Display panel and display device

Abstract

An embodiment of the present invention provides a display panel and a display device, relating to the field of display technologies, and effectively dissipating heat from an optical component setting area. The display panel includes: a display area including an optical component setting area and at least a part of a first display area surrounding the optical component setting area; a heat dissipation substrate; and an array layer located on a side of the heat dissipation substrate facing the light-emitting direction of the display panel. Among them, the heat dissipation substrate includes a heat dissipation base layer and a thermal radiation micro-nano structure. In a direction perpendicular to the plane where the display panel is located, the heat dissipation base layer covers the display area, the thermal radiation micro-nano structure is located in the optical component setting area, and the thermal radiation micro-nano structure is located between the heat dissipation base layer and the array layer.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and particularly to a display panel and a display device.

Background Art

[0002] In recent years, with the continuous improvement of users' demands for watching movies, entertainment, etc., electronic devices with a high screen-to-body ratio have been highly favored by the market. Currently, the display area of a display panel usually includes an optical component setting area. By embedding optical components such as cameras under the screen in the optical component setting area, a holeless full-screen design can be achieved.

[0003] However, based on the existing display panel structure, the optical component setting area generates serious heat during image display, and the heat accumulation causes significant changes in the device characteristics in the optical component setting area, thereby resulting in obvious differences in the device lifetimes and the displayed images between the optical component setting area and the conventional display area.

Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a display panel and a display device for effectively dissipating heat from the optical component setting area.

[0005] On the one hand, an embodiment of the present invention provides a display panel, including:

[0006] A display area, including an optical component setting area and at least a part of a first display area surrounding the optical component setting area;

[0007] A heat dissipation substrate;

[0008] An array layer located on a side of the heat dissipation substrate facing the light-emitting direction of the display panel;

[0009] Wherein, the heat dissipation substrate includes a heat dissipation base layer and a thermal radiation micro-nano structure. In a direction perpendicular to the plane where the display panel is located, the heat dissipation base layer covers the display area, the thermal radiation micro-nano structure is located in the optical component setting area, and the thermal radiation micro-nano structure is located between the heat dissipation base layer and the array layer.

[0010] On the other hand, an embodiment of the present invention provides a display device, including the above display panel.

[0011] One of the above technical solutions has the following beneficial effects:

[0012] In the embodiments of the present invention, when the display panel performs screen display, the heat generated by the light emission of the display device in the optical component setting area is radiated to the surrounding first display area through the thermal radiation micro-nano structure, and then the heat in the first display area is conducted to the surrounding environment through the heat dissipation base layer. In this way, the heat generated in the optical component setting area can be dissipated in time, avoiding adverse effects on the performance of the display device and the transistor caused by heat accumulation.

[0013] It can be seen that by setting the heat dissipation base layer and the thermal radiation micro-nano structure, the embodiments of the present invention can effectively dissipate heat from the optical component setting area, making the life attenuation rate and device characteristics of the devices in the optical component setting area consistent with those of the first display area, thereby effectively reducing the color brightness difference between the displayed images in the optical component setting area and the first display area and optimizing the performance of the display panel.

[0014] In addition, it should be noted that in the prior art, considering the influence of heat generation on device performance, the design of the sub-pixel aperture area in the optical component setting area is subject to greater limitations. However, in the embodiments of the present invention, since the heat dissipation substrate can dissipate the heat in the optical component setting area, the design limitations on the aperture area caused by considering the heat generation factor can be ignored. That is to say, on the premise of ensuring a high light transmittance, the embodiments of the present invention set the sub-pixel aperture area smaller to increase the pixel density of the optical component setting area to a greater extent. For example, the pixel density of the optical component setting area can be increased to be the same as that of the first display area, thereby further weakening the display difference between the optical component setting area and the first display area and optimizing the display effect.

Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a top view of the display panel provided by the embodiments of the present invention;

[0017] Figure 2 It is a schematic structural diagram of the display panel provided by the embodiments of the present invention;

[0018] Figure 3 It is Figure 2 A cross-sectional view along the A1-A2 direction;

[0019] Figure 4 It is another schematic structural diagram of the thermal radiation micro-nano structure provided by the embodiments of the present invention;

[0020] Figure 5 Another structural schematic diagram of the thermal radiation micro-nano structure provided by the embodiment of the present invention;

[0021] Figure 6 Another structural schematic diagram of the heat dissipation substrate provided by the embodiment of the present invention;

[0022] Figure 7 Another structural schematic diagram of the heat dissipation substrate provided by the embodiment of the present invention;

[0023] Figure 8 Another structural schematic diagram of the heat dissipation substrate provided by the embodiment of the present invention;

[0024] Figure 9 Another structural schematic diagram of the heat dissipation substrate provided by the embodiment of the present invention;

[0025] Figure 10 A structural schematic diagram of the display device provided by the embodiment of the present invention.

Specific Embodiments

[0026] In order to better understand the technical solution of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] It should be clear that the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0028] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms of "a", "the" and "said" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0029] It should be understood that the term " / and" used herein is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0030] As described in the background art, the display area of the existing display panel includes an optical component setting area. In the traditional design method, generally, the pixel density of the optical component setting area is set to be significantly less than that of the conventional display area. By reducing the pixel density, the occlusion of ambient light by sub-pixels is reduced, thereby ensuring a relatively high light transmittance in the optical component setting area. However, with this setting method, the pixel density difference between the optical component setting area and the conventional display area is obvious, and thus the difference in the displayed images of the two areas is also relatively obvious, affecting the user's viewing experience.

[0031] Therefore, the prior art further proposes a design method: to increase the pixel density of the optical component setting area to a certain extent, and then set the aperture area of the sub-pixels in the optical component setting area to be smaller than that of the sub-pixels in the conventional display area, so as to weaken the pixel density difference between the two areas on the premise of ensuring that the optical component setting area has sufficient light transmittance.

[0032] However, the inventor's research found that after reducing the aperture area of the sub-pixels in the optical component setting area, although the purpose of increasing the pixel density of the optical component setting area can be achieved, if the optical component setting area wants to display the same brightness as the conventional display area, the current density flowing through the sub-pixels in the optical component setting area will increase significantly. The increase in current density will cause the display device to generate serious heat, and then a large amount of heat will accumulate in the optical component setting area. The heat accumulation will accelerate the aging of the display device in the optical component setting area and affect the device characteristics of the transistors in this area. As the usage time increases, the difference in the service life of the devices between the optical component setting area and the conventional display area and the difference in the color brightness of the displayed images are still obvious, so it will still have an adverse impact on the performance of the display panel.

[0033] In response to this, the embodiment of the present invention provides a display panel. Based on the structural design of the display panel, effective heat dissipation can be carried out on the optical component setting area, thereby reducing the influence of heat accumulation on the device performance in the optical component setting area.

[0034] As Figure 1 shown, Figure 1 is a top view of the display panel provided by the embodiment of the present invention. The display panel includes a display area 1, and the display area 1 includes an optical component setting area 2 and at least a part of the first display area 3 surrounding the optical component setting area 2. Among them, the first display area 3 is a conventional display area, and the optical component setting area 2 is an area for setting optical components such as cameras. Ambient light enters the camera through the optical component setting area 2 to realize the camera function of the display panel. It should be noted that, Figure 1 the shape of the optical component setting area 2 shown is only for illustrative purposes. In actual applications, the optical component setting area 2 can be any shape such as a circle or a square.

[0035] As shown in Figure 2 and Figure 3 shown, Figure 2 FIG. is a schematic structural diagram of a display panel provided by an embodiment of the present invention, Figure 3 is Figure 2 a cross-sectional view along the A1-A2 direction. The display panel further includes a heat dissipation substrate 4 and an array layer 5 located on one side of the heat dissipation substrate 4 facing the light-emitting direction of the display panel. Among them, the heat dissipation substrate 4 includes a heat dissipation base layer 6 and a thermal radiation micro-nano structure 7. In the direction perpendicular to the plane where the display panel is located, the heat dissipation base layer 6 covers the display area 1, and the thermal radiation micro-nano structure 7 is located in the optical component setting area 2, and the thermal radiation micro-nano structure 7 is located between the heat dissipation base layer 6 and the array layer 5. The array layer 5 includes display devices and transistors. The display devices are used to emit light under the action of the driving current provided by the transistors to realize the normal display of the display panel.

[0036] In the embodiment of the present invention, when the display panel performs a picture display, the heat generated by the light emission of the display devices in the optical component setting area 2 is radiated to the surrounding first display area 3 through the thermal radiation micro-nano structure 7, and then the heat in the first display area 3 is conducted to the surrounding environment through the heat dissipation base layer 6. In this way, the heat generated in the optical component setting area 2 can be dissipated in time, avoiding adverse effects on the performance of the display devices and transistors caused by heat accumulation.

[0037] It can be seen that by providing the heat dissipation base layer 6 and the thermal radiation micro-nano structure 7, the embodiment of the present invention can effectively dissipate heat from the optical component setting area 2, so that the life attenuation rate of the devices in the optical component setting area 2 and the device characteristics are consistent with those of the first display area 3, thereby effectively reducing the color brightness difference between the pictures displayed in the optical component setting area 2 and the first display area 3 and optimizing the performance of the display panel.

[0038] In addition, it should be noted that in the prior art, considering the influence of heat generation on the device performance, the design of the sub-pixel aperture area in the optical component setting area 2 needs to be greatly restricted. In the embodiment of the present invention, since the heat dissipation substrate 4 can dissipate the heat in the optical component setting area 2, the design restriction on the aperture area caused by considering the heat generation factor can be ignored. That is to say, on the premise of ensuring a high light transmittance, the embodiment of the present invention sets the aperture area of the sub-pixels smaller to increase the pixel density of the optical component setting area 2 to a greater extent. For example, the pixel density of the optical component setting area 2 can be increased to be the same as that of the first display area 3, thereby further weakening the display difference between the optical component setting area 2 and the first display area 3 and optimizing the display effect.

[0039] In a feasible implementation manner, refer to Figure 2, the thermal radiation micro-nano structure 7 includes a plurality of periodically arranged ring structures 11 distributed in concentric circles. The material of the ring structure 11 includes metal or alloy. For example, the material of the ring structure 11 includes metallic nickel, or the material of the ring structure 11 includes titanium-aluminum-titanium alloy.

[0040] In this setting mode, the thermal radiation micro-nano structure 7 is a two-dimensional grating structure. This kind of metal grating structure can achieve a higher radiation efficiency through the surface plasmon resonance effect and the microcavity resonance effect, and further radiate the heat in the optical component setting area 2 to the first display area 3 to a greater extent.

[0041] Furthermore, as Figure 4 and Figure 5 shown, Figure 4 is another structural schematic diagram of the thermal radiation micro-nano structure provided by the embodiment of the present invention. Figure 5 is still another structural schematic diagram of the thermal radiation micro-nano structure provided by the embodiment of the present invention. In the direction perpendicular to the plane where the display panel is located, the center O1 of the concentric circles coincides with the geometric center O2 of the orthographic projection of the optical component setting area 2, and the orthographic projection of the outermost ring structure 11 contacts the edge of the orthographic projection of the optical component setting area 2.

[0042] Exemplarily, referring to Figure 4 , when the shape of the orthographic projection of the optical component setting area 2 is circular, the geometric center O2 of the orthographic projection of the optical component setting area 2 is the center of the circle, and the orthographic projection of the outermost ring structure 11 contacting the edge of the orthographic projection of the optical component setting area 2 can be that the orthographic projection of the outermost ring structure 11 coincides with the edge of the orthographic projection of the optical component setting area 2.

[0043] Or, referring to Figure 5 , when the shape of the orthographic projection of the optical component setting area 2 is square, the geometric center O2 of the orthographic projection of the optical component setting area 2 is the intersection of the diagonals of the square, and the orthographic projection of the outermost ring structure 11 contacting the edge of the orthographic projection of the optical component setting area 2 can be that the orthographic projection of the outermost ring structure 11 intersects with the edge of the orthographic projection of the optical component setting area 2.

[0044] In this setting mode, the plurality of ring structures 11 expand outward with the geometric center O2 of the orthographic projection of the optical component setting area 2 as the center O1 of the concentric circles. The thermal radiation micro-nano structure 7 dissipates heat evenly from different positions of the optical component setting area 2, improves the heat dissipation uniformity, and further reduces the lifespan difference of the devices at different positions inside the optical component setting area 2 and the color brightness difference of the displayed pictures.

[0045] Furthermore, referring to Figure 4 and Figure 5, the distance between two adjacent ring structures 11 is d1, where 8 μm ≤ d1 ≤ 12 μm. For example, d1 = 10 μm. At this time, the distance between two adjacent ring structures 11 is appropriate, which not only avoids the over-dense arrangement of the ring structures 11 and reserves enough space for heat dissipation, but also avoids the over-sparse arrangement of the ring structures 11. When the area of the optical component setting area 2 is fixed, more ring structures 11 can be set to improve the heat dissipation effect.

[0046] In a feasible implementation manner, referring to Figure 4 and Figure 5 , in the direction perpendicular to the plane of the display panel, the width of the ring structure 11 in the direction perpendicular to its extension direction is d2, T is the arrangement period of the ring structure 11. When the arrangement period of the ring structure 11 is fixed, by adjusting the duty cycle of the two-dimensional grating structure, the cavity of the two-dimensional grating structure can be adjusted, and then the radiation efficiency of the micro-nano structure can be changed. By setting the duty cycle between 0.4 and 0.6, the micro-nano structure can have a relatively high radiation efficiency. Further, it can be equal to 0.5, and at this time the radiation efficiency is higher.

[0047] In a feasible implementation manner, as Figure 6 shown, Figure 6 is another schematic structural diagram of the heat dissipation substrate provided by the embodiment of the present invention. The heat dissipation substrate layer 6 includes a first composite heat dissipation film 8, a diamond nano-film 9, and a second composite heat dissipation film 10.

[0048] Among them, the first composite heat dissipation film 8 includes a first substrate layer 12 and heat-conducting particles 13 doped in the first substrate layer 12. The material of the first substrate layer 12 may specifically include flexible materials such as polyimide (PI). The first composite heat dissipation film 8 can be formed by a coating process. By doping heat-conducting particles 13 in the first substrate layer 12, the heat-conducting particles 13 are in contact with each other, forming a continuous particle chain in the first substrate layer 12, promoting the formation of a heat conduction path and a heat conduction network, so as to promote the first composite heat dissipation film 8 to have a relatively high thermal conductivity.

[0049] The diamond nano-film 9 is located on the side of the first composite heat dissipation film 8 facing the light-emitting direction of the display panel. The diamond nano-film 9 has excellent properties such as high hardness, high thermal conductivity, high elastic modulus, and excellent chemical stability, and has rollability. It can be specifically formed by a hot filament chemical vapor deposition (HFCVD) process.

[0050] The second composite heat dissipation film 10 is located on the side of the diamond nanometer film 9 facing the light-emitting direction of the display panel. The second composite heat dissipation film 10 includes a second substrate layer 14 and heat-conducting particles 13 doped in the second substrate layer 14. The material of the second substrate layer 14 may specifically include flexible materials such as PI, and the second composite heat dissipation film 10 can be formed by a coating process. By doping the heat-conducting particles 13 in the second substrate layer 14, the heat-conducting particles 13 are in contact with each other, forming a continuous particle chain in the second substrate layer 14, promoting the formation of a heat conduction path and a heat conduction network, thereby enabling the second composite heat dissipation film 10 to have a relatively high heat conductivity.

[0051] By making the heat dissipation base layer 6 adopt the above-mentioned laminated structure, not only can the heat dissipation base layer 6 achieve better heat dissipation performance, but also the heat dissipation base layer 6 with this structure is similar to the laminated structure of the flexible substrate in the existing display panel. Therefore, in the embodiment of the present invention, the heat dissipation base layer 6 can also be reused as the substrate of the display panel, that is, the heat dissipation base layer 6 has both the functions of a substrate and heat dissipation. At this time, there is no need to set an additional substrate structure for the display panel, reducing the module thickness of the display panel.

[0052] In a feasible implementation manner, as Figure 7 shown, Figure 7 is another schematic structural diagram of the heat dissipation substrate provided by the embodiment of the present invention. The heat-conducting particles 13 include heat-conducting nanoparticles 15 and heat-conducting microparticles 16. By doping two kinds of heat-conducting particles 13 with different sizes in the first substrate layer 12 and the second substrate layer 14, the heat-conducting nanoparticles 15 can further fill the gaps between the heat-conducting microparticles 16, improving the filling density, and making the heat-conducting particles 13 contact each other to a greater extent, thus being beneficial to further improving the heat conduction performance of the first composite heat dissipation film 8 and the second composite heat dissipation film 10.

[0053] Furthermore, the heat-conducting nanoparticles 15 include modified three-dimensional structure diamond nanoparticles (n-ND), and the heat-conducting microparticles 16 include modified two-dimensional layered structure microparticle boron nitride particles (m-BN). On the one hand, both the modified three-dimensional structure diamond nanoparticles and the modified two-dimensional layered structure microparticle boron nitride particles are high heat-conducting particles 13 and have high electrical conductivity, which can improve the heat conduction performance; on the other hand, by doping the modified three-dimensional structure diamond nanoparticles in the first substrate layer 12 and the second substrate layer 14, it is also beneficial to the adhesion of the diamond nanometer film 9 on the first composite heat dissipation film 8, thereby improving the adhesion force between the first composite heat dissipation film 8, the diamond nanometer film 9 and the second composite heat dissipation film 10, and avoiding the situation of film layer detachment.

[0054] In a feasible embodiment, in order to improve the heat dissipation performance of the first composite heat dissipation film 8 and the second composite heat dissipation film 10, the mass ratio of the thermally conductive micron particles 16 and the thermally conductive nanoparticles 15 is n1, 7≤n1≤10, for example, the mass ratio of the modified two-dimensional layered structure micron boron nitride particles and the modified three-dimensional structure diamond nanoparticles is 9:1, that is, n1=9.

[0055] In a feasible implementation, the total mass filling amount of the thermally conductive particles 13 is n2, 20%≤n2≤40%, for example, the total mass filling amount of the modified two-dimensional layered micron boron nitride particles and the modified three-dimensional diamond nanoparticles is n2=30%. Setting the minimum value of the total mass filling amount of the thermally conductive particles 13 to 20% can avoid too few thermally conductive particles 13 doped in the substrate, ensuring that the first composite heat dissipation film 8 and the second composite heat dissipation film 10 have good heat dissipation performance. By setting the maximum value of the total mass filling amount of the thermally conductive particles 13 to 40%, it can also avoid too many thermally conductive particles 13 doped in the substrate to affect the flexibility of the substrate.

[0056] The inventors have found that when the mass ratio of modified two-dimensional layered structure micron boron nitride particles and modified three-dimensional structure diamond nanoparticles is n1=9, and the total mass filling amount of modified two-dimensional layered structure micron boron nitride particles and modified three-dimensional structure diamond nanoparticles is n2=30%, compared with the ordinary substrate layer, the thermal conductivity of the substrate layer doped with thermally conductive ions is increased by 3.5 times. At this time, the substrate layer doped with thermally conductive ions has both good thermal stability and electrical insulation, and can better meet the use requirements.

[0057] In a possible implementation, Figure 8 As shown, Figure 8 Another structural schematic diagram of the heat dissipation substrate provided in an embodiment of the present invention, the surface of the diamond nanofilm 9 facing the second composite heat dissipation film 10 has a protrusion 17, and the height of the protrusion 17 in the direction perpendicular to the plane where the display panel is located is less than or equal to 25nm, that is, the surface roughness of the diamond nanofilm 9 is less than or equal to 25nm.

[0058] With such a configuration, the roughness of the diamond nanofilm 9 is relatively small, which not only improves the adhesion between the diamond nanofilm 9 and the second composite heat dissipation film 10, but also makes the surface of the entire heat dissipation base layer 6 smoother, thereby improving the film flatness of the array layer 5 on the heat dissipation substrate 4, so that the heat dissipation base layer 6 can be better reused as a substrate for the display panel.

[0059] In a possible implementation, Figure 9 As shown, Figure 9Another structural schematic diagram of the heat dissipation substrate provided by the embodiment of the present invention. The heat dissipation substrate 4 further includes a first insulating layer 18 located between the thermal radiation micro-nano structure 7 and the heat dissipation base layer 6, and a second insulating layer 19 located between the thermal radiation micro-nano structure 7 and the array layer 5, so as to utilize the first insulating layer 18 and the second insulating layer 19 to play the roles of insulation and protection. Moreover, by disposing the second insulating layer 19 on the upper side of the thermal radiation micro-nano structure 7, the flatness of the entire heat dissipation substrate 4 can also be improved.

[0060] Wherein, the materials of the first insulating layer 18 and the second insulating layer 19 may include inorganic insulating materials such as silicon oxide or silicon nitride.

[0061] Based on the same inventive concept, the embodiment of the present invention also provides a display device, as Figure 10 shown. Figure 10 A structural schematic diagram of the display device provided by the embodiment of the present invention. The display device includes the above-mentioned display panel 100. Among them, the specific structure of the display panel 100 has been described in detail in the above embodiments and will not be elaborated here. Of course, Figure 10 The display device shown is only for illustrative purposes. The display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an e-reader or a television.

[0062] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the scope of protection of the present invention.

[0063] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that, Comprising: A display area, including an optical component setting area and a first display area at least partially surrounding the optical component setting area; A heat dissipation substrate; An array layer located on the light-emitting direction side of the heat dissipation substrate facing the display panel, the array layer including display devices; Wherein, the heat dissipation substrate includes a heat dissipation base layer and a thermal radiation micro-nano structure. In the direction perpendicular to the plane where the display panel is located, the heat dissipation base layer covers the display area, the thermal radiation micro-nano structure is located in the optical component setting area, and the thermal radiation micro-nano structure is located between the heat dissipation base layer and the array layer; The thermal radiation micro-nano structure includes a plurality of periodically arranged ring structures distributed in concentric circles, and the material of the ring structure includes metal.

2. The display panel according to claim 1, characterized in that In the direction perpendicular to the plane where the display panel is located, the center of the concentric circles coincides with the geometric center of the orthographic projection of the optical component setting area, and the orthographic projection of the outermost ring structure contacts the edge of the orthographic projection of the optical component setting area.

3. The display panel according to claim 1, characterized in that The interval between two adjacent ring structures is d1, 8μm ≤ d1 ≤ 12μm.

4. The display panel according to claim 1, characterized in that In a direction perpendicular to the plane of the display panel, the width of the annular structure in a direction perpendicular to its extending direction is d2, where 0.4 ≤ ≤ 0.6, and T is the arrangement period of the annular structure.

5. The display panel according to claim 1, wherein The heat dissipation base layer includes: A first composite heat dissipation film, the first composite heat dissipation film including a first substrate layer and heat-conducting particles doped in the first substrate layer; A diamond nano-film, located on the light-emitting direction side of the first composite heat dissipation film facing the display panel; A second composite heat dissipation film, located on the light-emitting direction side of the diamond nano-film facing the display panel, the second composite heat dissipation film including a second substrate layer and the heat-conducting particles doped in the second substrate layer.

6. The display panel according to claim 5, characterized in that The heat-conducting particles include heat-conducting nano-particles and heat-conducting micro-particles.

7. The display panel according to claim 6, characterized in that The heat-conducting nano-particles include modified three-dimensional structure diamond nano-particles, and the heat-conducting micro-particles include modified two-dimensional layered structure micro boron nitride particles.

8. The display panel according to claim 6, characterized in that The mass ratio of the heat-conducting micro-particles to the heat-conducting nano-particles is n1, 7 ≤ n1 ≤ 10.

9. The display panel according to claim 5, characterized in that The total mass filling amount of the heat-conducting particles is n2, 20% ≤ n2 ≤ 40%.

10. The display panel according to claim 5, characterized in that The surface of the diamond nano-film facing the second composite heat dissipation film side has protrusions, and in the direction perpendicular to the plane where the display panel is located, the height of the protrusions is less than or equal to 25nm.

11. The display panel according to claim 1, wherein The heat dissipation substrate further includes: A first insulating layer, located between the thermal radiation micro-nano structure and the heat dissipation base layer; A second insulating layer, located between the thermal radiation micro-nano structure and the array layer.

12. The display panel according to claim 1, characterized in that The metal is an alloy.

13. A display device, characterized in that, Comprising a display panel according to any one of claims 1 to 12.

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