Masking tape peeling device

Abstract

This invention relates to a masking tape removal apparatus for performing a sputtering process on a portion of a semiconductor material with masking tape attached for electromagnetic interference (EMI) shielding, and for peeling off the masking tape attached to the semiconductor material after the sputtering process is completed. In particular, it relates to a masking tape removal apparatus that can stably remove the masking tape from the material while the material is supported by pressure with a material fixing part during the masking tape removal process, preventing damage to the semiconductor material or impact during the removal of the masking tape, and solving the problem of masking tape residue caused by errors in the removal process.

Description

Technical Field

[0001] This invention relates to a masking tape removal apparatus for sputtering a portion of a semiconductor material to shield against electromagnetic interference (EMI), wherein the sputtering process is performed with masking tape adhered to a region other than the sputtering area of ​​the semiconductor material, and the masking tape is then peeled off to remove the masking tape adhering to the semiconductor material after the sputtering process. In particular, this invention relates to a masking tape removal apparatus capable of preventing shock transmission to the semiconductor material and minimizing material damage during the removal of the masking tape. Background Technology

[0002] After the semiconductor material forms the circuit section on the substrate, a mold section is formed above the circuit section using a mold material to protect the circuit section. In addition, sputtering processes for electromagnetic interference (EMI) shielding can be performed on the top and side surfaces of each semiconductor material, except for the bottom surface where the electrodes are provided.

[0003] Recently, it has been found that, in order to provide multiple functions, a semiconductor material contains multiple circuit sections within a mold section. Depending on the type or function of any of the circuit sections, a portion of the semiconductor material cannot form a sputtered layer for electromagnetic wave shielding.

[0004] For example, a semiconductor material has multiple circuit sections formed in a mold section. When one of the circuit sections is a circuit for communication, etc., in order to realize the wireless communication function, the sputtering layer on the upper surface and side surface of the mold section of the corresponding circuit section area should be prevented from being deposited by vapor deposition or the sputtering layer should be removed.

[0005] However, with the miniaturization of semiconductor materials, it is not easy to perform sputtering processes on the surface of a semiconductor material mold by region.

[0006] Furthermore, recently, due to the special shape of the material, there are cases where electrodes and mold portions are formed together on the upper or lower surface of the material. In this case, the method used is to apply thermosetting masking tape to the part forming the electrode, and perform the sputtering process only on the mold portion.

[0007] Therefore, in order to sputter a semiconductor material by region, the method currently in use is to perform sputtering while a masking tape such as thermosetting tape is applied to a portion of the semiconductor material mold portion, and then peel off the masking tape after the sputtering process is completed.

[0008] On the other hand, when applying masking tape to the mold portion of semiconductor material, due to the sputtering characteristics of small-particle evaporation, if there are small gaps between the masking tape and the mold portion of the semiconductor material, sputtered particles can penetrate inwards, forming a sputtered layer in areas where it shouldn't. When using masking tape with excellent adhesion to prevent this inward penetration, difficulties arise in removing the masking tape. Furthermore, if the operator manually removes the masking tape piece by piece when unloading the semiconductor material after the sputtering process, there will be reduced operability and productivity (Units per Hour; UPH). Even when using automated equipment to remove the masking tape, there is a risk of damage to the semiconductor material or masking tape residue remaining on the semiconductor material due to peeling process errors.

[0009] Therefore, there is an urgent need for a masking tape removal device to solve the problem of semiconductor material damage or masking tape residue caused by peeling process errors when removing the masking tape attached to a portion of a semiconductor material after sputtering for electromagnetic wave shielding in that portion of the material. Summary of the Invention

[0010] The purpose of this invention is to provide a masking tape removal device that can solve the problem of semiconductor material damage or masking tape residue due to process errors when removing the masking tape after sputtering for electromagnetic wave shielding on a portion of a semiconductor material while the material is covered with masking tape.

[0011] In addition, the purpose is to stabilize and support the material with the material fixing part during the process of peeling off the masking tape, thereby preventing the material from being lifted up together, ensuring that only the masking tape can be removed without damaging the material.

[0012] In addition, the purpose is to measure the tension of the adhesive tape by means of a load unit during the peeling process of the masking tape, and to monitor the tension of the peeled adhesive tape in real time during peeling, so as to avoid scratches or damage to the material.

[0013] In addition, the purpose is to measure the tension of the adhesive tape before peeling off the masking tape, and to interrupt the peeling operation when the measured tension value exceeds the preset tension range, thereby preventing material damage in advance.

[0014] Furthermore, the aim is to adjust the peel angle of the adhesive tape by changing the height of the guide roller used to guide the adhesive tape based on the measured tension of the adhesive tape.

[0015] To address the aforementioned problem, the present invention provides a masking tape peeling device for peeling masking tape from material with masking tape attached to a portion of the material. The device includes: a peeling head having a peeling section that moves up and down above the material with the masking tape attached, and a material fixing section that moves up and down on one side of the peeling section and presses and fixes the upper surface of material without the masking tape attached; a supply roller and a recovery roller, the supply roller supplying adhesive tape to the lower surface of the peeling section, and the recovery roller recovering the adhesive tape; and a mounting base on which the peeling head, the supply roller, and the recovery roller are mounted. The supply roller conveys the adhesive tape below the peeling section such that the adhesive surface of the adhesive tape faces the masking tape on the material, and the recovery roller recovers the adhesive tape with the peeled masking tape attached. The material fixing section and the peeling section descend simultaneously or sequentially to contact the material, and the peeling section rises while the material fixing section is in contact with the material to peel the masking tape from the material.

[0016] Here, the peeling head also has a main body, which is provided with the peeling part and the material fixing part, and the peeling head is mounted on the mounting base through the main body.

[0017] Furthermore, the masking tape peeling device further includes: a guide roller, which is mounted on the mounting base and disposed between the supply roller and the recovery roller to guide the adhesive tape; a support portion, which is mounted on the mounting base and disposed on both sides of the peeling portion to support the adhesive tape guided by the guide roller; and a load unit, one end of which is connected to the support portion and measures the tension of the adhesive tape.

[0018] Furthermore, the mounting base is a liftable structure. When the mounting base is raised or lowered, the peeling head, the supply roller, the recycling roller, the guide roller, the support part, and the load unit are raised or lowered together. The material fixing part protrudes downwards compared to the peeling part. An elastic component, a cylinder for supporting the material fixing part, or a motor for raising or lowering the material fixing part is provided above the material fixing part. The mounting base first descends to make the material fixing part contact and support the material. While maintaining the material contact and support, it descends a second time until the peeling part descends and the adhesive surface of the adhesive tape contacts the masking tape. Then it rises to peel the masking tape off the material.

[0019] Furthermore, the peeling part and the material fixing part are raised and lowered independently from the mounting base.

[0020] Furthermore, an impact mitigation component is also included above at least one of the material fixing portion or the peeling portion. During the process of the material fixing portion contacting the material and during the process of the peeling portion descending to contact the adhesive surface of the adhesive tape and the masking tape, the impact mitigation component raises the material fixing portion or the peeling portion to a predetermined height to mitigate the impact applied to the material. The impact mitigation component is an elastic component, a cylinder, or a motor.

[0021] Furthermore, the masking tape peeling device also includes a guide roller support frame, on which the guide roller is mounted and is movable. The guide roller is mounted on the mounting base via the guide roller support frame. The load unit is configured to be mounted on the guide roller support frame at the other end and can move up and down together with the guide roller. The load unit measures the tension of the adhesive tape before peeling the masking tape with the adhesive surface of the adhesive tape. The guide roller support frame moves up and down according to the tension measurement result, thereby changing the lifting height of the guide roller to adjust the tension of the adhesive tape supplied to the lower surface of the peeling section.

[0022] Furthermore, the masking tape peeling device further includes: a guide roller support frame on which the guide roller is mounted and is movable; and a control unit that generates an alarm based on the tension value measured by the load unit. The guide roller is mounted on the mounting base via the guide roller support frame. The load unit is configured to be mounted on the guide roller support frame at one end and can move up and down together with the guide roller. The load unit measures the tension of the adhesive tape during the process of contacting and peeling the masking tape with the adhesive surface of the adhesive tape. When the measured tension value of the adhesive tape exceeds a preset tension range, the control unit generates an alarm.

[0023] Furthermore, the load unit includes a measuring part for measuring the tension of the adhesive tape and a rod extending from one end of the measuring part, and the support part includes a plurality of support pins for supporting the adhesive tape by the rod. The load unit measures the tension of the adhesive tape supported by at least one of the plurality of support pins.

[0024] Furthermore, the masking tape peeling device also includes: a material supply unit that supplies a material assembly containing multiple materials, the materials having the masking tape attached to them;

[0025] A supply pick-up device that picks up and conveys the material assembly supplied from the material supply unit; and a conveyor table on which the material assembly conveyed by the supply pick-up device is placed and conveys the material in the X and Y axis directions to be located below the stripping head.

[0026] Furthermore, the masking tape peeling device further includes: an alignment view, which is positioned above the moving path of the conveyor table and checks the position of the masking tape to be peeled; a retrieving unit, which picks up the material assembly with the peeled material attached by the peeling head and moves it to one side; and a material recovery unit, which recovers the material assembly that has finished its operation by the retrieving unit. The supply picker and the retrieving unit are either integrally arranged or separately arranged. Based on the inspection result of the alignment view, the conveyor table is moved in the X-axis or Y-axis direction so that each masking tape attached to the material is located below the peeling unit of the peeling head.

[0027] Furthermore, multiple conveyor tables and stripping heads are provided, and the supply pick-up device and the conveyor table have overlapping operating paths.

[0028] Furthermore, the stripping head and the conveyor table rotate in the θ direction.

[0029] Furthermore, the stripping head also includes: a main frame, which is fixed to the mounting base and mounts the main body; and an angle adjustment unit, which adjusts the rotation angle of the main body mounted on the main frame and secures the main frame and the main body. The angle adjustment unit rotates the main body by 0°, 45°, and 90°, and rotates the conveyor table so that it corresponds to the rotation angle of the main body rotated by the angle adjustment unit.

[0030] Furthermore, a replaceable peeling head is provided at the lower end of the peeling part, and a replaceable material fixing head is provided at the lower end of the material fixing part. The material fixing head is provided with a retraction groove or through part for the adhesive tape to retract, so as to prevent the adhesive tape from interfering with the material fixing part when the main body is rotated 45° or 90°.

[0031] Furthermore, a peeling head is provided at the lower end of the peeling part, and a replaceable material fixing head is provided at the lower end of the material fixing part. The peeling head and the material fixing head are installed together on the tool and can be detached from the lower end of the main body and the material fixing part. The material fixing head is provided with a retraction groove or through part for the adhesive tape to retract, so as to prevent the adhesive tape from interfering with the material fixing part when the main body is rotated 45° or 90°.

[0032] The masking tape peeling device according to the present invention has the following effect: during the peeling process of the masking tape, the peeling is performed while the upper surface of the material without the masking tape attached is supported under pressure to avoid the material being lifted, thus ensuring that only the masking tape is removed without damaging the material.

[0033] Furthermore, the masking tape peeling device according to the present invention has the following effect: by supporting the unit that stably fixes the semiconductor material and the unit that peels off the masking tape with different buffering forces, it is possible to solve the problem of semiconductor material damage or masking tape residue caused by peeling process error during masking tape removal.

[0034] Furthermore, the masking tape peeling device according to the present invention has the following advantages: it can measure the tension of the adhesive tape in real time and peel the tape off with a suitable tension that will not cause scratches or damage to the material.

[0035] Furthermore, the masking tape peeling device according to the present invention has the following effect: the tension of the adhesive tape can be measured before peeling the masking tape with the adhesive surface of the adhesive tape, and the lifting height of the guide roller used to guide the adhesive tape can be changed according to the tension measurement result, thereby adjusting the tension of the adhesive tape provided on the lower surface of the peeling section.

[0036] Furthermore, the masking tape peeling device according to the present invention has the following effect: before peeling the masking tape, the tension of the adhesive tape is measured, and when the measured tension value exceeds the preset tension range, an alarm is generated by control, thereby interrupting the peeling operation and inspecting the material and the peeling device, thereby preventing material damage in advance.

[0037] Furthermore, the masking tape peeling device according to the present invention has the effect that the peeling angle of the peeling head can be adjusted as needed, taking into account the type of material or the adhesive force of the adhesive tape. Attached Figure Description

[0038] Figure 1 A schematic plan view of the masking tape peeling device according to the present invention is shown.

[0039] Figure 2 It shows Figure 1 The diagram shows a perspective view of the peeling head and conveyor table in the masking tape peeling device.

[0040] Figure 3 Briefly shown Figure 2 The diagram shows the process of a peeling head removing masking tape from a semiconductor material.

[0041] Figure 4 Briefly shown Figure 2 The diagram shows the positional relationship between the stripping head, guide roller, and load unit.

[0042] Figure 5 It shows Figure 2 The image shows the peeling head rotated 0°.

[0043] Figure 6 It shows Figure 2The image shows the peeling head rotated 45°.

[0044] Figure 7 It shows Figure 2 The image shows the peeling head rotated 90°.

[0045] (Explanation of reference numerals in the attached diagram)

[0046] P: Semiconductor material; T: Adhesive tape

[0047] 1000: Masking tape peeling device; 1200: Peeling device

[0048] 1210: Main frame; 1220: Angle adjustment unit

[0049] 1230: Main body 1240: Peeling section

[0050] 1250: Material fixing section; 1270: Supply roller

[0051] 1280: Recovery roller; 1290: Guide roller

[0052] 1260: Load unit; 1261: Support pin

[0053] 1263: Measuring section; 1292: Guide roller lifting section

[0054] 1300: Mount the base 1400: Align with the view

[0055] 2200: Supply Pickup Device 2300: Return Pickup Device

[0056] 2400: Conveyor Station; 3000: Material Supply / Recycling Department Detailed Implementation

[0057] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments described herein are provided to ensure thorough and complete disclosure and to fully convey the inventive concept to those skilled in the art. Throughout this specification, the same reference numerals denote the same constituent elements.

[0058] Figure 1 The masking tape peeling device according to the present invention is shown in schematic.

[0059] like Figure 1As shown, the masking tape peeling device 1000 according to the present invention is a peeling device for peeling masking tape from material on which masking tape is attached in a certain area. The masking tape peeling device 1000 includes: a material supply unit that supplies a material assembly having a plurality of materials attached to it; a supply pickup 2200 that picks up and conveys the material assembly conveyed from the material supply unit; and a conveying table 2400 on which the material assembly conveyed by the supply pickup 2200 is placed. The material geometry can be moved along the X and Y axes; an alignment view 1400, positioned above the movement path of the conveyor 2400, checks the position of the masking tape to be peeled off; a peeling device 1200 is used to peel off the masking tape from the material conveyed to the conveyor 2400; a collection and retrieval unit 2300 picks up the material assembly with the peeled masking tape attached and can move it to one side; and a material recovery unit recovers the material assembly whose operation has ended with the collection and retrieval unit 2300.

[0060] like Figure 2 As shown, in this invention, the peeling device 1200 is characterized by comprising: a peeling head, including: a peeling section 1240 capable of lifting and lowering above the material to which the masking tape is attached; a material fixing section 1250 capable of lifting and lowering to one side of the peeling section 1240 and pressing and fixing the upper surface of the material not to which the masking tape is attached; a supply roller 1270 for supplying adhesive tape to the lower surface of the peeling section 1240; a recovery roller 1280 for recycling; and a mounting base 1300, comprising the peeling head and the supply roller 1270. 70. The recovery roller 1280 is mounted on the mounting base. The supply roller 1270 conveys the adhesive tape to below the peeling part 1240 so that the adhesive surface of the adhesive tape faces the masking tape of the material. The recovery roller 1280 recovers the adhesive tape with the peeled masking tape attached. The material fixing part 1250 and the peeling part 1240 descend simultaneously or sequentially to contact the material. The peeling part 1240 rises while the fixing part is in contact with the material to peel the masking tape from the material.

[0061] In this regard, refer to the present invention Figures 1 to 7 To explain in more detail.

[0062] First, the material supply unit supplies a material assembly containing multiple materials, which are coated with masking tape. A cassette containing multiple stacked material assemblies is located within the material supply unit; the cassette is designed to be height-adjustable. A clamp 3200 pulls out any one of the material assemblies stacked in the cassette cassette 3100 and conveys it to a position where the supply pickup 2200 can pick it up. At this time, the cassette cassette 3100 can be height-adjustable, and the clamp 3200 can move in the forward / backward direction, i.e., in the Y-axis direction.

[0063] The supply pickup 2200 picks up the material assembly supplied by the material supply unit and then conveys it to the conveyor 2400. At this time, the supply pickup 2200 is configured to move along the material conveyor 2000 in the X-axis direction, and the conveyor 2400 is configured to move along the X-axis conveyor line 2500 in the X-axis direction and along the Y-axis conveyor line 2600 in the Y-axis direction.

[0064] In this invention, to improve productivity, multiple conveyor tables 2400 and stripping heads are provided. The number of conveyor tables 2400 and the number of stripping heads can be correspondingly set, and the supply pickup 2200 and the conveyor tables 2400 can have overlapping work paths. Since multiple conveyor tables 2400 and stripping heads are correspondingly provided, if a material assembly is conveyed above the conveyor table 2400 via the supply pickup 2200, the conveyor table 2400 can move below the stripping heads to perform individual stripping operations.

[0065] In this invention, multiple peeling devices for peeling off the masking tape are provided, but since they differ only in their installation positions and have the same structure, they are used in combination. Figure 2 The peeling device 1200 in the middle is used as an example for explanation.

[0066] The peeling device 1200 of the present invention is mounted on the mounting base 1300 and disposed on the frame 1100. The peeling device 1200 includes a peeling head, a supply roller 1270, a recovery roller 1280, a guide roller 1290, a support part, and a load unit 1260. The structures can be respectively mounted on the mounting base 1300. When the mounting base 1300 is raised or lowered, the peeling head, the supply roller 1270, the recovery roller 1280, the guide roller, the support part, and the load unit 1260 can be raised or lowered together.

[0067] First, the peeling head, as a necessary structure for peeling masking tape, has a peeling part 1240 and a material fixing part 1250.

[0068] The peeling section 1240 can move up and down above the material to which the masking tape is attached. Adhesive tape is supplied to the lower surface of the peeling section 1240. The peeling section 1240 descends to bring the adhesive surface of the adhesive tape into contact with the masking tape, causing the peeling section 1240 and the adhesive tape to rise, thereby peeling the masking tape off the material. The material fixing section 1250 is configured to move up and down to one side of the peeling section 1240 and to apply pressure to fix the upper surface of the material without the masking tape. During the process of peeling the masking tape off the material by the descent and ascent of the peeling section 1240, the material can be kept in a fixed state to prevent it from being dragged or lifted by the adhesive tape. The peeling section 1240 and the material fixing section 1250 are provided in the main body 1230, and the peeling head can be mounted on the mounting base 1300 through the main body 1230.

[0069] The supply roller 1270 delivers the adhesive tape below the peeling section 1240 so that the adhesive surface of the adhesive tape faces the masking tape of the material. The peeling section 1240 descends so that the adhesive surface of the adhesive tape contacts the masking tape and peels the masking tape off the material. The recovery roller 1280 recovers the adhesive tape with the peeled masking tape attached.

[0070] At this time, both the supply roller 1270 and the recovery roller 1280 are equipped with motors, which supply and recover the adhesive tape. Of course, it is also possible to install a motor only on the recovery roller 1280 side.

[0071] A guide roller can be provided between the supply roller 1270 and the recovery roller 1280, through which the adhesive tape is guided to below the peeling section 1240. The guide roller 1290 is mounted on a guide roller support frame 1291 and, via the guide roller support frame 1291, on a mounting base 1300. The guide roller support frame 1291 is mounted on a guide roller lifting section 1292, thereby enabling it to be raised and lowered from the mounting base 1300.

[0072] Support portions are respectively provided on both sides of the peeling section 1240, thereby supporting the adhesive tape guided by the guide roller 1290. The support portions can be connected to one end of the load unit 1260.

[0073] That is, one end of the load unit 1260 is connected to the support part, and the other end is installed on the guide roller support frame 1291, and can be raised and lowered together with the guide roller 1290, and can measure the tension of the adhesive tape supported by the support part.

[0074] For this purpose, the load unit 1260 includes a measuring section 1263 for measuring the tension of the adhesive tape and a rod extending from one end of the measuring section 1263. The support section includes a plurality of support pins 1261 disposed on the rod to support the adhesive tape, and the load unit 1260 can measure the tension of the adhesive tape supported by at least one of the plurality of support pins 1261.

[0075] Each of the multiple support pins 1261 can be located at the same height or at different heights from each other. For reference, when the support pins 1261 are located at different heights from each other, the adhesive tape can also be supported by more than one support pin 1261.

[0076] On the other hand, the load unit 1260 can measure the tension of the adhesive tape supplied to the lower end of the peeling section 1240 by measuring in real time the tension of the adhesive tape applied to the support pin 1261 when the adhesive tape supplied to the lower end of the peeling section 1240 is supported by at least one of the plurality of support pins 1261.

[0077] At this time, based on the tension of the adhesive tape measured by the load unit 1260, such as Figure 4 As shown, the tension of the adhesive tape supplied to the lower end of the peeling section 1240 can be adjusted by adjusting the lifting height of the guide roller support frame 1291.

[0078] For example, if the guide roller support frame 1291 is lowered, the guide roller 1290 and the load unit 1260 will lower together, thus... Figure 4 a. The peel angle of the adhesive tape decreases. If the guide roller support frame 1291 is raised, the guide roller 1290 and the load unit 1260 will rise together, thus... Figure 4 b. The peel angle of the adhesive tape becomes larger.

[0079] Therefore, by adjusting the height of the guide roller 1290 via the guide roller lifting part 1292, the tension of the adhesive tape T pressed by the lower end face of the peeling part 1240 as the peeling part 1240 descends can be adjusted. For reference, in addition to the height of the guide roller 1290, the tension of the adhesive tape can also be adjusted by changing the position of the support pins 1261 supporting the adhesive tape T among the plurality of support pins 1261 provided in the support part. The position of the support pins 1261 supporting the adhesive tape can be appropriately selected as needed.

[0080] The following is for reference. Figure 2 as well as Figure 3 The peeling method of the masking tape peeling device of the present invention will be described. Figure 2 It shows Figure 1 The figure shows a perspective view of the peeling head and conveyor table 2400 in the masking tape peeling device.

[0081] like Figure 2As shown, the peeling device 1200 includes: a peeling head having a peeling section 1240 capable of lifting and lowering above a material to which masking tape is attached, and a material fixing section 1250 capable of lifting and lowering on one side of the peeling section 1240 and pressurizing and fixing the upper surface of the material not to which the masking tape is attached; a supply roller 1270 for supplying adhesive tape to the lower surface of the peeling section 1240; a recovery roller 1280 for recovery; a guide roller 1290 disposed between the supply roller 1270 and the recovery roller 1280 and guiding the adhesive tape; a support section disposed on both sides of the peeling section 1240 and supporting the adhesive tape guided by the guide roller 1290; and a load unit 1260 connected at one end to the support section and measuring the tension of the adhesive tape.

[0082] In this invention, the peeling head, supply roller 1270, recovery roller 1280, and guide roller 1290 are mounted on the mounting base 1300, and the support and load unit 1260 are mounted on the mounting base 1300 via the guide roller support frame 1291. The mounting base 1300 is configured to be height-adjustable, and when the mounting base 1300 is raised or lowered, the peeling head, supply roller 1270, recovery roller 1280, guide roller 1290, support, and load unit 1260 can be raised or lowered together.

[0083] The supply roller 1270 delivers the adhesive tape below the peeling section 1240 so that the adhesive surface of the adhesive tape faces the masking tape of the material, and the recovery roller 1280 recovers the adhesive tape with the peeled masking tape attached.

[0084] The feature is that the material fixing part 1250 and the peeling part 1240 constituting the peeling head descend simultaneously or sequentially to contact the material, and the peeling part 1240 rises while the material fixing part 1250 is in contact with the material, so as to peel the masking tape from the material.

[0085] To explain in more detail, if the material to be peeled off the masking tape is located below the peeling head, with the material fixing part 1250 of the peeling head lowered and supporting the material, the peeling part 1240 of the peeling head lowers so that the adhesive surface of the adhesive tape conveyed below the peeling part 1240 comes into contact with the masking tape of the material. Then, the mounting base 1300 is raised, causing the peeling part 1240 and the adhesive tape to rise, thereby peeling the masking tape off the material.

[0086] When the mounting base 1300 and the peeling part 1240 are raised, the material fixing part 1250 remains in contact with the supporting material to prevent the material from being dragged up by the adhesive force of the adhesive tape. The material fixing part 1250 can be raised to release the material support state after the masking tape is completely peeled off.

[0087] Regarding the working relationship between the peeling part 1240 and the material fixing part 1250, Figure 3 For further details, please refer to this information.

[0088] Figure 3 Briefly shown Figure 2 The diagram illustrates the process of a peeling head removing masking tape from a semiconductor material. Figure 3 As shown in (a), in the peeling device 1200, the peeling head is mounted on the mounting base 1300 via the main body 1230, and the mounting base 1300 is configured to be able to move up and down in the Z-axis direction.

[0089] That is, the peeling head has a peeling part 1240 and a material fixing part 1250, and also has a main body part 1230 provided with the peeling part 1240 and the material fixing part 1250. At this time, the peeling head is mounted on the mounting base 1300 via the main body part 1230.

[0090] For reference, the peeling part 1240 and the material fixing part 1250 can also be raised and lowered independently from the mounting base 1300, but Figure 3 The example shown is that each cylinder is used to support the peeling part 1240 and the material fixing part 1250 with buffer force.

[0091] Furthermore, the stripping head is mounted on the mounting base 1300 via the main body 1230 and is configured to rise and fall together with the mounting base 1300. Therefore, when the mounting base 1300 is lowered by a motor or the like mounted on the mounting base 1300, the supply roller 1270, the recovery roller 1280, the guide roller 1290, the support portion, and the load unit 1260 mounted on the mounting base 1300 also fall together.

[0092] At this time, the material fixing part 1250 protrudes downward relative to the peeling part 1240, so that when the mounting base 1300 descends for the first time, the material fixing part 1250 can first contact the material and support it. While supporting the material, the mounting base 1300 descends a second time until the peeling part 1240 descends and the adhesive surface of the adhesive tape contacts the masking tape. Afterwards, when the mounting base 1300 is raised, causing the peeling part 1240 to rise and peel off the masking tape, the material fixing part 1250 can also be configured to rise and fall from the mounting base 1300 to maintain material contact and support.

[0093] In this invention, although the description is divided into a first descent and a second descent, the first descent is defined as the height at which the material fixing part 1250 first contacts the material during the descent of the mounting base 1300, and the second descent is defined as the height at which the adhesive surface of the adhesive tape contacts the masking tape when the mounting base 1300 is further lowered. Each descent action can be completed continuously.

[0094] That is, the mounting base 1300 is lowered continuously in one go until the adhesive surface of the adhesive tape contacts the masking tape. Since the material fixing part 1250 protrudes downward and contacts the material first, it is simply a first descent followed by a second descent where the adhesive surface of the adhesive tape contacts the masking tape. Of course, it is also possible that the mounting base 1300 stops after the first descent and then descents a second time.

[0095] On the other hand, an elastic member, a cylinder that supports the material fixing part 1250, or a motor that raises and lowers the material fixing part 1250 is provided above the material fixing part 1250, so that even if the peeling part 1240 and the mounting base 1300 are raised, the material fixing part 1250 can maintain the material support state.

[0096] For reference, although the lifting and lowering of the peeling part 1240 and the material fixing part 1250 are achieved by the mounting base 1300, in order to provide a buffering force to the peeling part 1240 and the material fixing part 1250 when the mounting base 1300 is lifted and lowered, an impact mitigation component may also be provided above either the peeling part 1240 or the material fixing part 1250. During the process of the material fixing part 1250 contacting the material and during the process of the peeling part 1240 descending and the adhesive surface of the adhesive tape contacting the masking tape, the impact mitigation component raises the peeling part 1240 or the material fixing part 1250 to a predetermined height to mitigate the impact applied to the material.

[0097] That is, the material fixing part 1250 lowers the mounting base 1300 to contact the material, and the peeling part 1240 lowers the mounting base 1300 until the adhesive surface contacts the masking tape, thus contacting the material. At this time, by lowering the mounting base 1300, the material fixing part 1250 and the peeling part 1240 can each have impact mitigation components to mitigate the impact applied to the material at the point of contact. Furthermore, if the mounting base 1300 is further lowered until the peeling part 1240 contacts the material while the material fixing part 1250 is in contact with the supporting material, the pressure applied to the material by the material fixing part 1250 further increases. Therefore, by raising the material fixing part 250 separately from the mounting base 1300, the pressure transmitted to the material can be reduced.

[0098] Therefore, in this invention, an elastic member, a cylinder, or a motor can be used as the impact mitigation component to alleviate the impact applied to the material. During the second descent until the peeling section 1240 descends and the adhesive surface of the adhesive tape contacts the masking tape, the material fixing section 1250, which contacts the supporting material during the first descent, also descends, further increasing the pressure on the material. This can make the impact on the material a burden. Therefore, in order to allow the adhesive tape and masking tape to contact and the mounting base to descend a second time so that the peeling section 1240 descends, an impact mitigation component is needed to alleviate the impact transmitted to the material through the material fixing section 1250 during the descent.

[0099] Taking the case where the cylinder of the support material fixing part 1250 is used as an impact mitigation component as an example, during the second descent of the mounting base 1300, the material fixing part 1250 can apply a buffering force to the material by causing the rod of the second cylinder to rise through the reaction force.

[0100] Although elastic components or motors can be used as shock-absorbing parts to perform the same function, in Figure 3 In one embodiment, a cylinder was used to mitigate the impact applied to the material.

[0101] In this invention, the impact mitigation component performs the function of raising the peeling portion 1240 or the material fixing portion 1250 to a predetermined height during the contact between the adhesive surface of the adhesive tape and the masking tape to mitigate the impact transmitted to the material. At the same time, it can also perform the function of raising the material fixing portion 125 to a predetermined height during the second descent of the peeling portion 1240 to impart a buffering force to the material.

[0102] refer to Figure 3 In order to provide a buffering force to the peeling part 1240 and the material fixing part 1250, a cylinder part is provided in the main body part 1230. The cylinder part includes a first cylinder part 1231 disposed above the peeling part 1240 for lifting and driving the peeling part 1240, and a second cylinder part 1232 disposed above the material fixing part 1250 for lifting and driving the material fixing part 1250.

[0103] The peeling portion 1240 is supported by the buffer force of the first cylinder portion 1231 of the main body portion 1230, and the material fixing portion 1250 is supported by the buffer force of the second cylinder portion 1232 of the main body portion 1230. Since the material fixing portion 1250 protrudes downwards compared to the peeling portion 1240, it contacts the material first. Therefore, the buffer force supporting the material fixing portion 1250 is greater than the buffer force supporting the peeling portion 1240.

[0104] In this invention, "large buffering force" means that the force that mitigates the impact generated by pressing the material is large, which means that when components with different buffering forces are pressed at the same time, the component with the larger buffering force will deform first.

[0105] Furthermore, the first cylinder portion 1231 can simultaneously support the peeling portion 1240 and the second cylinder portion 1232 supporting the material fixing portion 1250. The first cylinder portion 1231 and the second cylinder portion 1232 can be subjected to uniform pressure during the lifting and lowering of the main body portion 1230. At this time, the material fixing portion 1250 can protrude more than the peeling portion 1240.

[0106] This document details an embodiment in which the first cylinder portion 1231 simultaneously supports the peeling portion 1240 and the second cylinder portion 1232. The material fixing portion 1250, which protrudes further as the main body portion 1230 of the first cylinder portion 1231 descends, first contacts the material. The second cylinder portion 1232 then performs a buffering action due to the reaction force of the material being pressurized, thereby reducing the impact force applied to the material. During the buffering action of the second cylinder portion 1232, the main body portion 1230 continues to descend via the peeling portion 1240 until the lower surface of the adhesive tape contacts the upper surface of the masking tape. If both the peeling portion 1240 and the material fixing portion 1250 fully support the material and act with reaction force, a portion of the reaction force of the material in the first cylinder portion 1231 is reduced. The first and second cylinder sections reduce the impact applied to the material. The second cylinder section 1232 reacts to the small reaction force transmitted from the material fixing section 1250 and performs an action to reduce the impact force applied to the material. The first cylinder section 1231 reacts to the larger reaction force transmitted from the second cylinder section 1232 and the peeling section 1240 of the material fixing section 1250 and performs an action to reduce the impact force applied to the material.

[0107] In this regard, refer to Figure 3 To explain, firstly, as Figure 3 As shown in Figure a, the peeling section 1240 and the material fixing section 1250 descend together via their respective cylinder sections.

[0108] After that, as Figure 3 As shown in Figure b, the mounting base 1300 descends for the first time. During this first descent, the peeling portion 1240 and the material fixing portion 1250, which are mounted on the mounting base 1300 via the main body 1230, also descend together. The height at which the mounting base 1300 descends in one descent can be set to the height at which the material fixing portion 1250 contacts the upper surface of the material. The lower end of the material fixing portion 1250 is positioned further down than the lower end of the peeling portion 1240, so that the material fixing portion 1250 contacts the upper surface of the supporting material during the first descent of the mounting base 1300.

[0109] The lower end face of the material fixing part 1250 contacts the portion of the semiconductor material P that is not covered with masking tape, i.e., a part of the material, and applies stable pressure to the semiconductor material P with a relatively large buffering force supporting the material fixing part 1250, thereby fixing the position.

[0110] After that, as Figure 3 As shown in Figure c, the mounting base 1300, while maintaining material contact support via the material fixing part 1250, descends a second time until the peeling part 1240 descends and the adhesive surface of the adhesive tape contacts the masking tape. That is, by continuing to descend the peeling part 1240 while the semiconductor material P is stably supported by the material fixing part 1250, the adhesive tape below the lower end face of the peeling part 1240 is pressed by the lower end face of the peeling part 1240 and comes into contact with the masking tape attached to the semiconductor material P.

[0111] The adhesive surface of the adhesive tape contacts the portion of the semiconductor material P to which the masking tape is attached, and contacts the masking tape with a relatively small buffering force that supports the peeling portion 1240.

[0112] Furthermore, preferably, the adhesive force of the adhesive tape is greater than that of the masking tape, thereby causing the masking tape to be peeled off from the material and adhered to the adhesive surface of the adhesive tape.

[0113] With the adhesive surface of the adhesive tape in contact with the masking tape, Figure 3 As shown in d, the mounting base 1300 is raised to peel the masking tape off the material. Along with the raising of the mounting base 1300, the peeling section 1240 also rises.

[0114] At this time, as the mounting base 1300 rises, the supply roller 1270 and the recovery roller 1280 mounted on the mounting base 1300, as well as the guide roller 1290 that guides the adhesive tape, also rise together. The peeling part 1240 and the material fixing part 1250 mounted on the mounting base 1300 also rise together. If the material fixing part 1250 rises, the contact support state of the material may be released. Therefore, the problem is that during the peeling of the masking tape, due to the adhesive force of the adhesive tape, the masking tape and the material cannot be separated, and the material is lifted together with the masking tape.

[0115] Therefore, the material fixing part 1250 keeps the material fixed so that the masking tape is safely peeled off from the material. Only the peeling part 1240 should rise. For this purpose, the material fixing part 1250 is pressurized and fixed by the second cylinder part 1232 during the rise of the peeling part 1240, so that the material can be maintained in a supported state even when the mounting base 1300 rises.

[0116] That is, during the ascent of the mounting base 1300 and the peeling section 1240, the material fixing section 1250 extends the rod of the second cylinder section 1232 to maintain contact with the material, thereby fixing the material until the masking tape is peeled off. Of course, after the peeling section 1240 and the mounting base 1300 rise to a preset predetermined height, the mounting base 1300 is further raised until the contact between the material fixing section 1250 and the material is released, thereby releasing the support state of the material fixing section 1250, or the rod of the second cylinder section 1232 is extended or retracted, and then the masking tape peeling operation is performed in the same manner.

[0117] In other words, the main body 1230 rises, and before the peeling part 1240 and the material fixing part 1250 come into contact with the semiconductor material P, the lower end of the peeling part 1240 is positioned higher than the lower end of the material fixing part 1250. The buffering force supporting the peeling part 1240 is smaller than the buffering force supporting the material fixing part 1250. As a result, while the material fixing part 1250 is still stably in contact with the semiconductor material P, the lower end face of the peeling part 1240 rises and separates from the semiconductor material P. As a result, the adhesive tape that is bonded to the masking tape attached to the semiconductor material P also rises, and the masking tape is peeled off and removed from the semiconductor material P.

[0118] Through such Figure 3 The masking tape peeling process shown involves peeling the masking tape from the semiconductor material P through the peeling part 1240 and the adhesive tape until the masking tape is completely peeled off. The semiconductor material P is stabilized and fixed by a relatively large buffering force supporting the material fixing part 1250, and the masking tape attached to the semiconductor material P is gently peeled off by a relatively small buffering force supporting the peeling part 1240. This completely eliminates the problem of damage to the semiconductor material P during masking tape removal or masking tape residue in the material due to peeling process errors.

[0119] on the other hand, Figure 4 Briefly shown Figure 2 The positional relationship between the stripping head, guide roller 1290, and load unit 1260 is shown in the figure.

[0120] Figure 4 As shown in (a), the adhesive tape T, which is a masking tape with the adhesive surface facing the material, is supplied from the supply roller 1270 and is supported and guided by one of the support pins 1261 of the guide roller 1290 and the load unit 1260, thereby being supplied below the lower end face of the peeling section 1240. At this time, the tension of the adhesive tape supported by the support pin 1261 is measured by the load unit 1260 provided on one side of the support pin 1261.

[0121] Therefore, depending on the height of the guide roller 1290, the height and position of the support pin 1261 supporting the adhesive tape, the tension of the adhesive tape supported by the support pin 1261 will vary. That is, the angle at which the adhesive tape T is supplied below the lower end face of the peeling section 1240 will vary, and the tension applied to the adhesive tape T may vary depending on the difference in the peeling angle of the adhesive tape.

[0122] When masking tape is peeled off by contact with adhesive tape, the tension applied to the adhesive tape is still transmitted to the material, thus impacting the material and potentially causing scratches or damage.

[0123] Therefore, the height of the guide roller 1290 can be adjusted by the guide roller lifting part 1292, or the position of the support pin 1261 supporting the adhesive tape T among the plurality of support pins 1261 provided on the rod of the load unit 1260 can be changed. Figure 4 As shown in b, when the peeling part 1240 descends, the tension of the adhesive tape T pressed by the lower end face of the peeling part 1240 can be adjusted.

[0124] For example, Figure 4 The angle of the adhesive tape transmitted to the lower end of the peeling section 1240 shown in b is greater than... Figure 4 The angle of the adhesive tape transmitted to the lower end of the peeling section 1240 shown in figure a, with respect to the tension of the applied adhesive tape at this time. Figure 4 The tension of the adhesive tape applied in b is greater than Figure 4 The tension of the adhesive tape applied in a.

[0125] Since the greater the tension of the adhesive tape, the greater the force applied to the material, the tension of the adhesive tape is not always better. It is especially important to remove the masking tape attached to the material with appropriate tension so as not to impact the material.

[0126] When the tension of the adhesive tape T pressed by the lower end face of the peeling portion 1240 is too high as the peeling portion 1240 descends, the buffering force of the adhesive tape T itself decreases, and the semiconductor material P may be damaged by the force and impact transmitted from the peeling portion 1240. Conversely, when the tension does not meet the reference, the buffering force of the adhesive tape T itself is too high and absorbs a considerable portion of the force transmitted from the peeling portion 1240. Therefore, the contact between the adhesive tape T and the masking tape is insufficient, and as a result, at least a portion of the masking tape may not be peeled off and may remain on the semiconductor material P.

[0127] Therefore, before performing the peeling operation using the peeling head, the lifting height of the guide roller 1290 can be adjusted and assembled to enter the preset tension range required for peeling the masking tape. Furthermore, since the tension of the adhesive tape supported on the support pin 1261 can be monitored in real time using the load unit 1260, the tension of the adhesive tape can be measured during peeling, and an alarm can be generated by the control unit when the measured tension value exceeds the preset tension range.

[0128] That is, when the tension exceeds the preset range, it may cause impact and damage to the material. Therefore, the peeling operation is not performed excessively. An alarm is generated by the control unit, so that measures can be taken to check the cause of the peeling state where the tension value exceeds the limit, or to adjust the lifting height of the guide roller.

[0129] In an assembly of materials to be peeled off, each material is attached with a masking tape to be peeled off. Even when performing the same peeling operation, due to special circumstances, there may be cases where the masking tape adheres to the material more strongly or less weakly. Therefore, when peeling off the corresponding masking tape, the tension of the adhesive tape may not fall within a preset tension range, thus allowing equipment to inspect the material or peeling condition.

[0130] That is, the present invention can also adjust the tension of the adhesive tape by measuring the tension of the adhesive tape in real time through the load unit 1260, but when removing the corresponding masking tape, it can peel off the masking tape while protecting the material with the optimal tension that does not cause damage to the material, and can also find special peeling cases during the peeling operation.

[0131] Furthermore, the load unit 1260 is configured as a cantilever, meaning one end is fixed to the measuring unit 1263 and the other end extends outwards. The extended end includes a rod 1262 with one or more support pins 1261, thereby reducing the impact applied to the load unit 1260 itself. The rod 1262 senses the tension applied to the adhesive tape T and transmits it to the measuring unit 1263 via the support pins 1261 at its end, which support the adhesive tape T, thus enabling real-time measurement of the tension applied to the adhesive tape T.

[0132] Furthermore, the support pin 1261, when configured adjacent to the semiconductor material during the processing of a semiconductor material, can also function as a barrier to prevent other semiconductor materials not being processed and adhesive tape from unnecessarily adhering.

[0133] Based on the tension of the adhesive tape T measured in real time, the height of the guide roller 1290 is adjusted by the guide roller lifting part 1292, or the position of the support pin 1261 supporting the adhesive tape is selected, so that the tension of the adhesive tape T that can completely peel off the masking tape attached to the semiconductor material P can be achieved without damaging the semiconductor material P.

[0134] In this invention, the stripping head can be configured to rotate in the θ direction.

[0135] That is, the main body 1230 provided on the peeling head can rotate in the θ direction. By rotating the main body 1230, the peeling part 1240 and the material fixing part 1250 provided on the main body 1230 can also rotate together in the θ direction.

[0136] Furthermore, according to the rotation angle of the peeling head in the θ direction, the conveyor table 2400 also rotates in the θ direction, so that the material to be peeled conveyed to the top of the conveyor table 2400 corresponds to the direction of the fixing part 1250 and the peeling part 1240.

[0137] The θ-direction rotation of the peeling head can also be configured to be able to rotate by installing a rotary motor on the peeling head, or the main body 1230 can be rotated to the required angle by installing a separate angle adjustment unit 1220, and then the rotation angle can be fixed by fastening.

[0138] As an example of the θ-direction rotation of the stripping head, regarding the case where the main body 1230 rotates due to the installation of the angle adjustment unit 1220, please refer to... Figure 2 and Figures 5 to 7 More detailed explanation.

[0139] Figure 2 It shows Figure 1 The figure shows a perspective view of the peeling head and conveyor table 2400 in the masking tape peeling device. Figure 5 yes Figure 2 The image shows the peeling head rotated to 0°. Figure 6 yes Figure 2 The image shows the peeling head rotated 45°. Figure 7 Show Figure 2 The image shows the peeling head rotated 90°.

[0140] like Figure 2 As shown, the peeling head of the present invention may include: a main frame 1210, which is fixed to the mounting base 1300, and the main body part 1230 is mounted on the main frame; an angle adjustment part 1220, which adjusts the rotation angle of the main body part 1230 mounted on the main frame 1210, and fixes the main frame 1210 and the main body part 1230.

[0141] At this time, the angle adjustment unit 1220 is configured to rotate the main body 1230 by 0°, 45° or 90°.

[0142] That is, the angle adjustment part 1220 is fastened to the main body 1230 while the main body 1230 is rotated by 0°, 45° or 90° as needed, so that the main body 1230 rotates from the mounting base 1300 by 0°, 45° or 90°, and the peeling part 1240 and the material fixing part 1250 provided on the main body 1230 also rotate by 0°, 45° or 90°.

[0143] When the main body 1230 rotates 0°, as Figure 5 As shown, the peeling portion 1240 and the material fixing portion 1250 are arranged perpendicular to the adhesive tape T, so that the adhesive tape T and the material fixing portion 1250 can pass only below the peeling portion 1240 without interference.

[0144] When the main body 1230 rotates 45°, the angle adjustment part 1220, while the main body 1230 is rotated 45°, securely fastens the main body frame 1210 and the main body 1230, as follows: Figure 6 As shown, the main body 1230, the peeling part 1240 and the material fixing part 1250 of the main body 1230 are also rotated 45° and fixed together.

[0145] In this case, the transport stage 2400 that holds the semiconductor material P also rotates 45° in the same direction and angle.

[0146] Among them, such as Figure 6 As shown, when the peeling part 1240 and the material fixing part 1250 rotate 45°, a portion of the adhesive tape T passing through the lower end of the peeling part 1240 interferes with the material fixing part 1250. To prevent this, when the main body 1230 rotates, the peeling part 1240 and the material fixing part 1250 should also be replaced with heads that match the corresponding angle.

[0147] That is, a peeling head is replaceably mounted at the lower end of the peeling section 1240, and a head of the material fixing section 1250 is replaceably mounted at the lower end of the material fixing section 1250. These can also be replaced individually, but for ease of replacement, the peeling head 1240 and the material fixing head 1250 are mounted together on the tool 1245, and can be easily replaced at the lower ends of the main body 1230 and the material fixing section 1250 by removing and installing the tool 1245. At this time, the cylinder, elastic part, and motor mounted above the peeling section 1240 and the material fixing section 1250 rotate together with the rotation of the main body, thus not affecting the replacement of the peeling head 1240 and the material fixing head 1250. Furthermore, the peeling section 1240 and the material fixing section 1250 are mounted together on the tool 1245, and can be replaced at the lower ends of the material peeling section 1240 and the material fixing section 1250 by changing the tool 1245.

[0148] Furthermore, when the main body 1230 rotates, a portion of the adhesive tape interferes with the material fixing part 1250. Therefore, in order to prevent interference between the adhesive tape and the material fixing part 1250 in the material fixing part 1250, a retraction groove 1251 or a through part 1252 for retracting the adhesive tape can be provided.

[0149] That is, by means of the recess 1251 or the through portion 1252, interference between the adhesive tape and the material fixing portion 1250 can be prevented. The adhesive surface of the adhesive tape conveyed to the lower end of the peeling portion 1240 faces downward, so the adhesive tape can be supported by the support pin 1261 to prevent material adjacent to the material to be peeled off from adhering to the adhesive surface. By designing the support portion for supporting the adhesive tape as a support pin 1261 type, the contact area between the adhesive tape and the support pin 1261 can be reduced, thereby preventing the adhesive tape from adhering to the support portion while fully providing support for the adhesive tape.

[0150] Therefore, by supporting the adhesive tape T conveyed below the peeling section 1240 on the support pin 1261 located above the peeling section 1240 and lifting the adhesive tape, it is possible to prevent the adhesive tape from sagging while preventing interference between the adhesive tape T and the material adjacent to the material peeling off the masking tape or the masking tape attached to the material.

[0151] In particular, when the peeling part 1240 and the material fixing part 1250 rotate 45°, the peeling part 1240 descends and then rises. When the adhesive tape T peels off the masking tape of the semiconductor material P, the adhesive tape adheres to the adhesive surface of the adhesive tape and peels off the masking tape in the diagonal direction of the masking tape. This allows peeling to start from the outer corner of the masking tape, thereby improving the peeling efficiency of the masking tape.

[0152] In addition, such as Figure 7 As shown, when the peeling part 1240 and the material fixing part 1250 rotate 90°, the adhesive tape T passes under both the peeling part 1240 and the material fixing part 1250. Therefore, it should be replaced with a 90° material fixing part 1250 head with a retraction groove 1251 or a through part 1252 for retracting the adhesive tape from the material fixing part 1250. When the peeling part 1240 and the material fixing part 1250 are installed together on the tool 1245, the tool 1245 can be disassembled and replaced at the lower end of the main body 1230 and the material fixing part 1250, so that the adhesive tape T passes through the retraction groove 1251 or the through part 1252 instead of passing under the material fixing part 1250.

[0153] Similarly, when the main body 1230 rotates 90°, the lower ends of the peeling part 1240 and the material fixing part 1250 can be easily replaced using the disassembly tool 1245. At this time, the cylinder, elastic part, and motor installed above the peeling part 1240 and the material fixing part 1250 also rotate with the rotation of the main body, so they do not affect the replacement of the peeling part 1240 head and the material fixing part 1250 head at all, and can be easily replaced at the lower ends of the material peeling part 1240 and the material fixing part 1250 using the corresponding angle tool.

[0154] Therefore, when the adhesive tape T adheres to and peels off the masking tape of the semiconductor material P by the lowering and then rising of the peeling section 1240, the adhesion and peeling are performed in the vertical direction of the masking tape, making the peeling of the masking tape easier.

[0155] That is, by means of the angle adjustment part 1220 installed on the main frame 1210, the peeling head does not rotate or rotates 45° or 90°. Thus, by changing the tool that sets the peeling part 1240 and the material fixing part 1250, interference between the adhesive tape T and the lower end of the material fixing part 1250 can be prevented. At the same time, the most suitable method can be selected according to the area and position of the masking tape attached to the semiconductor material, so as to peel off and remove the masking tape most effectively.

[0156] In this invention, the angle adjustment unit is described as rotating 0°, 45°, or 90°, but in addition to the above-mentioned rotation angles, it can also be adjusted appropriately as needed. Furthermore, in order to precisely control the rotation angle of the main body 1230, the angle adjustment unit may also be provided with a micrometer.

[0157] On the other hand, in order to perform the aforementioned peeling operation, multiple peeling heads and conveyor tables 2400 can be provided. Each peeling head can perform a masking tape peeling operation on the material assembly placed above the conveyor table 2400.

[0158] In this invention, with the peeling head fixed at the top, the conveyor table 2400 moves in the X and Y axis directions while the masking tape to be peeled is located at the lower end of the peeling section 1240 of the peeling head. The same operation is repeated, thereby enabling the masking tape to be peeled off for all materials provided in the material assembly.

[0159] The following is a brief explanation of the peeling method of the masking tape peeling device 1000.

[0160] First, in the material supply unit 3000, the supply pickup 2200 picks up any one of the material assemblies containing multiple materials stacked in the cassette cartridge 3100, and conveys the material assembly above any one of the multiple conveyor tables 2400. At this time, masking tape is attached to a portion of each of the multiple materials in the material assembly. The material assembly can be in a state where individual materials are attached by a ring frame, or in a state where individual materials are loaded onto their respective sheets; it can be any state as long as multiple materials are present.

[0161] If the material assembly is transferred to the conveyor 2400, the conveyor 2400 moves toward the peeling device 1200. Before the peeling operation is performed by the peeling head, the material assembly placed above the conveyor 2400 is fully inspected by the alignment view 1400.

[0162] The alignment view 1400 checks and memorizes the position of the masking tape to be peeled off in each material of the material assembly. Simultaneously, it moves along the X and Y axes according to the position of the masking tape, ensuring the masking tape is positioned below the peeling section 1240 of the peeling head. Since the conveyor table 2400 is configured to rotate in the θ direction, any misalignment in the material assembly placed above the conveyor table 2400 can be corrected during the alignment view 1400 inspection.

[0163] After checking the completed position by aligning the viewfinder 1400, the masking tape to be peeled is positioned below the peeling section 1240, and the mounting base 1300 is lowered for the first time, so that the material fixing section 1250 contacts the upper surface of the material without masking tape. With the material fixing section 1250 supporting the upper surface of the material, the mounting base 1300 is lowered for the second time, so that the peeling section 1240 contacts the masking tape.

[0164] During the second descent of the mounting base 1300, to prevent material damage due to increased pressure from the material fixing part 1250, the material fixing part 1250 is raised to a predetermined height during the descent of the peeling part 1240, thereby mitigating the impact applied to the material. Of course, even when the material fixing part 1250 is raised to the predetermined height, the material should remain supported by the material fixing part 1250. At this time, to mitigate the impact, an elastic member, a cylinder supporting the material fixing part 1250, or a motor for raising and lowering the material fixing part 1250 can be provided above the material fixing part 1250 as an impact mitigation component.

[0165] On the other hand, the case where the material fixing part 1250 contacts the material and then the peeling part 1240 contacts the masking tape is illustrated as an example, through the first and second descent of the mounting base 1300. However, it is also possible for the material fixing part 1250 and the peeling part 1240 to contact each other simultaneously only through the first descent of the material fixing part 1250. That is, it is also possible for the mounting base 1300 to descent, the material fixing part 1250 to contact the material, and the adhesive surface of the adhesive tape and the masking tape to contact simultaneously through the peeling part 1240.

[0166] At this time, in order to peel off the masking tape, if only the peeling part 1240 and the adhesive tape are raised while the material fixing part 1250 and the peeling part 1240 are in contact with the material, the adhesive surface of the adhesive tape can be peeled off from the material with the masking tape attached.

[0167] To this end, the mounting base 1300 is raised, causing the peeling section 1240 to rise. If the material fixing section 1250 also rises along with the peeling section 1240 during the raising of the mounting base 1300, the material contact through the material fixing section 1250 is released, and the material is dragged along with the adhesive surface of the adhesive tape while still attached to it. Therefore, the material fixing section 1250 can maintain the material contact using an elastic component, a cylinder, or a motor, and when the peeling section 1240 rises, only the peeled masking tape adheres to the adhesive surface of the adhesive tape, thereby enabling the masking tape to be peeled off and removed from the material.

[0168] During the process of peeling off the adhesive tape from the adhesive side to the masking tape, the load unit 1260 can monitor the tension of the adhesive tape in real time and confirm whether the measured tension of the adhesive tape is within the preset tension range. When the measured tension of the adhesive tape is within the preset tension range, the mounting base 1300 is raised to perform the peeling operation of the masking tape. When the tension exceeds the preset tension range, an alarm can be generated in the control unit and the peeling operation can be interrupted.

[0169] If the masking tape adheres to the adhesive surface of the adhesive tape, the adhesive tape used by the supply roller 1270 and the recovery roller 1280 is wound around the recovery roller 1280, and the adhesive surface of the new adhesive tape is located below the peeling section 1240.

[0170] In addition, the conveyor 2400 also moves to a predetermined direction in order to peel off the masking tape for the next material.

[0171] After the stripping head has completely removed the masking tape from each material in the material assembly, the conveyor 2400 moves to the conveying position of the return collector 2300.

[0172] For reference, the supply pickup 2200 and the recycling pickup 2300 can be set separately, or they can be set as one unit, or a single pickup can be used to handle both supply and recycling.

[0173] like Figure 1 As shown, when the supply pickup 2200 and the return pickup 2300 are integrated, the supply pickup 2200 is in standby mode to pick up the material assembly to be reworked and moves above the conveyor 2400 where the work is finished. The return pickup 2300, located above the conveyor 2400, picks up the material assembly from the conveyor 2400, and the supply pickup 2200 conveys the material assembly to be reworked to the top of the conveyor 2400. If the material assembly to be reworked is conveyed to the conveyor 2400, the conveyor 2400 moves below the alignment view 1400 and performs a position check, and then moves below the peeling device 1200 to perform the masking tape peeling operation.

[0174] On the other hand, the reclaimer 2300 transports the completed material assembly to the material recycling unit. Figure 1 In the embodiment shown, the material supply unit and the material recycling unit are shown as a material supply / recycling unit 3000 arranged together, but the material supply unit and the material recycling unit may also be arranged separately in separate spaces.

[0175] exist Figure 1 In the embodiment shown, four stripping devices and four conveyor tables 2400 are provided to improve the productivity of the stripping operation, but this can be adjusted according to the operator. Furthermore, during the stripping operations performed in the four stripping sections 1240, the supply pick-up device 2200 is in standby mode except for picking up the material assembly to be reworked. Therefore, providing both a supply pick-up device 2200 and a return pick-up device 2300 will not delay the overall stripping process.

[0176] In addition, the conveyor 2400, the supply pick-up device 2200, and the return pick-up device 2300 have overlapping work paths, in which the supply pick-up device 2200 receives the material assembly to be retransmitted and the finished material assembly is transferred to the return pick-up device 2300.

[0177] According to the present invention, when the masking tape is peeled off, the masking tape is peeled off while the material is supported, thereby preventing the material from being lifted up together, and ensuring that only the masking tape is peeled off and removed without damaging the material.

[0178] Furthermore, by monitoring the tension of the adhesive tape in real time, the tape is peeled off at the optimal tension value that does not cause impact or scratches to the material. Therefore, during the peeling of the masking tape on each material in the material assembly, the tension of the adhesive tape is also measured in special cases, such as when the masking tape is difficult to fall off the material. An alarm is generated when the tension exceeds the preset range, thereby enabling the peeling status to be checked and having the effect of preventing material damage in advance.

[0179] Furthermore, depending on the type of material or adhesive tape, the peeling head can be configured to rotate, thereby allowing for different peeling directions by adjusting the rotation angle of the peeling head as needed.

[0180] This specification describes the invention with reference to preferred embodiments. However, those skilled in the art can make various modifications and alterations to the invention without departing from the scope and concept of the invention as set forth in the claims below. Therefore, any modifications that substantially include the constituent elements of the claims should be considered to fall within the technical scope of the invention.

Claims

1. A masking tape peeling device for peeling masking tape from a material in which it is attached in a certain area, characterized in that, include: The materials supply department supplies a material assembly containing multiple materials, the materials having the masking tape attached to them. A supply picker that picks up and delivers the assembly of materials supplied from the material supply unit; A peeling head having a peeling section that moves up and down above the material to which the masking tape is attached, and a material fixing section that moves up and down on one side of the peeling section and presses to fix the upper surface of the material not to which the masking tape is attached. A supply roller and a recovery roller, wherein the supply roller supplies adhesive tape to the lower surface of the peeling section, and the recovery roller recovers the adhesive tape; as well as, Mounting base, the stripping head, the supply roller, and the recovery roller are mounted on the mounting base; and, A conveyor table is placed on top of the material assembly conveyed by the supply pick-up device, and the material is conveyed in the X and Y axis directions to be positioned below the stripping head. The peeling head also includes a main body, which is provided with the peeling part and the material fixing part. The peeling head is mounted on the mounting base via the main body. The supply roller conveys the adhesive tape below the peeling section so that the adhesive surface of the adhesive tape faces the masking tape of the material, and the recovery roller recovers the adhesive tape with the peeled masking tape attached. The material fixing part and the peeling part descend simultaneously or sequentially to contact the material, and the peeling part rises while the material fixing part is in contact with the material to peel the masking tape off the material.

2. The masking tape peeling device according to claim 1, characterized in that, The masking tape peeling device further includes: A guide roller, mounted on the mounting base and positioned between the supply roller and the recovery roller, guides the adhesive tape. A support portion, mounted on the mounting base and respectively disposed on both sides of the peeling portion, supports the adhesive tape guided by the guide roller; and A load unit, one end of which is connected to the support portion, measures the tension of the adhesive tape.

3. The masking tape peeling device according to claim 2, characterized in that, The mounting base is a height-adjustable structure. When the mounting base is raised or lowered, the stripping head, the supply roller, the recovery roller, the guide roller, the support unit, and the load unit rise or fall together. The material fixing part protrudes downward compared to the peeling part. An elastic component, a cylinder for supporting the material fixing part, or a motor for raising and lowering the material fixing part is provided above the material fixing part. The mounting base descends for the first time to make the material fixing part contact and support the material. While maintaining the material contact and support, it descends a second time until the peeling part descends and the adhesive surface of the adhesive tape contacts the masking tape. Then it rises to peel the masking tape off the material.

4. The masking tape peeling device according to claim 1, characterized in that, The peeling section and the material fixing section are raised and lowered independently from the mounting base.

5. The masking tape peeling device according to any one of claims 1, 3 to 4, characterized in that, Above at least one of the material fixing portion or the peeling portion, an impact mitigation component is further included. During the process of the material fixing portion contacting the material and during the process of the peeling portion descending to bring the adhesive surface of the adhesive tape into contact with the masking tape, the impact mitigation component raises the material fixing portion or the peeling portion to a predetermined height to mitigate the impact applied to the material. The impact mitigation component is an elastic component, a cylinder, or a motor.

6. The masking tape peeling device according to claim 2, characterized in that, The masking tape peeling device also includes a guide roller support frame, on which the guide roller is mounted and can be raised and lowered. The guide roller is mounted on the mounting base via the guide roller support frame. The load unit is configured to be mounted on the guide roller support frame at the other end and can rise and fall together with the guide roller. The load unit measures the tension of the adhesive tape before peeling it off with the adhesive side of the adhesive tape. The guide roller support frame is raised and lowered according to the tension measurement results, thereby changing the lifting height of the guide roller to adjust the tension of the adhesive tape supplied to the lower surface of the peeling section.

7. The masking tape peeling device according to claim 2, characterized in that, The masking tape peeling device further includes: A guide roller support frame, on which the guide roller is mounted, and which is liftable; and The control unit generates an alarm based on the tension value measured by the load unit. The guide roller is mounted on the mounting base via the guide roller support frame. The load unit is configured to be mounted on the guide roller support frame at the other end and can rise and fall together with the guide roller. The load unit measures the tension of the adhesive tape during the process of contacting and peeling the masking tape with the adhesive surface of the adhesive tape. The control unit generates an alarm when the measured tension value of the adhesive tape exceeds the preset tension range.

8. The masking tape peeling device according to claim 2, characterized in that, The load unit includes a measuring part for measuring the tension of the adhesive tape and a rod extending from one end of the measuring part. The support portion includes a plurality of support pins that support the adhesive tape by providing the rod. The load unit measures the tension of the adhesive tape supported by at least one of the plurality of support pins.

9. The masking tape peeling device according to claim 1, characterized in that, The masking tape peeling device further includes: Align the view with the viewfinder positioned above the movement path of the conveyor and check the position of the masking tape to be peeled off. The retrieving device picks up the assembly of material with the peeling material attached to the peeling masking tape peeled off by the peeling head and moves it in one direction; and The material recycling department recycles the assemblies of materials that have completed their operation via the recycling collector. The supply pickup and the return pickup can be integrated as a single unit or configured separately. Based on the inspection results of the alignment view, the conveyor table is moved in the X-axis or Y-axis direction so that each masking tape attached to the material is located below the peeling part of the peeling head.

10. The masking tape peeling device according to claim 1, characterized in that, Multiple conveyor tables and stripping heads are provided. The supply pickup and the conveyor have overlapping operating paths.

11. The masking tape peeling device according to claim 1, characterized in that, The stripping head and the conveyor rotate in the XY plane.

12. The masking tape peeling device according to claim 11, characterized in that, The stripping head also features: The main frame, which is fixed to the mounting base and on which the main body is mounted; and An angle adjustment unit is included to adjust the rotation angle of the main body portion mounted on the main frame, and to securely fasten the main frame and the main body portion. The angle adjustment unit rotates the main body by 0°, 45°, and 90°. The angle adjustment unit rotates the conveyor table so that it corresponds to the rotation angle of the main body portion rotated by the angle adjustment unit.

13. The masking tape peeling device according to claim 12, characterized in that, A replaceable peeling head is provided at the lower end of the peeling section, and a replaceable material fixing head is provided at the lower end of the material fixing section. The material fixing part is provided with a retraction groove or through part for the adhesive tape to retract, so as to prevent the adhesive tape from interfering with the material fixing part when the main body is rotated 45° or 90°.

14. The masking tape peeling device according to claim 12, characterized in that, A peeling head is provided at the lower end of the peeling section, and a replaceable material fixing head is provided at the lower end of the material fixing section. The peeling head and the material fixing head are mounted together on the tool and can be detached from the lower end of the main body and the material fixing part. The material fixing part is provided with a retraction groove or through part for the adhesive tape to retract, so as to prevent the adhesive tape from interfering with the material fixing part when the main body is rotated 45° or 90°.

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