IC chip mounting device and IC chip mounting method

Abstract

The IC chip mounting apparatus of the present invention includes: a discharge section that discharges adhesive to predetermined reference positions of each antenna of an antenna continuum on which multiple antennas for inlays are continuously formed on a substrate; a nozzle that is movable between a first position and a second position, configured to adsorb an IC chip when in the first position and to place the IC chip on the adhesive at the reference positions of each antenna when in the second position; a determination section that determines whether an IC chip is adsorbed on the nozzle during the movement of the nozzle from the first position to the second position; and a moving mechanism that moves the nozzle away from the second position if the determination section determines that no IC chip is adsorbed on the nozzle.

Description

Technical Field

[0001] This invention relates to an IC chip mounting device and an IC chip mounting method. Background Technology

[0002] With the increasing prevalence of RFID tags, the production of chip-shaped inlays containing antennas and IC chips electrically connected to those antennas is expanding. In manufacturing the inlay, an adhesive is applied to a predetermined reference position on the antenna, which is formed on a substrate, serving as a reference for mounting the IC chip. The IC chip is then positioned at this reference position, and the adhesive is cured to secure the IC chip.

[0003] For example, Japanese Patent Application Publication No. 2005-209144 describes a method where, with an IC chip adsorbed in the adsorption hole of a synchronous roller, the synchronous roller is rotated, and the synchronous roller brings the film substrate and the IC chip into contact at a predetermined position, thereby releasing the IC chip from the adsorption hole and mounting the IC chip on the film substrate. Summary of the Invention

[0004] However, in methods for holding an IC chip in place and mounting it at a reference position on an antenna, there is a risk of contaminating the substrate and / or the IC chip mounting device if the chip attachment fails. For example, if air is vented from a nozzle that failed to hold the IC chip in order to release it, there is a possibility of contaminating the substrate and / or the IC chip mounting device due to the scattering of the low-viscosity adhesive formed on the antenna on the substrate before curing.

[0005] Therefore, one objective of the present invention is to prevent contamination of the substrate and / or the IC chip mounting device when mounting an IC chip on an antenna via an IC chip mounting device during the manufacturing process of the inlay.

[0006] One aspect of the present invention is an IC chip mounting device, comprising: a discharge section that discharges adhesive to predetermined reference positions of each antenna of an antenna continuum on which multiple antennas for inlays are continuously formed on a substrate; a nozzle movable between a first position and a second position, configured to adsorb an IC chip when in the first position and to place the IC chip on the adhesive at the reference positions of each antenna when in the second position; a determination section that determines whether an IC chip is adsorbed on the nozzle during the movement of the nozzle from the first position to the second position; and a moving mechanism that moves the nozzle away from the second position if the determination section determines that no IC chip is adsorbed on the nozzle.

[0007] According to one aspect of the present invention, when an IC chip is mounted on an antenna using an IC chip mounting device during the manufacturing process of the inlay, contamination of the substrate and / or the IC chip mounting device can be prevented. Attached Figure Description

[0008] Figure 1 These are top views of the antenna in the implementation method and enlarged views of the antenna before and after the IC chip is mounted.

[0009] Figure 2 This is a diagram showing the antenna sheet and the roller with the antenna sheet wound around it.

[0010] Figure 3 This diagram shows the portion of the IC chip mounting apparatus corresponding to the IC chip configuration process in the embodiment.

[0011] Figure 4 It is a diagram showing the chip's containment strip and its magnified cross-section.

[0012] Figure 5 This is a side view of the rotary chip mounter in the IC chip mounting apparatus of the embodiment.

[0013] Figure 6A , Figure 6B These are top and side views of the nozzle unit mounted on a rotary chip mounter.

[0014] Figure 7 This diagram provides a general explanation of the relationship between the rotary patcher and the antenna patch.

[0015] Figure 8 This is a 3D diagram showing the state of the chip containing the strip separated by the separation rollers.

[0016] Figure 9 This diagram illustrates the process of supplying IC chips from the chip-containing strip to the nozzle unit.

[0017] Figure 10 This is a front view showing the moving mechanism in the width direction of the rotary placement machine.

[0018] Figure 11 This is a functional block diagram of the control unit that controls the rotary chip mounter.

[0019] Figure 12 This is a diagram showing an example of an image captured by a camera.

[0020] Figure 13 This is a diagram illustrating the IC chip that has been attached to the nozzle before and after the nozzle is rotated.

[0021] Figure 14A , Figure 14B This diagram illustrates the operation of a rotary placement machine.

[0022] Figure 15A , Figure 15B This diagram illustrates the operation of a rotary placement machine.

[0023] Figure 16 This diagram illustrates a variation of the operation of a rotary chip mounter.

[0024] Figure 17 This diagram shows the portion of the IC chip mounting apparatus corresponding to the curing process in the embodiment.

[0025] Figure 18 It means from Figure 17 The arrow J indicates the direction of the pressed unit observed in the diagram, along with the ultraviolet irradiator.

[0026] Figure 19 This is a diagram illustrating a method for transporting an antenna sheet according to one embodiment.

[0027] Figure 20 This diagram illustrates the IC chip configuration process of one implementation method.

[0028] Figure 21 This is a diagram illustrating the curing process of one embodiment.

[0029] Figure 22 It means Figure 21 A diagram illustrating an example of the configuration of the ultraviolet curing unit.

[0030] Figure 23 This is a diagram illustrating the curing process of one embodiment. Detailed Implementation

[0031] This invention is associated with the following patent applications, namely patent applications 2019-235417 and 2020-216457, filed with the Japan Patent Office on December 26, 2019 and December 25, 2020, respectively, the entire contents of which are incorporated herein by reference.

[0032] Hereinafter, with reference to the accompanying drawings, the IC chip mounting apparatus and IC chip mounting method according to the embodiments will be described.

[0033] The IC chip mounting device 1 described in the embodiments is an apparatus for mounting an IC chip on a thin-film antenna during the manufacture of contactless communication inlays such as RFID inlays.

[0034] exist Figure 1 An exemplary antenna AN with a prescribed antenna pattern is shown, but it is not intended to be limited to that antenna pattern. Additionally, in Figure 1The diagram also shows enlarged views of section E before and after mounting the IC chip C on the antenna AN. In this example, the IC chip C is mounted at a predetermined reference position Pref, which is based on the antenna pattern. The IC chip C is extremely small, for example, with vertical and horizontal dimensions of several hundred μm, requiring that this extremely small IC chip C be correctly mounted at the reference position Pref.

[0035] When an IC chip C is mounted on an antenna AN, an IC chip configuration process and a curing process are required. In the IC chip configuration process, an adhesive is applied to the reference position Pref of the antenna AN, and the IC chip C is mounted on the adhesive. In the curing process, the adhesive is cured to make the connection between the antenna AN and the IC chip C stable.

[0036] like Figure 2 As shown, in the IC chip configuration process described later, a roller PR is provided, and a strip antenna sheet AS (an example of an antenna continuum) is wound around the roller PR. Multiple antennas AN are formed on the substrate BM at a constant spacing. The antenna sheet AS is continuously pulled out from the roller PR and fed into the production line of the IC chip configuration process.

[0037] The material of the substrate BM is not particularly limited. For example, it can be a paper substrate such as high-quality paper, coated paper, or art paper; a synthetic resin film made of PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), or PS (polystyrene); a sheet combining multiple of the above synthetic resins; or a composite sheet combining synthetic resin film and paper.

[0038] Antennas (AN) are formed, for example, by attaching metal foil to a substrate (BM), or by screen printing or vapor-depositing conductive materials onto the substrate (BM) in a prescribed pattern.

[0039] In addition, as stated in the following description, Figure 2 As shown, the XYZ coordinate system is defined. In the following description, when referring to the diagrams showing the state of each process, the diagram viewed in the YZ plane is called the front view, the diagram viewed in the XY plane is called the top view, and the diagram viewed in the XZ plane is called the side view.

[0040] The X direction is the direction in which the antenna piece AS is conveyed from the roller PR in each of the processes described below, and is also appropriately referred to as the conveying direction D1. Additionally, the Y direction is the width direction of the antenna piece AS, and is also appropriately referred to as the width direction D2. The Z direction is the direction orthogonal to the antenna piece AS.

[0041] (1) IC chip configuration process

[0042] The following is for reference Figures 3 to 10 The process of configuring IC chips is explained. Figure 3This diagram shows the portion of the IC chip mounting apparatus 1 in the embodiment that corresponds to the IC chip configuration process. Figure 4 The image shows a top view of the chip with CT and an enlarged view of its AA cross-section.

[0043] In the IC chip configuration process, the IC chip mounting device 1 can determine the reference position Pref (reference) of each antenna AN on the antenna chip AS. Figure 1 It can configure extremely small IC chips with high precision.

[0044] like Figure 3 As shown, in the IC chip configuration process, the IC chip mounting device 1 includes a conveyor 81, a distributor 2, a rotary chip mounter 3, an ultraviolet irradiator 41, imaging devices CA1 to CA3, a belt feeder 71, a belt body winding reel 72, a film winding reel 73, and a separating roller 74.

[0045] Conveyor 81 (an example of a conveying section) conveys the material from roller PR (see reference) downstream of the process at a specified conveying speed. Figure 2 The pulled-out antenna piece AS. The upper surface of conveyor 81 is equivalent to the conveying surface.

[0046] Dispenser 2 (an example of a discharge section) discharges a measured amount of anisotropic conductive paste (ACP; hereinafter referred to as "conductive paste") to the reference position Pref of each delivered antenna AN. This conductive paste is an example of an ultraviolet-curing adhesive. To accurately position the discharge location for the reference position Pref of each antenna AN, dispenser 2 is configured to be adjustable in the width direction.

[0047] Imaging device CA1 is positioned upstream of distributor 2 to capture local images near the reference position Pref of each antenna AN in order to determine the location where conductive paste is applied. Imaging device CA2 is positioned downstream of distributor 2 to capture local images near the reference position Pref of each antenna AN in order to check whether conductive paste has been applied to each antenna AN and whether the conductive paste is correctly applied to the area including the reference position Pref.

[0048] Rotary placement machine 3 is a chip placement machine that places IC chips on conductive paste already coated on each antenna AN. Figure 3 The rotary placement machine 3 rotates counterclockwise. It is mounted and suspended on a suspension plate 86. The suspension plate 86 is supported on a support platform 85 in a manner that allows it to move in the Y direction. Thus, the rotary placement machine 3 is configured to be suspended from above on the support platform 85 and capable of moving in the Y direction.

[0049] As described later, the rotary pick-and-place machine 3 releases and mounts the attached IC chip from the chip-containing strip to the reference position Pref of each antenna AN on the antenna sheet AS. At this time, in order to correctly mount the IC chip at the reference position Pref of the antenna AN, the position and orientation of the attached IC chip are corrected. To correct the position and orientation of the IC chip when mounting it on the antenna AN, and to retract the attached IC chip, the imaging device CA3 captures an image of the IC chip in its attached state to the nozzle (described later). The imaging device CA3 is an example of an image acquisition unit.

[0050] The tape feeder 71 is configured to: load a chip-included tape containing an IC chip in a wound state and feed it to... Figure 3 The arrow direction is synchronized with the speed of the rotary pick and place machine 3 to sequentially pull out the chip inclusion tape.

[0051] Here, refer to Figure 4 Here is an example of a chip containing a band.

[0052] like Figure 4 As shown, the chip-including strip CT includes: a strip body T, which has recesses Td containing IC chips C formed at constant intervals; and a covering film CF, which is adhered to the strip body T to seal the recesses Td. The recesses Td are formed, for example, by embossing the strip body T. The IC chips C are contained within each recess Td along the extension direction of the chip-including strip CT. Mounting holes H are formed at constant intervals along the extension direction of the chip-including strip CT. The mounting holes H are provided for proper positioning relative to the circumferential surface of the release roller 74, and when the chip-including strip CT is conveyed to the release roller 74, the protrusions 74p (described later) of the release roller 74 are inserted into the mounting holes H.

[0053] like Figure 4 As shown, an adsorption hole Ts is formed between the bottom surface of the recess Td and the back surface of the main body T (the side opposite to the side where the coating film CF is adhered). The adsorption hole Ts is provided to adsorb the IC chip C by the separation roller 74, so that the IC chip C does not fall off the recess Td when the coating film CF is peeled off.

[0054] Refer to again Figure 3 In the separating roller 74, the coating film CF is peeled off from the chip containing the CT, which is supplied from the self-contained feeder 71 via one or more auxiliary rollers. The chip containing the CT is separated into the chip body T and the coating film CF. The IC chip C exposed after peeling off the coating film CF is sequentially adsorbed by the nozzles of the rotary placement machine 3.

[0055] After the chip containing the CT is separated into the tape body T and the coating film CF by the separation roller 74, the tape body T is wound onto the tape body take-up reel 72 by one or more auxiliary rollers, and the coating film CF is wound onto the film take-up reel 73 by one or more auxiliary rollers.

[0056] Next, refer to Figures 5-7 The rotary chip mounter 3 will be described below.

[0057] Figure 5 This is a side view of the rotary chip mounter 3 in the IC chip mounting apparatus 1 of the embodiment. Figure 6A This is a top view of the nozzle unit mounted on the rotary chip mounter 3. Figure 6B This is a side view of nozzle unit 30. Figure 7 This diagram provides a general explanation of the relationship between the rotary patcher 3 and the antenna patch AS.

[0058] like Figure 5 As shown, in the rotary placement machine 3, a plurality of nozzle units 30-1 to 30-12 (12 in the illustrated example) are radially arranged from the rotating head 3H (an example of the nozzle mounting section). In the following description, when referring to matters common to nozzle units 30-1 to 30-12, they are collectively referred to as nozzle unit 30.

[0059] Regarding the rotating head 3H, although details are not shown in the diagram, it is related to the nozzle units 30-1 to 30-12 along... Figure 5 A counterclockwise rotating rotary drive motor (rotary drive motor M31 described later), a vacuum pump for adsorbing IC chips into the nozzle unit 30, and a blower for releasing IC chips from the nozzle unit 30 are connected.

[0060] Reference Figure 6A , Figure 6B The nozzle unit 30 includes a nozzle 32, a sleeve 33, a solenoid valve 35, and a cylinder drive motor M30. The nozzle 32 is disposed at the front end of the nozzle unit 30 and is connected to the cylinder drive motor M30 inside the sleeve 33. The cylinder drive motor M30 is a motor (e.g., a stepper motor) that rotates the nozzle 32 about its axis. A passage is formed in the nozzle 32 that can communicate with the intake pipe 36 and the exhaust pipe 37.

[0061] Sleeve 33 is connected to an intake pipe 36 and an exhaust pipe 37. The intake pipe 36 is connected to a vacuum pump (not shown), and the exhaust pipe 37 is connected to a blower (not shown).

[0062] Solenoid valve 35 is, for example, a three-port solenoid valve, configured such that, depending on the energization state of solenoid valve 35, the passage 34 of nozzle 32 is open between it and intake pipe 36 while exhaust pipe 37 is closed, or the passage 34 of nozzle 32 is open between it and exhaust pipe 37 while intake pipe 36 is closed. Solenoid valve 35 is configured to perform either a suction action (drawing air through intake pipe 36 via nozzle 32) or a discharge action (expelling air from nozzle 32 through exhaust pipe 37).

[0063] Reference Figure 7 A rotary drive motor (not shown) rotates the rotating head 3H counterclockwise, thereby sequentially switching the circumferential position of the rotating head 3H of each nozzle unit 30. That is, a specific nozzle unit 30, according to the rotation of the rotating head 3H, moves on a circular track in a plane orthogonal to the conveying surface, sequentially occupying each of the 12 positions PA to PL in the circumferential direction of the rotating head 3H from position PA to position PL in a counterclockwise direction.

[0064] Here, position PA (an example of the first position) is the position where the nozzle unit 30 reattaches the IC chip C from the chip-containing CT. Position PE is the position where an image of the IC chip C in the state of being attached to the nozzle unit 30 is captured by the imaging device CA3.

[0065] Position PK (an example of the second position) is the position where the adsorbed IC chip C is released from the conductive paste of the antenna AN coated on the transported antenna sheet AS. At position PK, the movement direction of the nozzle tip is consistent with the transport direction D1 of the antenna sheet AS. At position PK, air is vented from the nozzle of nozzle unit 30 to release the IC chip C.

[0066] Since the IC chip C has been completely released at position PK, no IC chip C is adsorbed on the nozzle unit 30 at position PL. Furthermore, at position PL, air can be released from the nozzle to remove any residue that may have adhered to it. Figure 7 The image shows an example of a residue collection tray TR configured at position PL to collect residue that may be released from the nozzle.

[0067] For example, repeatedly performing the following action, namely: Figure 7 The nozzle unit 30-1, located at position PA, re-attaches the IC chip C, rotates counterclockwise while maintaining the attached IC chip C, releases the IC chip C upon reaching position PK, and then re-attaches a new IC chip C upon returning to position PA. This IC chip mounting method allows for continuous placement of IC chips onto each antenna AN without interrupting the delivery of the antenna sheet AS, resulting in high productivity.

[0068] The angular velocity of the rotating head 3H and the conveying speed of the antenna sheet AS are set or controlled so that the nozzle unit 30, which arrives sequentially at position PK, releases the IC chip C to the reference position Pref of each antenna AN of the antenna sheet AS conveyed from upstream. For reliable configuration of the IC chip C, it is preferable that the speed of the front end of the nozzle unit 30 near the position PK is within the range where it is equal to the conveying speed of the antenna sheet AS.

[0069] Furthermore, this embodiment shows an example where 12 nozzle units 30 are arranged in the rotary head 3H, but it is not limited to this. The number of nozzle units 30 arranged in the rotary head 3H can be arbitrarily set.

[0070] Next, refer to Figure 8 as well as Figure 9 The operation of using the nozzle unit 30 to adsorb IC chip C is explained.

[0071] Figure 8 This is a three-dimensional view showing the state in which the chip contains the CT separated by the separation roller 74. Figure 9 This is a side view near the separating roller 74, illustrating the operation of supplying IC chip C from the chip-containing CT to the nozzle unit 30. Figure 9 The chip contains a CT strip only in cross-section to make the state of the chip containing the CT strip clear.

[0072] like Figure 8 As shown, the protrusion 74p of the separating roller 74 is inserted into the mounting hole H of the chip-containing tape CT supplied from the tape feeder 71, thereby conveying the chip-containing tape CT while it is positioned in the width direction. At this time, the coating film CF of the chip-containing tape CT is peeled off by the branch member 75 and moves toward the film winding reel 73. On the other hand, the tape body T of the chip-containing tape CT moves toward the tape body winding reel 72.

[0073] like Figure 9 As shown, the IC chip C exposed after the coating film CF is peeled off is immediately adsorbed by the nozzle unit 30. A suction path (not shown) is provided on the separating roller 74 to attract the IC chip C toward the center of rotation of the separating roller 74, so that the IC chip C will not fall off during the brief period from its exposure to adsorption by the nozzle unit 30. This suction path and the adsorption holes Ts provided in the body T (see reference) Figure 4 Adsorbed IC chip C.

[0074] Next, refer to Figure 10 The moving mechanism 8 that moves the rotating head 3H in the width direction D2 will be described. Figure 10 This is the main view of the moving mechanism 8.

[0075] The moving mechanism 8 is provided to correct the position of the IC chip C, which has been adsorbed by the nozzle unit 30, in the width direction D2. For example... Figure 10 As shown, the moving mechanism 8 has a bearing 76, a shaft 77, a suspension plate 86, a guide plate 87, a slider 88, and a width-direction drive motor M32.

[0076] Bearing 76, shaft 77, and width-direction drive motor M32 are mounted on support platform 85. Shaft 77 is a rod-shaped component with a threaded cutting portion, which is rotated by width-direction drive motor M32. Shaft 77 is supported by bearing 76 (at 2 locations) fixed to the upper surface of support platform 85 to enable rotation.

[0077] A rotating head 3H is mounted on a suspension plate 86. A threaded hole (not shown) is formed at the upper end of the suspension plate 86, which engages with the threaded portion of the shaft 77. Therefore, in response to the rotation of the shaft 77, the suspension plate 86 and the rotating head 3H mounted on it can move in the width direction D2. Furthermore, hollow portions are provided on the upper part of the support platform 85 and the guide plate 87 within the movable range of the suspension plate 86 in the width direction D2. A slider 88 is mounted on the suspension plate 86 and slides on the upper surface of the guide plate 87 as the suspension plate 86 moves in the width direction D2.

[0078] With the above structure, the moving mechanism 8 can cause the rotating head 3H to move in the width direction D2 in response to the rotational drive of the width direction drive motor M32.

[0079] In this embodiment, an example is shown where the rotating head 3H is moved in the width direction D2 by the moving mechanism 8, thereby moving the nozzle unit 30 mounted on the rotating head 3H in the width direction D2, but this is not a limitation. For example, the rotating head may be configured such that each nozzle unit 30 can be independently displaced in the width direction D2 inside the rotating head without moving the rotating head in the width direction D2.

[0080] Refer again Figure 3 At the position where the IC chip is released from the nozzle unit 30 of the rotary pick and place machine 3 to the antenna AN ( Figure 7 Near the location PK, set up an ultraviolet irradiator 41.

[0081] The ultraviolet irradiator 41 is configured to irradiate the conductive paste on the delivered antenna AN with ultraviolet light. The purpose of ultraviolet irradiation by the ultraviolet irradiator 41 differs from that of ultraviolet irradiation performed in the post-processing stage of the IC chip configuration process, namely the curing stage (described later). The former aims to adjust the viscosity of the conductive paste on the antenna AN. From this perspective, it is preferable that the cumulative light intensity of the ultraviolet light supplied to the conductive paste by the ultraviolet irradiator 41 is less than the cumulative light intensity supplied to the conductive paste in the subsequent curing stage. The cumulative light intensity is expressed as the product of light intensity and irradiation time; therefore, to adjust the cumulative light intensity, at least one of the light intensity and irradiation time can be adjusted.

[0082] In the IC chip mounting device 1 of this embodiment, a thermosetting device may also be provided instead of an ultraviolet irradiator 41, in which the distributor 2 coats the antenna AN with a thermosetting adhesive such as epoxy resin.

[0083] exist Figure 3 In this embodiment, the ultraviolet irradiator 41 is configured to irradiate ultraviolet light after the IC chip is configured, but it is not limited to this. The ultraviolet irradiator 41 can also be configured to irradiate ultraviolet light before the IC chip is configured, or it can be configured to irradiate ultraviolet light simultaneously with the configuration of the IC chip.

[0084] When an IC chip is placed and then exposed to ultraviolet light, the viscosity of the conductive paste decreases, making it less likely for the IC chip to shift or tilt after being placed on the paste. When the IC chip is placed before or simultaneously with the placement of the IC chip, the conductive paste is applied to the IC chip in a state of reduced viscosity, making it difficult for the IC chip to move after placement, thus reducing the likelihood of IC chip shifting or tilting.

[0085] In either case, by irradiating a location near the IC chip with ultraviolet light, the instability of the IC chip on the conductive paste caused by its fluidity can be avoided. That is, irradiation with ultraviolet light irradiator 41 has the advantage of improving the mounting accuracy of the IC chip.

[0086] Next, refer to Figures 11-13 The control performed by the control unit 100 that controls the rotary placement machine 3 will be explained. Figure 11 This is a functional block diagram of the control unit 100. Figure 12 An example of an image captured by the imaging device CA1 is shown. Figure 13 This is a diagram illustrating the IC chip C that has been adsorbed onto the nozzle 32 before and after the nozzle 32 is rotated. Figure 13 The state of the nozzle before rotation shows an example of an image captured by the CA3 imaging device. Figure 13The state of the nozzle after rotation indicates that the nozzle is in position PK (refer to...). Figure 7 The XYZ axes at that time.

[0087] The control unit 100 is encapsulated on a circuit board (not shown) and is electrically connected to the imaging devices CA1-CA3, the distributor 2, the cylinder drive motor M30, the rotary drive motor M31, the width direction drive motor M32, the solenoid valve 35, and the ultraviolet irradiator 41. The rotary drive motor M31 (an example of the rotating part) is a drive module that rotates the nozzle units 30-1 to 30-12 in the rotating head 3H.

[0088] The control unit 100 includes a microcomputer, a memory (RAM (Random Access Memory), ROM (Read Only Memory)), a storage device, and a drive circuit group. The microcomputer reads and executes the program recorded in the memory to realize the functions of the discharge position adjustment module 101, the IC chip correction module 102, the valve control module 103, the solidification execution module 104, and the nozzle retraction module 105.

[0089] The discharge position adjustment module 101 has the following functions: determining the discharge position of the conductive paste based on the image captured by the imaging device CA1, and adjusting the discharge timing of the conductive paste and the position of the dispenser 2 in the width direction D2. (Refer to...) Figure 12 The method for determining the discharge location of conductive paste is as follows.

[0090] like Figure 12 As illustrated, the image captured by the imaging device CA1 is a local image near the reference position Pref of the antenna AN.

[0091] The discharge position adjustment module 101 determines the reference position Pref based on the characteristic portions of the shape included in the image. Specifically, the discharge position adjustment module 101 analyzes... Figure 12 Based on the shape of the antenna AN in the image, determine the reference lines L1 and L2 that are parallel to each other in the X direction and L3 and L4 that are parallel to each other in the Y direction, and determine the reference position Pref as the intersection of the line at the center of reference lines L1 and L2 and the line at the center of reference lines L3 and L4.

[0092] Figure 12 Point Pj1 in the image is the target position of the reference position Pref on the image, which is a predetermined position determined based on the calibration results between the image captured by the imaging device CA1 and the dripping position of the conductive paste from the dispenser 2. That is, the discharge time point and the position of the dispenser 2 in the width direction D2 are adjusted so that the reference position Pref determined on the image and the target position Pj1 are consistent, thereby enabling the conductive paste to be applied to the reference position of the actual antenna AN.

[0093] exist Figure 12 In the example, to ensure that the reference position Pref determined on the image matches the target position Pj1, it is necessary to adjust position x1 in the X direction and position y1 in the Y direction. Specifically, the discharge time point from distributor 2, taking into account the transmission speed of antenna AN, is determined based on x1, and the displacement of distributor 2 in the width direction D2 is determined based on y1. That is, the discharge position adjustment module 101 sends a control signal to distributor 2 to indicate the discharge time point and the displacement in the width direction D2, and distributor 2 performs the discharge operation based on the control signal.

[0094] Aside from the fact that it is coated with conductive paste, the images captured by the CA2 imaging device are similar to... Figure 12 Same image.

[0095] The IC chip correction module 102 has the function of correcting the IC chip that has been attached to the nozzle 32. (Refer to...) Figure 12 as well as Figure 13 The correction method for IC chips is as follows.

[0096] like Figure 13 As shown in the image captured by the imaging device CA3, the image includes the nozzle end 32e of the nozzle 32 and the IC chip C that has been attached to the nozzle end 32e. Point Pc1 is the center position of the IC chip C before the nozzle is rotated. Figure 13 Point Pj2 in the image is the target position of the center of IC chip C on the image, set as and Figure 12 The target position Pj1 is consistent. That is, by making the center position of IC chip C consistent with the target position Pj1, IC chip C can be configured at the reference position of the actual antenna AN being transmitted.

[0097] Due to installation deviations of nozzle units 30-1 to 30-12, the rotation center Prc of nozzle 32 about its axis is not the theoretical axis center of each nozzle. The rotation center Prc varies depending on each nozzle unit, and may be determined, for example, based on previously obtained measured data.

[0098] First, when rotating the center Pc1 of the IC chip C shown in the image around the rotation center Prc of the nozzle 32 about the axis, the amount of rotation until the reference line of the IC chip C (e.g., the reference edge Sc of the IC chip C) is parallel to the Y direction is determined.

[0099] exist Figure 13In the example of the rotated state, the IC chip C in the captured image is rotated around the rotation center Prc, and the reference edge Sc of the IC chip C is made parallel to the Y direction. The rotation angle at this time is determined as the correction amount in the rotation direction of the IC chip C. Here, if the center position of the moved IC chip C is set as point Pc2, in order to make point Pc2 consistent with the target position Pj2, the correction amount in the X direction is determined as x2, and the correction amount in the Y direction is determined as y2.

[0100] The IC chip correction module 102 sends a control signal corresponding to the correction amount in the rotation direction of the nozzle 32 around the axis to the cylinder drive motor M30, thereby causing the nozzle 32 to rotate around the axis between position PE (the position captured by the imaging device CA3) and position PK where the IC chip is released.

[0101] The IC chip correction module 102 sends a control signal corresponding to the correction amount x2 in the X direction to the drive circuit of the rotary drive motor M31, thereby adjusting the angular velocity of the rotating head 3H. The IC chip correction module 102 also sends a control signal corresponding to the correction amount y2 in the Y direction to the drive circuit of the width drive motor M32, thereby adjusting the position of the rotating head 3H in the width direction D2. By adjusting the position of the rotating head 3H in the width direction D2, the position of the nozzle 32 in the width direction D2 can also be adjusted.

[0102] In the IC chip mounting device 1 of this embodiment, the IC chip correction module 102 corrects the position of the IC chip in the X direction and Y direction, as well as the orientation of the IC chip on the plane orthogonal to the axis of the nozzle. Therefore, it has the advantage of very high mounting accuracy of the IC chip relative to the reference position of the antenna.

[0103] For each of the 12 nozzle units 30-1 to 30-12 included in the rotary placement machine 3, the valve control module 103 controls each solenoid valve 35 to perform either the action of drawing in or expelling air from each nozzle unit 30, depending on the position of each nozzle unit 30. Specifically, the valve control module 103 controls the solenoid valve 35 to ensure that when the nozzle unit 30 is located at positions PA to PJ (see reference...). Figure 7 When the nozzle unit 30 is in position PK or PL, air is drawn from the nozzle unit 30, and the solenoid valve 35 is controlled to discharge air from the nozzle unit 30.

[0104] The curing execution module 104 sends a specified drive signal to the ultraviolet irradiator 41 so that each of the antennas AN being transported is irradiated with ultraviolet light from the ultraviolet irradiator 41 with a preset cumulative light amount.

[0105] During the movement of the nozzle unit 30 from position PA to position PK, the nozzle retraction module 105 determines whether an IC chip is attached to the nozzle unit 30. If no IC chip is attached to the nozzle unit 30, the module moves the nozzle unit 30 to move it away from position PK (an example of the second position). The nozzle retraction module 105 is an example of a determination unit.

[0106] Here, in connection with the nozzle retraction module 105, refer to Figures 14A to 16 This section explains the actions taken when the rotary chip mounter fails to pick up the IC chip C. Figure 14A , Figure 14B as well as Figure 15A , Figure 15B This diagram illustrates the actions taken when the rotary chip mounter fails to pick up IC chip C. Figure 16 This is a diagram showing a variation of it.

[0107] exist Figure 14A as well as Figure 14B The image shows a side view and a front view of the rotary placement machine 3 at a certain moment. Figure 15A as well as Figure 15B The side view and front view of the rotary placement machine 3 at the next moment are shown respectively.

[0108] exist Figure 14A , Figure 14B In the example shown, it is assumed that the nozzle unit 30-1 at position PJ has failed to attract the IC chip C. (As already referred to...) Figure 7 As explained, normally, each nozzle unit 30, when in position PK, expels air to release the IC chip C. However, in Figure 14A , Figure 14B In the example shown, since the nozzle unit 30-1 does not have an IC chip C attached, if air is expelled directly above the antenna AN-2 corresponding to the nozzle unit 30-1, the conductive paste coated on the antenna AN-2 may scatter around due to the air.

[0109] Therefore, in the IC chip mounting apparatus 1 of this embodiment, it is preferable to move the nozzle unit 30 away from the position PK when the nozzle unit 30 is not holding an IC chip C. This prevents contamination of the antenna sheet AS on the transport surface and / or the IC chip mounting apparatus 1.

[0110] Specifically, such as Figure 15A , Figure 15B As shown, via the moving mechanism 8 (refer to...) Figure 10The rotary pick and place machine 3 is moved as a whole in the width direction D2 (+Y direction), thereby causing the nozzle unit 30-1 to move away from position PK in the width direction D2. This prevents contamination of the antenna sheet AS and / or IC chip mounting device 1 on the transport surface.

[0111] In addition, in such Figure 15A , Figure 15B As shown, after the rotary placement machine 3 is moved, in order to place the adsorbed IC chip C on the antenna AN-3 by the nozzle unit 30-2 that is connected to the nozzle unit 30-1, the rotary placement machine 3 is returned to the antenna piece AS.

[0112] In progress Figure 14A , Figure 14B as well as Figure 15A , Figure 15B In the case of the operation shown, the nozzle retraction module 105 determines, based on the image captured by the imaging device CA3, whether the nozzle unit 30 that arrives at position PE in sequence has an IC chip C adsorbed. If a nozzle unit 30 that has not adsorbed an IC chip C is detected, the moving mechanism 8 is controlled to move the rotary placement machine 3 in the width direction D2 at the time point when the nozzle unit 30 arrives at position PK in the side view.

[0113] exist Figure 15A , Figure 15B The example shown illustrates moving the rotary pick-and-place machine 3 in the width direction D2 to move the nozzle unit 30 without an IC chip attached away from position PK, but it is not limited to this. It is also possible to move only the nozzle unit 30 without an IC chip attached away from position PK.

[0114] For example, in Figure 16 The example shown illustrates a rotary placement machine 3A configured to retract each nozzle unit 30 radially. In this rotary placement machine 3A, each nozzle unit 30 is provided with a retraction region 3e inside, and by moving the nozzle unit 30 radially along the nozzle axis Ax, the nozzle unit 30 can be retracted to the retraction region 3e.

[0115] When using a rotary placement machine 3A, such as Figure 16 As shown, nozzle units 30-11 that are detected as not having an IC chip attached are retracted to the retraction region 3e. This prevents contamination of the antenna sheet AS and / or the IC chip mounting device 1 on the transport surface.

[0116] (2) Curing process

[0117] Next, refer to Figure 17 as well as Figure 18 The curing process is described.

[0118] In the curing process, the conductive paste applied to each antenna that has undergone the above-mentioned IC chip configuration process is cured, so that the physical connection between the antenna and the IC chip is stable and the electrical conduction between the antenna and the IC chip is reliable.

[0119] Figure 17 This is a diagram showing the portion of the IC chip mounting apparatus 1 in the embodiment that corresponds to the curing process. Figure 18 It means from Figure 17 The arrow J shows a portion of the pressing unit 6 and the ultraviolet irradiator 42.

[0120] like Figure 17 As shown, in the curing process, the IC chip mounting device 1 includes a conveyor 82, a curing device 4, and an imaging device CA4.

[0121] Conveyor 82 conveys the antenna chip AS from the upstream IC chip configuration process downstream at a specified conveying speed.

[0122] The imaging device CA4 is positioned above the antenna sheet AS at the upstream end of the curing process (i.e., the downstream end of the IC chip configuration process) to capture images of each antenna AN delivered from the IC chip configuration process. The imaging device CA4 is configured to check whether the IC chip is configured in the appropriate position during the IC chip configuration process.

[0123] like Figure 17 As shown, the curing device 4 has one or more pressing units 6 and an ultraviolet irradiator 42.

[0124] The pressing unit 6 moves up and down in a direction orthogonal to the conveying surface, pressing the IC chip already disposed on the conductive paste of the antenna AN while irradiating each antenna AN with ultraviolet light. The number of pressing units 6 is unlimited, but from the point of view of productivity and cost, it can be set to any number.

[0125] The ultraviolet irradiator 42 is arranged along the transport direction D1. Therefore, it is possible to simultaneously irradiate multiple antennas AN on the antenna sheet AS with ultraviolet light.

[0126] Reference Figure 18 This illustrates the state of each antenna AN being irradiated with ultraviolet light by the ultraviolet irradiator 42. For example... Figure 18 As shown, the pressing unit 6 has a structure in which a pressing part 61 is mounted on the front end of the shaft 63. The side of the pressing part 61 of the pressing unit 6 (i.e., the side on which the ultraviolet irradiator 42 is disposed) is open. The glass plate 61p constituting the pressing surface of the pressing part 61 is formed of glass that can transmit ultraviolet light.

[0127] The ultraviolet irradiator 42 has a light source 42e, such as an LED (Light Emitting Device). The light source 42e is configured to irradiate ultraviolet light toward the antenna AN from a direction that is tilted relative to the transmission surface.

[0128] By pressing the IC chip coated on the conductive paste of each antenna AN while irradiating it with ultraviolet light, the conductive paste coated on each antenna AN is cured, the physical connection between the antenna and the IC chip becomes stable, and the electrical conduction between the antenna and the IC chip becomes reliable.

[0129] As described above, a strip-shaped antenna sheet with multiple antennas formed on a substrate at constant intervals is fed into the production line. After an IC chip placement process and a curing process, an IC chip is mounted on each antenna. In this embodiment, the IC chip mounting apparatus applies adhesive to a reference position of the antenna in the IC chip placement process and places the IC chip on the adhesive. In the curing process, the adhesive is cured to secure the connection between the antenna and the IC chip. Specifically, in the IC chip placement process, if the nozzle unit does not hold an IC chip, the nozzle unit is moved away from the position where the IC chip should be released from the nozzle unit to the antenna. Therefore, the conductive paste placed on the antenna will not scatter due to air released from the nozzle, thus preventing contamination of the antenna sheet and / or the IC chip mounting apparatus on the transport surface.

[0130] In addition, Figure 14A , Figure 14B as well as Figure 15A , Figure 15B In the example shown, the rotary pick-and-place machine 3 as a whole is moved in the width direction by the moving mechanism 8, thereby causing the nozzle unit to move away from position PK in the width direction, but it is not limited to this. It is also possible that each of the multiple nozzle units included in the rotary pick-and-place machine moves independently in the width direction. In this case, the rotary pick-and-place machine 3 as a whole is not moved in the width direction, but only the nozzle unit as the object is moved in the width direction.

[0131] The embodiments of the IC chip mounting device and IC chip mounting method have been described above, but the present invention is not limited to the above embodiments. Furthermore, various improvements and modifications can be made to the above embodiments without departing from the spirit of the present invention.

[0132] For example, in Figure 3 The embodiment shown illustrates a unidirectional transport of the antenna chip AS on the conveyor 81 during the IC chip configuration process, but is not limited to this.

[0133] like Figure 19As shown, in one embodiment, during the IC chip configuration process, adsorption rollers 92, 94 and multiple conveyor rollers (e.g., in...) can also be used. Figure 17 The middle section uses conveyor rollers 91, 93, and 95 to convey the antenna piece AS. Figure 19 In this process, at the highest position of the adsorption roller 92, conductive paste is dispensed from the antenna AN of the antenna sheet AS by the dispenser 2. Furthermore, at the highest position of the adsorption roller 94, an IC chip is placed on the conductive paste. In this case, it is preferable that at least adsorption rollers 92 and 94 are adsorption rollers that adsorb the back side of the antenna sheet AS. This prevents positional displacement of the antenna sheet AS (especially in the long side direction) and enables high-precision dispensing of the conductive paste and placement of the IC chip.

[0134] In one embodiment, instead of releasing the IC chip onto the conductive paste of the antenna AN coated on the delivered antenna sheet AS, the IC chip can be configured by pressing it onto the conductive paste.

[0135] Figure 20 The operation of the rotary placement machine 3 is shown in chronological order when the IC chip is configured by pressing it onto conductive paste. In one embodiment, each nozzle unit 30 of the rotary placement machine 3 is configured to move independently in the radial direction by means of a built-in drive device.

[0136] State ST1 indicates that the nozzle unit 30 has the IC chip C attached. As shown in state ST2, when the attached IC chip C is positioned, the nozzle unit 30 is oriented towards the reference position (i.e., downward direction, i.e., towards) in a radially extending manner. Figure 2 The nozzle unit 30 is moved in the Z direction, pressing the IC chip C onto the conductive paste coated on the antenna AN, thereby placing the IC chip C on the conductive paste. After placing the IC chip C, the attachment is released and the nozzle unit 30 is returned to the position in state ST1. For example, when the nozzle unit 30 reaches position PK (refer to...), Figure 7 The operation of states ST1 to ST3 is performed at specific time points, thereby enabling the IC chip C to be positioned on the conductive paste coated on the antenna AN.

[0137] exist Figure 21 The image shows a curing process according to one embodiment. Figure 21 The image shows a curing apparatus 4A used in the curing process of one embodiment. For the curing apparatus 4A, multiple ultraviolet curing units 43 are detachably mounted on a mounting plate 44. Multiple mounting plates 44 with different mounting positions are prepared according to the spacing between adjacent antennas AN of the antenna piece AS. The mounting plates 44 are replaced according to this spacing, thereby enabling compatibility with various antenna pieces AS.

[0138] Support shaft 45 supports mounting plate 44 and is configured to allow mounting plate 44 to be raised and lowered. Antenna chip AS from IC chip configuration process is conveyed to curing process via conveyor rollers 96-98. Conveyor roller 97 is configured to be raised and lowered by a drive device (not shown).

[0139] exist Figure 22 An example of the configuration of the ultraviolet curing unit 43 is shown. For example... Figure 22 As shown, the UV curing unit 43 has a built-in light source 432 (e.g., an LED light source) for irradiating ultraviolet light within a housing 431. The light source 432 is connected via a cable 436 provided from the outside of the UV curing unit 43. Figure 21 (Not shown in the diagram) Power supply. A focusing lens may also be provided inside the housing 431 to concentrate the ultraviolet light irradiated by the light source 432. A retaining plate 434 is connected to the housing 431, and a retaining glass plate 435 is maintained. The ultraviolet light irradiated by the light source 432 irradiates the conductive paste coated on each antenna AN, thereby curing the conductive paste.

[0140] Refer again Figure 21 The transport status indicates the state of the antenna piece AS being transported from the IC chip configuration process. At the point when the antenna AN, coated with uncured conductive paste, is directly below the UV curing unit 43, the transport of the antenna piece AS is stopped. Then, in the stopped state (stopped state), the UV curing unit 43 is moved downwards while pressing the antenna AN through the glass plate 435, and UV light is irradiated to cure the conductive paste.

[0141] Even in the stopped state, antenna sheets AS are transported from the IC chip configuration process. Therefore, during ultraviolet irradiation, the transport roller 97 descends by its own weight, absorbing the transported antenna sheets AS between the transport rollers 96 and 98. Once ultraviolet irradiation ends, antennas AN, in numbers equivalent to the number in the ultraviolet curing unit 43, are rapidly transported downstream, and then stopped, so that the uncured antennas AN are positioned directly below the ultraviolet curing unit 43. That is, in the curing process of one embodiment, the transport state and the stopped state (the state of ultraviolet irradiation) of the antenna sheets AS are repeatedly performed. During rapid transport of antennas AN, the transport roller 97 rises due to the tension applied to the antenna sheets AS.

[0142] In one embodiment, the curing process can also be performed using a heat-curing apparatus. That is, when a heat-curing adhesive such as an epoxy resin is applied to the dispenser 2, the adhesive is cured by heat curing during the curing process.

[0143] Figure 23 Is with Figure 21A curing apparatus 4B is similarly configured to repeatedly switch between a conveying state and a stationary state for the antenna element AS. Unlike the curing apparatus 4A, the curing apparatus 4B includes multiple heat-curing units 46. Each heat-curing unit 46 is equipped with a heat source powered by a cable (not shown). When the antenna element AS is in the stationary state, the support shaft 45 is driven to lower it, pressing down on the antenna AN corresponding to each heat-curing unit 46 while heating the adhesive to cure it. Once heating is complete, the support shaft 45 is driven to rise, and the antenna element AS is conveyed.

[0144] In addition, Figure 21 In the case where conductive paste is cured by ultraviolet light, the ultraviolet curing unit 43 with a built-in light source can be replaced by a pressing unit that presses the antenna AN via a glass plate, and an ultraviolet irradiation device is provided to irradiate the conductive paste on the antenna AN being pressed in the stopped state with ultraviolet light from the outside of the width direction or from the upper side.

[0145] In one embodiment, multiple ultraviolet curing units 43 can also be cyclically moved in conjunction with the travel speed of the antenna sheet AS, pressing the antenna AN while irradiating ultraviolet light through a built-in light source, so that the antenna sheet AS does not stop while irradiating ultraviolet light.

[0146] Similarly, in one embodiment, when the conductive paste is heat-cured, it can also be configured such that a plurality of heat-curing units 46 move cyclically in a manner linked to the travel speed of the antenna piece AS, while pressing the antenna AN and heating it.

Claims

1. An IC chip mounting device, characterized by comprising: Possessing: an ejection portion that ejects an adhesive to a prescribed reference position of each antenna of an antenna continuum in which a plurality of antennas for inlays are continuously formed on a substrate; a nozzle that is movable between a first position and a second position, and is configured to adsorb an IC chip when in the first position, and to dispose the IC chip on the adhesive at the reference position of each antenna when in the second position; a judging portion that judges whether or not an IC chip is adsorbed in the nozzle during movement of the nozzle from the first position to the second position; and a movement mechanism that moves the nozzle away from the second position when judged by the judging portion that no IC chip is adsorbed in the nozzle, and moves the nozzle to the second position when judged by the judging portion that an IC chip is adsorbed in the nozzle.

2. The IC chip mounting apparatus according to claim 1, characterized in that an image acquisition portion that acquires an image of the nozzle when the nozzle is at a prescribed position between the first position and the second position is possessed, the judging portion judges whether or not an IC chip is adsorbed in the nozzle based on the image acquired by the image acquisition portion. Possessing:

3. The IC chip mounting device according to claim 1 or 2, characterized by a conveying portion that conveys the antenna continuum on a prescribed conveying surface; a nozzle mounting portion in which the nozzle is mounted; and a rotating portion that rotates the nozzle mounting portion in a manner such that the nozzle moves on a ring-shaped track in a plane orthogonal to the conveying surface, and the direction of movement of the nozzle when in the second position is aligned with the direction of conveyance of the antenna continuum.

4. The IC chip mounting apparatus according to claim 3, characterized in that the movement mechanism moves the nozzle mounting portion in a width direction of the antenna continuum when judged that no IC chip is adsorbed in the nozzle.

5. The IC chip mounting apparatus according to claim 3, characterized in that the movement mechanism moves the nozzle toward a center of rotation of the rotating portion when judged that no IC chip is adsorbed in the nozzle.

6. The IC chip mounting apparatus according to claim 3, characterized in that a plurality of nozzles are mounted in the nozzle mounting portion, the judging portion judges whether or not an IC chip is adsorbed for each nozzle, the movement mechanism moves the nozzle that is judged not to have an IC chip adsorbed among the plurality of nozzles.

7. An IC chip mounting method, characterized by: ejecting an adhesive to a prescribed reference position of each antenna of an antenna continuum in which a plurality of antennas for inlays are continuously formed on a substrate, by a dispenser; adsorbing an IC chip by a nozzle that is movable between a first position and a second position, when the nozzle is in the first position; judging whether or not an IC chip is adsorbed in the nozzle during movement of the nozzle from the first position toward the second position, and ​ when it is determined that the IC chip is not adsorbed to the nozzle, moving the nozzle away from the second position, and when it is determined that the IC chip is adsorbed to the nozzle, moving the nozzle to the second position.

8. The IC chip mounting method according to claim 7, wherein an image of the nozzle is acquired when the nozzle is located at a prescribed position between the first position and the second position, and whether or not the IC chip is adsorbed to the nozzle is determined on the basis of the acquired image.

9. The IC chip mounting method according to claim 7 or 8, wherein the antenna continuum is transported on a prescribed transport surface, the nozzle mounting portion on which the nozzle is mounted is rotated in such a manner that the nozzle moves on a ring-shaped track in a plane orthogonal to the transport surface, and the direction of movement of the nozzle when the nozzle is located at the second position coincides with the direction of transport of the antenna continuum.

10. The IC chip mounting method according to claim 9, wherein when it is determined that the IC chip is not adsorbed to the nozzle, the nozzle mounting portion is moved in the width direction of the antenna continuum.

11. The IC chip mounting method according to claim 9, wherein when it is determined that the IC chip is not adsorbed to the nozzle, the nozzle is moved toward the center of rotation when the nozzle moves from the first position to the second position.

12. The IC chip mounting method according to claim 9, wherein the nozzle mounting portion on which a plurality of nozzles are mounted is rotated, whether or not the IC chip is adsorbed to each nozzle is determined, the nozzle among the plurality of nozzles that is determined not to have the IC chip adsorbed thereto is moved. ​

Images