Fast cutting device

Abstract

The present invention provides a fast cutting device for safely processing a workpiece having a protrusion formed on the outer surface. A fast cutting device (1) is used for cutting the upper surface (75c) of a BG film (75) adhered to a workpiece (7), wherein the workpiece (7) includes a protrusion area (73) having a protrusion (71) formed on the outer surface (72) and a peripheral area (74) around the protrusion area (73). The fast cutting device (1) includes: a fast cutting tool (21), a tool spindle (22) and a chuck (3), wherein the tool spindle (22) is provided with the fast cutting tool (21) at its lower end, and the tool spindle (22) can be raised and lowered when the fast cutting tool (21) is rotated, and the chuck (3) holds the workpiece (7) in a rotatable manner, and the fast cutting tool (21) cuts the upper surface (75c) of the BG film (75) from the center to the periphery.

Description

Technical Field

[0001] The present invention relates to a fast cutting device for cutting a protective film which is adhered to a workpiece having ridges formed on the outer surface. Background Art

[0002] In the field of semiconductor manufacturing, in order to grind a semiconductor wafer such as a silicon wafer (hereinafter referred to as a "workpiece") into a thinner and flatter part, the grinding surface of a rotating grinding stone is pressed against the workpiece to grind the inner surface of the workpiece. When grinding the inner surface of the workpiece, in order to protect the chips and ridges formed on the outer surface of the workpiece, a protective film is attached to the workpiece.

[0003] When the inner surface grinding of the workpiece is completed, a dicing film is pasted on the inner surface of the workpiece in a dicing film pasting device to integrate the workpiece and the dicing frame. Next, after peeling off the protective film pasted on the outer surface of the workpiece, the workpiece is cut into a grid shape. The wafer formed by dicing is picked up and mounted on a lead frame (for example, refer to Patent Document 1).

[0004] Specifically, through Fig. 9 The workpiece 100 is processed in the process shown. That is, a ridge 102 is formed on the outer surface 101 of the workpiece 100, and a BG film 103 is pasted in a manner to cover the ridge 102 (BG film pasting process). Then, the workpiece 100 is adsorbed and held on the chuck table 105 in a manner such that the inner surface 104 faces upward, and the inner surface 104 is ground by the grinding tool 106 (workpiece grinding process). Then, the laser is focused on the inside of the workpiece 100 to form a modified line 107 at a specified depth from the inner surface 104 (laser cutting (ML) process). Thereafter, the inner surface 104 of the workpiece 100 is adsorbed by the chuck 108 of the conveying arm, and the workpiece 100 is conveyed to the DC tape pasting device (workpiece conveying process). Then, while the workpiece 100 is held by the transposed chuck 109, the laminating roller 110 presses and adheres the DC tape 111 to the inner surface 104 of the workpiece 100. After the workpiece 100 is held by the cutting frame 112, the BG film 103 is peeled off via the peeling tape 113 (DC tape sticking, BG film peeling process).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2009-206475 Summary of the invention

[0008] Problems to be solved by the invention

[0009] However, in accordance with Fig. 9When the workpiece 100 is processed in the order shown, since the center of the workpiece 100 of the BG film 103 bulges out more than the periphery by an amount equivalent to the bulge 102, leakage occurs from the gap between the periphery of the BG film 103 and the chuck table 105, and the adsorption and holding of the workpiece 100 is likely to be insufficient, and the workpiece 100 is likely to shake during grinding, which may cause damage to the workpiece 100. In addition, since the periphery of the workpiece 100 is likely to be ground thicker than the center, the modified line 107 is formed with a large offset in the depth direction of the workpiece 100 in the subsequent ML process. When negative pressure is generated between the chuck 108 and the workpiece 100 in the conveying process, or when a peeling force greater than the adhesive force of the BG film 103 acts on the workpiece 100 in the peeling process, there is a risk of generating micro cracks in the workpiece 100 to a degree that cannot be detected even by image inspection.

[0010] Therefore, there arises a technical problem to be solved in order to safely process a workpiece having a protrusion formed on the outer surface, and an object of the present invention is to solve this problem.

[0011] Technical solutions to solve problems

[0012] In order to achieve the above-mentioned purpose, the fast cutting device of the present invention is the following fast cutting device, which cuts the upper surface of the protective film adhered to the workpiece, and the workpiece includes a raised area with a raised area formed on the outer surface and a peripheral area around the raised area, and is characterized in that the fast cutting device includes: a fast cutting tool; a tool spindle, the above-mentioned fast cutting tool is installed at the lower end of the tool spindle, and the above-mentioned tool spindle can be raised and lowered in a state of rotating the above-mentioned fast cutting tool; a chuck, which holds the above-mentioned workpiece in a rotatable manner, and the above-mentioned fast cutting tool cuts the upper surface of the above-mentioned protective film from the center toward the periphery.

[0013] According to this scheme, the central area of ​​the protective film is cut relatively thinner than the peripheral area, so that when the upper side of the protective film is adsorbed and held by a chuck, the entire surface of the protective film can be adsorbed and held by the chuck, so the workpiece can be safely ground, and in the ML process, the modified line is formed to a substantially constant depth from the inner surface of the workpiece, thereby suppressing the occurrence of micro cracks in the workpiece during the conveying process and the peeling process.

[0014] Effects of the Invention

[0015] The present invention forms a workpiece with protrusions with a roughly uniform thickness over the entire surface, so that the entire surface of the protective film is adsorbed and held by the chuck, the workpiece can be safely ground, and in the ML process, the modified line is formed to a roughly constant depth from the inner surface of the workpiece, so that the occurrence of tiny cracks in the workpiece can be suppressed during the conveying process and the peeling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram showing the outline of a free-cutting device according to one embodiment of the present invention.

[0017] Figure 2 (a) is a stereoscopic diagram of a fast cutting tool. Figure 2 (b) is an enlarged view of the main part of the fast cutting tool.

[0018] Figure 3 A top view showing the position of the fast cutting line and the measuring position of the thickness sensor.

[0019] Figure 4 (a) is the top view of the workpiece. Figure 4 (b) is the longitudinal cross-sectional view of the workpiece. Figure 4 (c) is an enlarged view of the main part of the workpiece.

[0020] Figure 5 A schematic diagram showing the sequence of processing a workpiece with a protrusion.

[0021] Figure 6 It is a schematic diagram showing the procedure of cutting the BG film.

[0022] Figure 7 It is a top view schematically showing the positional relationship between adjacent free-cutting lines.

[0023] Figure 8 A side view schematically showing the positional relationship between the fast cutting tool and the chuck.

[0024] Fig. 9 This is a schematic diagram showing the procedure for processing a workpiece with a conventional protrusion. DETAILED DESCRIPTION

[0025] An embodiment of the present invention is described with reference to the accompanying drawings. In addition, when referring to the number, value, amount, range, etc. of constituent elements, except for cases where it is specifically stated or clearly limited to a specific number in principle, it is not limited to the specific number, and it does not matter whether it is above or below the specific number.

[0026] Furthermore, when referring to the shapes and positional relationships of components, etc., it includes cases where they are substantially similar or similar to the shapes, etc., except for cases where it is particularly stated or cases where it is obvious that this is not the case in principle.

[0027] In addition, the drawings sometimes exaggerate characteristic parts such as enlargement to facilitate understanding of the features, and the dimensional ratios of the components are not necessarily the same as the actual ones. In addition, in the cross-sectional views, the hatching of some components is sometimes omitted to facilitate understanding of the cross-sectional structure of the components.

[0028] Figure 1 In the free-cutting device 1 shown, a silicon workpiece 7 described later is supplied. The free-cutting device 1 includes a cutting device 2 and a chuck 3 .

[0029] The cutting device 2 includes a high-speed cutting tool 21 , a tool spindle 22 and a spindle feeding mechanism 23 .

[0030] like Figure 2 As shown in (a) and (b) of FIG. 1 , the free-cutting tool 21 includes an annular frame 21a mounted on the lower end of a tool spindle 22 and a tool 21b mounted on the outer periphery of the annular frame 21a. The annular frame 21a is mounted on the tool spindle 22 via bolts or the like, for example. In addition, the tool 21b is mounted on the annular frame 21a via bolts 21c, so that when the tool 21b is consumed, only the tool 21b can be replaced. The tool 21b is, for example, a single stone diamond.

[0031] The tool spindle 22 rotates about the rotation axis 22a. Figure 1 The tool spindle 22 is configured to be rotationally driven in the direction of arrow A. An induction motor is used to rotationally drive the tool spindle 22. In addition, the rotation direction of the tool spindle 22 is not limited to Figure 1 The direction of arrow A in the figure can also be the opposite direction.

[0032] The spindle feed mechanism 23 moves the tool spindle 22 up and down. The spindle feed mechanism 23 is composed of, for example, a plurality of linear guides that guide the tool spindle 22 in its moving direction and a ball screw slide mechanism that moves the tool spindle 22 up and down. The spindle feed mechanism 23 is interposed between the tool spindle 22 and the column 24.

[0033] The chuck 3 has a chuck spindle 31. The chuck spindle 31 rotates about a rotation axis 31a. Figure 1 The chuck spindle 31 is configured to be driven to rotate in the direction of arrow B. Figure 1 The direction of arrow B in FIG. 1 may also be the opposite direction.

[0034] An adsorbent 32 made of a porous material such as alumina is buried on the chuck 3. The roughness of the pores of the adsorbent 32 is, for example, #400 or #800. The chuck 3 has a pipeline not shown in the figure extending from the inside to the outside. The pipeline is connected to a vacuum source, a compressed air source or a water supply source via a rotary joint not shown in the figure. When the vacuum source is activated, the workpiece 7 placed on the adsorbent 32 is adsorbed and held on the holding surface 3a of the chuck 3. In addition, when the compressed air source or the water supply source is activated, the adsorption of the workpiece 7 and the holding surface 3a is released.

[0035] The fly cutting device 1 includes a cooling water nozzle 4. The cooling water nozzle 4 supplies cooling water such as pure water to a fly cutting line L where a BG film 75 described later is cut by a blade 21b.

[0036] The fast cutting device 1 includes a thickness sensor 5. The thickness sensor 5 is an in-process gauge for measuring the thickness of the workpiece 7. Figure 3 As shown, one measuring head 51 measures the height of the workpiece 7, and another measuring head 52 measures the height of the chuck 3. The workpiece 7 on the chuck 3 can be measured during processing based on the difference between the two.

[0037] The operation of the free-cutting device 1 is controlled by the control unit 6. The control unit 6 controls the components constituting the free-cutting device 1 respectively. The control unit 6 is composed of, for example, a CPU, a memory, etc. In addition, the functions of the control unit 6 can be realized by controlling using software, or by operating using hardware.

[0038] In addition, the control unit 6 is also used as a cutting time prediction unit, which calculates the time it takes for the BG film 75 to reach the finished thickness based on the measurement value of the thickness sensor 5, the number of revolutions of the tool spindle 22, the number of revolutions of the chuck spindle 31, and the descending speed of the spindle feed mechanism 23.

[0039] like Figure 4 As shown in (a) and (b) of FIG. 7 , a plurality of wafers not shown in the figure having protrusions 71 are formed on the outer surface 72 of the workpiece 7. Specifically, the plurality of wafers of the workpiece 7 are formed only in the central region 73 of the outer surface 72 of the workpiece 7, and the protrusions 71 serving as electrical contacts are formed on each wafer. That is, the wafers and the protrusions 71 are not formed in the peripheral region 74 of the workpiece 7. Hereinafter, the central region 73 is referred to as the protrusion region 73. The height of the protrusion 71 is, for example, 100 μm or less.

[0040] A BG film 75 is attached to the outer surface 72 of the workpiece 7 so as to cover the entire surface. The BG film 75 protects the wafer and the protrusion 71 during cutting or grinding of the inner surface 76 described later. Figure 4As shown in (b) and (c) of FIG. 8 , the raised region 73 of the BG film 75 is higher than the peripheral region 74 in accordance with the height of the raised region 71 .

[0041] Next, according to Figure 5 A series of steps for processing the workpiece 7 will be described.

[0042] [BG film pasting]

[0043] First, a known film sticking device is used to stick the BG film 75 on the outer surface 72 of the workpiece 7. The BG film 75 is composed of a base material 75a and an adhesive 75b. For example, the base material 75a is made of polyolefin, and the adhesive 75b is made of acrylic.

[0044] [BG film cutting]

[0045] Next, the upper surface 75c of the BG film 75 is cut using the free-cutting device 1. Specifically, first, the inner surface 76 of the workpiece 7 is held by suction by the chuck 3. Next, while the tool spindle 22 and the chuck spindle 31 are rotated, cooling water is supplied from the cooling water nozzle 4, and at the same time, the spindle feed mechanism 23 causes the tool 21b to cut into the BG film 75.

[0046] like Figure 6 (a) to (c) and Figure 7 As shown in (a), the tool 21b cuts the upper surface 75c of the BG film 75 from the center to the periphery. When the tool 21b cuts from the periphery to the center of the BG film 75, the periphery of the BG film 75 touched by the tool 21b may be elastically deformed and cannot be cut into a desired shape. On the other hand, the tool 21b cuts from the center to the periphery of the BG film 75, thereby stably cutting the BG film 75. Various cutting conditions are, for example, the rotation amount of the tool spindle 22 is 3000 rpm, the rotation amount of the chuck spindle 31 is 1 rpm, and the descending speed of the spindle feed mechanism 23 is 0.2 μm / s.

[0047] In addition, under the above-mentioned cutting conditions, the thickness (depth) of the BG film 75 removed by the blade 21b in one cutting (the size of the free cutting line L) is 12 μm. Figure 7 As shown in (a) to (c) of FIG. 8 , after the cutter 21 b cuts the BG film 75 , the rotation amount (0.3 mm) of the BG film 75 during one rotation of the cutter 21 b corresponds to the pitch interval between the adjacent free-cut lines L.

[0048] In addition, if Figure 8As shown, the rotation axis 31a of the chuck 3 is inclined relative to the rotation axis 22a of the tool spindle 22, and the holding surface 3a of the chuck 3 is formed into a convex shape with the center higher than the periphery. That is, within the range where the tool 21b cuts the BG film 75, the chuck 3 is roughly parallel to the tool spindle 22, and on the other hand, on the opposite side of the rotation center of the chuck 3 in the range where the tool 21b cuts the BG film 75, the chuck 3 is separated from the tool spindle 22. Thus, during the period from when the tool 21b passes from the periphery of the BG film 75 to the outside to when it returns to the center of the BG film 75, a gap is ensured between the BG film 75 and the tool 21b, thereby preventing the tool 21b from contacting the BG film 75 at an undesirable position. In addition, Figure 7 In the embodiment, the distance from the lower end of the holding surface 3a to the rotation center of the chuck 3, that is, the escape amount, is set to 60 μm.

[0049] The moment when the cutting of the BG film 75 is finished is determined by the following process. That is, the thickness sensor 5 measures the thickness of the workpiece 7 relative to the chuck 3 during processing. The control unit 6 calculates the time until the measured value of the thickness sensor 5 reaches the preset finished product thickness of the workpiece 7 based on the measured value of the thickness sensor 5, the number of revolutions of the tool spindle 22, the number of revolutions of the chuck spindle 31, and the descending speed of the spindle feed mechanism 23. If this time has passed, the control unit 6 determines that the thickness of the workpiece 7 being processed has reached the finished product thickness, such as Figure 6 As shown in (d) of FIG. 1 , the feeding of the main shaft feeding mechanism 23 is stopped.

[0050] In addition, if Figure 3 As shown, the thickness sensor 5 measures the height of the workpiece 7 at a location different from the nearest fast cutting line L, so it is necessary to consider the positional relationship between the measurement position of the thickness sensor 5 and the nearest fast cutting line L. For example, Figure 3 The thickness of the workpiece 7 at the measurement position of the thickness sensor 5 is about 12 μm thicker than the thickness of the workpiece 7 at the nearest fast cutting line L, so about 12 μm can be subtracted from the measurement value of the thickness sensor 5 to make the measurement value of the thickness sensor 5 roughly consistent with the thickness of the workpiece 7 at the nearest fast cutting line L. In addition, the shape of the BG film 75 after fast cutting (that is, the total removal amount of fast cutting) can be arbitrarily changed according to the height of the protrusion 71.

[0051] If the workpiece 7 reaches the finished thickness, the upper surface 75c of the BG film 75 is a spiral curved surface, and Figure 6 As shown in (d) of FIG. 1 , a step 77 is formed in the nearest fast cutting line L. Therefore, as shown in FIG. Figure 6As shown in (e) of FIG. 7 , the upper surface 75 c of the BG film 75 is smoothly finished by performing spark-out grinding by rotating the tool spindle 22 and the chuck spindle 31 respectively while the spindle feed mechanism 23 is stopped.

[0052] In this way, by removing the central region 73 formed thicker than the outer peripheral region 74 in the upper surface 75 c of the BG film 75 using the tool 21 b , the thickness of the workpiece 7 including the BG film 75 can be formed substantially uniformly over the entire surface.

[0053] [Workpiece grinding]

[0054] Next, the workpiece 7 is conveyed to a known grinding device, and the inner surface of the workpiece 7 is ground using a grinding tool 81. At this time, the upper surface 75c of the BG film 75 is quickly cut, so that the entire upper surface 75c of the BG film 75 is adsorbed and held on the grinding chuck 82 in a substantially flat manner regardless of the protrusion 71, so that vacuum leakage at the periphery of the workpiece 7 and shaking of the workpiece 7 during grinding are suppressed, and the inner surface 76 of the workpiece 7 after grinding is formed to be substantially flat.

[0055] [Laser Cutting]

[0056] Then, the workpiece 7 is conveyed to a known laser cutting device, and laser cutting (ML) is performed to form modified lines 78 in a lattice shape on the workpiece 7 when viewed from above by focusing laser light of a wavelength that transmits the workpiece 7 into the workpiece 7. The modified lines 78 serve as the starting point for dividing the workpiece 7 when the workpiece 7 is singulated. By rapidly cutting the upper surface 75c of the BG film 75, the BG film 75 is held by the ML chuck 83 in a substantially flat state regardless of the protrusion 71, and the inner surface 76 of the workpiece 7 is ground to be substantially flat, so that the modified lines 78 can be stably formed at a predetermined depth from the inner surface 76 of the workpiece 7.

[0057] [Workpiece conveying]

[0058] After that, the inner surface 76 of the workpiece 7 is held by adsorption on the chuck 84 of the known conveying arm, and the workpiece 7 is conveyed to the cutting (DC) tape pasting device. At this time, since the modified line 78 is uniformly formed at a predetermined depth from the inner surface 76 of the workpiece 7, even if the workpiece 7 is sucked with negative pressure, cracks will not be generated in the workpiece 7, and the workpiece 7 can be safely conveyed.

[0059] [DC tape sticking, BG film peeling]

[0060] Next, the workpiece 7 transferred to the chuck 85 is pasted on the cutting frame 87 via the DC tape 86 using a known DC tape pasting device. The pasting of the DC tape 86 is performed by pressing the DC tape 86 against the inner surface 76 of the workpiece 7 by the laminating roller 88. At this time, since the modified lines 78 are uniformly formed at a predetermined depth from the inner surface 76 of the workpiece 7, even if the laminating roller 88 presses the workpiece 7, no cracks are generated in the workpiece 7, and the DC tape 86 can be pasted safely.

[0061] Then, the BG film 75 is peeled off from the workpiece 7 using a known peeling device. The BG film 75 is peeled off by rolling up the peeling tape 89 pressed against the BG film 75, thereby peeling the BG film 75 off from the outer surface 72 of the workpiece 7. At this time, since the modified lines 78 are uniformly formed at a predetermined depth from the inner surface 76 of the workpiece 7, even when the BG film 75 is peeled off from the workpiece 7, cracks will not be generated in the workpiece 7, and the DC tape 86 can be safely attached.

[0062] As described above, the fast cutting device 1 of the embodiment of the present invention is a fast cutting device 1 for cutting the upper surface 75c of the BG film 75 adhered to the workpiece 7, and the workpiece 7 includes a raised area 73 with a raised area 71 formed on the outer surface 72 and a peripheral area 74 around the raised area 73. The fast cutting device 1 has the following structure, which includes a fast cutting tool 21, a tool spindle 22 on which the fast cutting tool 21 is installed at the lower end and can be raised and lowered while the fast cutting tool 21 is rotated, and a chuck 3 that rotatably holds the workpiece 7, and the fast cutting tool 21 cuts the upper surface 75c of the BG film 75 from the center toward the periphery.

[0063] According to this structure, the central area 73 in the BG film 75 is cut relatively thinner than the peripheral area 74, so that when the upper side 75c of the BG film 75 is adsorbed and held by the chuck 3, the entire surface of the BG film 75 can be adsorbed and held on the chuck 3, so that the workpiece 7 can be safely ground, and in the ML process, the modified line 78 is formed to a substantially constant depth from the inner surface 76 of the workpiece 7, so when the workpiece 7 is conveyed, when the DC tape 86 is pasted, or when the BG film 75 is peeled off, the generation of micro cracks in the workpiece 7 can be suppressed.

[0064] The fly cutting device 1 has a structure in which the fly cutting tool 21 has an annular frame 21 a mounted on a tool spindle 22 and a cutter 21 b mounted on the outer periphery of the annular frame 21 a and capable of cutting the BG film 75 .

[0065] According to this structure, the tool 21b can be mounted on the tool spindle 22 via the annular frame 21a.

[0066] The free-cutting device 1 has a structure in which the rotation axis 31a of the chuck 3 is set to be inclined at a predetermined angle, and the holding surface 3a of the chuck 3 for holding the workpiece 7 is formed in a convex shape with the center higher than the outer periphery.

[0067] According to this structure, a gap is ensured between the BG film 75 and the cutter 21b during the period from when the cutter 21b passes from the outer periphery of the BG film 75 to when it returns to the center of the BG film 75, thereby preventing the cutter 21b from contacting the BG film 75 at an undesired position.

[0068] Furthermore, the fly-cutting device 1 is configured to include a cooling water nozzle 4 for supplying cooling water to the upper surface 75 c of the BG film 75 .

[0069] According to this structure, when the BG film 75 is cut, it is possible to suppress the BG film 75 from being excessively heated.

[0070] Furthermore, the fast cutting device 1 has the following structure, which includes a thickness sensor 5 and a control unit 6. The thickness sensor 5 measures the thickness of the BG film 75 during cutting by the fast cutting tool 21. The control unit 6 calculates the time it takes for the BG film 75 to reach the finished product thickness based on the measurement value of the thickness sensor 5, the number of rotations of the fast cutting tool 21, the number of rotations of the chuck 3, and the descending speed of the tool spindle 22.

[0071] According to this structure, the final thickness of the BG film 75 can be appropriately managed.

[0072] In addition, the present invention can be modified in various ways other than the above unless it deviates from the spirit of the present invention, and the present invention naturally includes the invention after such modification.

[0073] Description of the label:

[0074] Reference numeral 1 represents a fast cutting device;

[0075] Reference numeral 2 denotes a cutting mechanism;

[0076] Reference numeral 21 denotes a fast cutting tool;

[0077] Reference numeral 21a denotes an annular frame;

[0078] Reference numeral 21b denotes a tool;

[0079] Reference numeral 21c denotes a bolt;

[0080] Reference numeral 22 denotes a tool spindle;

[0081] Reference numeral 22a denotes a rotation axis;

[0082] Reference numeral 23 denotes a spindle feeding mechanism;

[0083] Reference numeral 24 denotes a column;

[0084] Reference numeral 3 denotes a chuck;

[0085] Reference numeral 3a denotes a retaining surface;

[0086] Reference numeral 31 denotes a chuck spindle;

[0087] Reference numeral 31a denotes a rotation axis;

[0088] Reference numeral 32 denotes an adsorbent;

[0089] Reference numeral 4 denotes a cooling water nozzle;

[0090] Reference numeral 5 denotes a thickness sensor;

[0091] Reference numerals 51 and 52 denote measuring heads;

[0092] Reference numeral 6 denotes a control unit;

[0093] Reference numeral 7 denotes a workpiece;

[0094] Reference numeral 71 denotes a protuberance;

[0095] Reference numeral 72 denotes the outside;

[0096] Reference numeral 73 denotes a raised area;

[0097] Reference numeral 74 denotes an outer peripheral region;

[0098] Reference numeral 75 denotes a BG film;

[0099] Reference numeral 75a denotes a substrate;

[0100] Reference numeral 75b denotes an adhesive;

[0101] Reference numeral 75c indicates the upper side;

[0102] Reference numeral 76 denotes an inner surface;

[0103] Reference numeral 77 indicates a step difference;

[0104] Reference numeral 78 denotes a modified line;

[0105] Symbol L represents the fast cutting line.

Claims

1. A high-speed cutting device for cutting the upper surface of a protective film adhered to a workpiece, wherein the workpiece includes a raised area having raised surfaces and a peripheral area around the raised area, wherein: The rapid cutting device comprises: Fast cutting tools; a tool spindle, the fast cutting tool being mounted at the lower end of the tool spindle, and the tool spindle being able to be raised and lowered while rotating the fast cutting tool; and a chuck that rotatably holds the workpiece, The high-speed cutting tool cuts the upper surface of the protective film from the center toward the periphery.

2. The rapid cutting device according to claim 1, characterized in that: The above-mentioned fast cutting tools include: an annular frame mounted on the tool spindle; and A cutter is installed on the outer periphery of the annular frame and can cut the protective film.

3. The rapid cutting device according to claim 1 or 2, characterized in that: The rotation axis of the chuck is set in a manner to be inclined by only a predetermined angle; The holding surface of the chuck for holding the workpiece is convex in shape with the center being higher than the periphery.

4. The rapid cutting device according to claim 1, characterized in that: The invention further comprises a cooling water nozzle for supplying cooling water to the upper surface of the protective film.

5. The rapid cutting device according to claim 1, characterized in that: Also includes: A thickness sensor for measuring the thickness of the protective film during cutting by the fast cutting tool; as well as A cutting time prediction unit calculates the time it takes for the protective film to reach a finished thickness based on the measurement value of the thickness sensor, the number of revolutions of the fast cutting tool, the number of revolutions of the chuck, and the descending speed of the tool spindle.

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