Substrate processing apparatus

Abstract

A holding mechanism (21) holds a substrate (SB) horizontally. A rotating mechanism (22) rotates the holding mechanism (21) holding the substrate (SB). A nozzle (51) supplies a processing liquid toward the substrate (SB). A nozzle arm (52) holds the nozzle (51). An arm operation mechanism (53) moves the nozzle arm (52) between a processing position overlapping the substrate (SB) in plan view and a retreat position deviated from the substrate (SB) in plan view. A cup portion (3) is arranged around the holding mechanism (21) and receives the processing liquid from the substrate (SB). A cup operation mechanism (40) moves the cup portion (3) up and down between an upper position and a lower position. A first container (61) is fixed to the cup portion (3) so as to be capable of moving up and down integrally with the cup portion (3), and is capable of accommodating the nozzle (51) positioned at the retreat position.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus for processing substrates using a processing liquid. Furthermore, the substrates include semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for plasma displays, glass or ceramic substrates for magnetic disks or optical disks, glass substrates for organic EL (electroluminescence) devices, glass substrates for solar cells, or silicon substrates, etc. Background Technology

[0002] According to Japanese Patent Application Publication No. 2018-107397 (Patent Document 1), a substrate processing apparatus is disclosed in which a processing liquid nozzle, which moves from a standby position to above the substrate, supplies processing liquid to the substrate. The substrate processing apparatus is provided with a baffle to catch the processing liquid that sprays around the substrate. A baffle lifting drive mechanism is connected to the baffle, which can be raised or lowered according to a lifting command from a control unit. The substrate processing apparatus also includes a standby cartridge for idling the nozzle when it has moved to the standby position. The standby cartridge is used to keep the nozzle idle during the period when it is not spraying processing liquid onto the substrate. Furthermore, during this standby period, processing liquid is preparatoryly sprayed, i.e., a so-called pre-dispensing process is performed. The sprayed processing liquid is captured by the standby cartridge. The standby cartridge has a container. An opening for inserting the tip of a nozzle into the standby cartridge is provided on the upper surface of the container; the opening is open when the nozzle leaves the standby cartridge. On the other hand, the opening is blocked by inserting the tip of the nozzle, and the treatment liquid sprayed from the nozzle can be received inside the container.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-107397 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] According to the technology described in the aforementioned publication, when inserting the nozzle into the opening of the standby cartridge container, a downward movement of the nozzle is required. However, there are situations where such an action is undesirable. In particular, if the substrate processing apparatus does not have an operating mechanism for moving the nozzle up and down, it is impossible to perform the aforementioned downward movement. Furthermore, even if the substrate processing apparatus has an operating mechanism for moving the nozzle up and down, there are still situations where the operation of the substrate processing apparatus is complicated by the downward movement of the nozzle.

[0008] The present invention was made to solve the above problems, and its purpose is to provide a substrate processing apparatus that does not require a nozzle descent action when the nozzle is being received into a container.

[0009] means for solving problems

[0010] The first embodiment is a substrate processing apparatus for processing a substrate using a processing liquid, comprising: a holding mechanism for holding the substrate horizontally; a rotating mechanism for rotating the holding mechanism holding the substrate; a nozzle for supplying the processing liquid to the substrate; a nozzle arm for holding the nozzle; an arm actuation mechanism for moving the nozzle arm between a processing position overlapping the substrate in plan view and a retracted position deviating from the substrate in plan view; a cup portion disposed around the holding mechanism for receiving the processing liquid from the substrate; a cup actuation mechanism for moving the cup portion vertically between an upper position and a lower position; and a first container fixed to the cup portion in a manner that allows it to move vertically integrally with the cup portion and is capable of accommodating the nozzle located in the retracted position.

[0011] The second method is based on the substrate processing apparatus of the first method, wherein the first container overlaps with the cup portion when viewed from above.

[0012] The third method, based on the substrate processing apparatus of the first or second method, further includes: a control unit that controls the arm action mechanism and the cup action mechanism; the control unit has a first control mode in which, when the nozzle is in the retraction position, the cup action mechanism is controlled to move from the lower position to the upper position.

[0013] The fourth method, based on the third-party substrate processing apparatus, has a second control mode in which, when the cup is in the above-mentioned upper position, the nozzle is maintained at a middle position that is offset from the substrate and is more inward than the retraction position when viewed from above.

[0014] The fifth method, based on the substrate processing apparatus of any one of the first to fourth methods, further includes: a second container capable of accommodating the nozzle located at a position different from the retraction position.

[0015] The sixth method is based on the substrate processing apparatus of any one of the first to fifth methods, wherein the aforementioned arm action mechanism moves the nozzle arm in such a way that the aforementioned nozzle moves horizontally along a straight line.

[0016] The seventh method is based on the substrate processing apparatus of any one of the first to fifth methods, wherein the arm actuation mechanism moves the nozzle arm in such a way that the nozzle moves horizontally along an arc.

[0017] Invention Effects

[0018] According to the first method, a first container that can accommodate a nozzle in a retracted position is fixed to a cup in a manner that allows it to move up and down integrally with the cup. Thus, after the nozzle retracts to the retracted position, the action of raising the cup and the action of accommodating the nozzle in the first container can be performed simultaneously.

[0019] According to the second method, the first container overlaps with the cup portion when viewed from above. This reduces the area used to assemble the first container and the cup portion.

[0020] According to the third method, the control unit has a first control mode in which, when the nozzle is in the retracted position, the cup actuation mechanism is controlled to move the cup from a lower position to an upper position. This allows for simultaneous control of both raising the cup and bringing the nozzle into the first container.

[0021] According to the fourth method, the control unit has a second control mode in which, when the cup is in the upper position, the nozzle is maintained at a middle position that is offset from the substrate and is more inward than the retracted position when viewed from above. Thus, even if the movement of the nozzle toward the retracted position is blocked by the cup in the upper position, liquid dripping from the nozzle toward the substrate can still be prevented by maintaining the nozzle in the middle position.

[0022] According to the fifth method, the substrate processing apparatus has a second container capable of accommodating a nozzle located at a position different from the retracted position. Thus, the nozzle can be accommodated even at a position other than that of the first container.

[0023] According to the sixth method, the nozzle arm is moved by an arm actuation mechanism that moves the nozzle horizontally along a straight line. This allows for high-precision position control along this straight line.

[0024] According to the seventh method, the nozzle arm is moved by an arm-operated mechanism that moves the nozzle horizontally along an arc. Thus, a wide range of nozzle movement can be achieved with a simple arm-operated mechanism. Attached Figure Description

[0025] Figure 1 This is a top view that schematically shows the configuration of the substrate processing system in Embodiment 1 of the present invention.

[0026] Figure 2 It is a general representation in Figure 1 A block diagram showing the configuration of the control unit included in the substrate processing system.

[0027] Figure 3 It is a general representation in Figure 1A top view of the substrate processing apparatus included in the substrate processing system.

[0028] Figure 4 It will be Figure 3 The top view of the nozzle and nozzle arm near the nozzle is omitted.

[0029] Figure 5 It is along Figure 3 A schematic cross-sectional view of line VV, and a diagram that schematically illustrates the step of spraying the processing liquid from the nozzle toward the substrate.

[0030] Figure 6 This is a flowchart that schematically illustrates a method for housing a nozzle in a container according to Embodiment 1 of the present invention.

[0031] Figure 7 It is a general representation in Figure 6 A cross-sectional view of the situation after the step of moving the cup from the upper position to the lower position.

[0032] Figure 8 It is a general representation in Figure 6 A top view of the situation after the step of moving the nozzle from the processing position to the retraction position.

[0033] Figure 9 It is along Figure 8 A rough cross-sectional view of line IX-IX.

[0034] Figure 10 It is a general representation in Figure 6 A cross-sectional view of the situation after the step of moving the cup from the bottom position to the top position.

[0035] Figure 11 This is a flowchart that schematically illustrates a method for housing a nozzle in a container in Embodiment 2 of the present invention.

[0036] Figure 12 It is a general representation in Figure 11 A top view of the situation after the step of moving the nozzle from the treatment position to the center position.

[0037] Figure 13 It is a general representation in Figure 11 A cross-sectional view of the situation after the step of moving the cup from the upper position to the lower position.

[0038] Figure 14 This is a top view that roughly shows the configuration of the substrate processing apparatus in Embodiment 3 of the present invention with the nozzle in the processing position.

[0039] Figure 15 This is roughly represented by the nozzle being in the retracted position.Figure 14 A top view of the configuration of the substrate processing apparatus.

[0040] Figure 16 This is a top view that schematically shows the configuration of the substrate processing apparatus in Embodiment 4 of the present invention.

[0041] Figure 17 This is a cross-sectional view that schematically shows the configuration of the substrate processing apparatus in Embodiment 5 of the present invention. Detailed Implementation

[0042] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. Furthermore, in the following drawings, the same or equivalent parts will be labeled with the same reference numerals without repeating their descriptions.

[0043] <Implementation Method 1>

[0044] Figure 1 This is a top view schematically showing the configuration of the substrate processing system 100 in Embodiment 1. The substrate processing system 100 includes a loading port LP, an indexing robot IR, a central robot CR, a control unit 90 (controller), and at least one processing unit UT (in Figure 1 (There are four processing units in the middle). Multiple processing units UT are used to process the substrate SB (wafer), at least one of which has details corresponding to the substrate processing apparatus 101 described later. The substrate processing apparatus 101 is a single-sheet apparatus for substrate processing, for example, a single-sheet apparatus for removing organic matter adhering to the substrate SB. The substrate processing apparatus 101 may have a chamber 80. In this case, substrate processing can be performed in a desired ambient gas by controlling the ambient gas within the chamber 80.

[0045] The control unit 90 can control the operation of each part included in the substrate processing system 100. Each carrier C is a receiving container for holding substrates SB. The loading port LP is a receiving container holding mechanism that holds multiple carriers C. The indexing robot IR can transfer substrates SB between the loading port LP and the substrate placement unit PS. The central robot CR can transfer substrates SB from either the substrate placement unit PS or at least one processing unit UT to the other. With the above configuration, the indexing robot IR, the substrate placement unit PS, and the central robot CR function as a transfer mechanism for transferring substrates SB between each processing unit UT and the loading port LP.

[0046] Unprocessed substrate SB is removed from carrier C by indexing robot IR and transferred to central robot CR via substrate placement unit PS. Central robot CR moves the unprocessed substrate SB into processing unit UT. Processing unit UT processes substrate SB. Processed substrate SB is removed from processing unit UT by central robot CR, and after further processing by other processing units UT as needed, is transferred to indexing robot IR via substrate placement unit PS. Indexing robot IR moves the processed substrate SB into carrier C. This process completes the processing of substrate SB.

[0047] Figure 2 It is a general representation in Figure 1 This is a block diagram illustrating the configuration of the control unit 90 included in the substrate processing system 100. The control unit 90 can be configured as a general computer with circuitry. Specifically, the control unit 90 includes a CPU (Central Processing Unit) 91, a ROM (Read Only Memory) 92, a RAM (Random Access Memory) 93, a storage device 94, an input unit 96, a display unit 97, and a communication unit 98, as well as a bus 95 connecting them to each other.

[0048] ROM 92 stores the basic program. RAM 93 is used as the operating area for CPU 91 to perform specified processing. Storage device 94 is configured as a non-volatile storage device such as flash memory or hard disk. Input unit 96 is configured as various switches or touch panels, etc., and receives input setting instructions such as processing procedures from the operator. Display unit 97 is configured as, for example, a liquid crystal display device and lights, and displays various information under the control of CPU 91. Communication unit 98 has data communication functions via LAN (Local Area Network), etc. Storage device 94 is pre-set with parameters for the board processing system ( Figure 1 The control unit 90 has multiple control modes for each device. The CPU 91 executes a processing program 94P, which selects one of the multiple modes and controls each device accordingly. Furthermore, the processing program 94P can also be stored on a recording medium. If this recording medium is used, the processing program 94P can be installed on the control unit 90. Moreover, some or all of the functions performed by the control unit 90 do not necessarily have to be implemented in software; they can also be implemented in hardware such as dedicated logic circuits.

[0049] Figure 3 This is a general representation of the substrate processing system 100 ( Figure 1 A top view of the configuration of the substrate processing apparatus 101 included in the apparatus. Figure 4 It will be Figure 3A top view of the area near the nozzle 51 of the nozzle 51 and nozzle arm 52, with the illustration omitted. In these figures, for ease of explanation, the substrate SB processed by the substrate processing apparatus 101 is also shown in addition to the substrate processing apparatus 101. Figure 5 It is along Figure 3 The diagram is a schematic cross-sectional view of line VV and schematically illustrates the step of ejecting the processing liquid LF from nozzle 51 toward substrate SB. Substrate processing apparatus 101 is used to process substrate SB using processing liquid.

[0050] The substrate processing apparatus 101 includes a rotary chuck 20, a nozzle 51, a nozzle arm 52, an arm actuation mechanism 53, a cup portion 3, a cup actuation mechanism 40, a first container 61, and a storage member 24. The rotary chuck 20 includes a holding mechanism 21 and a rotating mechanism 22.

[0051] The holding mechanism 21 holds the substrate SB horizontally. The rotation mechanism 22 rotates the holding mechanism 21 holding the substrate SB about a rotation axis CX that passes through the center of the substrate SB and extends in the vertical direction (see reference). Figure 5 (Arrow AR in the diagram). The rotation axis CX is along the vertical direction. The rotation mechanism 22 has a shaft 22X extending along the rotation axis CX and a motor 22M that rotates the shaft 22X about the rotation axis CX. The rotation mechanism 22 is protected by a housing member 24.

[0052] Specifically, the holding mechanism 21 is a mechanism that holds the substrate SB in a generally horizontal position while allowing it to rotate, with the processed main surface of the substrate SB facing upwards. Here, "horizontal position" means that the thickness direction of the substrate SB is along the vertical direction. The holding mechanism 21, rotated by the rotation mechanism 22, causes the substrate SB to rotate about a vertical (imaginary) axis of rotation CX passing through the center of its main surface. The axis of rotation CX is preferably through the center of the substrate SB. The holding mechanism 21, for example, has a generally circular plate shape. The holding mechanism 21 is configured such that its upper surface is generally horizontal, and its central axis is approximately aligned with the axis of rotation CX. Figure 3 In this example, the diameter of the holding mechanism 21 is smaller than the diameter of the substrate SB. A generally cylindrical shaft 22X is connected to the lower surface of the holding mechanism 21.

[0053] A suction mechanism MV is provided in the rotary chuck 20. The suction mechanism MV has a suction hole 25, a suction pipe 26, an on / off valve (not shown), and a pump (not shown). Specifically, a suction hole 25 is provided on the upper surface of the holding mechanism 21. The suction hole 25 is connected to the pump (not shown) via the suction pipe 26 extending in the internal space of the shaft 22X and the on / off valve (not shown). The pump and the on / off valve are electrically connected to the control unit 90. Figure 1The control unit 90 controls the operation of the pump and the on / off valve. The pump can selectively supply negative and positive pressure according to the control unit 90. With the substrate SB placed on the upper surface of the holding mechanism 21 in a generally horizontal position, when the pump supplies negative pressure, the suction hole 25 of the holding mechanism 21 adsorbs and holds the substrate SB from below. When the pump supplies positive pressure, the substrate SB can be removed from the upper surface of the holding mechanism 21. In this configuration, the holding mechanism 21 that adsorbs and holds the substrate SB is rotated by the rotating mechanism 22.

[0054] Furthermore, the holding mechanism 21 may also have multiple mechanical chuck pins, which are spaced appropriately apart near the periphery of the upper surface of the holding mechanism 21, replacing the suction holes 25. These multiple chuck pins hold the substrate SB. In this case, the substrate holding mechanism is, for example, a circular plate slightly larger than the substrate SB. The multiple chuck pins hold the substrate SB in a generally horizontal position, slightly higher than the upper surface of the substrate holding mechanism 21. Each chuck pin communicates with the control unit 90 (… Figure 1 The motor, etc., which are electrically connected, can be selectively switched to a state in which the substrate SB is held against the periphery of the substrate SB, and a state in which the substrate SB is released from the periphery of the substrate SB.

[0055] Nozzle 51 supplies processing liquid to substrate SB. Specifically, nozzle 51 sprays a stream of processing liquid LF from above substrate SB toward substrate SB. Nozzle arm 52 holds nozzle 51. Arm movement mechanism 53 is controlled by unit 90. Figure 1 Controlled, thereby positioning the nozzle arm 52 at a processing position overlapping the substrate SB in a top view (see reference). Figure 3 ), and the retraction position from the substrate SB as viewed from above (refer to Figure 8 The nozzle arm 52 moves between the nozzle 51 and the nozzle 51. Specifically, the arm actuation mechanism 53 moves the nozzle arm 52 in such a way that the nozzle 51 moves horizontally along a straight line (see reference). Figure 3 and Figure 8 The direction of extension of the straight line includes a radial component of the substrate SB, preferably along the radial direction.

[0056] The treatment fluid is supplied from the treatment fluid source 55 to the nozzle 51 via valve 56. Valve 56 is controlled by control unit 90. Figure 1 Controlled by valve 56. When valve 56 is set to the open state, the liquid flow LF( of the treatment fluid is ejected from nozzle 51) Figure 5 In addition, in Figure 5 In other figures, the diagrams of valve 56 and the processing fluid source 55 are omitted.

[0057] The cup portion 3 is positioned around the holding mechanism 21 to receive the processing liquid scattered by the substrate SB, which rotates due to centrifugal force. The cup actuation mechanism 40 is controlled by the control unit 90, thereby positioning the cup portion 3 in an upward position ( Figure 5) and the position below ( Figure 7 The cup movement mechanism 40 is supported by the bottom BM of the chamber, thus allowing the height of the cup portion 3 above the bottom BM to vary. When the cup portion 3 is in the upper position, the inner edge of the upper part of the cup portion 3 is positioned sufficiently high above the upper surface of the holding mechanism 21 (the support surface of the holding mechanism 21 that supports the substrate SB) to adequately receive the processing liquid splashed from the substrate SB. When the cup portion 3 is in the lower position, the cup portion 3 as a whole is positioned lower than the upper surface of the holding mechanism 21 in a manner that does not obstruct the movement of the substrate SB or the nozzle 51.

[0058] Specifically, the cup portion 3 may have a bottom 31, an inner baffle 32, and an outer baffle 33. The upper portions of both the inner baffle 32 and the outer baffle 33 have an inner surface that rises higher closer to the substrate SB in order to efficiently receive the processing liquid spilled from the substrate SB. Furthermore, as... Figure 5 As shown, the inner ends of the upper parts of the inner baffle 32 and the outer baffle 33 may also be provided with a downward-hanging portion to prevent the processing liquid temporarily received by the cup 3 from splashing back onto the substrate SB. To allow the bottom 31, the inner baffle 32, and the outer baffle 33 to move independently, the cup actuation mechanism 40 may also have a bottom actuation mechanism 41, an inner baffle actuation mechanism 42, and an outer baffle actuation mechanism 43, which are, for example, constructed using stepper motors. The inner baffle 32 and the outer baffle 33 are each cylindrical components that surround the holding mechanism 21. The outer baffle 33 surrounds the inner baffle 32. Furthermore, the outer baffle 33 covers the upper surface of the inner baffle 32. Alternatively, a single baffle or three or more baffles may be provided instead of these two baffles. The bottom 31 is positioned below the inner baffle 32 to receive the processing liquid falling within the inner baffle 32. The bottom 31 may also have a discharge port (not shown) for discharging the processing liquid. Furthermore, as a variation, a bottom may be provided to receive the treatment liquid falling between the inner baffle 32 and the outer baffle 33.

[0059] The first container 61 can accommodate the nozzle 51 in the retracted position. The nozzle 51 can be pre-dispensed or cleaned within the first container 61. Figure 5 As shown, the first container 61 has an opening facing upwards. The first container 61 is fixed to the cup portion 3 in a manner that allows it to move vertically as part of the cup portion 3. When the cup portion 3 is in the lower position (see reference...), Figure 9 The opening of the first container 61 is located lower than the lower end of the nozzle 51. Furthermore, when the cup portion 3 is in the upper position (see reference...), Figure 10 The opening of the first container 61 is located higher than the lower end of the nozzle 51. Figure 5 In the example, the first container 61 is mounted on the upper surface of the outer baffle 33, so the first container 61 appears as a top view (Figure 4 It overlaps with cup part 3.

[0060] Figure 6 This is a flowchart that schematically illustrates the method of housing the nozzle 51 in the first container 61 in this embodiment 1.

[0061] In step S10 ( Figure 6 The cup portion 3 moves from a top position to a bottom position. Specifically, the nozzle 51 is positioned in the processing position (see reference). Figure 3 And the cup part 3 is located at the top (refer to...) Figure 5 The configuration of the nozzle 51 is such that it is located in the processing position (refer to...). Figure 3 And the cup part 3 is located at the bottom (refer to...) Figure 7 The configuration is transferred.

[0062] In step S20, nozzle 51 self-processing position (refer to...) Figure 3 and Figure 5 ) towards the retreat position (refer to) Figure 8 and Figure 9 )move.

[0063] In step S30, the execution control unit 90 ( Figure 1 The first control mode possessed by ) Specifically, when the nozzle 51 is in the retracted position as a result of the above step S20 (refer to Figure 9 The cup action mechanism 40 is controlled to move the cup part 3 from a lower position to an upper position. Figure 5 The result is, as Figure 10 As shown, nozzle 51 is housed in first container 61.

[0064] According to this embodiment, the first container 61 that can accommodate the nozzle 51 in the retracted position is fixed to the cup 3 in a manner that allows it to move up and down integrally with the cup 3. Thus, after the nozzle 51 retracts to the retracted position, the action of raising the cup 3 and the action of accommodating the nozzle 51 in the first container 61 can be performed simultaneously.

[0065] First container 61 ( Figure 4 When viewed from above, it overlaps with the cup portion 3. This reduces the area used to assemble the first container 61 and the cup portion 3.

[0066] Control Unit 90 ( Figure 1 It has a first control mode in which, when nozzle 51 is in the retracted position (refer to...) Figure 9 The cup action mechanism 40 is controlled to move the cup part 3 from a lower position to an upper position (see reference). Figure 10 Therefore, control can be performed to simultaneously perform the action of raising the cup 3 and the action of receiving the nozzle 51 toward the first container 61.

[0067] The arm actuator 53 moves the nozzle arm 52 in such a way that the nozzle 51 moves horizontally along a straight line (see reference). Figure 3 and Figure 8 In other words, the arm action mechanism 53 is a linear actuator. This allows for high-precision position control along this linear direction. In particular, when performing substrate processing only at the periphery of the substrate SB, i.e., edge processing, precise positional accuracy of the nozzle 51 in the radial direction of the substrate SB is critical; therefore, the application of a linear actuator is especially effective. The nozzle 51 for edge processing typically has an outlet configured to eject a flow of processing liquid LF in a direction inclined from vertically. Figure 5 Typically, as shown in the figure, the liquid flow LF is ejected downwards and outwards. In this case, in order to accurately manage the processed area on the substrate SB in the radial direction, not only the horizontal position accuracy of the nozzle 51 is required, but also the vertical position accuracy. According to this embodiment, when the nozzle 51 is housed in the first container 61, it is not necessary to move the nozzle 51 in the vertical direction. Therefore, the vertical position of the nozzle 51 can be set to a fixed value and accurately managed. Thus, unexpected deviations in the vertical position of the nozzle 51 can be avoided. Therefore, the positional accuracy of the crystal edge processing can be improved.

[0068] <Implementation Method 2>

[0069] Figure 11 This is a flowchart that schematically illustrates the method of housing the nozzle 51 in the container in Embodiment 2.

[0070] In step S1 ( Figure 11 ), Execution Control Department 90 ( Figure 1 The second control mode is available. Specifically, the control unit 90 operates in the upper position when the cup part 3 is in the upper position (see reference). Figure 5 ) Move nozzle 51 from the processing position to the center position (refer to) Figure 12 The movement is controlled by the arm action mechanism 53. This intermediate position, viewed from above, is offset from the substrate SB and is more than the retracted position (see reference). Figure 10 (The position is further inside.) Moreover, the control unit 90 keeps the cup part 3 in the upper position and the nozzle 51 in the middle position.

[0071] In step S2 ( Figure 11 While maintaining the configuration established in step S1, certain substrate processing is performed without using nozzle 51. Typically, this involves rotating the substrate SB to remove processing liquid adhering to it; in other words, a substrate drying process is performed.

[0072] In step S15 ( Figure 11 ), cup part 3 from the top position (refer to Figure 12 ) Downward position (refer to) Figure 13 ) Move. In step S25 ( Figure 11 Nozzle 51 is positioned from the middle (refer to...) Figure 13 ) towards the retreat position (refer to) Figure 9 Move. Then, proceed with step S30 in the same manner as in Embodiment 1 described above. Figure 11 ) (refer to Figure 10 ).

[0073] In addition, except that the control unit 90 has a second control mode, this embodiment 2 is the same as the aforementioned embodiment 1.

[0074] According to this embodiment, the nozzle 51 is maintained in the intermediate position when the cup portion 3 is in the upper position using the second control mode. Therefore, even if the movement of the nozzle 51 toward the retracted position is obstructed by the cup portion 3 in the upper position, liquid dripping from the nozzle 51 onto the substrate SB can be prevented by maintaining the nozzle 51 in the intermediate position.

[0075] <Implementation Method 3>

[0076] Figure 14 and Figure 15 These are top views that roughly show the configuration of the substrate processing apparatus 102 in this embodiment 3, with the nozzle 51 in the processing position and in the retracted position, respectively. The substrate processing apparatus 102 has an arm actuation mechanism 53M, replacing the arm actuation mechanism 53 ( Figure 3 : Embodiment 1). The arm actuation mechanism 53M moves the nozzle arm 52 in such a way that the nozzle 51 moves horizontally along an arc. In addition, the arm actuation mechanism 53M can not only move the nozzle 51 horizontally as described above, but also move it vertically.

[0077] Except as described above, this embodiment 3 is the same as embodiment 1 or 2 described above.

[0078] According to this embodiment, the arm actuation mechanism 53M moves the nozzle arm 52 in a manner that causes the nozzle 51 to move horizontally along an arc, as described above. Thus, a wide range of movement of the nozzle 51 can be achieved with a simple arm actuation mechanism.

[0079] <Implementation Method 4>

[0080] Figure 16 This is a top view that schematically shows the configuration of the substrate processing apparatus 103 in this embodiment 4. The substrate processing apparatus 103, except for the substrate processing apparatus 102 ( Figure 14In addition to the configuration of embodiment 3), a second container 62 is also provided. The second container 62 can accommodate the nozzle 51 located at a position different from the retracted position. Thus, the nozzle 51 can be accommodated even in positions other than those of the first container 61. In the illustrated configuration, the second container 62 is disposed on the outer side of the cup portion 3 away from the cup portion 3. Unlike the first container 61, the second container 62 may not move vertically integrally with the cup portion 3. As a variation, the second container 62 may also be disposed on the inner side of the cup portion 3 away from the cup portion 3.

[0081] Furthermore, for matters other than those described above, this embodiment 4 is the same as the aforementioned embodiment 3. Additionally, as a variation, the second container 62 can also be applied to the aforementioned embodiment 1 or 2.

[0082] <Implementation Method 5>

[0083] Figure 17 This is a cross-sectional view schematically showing the configuration of the substrate processing apparatus 104 in this embodiment 5. The substrate processing apparatus 104 is a processing apparatus for edge processing. The substrate processing apparatus 104, in addition to the substrate processing apparatus 101 ( Figure 5 In addition to the configuration of embodiment 1), it also includes a gas nozzle 81, a valve 86, and a gas source 85. The outer edge of the gas nozzle 81 has a circular shape. The radius of the circular shape of the gas nozzle 81 is smaller than the radius of the substrate SB.

[0084] Gas is supplied from gas source 85 to gas nozzle 81 via valve 86. Gas source 85 can be a non-reactive gas source, such as a nitrogen source. Valve 86 is controlled by control unit 90. Figure 1 Control. The gas nozzle 81 has a downward-facing opening 82 and an outward-facing opening 83. When the valve 86 is set to the open state, airflows F1 and F2 are ejected from openings 82 and 83, respectively. Airflow F1 prevents the processing liquid from unexpectedly intruding into the vicinity of the center of the substrate SB. Airflow F2 suppresses the processing liquid that bounces back from the cup portion 3 from reaching the substrate SB. Airflow F2 preferably flows away from the nozzle 51 outlet and directly below it. This prevents airflow F2 from disturbing the flow direction of the processing liquid LF.

[0085] In various embodiments including this embodiment, it is preferred that the inner baffle 32 and the outer baffle 33 each have a downwardly projecting portion 32A and a downwardly projecting portion 33A. The downwardly projecting portions 32A and 33A extend downwardly from the inner ends of the upper portion of the inner baffle 32 and the outer baffle 33, respectively. The downwardly projecting portions 32A and 33A each have the effect of preventing the processing liquid received by the inner baffle 32 and the outer baffle 33 from returning to the substrate SB. On the other hand, the downwardly projecting portions 32A and 33A can easily cause the processing liquid from the substrate SB to be reflected towards the substrate SB, which is not desirable. Therefore, it is preferred that the inner ends of the upper portion of the inner baffle 32 and the outer baffle 33, when viewed from above (refer to...), have a downwardly projecting portion 32A and a downwardly projecting portion 33A. Figure 3 The portion closest to nozzle 51 does not have drooping portions 32A and 33A. In this case, near the processing position of nozzle 51, the processing liquid received by the inner baffle 32 and outer baffle 33 easily returns towards the substrate SB. This return can be suppressed by the aforementioned airflow F2.

[0086] However, the airflow F2 alone is insufficient to adequately prevent the processing liquid from the cup portion 3 from returning to the substrate SB. Therefore, it is preferable that the radius of the circular shape of the gas nozzle 81 is more than 2 / 3 of the radius of the substrate SB. In this case, a wide area from the center of the substrate SB to its periphery is covered by the gas nozzle 81, and this area is used to block the processing liquid that bounces back from the cup portion 3.

[0087] Furthermore, for configurations other than those described above, since they are substantially the same as those in Embodiment 1 described above, the same reference numerals are added to the same or corresponding elements, and their descriptions are not repeated.

[0088] The present invention has been described in detail above, but all the methods described above are merely illustrative and the present invention is not limited to these methods. It should be understood that numerous modifications not illustrated can be deduced without departing from the scope of the present invention. The components described in the above embodiments and modifications may be appropriately combined or omitted as long as they do not contradict each other.

[0089] [Explanation of the labeling in the attached diagram]

[0090] 3: Cup section

[0091] 20: Rotary chuck

[0092] 21: Maintain the organization

[0093] 22: Rotating mechanism

[0094] 22M: Motor

[0095] 22X: Axis

[0096] 24: Storage components

[0097] 25: Suction hole

[0098] 26: Suction piping

[0099] 31: Bottom

[0100] 32: Inner baffle

[0101] 32A, 33A: Lower part

[0102] 33: Outer baffle

[0103] 40: Cup Action Mechanism

[0104] 41: Bottom Action Mechanism

[0105] 42: Inner baffle action mechanism

[0106] 43: Outer baffle action mechanism

[0107] 51: Nozzle

[0108] 52: Nozzle arm

[0109] 53, 53M: Arm motion mechanism

[0110] 55: Processing liquid source

[0111] 56: Valve

[0112] 61: First Container

[0113] 62: Second container

[0114] 81: Gas Nozzle

[0115] 82, 83: Opening

[0116] 85: Gas Source

[0117] 86: Valve

[0118] 90: Control Department

[0119] 100: Substrate Processing System

[0120] 101-104: Substrate processing apparatus

[0121] SB: Substrate

Claims

1. A substrate processing apparatus for processing a substrate using a processing liquid, comprising: A holding mechanism that holds the aforementioned substrate horizontal; A rotating mechanism that rotates the holding mechanism that holds the substrate. A nozzle that supplies the processing liquid toward the substrate; The nozzle arm holds the aforementioned nozzle; An arm actuation mechanism that moves the nozzle arm between a processing position where the nozzle overlaps with the substrate in a top view and a retraction position where the nozzle deviates from the substrate in a top view. The cup portion is disposed around the holding mechanism and receives the processing liquid from the substrate. A cup-moving mechanism that causes the cup to move up and down between an upper position and a lower position; A first container is fixed to the cup portion in a manner that allows it to move vertically integrally with the cup portion, and is capable of accommodating the nozzle located in the retracted position; and The control unit has a first control mode in which, when the nozzle is in the retracted position, the cup actuation mechanism is controlled to move the cup portion from the lower position to the upper position. The aforementioned upper position is set such that, in the aforementioned first control mode, when the cup portion moves to the aforementioned upper position, the upper surface of the aforementioned first container is located above the tip of the aforementioned nozzle.

2. The substrate processing apparatus as claimed in claim 1, wherein, The first container mentioned above overlaps with the cup mentioned above when viewed from above.

3. The substrate processing apparatus as described in claim 1 or 2, wherein, The control unit has a second control mode in which, when the cup is in the above-mentioned upper position, the nozzle is maintained at a middle position that is offset from the substrate and is more inward than the retraction position when viewed from above.

4. The substrate processing apparatus as described in claim 1 or 2, wherein, It also has: The second container is capable of accommodating the nozzle located at a position different from the aforementioned retreat position.

5. The substrate processing apparatus as described in claim 1 or 2, wherein, The aforementioned arm action mechanism moves the nozzle arm in such a way that the nozzle moves horizontally along a straight line.

6. The substrate processing apparatus as claimed in claim 1 or 2, wherein, The aforementioned arm action mechanism moves the nozzle arm in such a way that the nozzle moves horizontally along an arc.

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