Wafer loading and unloading device and chemical mechanical polishing system

Abstract

The application discloses a wafer loading and unloading device, which comprises a carrier for loading and / or unloading wafers, a carrier seat connected below the carrier for supporting the carrier, and a driving mechanism connected below the carrier seat for driving the carrier seat to move vertically, wherein the periphery of the carrier is provided with spray members, and the spray members are arranged upwardly and obliquely towards the center of the carrier; the spray members spray fluid upwardly to clean and moisturize the carrier head located above the carrier.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of chemical mechanical polishing, and particularly relates to a wafer loading and unloading device and a chemical mechanical polishing system. BACKGROUND

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digitalization and intelligentization. Chips are the carriers of integrated circuits, and chip manufacturing involves integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting and packaging, and testing processes. Among them, chemical mechanical polishing is one of the five core processes in the wafer manufacturing process.

[0003] Chemical mechanical polishing (CMP) is a global planarization ultra-precision surface processing technology. Chemical mechanical polishing usually attracts the wafer to the bottom surface of the carrier head, the side of the wafer with the deposited layer abuts against the upper surface of the polishing pad, and the carrier head rotates with the polishing pad in the same direction under the actuation of the drive assembly and gives the wafer a downward load; the polishing liquid is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the wafer completes chemical mechanical polishing of the wafer under the combined action of chemical and mechanical.

[0004] The chemical mechanical polishing system is also provided with a wafer loading and unloading device (load cup) to realize wafer interaction, such as a robot placing a wafer on the wafer loading and unloading device, and the carrier head attracting the wafer on the wafer loading and unloading device and transferring the wafer to the polishing disc.

[0005] At present, on the wafer loading and unloading device, due to its interaction with the carrier head, there is an obstruction above the wafer, and in most cases, the polishing surface (i.e. the front surface) of the wafer is mainly moisturized, the moisturizing spray member is installed below the wafer, and the front surface of the wafer is sprayed from bottom to top, while the back surface of the wafer is generally difficult to moisturize directly. And the carrier head is difficult to clean, and the pollutants and particles accumulated on the carrier head will scratch the wafer, affecting the polishing effect of the wafer, which is a problem to be solved. SUMMARY

[0006] The present application provides a wafer loading and unloading device and a chemical mechanical polishing system, which aims to at least solve one of the technical problems existing in the prior art.

[0007] The first aspect of the present application provides a wafer loading and unloading device, which comprises:

[0008] A bracket for loading and / or unloading a wafer;

[0009] A bracket seat connected below the bracket for supporting the bracket;

[0010] A driving mechanism is connected to the lower part of the bracket base to drive the bracket base to move vertically;

[0011] The bracket is provided with a plurality of spray members around the circumference thereof, and the spray members are inclined upward toward the center of the bracket.

[0012] In some embodiments, the spray members are arranged outside the wafer placement area.

[0013] In some embodiments, the bracket has a ring structure, and the upper surface of the bracket is provided with a groove, and the spray members are arranged in the groove and inclined toward the center of the bracket.

[0014] In some embodiments, the number of spray members is at least one, and the spray members are arranged at intervals on the upper part of the bracket.

[0015] In some embodiments, the inclination angle of the spray members relative to the plane of the bracket is 30-70°.

[0016] In some embodiments, the inclination angles of adjacent spray members toward the center of the bracket are different.

[0017] In some embodiments, the spray members are solid cone nozzles, and the spray angles of adjacent spray members are different to form spray areas of different sizes.

[0018] In some embodiments, the inner bottom surface of the groove is inclined downward toward the center of the bracket to form an inclined surface, and the spray members are fixed in the groove perpendicularly to the inclined surface.

[0019] In some embodiments, the upper part of the bracket is further provided with an auxiliary spray assembly, and the auxiliary spray assembly comprises a support frame and auxiliary nozzles, and the auxiliary nozzles are arranged toward the center of the bracket to clean and moisturize the side surface of the carrier head and / or the wafer placed on the bracket.

[0020] In some embodiments, the support frame has a plate structure, and the support frame is arranged in parallel and at intervals above the bracket, and the support frame is located outside the interaction area of the carrier head.

[0021] In some embodiments, the auxiliary nozzles and the spray members are arranged alternately along the circumference of the bracket.

[0022] In some embodiments, the wafer loading and unloading device further comprises an information detection member and a control unit, the information detection member is arranged toward the upper side of the bracket to collect surface data of the carrier head located above the bracket, and the control unit determines the process parameters of the spray members based on the collected surface data.

[0023] In some embodiments, the information detecting member is staggered with the spraying member along the circumference of the carrier, and acquires the particle adhesion information on the surface of the carrier head by image acquisition; the control unit determines the process parameters of the spraying member by comparing the detected value of the surface data with the threshold value.

[0024] The second aspect of the embodiments of the present application provides a chemical mechanical polishing system, which comprises a polishing disc, a carrier head, a trimming device and a liquid supply device, and further comprises the wafer loading and unloading device as described above.

[0025] The beneficial effects of the present application include:

[0026] a. The spraying member arranged on the carrier is located outside the wafer placement area, so that the spraying member can clean and moisturize the carrier head above the carrier without waiting for the wafer on the carrier to be transferred, effectively shortening the process waiting time, improving the operation efficiency of the CMP system and improving the production capacity of the CMP system;

[0027] b. The carrier is provided with a plurality of spraying members, at least one of which is arranged towards the gap between the retaining ring and the elastic membrane of the carrier head, so as to reduce the crystallization of polishing particles in the gap and avoid the damage of the wafer caused by the falling of the crystallization;

[0028] c. The carrier is further provided with an auxiliary spraying assembly, which is combined with the wafer cleaning assembly arranged on the carrier seat to clean and moisturize the front and back surfaces of the wafer at the same time;

[0029] d. The information detecting member arranged on the carrier can acquire the adhesion information of the particles on the surface of the carrier head, and then determine the process parameters of the spraying member, so as to efficiently clean the gap between the retaining ring and the elastic membrane of the carrier head. BRIEF DESCRIPTION OF DRAWINGS

[0030] The advantages of the present application will become more apparent and more readily appreciated when considered in connection with the following detailed description, taken in conjunction with the accompanying drawings, which are merely illustrative and not restrictive, wherein:

[0031] Figure 1 is a schematic diagram of a chemical mechanical polishing system provided by an embodiment of the present application;

[0032] Figure 2 is a schematic diagram of a wafer loading and unloading device provided by an embodiment of the present application;

[0033] Figure 3 is a schematic diagram of a spraying member mounted on a carrier provided by an embodiment of the present application;

[0034] Figure 4 is a schematic diagram of a carrier provided by an embodiment of the present application;

[0035] Figure 5 is a sectional view of a carrier provided by an embodiment of the present application;

[0036] Figure 6 is a schematic view of a wafer handling device provided with an auxiliary spray assembly according to an embodiment of the present application;

[0037] Figure 7 is a schematic view of a carrier provided with an auxiliary spray assembly according to an embodiment of the present application;

[0038] Figure 8 is a schematic view of an auxiliary spray assembly according to an embodiment of the present application;

[0039] Figure 9 is a schematic view of a wafer handling device provided with an auxiliary spray assembly according to an embodiment of the present application; Figure 3 is a schematic view of a wafer handling device provided with an auxiliary spray assembly according to an embodiment of the present application;

[0040] Figure 10 is a schematic view of a wafer cleaning assembly according to an embodiment of the present application;

[0041] Figure 11 is a schematic view of a wafer handling device provided with an auxiliary spray assembly according to an embodiment of the present application;

[0042] Figure 12 is a schematic view of a wafer handling device provided with an auxiliary spray assembly according to an embodiment of the present application;

[0043] Figure 13 is a schematic view of a wafer handling device provided with an auxiliary spray assembly according to an embodiment of the present application; DETAILED DESCRIPTION

[0044] The technical solutions of the present application will be described in detail below with reference to specific embodiments and drawings. The embodiments described herein are specific and concrete embodiments of the present application, which are used to illustrate the concept of the present application; all the descriptions are explanatory and exemplary, and should not be understood as limiting the embodiments of the present application and the protection scope of the present application. In addition to the embodiments described herein, those skilled in the art can also employ other technical solutions that are obvious based on the content disclosed in the claims and the description of the present application, which include technical solutions that make any obvious substitutions and modifications to the embodiments described herein.

[0045] The drawings of the present specification are schematic views, which assist in illustrating the concept of the present application, and schematically represent the shape of each part and the relationship between them. It should be understood that in order to clearly show the structure of each component of the embodiments of the present application, the drawings are not drawn according to the same scale, and the same reference signs are used to represent the same parts in the drawings.

[0046] In the present application, "Chemical Mechanical Polishing (CMP)" is also referred to as "Chemical Mechanical Planarization (CMP)", and "Wafer (W)" is also referred to as "Substrate", which have the same meaning and actual effect.

[0047] Embodiments of the present disclosure generally relate to a CMP system used in the semiconductor device manufacturing industry. During chemical mechanical polishing, a polishing liquid composed of sub-micron or nano abrasive particles and a chemical solution flows between a wafer and a polishing pad, the polishing liquid is uniformly distributed under the action of transmission and rotation centrifugal force of the polishing pad to form a thin liquid film between the wafer and the polishing pad, the chemical components in the liquid react with the wafer to convert insoluble substances into soluble substances, and then the chemical reactants are removed from the wafer surface by the micro-mechanical friction of the abrasive particles and dissolved into the flowing liquid, that is, the surface material is removed in the alternating process of chemical film formation and mechanical film removal to achieve surface planarization treatment, so as to achieve the purpose of global planarization.

[0048] As shown in Figure 1 An embodiment of the present application provides a chemical mechanical polishing system, which comprises a wafer loading and unloading device 100, a polishing disc 200, a polishing pad, a carrier head 300, a liquid supply device 400 and a dressing device 500. The polishing pad is arranged on the upper surface of the polishing disc 200, and the polishing pad rotates together with the polishing disc 200. The horizontally movable carrier head 300 is arranged above the polishing pad, and the bottom of the carrier head 300 attracts the wafer to be polished. The liquid supply device 400 is arranged above the polishing pad to spread the polishing liquid on the surface of the polishing pad. The dressing device 500 swings around a fixed point, and the dressing head arranged thereon rotates itself and applies a downward load to dress the surface of the polishing pad.

[0049] Figure 1 In the present application, the wafer loading and unloading device 100 is horizontally adjacent to one side of the polishing disc 200, and the carrier head 300 can transfer the wafer in the wafer loading and unloading device 100 to above the polishing pad, or the carrier head 300 places the wafer after polishing in the wafer loading and unloading device 100. Alternatively, a wafer transfer robot (not shown) places the wafer to be polished in the wafer loading and unloading device 100, and after the carrier head 300 places the wafer after polishing in the wafer loading and unloading device 100 again, the wafer transfer robot transfers the wafer to the next process.

[0050] Figure 2 Fig. 1 is a schematic view of a wafer loading and unloading device 100 according to an embodiment of the present application. The wafer loading and unloading device 100 comprises:

[0051] A carrier 10 for loading and / or unloading the wafer;

[0052] A bracket base 20 is connected below the bracket 10 and used to support the bracket 10;

[0053] A driving mechanism 30 is connected below the bracket base 20 and used to drive the bracket base 20 to move vertically, thereby changing the vertical position of the bracket 10, so as to interact with the wafer handling robot or the carrier head and the wafer loading and unloading device 100.

[0054] Figure 2 In the embodiment, the bracket 10 is in a ring structure, and the upper surface of the bracket 10 is further provided with a tapered column 50 used to define the carrier head. The tapered column 50 can abut against the outer peripheral wall of the holding ring at the lower part of the carrier head, thereby accurately defining the position of the carrier head, so that the carrier head interacts with the wafer loading and unloading device 100.

[0055] Further, the upper part of the bracket base 20 is provided with a plurality of connecting seats 21 uniformly distributed along the central axis of the bracket base 20, and the connecting seats 21 are connected with the bracket 10.

[0056] Further, the driving mechanism 30 is a linear module, such as a pneumatic cylinder. The driving mechanism 30 drives the bracket base 20 and the bracket 10 thereon to move linearly to a predetermined position. It can be understood that the driving mechanism 30 can also be an electric cylinder or other linear module to realize the vertical movement of the bracket 10.

[0057] Figure 2 In the embodiment shown, the bracket 10 is further provided with a spraying member 40, which is arranged along the circumference of the bracket 10. Specifically, the spraying member 40 is arranged obliquely upward towards the center of the bracket 10; the spraying member 40 can obliquely spray fluid upward to clean and moisturize the carrier head located above the bracket 10.

[0058] Figure 3 FIG. 1 is a schematic view of the bracket 10 provided with the spraying member 40 according to an embodiment of the present application. The upper surface of the bracket 10 is provided with a plurality of tapered columns 50, which are arranged close to the outer edge of the bracket 10 to define the position of the carrier head; the upper surface of the bracket 10 is further provided with a plurality of limiting bodies 60, which are arranged close to the inner edge of the bracket 10. The limiting bodies 60 are uniformly distributed along the bracket 10 to define a wafer placement area. The wafer handling robot or the carrier head loads the wafer on the wafer placement area, and the position of the wafer on the bracket 10 is defined by the limiting bodies 60.

[0059] Figure 3 In the embodiment, the spraying member 40 is arranged outside the wafer placement area. Even if the wafer is placed on the bracket 10, the spraying member 40 can still spray fluid towards the carrier head above the bracket 10 to clean and moisturize the carrier head.

[0060] Furthermore, the spray element 40 is located inside the bearing head placement area formed by the plurality of conical columns 50. That is, the spray element 40 is approximately located below the retaining ring of the bearing head, the gap formed between the retaining ring and the elastic membrane, and / or the edge area of ​​the elastic membrane. The spray element 40 can directly spray fluid toward the above-mentioned area to achieve cleaning and moisturizing of the bearing head.

[0061] To accurately define the wafer's position within the holding ring, while ensuring the elastic membrane of the support head can move vertically within the holding ring to achieve wafer loading, unloading, and load adjustment, the gap G between the holding ring 310 and the elastic membrane 320 is typically controlled between 1-2 mm. Figure 13 As shown. In the chemical mechanical polishing process, such a small gap can easily cause polishing particles to accumulate, and even cause capillary effects. The fluid mixed with particles will flow towards the inside of the gap, causing a large number of crystals to form between the retaining ring and the elastic membrane. The formed crystals are easy to fall onto the polishing pad, causing the polished wafer to break.

[0062] To avoid the aforementioned problems, at least one spray element 40 of the bracket 10 is positioned toward the gap between the retaining ring and the elastic membrane, so that the fluid sprayed by the spray element 40 directly reaches the gap, achieving a good cleaning effect.

[0063] Figure 4 This is a schematic diagram of the structure of a bracket 10 provided in an embodiment of the present invention. The bracket 10 has a ring-shaped structure, and a groove 11 is provided on the upper surface of the bracket 10. Figure 3 In this bracket 10, there are three grooves 11, which are evenly spaced along the circumference of the bracket 10. The spraying element 40 is inclined in the groove 11 toward the center of the bracket 10.

[0064] Figure 3 In this design, there are three spray nozzles 40, spaced apart on the upper part of the bracket 10. It is understood that the number of spray nozzles 40 could also be different, spaced apart, to spray fluid toward different areas below the bearing head, thereby improving the efficiency of cleaning and moisturizing the bearing head.

[0065] Furthermore, the tilt angle θ of the injection component 40 relative to the plane of the bracket 10 is... Figure 5 (As shown) The angle is 30-70° to spray fluid towards different areas of the lower part of the bearing head. Preferably, the inclination angles of adjacent spray elements 40 toward the center of the bracket are different, so as to simultaneously rinse different areas of the bearing head and achieve a good cleaning and moisturizing effect. During the cleaning and moisturizing of the bearing head, the bearing head rotates around its central axis, so that the spray elements 40 can spray fluid in a predetermined inclination direction and cover the entire circumference of the bearing head, achieving comprehensive cleaning and moisturizing of the entire bearing head.

[0066] Figure 3In the shown embodiment, one of the spray members 40 is inclined at an angle θ of 65° to the plane of the carrier 10, and the other spray members 40 are inclined at an angle θ of 60° and 55° to the plane of the carrier 10, so that the fluid sprayed by the spray members 40 covers the holding ring of the carrier head, the gap between the holding ring and the elastic membrane, and the elastic membrane.

[0067] Figure 5 is a sectional view of the carrier 10 according to an embodiment of the present application, wherein the section is taken through the recess 11 to clearly show the structure and the position of the recess 11. The inner bottom surface of the recess 11 is inclined downward toward the center of the carrier 10 to form an inclined surface 11a. A through mounting hole is provided on the inclined surface 11a, and the axis of the mounting hole is perpendicular to the inclined surface 11a. The spray member 40 is fixed to the mounting hole perpendicularly to the inclined surface 11a. That is, the spray member 40 is fixed to the recess 10 perpendicularly to the inclined surface 11a, so that the spray member 40 is arranged inclined upward toward the inner side of the carrier 10, so that the spray member 40 sprays fluid upwardly and obliquely.

[0068] In the present application, the spray member 40 is a solid cone nozzle, and the fluid sprayed by the spray member 40 from the water outlet of the spray member toward the outside is in the shape of a cone, so as to ensure the cleaning and moisturizing effect. Figure 3 The spray member 40 in the shown embodiment shows the general shape of the sprayed fluid, so as to expand the spraying range of the spray member 40.

[0069] In the present application, the spraying angle of the spray member 40 is different from the inclined angle of the spray member 40. The spraying angle of the spray member 40 refers to the included angle corresponding to the longitudinal section of the cone formed by the solid cone nozzle. The spraying angle of the spray member 40 is related to the spraying area formed by the sprayed fluid. The greater the spraying angle of the spray member 40, the greater the spraying area formed by the fluid sprayed by the spray member 40.

[0070] In order to ensure the cleaning and moisturizing effect of the carrier head, the spraying angles of the adjacent spray members 40 are different, so as to form spraying areas of different sizes. Figure 3 In the shown embodiment, the corresponding spraying angles of the spray members 40 are 60°, 90° and 120°, respectively. Among them, the spray members 40 with the spraying angles of 60° and 90° mainly spray fluid toward the gap between the holding ring and the elastic membrane of the carrier head, and flush the side wall of the holding ring and the carrier head, while the spray member 40 with the spraying angle of 120° mainly sprays fluid toward the elastic membrane of the carrier head. That is, the spray member 40 with the greater spraying angle corresponds to a larger radiation area of the fluid, so as to flush the fluid toward the elastic membrane; while the spray member 40 with the smaller spraying angle corresponds to a smaller radiation area of the fluid, so as to provide fluid with a certain impact force, and improve the cleaning effect of the gap between the holding ring and the elastic membrane.

[0071] Figure 6 is a schematic view of a wafer loading and unloading device 100 according to an embodiment of the present application, andFigure 2 The embodiment shown is further provided with an auxiliary spraying assembly 70, which is arranged above the tray 10 to spray fluid towards the inner side of the tray 10, so as to clean and moisturize the side of the carrier head and / or the wafer placed on the tray 10.

[0072] Figure 7 Fig. 4 is a schematic view of the auxiliary spraying assembly 70 connected to the tray 10, the auxiliary spraying assembly 70 comprising a support frame 71 and an auxiliary nozzle 72 connected to the support frame 71. Specifically, the support frame 71 is a plate-shaped structure arranged parallel to the upper surface of the tray 10, so as to adjust the relative position of the auxiliary nozzle 72 thereon with reference to the tray 10. Meanwhile, the support frame 71 is arranged in a spaced manner with the tray 10, i.e. a gap is arranged between the bottom surface of the support frame 71 and the top surface of the tray 10, so as to provide space for the installation of the auxiliary nozzle 72.

[0073] Figure 7 In the embodiment shown, the auxiliary nozzle 72 is fixed at the middle position of the length direction of the support frame 71, and the number of the auxiliary nozzle 72 is one. It can be understood that multiple auxiliary nozzles 72 can be arranged on the support frame 71 in a spaced manner, so as to enhance the cleaning and moisturizing effect.

[0074] Further, the support frame 71 is an arc-shaped plate, and the support frame 71 and the auxiliary nozzle 72 thereon are arranged outside the interaction area of the carrier head. The auxiliary nozzle 72 is arranged towards the center of the tray 10, so as to clean and moisturize the side of the carrier head and / or the wafer placed on the tray 10.

[0075] Figure 7 In the embodiment shown, the number of the auxiliary spraying assemblies 70 is two, which are arranged in a spaced manner along the circumferential direction of the tray 10. When determining the arrangement position of the auxiliary spraying assembly 70, in addition to avoiding the moving track of the carrier head when loading and unloading the wafer, the moving track of the wafer carrying robot also needs to be avoided, so as to avoid the interference between the auxiliary spraying assembly 70 and the wafer carrying robot.

[0076] In the present application, when the wafer is placed on the tray 10, the spraying member 40 on the tray 10 can clean and moisturize the carrier head above the wafer loading and unloading device 100; meanwhile, the auxiliary spraying assembly 70 on the tray 10 can also clean and moisturize the wafer on the tray 10. That is, the wafer loading and unloading device 100 in the present application can clean and moisturize the wafer on the tray 10 and the carrier head above the tray 10 at the same time.

[0077] Figure 7In the embodiment shown, the support frame 71 is fixed to the top of the adjacent conical column 50, so as to reduce the number of components of the wafer loading and unloading device 100 and facilitate the mounting and fixing of the support frame 71.

[0078] Since the spray member 40 and the auxiliary nozzle 72 are solid conical nozzles, in addition to the physical staggered arrangement of the fixed positions of the spray members, the conical spray formed by the fluid sprayed by the nozzles should also be avoided as much as possible.

[0079] Figure 7 In the embodiment shown, the support frame 71 is fixed to the top of the adjacent conical column 50, so as to reduce the number of components of the wafer loading and unloading device 100 and facilitate the mounting and fixing of the support frame 71.

[0080] Figure 8 In the embodiment shown, the auxiliary nozzle 72 is slightly inclined downward, so as to flush the fluid toward the side surface of the retaining ring and prevent the side surface of the retaining ring from being attached with particles and crystallized. Specifically, the angle between the central axis of the auxiliary nozzle 72 and the plane on which the support frame 71 is located is α, and the angle α is 3-10°. Preferably, the angle between the central axis of the auxiliary nozzle 72 and the plane on which the support frame 71 is located is 5-8°. Within the above angle range, the fluid sprayed by the auxiliary nozzle 72 can effectively clean the front surface of the wafer placed on the carrier 10.

[0081] Figure 9 In the embodiment shown, the auxiliary nozzle 72 is slightly inclined downward, so as to flush the fluid toward the side surface of the retaining ring and prevent the side surface of the retaining ring from being attached with particles and crystallized. Specifically, the angle between the central axis of the auxiliary nozzle 72 and the plane on which the support frame 71 is located is α, and the angle α is 3-10°. Preferably, the angle between the central axis of the auxiliary nozzle 72 and the plane on which the support frame 71 is located is 5-8°. Within the above angle range, the fluid sprayed by the auxiliary nozzle 72 can effectively clean the front surface of the wafer placed on the carrier 10. Figure 3 The wafer cleaning assembly 80 is arranged on the wafer carrier seat 20, and is concentrically arranged in the carrier 10, so as to clean the wafer placed above the carrier 10.

[0082] Figure 10 The wafer cleaning assembly 80 includes a cleaning main body 81, which is concentrically arranged in the interior of the carrier 10. Since the wafer carrier seat 20 is provided with the S-shaped connecting seat 21, the wafer cleaning assembly 80 arranged on the wafer carrier seat 20 is lower than the bottom surface of the carrier 10. That is, there is a certain distance between the wafer cleaning assembly 80 and the wafer to be cleaned and moisturized, so as to increase the travel of the sprayed fluid and avoid the damage of the components on the wafer caused by the excessive impact of the sprayed fluid. Figure 2 The wafer cleaning assembly 80 is arranged on the wafer carrier seat 20, and is concentrically arranged in the carrier 10, so as to clean the wafer placed above the carrier 10.

[0083] Further, the cleaning main body 81 is provided with a straight jet nozzle 82 and three oblique jet nozzles 83, the straight jet nozzle 82 is arranged at the center of the cleaning main body 81, and the oblique jet nozzles 83 are uniformly distributed along the straight jet nozzle 82, so as to sufficiently clean the back surface of the wafer placed on the carrier 10.

[0084] Figure 11 In the embodiment, the carrier 10 is provided with an auxiliary spraying assembly 70 and Figure 10 The wafer cleaning assembly 80 (blocked by the wafer W) is shown. The wafer cleaning assembly 80 and the auxiliary spraying assembly 70 are combined to simultaneously clean and moisturize the front and back surfaces of the wafer on the carrier 10.

[0085] Figure 12 The auxiliary spraying assembly 70 of the wafer loading and unloading device 100 is combined with the wafer cleaning assembly 80 above the carrier seat 20 to spray fluid towards the front and back surfaces of the wafer, achieving the cleaning and moisturizing of the wafer. Since the spraying elements 40 on the carrier 10 are arranged outside the wafer placement area, the wafer on the carrier 10 will not block the spraying elements 40. The plurality of spraying elements 40 arranged on the wafer loading and unloading device 100 can clean the surface of the carrier head from different directions, achieving the cleaning and moisturizing of the carrier head.

[0086] In the embodiment, in order to increase the cleaning effect of the carrier head, especially the gap between the holding ring and the elastic film of the carrier head. The fluid sprayed by the spraying element 40 can be fluid with a certain pressure, fluid with a certain temperature and / or fluid generated by sound waves. The operator can flexibly determine the type of fluid sprayed by the spraying element 40 according to the operation of the carrier head, and determine the spraying time of the spraying element 40, so as to achieve good cleaning and moisturizing effect.

[0087] In the embodiment, the wafer loading and unloading device 100 further comprises Figure 2 The information detection member 90 and the control unit not shown are shown. The information detection member 90 is used to collect the surface data of the carrier head above the carrier 10, and the control unit determines the working process of the spraying element 40 based on the collected surface data.

[0088] Figure 3 In the embodiment, the information detection member 90 is arranged on the carrier 10, and the information detection member 90 is staggered with the spraying element 40. The information detection member 90 acquires the particle adhesion information of the surface of the carrier head by image acquisition, and the control unit compares the detection value of the surface data of the carrier head with the threshold value, thereby determining the process parameters of the spraying element 40. The process parameters can include parameters such as the pressure, temperature, gas phase vapor and / or sound wave generation of the fluid sprayed by the spraying element 40, so as to quickly and efficiently realize the surface cleaning of the carrier head.

[0089] For example, the information detecting member 90 can be an image collector which acquires the number or area of particles on the bottom surface of the carrier head when the carrier head is close and sends the number or area of particles to the control unit; the control unit compares the detected number or area of particles with a pre-stored threshold value, and when the number or area of particles is too large, controls the spraying member 40 to increase the pressure or temperature of the spraying fluid or to spray the two-fluid or vibration fluid.

[0090] Further, the control unit comprises:

[0091] a storage unit which stores a machine learning model constructed by machine learning;

[0092] a processing unit which inputs the surface data of the carrier head collected by the information detecting member 90, compares the surface data with the stored surface data, and calculates the process parameters of the spraying member 40 corresponding to the surface data reaching the threshold value.

[0093] The machine learning model includes but is not limited to support vector machines (SVM) or K-Nearest Neighbor (KNN) classification algorithm, etc. Through the training of the machine learning model, the relationship between the process parameters of the spraying member 40 and the surface data of the cleaned carrier head is constructed, so as to reasonably set the spraying parameters of the spraying member 40 and efficiently clean the gap between the carrier head, especially the retaining ring and the elastic membrane.

[0094] The following will be described in combination with Figure 1 a chemical mechanical polishing system shown in the drawings, and the operation process of the chemical mechanical polishing system will be briefly described:

[0095] Firstly, the wafer carrying robot (not shown) places the wafer to be polished on the tray 10 of the wafer loading and unloading device 100, the wafer cleaning assembly 80 and the auxiliary spraying assembly 70 spray the wafer front and back with fluid, at the same time, the spraying member 40 on the tray 10 flushes the elastic membrane, the retaining ring and the gap between the elastic membrane and the retaining ring of the carrier head 300, as shown in Figure 12 ;

[0096] Then, the carrier head 300 loads the wafer which has completed cleaning and moisturizing, and moves to the polishing pad to implement chemical mechanical polishing;

[0097] After the wafer completes polishing, the carrier head 300 moves to the station of the wafer loading and unloading device 100 and places the wafer which has completed polishing on the tray 10, waiting for the wafer carrying robot to transport; at this time, the wafer cleaning assembly 80 and the auxiliary spraying assembly 70 are turned on to clean and moisturize the wafer, at the same time, the spraying member 40 is turned on to clean and moisturize the carrier head 300.

[0098] Since the wafer moisturizing and the cleaning of the carrier head are independent of each other, the two can be performed simultaneously to improve the cleaning and moisturizing efficiency; in addition, the wafer transfer robot is not required to transfer the wafer before cleaning and moisturizing the carrier head, thereby effectively reducing the number of times of picking and placing the wafer by the wafer transfer robot and facilitating the comprehensive scheduling of the wafer transfer robot. That is, during the cleaning and moisturizing of the carrier head, the wafer transfer robot can take away the wafer after polishing and place a new wafer to be polished. After the wafer transfer robot completes the wafer placing action, the carrier head has completed the cleaning and moisturizing, and then the new wafer can be immediately loaded for polishing.

[0099] In summary, the wafer loading and unloading device 100 described above can effectively reduce the process waiting time and is beneficial to improve the WPH (Wafer Per Hour) of the CMP system; at the same time, the wafer loading and unloading device 100 is configured with multiple cleaning and moisturizing components to complete the cleaning and moisturizing of the wafer and the carrier head, which is beneficial to improve the polishing quality of the wafer.

[0100] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0101] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A wafer loading and unloading apparatus characterized by comprising: The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device.

2. The wafer handling device of claim 1, wherein The application relates to a wafer loading and unloading device.

3. The wafer handling device of claim 1, wherein The application relates to a wafer loading and unloading device.

4. The wafer handling device of claim 1, wherein The application relates to a wafer loading and unloading device.

5. A chemical mechanical polishing system characterized by comprising: The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. The application relates to a wafer loading and unloading device. 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