heat dissipation back clip according to claim 6 or 7, characterized in that: A circuit board is provided in the accommodating cavity, and the gas driving device and the semiconductor refrigeration plate are both electrically connected to the circuit board.

9. The heat dissipation back clip according to claim 8, characterized in that: An electricity storage device is provided in the accommodating cavity, and the electricity storage device is electrically connected to the circuit board.

10. The heat dissipation back clip according to claim 8, characterized in that: The circuit board includes a power input interface and a power output interface, and both the power input interface and the power output interface are installed on the middle frame.

11. The heat dissipation back clip according to any one of claims 1-3, 6-7, 9-10, characterized in that: The gas driving device is a fan, at least part of which is located in the refrigeration channel, the air inlet of the fan faces the air inlet hole, and the air outlet of the fan faces the air outlet hole.

12. The heat dissipation back clip according to any one of claims 1-3, 6-7, 9-10, characterized in that: The mounting surface is provided with a mounting piece, and the mounting piece is used to mount the electronic device.

13. The heat dissipation back clip according to claim 12, characterized in that: The mounting member is provided with a magnetic member, and the magnetic member is used to magnetically attract the electronic device; And / or, an anti-slip member is provided on the surface of the mounting member.

14. The heat dissipation back clip according to any one of claims 1-3, 6-7, 9-10, and 13, characterized in that: The housing is provided with a clamping member, which includes a clamping claw used for clamping the electronic device.

15. An electronic device assembly, characterized in that: It comprises an electronic device and a heat dissipation back clip as described in any one of claims 1 to 14, wherein the electronic device is mounted on the mounting surface of the heat dissipation back clip, the electronic device is connected to the mounting part of the mounting surface, and there is a gap between the electronic device and the mounting surface.

16. The electronic device assembly according to claim 15, wherein: It comprises a support frame, wherein a connecting portion of the support frame is connected to the electronic device or the heat dissipation back clip.

17. The electronic device assembly according to claim 16, wherein: It includes an audio component, which is connected to the electronic device wirelessly or by wire.

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