Power module, power conversion device, and method for manufacturing power module

Abstract

The resin material (336) is disposed in a first region (421) surrounded by the fin base (440), the inclined portion (343) of the cover member (340), and the outermost peripheral fin (334) disposed on the outermost peripheral side. Also, the resin material (336) is caused to overflow the first region (421). That is, the resin material (336) is disposed in the first region (421). In a cross section perpendicular to the flow direction (Y direction) of the refrigerant, the cross-sectional area of the first region (421) is larger than the average cross-sectional area (423) between the adjacent fins (331). Also, the cross-sectional area of a second region (422) formed between the resin material (336) disposed in the first region (421) and the outermost peripheral fin (334) disposed on the outermost peripheral side is smaller than the average cross-sectional area (423) between the fins.

Description

Technical Field

[0001] This invention relates to power modules, power conversion devices, and methods for manufacturing power modules. Background Technology

[0002] Power conversion devices using power semiconductor elements are widely used in civilian, automotive, railway, and power transmission equipment due to their high conversion efficiency. Since these power semiconductor elements generate heat when energized, power modules incorporating them require high heat dissipation. For example, it is necessary to minimize the gap between the flow path cover and the heat sink on the outer periphery of the heat sink base constituting the power module to prevent bypass flow of refrigerant within this gap. In Patent Document 1, a sealing member is provided in this gap, having an O-ring portion with a generally rectangular annular structure and a pair of flow path control portions integrally formed inside the O-ring portion.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-29539 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] In the technology described in Patent Document 1, components such as sealing components require high dimensional accuracy.

[0008] Technical means to solve the problem

[0009] The power module of the present invention comprises: a heat sink base on which a plurality of heat sinks are erected; a cover member having an inclined portion that slopes toward the outer periphery of the heat sink base and forms a refrigerant flow path between the cover member and the heat sink base; and a resin material that bonds the heat sink base and the cover member, the resin material being disposed in a first region enclosed by the heat sink base, the inclined portion of the cover member and the heat sinks disposed on the outermost periphery.

[0010] The method for manufacturing a power module according to the present invention includes: a first step of forming an inclined portion inclined toward the outer periphery of a heat sink base on which a plurality of heat sinks are erected, the inclined portion corresponding to the inclined portion of a cover member for forming a refrigerant flow path between the cover member and the heat sink base, and applying a resin material to the heat sink base; and a second step of pressing the cover member onto the heat sink base and bonding the cover member and the heat sink base together by means of the resin material, wherein the resin material is disposed in a first region surrounded by the heat sink base, the inclined portion of the cover member, and the heat sinks disposed on the outermost periphery.

[0011] The effects of the invention

[0012] According to the present invention, a power module can be provided that improves cooling effect by preventing refrigerant bypass flow regardless of the dimensional accuracy of the components. Attached Figure Description

[0013] Figure 1 This is a perspective view of the power module according to the first embodiment.

[0014] Figure 2 This is a perspective view showing the power module of the first embodiment concealing the cover component.

[0015] Figure 3 This is a cross-sectional view of the power module in the first embodiment.

[0016] Figure 4 (A) and (B) are top views of the power module of the first embodiment hiding the cover component.

[0017] Figure 5 (A) and (B) are top views of the power module of the first embodiment hiding the cover component.

[0018] Figure 6 (A), (B), and (C) are diagrams illustrating a method for manufacturing a power module according to the first embodiment.

[0019] Figure 7 This is a top view of the power module according to the second embodiment.

[0020] Figure 8 This is a perspective view of the circuit body according to the second embodiment.

[0021] Figure 9 This is a cross-sectional view of the power module in the second embodiment.

[0022] Figure 10 This is a cross-sectional view of the power module in the second embodiment.

[0023] Figure 11 (A), (B), (C), (D), and (E) are diagrams illustrating the manufacturing method of the power module according to the second embodiment.

[0024] Figure 12 It is a circuit diagram of the circuit body.

[0025] Figure 13 This is a circuit diagram of a power conversion device that uses a power module.

[0026] Figure 14 This is a three-dimensional view of the power conversion device.

[0027] Figure 15 This is a cross-sectional view of the power conversion device. Detailed Implementation

[0028] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following description and drawings are examples for illustrating the present invention; appropriate omissions and simplifications have been made to clarify the description. The present invention may also be implemented in various other ways. Unless otherwise specified, the constituent elements may be singular or plural.

[0029] To facilitate understanding of the present invention, the positions, sizes, shapes, and extents of the constituent elements shown in the accompanying drawings may not represent their actual positions, sizes, shapes, or extents. Therefore, the present invention is not limited to the positions, sizes, shapes, and extents disclosed in the accompanying drawings.

[0030] [First Implementation Method]

[0031] Figure 1 This is a perspective view of the power module 400 in this embodiment.

[0032] The power module 400 contains three circuit elements 300, sealed with sealing resin 360. Each circuit element 300 has a capacitor module 600 connected to a DC circuit (see below). Figure 13 The positive terminal 315B and negative terminal 319B are connected to the AC circuit's generators 192 and 194 (see below). Figure 13 The circuit includes power terminals such as the AC side terminal 320B, which carry large currents. It also includes signal terminals such as the lower arm gate terminal 325L, the upper arm gate terminal 325U, the temperature sensing signal terminal 325S, and the collector sensing signal terminal 325C. The circuit configuration of the circuit body 300 will be described later.

[0033] The power module 400 includes a housing member 340, which forms a refrigerant flow path with the circuit body 300. The circuit body 300 houses power semiconductor elements, which perform power conversion via switching, generating heat. Refrigerant flows through the flow path to cool this heat. The refrigerant may be water or an antifreeze mixture of water and ethylene glycol.

[0034] Figure 2 From Figure 1 The power module 400 is shown in a perspective view of the cover component 340 being hidden by the cover component 340.

[0035] A heat sink 331 is formed on a heat sink base 440 of the circuit body 300. Additionally, resin material 336 is disposed on the outer periphery of the heat sink base 440, forming a refrigerant flow path by bonding the heat sink base 440 and a cover member 340 (not shown). Details will be described later. Resin material 336 is disposed on the outer periphery of the heat sink base 440, and on both sides along the Y-direction shown in the figure, between the heat sink 331 and the cover member 340 located on the outermost periphery. The flow path is formed on the heat sink base 440 along the Y-direction shown in the figure.

[0036] Figure 3 This is a cross-sectional view of the power module 400 according to this embodiment. Figure 3 It's a power module 400. Figure 1 The cross-sectional view of line X1-X1 is shown.

[0037] The circuit body 300 has a collector-side conductor 431 and a collector-side wiring board 433 on the collector side of the power semiconductor element 150, and an emitter-side conductor 430 and an emitter-side wiring board 432 on the emitter side. By having thick-walled collector-side conductors 431 and 430 on the power semiconductor element 150 side of the collector-side wiring board 433 and emitter-side wiring board 432, heat dissipation of the power semiconductor element 150 is improved. A heat sink base 441 is bonded to the collector-side wiring board 433, and a heat sink base 440 is bonded to the emitter-side wiring board 432. The circuit body 300 is sealed with sealing resin 360. Multiple heat sinks 331 are vertically mounted on the heat sink bases 440 and 441.

[0038] The area where heat from the power semiconductor element 150 diffuses at a 45-degree angle through the collector-side conductor 431 and the emitter-side conductor 430 is designated as a heat dissipation region 410. This heat dissipation region 410 is crucial for cooling the power semiconductor element 150. A heat sink 331 erected on this heat dissipation region 410 is designated as a regional heat sink 332. Additionally, a heat sink 331 disposed on the outermost periphery of the heat sink base 440 is designated as an outermost peripheral heat sink 334.

[0039] The cover member 340 forms an inclined portion 343 that slopes towards the outer periphery of the heat sink base 440. Furthermore, the cover member 340 and the heat sink base 440 are bonded together at the sealing portion 338 by a resin material 336. The resin material 336 is disposed within a first region 421 enclosed by the heat sink base 440, the inclined portion 343 of the cover member 340, and the outermost heat sink 334 disposed on the outermost periphery. If the resin material 336 were not disposed in the first region 421, the refrigerant would flow in the first region 421, becoming a bypass flow that contributes almost no to cooling, thus reducing cooling efficiency. Generally, the accuracy and productivity of the power module 400 are inversely proportional; if productivity is prioritized, the first region 421 tends to become larger.

[0040] In this embodiment, the resin material 336 overflows from the first region 421. That is, the resin material 336 is disposed within the first region 421. In a cross-section perpendicular to the refrigerant flow direction (Y direction), the cross-sectional area of ​​the first region 421 is larger than the average cross-sectional area 423 between adjacent heat sinks 331. Furthermore, the cross-sectional area of ​​the second region 422 formed between the resin material 336 disposed within the first region 421 and the outermost peripheral heat sink 334 disposed on the outermost periphery is smaller than the average cross-sectional area 423 between the heat sinks.

[0041] That is, the resin material 336 overflows from the first region 421, narrowing the refrigerant flow path from the first region 421 to the second region 422. When the cross-sectional area of ​​the first region 421 is C, the cross-sectional area of ​​the second region 422 is B, and the average cross-sectional area between heat sinks is A, there exists a relationship B << A < C. Thus, by making the cross-sectional area B of the second region 422 (which becomes the bypass flow) smaller than the average cross-sectional area between heat sinks A, the influence of the bypass flow can be reduced, and heat dissipation can be improved.

[0042] Figure 4 This is a top view from which the shroud component 340 is hidden by the power module 400, and the heat sink 331 shows the case of a flat heat sink. Figure 4 (A) indicates the case where resin material 336 is not disposed in the first region 421. Figure 4 (B) indicates the case where resin material 336 is disposed in the first region 421.

[0043] like Figure 4 As shown in (A), when the resin material 336 is not placed in the first region 421, and viewed along the dashed line aa in the X direction, the cross-section of the first region 421 is larger than the average cross-sectional area 423 between the heat sinks. More refrigerant flows in the Y direction through the first region 421 than through the average cross-sectional area 423 between the heat sinks. Therefore, the refrigerant flowing in the first region 421 becomes a bypass flow that provides little cooling benefit, resulting in reduced cooling performance.

[0044] like Figure 4 As shown in (B), in this embodiment where the resin material 336 is disposed in the first region 421, when viewed along the dashed line bb in the X direction, the cross-section of the second region 422 is smaller than the average cross-sectional area 423 between the heat sinks. Less refrigerant flows in the Y direction in the second region 422 than in the average cross-sectional area 423 between the heat sinks. Therefore, the influence of bypass flow through the second region 422 can be reduced, improving heat dissipation. Furthermore, it is preferable to minimize the bypass flow through the second region 422.

[0045] Resin material 336 is an adhesive material with Al (aluminum) plate as the bonded material. It is a material in which more than 80% of the area of ​​cohesive failure occurs when a test piece with tensile shear bond strength determined according to JISK6850 is immersed in a long-life coolant at 125°C for 2000 hours in a closed container.

[0046] Figure 5 This is a top view from which the cover component 340 is hidden by the power module 400, showing the case where the heat sink 331 is a pin-type heat sink. Figure 5 (A) indicates the case where resin material 336 is not disposed in the first region 421. Figure 5 (B) indicates the case where resin material 336 is disposed in the first region 421.

[0047] like Figure 5 As shown in (A), when the resin material 336 is not placed in the first region 421, and viewed along the dashed line aa in the X direction, the cross-section of the first region 421 is larger than the average cross-sectional area 423 between the heat sinks. In the refrigerant flowing in the Y direction, the amount of refrigerant 451 flowing in the first region 421 is greater than the amount of refrigerant 450 flowing in the average cross-sectional area 423 between the heat sinks. Therefore, the refrigerant flowing in the first region 421 becomes a bypass flow that provides almost no cooling benefit, resulting in reduced cooling performance.

[0048] like Figure 5 As shown in (B), in this embodiment where resin material 336 is disposed in the first region 421, when viewed along the dashed line bb in the X direction, the cross-section of the second region 422 is smaller than the average cross-sectional area 423 between the heat sinks. In the refrigerant flowing in the Y direction, less refrigerant 451 flows through the second region 422 than less refrigerant 450 flows through the average cross-sectional area 423 between the heat sinks. Therefore, the influence of the bypass flow through the second region 422 can be reduced, improving heat dissipation. Furthermore, it is preferable to minimize the bypass flow through the second region 422.

[0049] Figure 6 This is a diagram illustrating the manufacturing method of the power module 400. Figure 6 (A) is a diagram representing the first process. Figure 6 (B) is a diagram representing the second process. Figure 6 (C) is a diagram representing the third process.

[0050] exist Figure 6 In the first step shown in (A), a liquid resin material 336 is applied to the heat sink base 440. The position where the resin material 336 is applied corresponds to the inclined portion 343 of the cover member 340, and is the first region 421 surrounded by the outermost heat sink 334 and the inclined portion 343 disposed on the outermost periphery. When applying the resin material 336, by separating the resin material 336 forming the sealing portion 338 and the resin material 336 overflowing to suppress bypass flow and applying appropriate amounts to each, the first region 421 can be effectively filled with the resin material 336, preferably making the second region 422 zero.

[0051] exist Figure 6 In the second step shown in (B), the cover member 340 and the heat sink base 440 are bonded together. Specifically, the cover member 340 is pressed onto the heat sink base 440, and the resin material 336 is stretched toward the outermost heat sink 334 side and the sealing portion 338 side. Then, the resin material 336 is cured by heating or the like. As a result, the resin material 336 is disposed within the first region 421 surrounded by the heat sink base 440, the inclined portion 343 of the cover member 340, and the outermost heat sink 334 disposed on the outermost periphery. In addition, the inclined portion 343 has a first inclined portion 343a toward the outer periphery of the heat sink base 440 and a second inclined portion 343b toward the heat sink side. The angle of the second inclined portion 343b relative to the heat sink base 440 is larger than the angle of the first inclined portion 343a relative to the heat sink base 440. Therefore, when the cover member 340 is pressed onto the heat sink base 440, the resin material 336 is pushed towards the outermost heat sink 334 by the second inclined portion 343b, which narrows the second region 422, preferably to zero. The resin material 336 is bonded to the first inclined portion 343a and to at least a portion of the second inclined portion 343b. Furthermore, the cover member 340 and the heat sink base 440 are bonded at the sealing portion 338 by the resin material 336. The bonding of the cover member 340 and the heat sink base 440 can be achieved by the resin material 336, and the following third step can be performed as needed.

[0052] exist Figure 6 In the third step shown in (C), the cover member 340 and the heat sink base 440 are fixed. Specifically, the cover member 340 and the heat sink base 440 are fixed at the welding part 339 on the outer periphery of the cover member 340 by laser welding or the like.

[0053] [Second Implementation]

[0054] Figure 7This is a top view of the power module 500 in this embodiment.

[0055] The power module 500 consists of three circuit bodies 700, a connecting member 341 connecting the three circuit bodies 700, and a cover member 340 forming a refrigerant flow path between the connected circuit bodies 700. Each circuit body 700 contains a power semiconductor element, which performs power conversion through switching, and the power semiconductor element generates heat. The power module 500 is a structure that cools the refrigerant by causing it to flow in the Y direction within the flow path. The refrigerant used is water or an antifreeze mixture of water and ethylene glycol.

[0056] Circuit body 700 includes capacitor module 600 for DC circuit (see below). Figure 13 The positive terminal 315B and negative terminal 319B are connected to the AC circuit's generators 192 and 194 (see below). Figure 13 The AC side terminal 320B, which is connected to the power terminal, carries a large current. In addition, it has signal terminals 325, including a lower arm gate terminal, a mirror emitter signal terminal, a Kelvin emitter signal terminal, a collector sensing signal terminal, an upper arm gate terminal, and a temperature sensing signal terminal.

[0057] Figure 8 This is a perspective view of the circuit body 700 in this embodiment.

[0058] like Figure 8 As shown, the circuit body 700 contains a power semiconductor element with power conversion function, is sealed with resin, and has positive terminal 315B, negative terminal 319B, AC terminal 320B, signal terminal 325, etc. The power module 500 is composed of three circuit bodies 700 connected by a connecting member 341 and covered by a cover member 340.

[0059] Figure 9 This is a cross-sectional view of the power module 500 according to this embodiment. Figure 9 It's a power module 500. Figure 7 The cross-sectional view of line X2-X2 is shown. Figure 10 This is a cross-sectional view of the power module 500. Figure 10 It's a power module 500. Figure 7 The cross-sectional view of line Y2-Y2 is shown.

[0060] like Figure 9 As shown, the power module 500 connects three circuit bodies 700 via connecting members 341. Furthermore, a cover member 340 forming a refrigerant flow path is provided between the connected circuit bodies 700. In addition to the built-in power semiconductor element 150, the circuit body 700 also includes... Figure 10As shown, the power semiconductor element 150 has a collector-side conductor 431 and a collector-side wiring board 433 on the collector side, and an emitter-side conductor 430 and an emitter-side wiring board 432 on the emitter side. A heat sink base 441 is bonded to the collector-side wiring board 433, and a heat sink base 440 is bonded to the emitter-side wiring board 432. The circuit body 700 is sealed with sealing resin 360. Multiple heat sinks 331 are erected on the heat sink bases 440 and 441.

[0061] The cover member 340 forms an inclined portion 343 that slopes towards the outer periphery of the heat sink base 440. Furthermore, the connecting member 341 and the heat sink base 440 are bonded together at the sealing portion 338 using resin material 336. Additionally, the cover member 340 and the connecting member 341 are bonded together at the sealing portion 338 using resin material 336, and laser welding is performed at the welding portion 339. The resin material 336 is disposed within a first region 421 enclosed by the heat sink base 440, the inclined portion 343 of the cover member 340, the outermost peripheral heat sink 334 disposed on the outermost peripheral side, and the connecting member 341.

[0062] In this embodiment, the resin material 336 overflows from the first region 421. That is, the resin material 336 is disposed within the first region 421. In a cross-section perpendicular to the refrigerant flow direction (Y direction), the cross-sectional area of ​​the first region 421 is larger than the average cross-sectional area 423 between adjacent heat sinks 331. Furthermore, the cross-sectional area of ​​the second region 422 formed between the resin material 336 disposed within the first region 421 and the outermost peripheral heat sink 334 disposed on the outermost periphery is smaller than the average cross-sectional area 423 between the heat sinks.

[0063] That is, the resin material 336 overflows from the first region 421, narrowing the refrigerant flow path from the first region 421 to the second region 422. When the cross-sectional area of ​​the first region 421 is C, the cross-sectional area of ​​the second region 422 is B, and the average cross-sectional area between heat sinks is A, there exists a relationship B << A < C. Thus, by making the cross-sectional area B of the second region 422 (which becomes the bypass flow) smaller than the average cross-sectional area between heat sinks A, the influence of the bypass flow can be reduced, and heat dissipation can be improved.

[0064] Resin material 336 is an adhesive material with Al (aluminum) plate as the bonded material. It is a material in which more than 80% of the area of ​​cohesive failure occurs when a test piece with tensile shear bond strength determined according to JISK6850 is immersed in a long-life coolant at 125°C for 2000 hours in a closed container.

[0065] The heat sink base 440 is a pure aluminum component, while the connecting structural component 341 and the cover component 340 are made of alloy aluminum. Specifically, the connecting structural component 341 and the cover component 340 are made of 3000 series aluminum.

[0066] Figure 11 This is a diagram illustrating the manufacturing method of the power module 500. Figure 11 (A) is a diagram representing the first process. Figure 11 (B) is a diagram representing the second process. Figure 11 (C) is a diagram representing the third process. Figure 11 (D) is the diagram representing the fourth process. Figure 11 (D) is the diagram representing the fifth process. Figure 11 (E) is a diagram representing the sixth process.

[0067] exist Figure 11 In the first step shown in (A), a liquid resin material 336 is applied to the heat sink base 440. The location where the resin material 336 is applied is the location where the bonding structural member 341 is attached, which is the inclined portion 343 of the cover member 340 (see reference). Figure 11 The position corresponding to (C) is the first region 421 surrounded by the outermost heat sink 334 and the inclined portion 343 located on the outermost periphery. The amount of resin material 336 applied is the amount required for bonding with the connecting member 341.

[0068] exist Figure 11 In the second step shown in (B), the connecting member 341 and the heat sink base 440 are bonded together. Specifically, the connecting member 341 is pressed onto the heat sink base 440, and the resin material 336 is stretched toward the outermost heat sink 334 side and the sealing part 338 side.

[0069] exist Figure 11 In the third step shown in (C), a liquid resin material 336 is applied to the outermost peripheral heat sink 334 side of the connecting member 341. The position where the resin material 336 is applied corresponds to the inclined portion 343 of the cover member 340, and is the first region 421 surrounded by the outermost peripheral heat sink 334 and the inclined portion 343 disposed on the outermost peripheral side. The amount of resin material 336 applied is the amount required to overflow from the connecting member 341 upwards into the first region 421.

[0070] exist Figure 11In the fourth step shown in (D), the cover member 340 and the connecting member 341 are bonded together. Specifically, the cover member 340 is pressed onto the connecting member 341, and the resin material 336 is stretched toward the outermost heat sink 334 side and the sealing portion 338 side. Then, the resin material 336 is cured by heating or the like. As a result, the resin material 336 is disposed within the first region 421 surrounded by the connecting member 341, the inclined portion 343 of the cover member 340, and the outermost heat sink 334 disposed on the outermost periphery side. In addition, the inclined portion 343 has a first inclined portion 343a toward the outer periphery side of the heat sink base 440 and a second inclined portion 343b toward the heat sink side. The angle of the second inclined portion 343b relative to the heat sink base 440 is larger than the angle of the first inclined portion 343a relative to the heat sink base 440. Therefore, when the cover member 340 is pressed onto the heat sink base 440 and the connecting member 341, the resin material 336 is pushed towards the outermost heat sink 334 side through the second inclined portion 343b, which narrows the second region 422, preferably to zero. Furthermore, the cover member 340 and the connecting member 341 are bonded together by the resin material 336. The bonding of the cover member 340 and the connecting member 341 can be performed using the resin material 336, and the fifth step below can be performed as needed.

[0071] exist Figure 11 In the fifth step shown in (E), the cover member 340 and the connecting member 341 are fixed. Specifically, the cover member 340 and the connecting member 341 are fixed at the welded part 339 by laser welding or the like at the outer periphery of the cover member 340.

[0072] The following describes the apparatus using the power modules 400 and 500 described in the first and second embodiments.

[0073] Figure 12 This is the circuit diagram of circuit element 300. Power modules 400 and 500 each have three circuit elements 300, performing DC and AC power conversion. (For example...) Figure 12As shown, for example, the series circuit of each phase of the UVW phase consists of a power semiconductor element 155 and a diode 156 in the upper arm, and a power semiconductor element 157 and a diode 158 in the lower arm. The cathode electrodes of diodes 156 and 158 are electrically connected to the collector electrodes of power semiconductor elements 155 and 157, and the anode electrodes are electrically connected to the emitter electrodes of power semiconductor elements 155 and 157. Therefore, the current flow from the emitter electrodes of the power semiconductor element 155 in the upper arm and the power semiconductor element 157 in the lower arm towards the collector electrodes becomes positive. The power semiconductor elements 155 and 157 are, for example, power MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bipolar Transistors).

[0074] A positive terminal 315B and an upper arm gate terminal 325U are derived from the power semiconductor element 155 and diode 156 of the upper arm. A negative terminal 319B and a lower arm gate terminal 325L are derived from the power semiconductor element 157 and diode 158 of the lower arm. An AC terminal 320B is derived from the midpoint between the upper and lower arms.

[0075] Figure 13 This is a circuit diagram of a power conversion device 200 that uses power modules 400 and 500.

[0076] The power conversion device 200 includes converter circuits 140 and 142, an auxiliary converter circuit 43, and a capacitor module 600. Converter circuits 140 and 142 are composed of power modules 400 and 500, each having multiple circuit elements 300. Furthermore, a three-phase bridge circuit is formed by connecting the power modules 400 and 500. That is, the power conversion device 200, equipped with power modules 400 and 500, converts DC power to AC power. In cases of high current capacity, the circuit elements 300 are further connected in parallel. By correspondingly connecting these parallel connections with each phase of the three-phase converter circuit, the increased current capacity can be accommodated. Additionally, by connecting the power semiconductor elements 155 and 157 and diodes 156 and 158 built into the circuit elements 300 in parallel, the increased current capacity can also be accommodated.

[0077] The basic circuit configurations of converter circuit 140 and converter circuit 142 are the same, and their control methods and operations are also basically the same. Since the operation of the circuits in converter circuit 140, etc., is well known, its description is omitted.

[0078] Power semiconductor elements 155 and 157 receive drive signals from one or the other of the two drive circuits constituting drive circuit 174 and perform switching operations to convert the DC power supplied by battery 136 into three-phase AC power.

[0079] The positive terminal 315B and negative terminal 319B of the upper and lower arm series circuit are respectively connected to the capacitor connection terminals of the capacitor module 600. Alternating current is generated at the connection points of the upper and lower arm circuits, and the connection points of the upper and lower arm circuits of the upper and lower arm series circuit are connected to the AC side terminals 320B of each circuit body 300. The AC side terminals 320B of each circuit body 300 of each phase are respectively connected to the output terminals of the power conversion device 200, and the generated AC power is supplied to the stator windings of the electric generator 192 or 194.

[0080] The control circuit 172 generates timing signals for controlling the switching operations of the power semiconductor element 155 of the upper arm and the power semiconductor element 157 of the lower arm based on input information from a control device or sensor (e.g., current sensor 180) on the vehicle side. The driver circuit 174 generates drive signals for switching the power semiconductor element 155 of the upper branch and the power semiconductor element 157 of the lower branch based on the timing signals output from the control circuit 172. Additionally, 181, 182, 183, and 188 are connectors.

[0081] The upper and lower arm series circuit includes a temperature sensor (not shown), and the temperature information of the upper and lower arm series circuit is input to the control circuit 172. Additionally, the control circuit 172 receives the voltage information of the DC positive terminal of the upper and lower arm series circuit. Based on this information, the control circuit 172 performs over-temperature detection and over-voltage detection. If over-temperature or over-voltage is detected, the switching operation of all power semiconductor elements 155 in the upper arm and power semiconductor elements 157 in the lower arm is stopped, protecting the upper and lower arm series circuit from the effects of over-temperature or over-voltage.

[0082] Figure 14 This is a perspective view of the power conversion device 200. Figure 15 yes Figure 14 A cross-sectional view of the power conversion device 200 along line Y3-Y3.

[0083] The power conversion device 200 includes a frame 12, which is formed in a generally rectangular parallelepiped shape and consists of a lower housing 11 and an upper housing 10. A power module 400 and the like are housed inside the frame 12. The power module 400 has a refrigerant flow path, and an inlet pipe 13 and an outlet pipe 14, communicating with the flow path, protrude from one side of the frame 12. Figure 15As shown, the lower housing 11 has an opening on its upper side (Z direction), and the upper housing 10 is mounted on the lower housing 11, blocking the opening. The upper housing 10 and lower housing 11 are made of aluminum alloy or the like, and are sealed and fixed to the outside. Alternatively, the upper housing 10 and lower housing 11 can be integrally formed. By making the frame 12 a simple cuboid shape, it is easy to install on vehicles, etc., and easy to manufacture. Figure 14 As shown, a connector 17 is mounted on one side of the housing 12 along its length, and an AC terminal 18 is connected to the connector 17.

[0084] like Figure 15 As shown, a power module 400 is housed within the housing 12. A control circuit 172 and a drive circuit 174 are positioned above the power module 400, and a capacitor module 600 is housed below it. The AC terminal 320B of the power module 400 is connected to the bus 361 via a current sensor 180. Furthermore, the positive terminal 315B and negative terminal 319B of the power module 400, which are DC terminals, are connected to the positive terminal 362A and negative terminal 362B of the capacitor module 600, respectively.

[0085] In addition, Figure 15 In the power module 400 shown, the AC side terminal 320B extends straight out without bending. In addition, the positive side terminal 315B and the negative side terminal 319B have a short shape that is cut off at the root side.

[0086] The following effects can be obtained by implementing the methods described above.

[0087] (1) The power module 400 includes: a heat sink base 440 on which a plurality of heat sinks 331 are erected; a cover member 340 having an inclined portion 343 that slopes toward the outer periphery of the heat sink base 440, forming a flow path for refrigerant 451 between the cover member and the heat sink base 440; and a resin material 336 that bonds the heat sink base 440 and the cover member 340, the resin material 336 being disposed within a first region 421 enclosed by the heat sink base 440, the inclined portion 343 of the cover member 340, and the outermost heat sinks 334 disposed on the outermost periphery. Thus, a power module that improves cooling performance by preventing refrigerant bypass flow regardless of the dimensional accuracy of the components can be provided.

[0088] (2) The manufacturing method of power modules 400 and 500 includes: a first step of forming an inclined portion 343 inclined toward the outer periphery of a heat sink base 440 on which a plurality of heat sinks 331 are erected, corresponding to the inclined portion 343 of a cover member 340 for forming a flow path for refrigerant 451 between the cover member and the heat sink base 440, and applying a resin material 336 to the heat sink base 440; and a second step of pressing the cover member 340 onto the heat sink base 440 to bond the cover member 340 and the heat sink base 440 via the resin material 336, wherein the resin material 336 is disposed within a first region 421 surrounded by the heat sink base 440, the inclined portion 343 of the cover member 340, and the outermost heat sink 334 disposed on the outermost periphery. Thus, a power module that improves cooling performance by preventing refrigerant bypass flow regardless of the dimensional accuracy of the components can be provided.

[0089] (Modified Example)

[0090] The present invention can be implemented by modifying the first and second embodiments described above as follows.

[0091] (1) In the first and second embodiments, the power modules 400 and 500 with two-sided cooling were described as examples, but the power modules with one-sided cooling may also be used.

[0092] This invention is not limited to the embodiments described above. Other embodiments that can be considered within the scope of the technical concept of this invention, as long as they do not impair the characteristics of this invention, are also included within the scope of this invention. Additionally, it may be a combination of the above embodiments and variations.

[0093] Symbol Explanation

[0094] 11…Lower housing, 12…Frame, 13…Inlet pipe, 14…Outlet pipe, 18…AC terminal, 43, 140, 142…Converter circuit, 150, 155, 157…Power semiconductor components, 156, 158…Diodes, 172…Control circuit, 174…Drive circuit, 180…Current sensor, 181, 182, 188…Connectors, 192, 194…Electric generator, 200…Power conversion device, 300…Circuit body, 440…Heat sink base, 331…Heat sink, 332… …area heat sink, 334…outermost heat sink, 336…resin material, 338…sealing part, 339…welding part, 340…cover component, 341…connecting structural component, 343…sloping part, 360…sealing resin, 400, 500…power module, 410…heat dissipation area, 421…first area, 422…second area, 430…emitter-side conductor, 431…collector-side conductor, 432…emitter-side wiring board, 433…collector-side wiring board, 450, 451…refrigerant, 600…capacitor module.

Claims

1. A power module, characterized in that, have: A heat sink base on which multiple heat sinks are erected; The cover component forms an inclined portion that slopes toward the outer periphery of the heat sink base, forming a refrigerant flow path between itself and the heat sink base; as well as A resin material is used to bond the heat sink base and the cover component. The resin material is disposed in a first region enclosed by the heat sink base, the inclined portion of the cover member, and the heat sink disposed on the outermost periphery. In the cross-section perpendicular to the flow direction of the refrigerant in the flow path, the cross-sectional area of ​​the first region is larger than the average cross-sectional area between adjacent heat sinks among the plurality of heat sinks, and the cross-sectional area of ​​the second region formed between the resin material disposed in the first region and the heat sink disposed on the outermost periphery is smaller than the average cross-sectional area between the heat sinks.

2. The power module according to claim 1, characterized in that, The resin material disposed in the first region is in contact with the heat sink disposed on the outermost peripheral side.

3. The power module according to claim 2, characterized in that, The heat sink that is in contact with the resin material is a flat heat sink.

4. The power module according to claim 1, characterized in that, The resin material is an adhesive material with Al plate as the substrate. It is a material that, when a test piece with tensile shear bond strength determined according to JISK6850 is immersed in a long-life coolant at 125°C for 2000 hours in a sealed container, exhibits cohesive failure in more than 80% of its area.

5. The power module according to claim 1, characterized in that, The inclined portion has a first inclined portion facing the outer periphery of the heat sink base and a second inclined portion facing the heat sink side. The angle of the second inclined portion relative to the heat sink base is greater than the angle of the first inclined portion relative to the heat sink base.

6. The power module according to claim 5, characterized in that, The resin material is bonded to the first inclined portion and to at least a portion of the second inclined portion.

7. The power module according to claim 1, characterized in that, have: The circuit body has the heat sink base; and Connecting structural components that connect multiple circuit elements. The connecting structural member is disposed between the heat sink base and the cover member. The resin material is disposed between the heat sink base and the connecting component, as well as in the first region.

8. The power module according to claim 7, characterized in that, The heat sink base is a pure aluminum component, while the connecting component and the cover component are made of alloy aluminum.

9. The power module according to claim 8, characterized in that, The connecting component and the cover component are made of 3000 series aluminum, and the connecting component and the cover component are fixed to the outer periphery of the cover component by laser welding.

10. A power conversion device, characterized in that, The power module described in claim 1 or 7 converts DC power and AC power to each other.

11. A method for manufacturing a power module, characterized in that, have: In the first step, an inclined portion is formed that is inclined toward the outer periphery of a heat sink base on which multiple heat sinks are erected, and the inclined portion corresponds to the cover member for forming a refrigerant flow path between the heat sink base and the heat sink base, and a resin material is applied to the heat sink base. as well as The second step involves pressing the cover component onto the heat sink base and bonding the cover component and the heat sink base together using the resin material. The resin material is disposed in a first region enclosed by the heat sink base, the inclined portion of the cover member, and the heat sink disposed on the outermost periphery. In the cross-section perpendicular to the flow direction of the refrigerant in the flow path, the cross-sectional area of ​​the first region is larger than the average cross-sectional area between adjacent heat sinks among the plurality of heat sinks, and the cross-sectional area of ​​the second region formed between the resin material disposed in the first region and the heat sink disposed on the outermost periphery is smaller than the average cross-sectional area between the heat sinks.

12. The method for manufacturing a power module according to claim 11, characterized in that, The third step involves fixing the cover component and the heat sink base on the outer periphery of the cover component.

13. The method for manufacturing a power module according to claim 11, characterized in that, The second step includes bonding a connecting component that connects multiple circuit bodies having the heat sink base to the cover component and the heat sink base using the resin material.

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