Display panel and method of forming the same

Abstract

The present invention discloses a display panel, comprising a first package body. The first package body comprises a first substrate, a plurality of first light-emitting diodes and a first packaging glue. The first substrate has a bottom surface, a first side surface and a second side surface, the first side surface and the second side surface are opposite sides, and the bottom surface and the first side surface form a first angle, and the bottom surface and the second side surface form a second angle. The first light-emitting diode is located on the first substrate. The first packaging glue covers the first side surface, the second side surface and the first light-emitting diode of the first substrate. The first packaging glue has a third side surface adjacent to the first side surface and a fourth side surface adjacent to the second side surface, and the bottom surface of the first substrate and the third side surface of the first packaging glue form a third angle greater than the first angle, and the bottom surface of the first substrate and the fourth side surface of the first packaging glue form a fourth angle less than the second angle.

Description

Technical Field

[0001] Some embodiments of the present disclosure relate to display panels and methods of forming the same. Background Art

[0002] As the technology of display panels is becoming more and more advanced, the application of display panels has become more and more ubiquitous. A display panel can be formed by splicing a plurality of packages with light emitting diodes, and each package can represent a different pixel to display an image. Summary of the invention

[0003] Some embodiments of the present disclosure provide a display panel, comprising a first package body. The first package body comprises a first substrate, a plurality of first light-emitting diodes and a first packaging glue. The first substrate has a bottom surface, a first side surface and a second side surface, the first side surface of the first substrate and the second side surface of the first substrate are opposite sides, and the bottom surface of the first substrate and the first side surface form a first angle, and the bottom surface of the first substrate and the second side surface form a second angle. The first light-emitting diode is located on the first substrate. The first packaging glue covers the first side surface, the second side surface and the first light-emitting diode of the first substrate, wherein the first packaging glue has a third side surface adjacent to the first side surface of the first substrate and a fourth side surface adjacent to the second side surface of the first substrate, and the bottom surface of the first substrate and the third side surface of the first packaging glue form a third angle, and the bottom surface of the first substrate and the fourth side surface of the first packaging glue form a fourth angle, wherein the third angle is greater than the first angle, and the fourth angle is less than the second angle.

[0004] In some embodiments, the first angle and the second angle are right angles.

[0005] In some embodiments, as getting farther away from the bottom surface of the first substrate, the third side surface gets farther away from the first side surface of the first substrate of the first package, and the fourth side surface gets closer to the second side surface of the first substrate of the first package.

[0006] In some embodiments, the display panel further includes a second package body, adjacent to and in contact with the first package body. The second package body includes a second substrate, a plurality of second light-emitting diodes, and a second packaging glue. The second substrate has a bottom surface and a fifth side surface, and the fifth side surface is adjacent to the second side surface of the first substrate. The second light-emitting diode is located on the second substrate. The second packaging glue covers the fifth side surface of the second substrate and the second light-emitting diode, wherein the second packaging glue has a sixth side surface adjacent to the fifth side surface of the second substrate, and the bottom surface of the second substrate and the sixth side surface form a fifth angle, and one of the fifth angle and the fourth angle is an acute angle, and the other is an obtuse angle.

[0007] In some embodiments, the fifth angle is complementary to the fourth angle.

[0008] In some embodiments, the upper surface of the first packaging adhesive forms a sixth angle with the fourth side surface, and the sixth angle is greater than the second angle.

[0009] Some embodiments of the present disclosure provide a method for forming a display panel, comprising placing a plurality of first light-emitting diodes on a first substrate, the first substrate having a bottom surface, a first side surface, and a second side surface, the first side surface and the second side surface of the first substrate being opposite sides. A first encapsulation glue is arranged so that the first encapsulation glue covers the first side surface, the second side surface, and the first light-emitting diode of the first substrate. The first encapsulation glue is cut along a first direction from the first substrate toward the first light-emitting diode to form a third side surface of the first encapsulation glue. The first encapsulation glue is cut along a second direction from the first light-emitting diode toward the first substrate to form a fourth side surface of the first encapsulation glue to form a first encapsulation body.

[0010] In some embodiments, in the extension direction of the bottom surface, the distance between the third side surface and the first side surface is smaller than the distance between the fourth side surface and the second side surface.

[0011] In some embodiments, the method further includes cutting the second encapsulation adhesive of the second package body along a third direction to form a fifth side of the second encapsulation adhesive of the second package body, wherein the third direction is opposite to the second direction, and arranging the second package body adjacent to the fourth side of the first package body.

[0012] In some embodiments, the fifth side of the second packaging glue of the second package body contacts the first packaging glue of the first package body, and the fifth side of the second packaging glue of the second package body forms a fifth angle with the bottom surface of the second substrate of the second package body. One of the fifth angle and the fourth angle is an acute angle, and the other is an obtuse angle.

[0013] In some embodiments, the third side of the first packaging glue forms a third angle with the bottom surface of the first substrate, and the fourth side of the first packaging glue forms a fourth angle with the bottom surface of the first substrate. The third angle is greater than the first angle, and the fourth angle is smaller than the second angle.

[0014] In summary, in the present disclosure, opposite cutting directions can be used to cut off the encapsulation glue on both sides of the package. The encapsulation glue after cutting has side surfaces inclined in the same direction. When different packages are spliced ​​together, the splicing width between the packages can be reduced and the interference of the splicing width on the visual effect can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figures 1 to 6 A side view illustrating an intermediate stage of a manufacturing process of a display panel according to some embodiments of the present disclosure is shown.

[0016] Figure 7 A side view of a display panel according to another embodiment of the present disclosure is shown.

[0017] Wherein, the reference numerals are:

[0018] 100: First package

[0019] 100': First package

[0020] 110: First substrate

[0021] 110': First substrate

[0022] 112: Bottom surface

[0023] 112': bottom surface

[0024] 114: Side

[0025] 114': Side

[0026] 116: Side

[0027] 116': Side

[0028] 118': Top

[0029] 120: First light emitting diode

[0030] 120B: Blue LED chip

[0031] 120G: Green LED chip

[0032] 120R: Red LED chip

[0033] 130: First packaging glue

[0034] 132: Side

[0035] 134: Side

[0036] 200: Second package

[0037] 200': Second package

[0038] 210: Second substrate

[0039] 210': Second substrate

[0040] 212: Bottom

[0041] 212': bottom surface

[0042] 214: Side

[0043] 214': Side

[0044] 216: Side

[0045] 216': Side

[0046] 218': Top

[0047] 220: Second light emitting diode

[0048] 220B: Blue LED chip

[0049] 220G: Green LED chip

[0050] 220R: Red LED chip

[0051] 230: Second packaging glue

[0052] 232: Side

[0053] 234: Side

[0054] a1: angle

[0055] a2: Angle

[0056] a3: Angle

[0057] a4: Angle

[0058] a5: Angle

[0059] a6: Angle

[0060] a7: Angle

[0061] a8: Angle

[0062] a9: Angle

[0063] a10: Angle

[0064] D1: First direction

[0065] D2: Second direction

[0066] D3: Third direction

[0067] D4: The fourth direction

[0068] d1: distance

[0069] d2: distance

[0070] d3: first horizontal distance

[0071] d4: Second horizontal distance

[0072] T1: Thickness

[0073] T2: Thickness DETAILED DESCRIPTION

[0074] In order to enable those skilled in the art to further understand the present disclosure, preferred embodiments of the present disclosure are listed below, and the components and intended effects of the present disclosure are described in detail with reference to the accompanying drawings.

[0075] Some embodiments of the present disclosure are related to a method of cutting a package. Specifically, in the present disclosure, opposite cutting directions can be used to cut off the encapsulation glue on both sides of the package. The encapsulation glue after cutting has sides inclined in the same direction. When different packages are spliced ​​together, the splicing width between the packages can be reduced and the interference of the splicing width on the visual effect can be reduced.

[0076] Figures 1 to 6 A side view of an intermediate stage of a manufacturing process of a display panel according to some embodiments of the present disclosure is shown. Figure 1 , a first substrate 110 is provided. The first substrate 110 has a bottom surface 112, a first side surface 114, and a second side surface 116. The first side surface 114 of the first substrate 110 and the second side surface 116 of the first substrate 110 are opposite sides, and the bottom surface 112 of the first substrate 110 and the first side surface 114 form a first angle a1, and the bottom surface 112 of the first substrate 110 and the second side surface 116 form a second angle a2. More specifically, the first angle a1 is the angle between the extended surface of the planar portion of the first side surface 114 and the extended surface of the bottom surface 112, and the second angle a2 is the angle between the extended surface of the planar portion of the second side surface 116 and the extended surface of the bottom surface 112. Therefore, in some embodiments, even if there is a chamfer between the first side surface 114 and the bottom surface 112, and there is a chamfer between the second side surface 116 and the bottom surface 112, the first substrate 110 still has the first angle a1 and the second angle a2. In some embodiments, the first angle a1 and the second angle a2 are between about 80 degrees and about 100 degrees, for example, the first angle a1 and the second angle a2 are right angles. In some embodiments, the first substrate 110 can be made of any suitable material, such as glass.

[0077] exist Figure 1 In the embodiment, a plurality of first LEDs 120 are placed on the first substrate 110, so that the plurality of first LEDs 120 are located on the first substrate 110. In some embodiments, the first LEDs 120 may include a red LED chip 120R, a green LED chip 120G, and a blue LED chip 120B. Figure 1 However, the color and quantity of the first light emitting diode 120 are not limited to the following. Figure 1As shown, for example, the first LED 120 may also include a yellow LED chip, and / or the number of each red LED chip 120R, green LED chip 120G, and blue LED chip 120B may be greater than 1. In some embodiments, the first LED 120 is a sub-millimeter LED chip or a micro LED chip.

[0078] refer to Figure 2 , a first encapsulant 130 is disposed so that the first encapsulant 130 covers the first side surface 114 and the second side surface 116 of the first substrate 110 and the first light-emitting diode 120. In some embodiments, the first encapsulant 130 may be made of epoxy resin, silicone or the like, and the first encapsulant 130 may be doped with black particles, such as carbon powder, to enhance the light-shielding effect and prevent interference from electromagnetic waves.

[0079] refer to Figure 3 and Figure 4 The first packaging glue 130 is cut along the first direction D1 from the first substrate 110 to the first light emitting diode 120 to form a third side surface 132 of the first packaging glue 130. Next, the first packaging glue 130 is cut along the second direction D2 from the first light emitting diode 120 to the first substrate 110 to form a fourth side surface 134 of the first packaging glue 130 to form the first package body 100, as shown in FIG. Figure 4 As shown. Specifically, the redundant first encapsulation glue 130 can be cut off in the first direction D1 along the first side surface 114 of the first substrate 110. Then, the redundant first encapsulation glue 130 can be cut off in the second direction D2 along the second side surface 116 of the first substrate 110. The first direction D1 and the second direction D2 are perpendicular to the bottom surface 112 of the first substrate 110. When the first encapsulation glue 130 is cut, there is a horizontal distance between the cut portion and the side surface of the first substrate 110. Therefore, after the first encapsulation glue 130 is cut, the first encapsulation glue 130 still covers the first side surface 114, the second side surface 116 and the first light-emitting diode 120 of the first substrate 110, and the first encapsulation glue 130 can have a third side surface 132 adjacent to the first side surface 114 of the first substrate 110 and a fourth side surface 134 adjacent to the second side surface 116 of the first substrate 110. The first side surface 114 of the first substrate 110 does not overlap with the third side surface 132 of the first packaging glue 130, and the second side surface 116 of the first substrate 110 does not overlap with the fourth side surface 134 of the first packaging glue 130. In this way, the first packaging glue 130 still covers the first side surface 114 and the second side surface 116 of the first substrate 110, so that during the operation of splicing the first package body 100, the first packaging glue 130 can avoid collision between the first substrates 110 and reduce damage to the first package body 100.

[0080] The first encapsulant 130 may be cut in any suitable manner. In some embodiments, the first encapsulant 130 may be cut using laser cutting, a cutting knife, or the like. Due to the characteristics of the cutting process, when the first encapsulant 130 is cut, the side surface formed will not be completely parallel to the cutting direction, so the third side surface 132 of the first encapsulant 130 is not parallel to the first direction D1, and the fourth side surface 134 of the first encapsulant 130 is not parallel to the second direction D2. Specifically, when laser cutting is used, because the laser cutting head itself is conical, when the first encapsulant 130 is cut, a larger opening will be created at the cutting location. On the other hand, when a cutting knife is used, the cutting knife will react with the first encapsulant 130, for example, the cut first encapsulant 130 may generate friction heat or fines, so that the first encapsulant 130 will have a larger opening at the cutting location. Since the first direction D1 is cut from the first substrate 110 toward the first LED 120 along the first side surface 114 of the first substrate 110, the opening formed is larger near the bottom surface 112 of the first substrate 110, so that the third side surface 132 of the first encapsulant 130 is increasingly farther away from the first side surface 114 of the first substrate 110 as it moves away from the bottom surface 112 of the first substrate 110. The second direction D2 is cut from the first LED 120 toward the first substrate 110 along the second side surface 116 of the first substrate 110, and the opening formed is larger near the first LED 120, so that the fourth side surface 134 of the first encapsulant 130 is increasingly closer to the second side surface 116 of the first substrate 110 as it moves away from the bottom surface 112 of the first substrate 110. In this way, the third side surface 132 and the fourth side surface 134 of the first encapsulant 130 can be inclined toward the same side. Furthermore, in the extension direction of the bottom surface 112 of the first substrate 110 , a distance d1 between the third side surface 132 of the first packaging adhesive 130 and the first side surface 114 of the first substrate 110 is smaller than a distance d2 between the fourth side surface 134 of the first packaging adhesive 130 and the second side surface 116 of the first substrate 110 .

[0081] The third side surface 132 and the fourth side surface 134 of the first encapsulant 130 are not perpendicular to the extended surface of the bottom surface 112 of the first substrate 110. The extended surface of the bottom surface 112 of the first substrate 110 and the third side surface 132 of the first encapsulant 130 form a third angle a3, and the extended surface of the bottom surface 112 of the first substrate 110 and the fourth side surface 134 of the first encapsulant 130 form a fourth angle a4. The third angle a3 is greater than the first angle a1, and the fourth angle a4 is less than the second angle a2. For example, the first angle a1 and the second angle a2 may be right angles, the third angle a3 may be an obtuse angle, and the fourth angle a4 may be an acute angle.

[0082] refer to Figure 5, the second package 200 may be cut in the same manner after the first package 100 is cut. The second package 200 may be a package that is the same as or similar to the first package 100. The second package 200 includes a second substrate 210, a plurality of second light-emitting diodes 220, and a second packaging glue 230. The second substrate 210 has a bottom surface 212, a fifth side surface 214, and a sixth side surface 216. The fifth side surface 214 of the second substrate 210 and the sixth side surface 216 of the first substrate 110 are opposite sides. The second light-emitting diodes 220 are located on the second substrate 210. In some embodiments, the second light-emitting diodes 220 may include a red light-emitting diode chip 220R, a green light-emitting diode chip 220G, and a blue light-emitting diode chip 220B. The second packaging glue 230 covers the fifth side surface 214 and the sixth side surface 216 of the second substrate 210 and the second light-emitting diodes 220.

[0083] When cutting the second package body 200, the second encapsulation glue 230 of the second package body 200 is cut along the third direction D3 beside the fifth side surface 214 of the second substrate 210, and the seventh side surface 232 of the second encapsulation glue 230 of the second package body 200 is formed. Then, the second encapsulation glue 230 of the second package body 200 is cut along the fourth direction D4 beside the sixth side surface 216 of the second substrate 210, and the eighth side surface 234 of the second encapsulation glue 230 of the second package body 200 is formed. The third direction D3 is opposite to the second direction D2, and the third direction D3 is opposite to the fourth direction D4. The seventh side surface 232 of the second encapsulation glue 230 of the second package body 200 forms a fifth angle a5 with the extension surface of the bottom surface 212 of the second substrate 210 of the second package body 200. Since the third direction D3 is opposite to the second direction D2, the formed opening is larger near the bottom surface 212 of the second substrate 210, so that the fifth angle a5 is an obtuse angle. Other relevant details of the second package body 200 are similar or identical to those of the first package body 100 , and relevant details of cutting the second package body 200 are similar or identical to those of cutting the first package body 100 , so the relevant details are not repeated here.

[0084] refer to Figure 6, the second package body 200 is arranged on the fourth side 134 of the first encapsulant 130 adjacent to the first package body 100. Specifically, the seventh side 232 of the second encapsulant 230 of the second package body 200 contacts the fourth side 134 of the first encapsulant 130 of the first package body 100. Since the fourth side 134 of the first encapsulant 130 and the seventh side 232 of the second encapsulant 230 are cut in opposite directions, the fourth side 134 of the first encapsulant 130 and the seventh side 232 of the second encapsulant 230 are inclined in the same direction, and the upper surface of the first encapsulant 130 forms a sixth angle a6 with the fourth side 134, and the sixth angle a6 is greater than the second angle a2. When the first package body 100 and the second package body 200 are spliced ​​together, the fourth side 134 of the first encapsulant 130 and the seventh side 232 of the second encapsulant 230 can contact each other, and the seventh side 232 of the second encapsulant 230 is above the fourth side 134 of the first encapsulant 130. In other words, the fifth angle a5 is an obtuse angle, while the fourth angle a4 is an acute angle. When the first package 100 and the second package 200 are spliced ​​together, the fourth side 134 of the first package glue 130 and the seventh side 232 of the second package glue 230 can overlap in the vertical direction. In this way, the first package 100 and the second package 200 can be closely arranged. When the user uses the display panel including the first package 100 and the second package 200, it is not easy to perceive the distance between the first package 100 and the second package 200, so that the distance between the first package 100 and the second package 200 is not easy to affect the image generated by the display panel. In some embodiments, the first package 100 and the second package 200 can be selected appropriately so that the fourth angle a4 and the fifth angle a5 complement each other. The first package 100 and the second package 200 can be arranged more closely.

[0085] The method of forming the first package 100 and the second package 200 can be used to form other packages, and according to the following Figure 6 In this way, the packages can be arranged more closely, and the spacing between the packages will not easily affect the image.

[0086] Figure 7 A side view of a display panel according to another embodiment of the present disclosure is shown. Figure 7 The display panel includes a first package body 100' and a second package body 200'. The first package body 100' and the second package body 200' are respectively Figure 6The first package 100 and the second package 200 are similar, except that the first substrate 110' of the first package 100' and the second substrate 210' of the second package 200' have inclined sides through bevel cutting. The adjacent sides of the first package 100' and the second package 200' are inclined in the same direction.

[0087] Specifically, in Figure 7 , the top surface 118' of the first substrate 110' is narrower than the bottom surface 112', and a first horizontal distance d3 is formed between the side edge of the bottom surface 112' of the first substrate 110' and the side edge of the top surface 118'. The top surface 218' of the second substrate 210' is wider than the bottom surface 212', and a second horizontal distance d4 is formed between the side edge of the bottom surface 212' of the second substrate 210' and the side edge of the top surface 218'. The first side surface 114' of the first substrate 110' of the first package body 100' forms a seventh angle a7 with the bottom surface 112', and the second side surface 116' of the first substrate 110' of the first package body 100' forms an eighth angle a8 with the bottom surface 112'. Furthermore, the fifth side surface 214' of the second substrate 210' of the second package body 200' forms a ninth angle a9 with the bottom surface 212', and the sixth side surface 216' of the second substrate 210' of the second package body 200' forms a tenth angle a10 with the bottom surface 212. In some embodiments, the seventh angle a7 and the eighth angle a8 are between 45 degrees and 90 degrees, and the ninth angle a9 and the tenth angle a10 are between 90 degrees and 135 degrees. In this way, the adjacent side surfaces (e.g., the second side surface 116' and the fifth side surface 214') of the first package body 100' and the second package body 200' are inclined in the same direction. When the seventh angle a7 or the eighth angle a8 is within the disclosed range, the first horizontal distance d3 is less than the thickness T1 of the first substrate 110'. When the ninth angle a9 or the tenth angle a10 is within the disclosed range, the second horizontal distance d4 is less than the thickness T2 of the second substrate 210'. Therefore, the distance between the first LED 120 on the first package 100' and the second LED 220 on the second package 200' can be suitable for display panels of sub-millimeter LEDs and micro LEDs. Figure 7 Other details are the same as Figure 6 The same or similar, therefore, will not be described in detail.

[0088] In summary, using the cutting method of some embodiments of the present disclosure to cut the encapsulation glue of the package body can achieve advantages. Cutting the encapsulation glue in opposite cutting directions can make the side walls of the cut encapsulation glue tilt in the same direction. When different packages are spliced ​​together, the side walls of the encapsulation glue tilted in the same direction can contact each other, so that the packages can be arranged closely together. In this way, when the user uses the display panel including the package body of some embodiments of the present disclosure, it is not easy to notice the spacing between the packages, so that the spacing between the packages is not easy to affect the image produced by the display panel.

[0089] Although the present disclosure has been disclosed as above by way of embodiments, it is not intended to limit the present disclosure. Any person having ordinary knowledge in the technical field may make slight changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the scope of the attached patent application.

Claims

1. A display panel, characterized in that: Include: A first package, the first package comprising: A first substrate, wherein the first substrate has a bottom surface, a first side surface and a second side surface, the first side surface of the first substrate and the second side surface of the first substrate are opposite sides, and the bottom surface of the first substrate and the first side surface form a first angle, and the bottom surface of the first substrate and the second side surface form a second angle; A plurality of first light emitting diodes are located on the first substrate; and A first packaging glue covers the first side surface, the second side surface and the first light-emitting diodes of the first substrate, wherein the first packaging glue has a third side surface adjacent to the first side surface of the first substrate and a fourth side surface adjacent to the second side surface of the first substrate, and the bottom surface of the first substrate and the third side surface of the first packaging glue form a third angle, and the bottom surface of the first substrate and the fourth side surface of the first packaging glue form a fourth angle, wherein the third angle is greater than the first angle, and the fourth angle is less than the second angle.

2. The display panel according to claim 1, wherein: The first angle and the second angle are right angles.

3. The display panel according to claim 1, wherein: As the third side surface is further away from the bottom surface of the first substrate, the third side surface is further away from the first side surface of the first substrate of the first package, and the fourth side surface is further closer to the second side surface of the first substrate of the first package.

4. The display panel according to claim 1, wherein: The invention further comprises a second package body, adjacent to and in contact with the first package body, wherein the second package body comprises: a second substrate, wherein the second substrate has a bottom surface and a fifth side surface, and the fifth side surface is adjacent to the second side surface of the first substrate; A plurality of second light emitting diodes are located on the second substrate; A second packaging adhesive covers the fifth side surface of the second substrate and the second light-emitting diodes, wherein the second packaging adhesive has a sixth side surface adjacent to the fifth side surface of the second substrate, and the bottom surface of the second substrate and the sixth side surface form a fifth angle, and one of the fifth angle and the fourth angle is an acute angle, and the other is an obtuse angle.

5. The display panel according to claim 4, wherein: The fifth angle is complementary to the fourth angle.

6. The display panel according to claim 1, wherein: An upper surface of the first packaging adhesive forms a sixth angle with the fourth side surface, and the sixth angle is greater than the second angle.

7. A method for forming a display panel, characterized in that: Include: Placing a plurality of first light emitting diodes on a first substrate, the first substrate having a bottom surface, a first side surface and a second side surface, the first side surface and the second side surface of the first substrate being opposite sides; Disposing a first packaging adhesive so that the first packaging adhesive covers the first side surface and the second side surface of the first substrate and the first light emitting diodes; Cutting the first packaging adhesive along a first direction from the first substrate toward the first light emitting diodes to form a third side surface of the first packaging adhesive; and Cutting the first packaging glue along a second direction from the first light emitting diodes toward the first substrate and forming a fourth side surface of the first packaging glue to form a first packaging body; Among them, the bottom surface of the first substrate forms a first angle with the first side surface, the bottom surface of the first substrate forms a second angle with the second side surface, the third side surface of the first packaging glue forms a third angle with the bottom surface of the first substrate, and the fourth side surface of the first packaging glue forms a fourth angle with the bottom surface of the first substrate, the third angle is greater than the first angle, and the fourth angle is smaller than the second angle.

8. The method according to claim 7, characterized in that In an extension direction of the bottom surface, a distance between the third side surface and the first side surface is smaller than a distance between the fourth side surface and the second side surface.

9. The method according to claim 7, characterized in that Also includes: Cutting a second packaging adhesive of a second package body along a third direction to form a fifth side surface of the second packaging adhesive of the second package body, wherein the third direction is opposite to the second direction; and The second package body is arranged on the fourth side surface adjacent to the first package body.

10. The method according to claim 9, characterized in that The fifth side surface of the second packaging glue of the second packaging body contacts the first packaging glue of the first packaging body, and the fifth side surface of the second packaging glue of the second packaging body forms a fifth angle with a bottom surface of a second substrate of the second packaging body. One of the fifth angle and the fourth angle is an acute angle, and the other is an obtuse angle.

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