Radiation detector and method for manufacturing a radiation detector

Abstract

The radiation detector (1) of the present invention comprises: a photoelectric conversion element array (7); a scintillator layer (8) for converting radiation into light; a resin frame (9) formed on the photoelectric conversion element array (7); and a protective film (13) covering the scintillator layer (8). A groove (30) is formed in the resin frame (9) and is continuous with the outer edge (13a) of the protective film (13). The groove (30) includes: a front irradiation portion (Rs) formed by scanning along the resin frame (9) while increasing the energy of a laser; a main irradiation portion (Ra) formed by scanning along the resin frame (9) while generally maintaining the energy of a laser; and a rear irradiation portion (Re) formed by scanning along the resin frame (9) while decreasing the energy of a laser.

Description

Technical Field

[0001] This invention relates to a radiation detector and a method for manufacturing a radiation detector. Background Technology

[0002] Patent documents 1, 2, and 3 disclose radiation detectors. The radiation detectors disclosed in patent documents 1, 2, and 3 include: a scintillator layer that converts radiation into light; and a light detection panel for detecting the light. The light detection panel includes: a light-receiving portion having a plurality of light-receiving elements disposed thereon; and a plurality of bonding pads disposed around the light-receiving portion and electrically connected to the light-receiving portion. A resin frame surrounding the light-receiving portion is formed between the light-receiving portion and the bonding pads. The scintillator layer is covered by a moisture-resistant protective film.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-96823

[0006] Patent Document 2: Japanese Patent Application Publication No. 2016-205916

[0007] Patent Document 3: U.S. Patent No. 2012 / 0288688 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] In the method for manufacturing the radiation detector disclosed in Patent Documents 1 and 2, a scintillator layer is first formed on a light detection panel. Then, a resin frame is formed. Next, a protective film is formed. The protective film is formed on the scintillator layer and also on the pads. The protective film simply covers the scintillator layer. Therefore, a portion of the protective film covering the pads is removed. Specifically, to cut the protective film, a laser is used to cut the protective film formed on the resin frame. That is, the protective film and the resin frame are the objects irradiated by the laser.

[0010] The laser irradiation method may differ slightly from the preset settings and the actual action. Therefore, even when set to cut the protective film but not the resin frame, the resin frame may still be accidentally cut during the actual action.

[0011] Therefore, the object of the present invention is to provide a radiation detector that can suppress the occurrence of unintentional cutting of the irradiated object and a method for manufacturing the radiation detector.

[0012] Technical means to solve the problem

[0013] An embodiment of the radiation detector of the present invention comprises: a light detection panel having a light-receiving portion and a plurality of pads, the light-receiving portion including a plurality of photoelectric conversion elements arranged in one or two dimensions, the pads being electrically connected to the photoelectric conversion elements and disposed outside the light-receiving portion; a scintillator layer stacked on the light detection panel to cover the light-receiving portion for converting radiation into light; a panel protection portion formed on the light detection panel such that, when viewed from the stacking direction of the scintillator layer, it separates from the scintillator layer and the pads, passes between the scintillator layer and the pads, and surrounds the scintillator layer; and a scintillator protective film covering the scintillator layer and having an outer edge located on the panel protection portion. A groove continuous with the outer edge of the scintillator protective film is formed in the panel protection portion. The groove includes: a front irradiation section formed by scanning along the panel protection section while increasing the laser energy from a value lower than the threshold energy of the cuttable scintillator protective film to a value higher than the threshold energy; a main irradiation section formed by scanning along the panel protection section while maintaining the laser energy at a value higher than the threshold energy; and a rear irradiation section formed by scanning along the panel protection section while decreasing the laser energy from a value higher than the threshold energy to a value lower than the threshold energy.

[0014] The groove in the panel protection portion of the radiation detector is continuous with the outer edge of the scintillator protective film. Therefore, the groove is formed along with the outer edge of the scintillator protective film irradiated by the laser. When a groove is formed in the panel protection portion, the scintillator protective film formed on the panel protection portion can be reliably cut off. In the front irradiation portion, irradiation begins with an energy lower than the threshold energy. According to this irradiation method, the energy required to cut off the panel protection portion can be sufficient to begin laser irradiation with a margin. Therefore, even if an energy higher than the set value is supplied unintentionally at the start of laser irradiation, the cutting off of the panel protection portion can be suppressed by ensuring a margin. Similarly, in the rear irradiation portion, irradiation stops after the energy is reduced to a level lower than the threshold energy. According to this irradiation method, the energy required to cut off the panel protection portion can be sufficient to stop laser irradiation with a margin. Therefore, even if an energy higher than the set value is supplied unintentionally at the end of laser irradiation, the cutting off of the panel protection portion can be suppressed by ensuring a margin. Therefore, unintentional cutting off of the panel protection portion of the irradiated object can be suppressed.

[0015] The radiation detector may also include a coating resin covering the outer edge of the scintillator protective film. This structure can suppress the peeling of the scintillator protective film.

[0016] The coating resin of the radiation detector may further cover the panel protection portion. The coating resin may also have material properties that allow it to remain on the panel protection portion, so that the edge of the contact surface between the coating resin and the panel protection portion is formed on the panel protection portion. According to this structure, the coating resin will not reach the surface of the photodetector panel and the pads located outside the panel protection portion. Therefore, the surface of the photodetector panel and the pads can be kept clean.

[0017] In the radiation detector, the central portion of the panel protection section may be higher than the two edges of the panel protection section. With this structure, the coating resin can reliably cover the outer edge of the scintillator protective film.

[0018] In the aforementioned radiation detector, the width of the panel protective portion may be 700 micrometers or more and 1000 micrometers or less. This structure allows for miniaturization of the radiation detector.

[0019] In the aforementioned radiation detector, the height of the panel protection portion may be 100 micrometers or more and 300 micrometers or less. This structure allows for miniaturization of the radiation detector.

[0020] Another method for manufacturing a radiation detector according to the present invention includes: a step of preparing a light detection panel having a light-receiving portion and a plurality of pads, and a step of stacking a scintillator layer on the light detection panel such that it covers the light-receiving portion; a step of disposing a panel protection portion on the light detection panel such that it surrounds the scintillator layer when viewed from the stacking direction of the scintillator layer; a step of forming a scintillator protective film such that it covers the entire surface of the side of the light detection panel on which the scintillator layer is stacked and the surface of the panel protection portion; a step of cutting the scintillator protective film by irradiating the panel protection portion with a laser; and a step of removing the outer portion of the scintillator protective film, wherein the light-receiving portion includes a plurality of photoelectric conversion elements arranged in one or two dimensions, the plurality of pads being electrically connected to the photoelectric conversion elements and disposed on the outer side of the light-receiving portion, and the scintillator layer being used to convert radiation into light. The process of cutting the scintillator protective film includes: a pre-irradiation process in which the laser energy is increased from a value lower than the threshold energy that can cut the scintillator protective film to a value higher than the threshold energy while scanning along the panel protection portion; a main irradiation process in which the laser energy is maintained at a value higher than the threshold energy while scanning along the panel protection portion; and a post-irradiation process in which the laser energy is decreased from a value higher than the threshold energy to a value lower than the threshold energy while scanning along the panel protection portion.

[0021] In the process of manufacturing a radiation detector, the step of cutting the scintillator protective film forms the outer edge of the scintillator protective film and a groove is formed in the panel protection portion. Furthermore, with the groove formed in the panel protection portion, the scintillator protective film formed on the panel protection portion can be reliably cut. This is achieved through a pre-irradiation step that increases energy while forming the groove, and a post-irradiation step that decreases energy while forming the groove. According to these steps, the depth of the groove will not become excessive. Therefore, unintentional cutting of the panel protection portion, which is the irradiated object, can be suppressed.

[0022] In other methods of manufacturing radiation detectors, the panel protection portion may include a resin frame. In the process of configuring the panel protection portion, the resin frame may be configured on the light detection panel in a manner that separates it from the scintillator layer and pads, passing between the scintillator layer and pads and surrounding the scintillator layer. According to this process, a radiation detector with a resin frame can be manufactured.

[0023] In other methods of manufacturing radiation detectors, the panel protection section may also include a masking component. In the process of configuring the panel protection section, the masking component may be further configured on the photodetector panel to cover the pads. This process provides ideal protection for the pads.

[0024] In other methods of manufacturing radiation detectors, the panel protection portion may include a shielding member. In the process of arranging the panel protection portion, the shielding member may be arranged on the light detection panel to cover the area between the scintillator layer and the pads, as well as the pads themselves. In the process of forming the scintillator protective film, the scintillator protective film may be formed on the entire surface of the light detection panel on the side where the scintillator layer is stacked and on the surface of the shielding member. According to this process, a radiation detector without a resin frame can be manufactured. That is, the distance between the scintillator layer and the pads can be shortened. As a result, the radiation detector can be further miniaturized.

[0025] In other methods of manufacturing radiation detectors, a step of removing the shielding component may be included after the step of cutting the scintillator protective film. According to this step, a radiation detector without a resin frame can be ideally manufactured.

[0026] In other methods of manufacturing radiation detectors, a step may be included, after the step of removing the outer portion of the scintillator protective film, of forming a coating resin covering the outer edge of the scintillator protective film. This step can further suppress the peeling of the outer edge of the scintillator protective film.

[0027] The effects of the invention

[0028] According to the present invention, a radiation detector capable of suppressing the occurrence of unintentional cutting of an irradiated object and a method for manufacturing the radiation detector are provided. Attached Figure Description

[0029] Figure 1 This is a top view of the radiation detector according to the first embodiment.

[0030] Figure 2 It is along Figure 1 A cross-sectional view of line II-II.

[0031] Figure 3 It is Figure 1 A magnified top view showing the area near the corner of the radiation detector.

[0032] Figure 4 (a) is a cross-sectional view showing the state before the formation of the scintillator layer. Figure 4 (b) is a cross-sectional view showing the state after the scintillator layer is formed.

[0033] Figure 5 (a) is a cross-sectional view showing the state after the resin frame is formed. Figure 5 (b) is a cross-sectional view showing the state after the formation of the first organic membrane.

[0034] Figure 6 (a) is a cross-sectional view showing the state after the formation of the inorganic membrane. Figure 6 (b) is a cross-sectional view showing the state after the formation of the second organic membrane.

[0035] Figure 7 It is a cross-sectional view showing the processing done by laser.

[0036] Figure 8 It is a diagrammatic representation of the time history of the energy received by the irradiated object.

[0037] Figure 9 (a) is a cross-sectional view of the front irradiation section. Figure 9 (b) is a cross-sectional view showing the front irradiation section and the main irradiation section. Figure 9 (c) is a cross-sectional view showing the front irradiation section, the main irradiation section and the rear irradiation section.

[0038] Figure 10 (a) is a cross-sectional view used to illustrate the process of forming the rear irradiation section. Figure 10 (b) is used to explain the continuation. Figure 10 A cross-sectional view of the process of forming the irradiation section after (a) is formed.

[0039] Figure 11 (a) is a graph representing an example of the time history of the laser head's speed. Figure 11 (b) is a chart representing an example of the time history of the energy of the laser emitted from the laser head. Figure 11(c) is a chart showing an example of the time history of the focal position of the laser emitted from the laser head.

[0040] Figure 12 (a) is a graph representing an example of the time history of the laser head's speed. Figure 12 (b) is a schematic diagram showing the positional relationship between the laser head, the protective film, and the resin frame.

[0041] Figure 13 (a) is a cross-sectional view showing the state where a portion of the protective film has been removed. Figure 13 (b) is a cross-sectional view showing the state after the coating resin is formed.

[0042] Figure 14 (a) is a diagram schematically representing the time history of the energy received by the irradiated body. Figure 14 (b) is a graph schematically representing the time history of the laser head's speed.

[0043] Figure 15 This is a top view of the radiation detector according to the second embodiment.

[0044] Figure 16 It is along Figure 15 A cross-sectional view of the XVI-XVI line.

[0045] Figure 17 yes Figure 15 The first stereoscopic view of the radiation detector.

[0046] Figure 18 yes Figure 15 The second stereoscopic view of the radiation detector.

[0047] Figure 19 (a) is a cross-sectional view showing the state before the formation of the scintillator layer. Figure 19 (b) is a cross-sectional view showing the state after the scintillator layer is formed.

[0048] Figure 20 (a) is a cross-sectional view showing the state after the shielding component is configured. Figure 20 (b) is a cross-sectional view showing the state after the formation of the first organic membrane.

[0049] Figure 21 (a) is a cross-sectional view showing the state after the formation of the inorganic membrane. Figure 21 (b) is a cross-sectional view showing the state after the formation of the second organic membrane.

[0050] Figure 22 (a) is a cross-sectional view showing the processing by laser. Figure 22 (b) is a cross-sectional view showing the process of removing the shielding component.

[0051] Figure 23 It is a cross-sectional view showing the state after the shielding components are removed.

[0052] Figure 24 This is a cross-sectional view of a radiation detector in a modified example of the second embodiment. Detailed Implementation

[0053] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are given the same reference numerals, and repeated descriptions are omitted.

[0054] Reference Figure 1 and Figure 2 The structure of the radiation detector 1 in this embodiment will be described. For example... Figure 1 and Figure 2 As shown, the radiation detector 1 includes: a photoelectric conversion element array 7 (photodetector panel), a scintillator layer 8, a resin frame 9, a protective film 13 (scintillator protective film), and a coating resin 14 (coating resin). The photoelectric conversion element array 7 includes: a substrate 2, a light-receiving portion 3, a signal line 4, a pad 5, and a passivation film 6. The protective film 13 includes a first organic film 10, an inorganic film 11 (metal film), and a second organic film 12.

[0055] The light-receiving section 3 includes a plurality of photoelectric conversion elements 3a. These photoelectric conversion elements 3a are arranged in a rectangular region at the center of an insulating substrate 2 in a two-dimensional arrangement. The substrate 2 is, for example, a glass substrate. The photoelectric conversion elements 3a are constructed using amorphous silicon photodiodes (PDs) or thin-film transistors (TFTs). Each row or column of photoelectric conversion elements 3a included in the light-receiving section 3 is electrically connected to pads 5 (not shown) for obtaining signals from an external circuit via signal lines 4.

[0056] Multiple pads 5 are arranged at predetermined intervals along both sides of adjacent joints on the outer edge of the substrate 2. The two sides of adjacent joints are, for example... Figure 1 The pads 5 are located on the top and right sides of the circuit. Pad 5 is electrically connected to the corresponding photoelectric conversion element 3a via signal line 4. An insulating passivation film 6 is formed on the photoelectric conversion element 3a and signal line 4. The passivation film 6 can be, for example, silicon nitride or silicon oxide. Pad 5 is exposed for connection to external circuitry.

[0057] A columnar scintillator 8a converts X-rays of radiation into light. The scintillator 8a is stacked on the photoelectric conversion element array 7 to cover the light-receiving portion 3. The scintillator layer 8 is formed by the scintillator 8a. Multiple scintillators 8a are stacked on the photoelectric conversion element array 7 in a slightly rectangular region containing the light-receiving portion 3. The slightly rectangular region is... Figure 1 The area enclosed by the dashed line shown. The scintillator 8a can be made of various materials. For example, the scintillator 8a can use cesium iodide (CsI) doped with thallium (Tl), which has good luminous efficiency.

[0058] The peripheral portion 8b of the scintillator layer 8 has a gradient shape. In other words, the height of the peripheral portion 8b gradually decreases towards the outer side of the scintillator layer 8. That is, in the peripheral portion 8b, the scintillator 8a formed further out of the scintillator layer 8 has a lower height. The peripheral portion 8b is the area where the light-receiving portion 3 is not formed below. The area where the light-receiving portion 3 is not formed is the effective off-screen area. The peripheral portion 8b is the area with minimal impact on the generation of X-ray images. Therefore, based on the gradient shape of the peripheral portion 8b, the area on the scintillator layer 8 affected by the adverse effects of laser light can be limited during manufacturing. The gradient angle (angle θ) of the peripheral portion 8b is defined. First, a straight line connecting the height position of the scintillator 8a formed in the peripheral portion 8b from the inner side of the scintillator layer 8 outward is defined. The angle θ is the angle formed by this straight line with respect to the upper surface of the substrate 2. The angle θ is in the range of 20 degrees to 80 degrees.

[0059] A resin frame 9 is formed on the photoelectric conversion element array 7. Viewed from the stacking direction A of the scintillator layer 8, the resin frame 9 passes between the scintillator layer 8 and the pad 5 and surrounds the scintillator layer 8. The corners of the resin frame 9 are convex arc-shaped, pointing outwards. The resin frame 9 is, for example, a silicone resin. The corners of the resin frame 9 may also be a so-called R (bevel) shape.

[0060] The central portion of the resin frame 9 is higher than its two edges. The height d1 of the resin frame 9 is lower than the height d of the scintillator layer 8. This allows for miniaturization of the resin frame 9. Furthermore, the adverse effects of laser light on the scintillator layer 8 can be suppressed during manufacturing. The height d1 of the resin frame 9 is the distance from the position of the upper surface of the photoelectric conversion element array 7 to the position of the apex of the resin frame 9. The height d of the scintillator layer 8 is the maximum height of the scintillator 8a contained within the scintillator layer 8.

[0061] From the viewpoint of miniaturizing the radiation detector 1, the resin frame 9 is preferably made as small as possible. More specifically, the height d1 of the resin frame 9 is 100 μm or more. Furthermore, the height d1 of the resin frame 9 is 300 μm or less. Also, the width d2 of the resin frame 9 is 700 μm or more. The width d2 of the resin frame 9 is 1000 μm or less. The width d2 of the resin frame 9 is the width between the inner edge E1 and the outer edge E2 of the resin frame 9. The inner edge E1 is the edge on the scintillator layer 8 side. The outer edge E2 is the edge on the pad 5 side.

[0062] The distance from the inner edge E1 of the resin frame 9 to the outer edge E3 of the scintillator layer 8 is the first distance D1. The distance from the outer edge E2 of the resin frame 9 to the outer edge E4 of the photoelectric conversion element array 7 is the second distance D2. The first distance D1 is shorter than the second distance D2. From the viewpoint of suppressing the adverse effects of laser on the pads 5 during manufacturing and ensuring the effective area of ​​the scintillator layer 8, the ratio of the second distance D2 to the first distance D1 is preferably 5 or more. More specifically, the first distance D1 is preferably 1 mm or less. The second distance D2 is preferably 5 mm or more. This is based on the following reasons.

[0063] When there is no gap between the outer edge E3 of the scintillator layer 8 and the inner edge E1 of the resin frame 9, the effective area of ​​the scintillator layer 8 can be maximized. However, the adverse effects of the laser on the scintillator layer 8 must be considered during manufacturing. Furthermore, there is a concern about slight failures in the process of forming the resin frame 9. Slight failures refer to, for example, the formation of the resin frame 9 on the scintillator layer 8. Considering these factors, the first distance D1 is preferably set to a range of 1 mm or less. The second distance D2 is set to a range of 5 mm or more. As a result, since the adverse effects of the laser on the pads 5 during manufacturing are taken into account, a sufficient distance can be ensured between the resin frame 9 and the pads 5.

[0064] The scintillator layer 8 is covered by a protective film 13. The protective film 13 comprises a first organic film 10, an inorganic film 11, and a second organic film 12. These films are stacked sequentially from the scintillator layer 8 side. The first organic film 10, the inorganic film 11, and the second organic film 12 are all permeable to X-rays. Furthermore, the first organic film 10, the inorganic film 11, and the second organic film 12 can block water vapor. Specifically, the first organic film 10 and the second organic film 12 can be made of parylene resin or polychloroparaxylene, etc. The inorganic film 11 can be transparent, opaque, or reflective. The inorganic film 11 can be made of oxide films such as silicon (Si), titanium (Ti), chromium (Cr), or metal films such as gold, silver, or aluminum (Al). For example, using an inorganic film 11 that reflects light as a metal film can prevent fluorescence leakage generated in the scintillator 8a. As a result, the detection sensitivity of the radiation detector 1 can be increased. In this embodiment, an example is described regarding the use of easily formable aluminum (Al) as the inorganic film 11. Aluminum (Al) is easily corroded in air. However, the inorganic film 11 is sandwiched between the first organic film 10 and the second organic film 12. Therefore, the inorganic film 11 using aluminum (Al) can prevent corrosion.

[0065] The protective film 13 can be formed, for example, by CVD. Therefore, immediately after its formation, the protective film 13 covers the entire surface of the photoelectric conversion element array 7. To expose the pads 5, the protective film 13 is cut at a position further inward than the pads 5 of the photoelectric conversion element array 7. Furthermore, a portion of the protective film 13 further outward than the cut position is removed. As described later, the protective film 13 is cut using a laser near the outer edge of the resin frame 9, and the outer edge 13a of the protective film 13 is fixed by the resin frame 9. This prevents peeling of the protective film 13 from the outer edge 13a. The cutting of the protective film 13 can also be performed using, for example, a carbon dioxide laser. By using a carbon dioxide laser, the protective film 13 can be cut in a single scan. In other words, the protective film 13 can be cut in a short time. As a result, productivity can be improved. Alternatively, the cutting of the protective film 13 can also be performed using ultrashort pulse semiconductor lasers of the nanosecond or picosecond range. Furthermore, adverse effects on the photoelectric conversion element array 7, pad 5, and scintillator layer 8, for example, include thermal damage when using carbon dioxide lasers or ultrashort pulse lasers.

[0066] The outer edge 13a of the protective film 13 is located on the resin frame 9. The outer edge 13a is coated together with the resin frame 9 by a coating resin 14. The coating resin 14 is disposed along the resin frame 9. The coating resin 14 can be a resin with good adhesion to both the protective film 13 and the resin frame 9. For example, the coating resin 14 can be an acrylic adhesive. The coating resin 14 can also be the same silicone resin as the resin frame 9. The resin frame 9 can also be the same acrylic resin as the coating resin 14.

[0067] Secondly, refer to Figure 3 This section explains the corners (corner portions) of the resin frame 9 and the protective film 13. Figure 3 In order to make it easier to understand the state of the corners of the resin frame 9 and the protective film 13, the diagram of a part of the resin 14 is omitted.

[0068] As will be described in detail later, in the manufacturing process of the radiation detector 1, a laser is irradiated onto the protective film 13 on the resin frame 9. As a result, the portion of the protective film 13 irradiated by the laser is cut off. The protective film 13 is very thin. Therefore, the portion of the resin frame 9 is also cut off by the laser beam of the carbon dioxide gas. As a result, a groove 30 is formed in a corresponding region near the center of the resin frame 9. The outer edge 13a of the protective film 13 of the resin frame 9 is processed by laser. In addition, the groove 30 is also processed by laser. Here, the depth (height) d3 of the groove 30 is less than 1 / 3 of the height d1 of the resin frame 9. As a result, the adverse effects of the laser on the photoelectric conversion element array 7 located below the resin frame 9 can be suppressed.

[0069] like Figure 3 As shown, the outer edge 13a and groove 30 of the protective film 13 after laser processing, when viewed from the stacking direction A of the scintillator layer 8, appear as a slightly rectangular ring with convex arc-shaped corners on the outer side. The arc-shaped corners are as follows: Figure 3 As shown in region B, the outer edge 13a and the surface shape of the groove 30 of the protective film 13, when viewed from the lamination direction A, exhibit a slightly wavy shape. The surface shape of the outer edge 13a and the groove 30 of the protective film 13 differs from a flat cross-section formed by a cutting object such as a knife. The surfaces of the outer edge 13a and the groove 30 of the protective film 13 have minute irregularities. This increases the contact area between the outer edge 13a of the protective film 13 and the coating resin 14. Therefore, the adhesion of the coating resin 14 to the outer edge 13a of the protective film 13 can be made stronger. Furthermore, the contact area between the groove 30 and the coating resin 14 is also increased. Therefore, the adhesion of the coating resin 14 to the groove 30 can also be made stronger.

[0070] like Figure 1 As shown, the groove 30 provided in the resin frame 9 comprises three parts corresponding to the process of forming the groove 30. Specifically, the groove 30 includes a front irradiation section Rs, a main irradiation section Ra, and a rear irradiation section Re. In the repeating region 31, the front irradiation section Rs and the rear irradiation section Re are repeated. The front irradiation section Rs, the main irradiation section Ra, and the rear irradiation section Re will be described in detail later.

[0071] The operation of the radiation detector 1 in this embodiment is explained. X-rays (radiation) incident from the incident surface pass through the protective film 13 and reach the scintillator 8a. The X-rays are absorbed by the scintillator 8a. The scintillator 8a emits light proportional to the amount of X-rays absorbed. Of the emitted light, light traveling in the opposite direction to the direction of the X-ray incident is reflected by the inorganic film 11. As a result, almost all the light generated in the scintillator 8a is incident on the photoelectric conversion element 3a via the passivation film 6. The photoelectric conversion element 3a generates an electrical signal corresponding to the amount of incident light through photoelectric conversion. The electrical signal is accumulated over a certain period of time. The amount of light corresponds to the amount of incident X-rays. That is, the electrical signal accumulated in the photoelectric conversion element 3a corresponds to the amount of incident X-rays. Therefore, an image signal corresponding to the X-ray image is obtained through this electrical signal. The image signal accumulated in the photoelectric conversion element 3a is sequentially read out from the pad 5 via the signal line 4. The read-out image signal is transmitted to the outside. The transmitted image signal is processed through a defined processing loop. The result is represented as an X-ray image.

[0072] <Manufacturing Method of Radiation Detector>

[0073] Secondly, refer to Figures 14 to 13The manufacturing method of the radiation detector 1 according to this embodiment will be described. First, as follows... Figure 4 As shown in (a), the photoelectric conversion element array 7 is prepared (step S1). Next, as... Figure 4 As shown in (b), a (stacked) scintillator layer 8 is formed (step S2). Specifically, columnar crystals of cesium iodide (CsI) doped with thallium (Tl) are grown in the region covering the light-receiving portion 3 on the photoelectric conversion element array 7. The growth of the columnar crystals can be achieved, for example, by vapor deposition. The thickness of the columnar crystals of cesium iodide (CsI) is, for example, about 600 μm.

[0074] Secondly, such as Figure 5 As shown in (a), a resin frame 9 is formed on the photoelectric conversion element array 7 (step S3). Specifically, the resin frame 9 is formed such that, when viewed from the stacking direction A of the scintillator layer 8, it passes between the scintillator layer 8 and the pad 5 and surrounds the scintillator layer 8. More specifically, the resin frame 9 is formed at a position where the first distance D1 is less than 1 mm and the second distance D2 is more than 5 mm. The resin frame 9 can be formed using, for example, an automatic XY coating apparatus. Hereinafter, for ease of explanation, the scintillator layer 8 and the resin frame 9 formed on the photoelectric conversion element array 7 will be referred to simply as the [substrate].

[0075] Furthermore, in step S3, in addition to the resin frame 9, a shielding member as shown in the second embodiment may also be configured (see reference). Figure 20 (a)). The masking member is a pad 5 configured to cover the outer area of ​​the resin frame 9. The masking member is used to protect the surface of the pad 5. When the masking member is configured, in step S6 of removing the outer portion of the protective film 13, which will be described later, the masking member and the protective film 13 are removed together.

[0076] Secondly, such as Figure 5 As shown in (b), the first organic film 10 is formed (step S4a). The cesium iodide (CsI) used to form the scintillator layer 8 is highly hygroscopic. Therefore, if the scintillator layer 8 is left exposed, it will absorb water vapor from the air. As a result, the scintillator layer 8 dissolves. Therefore, for example, a CVD method is used to coat the entire surface of the substrate with parylene. The thickness of the parylene is preferably 5 μm or more and 25 μm or less.

[0077] Then, as Figure 6 As shown in (a), an inorganic film 11 is formed to form a metal film (step S4b). Specifically, an aluminum film with a thickness of 0.2 μm is deposited on the surface of the first organic film 10 on the radiation incident surface side by vapor deposition. The radiation incident surface refers to the surface of the radiation detector 1 on the side where the scintillator layer 8 is formed. Next, as... Figure 6As shown in (b), a second organic film 12 is formed (step S4c). Specifically, the entire surface of the substrate on which the inorganic film 11 is formed is coated again with parylene using a CVD method. The thickness of the parylene is preferably 5 μm or more and 25 μm or less. The second organic film 12 is to prevent deterioration caused by corrosion of the inorganic film 11. A protective film 13 is formed through steps S4a, S4b, and S4c. The portion of the protective film 13 slightly outside the central portion of the resin frame 9 is removed by a subsequent process. The portion of the protective film 13 slightly outside the central portion of the resin frame 9 refers to the portion covering the pad 5. Therefore, the first organic film 10 and the second organic film 12 may not need to be formed on the side of the photoelectric conversion element array 7. In addition, the first organic film 10 and the second organic film 12 may not need to be formed on the surface of the photoelectric conversion element array 7 opposite to the surface on which the scintillator layer 8 is stacked.

[0078] Next, as Figure 7 As shown, laser L is irradiated along the resin frame 9. As a result, the protective film 13 is cut (step S5). Specifically, a laser head (not shown) used to irradiate laser L is moved on a stage (not shown) on which the entire substrate on which the protective film 13 is formed is placed. As a result, laser L scans along the resin frame 9 in a single stroke.

[0079] The following is a reference. Figure 8 , Figure 9 , Figure 10 and Figure 11 While explaining in detail the process S5 of cutting the protective film 13.

[0080] Figure 8 This refers to the time history of the energy received by the irradiated object in process S5. In this specification, "[irradiated object]" refers to the protective film 13 and the resin frame 9. First, the cut-off threshold (threshold energy) is defined. The cut-off threshold is the value at which the irradiated object will be cut off if irradiated with energy exceeding this value. Furthermore, in this specification, "cut-off" means that a gap is formed in the irradiated object that extends from the surface receiving laser irradiation to the back surface of the surface receiving laser irradiation. Therefore, if the gap does not extend from the surface receiving laser irradiation to the back surface and has a bottom, it is not called "cut-off".

[0081] The cutting threshold is determined based on factors such as the type of material and the thickness of the object. The radiation detector 1 of the first embodiment includes a protective film 13 and a resin frame 9 as the irradiated object. In this case, two cutting thresholds are defined. Specifically, a cutting threshold Q1 for the protective film 13 and a cutting threshold Q2 for the resin frame 9 are defined. The cutting threshold Q2 for the resin frame 9 is larger than the cutting threshold Q1 for the protective film 13. In step S5, the protective film 13 is cut, but the resin frame 9 is not cut. Therefore, in step S5, the energy (Qs) of the laser to be irradiated is between the cutting threshold Q2 for the resin frame 9 and the cutting threshold Q1 for the protective film 13. Specifically, the energy (Qs) of the laser to be irradiated is smaller than the cutting threshold Q2 for the resin frame 9 and larger than the cutting threshold Q1 for the protective film 13.

[0082] The time history of energy includes: the period ts during which energy increases; the period ta during which energy is maintained; and the period te during which energy decreases.

[0083] The period ts during which energy is increased corresponds to the period of time Rs (refer to) the front irradiation section. Figure 1 The processing period (process S5s) is as follows. Period ts includes period ts1 and period ts2. Period ts1 is used to increase the energy from a value smaller than the cutting threshold Q1 (Q0) to become the cutting threshold Q1 of the protective film 13. Period ts2 is used to increase the energy from the cutting threshold Q1 of the protective film 13 to become the energy (Qs). The groove 30 formed during the energy-increasing period ts includes a front irradiation portion Rs, the depth of which gradually increases along the scanning direction of the laser.

[0084] Figure 9 (a) illustrates the processing during period ts. During period ts1, because the energy is lower than the cutting threshold Q1, the groove 30 does not reach the resin frame 9. Furthermore, as the laser scan progresses, the energy increases. Then, when the energy reaches the cutting threshold Q1, the groove 30 penetrates the protective film 13. That is, the groove 30 reaches the surface of the resin frame 9. Additionally, during period ts2, the groove 30 reaches the specified depth.

[0085] The period ta during which energy is maintained corresponds to the period Ra of the main irradiated section (see reference). Figure 1 The processing period (process S5a) is during which the process is carried out. The period ta corresponds to the time during which the process concerning... Figure 1 The processing period of the main irradiation section Ra is shown. Therefore, during this period, the energy (Qs) of ta is greater than the cutting threshold Q1 of the protective film 13 and smaller than the cutting threshold Q2 of the resin frame 9. During the period of maintaining the energy, the depth d3 of the main irradiation section Ra of the groove 30 formed by ta is approximately constant along the scanning direction of the laser.

[0086] Figure 9 (b) and Figure 9 (c) indicates the processing of ta during the period. Figure 9 (b) represents the state after the main irradiation unit Ra has just started operation. Figure 9 (c) indicates the state just before the processing of the main irradiation section Ra is about to end. Thus, the energy (Qs) is set to cut the resin frame 9 to a predetermined depth. Therefore, even if there is a slight increase or decrease in the thickness of the protective film 13, the protective film 13 can be reliably cut if the increase or decrease is smaller than the increase or decrease corresponding to the depth.

[0087] The period during which energy is reduced (te) corresponds to the period after the irradiation (Re) (see reference). Figure 1 The processing period (process S5e) includes period te2 and period te1. Period te2 is used to reduce the energy (Qs) to the cutting threshold Q1 of the protective film 13. Period te1 is used to reduce the energy from the cutting threshold Q1 of the protective film 13 to a value (Q0) smaller than the cutting threshold Q1. The groove 30 formed during the energy reduction period te includes a back irradiation portion Re, the depth of which gradually decreases along the scanning direction of the laser.

[0088] Figure 10 (a) and Figure 10 (b) represents the processing pattern during period te. During period te, the energy (Qs) gradually decreases. For example... Figure 10 As shown in (a), the depth of the resin frame 9 in groove 30 gradually decreases. Furthermore, a portion of period te repeats a portion of period ts in the laser scanning direction. That is, as... Figure 10 As shown in (b), the portion that has already been irradiated by laser during period ts is irradiated by laser again during period te. Thus, in the area that has been irradiated by laser twice, the depth of the groove 30 gradually increases before the second irradiation. For this shape, the laser energy is controlled during the second irradiation to make the depth of the formed groove 30 gradually decrease. Therefore, the portion P remaining after the first irradiation is removed by the second irradiation. As a result, the protective film 13 is penetrated, and the resin frame 9 is excavated to the specified depth.

[0089] Furthermore, the depth W1 of the portion formed by ts and te during the period can be the same as or different from the depth W2 of the portion formed by ta during the period. In other words, depth W2 can be smaller than depth W1. Alternatively, depth W2 can be larger than depth W1.

[0090] like Figure 8The energy history per unit shown can be achieved by selecting one control variable from a set of control variables. Alternatively, the energy history per unit can also be achieved by combining multiple control variables.

[0091] As control variables, examples include the moving speed of the laser head, the irradiation energy of the laser, and the focal position of the laser.

[0092] Figure 11 (a) is used to implement Figure 8 Examples of the history of the laser head's movement speed per unit energy. During the period ts, the speed decreases simultaneously with the passage of time (V0→Vs). During the period ta, the speed is maintained (Vs). During the period te, the speed increases simultaneously with the passage of time (Vs→V0).

[0093] Figure 11 (b) is used to achieve Figure 8 Examples of the irradiation energy history of a laser head per unit energy. During period ts, the energy increases (Q0→Qs) as time elapses. During period ta, the energy is maintained (Qs). During period te, the energy decreases (Qs→Q0) as time elapses.

[0094] Figure 11 (c) is used to implement Figure 8 Examples of the history of the focal position of a laser with unit energy. During period ts, as time elapses, the focal position is brought closer to the surface of the irradiated object (P0→Ps). During period ta, the focal position is maintained at the surface of the irradiated object (Ps). During period te, as time elapses, the focal position is moved away from the surface of the irradiated object (Ps→P0).

[0095] According to the laser control method, not only can the protective film 13 be reliably prevented from penetrating the resin frame 9, but the laser can also be reliably cut through the protective film 13 without causing damage to the surface of the photoelectric conversion element array 7 with the resin frame 9 due to laser irradiation. Therefore, the generation of defective products can be suppressed, and productivity can be improved.

[0096] In addition, when performing process S5, besides the control method described above, the following control can also be performed.

[0097] The premise of this control is that the time point at which laser irradiation begins and the time point at which the laser head begins to move are simultaneous. For example, shifting the time point at which the laser head begins to move from the time point at which laser irradiation begins can prevent excessive energy from being applied to the irradiated object.

[0098] For example, when starting laser irradiation, proceed as follows: First, begin moving the laser head ( Figure 12(a) of t0). At this time, laser irradiation has not yet begun (see reference). Figure 12 (b) Laser head 300). Simultaneously with the passage of time (t0→t1), the speed of the laser head increases. Then, when the speed of the laser head reaches a predetermined value (Va), laser irradiation L begins (refer to...). Figure 12 (a) of ts, Figure 12 (b) Laser head 300). This specified value can be a constant speed (Vs) or a value that is larger than the speed threshold (V1) and smaller than the constant speed (Vs). That is, the time point (ts) at which laser irradiation begins is set later than the time point (t0) at which the laser head begins to move. Because the time point at which laser irradiation begins is later than the time point at which the laser head begins to move, this control is called [delay control].

[0099] Furthermore, when laser irradiation ends, the time point for stopping laser irradiation is set earlier than the time point for stopping the movement of the laser head. For example, laser irradiation can be stopped when the speed of the laser head is constant (Vs). During the period of decelerating the speed of the laser head, laser irradiation can also be stopped at a speed that allows irradiation of unit energy below the cutting threshold Q1 of the resin frame 9. In addition, if the speed of the laser head increases, the energy per unit length decreases. Therefore, it is also possible to increase the speed of the laser head while stopping laser irradiation.

[0100] According to the laser control method, not only the protective film 13 can be protected, but the laser can also be more reliably prevented from reaching the resin frame 9. That is, the protective film 13 can be reliably cut off, and the surface of the photoelectric conversion element array 7 with the resin frame 9 will not be damaged by laser irradiation. Therefore, the generation of defective products can be suppressed, and productivity can be improved.

[0101] Furthermore, the delay control was not based on Figure 8 The energy history shown is subject to control. Delay control can also be used independently.

[0102] By performing the above process S5, the protective film 13 can be cut off.

[0103] Secondly, such as Figure 13 As shown in (a), the pad 5 is exposed by removing the portion outside the cut portion of the protective film 13 from the laser L (step S6). The portion outside the cut portion includes the portion opposite to the injection surface. Next, as... Figure 13As shown in (b), uncured resin material is applied along the resin frame 9 (step S7). The uncured resin material is formed to cover the outer edge 13a of the protective film 13 and the resin frame 9. The uncured resin material is, for example, an ultraviolet-cured acrylic resin. Then, the uncured resin material is irradiated with ultraviolet light. As a result, the resin material cures, thus forming a coating resin 14.

[0104] The protective film 13 may also be attached to the photoelectric conversion element array 7 via the resin frame 9 without the coating resin 14. However, by forming the coating resin 14, the protective film 13 containing the first organic film 10 is sandwiched between the resin frame 9 and the coating resin 14. That is, the protective film 13 is fixed. As a result, the adhesion of the protective film 13 to the photoelectric conversion element array 7 can be further improved. Therefore, the scintillator 8a is sealed by the protective film 13. As a result, moisture can be reliably prevented from penetrating the scintillator 8a. That is, the degradation of the scintillator 8a due to moisture absorption can be prevented, thus preventing a decrease in the resolution of the element.

[0105] In the first embodiment, the panel protection portion is a resin frame 9. The panel protection portion can also be constructed from multiple components. For example, the panel protection portion may include: a resin frame 9; and a shielding member adhered to the resin frame 9. According to this structure, when laser irradiation occurs (step S5), a panel protection portion formed by the resin frame 9 and the shielding member is formed. Therefore, laser irradiation can significantly ensure the distance from the protective film 13 to the photoelectric conversion element array 7. As a result, the influence of laser irradiation on the photoelectric conversion element array 7 can be suppressed more reliably.

[0106] <Effects>

[0107] The following explains the effects of this embodiment. As described in the technical problem section, there may be slight differences between the preset laser irradiation method and the actual operation. First, an example will be given to illustrate this point.

[0108] When laser irradiation begins, the laser energy on the surface of the irradiated object rises from zero (non-irradiation) to a specified energy over a specified time period. Figure 14 (a) t1) is the time it takes for the laser head to move from zero to the specified speed. Figure 14 (b) The t1 to t3) is much shorter.

[0109] Therefore, the laser energy (Q3-Qs) received by the irradiated object per unit time (length) during the acceleration period (t1-t3) from zero to a specified speed is different from the laser energy (Qs) received by the irradiated object per unit time (length) during the constant period (t3-t4) when the laser head moves at the specified speed. Specifically, the laser head's speed (0-Vs) during the acceleration period (t1-t3) is slower than its speed (Vs) during the constant period (t3-t4). Therefore, the laser energy (Q3-Qs) received by the irradiated object during the acceleration period (t1-t3) is greater than that received during the constant period (t3-t4). Thus, if the laser head's speed is too slow during this acceleration period (t1-t3), there may be a situation where excessive energy is irradiated onto the irradiated object. If this energy exceeds the energy (Q2) at which the resin frame 9 is cut off, it may damage the photoelectric conversion element array 7 located under the resin frame 9.

[0110] The radiation detector 1 includes: a photoelectric conversion element array 7 having a light-receiving portion 3 comprising a plurality of photoelectric conversion elements 3a arranged in one or two dimensions, and a plurality of pads 5 electrically connected to the photoelectric conversion elements 3a and disposed outside the light-receiving portion 3; a scintillator layer 8, which is stacked on the photoelectric conversion element array 7 to cover the light-receiving portion 3 for converting radiation into light; a resin frame 9, which, when viewed from the stacking direction A of the scintillator layer 8, is separated from the scintillator layer 8 and the pads 5, passes between the scintillator layer 8 and the pads 5, and surrounds the scintillator layer 8; and a protective film 13, which covers the scintillator layer 8 and has an outer edge 13a located on the resin frame 9. A groove 30 is formed in the resin frame 9 that is continuous with the outer edge 13a of the protective film 13. The groove 30 includes: a front irradiation section Rs formed by scanning along the resin frame 9 while increasing the laser energy from a value (Q0) smaller than the cut threshold Q1 of the cutable protective film 13 to a value larger than the cut threshold Q1; a main irradiation section Ra formed by scanning along the resin frame 9 while maintaining the laser energy at a value (Qs) larger than the cut threshold Q1; and a rear irradiation section Re formed by scanning along the resin frame 9 while decreasing the laser energy from a value larger than the cut threshold Q1 to a value (Q0) smaller than the cut threshold Q1.

[0111] The groove 30 of the resin frame 9 of the radiation detector 1 is continuous with the outer edge 13a of the protective film 13. Therefore, the groove 30 is formed along with the formation of the outer edge 13a of the protective film 13 irradiated by the laser. When the groove is formed on the resin frame 9, the protective film 13 formed on the resin frame 9 is reliably cut off. In addition, in the front irradiation section Rs, irradiation begins with an energy Q0 that is smaller than the cutting threshold Q1. According to this irradiation method, laser irradiation can begin with a margin for the cutting threshold Q2 required to cut off the resin frame 9. Therefore, even if the energy supplied is larger than the set value due to unintentional reasons at the beginning of laser irradiation, the cutting of the resin frame 9 can be suppressed by ensuring a margin. Similarly, in the rear irradiation section Re, irradiation stops after the energy Q0 is reduced to a level smaller than the cutting threshold Q1. According to this irradiation method, laser irradiation can be stopped with a margin for the cutting threshold Q2 required to cut off the resin frame 9. Therefore, even if the energy supplied is unintentionally greater than the set value due to unintentional reasons after the laser irradiation stops, the cutting of the resin frame 9 can be suppressed by ensuring a margin. Thus, the unintentional cutting of the resin frame 9 can be suppressed.

[0112] The radiation detector 1 also includes a coating resin 14 covering the outer edge 13a of the protective film 13. This structure can suppress the peeling of the protective film 13.

[0113] The coating resin 14 also covers the resin frame 9. The edge 14e of the coating resin 14, which covers the surface in contact with the resin frame 9, is formed on the resin frame 9 and has adhesiveness and thixotropy that allows it to remain on the resin frame 9. According to this structure, the coating resin 14 will not reach the surface of the photoelectric conversion element array 7 located outside the resin frame 9, nor will it reach the pads 5. Therefore, the surface of the photoelectric conversion element array 7 and the pads 5 can be kept clean, respectively.

[0114] The central portion of the resin frame 9 is higher than the two edges of the resin frame 9. According to this structure, the coating resin 14 can reliably cover the outer edge 13a of the protective film 13.

[0115] The width of the resin frame 9 is greater than 700 micrometers and less than 1000 micrometers. Based on this structure, the radiation detector 1 can be miniaturized.

[0116] The height of the resin frame 9 is greater than 100 micrometers and less than 300 micrometers. Based on this structure, the radiation detector 1 can be miniaturized.

[0117] A method for manufacturing a radiation detector 1 includes: a step S2 of preparing a light-receiving part 3 having a plurality of photoelectric conversion elements 3a arranged in one or two dimensions, and a plurality of pads 5 electrically connected to the photoelectric conversion elements 3a and disposed on the outside of the light-receiving part 3; a step S3 of stacking a scintillator layer 8 that converts radiation into light onto the photoelectric conversion element array 7 such that it covers the light-receiving part 3; a step S4a, S4b, and S4c of disposing a resin frame 9 on the photoelectric conversion element array 7 such that it surrounds the scintillator layer 8 when viewed from the stacking direction of the scintillator layer 8; a step S5 of forming a protective film 13 such that it covers the entire surface of the photoelectric conversion element array 7 on the side where the scintillator layer 8 is stacked and the surface of the resin frame 9; a step S5 of cutting the protective film 13 by irradiating the resin frame 9 with a laser; and a step S6 of removing the outer portion of the protective film 13. The process S5 for cutting the protective film 13 includes: a pre-irradiation process S5s in which the laser energy is increased from a value smaller than the cutting threshold Q1 of the protective film 13 to a value larger than the cutting threshold Q1 while scanning along the resin frame 9; a main irradiation process S5a in which the laser energy is maintained at a value larger than the cutting threshold Q1 while scanning along the resin frame 9; and a post-irradiation process S5e in which the laser energy is decreased from a value larger than the cutting threshold Q1 to a value smaller than the cutting threshold Q1 while scanning along the resin frame 9.

[0118] In the manufacturing method of the radiation detector 1, in the step S5 of cutting the protective film 13, the outer edge 13a of the protective film 13 is formed, and the groove 30 of the resin frame 9 is formed. Furthermore, with the groove 30 formed on the resin frame 9, the protective film 13 formed on the resin frame 9 is reliably cut off. The groove 30 includes a pre-irradiation step S5s formed while increasing energy, and a post-irradiation step S5e formed while decreasing energy. Depending on the pre-irradiation portion Rs and the post-irradiation portion Re, the depth of the groove 30 will not become excessively deep. Therefore, unintentional cutting of the resin frame 9 can be suppressed. As a result, not only the protective film 13, but also laser penetration into the resin frame 9 can be reliably prevented.

[0119] That is, the protective film 13 can be reliably cut without causing damage to the surface of the photoelectric conversion element array 7 with the resin frame 9 caused by laser irradiation. Therefore, the generation of defective products can be suppressed, and productivity can be improved.

[0120] In the manufacturing method of the radiation detector 1, the panel protection part is a resin frame 9. In the process of arranging the resin frame 9, the resin frame 9 is arranged on the photoelectric conversion element array 7 in a manner that separates it from the scintillator layer 8 and the pads 5, passes between the scintillator layer 8 and the pads 5, and surrounds the scintillator layer 8. According to this process S3, the radiation detector 1 having the resin frame 9 can be manufactured.

[0121] The first embodiment of the present invention has been described in detail above. However, the present invention is not limited to the first embodiment. Various modifications can be made to the present invention without departing from its technical concept.

[0122] The radiation detector of the present invention has been described in detail above according to the first embodiment. However, the radiation detector of the present invention is not limited to the first embodiment. Various modifications can be made to the present invention without departing from its technical concept. For example, the protective film 13 has a structure in which an inorganic film 11 is sandwiched between a first organic film 10 made of parylene and a second organic film 12. That is, the material of the first organic film 10 is the same as the material of the second organic film 12. For example, the material of the first organic film 10 may also be different from the material of the second organic film 12. In addition, when a highly corrosive material is used as the inorganic film 11, the second organic film 12 may be omitted from the protective film 13. The light-receiving part 3 of the radiation detector 1 has a plurality of photoelectric conversion elements 3a arranged in two dimensions. The light-receiving part 3 may also have a plurality of photoelectric conversion elements 3a arranged in one dimension. The pads 5 may also be formed on two sides of the rectangular radiation detector 1. Furthermore, the pads 5 may also be formed on three sides of the rectangular radiation detector 1. In addition, in the first embodiment, a method for performing laser processing by moving the laser head was described. For example, laser irradiation can be performed while the stage on which the radiation detector 1 is mounted is moved.

[0123] <Second Implementation Method>

[0124] The following describes the radiation detector 1A according to the second embodiment and its manufacturing method. The radiation detector 1 of the first embodiment uses a resin frame 9 as a panel protection part. Specifically, during the manufacturing process of the radiation detector 1, in the step of cutting the protective film 13, the resin frame 9 is used as a component to protect the photoelectric conversion element array 7 from laser influence. The radiation detector 1 includes the resin frame 9 as a constituent element.

[0125] The radiation detector 1A of the second embodiment uses a shielding member M1 (see reference). Figure 20 (etc.), when the protective film 13 is cut, it serves as a component to protect the photoelectric conversion element array 7 from the influence of laser. The shielding component M1 is removed after the step S15 of cutting the protective film 20. The radiation detector 1A does not include the shielding component M1 as a component.

[0126] like Figure 15 and Figure 16 As shown, the radiation detector 1A includes: a photoelectric conversion element array 7, a scintillator layer 8, and a protective film 20. The photoelectric conversion element array 7 and the scintillator layer 8 are the same as in the first embodiment. Therefore, a detailed description of the photoelectric conversion element array 7 and the scintillator layer 8 is omitted. Hereinafter, the protective film 20 will be described in detail.

[0127] The protective film 20 has a body portion 21 and an outer edge portion 22. The body portion 21 covers the scintillator layer 8. A first organic film 10 of the body portion 21 is provided on the scintillator layer 8. The first organic film 10 can be embedded between each of the plurality of scintillators 8a in a columnar structure. The outer edge portion 22 is provided on the outside of the body portion 21. The outer edge portion 22 is continuous with the body portion 21.

[0128] The outer edge 22 has a contact portion 23 and an extension portion 24. The contact portion 23 is located in region K between the scintillator layer 8 and the pad 5, and is in close contact with the photoelectric conversion element array 7. For example, a portion of the first organic film 10 on the scintillator layer 8 side of the contact portion 23 has a surface that is in close contact with the photoelectric conversion element array 7. As a result, the contact portion 23 is in close contact with the photoelectric conversion element array 7. By increasing the contact surface, the adhesion of the photoelectric conversion element array 7 to the contact portion 23 can be improved. In other words, increasing the contact surface means increasing the length g1+g2 of the contact portion.

[0129] The adhering portion 23 has a first portion 23a and a second portion 23b. The first portion 23a is located on the side of the body portion 21. The first portion 23a has a first organic film 10, an inorganic film 11, and a second organic film 12. The first portion 23a has a three-layer structure. The second portion 23b is located on the opposite side of the body portion 21, separated from the first portion 23a. The second portion 23b has a first organic film 10 and a second organic film 12. The second portion 23b has a two-layer structure. The outer edge end 11a of the inorganic film 11 is located further inward than the outer edge end 20a of the protective film 20. In other words, it is located on the side of the scintillator layer 8. In the first portion 23a, the inorganic film 11 is sandwiched between the outer edge end 10b of the first organic film 10 and the outer edge end 12b of the second organic film 12. The second part 23b is located further outward than the outer edge 11b of the inorganic film 11. In other words, the second part 23b is located closer to the pad 5 than the outer edge 11b of the inorganic film 11. The outer edge 10b of the first organic film 10 is joined to the outer edge 12b of the second organic film 12 at the second part 23b. When the first organic film 10 and the second organic film 12 are made of the same material, the first organic film 10 and the second organic film 12 can also be integrated. At the bonding portion 23, the outer edges 10b of the first organic film 10 and the outer edges 12b of the second organic film 12 cooperate to surround the outer edge 11b of the inorganic film 11.

[0130] The extension 24 has a two-layer structure consisting of a first organic film 10 and a second organic film 12. The extension 24 extends from the adhesive portion 23 toward the opposite side of the photoelectric conversion element array 7 in a self-standing state. The extension 24 is located on the outermost edge 20a side of the protective film 20. The outer edge 10a of the first organic film 10 and the outer edge 12a of the second organic film 12 constitute the outer edge 20a of the protective film 20. The extension 24 has a standing portion 24a and a sheet portion 24b. The standing portion 24a extends toward the normal direction of the surface of the photoelectric conversion element array 7, with the portion of the adhesive portion 23 opposite to the main body portion 21 as its base end. Here, "self-standing state" refers to the state in which the standing portion 24a can stand upright without being held or supported by a certain component. Such a component is, for example, resin. The base end portion of the standing portion 24a is connected to the adhesive portion 23. The portion of the erected part 24a other than its base portion does not come into contact with any element of the radiation detector 1A.

[0131] The upright portion 24a extends in a self-standing state in the normal direction of the surface of the photoelectric conversion element array 7. In other words, the upright portion 24a stands upright from the photoelectric conversion element array 7. However, the extending direction of the upright portion 24a is not limited to this. The upright portion 24a may extend in a self-standing state along a direction intersecting the direction parallel to the surface of the photoelectric conversion element array 7. For example, the upright portion 24a may also be inclined towards the pad 5 side based on the upright state of the photoelectric conversion element array 7. The upright portion 24a may also be inclined towards the scintillator layer 8 side based on the upright state of the photoelectric conversion element array 7. In addition, the shape of the upright portion 24a is not limited to a plane. The shape of the upright portion 24a may also be a curved surface, for example.

[0132] The plate portion 24b protrudes from the upper part of the upright portion 24a toward the pad 5. The direction in which the plate portion 24b protrudes is parallel to the surface of the photoelectric conversion element array 7. However, the direction in which the plate portion 24b protrudes is not limited to being parallel to the surface of the photoelectric conversion element array 7. The direction in which the plate portion 24b protrudes may differ from the direction in which the upright portion 24a extends. For example, the plate portion 24b may be inclined to gradually approach the photoelectric conversion element array 7, based on a state of being parallel to the surface of the photoelectric conversion element array 7. Alternatively, the plate portion 24b may be inclined to gradually separate from the photoelectric conversion element array 7. Furthermore, the shape of the plate portion 24b is not limited to a plane. The shape of the plate portion 24b may, for example, be a curved surface.

[0133] exist Figure 16In this text, lengths g1 and g2 represent the lengths of the contact portion 23. Specifically, length g1 represents the length of the first portion 23a of the contact portion 23. Length g2 represents the length of the second portion 23b of the contact portion 23. The total length of lengths g1 and g2 is, for example, approximately 1000 μm. Alternatively, the total length of lengths g1 and g2 is, for example, less than 1000 μm. Length g3 is the height of the raised portion 24a. In other words, length g3 is the height of the extension portion 24. Length g3 is, for example, more than 80 μm and less than 250 μm. Length g4 represents the length of the sheet portion 24b of the extension portion 24. Length g4 is, for example, approximately 300 μm. Alternatively, length g4 is, for example, less than 300 μm. Length g5 is the distance from the boundary between the contact portion 23 and the extension portion 24 to the pad 5. Length g5 is longer than length g4. For example, the length g5 is longer than the length g4 by tens to hundreds of μm. According to this structure, the extension 24 will not interfere with the pad 5.

[0134] Describe the external shape of the radiation detector 1A. Figure 17 This is a three-dimensional view schematically showing the corner portion of the radiation detector 1A. Figure 18 It is a schematic representation of from and Figure 17 Stereoscopic views of the angular portion of the radiation detector 1A viewed from different angles. Furthermore, in Figure 18 In the diagram, a cross-section of the scintillator layer 8, covered by the protective film 20, is shown to reveal its structure. Figure 18 The dashed lines represent multiple scintillators 8a with a columnar structure. From Figure 17 and Figure 18 It can also be seen that the outer edge 22 of the protective film 20 has a close-fitting portion 23 and an extension portion 24. The upright portion 24a is inclined toward the pad 5. In addition, the sheet portion 24b may also be inclined toward the pad 5. Furthermore, the connection between the upright portion 24a and the sheet portion 24b is not bent at a right angle. In other words, the connection between the upright portion 24a and the sheet portion 24b may be smoothly bent.

[0135] <The Function and Effects of Radiation Detectors>

[0136] The effects of the radiation detector 1A are explained below. In the radiation detector 1A, the outer edge 22 of the protective film 20 covering the scintillator layer 8 has a close-fitting portion 23 that is in close contact with the photoelectric conversion element array 7. The close-fitting portion 23 prevents moisture from entering the scintillator layer 8 from between the protective film 20 and the photoelectric conversion element array 7. Furthermore, the outer edge 22 of the protective film 20 has an extension 24. The extension 24 extends in a self-standing state in the direction opposite to that from the close-fitting portion 23 towards the photoelectric conversion element array 7. If the outer edge 22 of the protective film 20 does not have the extension 24, the outer edge end 20a of the protective film 20 is contained within the close-fitting portion 23. In this case, in particular, the close contact between the portion of the close-fitting portion 23 containing the outer edge end 20a of the protective film 20 and the photoelectric conversion element array 7 becomes difficult to ensure. As a result, moisture easily penetrates into the scintillator layer 8 from the boundary between the close-fitting portion 23 and the photoelectric conversion element array 7.

[0137] In contrast, the outer edge 22 of the protective film 20 of the radiation detector 1A has an extension 24. The outer edge 20a of the protective film 20 is not included in the contact portion 23. That is, the contact portion 23 and the photoelectric conversion element array 7 can be sufficiently ensured. As a result, the moisture resistance of the scintillator layer 8 can be improved compared to the case without the extension 24. Therefore, even if the outer edge of the protective film 20 is not held by the resin member (resin frame 9) as in the first embodiment, the moisture resistance of the scintillator layer 8 can be maintained. Furthermore, since it is not necessary to provide a resin member to support the outer edge of the protective film 20, the region K between the scintillator layer 8 and the pad 5 can be narrowed. For example, when the width of the resin frame 9 is about 900 μm, the region K can be reduced to a length equivalent to the width of the resin frame 9. Therefore, according to the radiation detector 1A, both the moisture resistance of the scintillator layer 8 and the expansion of the region K between the scintillator layer 8 and the pad 5 can be ensured. In other words, the radiation detector 1A can reduce the region K. As a result, the length of the signal line 4 that electrically connects the light-receiving part 3 to the pad 5 can be shortened. Therefore, the transmission time of the electrical signal can be shortened. In addition, since the signal line 4 is shortened, the increase in noise can be suppressed.

[0138] The protective film 20 includes an inorganic film 11, a first organic film 10, and a second organic film 12. The first organic film 10 is disposed on the side of the scintillator layer 8 opposite to the inorganic film 11. The second organic film 12 is disposed on the opposite side of the scintillator layer 8 opposite to the inorganic film 11. By including the inorganic film 11 in the protective film 20, light generated in the scintillator layer 8 can be prevented from leaking to the outside. In other words, light generated in the scintillator layer 8 can be prevented from leaking to parts other than the light-receiving part 3. As a result, the sensitivity of the radiation detector 1A can be increased. The first organic film 10 and the second organic film 12 are disposed on both sides of the inorganic film 11. According to this structure, the first organic film 10 and the second organic film 12 can also protect the inorganic film 11.

[0139] The outer edge 11a of the inorganic membrane 11 is located further inward than the outer edge 20a of the protective membrane 20. The outer edge 10a of the first organic membrane 10 and the outer edge 12a of the second organic membrane 12 constitute the outer edge 20a of the protective membrane 20. The outer edge 10b of the first organic membrane 10 is located further outward than the outer edge 11a of the inorganic membrane 11 and is joined to the outer edge 12b of the second organic membrane 12. The outer edge 10b of the first organic membrane 10 and the outer edge 12b of the second organic membrane 12 cover the outer edge 11b of the inorganic membrane 11. For example, even if the adhesion between the inorganic membrane 11 and the first organic membrane 10 is poor, or the adhesion between the inorganic membrane 11 and the second organic membrane 12 is poor, the outer edge 11b of the inorganic membrane 11 can still be sealed by the outer edge 10b of the first organic membrane 10 and the outer edge 12b of the second organic membrane 12. Therefore, the adhesion of the second organic membrane 12 to the first organic membrane 10 can be ensured.

[0140] The inorganic film 11 is a metallic film made of aluminum or silver. Therefore, the light reflectivity of the inorganic film 11 can be made good.

[0141] The height of the extension 24 is between 80 μm and 250 μm. Therefore, the moisture resistance of the scintillator layer 8 can be more reliably ensured.

[0142] The extension 24 has a raised portion 24a and a sheet portion 24b. The sheet portion 24b protrudes from the upper part of the raised portion 24a toward the pad 5. The extension 24 has not only a raised portion 24a but also a sheet portion 24b. Therefore, the outer edge 20a of the protective film 20 can be sufficiently far away from the contact portion 23. As a result, the adhesion of the photoelectric conversion element array 7 to the contact portion 23 can be more reliably ensured. Even in this case, the length of the sheet portion 24b is, for example, about 300 μm. Or, the length of the sheet portion 24b is, for example, 300 μm or less. Therefore, the area K between the scintillator layer 8 and the pad 5 can be reduced.

[0143] For example, during the wiring process, when conductive components such as wires are bonded to pads 5, there is a possibility that foreign objects or the like may fly from the bonding portion toward the scintillator layer 8. Even in this case, the extension 24 can function as a protective wall to prevent damage to the scintillator layer 8 from foreign objects or the like. Thus, contamination of the scintillator layer 8 can be prevented during bonding.

[0144] The photoelectric conversion element array 7 is also expensive. If, due to inspections during the manufacturing process, the radiation detector 1A fails to meet quality standards, the photoelectric conversion element array 7 may be reused. In this case, the scintillator layer 8 provided on the photoelectric conversion element array 7 is removed, and a new scintillator layer 8 is provided on the photoelectric conversion element array 7. Therefore, the protective film 20 must be removed. According to the radiation detector 1A of this embodiment, the outer edge 22 of the protective film 20 has an extension 24. For example, when peeling the protective film 20 from the photoelectric conversion element array 7, the extension 24 can be held and lifted upwards, using the extension 24 as the starting point for peeling. Therefore, the protective film 20 is easier to remove due to the extension 24.

[0145] <Manufacturing Method of Radiation Detector>

[0146] Secondly, refer to Figures 19 to 23 This describes the various steps involved in manufacturing the radiation detector 1A. First, as... Figure 19 As shown in (a), the photoelectric conversion element array 7 is prepared (step S11). Next, as... Figure 19 As shown in (b), a scintillator layer 8 is provided on the photoelectric conversion element array 7 to cover the light-receiving part 3 (process S12).

[0147] Secondly, such as Figure 20 As shown in (a), a shielding member M1 is provided on the photoelectric conversion element array 7 to cover the pads 5 (step S13). An example of the shielding member M1 is a UV-curable shielding tape. Hereinafter, the UV-curable shielding tape will simply be referred to as [UV tape]. The pads 5 are arranged in multiple ways along the outer edge of the substrate 2. Therefore, firstly, the length direction of the UV tape is aligned with the direction in which the pads 5 are arranged. Secondly, the adhesive surface of the UV tape is adhered to the photoelectric conversion element array 7 such that the UV tape covers the pads 5. The thickness of the UV tape can be, for example, about 110 μm. Alternatively, the thickness of the UV tape can be 110 μm or less. Multiple UV tapes can be used in overlapping fashion to adjust the thickness of the shielding member M1.

[0148] Furthermore, a protective film 20 is formed on the photoelectric conversion element array 7 in a manner that covers the scintillator layer 8, region K, and shielding member M1 (step S14). Specifically, firstly, as Figure 20 As shown in (b), a first organic film 10 is formed (step S14a). For example, the entire surface of the substrate 2 is coated with a material such as parylene using a CVD method. Next, as... Figure 21As shown in (a), an inorganic film 11 is formed on the first organic film 10 (step S14b). For example, an aluminum film is deposited onto the inorganic film 11 by vapor deposition. Here, it is also possible to leave the pads 5 uncovered by the inorganic film 11. In this case, it is preferable to shield the pads 5 with a shielding member M2 before vapor deposition of the aluminum film. The shielding member M2 is preferably, for example, a UV tape. Next, as Figure 21 As shown in (b), a second organic film 12 is formed (step S14c). For example, the entire surface of the substrate 2 is coated again with parylene or the like by CVD.

[0149] Next, as Figure 22 As shown in (a), the protective film 20 is cut on the shielding member M1 by irradiating with laser L (step S15). For example, the laser head (not shown) irradiating with laser L is moved on a stage (not shown) on which the substrate 2 is placed. As a result, laser L scans along the edge of the scintillator layer 8 side of the shielding member M1.

[0150] The specific procedures are the same as those in step S5 of the first embodiment.

[0151] Then, the masking member M1 is removed (step S16). Specifically, the masking member M1 is removed by reducing the adhesive force of the adhesive surface of the masking member M1, which is a UV strip. First, as... Figure 22 As shown in (b), the shielding member M1 is irradiated with ultraviolet light (step S16a). The ultraviolet light reaches the shielding member M1 through the protective film 20. By receiving ultraviolet light irradiation, the shielding member M1 loses the adhesive force of the adhesive surface. Then, as... Figure 23 As shown, the shielding member M1 is removed (step S16b). The portion of the cut protective film 20 covering the shielding member M1 is also removed along with the shielding member M1. As a result, the solder pad 5 is exposed.

[0152] <Effects>

[0153] In the manufacturing method of the radiation detector 1A, the panel protection part is a shielding member M1. In step S13, where the shielding member M1 is disposed, the shielding member M1 is disposed on the photoelectric conversion element array 7 to cover the area K between the scintillator layer 8 and the pad 5, and the pad 5. In step S14, where the protective film 20 is formed, the protective film 20 is formed on the entire surface of the photoelectric conversion element array 7 on the side where the scintillator layer 8 is stacked and on the surface of the shielding member M1. According to this step S14, a radiation detector 1A without the resin frame 9 can be manufactured. That is, the distance between the scintillator layer 8 and the pad 5 can be shortened. Therefore, the radiation detector 1A can be further miniaturized.

[0154] The manufacturing method of the radiation detector 1A includes, after step S15 of cutting the protective film 20, a step S16b of removing the shielding member M1. According to these steps S16a and S16b, the radiation detector 1A without the resin frame 9 can be ideally manufactured.

[0155] like Figure 24 As shown, the manufacturing method of the radiation detector 1A includes, after step S16a of removing the outer portion of the protective film 20, a step of forming a coating resin 14A covering the outer edge 20a of the protective film 20. According to this step, the peeling of the outer edge 20a of the protective film 20 can be further suppressed.

[0156] According to the manufacturing method of the radiation detector 1A, the pad 5 is covered by a shielding member M1. Furthermore, the scintillator layer 8, the area between the scintillator layer 8 and the pad 5, and the shielding member M1 are covered by a protective film 20. Thus, the protective film 20 has a contact portion 23 in the area K between the scintillator layer 8 and the pad 5, which is in close contact with the photoelectric conversion element array 7. Additionally, a step difference is created between the end face of the shielding member M1 and the photoelectric conversion element array 7 due to the thickness of the shielding member M1. The protective film 20 is formed along this step difference. Thus, the protective film 20 has an extension portion 24 extending from the contact portion 23 toward the opposite side of the photoelectric conversion element array 7. Then, laser L is irradiated along the edge of the shielding member M1 on the scintillator layer 8 side. As a result, the protective film 20 is cut on the shielding member M1. Then, the shielding member M1 is removed. Thus, the pad 5 is exposed. And, the extension portion 24 stands upright without contacting the shielding member M1. Additionally, the extension 24 has a raised portion 24a and a sheet portion 24b. The raised portion 24a is formed along the step difference created by the edge of the shielding member M1. The sheet portion 24b is formed between the raised portion 24a and the edge of the shielding member M1 that performs laser irradiation.

[0157] The radiation detector 1A has a contact portion 23 and an extension portion 24. The contact portion 23 is located in region K between the scintillator layer 8 and the pad 5, and is in close contact with the photoelectric conversion element array 7. The extension portion 24 extends from the contact portion 23 toward the opposite side of the photoelectric conversion element array 7 in a self-standing state. Furthermore, the extension portion 24 includes a raised portion 24a and a sheet portion 24b. With these configurations, the moisture resistance of the scintillator layer 8 can be maintained. Furthermore, the region K between the scintillator layer 8 and the pad 5 can be reduced.

[0158] Here, it is considered that there is a possibility that the pad 5 might be damaged due to irradiation by the laser L. However, in the manufacturing method of the radiation detector 1A, when the protective film 20 is cut, the pad 5 is covered by the shielding member M1. At this time, the shielding member M1 functions as an absorption layer to absorb the laser L. Therefore, even if the laser L irradiates the pad 5, damage to the pad 5 can be prevented.

[0159] In the manufacturing method of the radiation detector 1A, the protective film 20 is cut by irradiation with laser L (step S15). According to step S15, the adhering portion 23 and the extension portion 24 can be formed with good precision on the outer edge 22 of the protective film 20. Even if the pads 5 are arranged at predetermined intervals along multiple sides (e.g., 2 to 4 sides) instead of along one side of the outer edge of the substrate 2, the laser L can be scanned on each side. Therefore, the adhering portion 23 and the extension portion 24 can be easily formed on the outer edge 22.

[0160] The above describes the second embodiment; however, the present invention is not limited to the second embodiment. For example, the outer edge 11a of the inorganic membrane 11 may together with the outer edge 10a of the first organic membrane 10 and the outer edge 12a of the second organic membrane 12 to form the outer edge 20a of the protective membrane 20.

[0161] The inorganic film 11 can also be a resin film containing a white pigment. Examples of white pigments include alumina, titanium dioxide, zirconium oxide, and yttrium oxide. When a resin film containing a white pigment is used as the inorganic film 11, after forming the second organic film 12, a metal film (e.g., aluminum) and a third protective film (made of the same material as the first and second organic films) are sequentially laminated. The metal film can also be made of aluminum. Furthermore, the third protective film can be made of the same type of material as the first organic film. Also, the third protective film can be made of the same type of material as the second organic film. According to these processes, even a resin-based reflective film with poor moisture resistance can achieve moisture resistance equivalent to that of a metal-based reflective film. Furthermore, higher light output than that of a metal-based reflective film can also be obtained. Thus, an inorganic film 11 with light reflectivity can be achieved.

[0162] Symbol Explanation

[0163] 1,1A: Radiation detector

[0164] 2:Substrate

[0165] 3: Light-receiving part

[0166] 3a: Photoelectric conversion element

[0167] 4: Signal line

[0168] 5: Solder pads

[0169] 6: Passivation film

[0170] 7: Photoelectric conversion element array

[0171] 8: Scintillator layer

[0172] 8a: Flasher

[0173] 8b: Peripheral part

[0174] 9: Resin frame

[0175] 10: The first organic membrane

[0176] 11: Inorganic membranes (metal membranes)

[0177] 12: Second organic membrane

[0178] 13: Protective film

[0179] 13a: Outer edge of protective film 13

[0180] 14: Coating resin

[0181] 30: Ditch

[0182] D1: First distance

[0183] D2: Second distance

[0184] d, d1, d3: Height

[0185] d2: Width

[0186] E1: Inner edge of resin frame 9

[0187] E2: Outer edge of resin frame 9

[0188] E3: Outer edge of scintillator layer 8

[0189] E4: Outer edge of photoelectric conversion element array 7

[0190] M1: Shielding component.

Claims

1. A radiation detector, wherein, have: A light-detecting panel has a light-receiving part and multiple pads. The light-receiving part includes multiple photoelectric conversion elements arranged in one or two dimensions. The pads are electrically connected to the photoelectric conversion elements and are disposed on the outside of the light-receiving part. A scintillator layer, which is stacked on the light detection panel to cover the light-receiving part, converts radiation into light; A panel protection portion is formed on the light detection panel such that, when viewed from the stacking direction of the scintillator layer, it is separated from the scintillator layer and the pads, passes between the scintillator layer and the pads, and surrounds the scintillator layer; and A scintillator protective film covers the scintillator layer and has an outer edge located on the panel protection portion. A groove is formed in the panel protection section that is continuous with the outer edge of the scintillator protective film. The slot includes: The front illumination section is formed by scanning along the panel protection section while increasing the energy of the laser from a value lower than the threshold energy that can cut the scintillator protective film to a value higher than the threshold energy. The main irradiation section is formed by scanning along the panel protection section while maintaining the laser energy at a value higher than the threshold energy; and The rear illumination section is formed by scanning along the panel protection section while reducing the energy of the laser from a value higher than the threshold energy to a value lower than the threshold energy. The main irradiation section has a fixed depth along the extension direction of the panel protection section. The front irradiation portion includes a portion that is continuous with the first end of the main irradiation portion and gradually increases in depth as it approaches the first end along the extending direction of the panel protection portion. The rear irradiation portion includes a portion that is continuous with the second end of the main irradiation portion and gradually becomes shallower in depth as it moves away from the second end along the extending direction of the panel protection portion.

2. The radiation detector as claimed in claim 1, wherein, It also includes: a coating resin that covers the outer edge of the scintillator protective film.

3. The radiation detector as described in claim 2, wherein, The coating resin further covers the panel protective portion. The coating resin has the material property of being able to remain on the panel protection portion in such a way that the edge of the contact surface between the coating resin and the panel protection portion is formed on the panel protection portion.

4. The radiation detector as described in claim 2 or 3, wherein, The central portion of the panel protection part is higher than the two edges of the panel protection part.

5. The radiation detector as claimed in any one of claims 1 to 4, wherein, The width of the panel protective portion is 700 micrometers or more and 1000 micrometers or less.

6. The radiation detector as claimed in any one of claims 1 to 5, wherein, The height of the panel protection part is 100 micrometers or more and 300 micrometers or less.

7. A method for manufacturing a radiation detector, wherein, have: The process of preparing a light detection panel and stacking a scintillator layer on the light detection panel in a manner that covers the light receiving part, wherein the light detection panel has the light receiving part and a plurality of pads, the light receiving part includes a plurality of photoelectric conversion elements arranged in one or two dimensions, the pads are electrically connected to the photoelectric conversion elements and are disposed on the outside of the light receiving part, and the scintillator layer converts radiation into light; The process of configuring a panel protection portion on the light detection panel in a manner that surrounds the scintillator layer when viewed from the stacking direction of the scintillator layer; The process of forming a scintillator protective film in such a way that it covers the entire surface of one side of the light detection panel on which the scintillator layer is stacked and the surface of the panel protective portion; The process of cutting the scintillator protective film by irradiating the panel protective portion with a laser; and The process of removing the outer portion of the scintillator protective film, The process of cutting the scintillator protective film includes: The pre-irradiation process involves increasing the energy of the laser from a value lower than the threshold energy that can cut the scintillator protective film to a value higher than the threshold energy while scanning along the panel protection portion, thereby forming a pre-irradiation portion that is continuous with the first end of the main irradiation portion and gradually deepens in depth as it approaches the first end along the extending direction of the panel protection portion. The main irradiation process involves maintaining the laser energy at a value higher than the threshold energy while scanning along the panel protection portion, thereby forming a main irradiation portion with a fixed depth along the extension direction of the panel protection portion; and In the post-irradiation process, the energy of the laser is reduced from a value greater than the threshold energy to a value less than the threshold energy while scanning along the panel protection portion, thereby forming a post-irradiation portion that is continuous with the second end of the main irradiation portion and gradually becomes shallower in depth along the extension direction of the panel protection portion as it moves away from the second end.

8. The method for manufacturing a radiation detector as described in claim 7, wherein, The panel protection section includes a resin frame. In the process of configuring the panel protection portion, the resin frame is configured on the light detection panel in a manner that separates it from the scintillator layer and the pads, passes between the scintillator layer and the pads, and surrounds the scintillator layer.

9. The method for manufacturing a radiation detector as described in claim 8, wherein, The panel protection section also includes a shielding component. In the process of configuring the panel protection section, the shielding member is further configured on the light detection panel to cover the pads.

10. The method for manufacturing a radiation detector as claimed in claim 7, wherein, The panel protection section includes a shielding component. In the process of configuring the panel protection section, the shielding member is configured on the light detection panel to cover the area between the scintillator layer and the pad, as well as the pad itself. In the process of forming the scintillator protective film, the scintillator protective film is formed on the entire surface of the side of the light detection panel on which the scintillator layer is stacked and on the surface of the shielding member.

11. The method of manufacturing a radiation detector as claimed in claim 10, wherein, Following the step of cutting the scintillator protective film, the process also includes the step of removing the shielding member.

12. The method of manufacturing a radiation detector as described in claim 10 or 11, wherein, After the step of removing the outer portion of the scintillator protective film, the process further includes a step of forming a coating resin covering the outer edge of the scintillator protective film.

Images