A multi-stage ladder high-frequency PCB board and a press-bonding preparation process thereof

Abstract

The application discloses a kind of multistage ladder high-frequency PCB, including at least two high-frequency core boards and constitute main body, all high-frequency core board is from top to bottom in turn and is stacked, high-frequency PP piece is arranged between adjacent two high-frequency core boards, and a plurality of ladder windows are opened from top to bottom on main body, the bottom of each ladder window extends to the upper surface of one of high-frequency core board, the upper surface of high-frequency core board corresponding to the bottom of ladder window is provided with component solder pad and wiring design, the component solder pad is located at ladder window, the application can greatly improve the component carrying quantity, save the volume of PCB, while the manufacturing cost of PCB and electronic equipment can be reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of PCB boards, and more particularly relates to a multi-step high-frequency PCB board and a pressing and manufacturing process thereof. Background Art

[0002] Electronic products are becoming increasingly miniaturized and lightweight, yet they are becoming increasingly complex and feature-rich. This means that each PCB needs to be smaller while still supporting more components. The currently common solution is to reduce the size of components on the PCB. However, due to limitations such as the inability to reduce the size of some components and the high cost of small components, this solution faces significant challenges in practice, hindering the development of many electronic products. Summary of the Invention

[0003] In response to the shortcomings of the existing technology, the present invention provides a high-frequency PCB board composed of two or more high-frequency Core boards. Stepped windows can be designed on different high-frequency Core boards, and component pads are provided, thereby realizing three-dimensional welding and packaging of multi-layer components, which can greatly increase the number of components carried, save the volume of the PCB board, and at the same time reduce the production cost of the PCB board and electronic equipment.

[0004] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a multi-level stepped high-frequency PCB board, comprising a main body composed of at least two high-frequency core boards, all of which are stacked in sequence from top to bottom, and a number of stepped windows are opened on the main body from top to bottom, the bottom of each stepped window extending to the upper surface of one of the high-frequency core boards, and the upper surface of the high-frequency core board corresponding to the bottom of the stepped window is provided with component pads and wiring design, and the component pads are located at the stepped windows.

[0005] Furthermore, a high-frequency PP sheet is provided between two adjacent high-frequency Core boards.

[0006] Furthermore, component pads and wiring design are also provided above the top high-frequency Core board.

[0007] A lamination die for a multi-step high-frequency PCB board comprises a support member and a lamination die. The support member comprises a first mirrored steel plate and a first release film arranged from bottom to top; the lamination die comprises a second mirrored steel plate, a mold, a third release film, Tg130PP, and a second release film arranged from top to bottom; a boss is provided below the mold to cooperate with the stepped window.

[0008] Furthermore, the length and width of the boss are 0.1 mm smaller on one side than the stepped window size, and the height of the boss is 0.2 mm smaller than the height of the stepped window.

[0009] A lamination preparation process for a multi-step high-frequency PCB board includes the following steps:

[0010] S1: Open the window of the non-stepped high-frequency core board and mill off the waste material at the window opening position of the high-frequency core board according to the preset program;

[0011] S2: Open the window of high-frequency PP sheet, and mill off the waste material at the window opening position of high-frequency PP sheet according to the preset program;

[0012] S3: Design of the pressing die. Mill a boss on the thick epoxy board according to the preset program. The position of the boss corresponds to the stepped window. The length and width of the boss are 0.1mm smaller than the stepped window size on one side, and the height of the boss is 0.2mm smaller than the stepped window height.

[0013] S4: Stacking: stacking the first mirror steel plate, the first release film, the PCB to be pressed, the second release film, Tg130PP, the third release film, the mold, and the second mirror steel plate on the stacking table in sequence;

[0014] S5: Lamination. According to the specific model of the high-frequency PP sheet, select the corresponding lamination program to complete the lamination of the multi-level stepped high-frequency PCB board under a certain high temperature and high pressure.

[0015] Furthermore, in step S2, the window size of the high-frequency PP sheet is 0.5-2 mm larger than the single side of the PCB board design.

[0016] Compared with the existing technology, the beneficial effects of the present invention are as follows: the high-frequency PCB board is made of two or more high-frequency core boards bonded together by high-frequency PP sheets, and stepped windows can be designed on different high-frequency core boards. Component pads are designed within the stepped windows, thereby improving the limitation of the current PCB board that component pad wiring design can only be performed on the surface of the outermost high-frequency core board; the multi-level stepped high-frequency PCB board can realize three-dimensional welding and packaging of multi-layer components. Compared with the current flat design of component pad wiring, it can greatly increase the number of components carried, save the volume of the PCB board, and at the same time reduce the production cost of the PCB board and electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a cross-sectional view of an embodiment of a multi-step high-frequency PCB board of the present invention;

[0018] Figure 2 for Figure 1 A top view of

[0019] Figure 3 for Figure 1 Partial stereoscopic view of ;

[0020] Figure 4Schematic diagram of stacking boards in the lamination preparation process of a multi-step high-frequency PCB board according to the present invention;

[0021] Figure 5 is a cross-sectional view of the mold;

[0022] Figure 6 A top view of the mold.

[0023] Figure numerals: 1. L3 layer stepped window; 2. L5 layer stepped window; 3. High-frequency Core board; 5. Boss; 6. Support member; 61. First mirror steel plate; 62. First release film; 7. Pressing member; 71. Second mirror steel plate; 72. Mold; 73. Third release film; 74. Tg130PP; 75. Second release film; 8. PCB board to be pressed. DETAILED DESCRIPTION

[0024] Reference Figures 1 to 6 The embodiments of the present invention are further described.

[0025] In the description of the present invention, it should be noted that, for directional words, such as the terms "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating directions and positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Therefore, the terms "first" and "second" may explicitly or implicitly refer to one or more of these features. Throughout the description of the present invention, "several" and "a number" mean two or more, unless otherwise specifically defined.

[0027] A multi-step high-frequency PCB board includes a main body consisting of at least two high-frequency Core boards 3. All high-frequency Core boards 3 are stacked in sequence from top to bottom, and a number of stepped windows are opened on the main body from top to bottom. The bottom of each stepped window extends to the upper surface of one of the high-frequency Core boards 3. Different stepped window bottoms can be on the upper surfaces of different high-frequency Core boards 3. The upper surface of the high-frequency Core board 3 corresponding to the bottom of the stepped window is provided with component pads and wiring design. The component pads are located at the stepped window, that is, each component pad is located at the bottom position of the corresponding stepped window.

[0028] Preferably, a high-frequency PP sheet is provided between two adjacent high-frequency Core boards 3 , that is, the two adjacent high-frequency Core boards 3 are bonded and fixed by the high-frequency PP sheet.

[0029] Component pads and wiring design are also provided above the top high-frequency Core board 3.

[0030] like Figure 1-3 As shown, taking a six-layer, two-level high-frequency PCB board as an example, the PCB board is designed with an L3 stepped window 1 and an L5 stepped window 2, thereby achieving the purpose of designing component pads on the L1 circuit layer, L3 circuit layer, and L5 circuit layer at the same time. That is, stepped windows can be designed on different high-frequency core boards 3, and component pads are designed within the stepped windows, thereby overcoming the limitation of the current PCB board that component pad wiring design can only be performed on the surface of the outermost high-frequency core board 3; the multi-level stepped high-frequency PCB board can realize three-dimensional welding and packaging of multi-layer components. Compared with the current flat design of component pad wiring, it can greatly increase the number of components carried, save the volume of the PCB board, and at the same time reduce the production cost of the PCB board and electronic equipment.

[0031] A pressing mold for a multi-step high-frequency PCB board includes a support member 6 and a pressing member 7. The support member 6 includes a first mirror steel plate 61 and a first release film 62 arranged from bottom to top. The pressing member 7 includes a second mirror steel plate 71, a mold 72, a third release film 73, Tg130PP, and a second release film 75 arranged from top to bottom; a boss 5 is provided below the mold 72 to cooperate with the stepped window.

[0032] A lamination preparation process for a multi-step high-frequency PCB board includes the following steps:

[0033] S1: Non-stepped high-frequency Core board 3 window, use precision milling machine according to preset program to mill away the waste material at the window position of high-frequency Core board 3; take the above six-layer secondary high-frequency PCB board as an example, refer to the attached Figure 1 , the high-frequency Core board 3 of L1-L2 needs to mill off the waste material at the step position of L3 layer, and the high-frequency Core board 3 of L1-L2 and the high-frequency Core board 3 of L3-L4 need to mill off the waste material at the step position of L5 layer; in order to ensure the inter-layer alignment accuracy of the high-frequency Core board 3 of L1-L2 and the high-frequency Core board 3 of L3-L4, before milling off the waste material at the step position of L5 layer, it is necessary to use a hot melt machine to fuse the high-frequency Core board 3 of L1-L2 and the high-frequency Core board 3 of L3-L4;

[0034] S2: High-frequency PP sheet window, use precision milling machine according to the preset program to mill off the waste material at the high-frequency PP sheet window position; take the above six-layer secondary high-frequency PCB board as an example, refer to the attached Figure 1 , the high-frequency PP sheet between the L2 layer pattern and the L3 layer pattern needs to mill off the waste material at the L3 layer step position, and the high-frequency PP sheet between the L4 layer pattern and the L5 layer pattern needs to mill off the waste material at the L5 layer step position; to ensure the alignment accuracy between the Core board and the high-frequency PP sheet, before milling off the waste material at the L3 layer step position, it is necessary to use a hot melt machine to fuse the L1-L2 Core and the L2-L3 high-frequency PP sheet; before milling off the waste material at the L5 layer step position, it is necessary to use a hot melt machine to fuse the L1-L2 high-frequency Core board 3, the L3-L4 Core and the L4-L5 high-frequency PP sheet;

[0035] The window size of each layer of high-frequency Core board 3 is consistent with the design of the finished PCB board; the window size of the high-frequency PP sheet needs to be 0.5-2mm larger on one side than the design of the finished PCB board. The specific size can be adjusted according to the amount of glue flowing from the high-frequency PP sheet; the purpose is to avoid excessive glue flowing from the high-frequency PP sheet overflowing between layers and contaminating the pads in the stepped position.

[0036] S3: Design of the pressing mold: Use a precision milling machine to mill out a boss 5 on the thick epoxy board according to a preset program. The position of the boss 5 corresponds to the stepped window. The length and width of the boss 5 are 0.1mm smaller than the stepped window size on one side, and the height of the boss 5 is 0.2mm smaller than the stepped window height.

[0037] The thickness of the thick epoxy board is 3.00mm, and the four corners of the mold 72 are designed with positioning pin holes. The upper part of the pin is square and the lower part is round. The height of the square part does not exceed the upper surface of the mold, and the length of the round part is 60%-80% of the thickness of the PCB to be pressed.

[0038] S4: Stacking, stack the first mirror steel plate 61, the first release film 62, the PCB board 8 to be pressed, the second release film 75, the Tg130PP74, the third release film 73, the mold 72, and the second mirror steel plate 71 on the stacking table in sequence; the thickness of the release film and the thickness of the Tg130PP can be adjusted according to the step depth of the specific PCB board. In principle, the total thickness of the release film and the PP sheet must be greater than or equal to the deepest step depth; the mold 72 needs to be fixed to the PCB board using alignment pins to ensure that the protruding position on the mold 72 and the step position of the PCB board are completely overlapped during pressing and will not slide.

[0039] S5: Lamination. According to the specific model of the high-frequency PP sheet, select the corresponding lamination program to complete the lamination of the multi-level stepped high-frequency PCB board under a certain high temperature and high pressure.

[0040] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A lamination preparation process for a multi-step high-frequency PCB board, characterized in that: The multi-level stepped high-frequency PCB board includes a main body consisting of at least two high-frequency core boards, all of which are stacked in sequence from top to bottom, and a number of stepped windows are opened on the main body from top to bottom. The bottom of each stepped window extends to the upper surface of one of the high-frequency core boards. The upper surface of the high-frequency core board corresponding to the bottom of the stepped window is provided with component pads and wiring design. The component pads are located at the stepped windows. A high-frequency PP sheet is provided between two adjacent high-frequency core boards. Component pads and wiring design are also provided above the top high-frequency core board. The lamination preparation process of the multi-step high-frequency PCB board includes the following steps: S1: Open the window of the non-stepped high-frequency core board and mill off the waste material at the window opening position of the high-frequency core board according to the preset program; S2: Open the window of high-frequency PP sheet, and mill off the waste material at the window opening position of high-frequency PP sheet according to the preset program; S3: Design of the pressing die. Mill a boss on the thick epoxy board according to the preset program. The position of the boss corresponds to the stepped window. The length and width of the boss are 0.1mm smaller than the stepped window size on one side, and the height of the boss is 0.2mm smaller than the stepped window height. S4: Stacking: stacking the first mirror steel plate, the first release film, the PCB to be pressed, the second release film, Tg130PP, the third release film, the mold, and the second mirror steel plate on the stacking table in sequence; S5: Lamination: According to the specific model of the high-frequency PP sheet, the corresponding lamination procedure is selected to complete the lamination of the multi-level stepped high-frequency PCB board under high temperature and high pressure; The pressing mold includes a supporting part and a pressing part, the supporting part includes a first mirror steel plate and a first release film arranged from bottom to top, and the pressing part includes a second mirror steel plate, a mold, a third release film, Tg130PP and a second release film arranged from top to bottom; the boss that cooperates with the stepped window is provided below the mold.

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