Heat dissipating device and electronic component

Abstract

The embodiment of the present application provides a heat dissipation device and an electronic element, the heat dissipation device comprises a first closed panel, a second closed panel and a plurality of intermediate panels; the first closed panel, the plurality of intermediate panels and the second closed panel are sequentially stacked and welded and fixed, fluid inlets, fluid outlets and microchannels are arranged between the plurality of intermediate panels; the fluid inlets and the fluid outlets are located at edges of the intermediate panels, and the microchannels are communicated between the fluid inlets and the fluid outlets; along an extension surface of the intermediate panel, an area ratio of a normal projection area of the microchannel on the intermediate panel to the corresponding intermediate panel is not less than 1 / 2. The present application has the characteristics of large heat transfer area density, good environmental adaptability and good heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of electronic component technology, and in particular to a heat dissipation device and electronic component. Background Technology

[0002] Chips on a circuit board generate a significant amount of heat during prolonged operation, causing their temperature to rise and consequently degrading their performance and reducing their lifespan. A water-cooled plate is a heat dissipation device that uses the flow of cooling liquid to remove the heat generated by the chip during operation.

[0003] In related technologies, a water-cooled plate includes a base plate, metal pipes, and a cover plate. Channels are provided on both the base plate and the cover plate. The metal pipes are sandwiched between the base plate and the cover plate and installed within the channels. During use, cooling liquid is poured into the metal pipes. The cooling liquid flows within the metal pipes and carries away the heat generated by the chip during operation.

[0004] However, the water-cooled plate in the above technical solution has poor heat dissipation performance. Summary of the Invention

[0005] In view of the above problems, this application provides a heat dissipation device and electronic component, which has the characteristics of large heat transfer area density, good environmental adaptability and heat dissipation effect.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] A first aspect of this application provides a heat dissipation device, including a first closed panel, a second closed panel, and a plurality of intermediate panels;

[0008] The first closed panel, the plurality of intermediate panels and the second closed panel are stacked and welded together in sequence, and a fluid inlet, a fluid outlet and a microchannel are provided between the plurality of intermediate panels;

[0009] Both the fluid inlet and the fluid outlet are located at the edge of the intermediate panel, and the microchannel connects the fluid inlet and the fluid outlet.

[0010] Along the extension surface of the middle panel, the orthographic projection area of ​​the microchannel on the middle panel is not less than 1 / 2 of the area of ​​the corresponding middle panel.

[0011] In one feasible implementation, multiple microchannels are provided, all of which are arranged in parallel and each microchannel is connected between the fluid inlet and the fluid outlet.

[0012] In one feasible implementation, a microchannel is provided on one of the two adjacent intermediate panels, and the other of the two adjacent intermediate panels is connected to the intermediate panel with the microchannel and the opening of the microchannel is blocked to form the microchannel.

[0013] Alternatively, microchannels are provided on the adjacent surfaces of two adjacent intermediate panels, and the microchannels on the two adjacent intermediate panels are joined together to form the microchannel.

[0014] In one feasible implementation, micropores are provided on two adjacent intermediate panels, the two adjacent intermediate panels are connected, and the micropores on the two adjacent intermediate panels are interconnected to form the microchannel.

[0015] In one feasible implementation, the system further includes a first partition and a second partition. At least one first partition is connected between the walls of the micropores of one of two adjacent intermediate panels having the micropores, and at least one second partition is connected between the walls of the micropores of the other of two adjacent intermediate panels having the micropores. The orthographic projections of the first partition and the second partition on the same intermediate panel do not overlap.

[0016] In one feasible implementation, multiple microchannels are provided, which are arranged in a mesh and interconnected. At least one microchannel is connected to the fluid inlet, and at least one microchannel is connected to the fluid outlet.

[0017] In one possible implementation, the plurality of intermediate panels includes a plurality of first intermediate panels and a plurality of second intermediate panels, wherein the first intermediate panels and the second intermediate panels are alternately arranged;

[0018] The first intermediate panel is provided with a plurality of first micro-holes spaced apart along a first direction, and each of the first micro-holes extends along a second direction.

[0019] The second middle panel is provided with a plurality of second microholes spaced apart along the second direction, and each second microhole extends along the first direction;

[0020] The first direction and the second direction intersect;

[0021] The first micropore located on the first intermediate panel and the second micropore located on the second intermediate panel are interconnected to form the microchannel.

[0022] In one feasible implementation, along the second direction, the same end of each of the first micropores is interconnected;

[0023] And / or, along the first direction, the same end of each of the second micropores is interconnected.

[0024] In one feasible implementation, a third partition is further included, which is parallel to the first direction and is connected between the two hole walls of the first micropore that are disposed opposite to each other.

[0025] And / or,

[0026] It also includes a fourth partition, which is parallel to the second direction and is connected between the two hole walls of the second micropore that are disposed opposite to each other.

[0027] In one possible implementation, the extension direction of the microchannel includes a straight line and / or a curve.

[0028] In one feasible implementation, along the direction from the fluid inlet to the fluid outlet,

[0029] The cross-sectional areas at different locations of the microchannel are all different, or the cross-sectional areas at at least some different locations of the microchannel are equal.

[0030] In one feasible implementation, the fluid inlet, the fluid outlet, and the microchannel form a microchannel group.

[0031] The heat dissipation device is provided with multiple microchannel groups, which are distributed at intervals along the thickness direction of the middle panel, and adjacent microchannel groups are not connected to each other.

[0032] In one feasible implementation, the first closed panel, the plurality of intermediate panels, and the second closed panel are made of metal or composite metal materials.

[0033] And / or, the thickness of the first closed panel, the plurality of intermediate panels and the second closed panel ranges from 0.01mm to 4mm;

[0034] And / or, the first closed panel, the second closed panel, and the plurality of intermediate panels are formed by etching.

[0035] And / or, the first closed panel, the plurality of intermediate panels and the second closed panel are connected by gas-shielded brazing and / or vacuum brazing and / or diffusion welding.

[0036] A second aspect of this application provides an electronic component, including a heating element and the aforementioned heat dissipation device, wherein the heating element has a heating surface, and a first enclosed panel of the heat dissipation device is disposed on the side of the heating element near the heating surface.

[0037] This application provides a heat dissipation device and electronic component, applicable not only to heat dissipation of heat-generating components in electronic components but also to other applications requiring heat exchange. The heat dissipation device, by employing multiple layers of panels, allows heat to flow layer by layer between the panels, resulting in lower flow resistance and rapid heat diffusion from one end of the panel to the other, leading to higher heat dissipation efficiency and better heat dissipation effect. By incorporating a fluid inlet, fluid outlet, and microchannels, the area occupied by metal pipes on the panels is avoided. Furthermore, the microchannels, with their micrometer-scale structural dimensions, increase the heat exchange area of ​​the fluid, prolonging the fluid's residence time within the heat dissipation device, allowing the fluid to carry away more heat and improving heat exchange efficiency. By setting the ratio of the microchannel's projected area on the middle panel to the corresponding area of ​​the middle panel, the contact area between the microchannel and the heat-generating surface is increased, resulting in a high heat transfer area density, environmental adaptability, and good heat dissipation effect. The electronic component including the aforementioned heat dissipation device possesses the same beneficial effects.

[0038] The structure of this application, as well as its other objects and beneficial effects, will become more apparent from the description of the preferred embodiments taken in conjunction with the accompanying drawings. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the structure of the first enclosed panel of the heat dissipation device provided in the embodiments of this application;

[0041] Figure 2 This is a schematic diagram of the structure of the middle panel of the heat dissipation device provided in the embodiments of this application;

[0042] Figure 3 for Figure 2 A sectional view at point AA;

[0043] Figure 4 Another structural schematic diagram of the middle panel of the heat dissipation device provided in the embodiments of this application;

[0044] Figure 5 for Figure 4 A sectional view at BB;

[0045] Figure 6 This is a schematic diagram of the structure of the first intermediate panel of the heat dissipation device provided in the embodiments of this application;

[0046] Figure 7 This is a schematic diagram of the structure of the second intermediate panel of the heat dissipation device provided in the embodiment of this application.

[0047] Explanation of reference numerals in the attached figures:

[0048] 100 - First closed panel;

[0049] 200 - Middle panel; 210 - Microchannel;

[0050] 300 - First intermediate panel; 310 - First micropore; 320 - Third partition;

[0051] 400 - Second intermediate panel; 410 - Second micropore; 420 - Fourth partition;

[0052] 500 - Fluid; 501 - Fluid inlet; 502 - Fluid outlet;

[0053] x - First direction; y - Second direction. Detailed Implementation

[0054] In related technologies, a water-cooled plate includes a base plate, metal pipes, and a cover plate. Channels are provided on both the base plate and the cover plate. The metal pipes are sandwiched between the base plate and the cover plate and installed within the channels. During use, cooling liquid is poured into the metal pipes. The cooling liquid flows within the metal pipes and carries away the heat generated during chip operation.

[0055] However, in the above-mentioned technical solutions, the water-cooled plate has a poor heat dissipation effect on the chip. The main reason is that the structural composition of the water-cooled plate limits its further miniaturization. The metal pipes occupy the distribution area of ​​the cooling liquid on the water-cooled plate, resulting in a relatively reduced flow rate of the cooling liquid. Consequently, the heat carried away by the cooling liquid cannot meet the heat dissipation requirements of the chip.

[0056] To address the aforementioned technical problems, this application provides a heat dissipation device and electronic component, applicable not only to heat dissipation of heat-generating components in electronic components but also to other applications requiring heat exchange. This heat dissipation device, by incorporating multiple layers of panels, allows heat to flow layer by layer between the panels, resulting in lower flow resistance and rapid heat diffusion from one end of the panel to the other, leading to higher heat dissipation efficiency and better heat dissipation effect. By incorporating a fluid inlet, fluid outlet, and microchannels, the area occupied by metal pipes on the panels is avoided. Furthermore, the microchannels, with their micrometer-scale structural dimensions, increase the heat exchange area of ​​the fluid, prolonging the fluid's residence time within the heat dissipation device, allowing the fluid to carry away more heat and improving heat exchange efficiency. By setting the ratio of the microchannel's projected area on the middle panel to the corresponding area of ​​the middle panel, the contact area between the microchannel and the heat-generating surface is increased, resulting in a high heat transfer area density, environmental adaptability, and good heat dissipation effect. The electronic component, including the aforementioned heat dissipation device, possesses the same beneficial effects.

[0057] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, of the embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0058] The electronic components provided in the embodiments of this application will be described below.

[0059] This application provides an electronic component, including a heating element and a heat dissipation device. The heating element has a heating surface, and the first enclosed panel of the heat dissipation device is disposed on the side of the heating element near the heating surface.

[0060] The electronic components may include circuit boards, and the heating element may include chips on the circuit board. The heating element may include not only low-power, low-heat-flux-density heating elements in large spaces, but also high-power, high-heat-flux-density heating elements in confined spaces. In some embodiments, the electronic components may also be batteries, and the heating element may include battery cells.

[0061] The following will refer to Figures 1-7 The heat dissipation device provided in the embodiments of this application will be described.

[0062] This application provides a heat dissipation device that can be applied to electronic components with heat-generating elements, and can also be applied to other occasions that require heat exchange.

[0063] The heat dissipation device includes a first closed panel 100, a second closed panel, and a plurality of intermediate panels 200. The first closed panel 100, the plurality of intermediate panels 200, and the second closed panel are stacked and welded together in sequence. A fluid inlet 501, a fluid outlet 502, and a microchannel are provided between the plurality of intermediate panels 200.

[0064] Both the fluid inlet 501 and the fluid outlet 502 are located at the edge of the intermediate panel 200, and the microchannel connects the fluid inlet 501 and the fluid outlet 502.

[0065] Along the extension surface of the middle panel 200, the orthographic projection area of ​​the microchannel on the middle panel 200 is no less than 1 / 2 of the area of ​​the corresponding middle panel 200.

[0066] The first closed panel 100, the second closed panel, and a plurality of intermediate panels 200 constitute a plurality of panels. The plurality of panels may be made of the same material. For example, the panel material may include composite materials, such as copper alloys or composite welded plates. The plurality of panels may have the same shape. For example, the orthographic projections of the panels onto each other overlap, and they can be welded together to be fixed in place.

[0067] The first closed panel 100, multiple intermediate panels 200, and the second closed panel can be connected by at least one of gas-shielded brazing, vacuum brazing, and diffusion welding. This establishes the structural relationship of the heat dissipation device, forming a stable connection that meets its operating pressure requirements.

[0068] In some embodiments, the first closed panel 100 and the second closed panel may have the same thickness, and the plurality of intermediate panels 200 may have the same thickness. Furthermore, the thickness of the first closed panel 100 may be greater than the thickness of the intermediate panels 200. For example, the thickness of the first closed panel 100 ranges from 1 to 4 mm, serving as a sealing element for a heat dissipation device, while the thickness of the intermediate panels 200 ranges from 0.01 mm to 0.1 mm, serving to form microchannels.

[0069] In this way, heat flows along the layers between the panels, with less flow resistance, and heat can be quickly diffused from one end of the panel to the other, resulting in higher heat dissipation efficiency and better heat dissipation effect.

[0070] The heat dissipation device is provided with a fluid inlet 501 and a fluid outlet 502. The fluid inlet 501 and the fluid outlet 502 can be located at two opposite edges of the middle panel 200, or they can be distributed on opposite sides of the same edge of the middle panel 200, or they can be located at two adjacent edges of the middle panel 200.

[0071] The first closed panel 100, multiple intermediate panels 200, and the second closed panel are etched to form a fluid inlet 501, a fluid outlet 502, and a microchannel. The etching process can precisely remove the material on the intermediate panels 200 to form the above structure.

[0072] In this way, the relative positions of the fluid inlet 501 and the fluid outlet 502 on the middle panel 200 can be flexibly set according to the installation location and application of the heat dissipation device.

[0073] A microchannel is provided between the fluid inlet 501 and the fluid outlet 502. The structure of the microchannel is in the micrometer range. The microchannel design avoids the introduction of metal pipe structures, allowing the fluid 500 flowing through the microchannel to have a larger heat exchange area and a longer heat exchange time, thereby enabling the fluid 500 to have higher heat exchange efficiency.

[0074] The projected area of ​​the microchannels on the intermediate panel 200 can be 1 / 2, 2 / 3, or 3 / 4 of the area of ​​the intermediate panel 200. This increases the distribution area of ​​the microchannels on the intermediate panel 200, ensuring that the fluid 500 has sufficient heat exchange area and improving the heat exchange effect of the fluid 500.

[0075] In this embodiment, multiple microchannels are provided, and these multiple microchannels can include the following two arrangement methods:

[0076] In the first feasible arrangement, multiple microchannels are arranged in parallel, and each microchannel is connected between the fluid inlet 501 and the fluid outlet 502.

[0077] In this way, multiple interconnected microchannels are formed between the fluid inlet 501 and the fluid outlet 502. The fluid 500 flowing through these microchannels can have a higher coefficient of performance, thus improving heat dissipation. This microchannel structure is suitable not only for liquid fluid 500 but also for gaseous fluid 500.

[0078] In this embodiment, the above-described parallel microchannels can be formed in the following three ways:

[0079] In a first feasible implementation, one of the two adjacent intermediate panels 200 is provided with a microchannel 210, and the other of the two adjacent intermediate panels 200 is connected to the intermediate panel 200 provided with the microchannel 210 and the opening of the microchannel 210 is sealed to form a microchannel.

[0080] Reference Figure 2 and Figure 3 As shown or referenced Figure 4 and Figure 5 As shown, one side of the middle panel 200 is a planar structure, and the other side of the middle panel 200 is provided with microchannels 210. When the side of the middle panel 200 with microchannels 210 is aligned with the planar structure side of another middle panel 200, a microchannel is formed between the two adjacent middle panels 200. When multiple parallel microchannels 210 are provided on the middle panel 200, multiple parallel microchannels are formed between the two middle panels 200.

[0081] In a second feasible implementation, microchannels 210 are provided on the adjacent surfaces of two adjacent intermediate panels 200. The two adjacent intermediate panels 200 are joined together, and the microchannels 210 on the two adjacent intermediate panels 200 are aligned to form microchannels.

[0082] Similarly, refer to Figure 2 and Figure 3 As shown or referenced Figure 4 and Figure 5 As shown, when one side of the intermediate panel 200 with microchannels 210 is aligned with one side of another intermediate panel 200 with microchannels 210, a microchannel is formed between the two adjacent intermediate panels 200. When each intermediate panel 200 has multiple parallel microchannels 210, multiple parallel microchannels are formed between the two intermediate panels 200.

[0083] In some embodiments, multiple microchannels 210 are provided on both sides of each intermediate panel 200, so that multiple microchannels can be formed between the opposite sides of each intermediate panel 200 and the adjacent intermediate panel 200.

[0084] In a third feasible implementation, micropores are provided on two adjacent intermediate panels 200, the two adjacent intermediate panels 200 are connected, and the micropores on the two adjacent intermediate panels 200 are interconnected to form microchannels.

[0085] When micropores are formed on adjacent intermediate panels 200, the micropores on adjacent intermediate panels 200 are interconnected to form microchannels. When multiple parallel micropores are provided on adjacent panels, the corresponding micropores on adjacent intermediate panels 200 are interconnected to form multiple parallel microchannels.

[0086] In one feasible implementation, it further includes a first partition and a second partition. At least one first partition is connected between the walls of the micropores of one of two adjacent intermediate panels 200 with micropores, and at least one second partition is connected between the walls of the micropores of the other of two adjacent intermediate panels 200 with micropores. The orthographic projections of the first partition and the second partition on the same intermediate panel 200 do not overlap.

[0087] The first and second partitions both provide support between the walls of the micropores and isolate the fluid 500 in the micropores on both sides. The orthographic projections of the first and second partitions on either intermediate panel 200 do not overlap, allowing the fluid 500 in the micropores of adjacent intermediate panels to flow meanderingly around the partitions, prolonging the residence time of the fluid 500 in the microchannel and improving the efficiency of heat exchange of the fluid 500.

[0088] It is understandable that in the three feasible implementation methods described above, the solid parts between the parallel microchannels form a support between the microchannels, which can ensure that the heat dissipation device has sufficient structural strength.

[0089] In the second possible arrangement, multiple microchannels are arranged in a mesh and interconnected, with at least one microchannel connected to the fluid inlet 501 and at least one microchannel connected to the fluid outlet 502.

[0090] In this way, multiple interconnected microchannel segments can be formed between the fluid inlet 501 and the fluid outlet 502, which can expand the heat exchange area of ​​the microchannels, prolong the residence time of the fluid 500 in the microchannels, and improve the heat exchange effect. This type of microchannel is not only suitable for gaseous fluid 500, but also for liquid fluid 500.

[0091] It is understandable that the microchannel connected to the fluid inlet 501 and the microchannel connected to the fluid outlet 502 can be the same microchannel or different microchannels.

[0092] In one feasible implementation, the plurality of intermediate panels 200 include a plurality of first intermediate panels 300 and a plurality of second intermediate panels 400, wherein the first intermediate panels 300 and the second intermediate panels 400 are alternately arranged.

[0093] The first intermediate panel 300 is provided with a plurality of first microholes 310 distributed at intervals along the first direction x, and each first microhole 310 extends along the second direction y.

[0094] The second intermediate panel 400 is provided with a plurality of second microholes 410 distributed at intervals along the second direction y, and each second microhole 410 extends along the first direction x.

[0095] The first direction x intersects with the second direction y.

[0096] The first micro-hole 310 located on the first intermediate panel 300 and the second micro-hole 410 located on the second intermediate panel 400 are interconnected to form a microchannel.

[0097] Microchannels can consist of multiple Figure 6 The first middle panel 300 and multiple Figure 7 The second intermediate panel 400 shown is formed by sequentially stacking and welding. The width direction of the panel is the first direction x, and the length direction is the second direction y; the first direction x and the second direction y are perpendicular to each other. After the first intermediate panel 300 and the second intermediate panel 400 are sequentially stacked, the first micropores 310 and the second micropores 410 are perpendicular to each other, and some positions of the two are interconnected, forming a mesh-like arrangement of interconnected microchannels. Furthermore, the solid portions between the first micropores 310 on the first intermediate panel 300 are connected to the solid portions between the second micropores 410 on the second intermediate panel 400, ensuring sufficient structural strength for the heat dissipation device.

[0098] In one feasible implementation, such as Figure 6 As shown, along the second direction y, the same end of each of the first micropores 310 is interconnected.

[0099] In one feasible implementation, such as Figure 7 As shown, along the first direction x, the same end of each of the second micropores 410 is interconnected.

[0100] In this way, the fluid 500 in the microchannel can not only be interconnected through the staggered arrangement of the first micropore 310 and the second micropore 410, but also the first micropore 310 on the same first intermediate panel 300 and the second micropore 410 on the same second intermediate panel 400 can be interconnected. The fluid 500 can flow more smoothly between the mesh-arranged microchannels, which makes it easier for the fluid 500 to flow through more locations, increases the heat exchange area of ​​the fluid 500, and the fluid 500 can flow from the fluid inlet 501 to the fluid outlet 502 through any path.

[0101] In one feasible implementation, refer to Figure 6 and Figure 7 As shown, the heat dissipation device also includes a third partition 320. The third partition 320 is parallel to the first direction x, and the third partition 320 is connected between the two hole walls of the first micropore 310 that are disposed opposite to each other.

[0102] In one feasible implementation, refer to Figure 6 and Figure 7As shown, the heat dissipation device also includes a fourth partition 420. The fourth partition 420 is parallel to the second direction y, and the fourth partition 420 is connected between the two hole walls of the second micropore 410 that are disposed opposite to each other.

[0103] The third partition 320 forms a support between the walls of the first micropores 310 and isolates the fluid 500 in the first micropores 310 on both sides of the third partition 320. The fourth partition 420 forms a support between the walls of the second micropores 410 and isolates the fluid 500 in the second micropores 410 on both sides of the fourth partition 420. The orthographic projections of the third partition 320 and the fourth partition 420 on either intermediate panel 200 may not coincide or may intersect each other, so that the fluid 500 isolated on both sides of the third partition 320 in the first micropores 310 can communicate with each other through the second micropores 410, and the fluid 500 isolated on both sides of the fourth partition 420 in the second micropores 410 can communicate with each other through the first micropores 310. This allows the fluid 500 to flow meanderingly around the partitions, prolonging the residence time of the fluid 500 in the microchannel and improving the efficiency of heat exchange of the fluid 500.

[0104] In one feasible implementation, the cross-sectional areas of the microchannel at different locations along the direction from fluid inlet 501 to fluid outlet 502 are all unequal, or the cross-sectional areas at at least some different locations of the microchannel are equal.

[0105] In this way, the cross-sectional area of ​​the microchannel can be equal everywhere, or it can gradually change or change in stages along the direction between the fluid inlet 501 and the fluid outlet 502.

[0106] It is understandable that the cross-sectional area of ​​the microchannel is on the micrometer scale. The microchannel can serve as a capillary channel for the fluid 500. Under the action of the capillary channel, the fluid 500 will flow towards the microchannel with a smaller cross-sectional area. By setting the change of the cross-sectional area of ​​the microchannel, the flow direction of the fluid 500 can be guided.

[0107] In one feasible implementation, the fluid inlet 501, the fluid outlet 502, and the microchannel form a microchannel group.

[0108] The heat dissipation device is equipped with multiple microchannel groups, which are distributed at intervals along the thickness direction of the middle panel 200, and adjacent microchannel groups are not connected to each other.

[0109] For example, such as Figure 2 The fluid inlet 501, fluid outlet 502, and microchannels on the intermediate panel 200 shown form a first microchannel group, as... Figure 4 The fluid inlet 501, fluid outlet 502, and microchannels shown form a second microchannel group, with multiple... Figure 2 The middle panel 200 and multiple shown Figure 4 The middle panel 200 shown is arranged alternately in sequence, so that multiple first microchannel groups and multiple second microchannel groups are arranged alternately in sequence. Refrigerant is introduced into the microchannel of one of the first microchannel groups and the second microchannel groups, and heat medium is introduced into the microchannel of one of the first microchannel groups and the second microchannel groups, so that heat exchange between refrigerant and heat medium can be realized.

[0110] In some embodiments, a refrigerant is introduced into both the first microchannel group and the second microchannel group to dissipate heat from the heat-generating component.

[0111] It is understood that in the above embodiments, the microchannels in the microchannel group are arranged in parallel. Similarly, when the microchannels in the microchannel group are arranged in a mesh, multiple microchannel groups can be set up to have the same beneficial effect.

[0112] It should be noted that, in the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0113] In the description of the embodiments of this application, the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the term "multiple" means two or more, unless otherwise precisely specified.

[0114] In the description of the embodiments of this application, the terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0115] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipating device, characterized by, The microchannel device comprises a first closure panel, a second closure panel and a plurality of intermediate panels; The first closure panel, the plurality of intermediate panels and the second closure panel are sequentially stacked and welded, and a fluid inlet, a fluid outlet and a microchannel are arranged between the plurality of intermediate panels; The fluid inlet and the fluid outlet are located at the edges of the intermediate panels, and the microchannel is communicated between the fluid inlet and the fluid outlet; The area ratio of the orthogonal projection area of the microchannel on the intermediate panel to the area of the corresponding intermediate panel is not less than 1 / 2 along the extension surface of the intermediate panel; The microchannel is provided with a plurality of microchannels, and the plurality of microchannels are parallelly arranged and communicated between the fluid inlet and the fluid outlet; One of the two adjacent intermediate panels is provided with a microchannel, and the other of the two adjacent intermediate panels is butted with the intermediate panel provided with the microchannel and blocks the slot of the microchannel to form the microchannel; Alternatively, the mutually close surfaces of the two adjacent intermediate panels are both provided with a microchannel, and the two adjacent intermediate panels are butted, and the microchannels on the two adjacent intermediate panels are closed to form the microchannel; The two adjacent intermediate panels are both provided with a microhole, and the two adjacent intermediate panels are butted, and the microholes on the two adjacent intermediate panels are communicated to form the microchannel; Further comprising a first partition plate and a second partition plate, at least one first partition plate is connected between the hole walls of the microholes of one of the two adjacent intermediate panels provided with the microholes, at least one second partition plate is connected between the hole walls of the microholes of the other of the two adjacent intermediate panels provided with the microholes, and the orthogonal projections of the first partition plate and the second partition plate on the same intermediate panel do not overlap.

2. The heat dissipating device according to claim 1, wherein The microchannel is provided with a plurality of microchannels, and the plurality of microchannels are arranged in a network and communicated, at least one microchannel is communicated with the fluid inlet, and at least one microchannel is communicated with the fluid outlet.

3. The heat dissipating device of claim 2, wherein The plurality of intermediate panels comprise a plurality of first intermediate panels and a plurality of second intermediate panels, and the first intermediate panels and the second intermediate panels are alternately arranged; The first intermediate panel is provided with a plurality of first microholes which are spaced apart along a first direction, and each first microhole extends along a second direction; The second intermediate panel is provided with a plurality of second microholes which are spaced apart along the second direction, and each second microhole extends along the first direction; The first direction and the second direction intersect; The first microholes on the first intermediate panel and the second microholes on the second intermediate panel are communicated to form the microchannel.

4. The heat dissipating device according to claim 3, wherein Along the second direction, the same end of each first microhole is communicated; And / or, along the first direction, the same end of each second microhole is communicated.

5. The heat dissipating device of claim 3, wherein Further comprising a third partition plate, the third partition plate is parallel to the first direction, and the third partition plate is connected between the two hole walls of the first microhole which are oppositely arranged; And / or, A fourth partition plate is further included, which is parallel to the second direction and is connected between two hole walls of the second micro-holes.

6. The heat dissipating device according to any one of claims 1 to 5, wherein The extension direction of the micro-channels includes a straight line and / or a curve.

7. The heat dissipating device according to any one of claims 1 to 5, wherein In the direction from the fluid inlet to the fluid outlet, The cross-sectional areas of different positions of the micro-channels are all different, or the cross-sectional areas of at least some different positions of the micro-channels are equal.

8. The heat dissipating device according to any one of claims 1 to 5, wherein The fluid inlet, the fluid outlet and the micro-channels form a micro-channel group, The heat dissipation device is provided with a plurality of micro-channel groups, which are distributed at intervals along the thickness direction of the intermediate panel, and adjacent micro-channel groups are not communicated with each other.

9. The heat dissipating device according to any one of claims 1 to 5, wherein The material of the first closed panel, the plurality of intermediate panels and the second closed panel includes metal or composite metal material. And / or, the thickness of the first closed panel, the second closed panel and the plurality of intermediate panels ranges from 0.01 mm to 4 mm. And / or, the first closed panel, the second closed panel and the plurality of intermediate panels are formed by etching processing. And / or, the first closed panel, the plurality of intermediate panels and the second closed panel are connected by gas shield brazing and / or vacuum brazing and / or diffusion welding etching.

10. An electronic component, characterized by comprising: The heat dissipation device as claimed in any one of claims 1-9 is further included, and the heat dissipation device is provided with a heating element having a heating surface, and the first closed panel of the heat dissipation device is arranged on the side of the heating element close to the heating surface.

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