Chassis, electronic device, and chassis exhaust method

Abstract

The present disclosure relates to a chassis, electronic equipment and chassis exhaust method, wherein the chassis includes: a shell, forming a accommodating chamber, wherein the accommodating chamber is used to accommodate coolant and heat-generating components immersed in the coolant; a condenser, arranged in the accommodating chamber, used to condense the coolant in gas phase; a coolant interface, arranged on the shell; and an exhaust component, located on the shell, at least used to discharge the gas in the accommodating chamber when the coolant is injected into the accommodating chamber through the coolant interface.

Description

Technical Field

[0001] The present disclosure relates to the technical field of immersion liquid cooling, and in particular to a chassis, an electronic device, and a chassis exhaust method. Background Art

[0002] Integrated circuit devices that perform high-speed calculations in supercomputing equipment, such as application-specific integrated circuit (ASIC) chips, generate a large amount of heat during operation. When the heat accumulates to a certain level, the temperature of the integrated circuit device rises, causing the operating performance of the integrated circuit device to decrease or even burn out the integrated circuit device.

[0003] Integrated circuits (ICs) typically dissipate heat using heat sinks and other methods. For example, heat sinks are placed close to the IC and dissipated through fans or liquid cooling pipes. As the computing power of ASICs and other ICs continues to increase, the amount of heat generated increases. Existing heat dissipation methods are no longer sufficient for IC devices. Therefore, dissipating heat from ICs to meet the cooling requirements of these devices is an urgent issue. Summary of the Invention

[0004] The present disclosure provides a metal-based circuit board, a circuit board, and an electronic device.

[0005] According to a first aspect of an embodiment of the present disclosure, a chassis is provided, comprising:

[0006] The housing forms a receiving cavity, wherein the receiving cavity is used to receive a coolant and a heat generating component immersed in the coolant;

[0007] a condenser, disposed in the accommodating cavity, for condensing the coolant in gas phase;

[0008] A coolant interface is provided on the housing;

[0009] An exhaust component is located on the shell and is at least used to exhaust the gas in the accommodating cavity when the coolant is injected into the accommodating cavity through the coolant interface.

[0010] In one embodiment, the condenser includes a condenser tube, and the inner wall and / or outer wall of the condenser tube is provided with rib-shaped protrusions.

[0011] In one embodiment, the rib-shaped protrusions are spirally arranged on the inner wall and / or the outer wall of the condenser.

[0012] In one embodiment, the cross section of the rib-shaped protrusion is V-shaped or U-shaped.

[0013] In one embodiment, the condenser contains condensate, and the condenser comprises: a liquid inlet provided on the shell for the condensate to flow in, and a liquid outlet provided on the shell for the condensate to flow out;

[0014] The liquid inlet is connected to an external heat exchange device;

[0015] The liquid outlet is communicated with the heat exchange device.

[0016] In one embodiment, the condenser is in contact with an inner wall of the top of the housing.

[0017] In one embodiment, the housing includes: a first housing and a second housing, wherein the first housing tightly covers the second housing to form the accommodating cavity.

[0018] In one embodiment, the exhaust component includes a one-way valve and a ball valve.

[0019] According to a second aspect of an embodiment of the present disclosure, there is provided an electronic device, including:

[0020] The chassis of the first aspect;

[0021] a cooling liquid contained in the accommodating cavity formed by the shell of the chassis;

[0022] A heat-generating component immersed in the coolant, wherein the heat-generating component includes at least one computing board.

[0023] In one embodiment, the first surface of the hash board faces the top of the housing, and an angle between the first surface and the vertical direction is greater than 0 degrees and less than 90 degrees, wherein the first surface is provided with an integrated circuit device that generates heat.

[0024] In one embodiment, the integrated circuit device includes a chipset arranged in a matrix.

[0025] In one embodiment, the angle between the first surface and the vertical direction is greater than or equal to 5 degrees and less than or equal to 85 degrees.

[0026] In one embodiment, the angle between the first surface and the vertical direction is 20 degrees.

[0027] In one embodiment, a metal pore layer is provided on a chip surface of the integrated circuit device facing away from the first surface, wherein the metal pore layer includes metal particles and pores between the metal particles.

[0028] In one embodiment, a metal packaging shell of the chip is provided between the chip surface and the metal pore layer;

[0029] or,

[0030] A thermal conductive coating is provided between the chip surface and the metal pore layer.

[0031] In one embodiment, the thermal conductive coating comprises: a metal thermal conductive coating or a non-metal thermal conductive coating.

[0032] In one embodiment, the heat generating component includes: a power supply component of the electronic device and / or a control board of the electronic device.

[0033] In one embodiment, the electronic device further includes: an external heating component arranged on the outer surface of the housing.

[0034] In one embodiment, the cooling liquid includes: a fluorinated liquid.

[0035] According to a third aspect of an embodiment of the present disclosure, a chassis exhaust method is provided, which is applied to the electronic device described in the second aspect. The method includes:

[0036] A first liquid level of the coolant in the accommodating chamber formed by the housing of the electronic device is lower than that of the condenser, and the condenser is used to condense the gas in the accommodating chamber to a first temperature;

[0037] The coolant is injected into the accommodating chamber through a coolant interface to a second liquid level position, and the gas in the accommodating chamber is discharged through an exhaust component, wherein the second liquid level position is higher than the first liquid level position.

[0038] In one embodiment, before using the condenser to condense the gas in the accommodating chamber to the first temperature, the method further includes:

[0039] A heat-generating component immersed in the coolant is used to heat the coolant to a second temperature, wherein the second temperature is higher than the first temperature.

[0040] In one embodiment, the second temperature is greater than or equal to a phase transition temperature of the cooling liquid.

[0041] In one embodiment, the method further comprises:

[0042] Discharging the coolant from the accommodating cavity to a third liquid level through the coolant interface, wherein the third liquid level is lower than the second liquid level and higher than the first liquid level;

[0043] Cooling liquid is injected into the accommodating cavity through the cooling liquid interface to a second liquid level position, and the gas in the accommodating cavity is discharged through the exhaust component.

[0044] In one embodiment, the second liquid level position is the liquid level position when the accommodating chamber is filled with the cooling liquid.

[0045] In one embodiment, the first liquid level is higher than the heat-generating component.

[0046] According to the chassis, electronic equipment and chassis exhaust method provided by the embodiments of the present disclosure, the chassis includes: a shell, forming a accommodating chamber, wherein the accommodating chamber is used to accommodate coolant and heat-generating components immersed in the coolant; a condenser, arranged in the accommodating chamber, used to condense the coolant in gas phase; a coolant interface, arranged on the shell; an exhaust component, located on the shell, at least used to discharge the gas in the accommodating chamber when the coolant is injected into the accommodating chamber through the coolant interface. In this way, by arranging the exhaust component to discharge the gas in the accommodating chamber when the coolant is injected into the accommodating chamber through the coolant interface, gases such as air with poor heat exchange capacity during the phase change heat dissipation process are discharged, thereby improving the working efficiency of the condenser and thus improving the heat dissipation effect of the chassis.

[0047] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0049] Figure 1 is a schematic structural diagram of a chassis according to an exemplary embodiment;

[0050] Figure 2 is a schematic structural diagram of an exhaust component according to an exemplary embodiment;

[0051] Figure 3 is a structural schematic diagram of a condenser according to an exemplary embodiment;

[0052] Figure 4 is a schematic diagram of a chassis in direction A according to an exemplary embodiment;

[0053] Figure 5 FIG. 1 is a schematic diagram of a hashboard structure according to an exemplary embodiment.

[0054] Figure 6 It is a schematic diagram of the cross-sectional structure of a condenser according to an exemplary embodiment.

[0055] Figure 7 The figure is a flow chart showing an exhaust method according to an exemplary embodiment. DETAILED DESCRIPTION

[0056] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present disclosure. Rather, they are merely examples of devices consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0057] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0058] In the description of the present invention, “a plurality of” means two or more, and “a number of” means one or more.

[0059] In an embodiment of the present invention, Figure 1 As shown, a chassis 10 is provided, and the chassis 10 includes:

[0060] The housing 11 forms a receiving cavity, wherein the receiving cavity is used to receive the coolant and the heat generating component 20 immersed in the coolant;

[0061] A condenser 12 is provided in the accommodating cavity and is used to condense the coolant in gas phase;

[0062] A coolant interface 13 is provided on the housing 11;

[0063] The exhaust component 14 is located on the housing 11 and is at least used to exhaust the gas in the accommodating cavity when the coolant is injected into the accommodating cavity through the coolant interface 13 .

[0064] Here, the chassis 10 can be applied to electronic devices with high computing capabilities, such as computers, servers, and supercomputing devices. The chassis 10 can be used to set a heat-generating component 20 of the electronic device.

[0065] The heat generating component 20 may include a printed circuit board (PCB) with integrated circuit devices such as a processor. For example, the chassis 10 may be used to house a computing board of a supercomputing device. One or more computing boards may be placed in the housing.

[0066] In one embodiment, the heat generating component 20 includes: a power supply component of the electronic device and / or a control board of the electronic device.

[0067] Electronic devices with high computing power typically include a hashboard, a power supply unit that provides power to the hashboard, and a control board that coordinates the hashboard's operations. Both the power supply unit and the control board also generate heat. These components can also be immersed in the coolant to dissipate heat.

[0068] The housing 11 of the chassis 10 can be made of metal or non-metal material, and the housing forms a receiving cavity. A heat generating component 20 can be arranged at the lower part of the receiving cavity.

[0069] The heat-generating component 20 can be immersed in the coolant, and the heat-generating component 20 can exchange heat with the coolant, conduct the generated heat to the coolant, and thus reduce its own temperature.

[0070] After absorbing heat, the coolant undergoes a phase change, transforming from a liquid to a vapor. This phase transition absorbs heat generated by the heat-generating component 20. The area of the coolant chamber where the coolant resides can be referred to as the submerged section.

[0071] A condenser 12 may be provided above the accommodating chamber to condense the coolant in its vapor phase, converting it from a vapor phase to a liquid phase. During this conversion, the coolant releases heat to the condenser 12. The condenser 12 exchanges the absorbed heat with the external environment, thereby dissipating heat from the heat-generating component 20. The area within the accommodating chamber where the condenser 12 is located may be referred to as the condensation section.

[0072] In one embodiment, the cooling liquid includes: a fluorinated liquid.

[0073] The coolant can be fluorinated liquid, etc. The boiling point of fluorinated liquid under atmospheric pressure is 40-65°C. The immersion liquid can be selected according to the chip temperature control conditions to ensure that the operating temperature inside the device is close to the external environment under working conditions, effectively avoiding leakage of immersion liquid gas.

[0074] There is a predetermined distance between the bottom of the condenser 12 and the surface of the coolant, namely the bubble bursting section. During the heat dissipation process of the heat generating component 20, the bubble bursting section is used to allow bubbles generated by the coolant to rise to the surface of the coolant and then burst to produce droplets and steam. The droplets fall directly into the immersion section under gravity, while the steam rises in the bubble bursting section and enters the connected condensation section to be condensed by the condenser 12. The predetermined distance can be 10 to 100 cm.

[0075] The cooling liquid interface 13 can be arranged at the bottom of the shell, so that more cooling liquid can be discharged during the cooling liquid discharge process. For example, the cooling liquid interface 13 can be arranged at the bottom of the shell, so that the cooling liquid can be completely discharged.

[0076] To facilitate operation, a heat-generating component 20 can be placed in the accommodating chamber, and then coolant can be injected into the accommodating chamber through the coolant interface 13. As the coolant is added, the pressure in the accommodating chamber increases. Gas in the accommodating chamber, such as air, coolant vapor, or a mixture of air and coolant vapor, can be discharged from the accommodating chamber through the exhaust component 14.

[0077] Since the gas is located above the coolant, an exhaust component 14 can be provided at the top of the accommodating chamber. The exhaust component 14 can be a valve or other component. It can be opened when the gas needs to be discharged and closed after the gas is discharged.

[0078] In one embodiment, the exhaust component 14 may be a passive exhaust component 14 , that is, the exhaust component 14 itself does not consume energy to drive the gas, but exhausts gas through the pressure difference between the inside and outside of the accommodating chamber.

[0079] In one embodiment, Figure 2 As shown, the exhaust component 14 includes a one-way valve 141 and a ball valve 142 .

[0080] On the gas exhaust path, a one-way valve 141 (also called a check valve) can be installed before the ball valve 142. The one-way valve 141 can prevent external air from entering the chamber when the pressure inside the chamber is lower than the external air pressure. The ball valve 142 can be used to control the on / off of the exhaust gas path.

[0081] During the normal pressure assembly and coolant injection process, a certain amount of air exists in the accommodating cavity. Since the air does not undergo phase change within the operating temperature range of the coolant, its effect on the heat dissipation process is relatively low. On the contrary, the presence of air reduces the working efficiency of the condenser 12, causing the two-phase operating temperature to rise and the operating pressure to increase, thereby damaging the structure of the chassis 10 and causing leakage.

[0082] Therefore, when injecting coolant, the coolant can be filled into the entire accommodating cavity, and all gas can be discharged through the exhaust component 14. This reduces the air in the accommodating cavity in the working state, improves the working efficiency of the condenser 12, and further improves the heat dissipation effect of the chassis 10.

[0083] In this way, by setting up an exhaust component 14 to discharge the gas in the accommodating cavity when the coolant is injected into the coolant interface 13, the air and other gases with poor heat exchange capacity during the phase change heat dissipation process are discharged, thereby improving the working efficiency of the condenser 12 and further improving the heat dissipation effect of the chassis 10.

[0084] In one embodiment, Figure 3 As shown, the condenser 12 includes a condenser tube 121 , and the inner wall and / or outer wall of the condenser tube 121 is provided with rib-shaped protrusions.

[0085] Here, the condenser 12 may include a condenser tube 121 disposed above the coolant level. Condensate flows in the condenser tube 121 .

[0086] During the process of converting the coolant from the gas phase to the liquid phase, the coolant releases heat to the wall of the condenser tube 121. The condensate flowing through the condenser tube 121 can have a relatively low temperature. The condensate exchanges heat with the higher temperature wall of the condenser tube 121, thereby lowering the temperature of the wall of the condenser tube 121 and improving the effect of condensing the coolant.

[0087] The condensate includes, but is not limited to, water, ethanol, electronic fluorinated fluid and / or mineral oil.

[0088] The condensing tubes 121 may be arranged horizontally in one or more rows. The condensing tubes 121 may be arranged in an S-shape or in a disc shape, etc., which is not limited here.

[0089] The inner and / or outer walls of the condenser tube 121 are provided with rib-like protrusions. The rib-like protrusions on the inner wall increase the surface area of the inner wall of the condenser tube 121, thereby improving the heat exchange efficiency between the condensate and the condenser tube 121. The rib-like protrusions on the outer wall also increase the surface area of the outer wall of the condenser tube 121, thereby improving the heat exchange efficiency between the coolant and the condenser tube 121. This improves the phase change efficiency of the coolant, thereby enhancing the heat dissipation effect.

[0090] In one embodiment, the height of the rib-shaped protrusions is 0.1-5 mm.

[0091] In one embodiment, the condenser 12 is in contact with the inner wall of the top of the housing 11 .

[0092] In one embodiment, the electronic device further includes: an external heating component 30 disposed on the outer surface of the housing 11 .

[0093] The external heating component 30 may include: a power supply component of the electronic device and / or a control panel of the electronic device

[0094] The top row of the multiple rows of condenser tubes 121 can be in direct contact with the top of the housing 11. The top of the housing 11 can be used to place external heat-generating components 30, such as power supply components and / or control boards of electronic devices. Heat-generating components 20 that are not suitable for immersion in coolant can be placed on the top of the housing 11.

[0095] In one embodiment, the rib-shaped protrusions are spirally arranged on the inner wall and / or the outer wall of the condenser 121 .

[0096] The rib-shaped protrusions are spirally arranged to further increase the surface area of the inner wall and / or outer wall, thereby improving the heat exchange efficiency between the coolant and the condenser tube 121, and / or between the coolant and the condenser tube 121. This improves the phase change efficiency of the coolant, thereby improving the heat dissipation effect.

[0097] In one embodiment, the cross section of the rib-shaped protrusion is V-shaped or U-shaped.

[0098] The coolant in the gas phase is more likely to change phase into the liquid phase at the tip, so the cross section of the rib-shaped protrusion can be set to a V-shape or a U-shape. This can promote the phase change efficiency of the coolant at the top of the rib-shaped protrusion, thereby improving the heat dissipation effect.

[0099] In one embodiment, the condenser 12 contains condensate, and the condenser 12 includes: a liquid inlet 1211 provided on the shell 11 for the condensate to flow in, and a liquid outlet 1212 provided on the shell 11 for the condensate to flow out;

[0100] The liquid inlet 1211 is connected to an external heat exchange device;

[0101] The liquid outlet 1212 is communicated with the heat exchange device.

[0102] The outer wall of the housing 11 may be provided with a liquid inlet 1211 and a liquid outlet 1212, so that the condensate in the condenser tube 121 flows into the heat exchange device for heat exchange with the external environment. The condensate can flow from the outside into the condenser tube 121 through the liquid inlet 1211, and after completing the heat exchange within the housing 11, it flows out through the liquid outlet 1212 and into the heat exchange device.

[0103] The heat exchange device is used to perform heat exchange between the condensate and the external environment, reduce the temperature of the condensate flowing out of the condenser tube 121 , and allow the cooled condensate to flow back into the condenser tube 121 from the liquid inlet 1211 .

[0104] Illustratively, the heat exchange device may include a first pipe connected to the liquid inlet 1211 and a second pipe connected to the liquid outlet 1212. The heat exchange device may include heat dissipation fins and a heat dissipation fan to dissipate heat from the condensate flowing through the heat exchange device.

[0105] In one embodiment, the housing 11 includes: a first housing and a second housing, wherein the first housing tightly covers the second housing to form the accommodating cavity.

[0106] The first shell and the second shell can be sealed by using a sealing ring and a sealing glue. The first shell can be a shell cover located at the upper part, and the second shell can be a shell bottom located at the lower part.

[0107] In one embodiment, the condenser 12 can be disposed in the first housing, and the heat generating component 20 can be disposed in the second housing, so that the condenser 12 and the heat generating component 20 can be maintained separately when the first housing and the second housing are separated.

[0108] In an embodiment of the present invention, Figure 1 As shown, an electronic device is provided, the electronic device comprising:

[0109] Figure 1 The chassis 10 shown; a coolant contained in a receiving cavity formed by the shell 11 of the chassis 10; a heat-generating component 20 immersed in the coolant, wherein the heat-generating component 20 includes: at least one computing board 21.

[0110] like Figure 1 As shown, the chassis 10 includes:

[0111] The housing 11 forms a receiving cavity, wherein the receiving cavity is used to receive the coolant and the heat generating component 20 immersed in the coolant;

[0112] A condenser 12 is provided in the accommodating cavity and is used to condense the coolant in gas phase;

[0113] A coolant interface 13 is provided on the housing 11;

[0114] The exhaust component 14 is located on the housing 11 and is at least used to exhaust the gas in the accommodating cavity when the coolant is injected into the accommodating cavity through the coolant interface 13 .

[0115] Here, the chassis 10 can be applied to electronic devices with high computing capabilities, such as computers, servers, and supercomputing devices. The chassis 10 can be used to set a heat-generating component 20 of the electronic device.

[0116] The heat generating component 20 may include a printed circuit board (PCB) with integrated circuit devices such as a processor. For example, the chassis 10 may be used to house a computing board 21 of a supercomputing device. One or more computing boards 21 may be placed in the housing.

[0117] In one embodiment, the heat generating component 20 includes: a power supply component of the electronic device and / or a control board of the electronic device.

[0118] Electronic devices with high computing power typically include a computing board 21, a power supply unit that provides power to the computing board 21, and a control board that coordinates the operation of the computing board 21. The power supply unit and the control board also generate heat. The power supply unit and the control board can also be immersed in the coolant to dissipate heat.

[0119] The housing 11 of the chassis 10 can be made of metal or non-metal material, and the housing forms a receiving cavity. A heat generating component 20 can be arranged at the lower part of the receiving cavity.

[0120] The heat-generating component 20 can be immersed in the coolant, and the heat-generating component 20 can exchange heat with the coolant, conduct the generated heat to the coolant, and thus reduce its own temperature.

[0121] After absorbing heat, the coolant undergoes a phase change, transforming from a liquid to a vapor. This phase transition absorbs heat generated by the heat-generating component 20. The area of the coolant chamber where the coolant resides can be referred to as the submerged section.

[0122] A condenser 12 may be provided above the accommodating chamber to condense the coolant in a vapor phase, converting it from a vapor phase to a liquid phase. During this conversion, the coolant releases heat to the condenser 12. The condenser 12 then exchanges the absorbed heat with the external environment, thereby dissipating heat from the heat-generating component 20.

[0123] The location of the accommodating cavity where the condenser 12 is located can be called a condensation section.

[0124] In one embodiment, the cooling liquid includes: a fluorinated liquid.

[0125] The coolant can be fluorinated liquid, etc. The boiling point of fluorinated liquid under atmospheric pressure is 40-65°C. The immersion liquid can be selected according to the chip temperature control conditions to ensure that the operating temperature inside the device is close to the external environment under working conditions, effectively avoiding leakage of immersion liquid gas.

[0126] There is a predetermined distance between the bottom of the condenser 12 and the surface of the coolant, namely the bubble bursting section. During the heat dissipation process of the heat generating component 20, the bubble bursting section is used to allow bubbles generated by the coolant to rise to the surface of the coolant and then burst to produce droplets and steam. The droplets fall directly into the immersion section under gravity, while the steam rises in the bubble bursting section and enters the connected condensation section to be condensed by the condenser 12. The predetermined distance can be 10 to 100 cm.

[0127] The cooling liquid interface 13 can be arranged at the bottom of the shell, so that more cooling liquid can be discharged during the cooling liquid discharge process. For example, the cooling liquid interface 13 can be arranged at the bottom of the shell, so that the cooling liquid can be completely discharged.

[0128] To facilitate operation, a heat-generating component 20 can be placed in the accommodating chamber, and then coolant can be injected into the accommodating chamber through the coolant interface 13. As the coolant is added, the pressure in the accommodating chamber increases. Gas in the accommodating chamber, such as air, coolant vapor, or a mixture of air and coolant vapor, can be discharged from the accommodating chamber through the exhaust component 14.

[0129] Since the gas is located above the coolant, an exhaust component 14 can be provided at the top of the accommodating chamber. The exhaust component 14 can be a valve or other component. It can be opened when the gas needs to be discharged and closed after the gas is discharged.

[0130] In one embodiment, the exhaust component 14 may be a passive exhaust component 14 , that is, the exhaust component 14 itself does not consume energy to drive the gas, but exhausts gas through the pressure difference between the inside and outside of the accommodating chamber.

[0131] In one embodiment, Figure 2 As shown, the exhaust component 14 includes a one-way valve 141 and a ball valve 142 .

[0132] On the gas exhaust path, a one-way valve 141 (also called a check valve) can be installed before the ball valve 142. The one-way valve 141 can prevent external air from entering the chamber when the pressure inside the chamber is lower than the external air pressure. The ball valve 142 can be used to control the on / off of the exhaust gas path.

[0133] During the normal pressure assembly and coolant injection process, a certain amount of air exists in the accommodating cavity. Since the air does not undergo phase change within the operating temperature range of the coolant, its effect on the heat dissipation process is relatively low. On the contrary, the presence of air reduces the working efficiency of the condenser 12, causing the two-phase operating temperature to rise and the operating pressure to increase, thereby damaging the structure of the chassis 10 and causing leakage.

[0134] Therefore, when injecting coolant, the coolant can be filled into the entire accommodating cavity, and all gas can be discharged through the exhaust component 14. This reduces the air in the accommodating cavity in the working state, improves the working efficiency of the condenser 12, and further improves the heat dissipation effect of the chassis 10.

[0135] In this way, by setting up an exhaust component 14 to discharge the gas in the accommodating cavity when the coolant is injected into the coolant interface 13, the air and other gases with poor heat exchange capacity during the phase change heat dissipation process are discharged, thereby improving the working efficiency of the condenser 12 and further improving the heat dissipation effect of the chassis 10.

[0136] In one embodiment, Figure 4As shown, the first surface 211 of the hash board 21 faces the top of the housing 11, and the angle between the first surface 211 and the vertical direction is greater than 0 degrees and less than 90 degrees, wherein the first surface 211 is provided with an integrated circuit device that generates heat.

[0137] Figure 4 for Figure 1 View in direction A. Figure 4 As shown, arrow B is the vertical direction, and the angle b between the first surface 211 and the vertical direction is greater than 0 degrees and less than 90 degrees.

[0138] The first surface 211 faces the top of the housing 11, that is, the first surface 211 faces the rising direction of the coolant bubbles. The computing board 21 can be tilted relative to the vertical direction.

[0139] In one embodiment, multiple computing boards 21 can be arranged in parallel.

[0140] In the immersion section, multiple computing boards 21 can be stacked in parallel and immersed in the coolant, with the spacing between adjacent computing boards 21 being 8 to 20 mm. The coolant level is approximately 5 to 55 mm higher than the top of the computing board 21, ensuring that all computing boards 21 are immersed in the coolant during the two-phase immersion heat exchange process.

[0141] In one embodiment, Figure 5 As shown, the integrated circuit device includes chipsets 212 arranged in a matrix.

[0142] Multiple rows of integrated circuits are arranged in parallel on the hashboard 21, forming a matrix-arranged chipset 212. This matrix-arranged chipset 212 features a small size, high heat flux density, and high total power. During operation, a large amount of heat is generated. The surfaces of the integrated circuits heat the coolant, creating bubbles on the surface.

[0143] If the hashboard 21 is set vertically, in the matrix-arranged integrated circuit devices, bubbles generated on the surface of the integrated circuit device below may float vertically upwards. During the floating process, they may cling to the surface of the integrated circuit device above, thereby occupying the space of the coolant on the surface of the integrated circuit device above. That is, the proportion of the vapor film on the surface of the integrated circuit device above is increased, thereby reducing the heat exchange capacity of the surface of the integrated circuit device above, resulting in poor heat dissipation.

[0144] If the hash board 21 is set horizontally, the surface of the integrated circuit device faces the direction of rising bubbles, and the edge of the surface of the integrated circuit device can be replenished with coolant in time. However, the middle position of the surface of the integrated circuit device cannot be cooled and replenished in time because bubbles rise all around it. This will also increase the proportion of vapor film in the middle position of the surface of the integrated circuit device, thereby reducing the heat exchange capacity of the surface of the integrated circuit device and causing poor heat dissipation.

[0145] Therefore, the computing board 21 can be placed at an angle. In the matrix-arranged integrated circuit devices, bubbles generated on the surface of the integrated circuit devices below will move vertically upward due to the buoyancy force. Due to the tilt of the computing board 21, the bubbles will pass by the surface of the integrated circuit devices above at a certain distance, reducing the situation where the rising bubbles are closely attached to the surface of the integrated circuit devices above, thereby reducing the proportion of the vapor film on the surface of the integrated circuit devices above. Compared with the vertical arrangement of the computing board 21, the heat exchange capacity of the surface of the integrated circuit devices above is improved. In addition, the disturbance generated during the bubble rise accelerates the generation and detachment process of bubbles on the surface of the integrated circuit devices above, increases the modal condensation heat transfer temperature difference and heat transfer coefficient, and further enhances the heat exchange capacity of the surface of the integrated circuit devices above.

[0146] In one embodiment, the angle between the first surface 211 and the vertical direction is greater than or equal to 5 degrees and less than or equal to 85 degrees.

[0147] In one embodiment, the angle between the first surface 211 and the vertical direction is 20 degrees.

[0148] Preferably, an angle of 20 degrees can be used, which can achieve a critical heat flux density of 50 to 500 W / cm2.

[0149] In one embodiment, a metal pore layer is provided on the chip surface of the integrated circuit device facing away from the first surface 211 , wherein the metal pore layer includes metal particles and pores between the metal particles.

[0150] The surface of the integrated circuit device facing away from the first surface 211 is the surface of the integrated circuit device that contacts the coolant and generates bubbles. Heat is transferred from the chip surface to the metal void structure through thermal conduction. The metal particles in the metal void structure have excellent thermal conductivity, and the pore structure provides a vaporization core for the coolant to boil and exchange heat. This improves heat conversion efficiency and, in turn, enhances the heat dissipation performance of the chassis 10.

[0151] For example, the thickness of the metal porous layer can be 10 to 500 μm, and the metal particles in the metal porous layer, that is, the metal powder can be copper powder with an average particle size of 20 to 300 μm, forming a pore structure of 5 to 200 μm, which provides a vaporization core for boiling heat exchange.

[0152] In one embodiment, a metal packaging shell of the chip is provided between the chip surface and the metal pore layer;

[0153] or,

[0154] A thermal conductive coating is provided between the chip surface and the metal pore layer.

[0155] Each chip in an integrated circuit device can have a metal encapsulation housing. A spray coating or deposition process can be used to form a 10-500 μm thick layer of metal powder structure on the outer surface of the metal encapsulation housing, facing away from the chip. This creates a metal porous layer. Heat generated by the chip can be conducted through the metal encapsulation housing to the metal porous layer. The metal powder is copper powder with an average particle size of 20-300 μm, forming a 5-200 μm porous structure that provides a vaporization core for boiling heat transfer.

[0156] The chip of an integrated circuit device may not have a metal package, that is, the chip is a bare chip without a housing. A thermally conductive coating can be applied to the chip surface, and a metal porous layer can be formed on the thermally conductive coating. Heat generated by the chip can be transferred to the metal porous layer through the thermally conductive coating.

[0157] In one embodiment, the thermal conductive coating comprises: a metal thermal conductive coating or a non-metal thermal conductive coating.

[0158] The thermal conductive coating may be a non-metallic thermal conductive coating such as a plastic layer, or a metal thermal conductive coating.

[0159] Exemplarily, a 5-50um plastic layer is plated on the chip surface by injection molding or spraying. Furthermore, the plastic layer contains a high thermal conductivity powder material, and a layer of metal powder structure with a thickness of 10-500um is sprayed on the plastic layer to form a metal pore layer. The metal powder is copper powder with an average particle size of 20-300um, forming a pore structure of 5um-200um. The pore structure provides a vaporization core for boiling heat exchange.

[0160] In one embodiment, Figure 3 As shown, the condenser 12 includes a condenser tube 121 , and the inner wall and / or outer wall of the condenser tube 121 is provided with rib-shaped protrusions.

[0161] Here, the condenser 12 may include a condenser tube 121 disposed above the coolant level. Condensate flows in the condenser tube 121 .

[0162] During the process of converting the coolant from the gas phase to the liquid phase, the coolant releases heat to the wall of the condenser tube 121. The condensate flowing through the condenser tube 121 can have a relatively low temperature. The condensate exchanges heat with the higher temperature wall of the condenser tube 121, thereby lowering the temperature of the wall of the condenser tube 121 and improving the effect of condensing the coolant.

[0163] The condensate includes, but is not limited to, water, ethanol, electronic fluorinated fluid and / or mineral oil.

[0164] The condensing tubes 121 may be arranged horizontally in one or more rows. The condensing tubes 121 may be arranged in an S-shape or in a disc shape, etc., which is not limited here.

[0165] The inner and / or outer walls of the condenser tube 121 are provided with rib-like protrusions. The rib-like protrusions on the inner wall increase the surface area of the inner wall of the condenser tube 121, thereby improving the heat exchange efficiency between the condensate and the condenser tube 121. The rib-like protrusions on the outer wall also increase the surface area of the outer wall of the condenser tube 121, thereby improving the heat exchange efficiency between the coolant and the condenser tube 121. This improves the phase change efficiency of the coolant, thereby enhancing the heat dissipation effect.

[0166] In one embodiment, the height of the rib-shaped protrusions is 0.1-5 mm.

[0167] In one embodiment, the condenser 12 is in contact with the inner wall of the top of the housing 11 .

[0168] In one embodiment, Figure 1 As shown, the electronic device further includes: an external heating component 30 arranged on the outer surface of the housing 11 .

[0169] The external heating component 30 may include: a power supply component of the electronic device and / or a control panel of the electronic device

[0170] For example, the top row of condenser tubes 121 in the multiple rows of condenser tubes 121 can be in direct contact with the top of the housing 11. The top of the housing 11 can be used to place external heat-generating components 30, such as power supply components and / or control boards of electronic devices. Heat-generating components 20 that are not suitable for immersion in coolant can be placed on the top of the housing 11.

[0171] In one embodiment, the rib-shaped protrusions are spirally arranged on the inner wall and / or the outer wall of the condenser 121 .

[0172] The rib-shaped protrusions are spirally arranged to further increase the surface area of the inner wall and / or outer wall, thereby improving the heat exchange efficiency between the coolant and the condenser tube 121, and / or between the coolant and the condenser tube 121. This improves the phase change efficiency of the coolant, thereby improving the heat dissipation effect.

[0173] In one embodiment, the cross section of the rib-shaped protrusion is V-shaped or U-shaped.

[0174] The coolant in the gas phase is more likely to change phase into the liquid phase at the tip, so the cross section of the rib-shaped protrusion can be set to a V-shape or a U-shape. This can promote the phase change efficiency of the coolant at the top of the rib-shaped protrusion, thereby improving the heat dissipation effect.

[0175] In one embodiment, the condenser 12 contains condensate, and the condenser 12 includes: a liquid inlet 1211 provided on the shell 11 for the condensate to flow in, and a liquid outlet 1212 provided on the shell 11 for the condensate to flow out;

[0176] The liquid inlet 1211 is connected to an external heat exchange device;

[0177] The liquid outlet 1212 is communicated with the heat exchange device.

[0178] The outer wall of the housing 11 may be provided with a liquid inlet 1211 and a liquid outlet 1212, so that the condensate in the condenser tube 121 flows into the heat exchange device for heat exchange with the external environment. The condensate can flow from the outside into the condenser tube 121 through the liquid inlet 1211, and after completing the heat exchange within the housing 11, it flows out through the liquid outlet 1212 and into the heat exchange device.

[0179] The heat exchange device is used to perform heat exchange between the condensate and the external environment, reduce the temperature of the condensate flowing out of the condenser tube 121 , and allow the cooled condensate to flow back into the condenser tube 121 from the liquid inlet 1211 .

[0180] Illustratively, the heat exchange device may include a first pipe connected to the liquid inlet 1211 and a second pipe connected to the liquid outlet 1212. The heat exchange device may include heat dissipation fins and a heat dissipation fan to dissipate heat from the condensate flowing through the heat exchange device.

[0181] In practical applications, the liquid inlet 1211 can be connected to the external cooling water, 40°C cooling water is introduced and the circulating water supply is maintained continuously, and then the power is turned on and started, and the chipset 212 arranged in a matrix on the printed circuit board begins to calculate. Since more than 99% of the electrical energy of the chipset 212 is released from the inside of the chip in the form of heat energy when the chipset 212 calculates, the fluorinated liquid with a phase change temperature of 51°C undergoes phase change boiling at around 51°C. Since phase change boiling is an efficient latent heat exchange, the chipset 212 is effectively cooled. During the boiling process, part of the liquid turns into steam, and the liquid level drops slightly, but it still effectively submerges the printed circuit board. Therefore, the phase change boiling heat exchange basically maintains the temperature of the chipset 212 at Between 51 and 58°C, bubbles generated from the surface of the chipset 212 float upward. Due to the plastic layer and expansion powder on the bare chip, a vaporization core for boiling heat exchange is generated, the boiling heat dissipation superheat is reduced, and the heat dissipation heat flux density is enhanced. At the same time, when the chip is arranged upward at an angle of 20°, bubbles generated on the surface of the lower chip move vertically upward under the action of buoyancy. When the bubbles pass over other chips on the same printed circuit board, the vapor film proportion of these chips is significantly reduced. At the same time, disturbances are generated during the rising process of the bubbles, which accelerates the generation and separation process of the upstream bubbles and improves the modal condensation heat transfer temperature difference and heat transfer coefficient. The critical heat flux density can reach 50 to 500 W / cm2 by adopting this solution.

[0182] Bubble rises to the liquid level of fluorinated liquid and enters the bubble burst section. At this moment, bubble is stressed and descends suddenly. Bubble bursts quickly. The droplet produced after the burst falls back into the fluorinated liquid under gravity, the steam produced then upwards migrates to the condensation section. The inwall and outer wall of the serpentine condensing tube 121 in the condensation section all have the serpentine coil with inverted V-type spiral microgrooves to directly contact with steam. The height of the spiral microgrooves can be selected to be 0.1~0.5mm, and the V-type opening angle can be selected to be 30~135 °. The spiral microgrooves have increased the surface area of the serpentine coil. Because 40 ℃ of cooling water are arranged in the serpentine coil, the serpentine coil surface temperature is lower, and fluorinated liquid steam condenses on the serpentine coil surface. Condensate drips onto the submerged section fluorinated liquid surface of bottom under gravity. Complete with regard to fluorinated liquid from liquid evaporation, bubble growth and rising, bubble burst, the whole cycle of steam condensation and condensation that also flows back. Figure 6 is an axial cross-sectional view of an exemplary section of the serpentine condenser tube 121, as shown in FIG. Figure 6 As shown, the outside of the serpentine condenser tube 121 is provided with V-shaped spiral micro grooves.

[0183] In one embodiment, the housing 11 includes: a first housing and a second housing, wherein the first housing tightly covers the second housing to form the accommodating cavity.

[0184] The first shell and the second shell can be sealed by using a sealing ring and a sealing glue. The first shell can be a shell cover located at the upper part, and the second shell can be a shell bottom located at the lower part.

[0185] In one embodiment, the condenser 12 can be disposed in the first housing, and the heat generating component 20 can be disposed in the second housing, so that the condenser 12 and the heat generating component 20 can be maintained separately when the first housing and the second housing are separated.

[0186] In an embodiment of the present invention, Figure 7 As shown, a chassis 10 exhaust method is provided, characterized in that it is applied to Figure 1 The electronic device shown, the method includes:

[0187] Step 701: a first liquid level of the coolant in the accommodating chamber formed by the housing 11 of the chassis 10 of the electronic device is lower than the condenser 12, and the condenser 12 is used to condense the gas in the accommodating chamber to a first temperature;

[0188] Step 702: inject the coolant into the accommodating chamber through the coolant interface 13 to a second liquid level position, and discharge the gas in the accommodating chamber through the exhaust component 14, wherein the second liquid level position is higher than the first liquid level position.

[0189] The first liquid level position may be the liquid level position of the cooling liquid when the chassis 10 is used for the first time, by injecting the cooling liquid into the chassis 10. It may also be the liquid level position of the cooling liquid during the use of the chassis 10.

[0190] In one embodiment, the first liquid level is higher than the heat-generating component 20 .

[0191] The first liquid level is higher than the heat generating component 20 in the dissolving chamber, that is, when the coolant is at the first liquid level, the coolant submerges the heat generating component 20 .

[0192] Here, the first temperature may be lower than a phase transition temperature of the coolant.

[0193] When the coolant is at the first liquid level, a gas space exists above the first liquid level. The gas in this space may be a mixture of air and vapor-phase coolant. Condenser 12 controls the gas temperature to the first temperature, condenses the vapor-phase coolant into a liquid phase, and reduces the vapor-phase coolant in the mixed gas.

[0194] In one embodiment, using the condenser 12 to condense the gas in the accommodating chamber to the first temperature may include: using the condenser 12 to condense the gas in the accommodating chamber to the first temperature for a first predetermined period of time.

[0195] Continuing the first predetermined time period can condense more gaseous coolant into the liquid phase, reducing the gaseous coolant in the mixed gas. The first predetermined time period can be determined based on the amount of gaseous coolant in the mixed gas. If the mixed gas contains a large amount of gaseous coolant, a longer first predetermined time period can be set. The first predetermined time period can be 5 minutes, 0.5 hours, or the like.

[0196] Coolant can be injected into the accommodating chamber from the coolant interface 13 to raise the coolant to the second liquid level. As the coolant level rises, the gas pressure in the accommodating chamber increases, and can be discharged from the exhaust component 14. The exhaust component 14 can be arranged on the top of the housing 11.

[0197] In one embodiment, the second liquid level position is the liquid level position when the accommodating chamber is filled with the cooling liquid.

[0198] The higher the second liquid level is, the more gas is discharged. The second liquid level is the liquid level when the accommodating chamber is filled with the cooling liquid, that is, when the cooling liquid is at the second liquid level, all gas in the accommodating chamber can be discharged.

[0199] After exhausting the gas in the accommodating chamber, some of the coolant can be exhausted to a working level. The working level can be any position below the condenser 12 and above the heat-generating component 20, such as the first level. After exhausting some of the coolant to a certain level, the exhaust component 14 can be closed. This reduces the amount of air that re-enters the accommodating chamber while the coolant is being exhausted.

[0200] For example, when injecting coolant for the first time, you can first inject coolant into the accommodating cavity through the coolant interface 13 to about 3 cm above the printed circuit board (computing board), connect the serpentine coil condenser 121 to the external cooling water (condensate), pass 40°C cooling water and maintain continuous circulating water supply for about 5 minutes, basically cooling the gas phase temperature to 40°C, then open the exhaust component 14, and inject coolant and flush the liquid pipe mouth into the accommodating cavity through the coolant interface 13, continue filling the liquid, and as the liquid level rises, air and a small amount of fluorinated liquid vapor are discharged from the exhaust component 14 until all the gas is discharged. For example: after fluorinated liquid flows out of the exhaust pipe, stop filling the liquid and close the exhaust component 14.

[0201] For example, during the operation of the electronic device, if there is a sealing problem with the housing 11 or air in the fluorinated liquid overflows from the liquid phase, the air needs to be discharged. The specific method is to keep the cooling water circulating and cut off the power supply of the printed circuit board (that is, the heating component 20 stops heating), and continue to run for about 0.5 hours so that more gaseous coolant condenses. At this time, the coolant is injected through the coolant interface 13, and the exhaust component 14 is opened to discharge the mixed gas inside the housing 11. When the fluorinated liquid is full, the coolant injection is stopped and the exhaust component 14 is closed. Finally, part of the fluorinated liquid is discharged from the coolant interface 13 until the liquid level reaches 3 cm on the printed circuit board, and the coolant interface 13 is closed to complete the emptying of the residual air.

[0202] When the fluorine liquid needs to be replaced, regenerated, or the printed circuit board (computing board) needs to be repaired, keep the exhaust component 14 closed, take the fluorine liquid from the coolant interface 13, complete the fluorine liquid regeneration, or use new fluorine liquid to refill the liquid.

[0203] The boiling point of the fluorinated liquid used is selected based on operating and environmental conditions. Fluorinated liquids with a phase transition temperature of 47°C, 51°C, 56°C, or 61°C at 1 atm can be selected. Fluorinated liquids are non-toxic, harmless, non-corrosive, and insulating agents used for cleaning circuit boards, providing excellent protection for electronic devices.

[0204] Due to the low phase transition temperature of air, phase transition heat transfer cannot occur during normal operation of chassis 10, reducing the condensing efficiency of condenser 12. Since the air remains in a gaseous state during operation of condenser 12, as the temperature rises, the pressure within housing 11 increases, raising the phase transition temperature of the coolant and reducing the cooling efficiency. This increased pressure within housing 11 negatively impacts the reliability of components within housing 11 and compromises the sealing of housing 11.

[0205] Therefore, by discharging as much air as possible, the condensation effect of the condenser 12 can be improved, the phase change heat dissipation effect can be improved, and the working stability of the electronic equipment can be improved.

[0206] In one embodiment, before condensing the gas in the accommodating chamber to the first temperature using the condenser 12, the method further includes:

[0207] The cooling liquid is heated to a second temperature by using a heat generating component 20 immersed in the cooling liquid, wherein the second temperature is higher than the first temperature.

[0208] Before exhausting the gas, the coolant can be heated to a second temperature by a heating component, such as a computing board. Increasing the coolant temperature can cause the air dissolved in the coolant to overflow from the liquid phase coolant into the mixed gas, and then be discharged from the exhaust component 14.

[0209] In one embodiment, heating the coolant to a second temperature may include: heating the coolant to the second temperature for a second predetermined period of time.

[0210] Maintaining the first predetermined time period allows air to continue to overflow from the coolant, thereby increasing the amount of air discharged. The second predetermined time period may be 5 minutes, or 0.5 hours, or the like.

[0211] In one embodiment, the second temperature is greater than or equal to a phase transition temperature of the cooling liquid.

[0212] Raising the coolant temperature to the phase change temperature causes the coolant to vaporize. The vaporization of the coolant can increase the overflow of the air dissolved in the coolant, thereby discharging more air.

[0213] In one embodiment, the method further comprises:

[0214] Discharge the coolant from the accommodating cavity to a third liquid level through the coolant interface 13, wherein the third liquid level is lower than the second liquid level and higher than the first liquid level;

[0215] Cooling liquid is injected into the accommodating chamber to a second liquid level position through the cooling liquid interface 13 , and the gas in the accommodating chamber is discharged through the exhaust component 14 .

[0216] By injecting coolant into the accommodating chamber through the coolant interface 13 to a second liquid level, and exhausting the gas in the accommodating chamber through the exhaust component 14, the coolant can be discharged to a third liquid level, thereby generating a negative pressure in the accommodating chamber. Air dissolved in the coolant can further overflow from the coolant. When coolant is again injected into the accommodating chamber to the second liquid level, the overflowed air can be discharged from the housing 11, reducing the amount of air in the accommodating chamber and improving the condensation effect.

[0217] In one embodiment, the coolant may be maintained at a third liquid level for a third predetermined period of time.

[0218] Maintaining the third predetermined time period allows air to continue to overflow from the coolant, thereby increasing the amount of exhausted air. The third predetermined time period may be 5 minutes, or 0.5 hours, or the like.

[0219] The methods disclosed in the several method embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method embodiments.

[0220] The features disclosed in the several product embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new product embodiments.

[0221] The features disclosed in several method or product embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method embodiments or product embodiments.

[0222] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the claims.

[0223] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A chassis, characterized in that: The chassis includes: The housing forms a receiving cavity, wherein the receiving cavity is used to receive a coolant and a heat generating component immersed in the coolant; The condenser is arranged in the accommodating cavity; the coolant interface is arranged on the shell; The condenser is used to condense the gas in the accommodating chamber to a first temperature after the coolant is injected into the accommodating chamber through the coolant interface to a first liquid level, so as to reduce the gas phase coolant in the gas; an exhaust component, located on the housing, and at least used to exhaust gas in the accommodating chamber when the coolant is injected into the accommodating chamber through the coolant interface to a second liquid level position; the second liquid level position is higher than the first liquid level position; The condenser includes a condenser tube, and the inner wall and / or outer wall of the condenser tube is provided with rib-shaped protrusions.

2. The chassis according to claim 1, wherein: The rib-shaped protrusions are spirally arranged on the inner wall and / or the outer wall of the condenser.

3. The chassis according to claim 1, wherein: The cross section of the rib-shaped protrusion is V-shaped or U-shaped.

4. The chassis according to claim 1, wherein: The condenser has condensate in it, and the condenser comprises: a liquid inlet provided on the shell for the condensate to flow in, and a liquid outlet provided on the shell for the condensate to flow out; The liquid inlet is connected to an external heat exchange device; The liquid outlet is communicated with the heat exchange device.

5. The chassis according to claim 1, wherein: The condenser is in contact with an inner wall of the top of the housing.

6. The chassis according to any one of claims 1 to 5, characterized in that: The housing comprises a first housing and a second housing, wherein the first housing tightly covers the second housing to form the accommodating cavity.

7. The chassis according to any one of claims 1 to 5, characterized in that: The exhaust component includes a one-way valve and a ball valve.

8. An electronic device, characterized in that: include: The chassis according to any one of claims 1 to 7; a cooling liquid contained in the accommodating cavity formed by the shell of the chassis; A heat-generating component immersed in the coolant, wherein the heat-generating component includes at least one computing board.

9. The electronic device according to claim 8, wherein: The first surface of the hash board faces the top of the housing, and an angle between the first surface and a vertical direction is greater than 0 degrees and less than 90 degrees, wherein the first surface is provided with an integrated circuit device that generates heat.

10. The electronic device according to claim 9, characterized in that The integrated circuit device includes a chipset arranged in a matrix.

11. The electronic device according to claim 9, wherein: An angle between the first surface and the vertical direction is greater than or equal to 5 degrees and less than or equal to 85 degrees.

12. The electronic device according to claim 11, wherein: The angle between the first surface and the vertical direction is 20 degrees.

13. The electronic device according to claim 9, wherein A metal pore layer is provided on a chip surface of the integrated circuit device facing away from the first surface, wherein the metal pore layer includes metal particles and pores between the metal particles.

14. The electronic device according to claim 13, wherein: A metal packaging shell of the chip is provided between the chip surface and the metal pore layer; or, A thermal conductive coating is provided between the chip surface and the metal pore layer.

15. The electronic device according to claim 14, characterized in that The thermal conductive coating includes: a metal thermal conductive coating or a non-metal thermal conductive coating.

16. The electronic device according to claim 8, characterized in that The heat generating component includes: a power supply component of the electronic device and / or a control board of the electronic device.

17. The electronic device according to any one of claims 8 to 16, characterized in that: The electronic device further comprises an external heating component arranged on the outer surface of the housing.

18. The electronic device according to any one of claims 8 to 16, characterized in that: The cooling liquid includes: fluorinated liquid.

19. A chassis exhaust method, characterized in that: Applied to the electronic device of any one of claims 8 to 18, the method comprising: A first liquid level of the coolant in the accommodating chamber formed by the housing of the electronic device is lower than that of the condenser, and the condenser is used to condense the gas in the accommodating chamber to a first temperature to reduce the gaseous coolant in the gas; the condenser condensing the gas in the accommodating chamber includes: rib-shaped protrusions provided on the inner wall and / or outer wall of the condenser tube of the condenser condensing the gas; The coolant is injected into the accommodating chamber through a coolant interface to a second liquid level position, and the gas in the accommodating chamber is discharged through an exhaust component, wherein the second liquid level position is higher than the first liquid level position.

20. The method according to claim 19, characterized in that Before condensing the gas in the accommodating chamber to the first temperature using the condenser, the method further includes: A heat-generating component immersed in the coolant is used to heat the coolant to a second temperature, wherein the second temperature is higher than the first temperature.

21. The method according to claim 20, characterized in that The second temperature is greater than or equal to a phase change temperature of the coolant.

22. The method according to claim 19, wherein The method further comprises: Discharging the coolant from the accommodating cavity to a third liquid level through the coolant interface, wherein the third liquid level is lower than the second liquid level and higher than the first liquid level; Cooling liquid is injected into the accommodating cavity through the cooling liquid interface to a second liquid level position, and the gas in the accommodating cavity is discharged through the exhaust component.

23. The method according to any one of claims 19 to 22, characterized in that The second liquid level position is the liquid level position when the accommodating cavity is filled with the cooling liquid.

24. The method according to any one of claims 19 to 22, characterized in that The first liquid level is higher than the heat-generating component.

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