Radiation detector and method for manufacturing a radiation detector

Abstract

The radiation detector (1) of the present invention comprises: a photoelectric conversion element array (7); a scintillator layer (8) for converting radiation into light; a resin frame (9) formed on the photoelectric conversion element array (7); and a protective film (13) covering the scintillator layer (8). A groove (30) is formed in the resin frame (9) that is continuous with the outer edge (13a) of the protective film (13). The groove (30) has a repeating region (31) including a first groove end (32) and a second groove end (33) that are partially repeated in a direction intersecting the extending direction of the groove (30).

Description

Technical Field

[0001] This invention relates to a radiation detector and a method for manufacturing a radiation detector. Background Technology

[0002] Patent documents 1, 2, and 3 disclose radiation detectors. The radiation detectors disclosed in patent documents 1, 2, and 3 include: a scintillator layer that converts radiation into light; and a light detection panel for detecting the light. The light detection panel includes: a light-receiving portion having a plurality of light-receiving elements disposed thereon; and a plurality of bonding pads disposed around the light-receiving portion and electrically connected to the light-receiving portion. A resin frame surrounding the light-receiving portion is formed between the light-receiving portion and the bonding pads. The scintillator layer is covered by a moisture-resistant protective film.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-96823

[0006] Patent Document 2: Japanese Patent Application Publication No. 2016-205916

[0007] Patent Document 3: U.S. Patent No. 2012 / 0288688 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] In the method for manufacturing the radiation detector disclosed in Patent Documents 1 and 2, a scintillator layer is first formed on a light detection panel. Then, a resin frame is formed. Next, a protective film is formed. The protective film is formed on the scintillator layer and also on the pads. The protective film simply covers the scintillator layer. Therefore, a portion of the protective film covering the pads is removed. Specifically, to cut the protective film, the protective film formed on the resin frame is cut by irradiating it with a laser.

[0010] When a laser is irradiated onto the protective film, the laser needs to have energy above a certain threshold to reliably cut it. However, if the laser energy is too strong, it may cut through both the protective film and the resin frame. This could potentially damage the photodetector panel. Furthermore, even if the laser does not reach the photodetector panel, a deep groove formed in the resin frame could become an unexpected cause of failure. Therefore, the height of the protective film and resin frame is not constant. Thus, even if the laser energy is kept constant, the aforementioned failures may still occur.

[0011] This means that even under constant laser irradiation conditions, it is possible to manufacture radiation detectors that fail to meet specified performance requirements. Therefore, in the field of radiation detector technology, there is a desire to improve productivity by reducing the production of defective products during the manufacturing process.

[0012] Therefore, the object of the present invention is to provide a radiation detector and a method for manufacturing the radiation detector that can improve productivity.

[0013] Technical means to solve the problem

[0014] One aspect of the radiation detector of the present invention comprises: a light detection panel having a light-receiving portion including a plurality of photoelectric conversion elements arranged in one or two dimensions, and a plurality of pads electrically connected to the photoelectric conversion elements and disposed outside the light-receiving portion; a scintillator layer for converting radiation into light, laminated on the light detection panel to cover the light-receiving portion; a resin frame formed on the light detection panel such that, when viewed from the lamination direction of the scintillator layer, it is separated from the scintillator layer and the pads and passes between the scintillator layer and the pads, and surrounds the scintillator layer; and a scintillator protective film covering the scintillator layer and having an outer edge located on the resin frame. In the resin frame, a groove is formed that is continuous with the outer edge of the scintillator protective film. The groove has a repeating region, which includes a first groove end and a second groove end that are partially repeated in a direction intersecting the extension direction of the groove.

[0015] The grooves in the resin frame of the radiation detector are continuous with the outer edge of the scintillator protective film. Furthermore, the outer edge of the scintillator protective film is formed by laser irradiation. The grooves in the resin frame are formed along with this outer edge. Moreover, when the grooves are formed in the resin frame, the scintillator protective film formed on the resin frame is reliably cut off. Additionally, the grooves have repeating regions including a first groove end and a second groove end. Due to the partial repetition of the first and second groove ends, the groove depth does not become excessively deep in the repeating region. As a result, not only the scintillator protective film but also the laser can be reliably prevented from reaching the resin frame. That is, the scintillator protective film can be reliably cut off. Furthermore, the surface of the light detection panel with the resin frame is not damaged by laser irradiation. Therefore, the generation of defective products can be suppressed. As a result, productivity can be improved.

[0016] In one type of radiation detector, a coating resin may also be provided covering the outer edge of the scintillator protective film. This structure can suppress the peeling of the scintillator protective film.

[0017] In one type of radiation detector, a resin frame may be further covered by a coating resin. The coating resin may also have material properties that allow it to remain within the resin frame, such that the edge of the contact surface between the coating resin and the resin frame is formed on the resin frame. According to this structure, the coating resin will not reach the surface of the photodetector panel located outside the resin frame. Furthermore, the coating resin will not reach the pads. Therefore, the surface of the photodetector panel and the pads can be kept clean.

[0018] In one type of radiation detector, the central portion of the resin frame may be higher than the two edges of the resin frame. Alternatively, the groove may be positioned on the resin frame biased towards the pad side. According to this structure, the coating resin can reliably cover the outer edge of the scintillator protective film.

[0019] In one type of radiation detector, the width of the resin frame can be between 700 micrometers and 1000 micrometers. This structure allows for the miniaturization of the radiation detector.

[0020] In one type of radiation detector, the height of the resin frame can be between 100 micrometers and 300 micrometers. This structure allows for the miniaturization of the radiation detector.

[0021] In one type of radiation detector, the light detection panel can also be rectangular in shape. Alternatively, the resin frame can have four sides surrounding the scintillator layer. The repeating region can also be located on any one of the four sides. According to this structure, the peeling of the scintillator protective film can be further suppressed.

[0022] Another method for manufacturing a radiation detector according to the present invention includes: a step of preparing a light detection panel having a light-receiving portion and a plurality of pads, and a step of stacking a scintillator layer on the light detection panel such that it covers the light-receiving portion; a step of disposing a panel protection portion on the light detection panel such that it surrounds the scintillator layer when viewed from the stacking direction of the scintillator layer; a step of forming a scintillator protective film such that it covers the entire surface of the light detection panel on one side where the scintillator layer is stacked and the surface of the panel protection portion; a step of cutting the scintillator protective film by irradiating the panel protection portion with a laser; and a step of removing the outer portion of the scintillator protective film, wherein the light-receiving portion includes a plurality of photoelectric conversion elements arranged in one or two dimensions, the plurality of pads being electrically connected to the photoelectric conversion elements and disposed on the outer side of the light-receiving portion, and the scintillator layer being used to convert radiation into light. In the process of cutting the scintillator protective film, a laser is irradiated, so that the outer edge of the scintillator protective film is formed due to the cutting of the scintillator protective film. A groove is formed on the panel protection part that is continuous with the outer edge of the scintillator protective film, and the groove has a repeating area, which includes a first groove end and a second groove end that are partially repeated in a direction that intersects with the extension direction of the groove.

[0023] In the process of manufacturing a radiation detector, the step of cutting the scintillator protective film forms the outer edge of the scintillator protective film and a groove in the panel protection portion. Furthermore, with the groove formed in the panel protection portion, the scintillator protective film formed on the panel protection portion can be reliably cut. Additionally, the groove has a repeating region including a first groove end and a second groove end. Due to the repetition of the first and second groove ends, the groove depth does not become excessively deep in the repeating region. As a result, not only the scintillator protective film but also laser light is prevented from reaching the panel protection portion. That is, the scintillator protective film can be reliably cut. Furthermore, the surface of the light detection panel with the panel protection portion is not damaged by laser irradiation. Therefore, the generation of defective products can be suppressed. As a result, productivity can be improved.

[0024] In other methods of manufacturing radiation detectors, the shape of the light detection panel can also be rectangular. The panel protective portion can also have four sides surrounding the scintillator layer. In the step of cutting the scintillator protective film, a repeating area can be provided on any of the four sides. According to this step, the peeling of the scintillator protective film can be further suppressed.

[0025] In other methods of manufacturing radiation detectors, the step of cutting the scintillator protective film may include: setting at least one of the positions of the four corners formed by the four sides as a reference position; and irradiating the four sides with laser light according to the reference position. This step allows for precise control of the position to be irradiated with laser light.

[0026] In other methods of manufacturing radiation detectors, the panel protection portion may be a resin frame. In the process of configuring the panel protection portion, the resin frame is configured on the light detection panel in a manner that separates it from the scintillator layer and pads, passing between the scintillator layer and pads and surrounding the scintillator layer. According to this process, a radiation detector with a resin frame can be manufactured.

[0027] In other methods of manufacturing radiation detectors, the resin frame can be formed such that its central portion is higher than its two edges during the process of configuring the panel protection portion. In the process of cutting the scintillator protective film, a laser can be irradiated onto a position on the resin frame biased towards the pad side. According to this process, the outer edge of the scintillator protective film can be reliably covered by coating resin.

[0028] In other methods of manufacturing radiation detectors, the panel protection portion may also be a masking member. In the process of configuring the panel protection portion, the masking member may be configured on the light detection panel to cover the area between the scintillator layer and the pads, as well as the pads themselves. In the process of forming the scintillator protective film, the scintillator protective film may be formed on the entire surface of the light detection panel on the side where the scintillator layer is stacked, and on the surface of the masking member. According to this process, a radiation detector without a resin frame can be manufactured. That is, the distance between the scintillator layer and the pads can be shortened. As a result, the radiation detector can be further miniaturized.

[0029] In other methods of manufacturing radiation detectors, a step of removing the shielding member may be included after the step of removing the outer portion of the scintillator protective film. According to this step, a radiation detector without a resin frame can be ideally manufactured.

[0030] In other methods of manufacturing radiation detectors, a step may be included, after the step of removing the outer portion of the scintillator protective film, of forming a coating resin covering the outer edge of the scintillator protective film. This step can further suppress the peeling of the outer edge of the scintillator protective film.

[0031] The effects of the invention

[0032] According to the present invention, a radiation detector capable of improving productivity and a method for manufacturing the radiation detector can be provided. Attached Figure Description

[0033] Figure 1 This is a top view of the radiation detector according to the first embodiment.

[0034] Figure 2 It is along Figure 1 A cross-sectional view of line II-II.

[0035] Figure 3 It is Figure 1 A magnified top view showing the area near the corner of the radiation detector.

[0036] Figure 4 It means Figure 1 A top view of the resin frame and the groove set in the resin frame.

[0037] Figure 5 It is Figure 4 The repeated area is enlarged to represent the top view.

[0038] Figure 6 It means along Figure 5 A three-dimensional view of the cross section of line VI-VI.

[0039] Figure 7(a) is a cross-sectional view of the resin frame of the comparative example. Figure 7 (b) is a cross-sectional view of the resin frame representing the embodiment.

[0040] Figure 8 (a) is a cross-sectional view showing the state before the formation of the scintillator layer. Figure 8 (b) is a cross-sectional view showing the state after the scintillator layer is formed.

[0041] Figure 9 (a) is a cross-sectional view showing the state after the resin frame is formed. Figure 9 (b) is a cross-sectional view showing the state after the formation of the first organic membrane.

[0042] Figure 10 (a) is a cross-sectional view showing the state after the formation of the inorganic membrane. Figure 10 (b) is a cross-sectional view showing the state after the formation of the second organic membrane.

[0043] Figure 11 It is a cross-sectional view showing the processing done by laser.

[0044] Figure 12 It is a diagram used to specifically illustrate the processing done by laser.

[0045] Figure 13 (a) is a diagram used to illustrate the processing along the front illumination line. Figure 13 (b) is a diagram used to illustrate the processing along the first irradiation line.

[0046] Figure 14 (a) is a diagram used to illustrate the processing along the second irradiation line. Figure 14 (b) is a diagram used to illustrate the processing along the third irradiation line.

[0047] Figure 15 (a) is a diagram used to illustrate the processing along the fourth irradiation line. Figure 15 (b) is a diagram used to illustrate the processing along the backlighting line.

[0048] Figure 16 It is a diagram used to illustrate the processing along the release line.

[0049] Figure 17 (a) is a cross-sectional view showing the state where a portion of the protective film has been removed. Figure 17 (b) is a cross-sectional view showing the state after the coating resin is formed.

[0050] Figure 18 (a) is a cross-sectional view of the resin frame of the comparative example. Figure 18(b) is a cross-sectional view of the resin frame representing the embodiment.

[0051] Figure 19 This is a top view of the radiation detector according to the second embodiment.

[0052] Figure 20 It is along Figure 19 A cross-sectional view of the XX-XX line.

[0053] Figure 21 yes Figure 19 The first stereoscopic view of the radiation detector.

[0054] Figure 22 yes Figure 19 The second stereoscopic view of the radiation detector.

[0055] Figure 23 (a) is a cross-sectional view showing the state before the formation of the scintillator layer. Figure 23 (b) is a cross-sectional view showing the state after the scintillator layer is formed.

[0056] Figure 24 (a) is a cross-sectional view showing the state after the shielding component is configured. Figure 24 (b) is a cross-sectional view showing the state after the formation of the first organic membrane.

[0057] Figure 25 (a) is a cross-sectional view showing the state after the formation of the inorganic membrane. Figure 25 (b) is a cross-sectional view showing the state after the formation of the second organic membrane.

[0058] Figure 26 It is a cross-sectional view showing the processing done by laser.

[0059] Figure 27 It means Figure 19 A top view of the resin frame and the groove set in the resin frame.

[0060] Figure 28 (a) is a cross-sectional view showing the process of removing the shielding component. Figure 28 (b) is a cross-sectional view showing the state after the shielding component is removed.

[0061] Figure 29 This is a cross-sectional view of a radiation detector in a modified example of the second embodiment.

[0062] Figure 30 (a) is a diagram schematically representing the time history of the energy received by the irradiated body. Figure 30 (b) is a graph schematically representing the time history of the laser head's speed.

[0063] Figure 31It is a diagrammatic representation of the time history of the energy received by the irradiated object.

[0064] Figure 32 (a) is a graph representing an example of the time history of the laser head's speed. Figure 32 (b) is a chart representing an example of the time history of the energy of the laser emitted from the laser head. Figure 32 (c) is a chart showing an example of the time history of the focal position of the laser emitted from the laser head.

[0065] Figure 33 (a) is a graph representing an example of the time history of the laser head's speed. Figure 33 (b) is a diagram that schematically shows the positional relationship between the laser head and the protective film, and also schematically shows the positional relationship between the laser head and the resin frame. Detailed Implementation

[0066] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the illustrated description, the same elements are given the same reference numerals, and repeated descriptions are omitted.

[0067] Reference Figure 1 and Figure 2 The structure of the radiation detector 1 in this embodiment will be described. For example... Figure 1 and Figure 2 As shown, the radiation detector 1 includes: a photoelectric conversion element array 7 (photodetector panel), a scintillator layer 8, a resin frame 9, a protective film 13 (scintillator protective film), and a coating resin 14 (coating resin). The photoelectric conversion element array 7 includes: a substrate 2, a light-receiving portion 3, a signal line 4, a pad 5, and a passivation film 6. The protective film 13 includes a first organic film 10, an inorganic film 11 (metal film), and a second organic film 12.

[0068] The light-receiving section 3 includes a plurality of photoelectric conversion elements 3a. These photoelectric conversion elements 3a are arranged in a rectangular region at the center of an insulating substrate 2 in a two-dimensional arrangement. The substrate 2 is, for example, a glass substrate. The photoelectric conversion elements 3a are constructed using amorphous silicon photodiodes (PDs) or thin-film transistors (TFTs). Each row or column of photoelectric conversion elements 3a included in the light-receiving section 3 is electrically connected to pads 5 (not shown) for obtaining signals from an external circuit via signal lines 4.

[0069] Multiple pads 5 are arranged at predetermined intervals along both sides of adjacent joints on the outer edge of the substrate 2. The two sides of adjacent joints are, for example... Figure 1The pads 5 are located on the top and right sides of the circuit. Pad 5 is electrically connected to the corresponding photoelectric conversion element 3a via signal line 4. An insulating passivation film 6 is formed on the photoelectric conversion element 3a and signal line 4. The passivation film 6 can be, for example, silicon nitride or silicon oxide. Pad 5 is exposed for connection to external circuitry.

[0070] A columnar scintillator 8a converts X-rays of radiation into light. The scintillator 8a is stacked on the photoelectric conversion element array 7 to cover the light-receiving portion 3. The scintillator layer 8 is formed through the scintillator 8a. Multiple scintillators 8a are stacked on the photoelectric conversion element array 7 in a generally rectangular region containing the light-receiving portion 3. The generally rectangular region is... Figure 1 The area enclosed by the dashed line shown. The scintillator 8a can be made of various materials. For example, cesium iodide (CsI) doped with thallium (Tl), which has good luminous efficiency, can be used.

[0071] The peripheral portion 8b of the scintillator layer 8 has a gradient shape. In other words, the height of the peripheral portion 8b gradually decreases towards the outer side of the scintillator layer 8. That is, in the peripheral portion 8b, the scintillator 8a formed further out of the scintillator layer 8 has a lower height. The peripheral portion 8b is the area where the light-receiving portion 3 is not formed below. The area where the light-receiving portion 3 is not formed is the effective off-screen area. The peripheral portion 8b is the area with minimal impact on the generation of X-ray images. Therefore, based on the gradient shape of the peripheral portion 8b, the area on the scintillator layer 8 affected by the adverse effects of laser light can be limited during manufacturing. The gradient angle (angle θ) of the peripheral portion 8b is defined. First, a straight line connecting the height positions of the scintillators 8a formed in the peripheral portion 8b from the inner side of the scintillator layer 8 outwards is defined. The angle θ is the angle formed by this straight line relative to the upper surface of the substrate 2. The angle θ is in the range of 20 degrees to 80 degrees.

[0072] A resin frame 9 is formed on the photoelectric conversion element array 7. Viewed from the stacking direction A of the scintillator layer 8, the resin frame 9 passes between the scintillator layer 8 and the pad 5 and surrounds the scintillator layer 8. The corners of the resin frame 9 are convex arc-shaped, pointing outwards. The resin frame 9 is, for example, a silicone resin. The corners of the resin frame 9 may also be of the so-called R-shape.

[0073] The central portion of the resin frame 9 is higher than its two edges. The height d1 of the resin frame 9 is lower than the height d of the scintillator layer 8. This allows for miniaturization of the resin frame 9. Furthermore, the adverse effects of laser light on the scintillator layer 8 can be suppressed during manufacturing. The height d1 of the resin frame 9 is the distance from the position of the upper surface of the photoelectric conversion element array 7 to the position of the apex of the resin frame 9. The height d of the scintillator layer 8 is the maximum height of the scintillator 8a contained within the scintillator layer 8.

[0074] From the viewpoint of miniaturizing the radiation detector 1, the resin frame 9 is preferably made as small as possible. More specifically, the height d1 of the resin frame 9 is 100 μm or more. Furthermore, the height d1 of the resin frame 9 is 300 μm or less. Also, the width d2 of the resin frame 9 is 700 μm or more. The width d2 of the resin frame 9 is 1000 μm or less. The width d2 of the resin frame 9 is the width between the inner edge E1 and the outer edge E2 of the resin frame 9. The inner edge E1 is the edge on the scintillator layer 8 side. The outer edge E2 is the edge on the pad 5 side.

[0075] The distance from the inner edge E1 of the resin frame 9 to the outer edge E3 of the scintillator layer 8 is the first distance D1. The distance from the outer edge E2 of the resin frame 9 to the outer edge E4 of the photoelectric conversion element array 7 is the second distance D2. The first distance D1 is shorter than the second distance D2. From the viewpoint of suppressing the adverse effects of laser on the pads 5 during manufacturing and ensuring the effective area of ​​the scintillator layer 8, the ratio of the second distance D2 to the first distance D1 is preferably 5 or more. More specifically, the first distance D1 is preferably 1 mm or less. The second distance D2 is preferably 5 mm or more. This is based on the following reasons.

[0076] When there is no gap between the outer edge E3 of the scintillator layer 8 and the inner edge E1 of the resin frame 9, the effective area of ​​the scintillator layer 8 can be maximized. However, the adverse effects of the laser on the scintillator layer 8 must be considered during manufacturing. Furthermore, there is a concern about slight failures in the process of forming the resin frame 9. Slight failures refer to, for example, the formation of the resin frame 9 on the scintillator layer 8. Considering these factors, the first distance D1 is preferably set to a range of 1 mm or less. The second distance D2 is set to a range of 5 mm or more. As a result, since the adverse effects of the laser on the pads 5 during manufacturing are taken into account, a sufficient distance can be ensured between the resin frame 9 and the pads 5.

[0077] The scintillator layer 8 is covered by a protective film 13. The protective film 13 comprises a first organic film 10, an inorganic film 11, and a second organic film 12. These films are stacked sequentially from the scintillator layer 8 side. The first organic film 10, inorganic film 11, and second organic film 12 are all permeable to X-rays. Furthermore, the first organic film 10, inorganic film 11, and second organic film 12 can block water vapor. Specifically, the first organic film 10 and second organic film 12 can be made of parylene resin or polychloroparaxylene, etc. The inorganic film 11 can be transparent, opaque, or reflective. The inorganic film 11 can be made of, for example, oxide films of silicon (Si), titanium (Ti), chromium (Cr), or metal films of gold, silver, aluminum (Al). For example, using an inorganic film 11 that reflects light as a metal film can prevent fluorescence leakage generated in the scintillator 8a. As a result, the detection sensitivity of the radiation detector 1 can be increased. In this embodiment, an example is described regarding the use of easily formable aluminum (Al) as the inorganic film 11. Aluminum (Al) is easily corroded in air. However, the inorganic film 11 is sandwiched between the first organic film 10 and the second organic film 12. Therefore, the inorganic film 11 using aluminum (Al) can prevent corrosion.

[0078] The protective film 13 can be formed, for example, by CVD. Therefore, immediately after its formation, the protective film 13 covers the entire surface of the photoelectric conversion element array 7. To expose the pads 5, the protective film 13 is cut at a position further inward than the pads 5 of the photoelectric conversion element array 7. Furthermore, a portion of the protective film 13 further outward than the cut position is removed. As described later, the protective film 13 is cut using a laser near the outer edge of the resin frame 9, and the outer edge 13a of the protective film 13 is fixed by the resin frame 9. This prevents peeling of the protective film 13 from the outer edge 13a. The cutting of the protective film 13 can also be performed using, for example, a carbon dioxide laser. By using a carbon dioxide laser, the protective film 13 can be cut in a single scan. In other words, the protective film 13 can be cut in a short time. As a result, productivity can be improved. Alternatively, the cutting of the protective film 13 can also be performed using ultrashort pulse semiconductor lasers of the nanosecond or picosecond range. Furthermore, adverse effects on the photoelectric conversion element array 7, pad 5, and scintillator layer 8 include, for example, thermal damage when using carbon dioxide lasers or ultrashort pulse lasers.

[0079] The outer edge 13a of the protective film 13 is located on the resin frame 9. The outer edge 13a is coated together with the resin frame 9 by a coating resin 14. The coating resin 14 is disposed along the resin frame 9. The coating resin 14 can be a resin with good adhesion to both the protective film 13 and the resin frame 9. For example, the coating resin 14 can be an acrylic adhesive. The coating resin 14 can also be the same silicone resin as the resin frame 9. The resin frame 9 can also be the same acrylic resin as the coating resin 14.

[0080] Secondly, refer to Figure 3 This section explains the corners (corner portions) of the resin frame 9 and the protective film 13. Figure 3 In order to make it easier to understand the state of the corners of the resin frame 9 and the protective film 13, the illustration of a part of the resin 14 is omitted.

[0081] As will be described in detail later, in the manufacturing process of the radiation detector 1, a laser is irradiated onto the protective film 13 on the resin frame 9. As a result, the portion of the protective film 13 irradiated by the laser is cut off. The protective film 13 is very thin. Therefore, the portion of the resin frame 9 is also cut off by the laser beam of the carbon dioxide gas. As a result, a groove 30 is formed in the vicinity of the center of the resin frame 9. The outer edge 13a of the protective film 13 of the resin frame 9 is processed by laser. In addition, the groove 30 is also processed by laser. Here, the depth (height) d3 of the groove 30 is less than 1 / 3 of the height d1 of the resin frame 9. As a result, the adverse effects of the laser on the photoelectric conversion element array 7 located below the resin frame 9 can be suppressed.

[0082] like Figure 3 As shown, the outer edge 13a and groove 30 of the protective film 13 after laser processing, when viewed from the stacking direction A of the scintillator layer 8, are approximately rectangular rings with convex arc-shaped corners on the outer side. The arc-shaped corners are as follows: Figure 3 As shown in region B, the outer edge 13a and the surface shape of the groove 30 of the protective film 13, when viewed from the lamination direction A, exhibit a slightly wavy shape. The surface shape of the outer edge 13a and the groove 30 of the protective film 13 differs from a flat cross-section formed by a cutting tool, such as a knife. The surfaces of the outer edge 13a and the groove 30 of the protective film 13 have minute irregularities. This increases the contact area between the outer edge 13a of the protective film 13 and the coating resin 14. Therefore, the adhesion of the coating resin 14 to the outer edge 13a of the protective film 13 can be made stronger. Furthermore, the contact area between the groove 30 and the coating resin 14 is also increased. Therefore, the adhesion of the coating resin 14 to the groove 30 can also be made stronger.

[0083] Secondly, while referring to Figure 4 , Figure 5 , Figure 6 and Figure 7 To provide a more detailed explanation of slot 30, see below. Figure 4 As shown, the resin frame 9 surrounds the light-receiving portion 3. The shape of the resin frame 9 is rectangular in a top view. Therefore, the resin frame 9 includes a first side 9a, a second side 9b, a third side 9c, and a fourth side 9d. A groove 30 is formed in the resin frame 9. In other words, the groove 30 extends along the extending direction of the resin frame 9. The shape of the groove 30 is also rectangular in a top view. The groove 30 includes a repeating region 31. In this embodiment, the repeating region 31 is formed in the first side 9a. Furthermore, the repeating region 31 may be formed in any one of the second side 9b, the third side 9c, and the fourth side 9d. In other words, the repeating region 31 is not formed at the corners.

[0084] Figure 5 yes Figure 4 A magnified view of the area near the repeating region 31 shown. Figure 6 It means Figure 5 A three-dimensional view of the cross-section of line VI-VI from the perspective of the arrow. Figure 6 In the diagram, the coating resin 14 is imaginary represented by two chain lines. The repeating region 31 includes two groove ends 32 and 33. The first groove end 32 is formed near the point at which laser irradiation begins. The second groove end 33 is formed near the point at which laser irradiation is to be stopped.

[0085] The first groove end 32 is formed further inward than the second groove end 33. "Inner" refers to the side of the scintillator layer 8 relative to the resin frame 9. "Outer" refers to the side of the pad 5 relative to the resin frame 9. The second groove end 33 is formed further outward than the first groove end 32. The first groove end 32 partially repeats the second groove end 33 in the width direction of the groove 30. Specifically, a portion 32a of the outer side of the first groove end 32 repeats a portion 33a of the inner side of the second groove end 33. Therefore, the width W31 of the repeating portion is larger than the width W32 of the first groove end 32. Similarly, the width W31 of the repeating portion is larger than the width W33 of the second groove end 33. Furthermore, the width W31 of the repeating portion is smaller than the sum of the widths W32 of the first groove end 32 and W33 of the second groove end 33, which is equivalent to the length of the repeat. In this repeating portion, the first groove end 32 and the second groove end 33 are connected.

[0086] The position of the repeating region 31 is biased towards the pad 5 side on the resin frame 9. For example, the distance W1 from the outer edge of the second groove end 33 to the edge of the pad 5 side of the resin frame 9 is shorter than the distance W2 from the inner edge of the first groove end 32 to the edge of the scintillator layer 8 side of the resin frame 9. Furthermore, in the resin frame 9, an inner region 9A and an outer region 9B are defined, divided in the width direction of the resin frame 9. Here, the second groove end 33 is entirely formed in the outer region 9B. A first portion of the first groove end 32 is formed in the outer region 9B. A portion of the first groove end 32 is formed in the inner region 9A.

[0087] like Figure 7 As shown, in the repeating region 31, the first groove end 32 and the second groove end 33 are arranged in the width direction of the resin frame 9. In the repeating region 31, a portion of the first groove end 32 is repeated in the width direction relative to a portion of the second groove end 33. More specifically, the inner circumference of the first groove end 32 located in the repeating region 31 is repeated with the outer circumference of the second groove end 33 located in the repeating region 31. In the repeating region 31, the first groove end 32 and the second groove end 33 are connected. The depth of the first groove end 32 is the distance from the point where the center line CL intersects with the surface of the resin frame 9 to the deepest part of the first groove end 32. The depth of the second groove end 33 is also the same. Thus, the depth of the first groove end 32 and the depth of the second groove end 33 are approximately the same.

[0088] For example, in the case where the second groove end 33 is completely repeated relative to the first groove end 32, the laser forming the second groove end 33 irradiates the deepest part of the first groove end 32 (see reference). Figure 7 (a) Therefore, if the laser irradiation conditions are the same, the depth of the groove in the repeating region 31 is twice the depth of the end 32 of the first groove.

[0089] However, in this embodiment, the first groove end 32 and the second groove end 33 are offset in a parallel manner. Therefore, as Figure 7 As shown in (b), the laser forming the second groove end 33 irradiates the outside of the first groove end 32, that is, the surface of the unprocessed resin frame 9. Therefore, the depth of the groove in the repeating region 31 is not twice the depth of the groove formed by one irradiation when the second groove end 33 is completely repeated relative to the first groove end 32.

[0090] The operation of the radiation detector 1 in this embodiment is explained. X-rays (radiation) incident from the incident surface pass through the protective film 13 and reach the scintillator 8a. The X-rays are absorbed by the scintillator 8a. The scintillator 8a emits light in proportion to the amount of X-rays absorbed. Of the emitted light, light traveling in the opposite direction to the direction of the X-ray incident is reflected by the inorganic film 11. As a result, almost all the light generated in the scintillator 8a is incident on the photoelectric conversion element 3a via the passivation film 6. The photoelectric conversion element 3a generates an electrical signal corresponding to the amount of incident light through photoelectric conversion. The electrical signal is accumulated over a certain period of time. The amount of light corresponds to the amount of incident X-rays. That is, the electrical signal accumulated in the photoelectric conversion element 3a corresponds to the amount of incident X-rays. Therefore, an image signal corresponding to the X-ray image is obtained through this electrical signal. The image signal accumulated in the photoelectric conversion element 3a is sequentially read out from the pad 5 via the signal line 4. The read-out image signal is transmitted to the outside. The transmitted image signal is processed through a defined processing loop. The result is represented as an X-ray image.

[0091] <Manufacturing Method of Radiation Detector>

[0092] Secondly, refer to Figures 8 to 18 The manufacturing method of the radiation detector 1 according to this embodiment will be described. First, as follows... Figure 8 As shown in (a), the photoelectric conversion element array 7 is prepared (step S1). Next, as... Figure 8 As shown in (b), a (stacked) scintillator layer 8 is formed (step S2). Specifically, columnar crystals of cesium iodide (CsI) doped with thallium (Tl) are grown in the region covering the light-receiving portion 3 on the photoelectric conversion element array 7. The growth of the columnar crystals can be, for example, by vapor deposition. The thickness of the columnar crystals of cesium iodide (CsI) is, for example, about 600 μm.

[0093] Secondly, such as Figure 9 As shown in (a), a resin frame 9 is formed on the photoelectric conversion element array 7 (step S3). Specifically, the resin frame 9 is formed between and surrounding the scintillator layer 8, as viewed from the stacking direction A of the scintillator layer 8. More specifically, the resin frame 9 is formed at a position where the first distance D1 is 1 mm or less and the second distance D2 is 5 mm or more. The resin frame 9 can be formed using, for example, an automated XY coating apparatus. Hereinafter, for ease of explanation, the part on which the scintillator layer 8 and the resin frame 9 are formed will be referred to simply as the "substrate".

[0094] Furthermore, in step S3, in addition to the resin frame 9, a shielding member as shown in the second embodiment may also be configured (see reference). Figure 24(a)). The masking member is a pad 5 configured to cover the outer area of ​​the resin frame 9. The masking member is used to protect the surface of the pad 5. When the masking member is configured, in step S6 of removing the outer portion of the protective film 13, which will be described later, the masking member and the protective film 13 are removed together.

[0095] Secondly, such as Figure 9 As shown in (b), the first organic film 10 is formed (step S4a). The cesium iodide (CsI) used to form the scintillator layer 8 is highly hygroscopic. Therefore, if the scintillator layer 8 is left exposed, it will absorb water vapor from the air. As a result, the scintillator layer 8 dissolves. Therefore, for example, a CVD method is used to coat the entire surface of the substrate with parylene. The thickness of the parylene is preferably 5 μm or more and 25 μm or less.

[0096] Then, as Figure 10 As shown in (a), an inorganic film 11 is formed to form a metal film (step S4b). Specifically, an aluminum film with a thickness of 0.2 μm is deposited on the surface of the first organic film 10 on the radiation incident surface side by vapor deposition. The radiation incident surface refers to the surface of the radiation detector 1 on the side where the scintillator layer 8 is formed. Next, as... Figure 10 As shown in (b), a second organic film 12 is formed (step S4c). Specifically, the entire surface of the substrate on which the inorganic film 11 is formed is coated again with parylene using a CVD method. The thickness of the parylene is preferably 5 μm or more and 25 μm or less. The second organic film 12 is to prevent deterioration caused by corrosion of the inorganic film 11. A protective film 13 is formed through steps S4a, S4b, and S4c. The portion of the protective film 13 that is further outward from the approximately central portion of the resin frame 9 is removed by a subsequent process. The portion of the protective film 13 that is further outward from the approximately central portion of the resin frame 9 refers to the portion covering the pad 5. Therefore, the first organic film 10 and the second organic film 12 may not need to be formed on one side of the photoelectric conversion element array 7. In addition, the first organic film 10 and the second organic film 12 may not need to be formed on the surface of the photoelectric conversion element array 7 opposite to the surface on which the scintillator layer 8 is stacked.

[0097] Next, as Figure 11 As shown, laser L is irradiated along the resin frame 9. As a result, the protective film 13 is cut (step S5). Specifically, a laser head (not shown) used to irradiate laser L is moved on a stage (not shown) on which the substrate on which the protective film 13 is formed is placed. As a result, laser L scans along the resin frame 9 in a single stroke.

[0098] The following is a reference. Figure 12 , Figure 13 , Figure 14 , Figure 15 and Figure 16 While explaining in detail the process S5 of cutting the protective film 13.

[0099] like Figure 12 As shown, baselines C1, C2, C3, and C4 are defined. To define baselines C1, C2, C3, and C4, several reference points are defined (step S5s). For example, an image is obtained by photographing the resin frame 9 with a camera. Based on the image, reference points are specified at, for example, seven locations. These reference points may also overlap with the center line of the resin frame 9. Additionally, reference points may be set at corners.

[0100] Next, laser irradiation is performed (step S5r). Step S5r includes defining the scan line and performing the operation along the scan line. The scan line includes several elements. Specifically, the scan line includes: the front irradiation line RS, the first irradiation line R1, the second irradiation line R2, the third irradiation line R3, the fourth irradiation line R4, the rear irradiation line RE, and the release line RL. In addition, the operation of performing the operation along the scan line also includes multiple elements corresponding to these elements. In the following explanation, the operation of repeatedly defining the elements of the scan line and performing the operation along the elements is illustrated by example. That is, after defining the front irradiation line RS, the operation along the front irradiation line RS is performed immediately. Next, after defining the first irradiation line R1, the operation along the first irradiation line R1 is performed immediately. Similarly, the second irradiation line R2, the third irradiation line R3, the fourth irradiation line R4, the rear irradiation line RE, and the release line RL are defined and the operation along the lines is performed.

[0101] Alternatively, the definition of the scan line can be summarized, and then the operation along the scan line can be summarized. Furthermore, the definition of the scan line and the operation along the scan line can be performed in parallel. For example, the definition of the first scan line can be performed while the operation along the front illumination line is being performed.

[0102] First, define the front irradiation line RS (process S5a: refer to...). Figure 13 (a) The front irradiation line RS is the interval from the starting point PSs to the starting point P1s of the first irradiation line R1. The starting point PSs is separated from the first baseline C1 by a predetermined distance, and is also separated from the fourth baseline C4 by a predetermined distance. As an example of the predetermined distance, it is 70 μm. The front irradiation line RS is parallel to the first baseline C1. The front irradiation line RS is separated from the first baseline C1 by a predetermined distance. The predetermined distance is, for example, 70 μm.

[0103] Next, the operation along the front irradiation line RS is performed (step S5b). First, the laser head is moved to the starting point PSs. Then, the laser head is moved along the front irradiation line RS. The speed of the laser head is, for example, 6000 mm / min. At this time, the laser head is not irradiating the laser. The laser head begins irradiating the laser at least after the starting point PSs of the front irradiation line RS and during the period to the starting point P1s of the first irradiation line R1. For example, the laser head may also begin irradiating the laser from the starting point P1s of the first irradiation line R1.

[0104] Next, the first irradiation line R1 is defined (step S5c: refer to...). Figure 13 (b) The first irradiation line R1 comprises: a first irradiation side R1a and a first irradiation corner R1b. The first irradiation side R1a is continuous with the preceding irradiation line RS. That is, the first irradiation side R1a is parallel to the first baseline C1. Furthermore, the first irradiation side R1a is separated from the first baseline C1 by a predetermined distance. The predetermined distance is, for example, 70 μm. The first irradiation corner R1b connects the first irradiation side R1a to the second irradiation side R2a, which will be described later. The first irradiation corner R1b is at the corner of the first irradiation side R1a and the second irradiation side R2a, corresponding to the hypotenuse of a right isosceles triangle with a side length of 0.4 mm.

[0105] Next, the operation along the first irradiation line R1 is performed (process S5d). The speed of the laser head is, for example, 6000 mm / min.

[0106] Next, the definition of the second irradiation line R2 is performed (step S5e: refer to...). Figure 14 (a)). The second irradiation line R2 includes a second irradiation side R2a and a second irradiation corner R2b. The second irradiation side R2a is continuous with the first irradiation corner R1b. The second irradiation side R2a is parallel to the second baseline C2. Furthermore, the second irradiation side R2a is separated from the second baseline C2 by a predetermined distance. The predetermined distance is, for example, 70 μm. The second irradiation corner R2b connects the second irradiation side R2a to the third irradiation side R3a, which will be described later. The second irradiation corner R2b is at the corner of the second irradiation side R2a and the third irradiation side R3a, corresponding to the hypotenuse of a right isosceles triangle with a side length of 0.4 mm.

[0107] Next, the operation along the second irradiation line R2 is performed (step S5f). The speed of the laser head is, for example, 6000 mm / min.

[0108] Next, the definition of the third irradiation line R3 is performed (step S5g: refer to...). Figure 14(b) The third irradiation line R3 comprises a third irradiation side R3a and a third irradiation corner R3b. The third irradiation side R3a is continuous with the second irradiation corner R2b. The third irradiation side R3a is parallel to the third baseline C3. Furthermore, the third irradiation side R3a is separated from the third baseline C3 by a predetermined distance. The predetermined distance is, for example, 70 μm. The third irradiation corner R3b connects the third irradiation side R3a to the fourth irradiation side R4a, which will be described later. The third irradiation corner R3b is at the corner of the third irradiation side R3a and the fourth irradiation side R4a, corresponding to the hypotenuse of a right isosceles triangle with a side length of 0.4 mm.

[0109] Next, the operation along the third irradiation line R3 is performed (process S5h). The speed of the laser head is, for example, 6000 mm / min.

[0110] Next, the fourth irradiation line R4 is defined (procedure S5i: refer to...). Figure 15 (a) The fourth irradiation line R4 includes a fourth irradiation edge R4a and a fourth irradiation corner R4b. The fourth irradiation edge R4a is continuous with the third irradiation corner R3b. The fourth irradiation edge R4a is parallel to the fourth baseline C4. Furthermore, the fourth irradiation edge R4a is separated from the fourth baseline C4 by a predetermined distance. The predetermined distance is, for example, 70 μm. The fourth irradiation corner R4b connects the fourth irradiation edge R4a to the rear irradiation line RE, which will be described later. The fourth irradiation corner R4b is located at the corner of the fourth irradiation edge R4a and the rear irradiation line RE, corresponding to the hypotenuse of a right isosceles triangle with a side length of 0.4 mm. Here, the fourth irradiation corner R4b intersects with the front irradiation line RS. In addition, the end point of the fourth irradiation corner R4b is located at a predetermined distance separated from the front irradiation line RS outward. The predetermined distance is, for example, 100 μm.

[0111] Next, the operation along the fourth irradiation line R4 is performed (process S5j). The speed of the laser head is, for example, 6000 mm / min.

[0112] Next, the post-irradiation line (RE) is defined (procedure S5k: refer to...). Figure 15 (b) The rear irradiation line RE is parallel to the front irradiation line RS and the first irradiation edge R1a. In a direction parallel to the first baseline C1, the rear irradiation line RE repeats the front irradiation line RS. Therefore, the rear irradiation line RE extends parallel to the first baseline C1 and to the front irradiation line RS.

[0113] Next, the operation along the back irradiation line RE is performed (process S5m). The speed of the laser head, for example, is 6000 mm / min.

[0114] Then, define the release line RL (procedure S5n: refer to...). Figure 16The release line RL is parallel to the first irradiation edge R1a. The endpoint of the release line RL is located on the second baseline C2. That is, the release line RL runs along the first baseline C1, including the portion that overlaps with the first irradiation edge R1a and the portion that overlaps with the first irradiation corner R1b.

[0115] Next, the operation along the release line RL is performed (step S5p). The laser head speed, for example, is 15000 mm / min. That is, the laser head speed along the release line RL is faster than the laser heads speeds of the first irradiation line R1, the second irradiation line R2, the third irradiation line R3, and the fourth irradiation line R4. Due to this operation, the irradiation time per unit length of laser beam decreases. That is, the irradiation energy applied to the resin frame 9 gradually decreases. Furthermore, the operation along the release line RL gradually increases the distance from the resin frame 9 to the laser head. Due to this operation, the laser focal point position moves upwards. That is, the irradiation energy applied to the resin frame 9 gradually decreases. Based on these operations, the depth of the groove can be gradually reduced.

[0116] By performing the above process S5, the protective film 13 can be cut off.

[0117] Secondly, such as Figure 17 As shown in (a), the portion outside the cut section of the protective film 13 via laser L is removed. As a result, the solder pad 5 is exposed (step S6). The portion outside the cut section includes the portion opposite to the injection surface. Next, as... Figure 17 As shown in (b), uncured resin material is applied along the resin frame 9 (step S7). The uncured resin material is formed to cover the outer edge 13a of the protective film 13 and the resin frame 9. The uncured resin material is, for example, an ultraviolet-cured acrylic resin. Then, the uncured resin material is irradiated with ultraviolet light. As a result, the resin material cures, thus forming a coating resin 14.

[0118] The resin material is supplied from the syringe needle to the top of the resin frame 9. In other words, the resin material is supplied to the highest position of the resin frame 9. That is, the syringe needle is configured such that the center line of the syringe needle coincides with the center line of the resin frame 9.

[0119] The resin material supplied to the resin frame 9 flows along the surface of the resin frame 9 toward the substrate 2. The extent to which the resin material flows along the surface of the resin frame 9 is determined by the material properties of the resin material. Examples of such material properties include viscosity and thixotropy. High-viscosity resin materials are less likely to flow. Thixotropy, on the other hand, is a property where viscosity changes over time. It serves as an indicator of the ease with which a material retains its shape. A material with high thixotropy will decrease in viscosity and approach liquid level if subjected to continuous shear stress. Conversely, a material with high thixotropy will gradually increase in viscosity and approach solid level if left undisturbed. The resin material used in this embodiment has relatively high viscosity and thixotropy. Therefore, after being supplied to the surface of the resin frame 9, the resin material becomes less likely to flow along the surface.

[0120] For example in Figure 18 In the comparative example shown in (a), the resin frame 109 has a groove 130 formed in its center. Uncured resin material 14S covers the repeating portion H1 on the surface of the protective film 13. The end of the repeating portion H1 includes the outer edge 13a of the protective film 13. The outer edge 13a is, as described, an uneven surface. Therefore, the highly thixotropic resin material will be hindered from deforming due to the unevenness and will not flow downwards easily. As a result, it may be difficult to adequately cover the outer edge 13a with the coating resin 14.

[0121] In addition, Figure 18 In the resin frame 9 shown in (b) of this embodiment, the groove 30 is formed on the outer side of the resin frame 9. This outer side is the pad 5 side. According to this structure, the outer edge 13a of the protective film 13 is also formed near the outer side (pad 5 side). In other words, compared to the comparative example, the repeating portion H2 of the protective film 13 formed on the resin frame 9 is increased. As a result, when uncured resin material 14S is supplied to the resin frame 9, the resin material 14S can cover a sufficient area including the outer edge 13a. Furthermore, the scintillator layer 8 side of the resin material 14S can be sufficiently far away from the outer edge 13a. As a result, the resin material 14S is less affected by the unevenness of the outer edge 13a. Therefore, since the uncured resin material 14S becomes easier to flow downward, the repeating area can be further expanded. That is, by offsetting the position of the groove 30 from the center of the resin frame 9, the outer edge 13a can be sufficiently covered by the covering resin 14.

[0122] The groove 30 of the embodiment can achieve other advantageous effects in the formation of the coating resin 14. See again... Figure 18(a) The resin frame 109 of the comparative example is formed by irradiating the same position twice with a laser. As a result, the depth of the groove 130 is increased. In other words, the ratio of the opening width to the depth of the groove 130 is large. That is, the groove 130 is a deep, narrow groove. In such a groove 130, the resin material 14S with high viscosity and thixotropy is not easy to enter. As a result, the resin material 14S is not filled in the entire groove 130. Therefore, it is also possible to form a closed cavity 130S at the bottom of the groove 130. If such a closed cavity 130S exists, the air present in the cavity 130S will expand, for example, when the substrate 2 is heated. Due to the expansion of the air, there is also a possibility of adverse effects on the protective film 13 and the scintillator layer 8.

[0123] in addition, Figure 18 The groove 30 shown in embodiment (b) has a smaller opening width and depth compared to the comparative example. This is because it avoids repeated irradiation of the same position on the resin frame 9 by the laser. With such a groove 30, even a resin material 14S with high viscosity and thixotropy can fill the entire groove 30 well. As a result, the formation of voids 130S can be prevented. Therefore, any adverse effects on the protective film 13 and the scintillator layer 8 that may occur during heat treatment can be eliminated.

[0124] The protective film 13 may also be attached to the photoelectric conversion element array 7 via the resin frame 9 without the coating resin 14. However, by forming the coating resin 14, the protective film 13 containing the first organic film 10 is sandwiched between the resin frame 9 and the coating resin 14. That is, the protective film 13 is fixed. As a result, the adhesion of the protective film 13 to the photoelectric conversion element array 7 can be further improved. Therefore, the scintillator 8a is sealed by the protective film 13. As a result, moisture can be reliably prevented from penetrating the scintillator 8a. That is, the degradation of the scintillator 8a due to moisture absorption can be prevented, thus preventing a decrease in the resolution of the element.

[0125] <Effects>

[0126] The radiation detector 1 includes: a photoelectric conversion element array 7 having a light-receiving portion 3 comprising a plurality of photoelectric conversion elements 3a arranged in one or two dimensions, and a plurality of pads 5 electrically connected to the photoelectric conversion elements 3a and disposed outside the light-receiving portion 3; a scintillator layer 8, which is stacked on the photoelectric conversion element array 7 to cover the light-receiving portion 3 for converting radiation into light; a resin frame 9, which, when viewed from the stacking direction A of the scintillator layer 8, is separated from the scintillator layer 8 and the pads 5, passes between the scintillator layer 8 and the pads 5, and surrounds the scintillator layer 8; and a protective film 13, which covers the scintillator layer 8 and has an outer edge 13a located on the resin frame 9. A groove 30 is formed in the resin frame 9, continuous with the outer edge 13a of the protective film 13. The groove 30 has a repeating region 31, which includes a first groove end 32 and a second groove end 33 that are partially repeated in a direction intersecting the extending direction of the groove 30.

[0127] The groove 30 of the resin frame 9 of the radiation detector 1 is continuous with the outer edge 13a of the protective film 13. Therefore, the groove 30 is formed along with the outer edge 13a of the protective film 13, which is irradiated by a laser. With the groove 30 formed on the resin frame 9, the protective film 13 formed on the resin frame 9 is reliably cut off. The groove 30 has a repeating region 31 including a first groove end 32 and a second groove end 33. Due to the partial repetition of the first groove end 32 and the second groove end 33, the depth of the groove 30 does not become excessively deep in the repeating region 31. As a result, not only the protective film 13, but also the resin frame 9 can be reliably prevented from being reached by laser. That is, the protective film 13 can be reliably cut off. Furthermore, the surface of the photoelectric conversion element array 7 on which the resin frame 9 is provided is not damaged by laser irradiation. Therefore, the generation of defective products can be suppressed, and productivity can be improved.

[0128] The first groove end 32 and the second groove end 33 partially repeat in a direction that intersects the extension direction relative to the groove 30. In the partially repeated portion, the first groove end 32 connects to the second groove end 33. Therefore, the protective film 13 can be reliably separated from the scintillator layer 8 side and the pad 5 side on the resin frame 9. As a result, the photoelectric conversion element array 7 is not damaged, and the protective film 13 on the bonding side can be removed.

[0129] The radiation detector 1 also includes a coating resin 14 covering the outer edge 13a of the protective film 13. This structure can suppress the peeling of the protective film 13.

[0130] The coating resin 14 also covers the resin frame 9. The edge 14e of the coating resin 14, which covers the surface in contact with the resin frame 9, is formed on the resin frame 9 and has adhesiveness and thixotropy that allows it to remain on the resin frame 9. According to this structure, the coating resin 14 will not reach the surface of the photoelectric conversion element array 7 located outside the resin frame 9, nor will it reach the pads 5. Therefore, the surface of the photoelectric conversion element array 7 and the pads 5 can be kept clean, respectively.

[0131] The central portion of the resin frame 9 is higher than its two edges. The groove 30 is located on the resin frame 9, biased towards the pad 5. With this structure, the covering resin 14 can reliably cover the outer edge 13a of the protective film 13.

[0132] The width of the resin frame 9 is greater than 700 micrometers and less than 1000 micrometers. Based on this structure, the radiation detector 1 can be miniaturized.

[0133] The height of the resin frame 9 is greater than 100 micrometers and less than 300 micrometers. Based on this structure, the radiation detector 1 can be miniaturized.

[0134] The photoelectric conversion element array 7 is rectangular in shape. The resin frame 9 has a first side 9a, a second side 9b, a third side 9c, and a fourth side 9d surrounding the scintillator layer 8. A repeating region 31 is provided on the first side 9a. According to this structure, the peeling of the protective film 13 can be further suppressed.

[0135] The method for manufacturing a radiation detector 1 includes: a step S2 of preparing a light-receiving part 3 having a plurality of photoelectric conversion elements 3a arranged in one or two dimensions, and a plurality of pads 5 electrically connected to the photoelectric conversion elements 3a and disposed on the outside of the light-receiving part 3; a step S3 of stacking a scintillator layer 8 that converts radiation into light onto the photoelectric conversion element array 7 such that it covers the light-receiving part 3; a step S4a, S4b, and S4c of disposing a resin frame 9 on the photoelectric conversion element array 7 such that it surrounds the scintillator layer 8 when viewed from the stacking direction of the scintillator layer 8; a step S5 of forming a protective film 13 such that it covers the entire surface of the photoelectric conversion element array 7 on the side where the scintillator layer 8 is stacked and the surface of the resin frame 9; a step S5 of cutting the protective film 13 by irradiating the resin frame 9 with a laser; and a step S6 of removing the outer portion of the protective film 13. In step S5, when the protective film 13 is cut, a laser is irradiated to form an outer edge 13a of the protective film 13 due to the cutting of the protective film 13. A groove 30 is formed in the resin frame 9 that is continuous with the outer edge 13a of the protective film 13. The groove 30 has a repeating region 31, which includes a first groove end 32 and a second groove end 33 that are partially repeated in a direction that intersects with the extension direction of the groove 30.

[0136] In the manufacturing method of the radiation detector 1, in step S5 of cutting the protective film 13, the outer edge 13a of the protective film 13 is formed, and the groove 30 of the resin frame 9 is formed. Furthermore, with the groove 30 formed on the resin frame 9, the protective film 13 formed on the resin frame 9 is reliably cut. The groove 30 has a repeating region 31 including a first groove end 32 and a second groove end 33. Due to the repetition of the first groove end 32 and the second groove end 33, the depth of the groove 30 does not become excessively deep in the repeating region 31. As a result, not only the protective film 13, but also the laser can reliably prevent penetration into the resin frame 9. That is, the protective film 13 can be reliably cut. Furthermore, the surface of the photoelectric conversion element array 7 on which the resin frame 9 is provided is not damaged by laser irradiation. Therefore, the generation of defective products can be suppressed, and productivity can be improved.

[0137] In the manufacturing method of the radiation detector 1, the photoelectric conversion element array 7 is rectangular in shape. The resin frame 9 has a first side 9a, a second side 9b, a third side 9c, and a fourth side 9d surrounding the scintillator layer 8. In the step S5 of cutting the protective film 13, a repeating region 31 is provided on the first side 9a. According to this step S5, the peeling of the protective film 13 can be further suppressed.

[0138] In the manufacturing method of the radiation detector 1, the step S5 of cutting the protective film 13 includes: a step S5s of setting at least one of the positions of the four corners formed by the first side portion 9a as a reference position; and a step S5r of irradiating the first side portion 9a with laser light according to the reference position. According to these steps S5s and S5r, the position to be irradiated with laser light can be controlled with good precision.

[0139] In the manufacturing method of the radiation detector 1, the panel protection part is a resin frame 9. In the process of arranging the resin frame 9, the resin frame 9 is arranged on the photoelectric conversion element array 7 in a manner that separates it from the scintillator layer 8 and the pads 5, passes between the scintillator layer 8 and the pads 5, and surrounds the scintillator layer 8. According to this process S3, the radiation detector 1 having the resin frame 9 can be manufactured.

[0140] In the manufacturing method of the radiation detector 1, in step S3 of configuring the resin frame 9, the resin frame 9 is formed such that the central portion of the resin frame 9 is higher than the two edges of the resin frame 9. In step S5 of cutting the protective film 13, a laser is irradiated onto a position on the resin frame 9 that is biased towards the pad 5. According to these steps S3 and S5, the outer edge 13a of the protective film 13 can be reliably covered by the coating resin 14.

[0141] The radiation detector of the present invention has been described in detail above according to the first embodiment. However, the radiation detector of the present invention is not limited to the first embodiment. Various modifications can be made to the present invention without departing from its technical concept. For example, the protective film 13 has a structure in which an inorganic film 11 is sandwiched between a first organic film 10 made of parylene and a second organic film 12. That is, the material of the first organic film 10 is the same as the material of the second organic film 12. For example, the material of the first organic film 10 may also be different from the material of the second organic film 12. In addition, when a highly corrosive material is used as the inorganic film 11, the second organic film 12 may be omitted from the protective film 13. The light-receiving part 3 of the radiation detector 1 has a plurality of photoelectric conversion elements 3a arranged in two dimensions. The light-receiving part 3 may also have a plurality of photoelectric conversion elements 3a arranged in one dimension. The pads 5 may also be formed on two sides of the rectangular radiation detector 1. Furthermore, the pads 5 may also be formed on three sides of the rectangular radiation detector 1. In addition, in the first embodiment, a method for performing laser processing by moving the laser head was described. For example, laser irradiation can be performed while the stage on which the radiation detector 1 is mounted is moved.

[0142] <Second Implementation Method>

[0143] The following describes the radiation detector 1A according to the second embodiment and its manufacturing method. The radiation detector 1 of the first embodiment uses a resin frame 9 as a panel protection part. Specifically, during the manufacturing process of the radiation detector 1, in the step of cutting the protective film 13, the resin frame 9 is used as a component to protect the photoelectric conversion element array 7 from laser influence. The radiation detector 1 includes the resin frame 9 as a constituent element.

[0144] The radiation detector 1A of the second embodiment uses a shielding member M1 (see reference). Figure 25 (etc.), when the protective film 13 is cut, it serves as a component to protect the photoelectric conversion element array 7 from the influence of laser. The shielding component M1 is removed after the step S15 of cutting the protective film 20. The radiation detector 1A does not include the shielding component M1 as a component.

[0145] like Figure 19 and Figure 20 As shown, the radiation detector 1A includes: a photoelectric conversion element array 7, a scintillator layer 8, and a protective film 20. The photoelectric conversion element array 7 and the scintillator layer 8 are the same as in the first embodiment. Therefore, a detailed description of the photoelectric conversion element array 7 and the scintillator layer 8 is omitted. Hereinafter, the protective film 20 will be described in detail.

[0146] The protective film 20 has a body portion 21 and an outer edge portion 22. The body portion 21 covers the scintillator layer 8. A first organic film 10 is disposed on the scintillator layer 8. The first organic film 10 can be embedded between each of the plurality of scintillators 8a in a columnar structure. The outer edge portion 22 is disposed on the outer side of the body portion 21. The outer edge portion 22 is continuous with the body portion 21.

[0147] The outer edge portion 22 has a contact portion 23 and an extension portion 24. The contact portion 23 is in close contact with the photoelectric conversion element array 7 in the region K between the scintillator layer 8 and the pad 5. For example, a portion of the first organic film 10 on the scintillator layer 8 side of the contact portion 23 has a surface that is in close contact with the photoelectric conversion element array 7. As a result, the contact portion 23 is in close contact with the photoelectric conversion element array 7. By increasing the contact surface, the adhesion of the photoelectric conversion element array 7 to the contact portion 23 can be improved. In other words, increasing the contact surface means increasing the length g1+g2 of the contact portion.

[0148] The adhering portion 23 has a first portion 23a and a second portion 23b. The first portion 23a is located on the side of the body portion 21. The first portion 23a has a first organic film 10, an inorganic film 11, and a second organic film 12. The first portion 23a has a three-layer structure. The second portion 23b is located on the opposite side of the body portion 21, separated from the first portion 23a. The second portion 23b has a first organic film 10 and a second organic film 12. The second portion 23b has a two-layer structure. The outer edge end 11a of the inorganic film 11 is located further inward than the outer edge end 20a of the protective film 20. In other words, it is located on the side of the scintillator layer 8. In the first portion 23a, the inorganic film 11 is sandwiched between the outer edge end 10b of the first organic film 10 and the outer edge end 12b of the second organic film 12. The second part 23b is located further outward than the outer edge 11b of the inorganic film 11. In other words, the second part 23b is located closer to the pad 5 than the outer edge 11b of the inorganic film 11. The outer edge 10b of the first organic film 10 is joined to the outer edge 12b of the second organic film 12 in the second part 23b. When the first organic film 10 and the second organic film 12 are made of the same material, the first organic film 10 and the second organic film 12 can also be integrated. In the adhering portion 23, the outer edges 10b of the first organic film 10 and the outer edges 12b of the second organic film 12 cooperate to surround the outer edge 11b of the inorganic film 11.

[0149] The extension 24 has a two-layer structure consisting of a first organic film 10 and a second organic film 12. The extension 24 extends from the adhesive portion 23 toward the opposite side of the photoelectric conversion element array 7 in a self-standing state. The extension 24 is located on the outermost edge 20a side of the protective film 20. The outer edge 10a of the first organic film 10 and the outer edge 12a of the second organic film 12 constitute the outer edge 20a of the protective film 20. The extension 24 has a standing portion 24a and a sheet portion 24b. The standing portion 24a extends toward the normal direction of the surface of the photoelectric conversion element array 7, with the portion of the adhesive portion 23 opposite to the main body portion 21 as its base end. Here, "self-standing state" means that the standing portion 24a can stand upright without being held or supported by a certain component. Such a component is, for example, resin. The base end portion of the standing portion 24a is connected to the adhesive portion 23. The portion of the erected part 24a other than its base portion does not come into contact with any element of the radiation detector 1A.

[0150] The upright portion 24a extends in a self-standing state in the normal direction of the surface of the photoelectric conversion element array 7. In other words, the upright portion 24a is upright from the photoelectric conversion element array 7. However, the extending direction of the upright portion 24a is not limited to this. The upright portion 24a may extend in a self-standing state along a direction intersecting the direction parallel to the surface of the photoelectric conversion element array 7. For example, the upright portion 24a may be inclined towards the pad 5 side based on the upright state of the photoelectric conversion element array 7. The upright portion 24a may also be inclined towards the scintillator layer 8 side based on the upright state of the photoelectric conversion element array 7. In addition, the shape of the upright portion 24a is not limited to a plane. The shape of the upright portion 24a may be, for example, a curved surface.

[0151] The plate portion 24b protrudes from the upper part of the upright portion 24a toward the pad 5. The direction in which the plate portion 24b protrudes is parallel to the surface of the photoelectric conversion element array 7. However, the direction in which the plate portion 24b protrudes is not limited to being parallel to the surface of the photoelectric conversion element array 7. The direction in which the plate portion 24b protrudes may differ from the direction in which the upright portion 24a extends. For example, the plate portion 24b may be inclined to gradually approach the photoelectric conversion element array 7, based on a state of being parallel to the surface of the photoelectric conversion element array 7. Alternatively, the plate portion 24b may be inclined to gradually separate from the photoelectric conversion element array 7. Furthermore, the shape of the plate portion 24b is not limited to a plane. The shape of the plate portion 24b may, for example, be a curved surface.

[0152] exist Figure 20In this text, lengths g1 and g2 represent the lengths of the contact portion 23. Specifically, length g1 represents the length of the first portion 23a of the contact portion 23. Length g2 represents the length of the second portion 23b of the contact portion 23. The total length of lengths g1 and g2 is, for example, approximately 1000 μm. Alternatively, the total length of lengths g1 and g2 is, for example, less than 1000 μm. Length g3 is the height of the raised portion 24a. In other words, length g3 is the height of the extension portion 24. Length g3 is, for example, more than 80 μm and less than 250 μm. Length g4 represents the length of the sheet portion 24b of the extension portion 24. Length g4 is, for example, approximately 300 μm. Alternatively, length g4 is, for example, less than 300 μm. Length g5 is the distance from the boundary between the contact portion 23 and the extension portion 24 to the pad 5. Length g5 is longer than length g4. For example, the length g5 is longer than the length g4 by tens to hundreds of μm. According to this structure, the extension 24 will not interfere with the pad 5.

[0153] Describe the external shape of the radiation detector 1A. Figure 21 This is a three-dimensional view schematically showing the corner portion of the radiation detector 1A. Figure 22 It is a schematic representation of from and Figure 21 Stereoscopic views of the angular portions of the radiation detector 1A viewed from different angles. Furthermore, in Figure 22 In the diagram, a cross-section of the scintillator layer 8, covered by the protective film 20, is shown to reveal its structure. Figure 22 The dashed lines represent multiple scintillators 8a with a columnar structure. From Figure 21 and Figure 22 It can also be seen that the outer edge 22 of the protective film 20 has a close-fitting portion 23 and an extension portion 24. The upright portion 24a is inclined toward the pad 5. In addition, the sheet portion 24b may also be inclined toward the pad 5. Furthermore, the connection between the upright portion 24a and the sheet portion 24b is not bent at a right angle. In other words, the connection between the upright portion 24a and the sheet portion 24b may be smoothly bent.

[0154] <The Function and Effects of Radiation Detectors>

[0155] The effects of the radiation detector 1A are explained below. In the radiation detector 1A, the outer edge 22 of the protective film 20 covering the scintillator layer 8 has a contact portion 23 that is in close contact with the photoelectric conversion element array 7. The contact portion 23 prevents moisture from entering the scintillator layer 8 from between the protective film 20 and the photoelectric conversion element array 7. Furthermore, the outer edge 22 of the protective film 20 has an extension portion 24. The extension portion 24 extends in a self-standing state in the direction opposite to that from the contact portion 23 towards the photoelectric conversion element array 7. If the outer edge 22 of the protective film 20 does not have the extension portion 24, the outer edge end 20a of the protective film 20 is contained within the contact portion 23. In this case, in particular, the adhesion between the portion of the outer edge end 20a of the protective film 20 in the contact portion 23 and the photoelectric conversion element array 7 becomes difficult to ensure. As a result, moisture easily penetrates into the scintillator layer 8 from the boundary between the contact portion 23 and the photoelectric conversion element array 7.

[0156] In contrast, the outer edge 22 of the protective film 20 of the radiation detector 1A has an extension 24. The outer edge 20a of the protective film 20 is not included in the contact portion 23. That is, the contact portion 23 and the photoelectric conversion element array 7 can be sufficiently ensured. As a result, the moisture resistance of the scintillator layer 8 can be improved compared to the case without the extension 24. Therefore, even if the outer edge of the protective film 20 is not held by the resin member (resin frame 9) as in the first embodiment, the moisture resistance of the scintillator layer 8 can be maintained. Furthermore, since it is not necessary to provide a resin member to support the outer edge of the protective film 20, the region K between the scintillator layer 8 and the pad 5 can be narrowed. For example, when the width of the resin frame 9 is about 900 μm, the region K can be reduced to a length equivalent to the width of the resin frame 9. Therefore, according to the radiation detector 1A, both the moisture resistance of the scintillator layer 8 and the expansion of the region K between the scintillator layer 8 and the pad 5 can be ensured. In other words, the radiation detector 1A can reduce the region K. As a result, the length of the signal line 4 that electrically connects the light-receiving part 3 to the pad 5 can be shortened. Therefore, the transmission time of the electrical signal can be shortened. In addition, since the signal line 4 is shortened, the increase in noise can be suppressed.

[0157] The protective film 20 includes an inorganic film 11, a first organic film 10, and a second organic film 12. The first organic film 10 is disposed on the side of the scintillator layer 8 opposite to the inorganic film 11. The second organic film 12 is disposed on the opposite side of the scintillator layer 8 opposite to the inorganic film 11. By including the inorganic film 11 in the protective film 20, light generated in the scintillator layer 8 can be prevented from leaking to the outside. In other words, light generated in the scintillator layer 8 can be prevented from leaking to parts other than the light-receiving part 3. As a result, the sensitivity of the radiation detector 1A can be increased. The first organic film 10 and the second organic film 12 are disposed on both sides of the inorganic film 11. According to this structure, the first organic film 10 and the second organic film 12 can also protect the inorganic film 11.

[0158] The outer edge 11a of the inorganic membrane 11 is located further inward than the outer edge 20a of the protective membrane 20. The outer edges 10a of the first organic membrane 10 and 12a of the second organic membrane 12 constitute the outer edge 20a of the protective membrane 20. The outer edge 10b of the first organic membrane 10 is located further outward than the outer edge 11a of the inorganic membrane 11 and is joined to the outer edge 12b of the second organic membrane 12. The outer edges 10b of the first organic membrane 10 and 12b of the second organic membrane 12 cover the outer edge 11b of the inorganic membrane 11. For example, even if the adhesion between the inorganic membrane 11 and the first organic membrane 10 is poor, or the adhesion between the inorganic membrane 11 and the second organic membrane 12 is poor, the outer edge 11b of the inorganic membrane 11 can still be sealed by the outer edges 10b of the first organic membrane 10 and 12b of the second organic membrane 12. Therefore, the adhesion of the second organic membrane 12 to the first organic membrane 10 can be ensured.

[0159] The inorganic film 11 is a metallic film made of aluminum or silver. Therefore, the light reflectivity of the inorganic film 11 can be made good.

[0160] The height of the extension 24 is between 80 μm and 250 μm. Therefore, the moisture resistance of the scintillator layer 8 can be more reliably ensured.

[0161] The extension 24 has a raised portion 24a and a sheet portion 24b. The sheet portion 24b protrudes from the upper part of the raised portion 24a toward the pad 5. The extension 24 has not only a raised portion 24a but also a sheet portion 24b. Therefore, the outer edge 20a of the protective film 20 can be sufficiently far away from the contact portion 23. As a result, the adhesion of the photoelectric conversion element array 7 to the contact portion 23 can be more reliably ensured. Even in this case, the length of the sheet portion 24b is, for example, about 300 μm. Or, the length of the sheet portion 24b is, for example, 300 μm or less. Therefore, the area K between the scintillator layer 8 and the pad 5 can be reduced.

[0162] For example, during the wiring process, when conductive components such as wires are bonded to pads 5, there is a possibility that foreign objects or the like may fly from the bonding portion toward the scintillator layer 8. Even in this case, the extension 24 can function as a protective wall to prevent damage to the scintillator layer 8 from foreign objects or the like. Thus, contamination of the scintillator layer 8 can be prevented during bonding.

[0163] The photoelectric conversion element array 7 is also expensive. If, during manufacturing process inspections, the radiation detector 1A fails to meet quality standards, the photoelectric conversion element array 7 may be reused. In this case, after removing the scintillator layer 8 provided on the photoelectric conversion element array 7, a new scintillator layer 8 is provided on the photoelectric conversion element array 7. Therefore, the protective film 20 must be removed. According to the radiation detector 1A of this embodiment, the outer edge 22 of the protective film 20 has an extension 24. For example, when peeling the protective film 20 from the photoelectric conversion element array 7, the extension 24 can be held and lifted upwards, using the extension 24 as the starting point for peeling. Therefore, the protective film 20 is easier to remove due to the extension 24.

[0164] <Manufacturing Method of Radiation Detector>

[0165] Secondly, refer to Figures 23 to 28 This describes the various steps involved in manufacturing the radiation detector 1A. First, as... Figure 23 As shown in (a), the photoelectric conversion element array 7 is prepared (step S11). Next, as... Figure 23 As shown in (b), a scintillator layer 8 is provided on the photoelectric conversion element array 7 to cover the light-receiving part 3 (process S12).

[0166] Secondly, such as Figure 24 As shown in (a), a shielding member M1 is provided on the photoelectric conversion element array 7 to cover the pads 5 (step S13). An example of the shielding member M1 is a UV-curable shielding tape. Hereinafter, the UV-curable shielding tape will simply be referred to as "UV tape". The pads 5 are arranged in multiple ways along the outer edge of the substrate 2. Therefore, firstly, the length direction of the UV tape is aligned with the direction in which the pads 5 are arranged. Secondly, the adhesive surface of the UV tape is adhered to the photoelectric conversion element array 7 such that the UV tape covers the pads 5. The thickness of the UV tape can be, for example, about 110 μm. Alternatively, the thickness of the UV tape can be 110 μm or less. Multiple UV tapes can be overlapped to adjust the thickness of the shielding member M1.

[0167] Furthermore, a protective film 20 is formed on the photoelectric conversion element array 7 in a manner that covers the scintillator layer 8, region K, and shielding member M1 (step S14). Specifically, firstly, as Figure 24 As shown in (b), a first organic film 10 is formed (step S14a). For example, the entire surface of the substrate 2 is coated with a material such as parylene using a CVD method. Next, as... Figure 25As shown in (a), an inorganic film 11 is formed on the first organic film 10 (step S14b). For example, an aluminum film is deposited onto the inorganic film 11 by vapor deposition. Here, it is also possible to leave the pads 5 uncovered by the inorganic film 11. In this case, it is preferable to shield the pads 5 with a shielding member M2 before vapor deposition of the aluminum film. The shielding member M2 is preferably, for example, a UV tape. Next, as Figure 25 As shown in (b), a second organic film 12 is formed (step S14c). For example, the entire surface of the substrate 2 is coated again with parylene or the like by CVD.

[0168] Next, as Figure 26 As shown, the protective film 20 is cut on the shielding member M1 by irradiating it with laser L (step S15). For example, the laser head (not shown) irradiating the laser L is moved on a stage (not shown) on which the substrate 2 is placed. As a result, the laser L scans along the edge of the scintillator layer 8 side of the shielding member M1.

[0169] That is Figure 27 As shown, the shielding member M1 has a first side portion M1a, a second side portion M1b, a third side portion M1c, and a fourth side portion M1d. Furthermore, the laser L is irradiated by forming a groove 30A with a repeating region 31A in the first side portion M1a of the shielding member M1. The specific process is the same as process S7 in the first embodiment.

[0170] Then, the masking member M1 is removed (step S16). Specifically, the masking member M1 is removed by reducing the adhesive force of the adhesive surface of the masking member M1, which is a UV strip. First, as... Figure 28 As shown in (a), the shielding member M1 is irradiated with ultraviolet light (step S16a). The ultraviolet light reaches the shielding member M1 through the protective film 20. By receiving ultraviolet light irradiation, the shielding member M1 loses the adhesive force of the adhesive surface. Then, as... Figure 28 As shown in (b), the shielding member M1 is removed (step S16b). In the cut protective film 20, the portion covering the shielding member M1 is also removed along with the shielding member M1. As a result, the pad 5 is exposed.

[0171] <Effects>

[0172] In the manufacturing method of the radiation detector 1A, the panel protection part is a shielding member M1. In step S13, where the shielding member M1 is disposed, the shielding member M1 is disposed on the photoelectric conversion element array 7 to cover the area K between the scintillator layer 8 and the pad 5, and the pad 5. In step S14, where the protective film 20 is formed, the protective film 20 is formed on the entire surface of the photoelectric conversion element array 7 on the side where the scintillator layer 8 is stacked, and on the surface of the shielding member M1. According to this step S14, a radiation detector 1A without the resin frame 9 can be manufactured. That is, the distance between the scintillator layer 8 and the pad 5 can be shortened. Therefore, the radiation detector 1A can be further miniaturized.

[0173] The manufacturing method of the radiation detector 1A includes a step S16b of removing the shielding member M1 after the step S16a of removing the outer portion of the protective film 20. According to these steps S16a and S16b, the radiation detector 1A without the resin frame 9 can be ideally manufactured.

[0174] like Figure 29 As shown, the manufacturing method of the radiation detector 1A includes, after step S16a of removing the outer portion of the protective film 20, a step of forming a coating resin 14A covering the outer edge 20a of the protective film 20. According to this step, the peeling of the outer edge 20a of the protective film 20 can be further suppressed.

[0175] According to the manufacturing method of the radiation detector 1A, the pad 5 is covered by a shielding member M1. Furthermore, the scintillator layer 8, the area between the scintillator layer 8 and the pad 5, and the shielding member M1 are covered by a protective film 20. Thus, the protective film 20 has a contact portion 23 in the area K between the scintillator layer 8 and the pad 5, which is in close contact with the photoelectric conversion element array 7. Additionally, a step difference is created between the end face of the shielding member M1 and the photoelectric conversion element array 7 due to the thickness of the shielding member M1. The protective film 20 is formed along this step difference. Thus, the protective film 20 has an extension portion 24 extending from the contact portion 23 toward the opposite side of the photoelectric conversion element array 7. Then, laser L is irradiated along the edge of the shielding member M1 on the scintillator layer 8 side. As a result, the protective film 20 is cut on the shielding member M1. Then, the shielding member M1 is removed. Thus, the pad 5 is exposed. And, the extension portion 24 stands upright without contacting the shielding member M1. Additionally, the extension 24 has a raised portion 24a and a sheet portion 24b. The raised portion 24a is formed along the step difference created by the edge of the shielding member M1. The sheet portion 24b is formed between the raised portion 24a and the edge of the shielding member M1 that is irradiated by the laser.

[0176] The radiation detector 1A has a contact portion 23 and an extension portion 24. The contact portion 23 is in close contact with the photoelectric conversion element array 7 in the region K between the scintillator layer 8 and the pad 5. The extension portion 24 extends from the contact portion 23 toward the opposite side of the photoelectric conversion element array 7 in a self-standing state. Furthermore, the extension portion 24 includes a raised portion 24a and a sheet portion 24b. With these configurations, the moisture resistance of the scintillator layer 8 can be maintained. Furthermore, the region K between the scintillator layer 8 and the pad 5 can be reduced.

[0177] Here, it is considered that there is a possibility that the pad 5 might be damaged due to irradiation by the laser L. However, in the manufacturing method of the radiation detector 1A, when the protective film 20 is cut, the pad 5 is covered by the shielding member M1. At this time, the shielding member M1 functions as an absorption layer to absorb the laser L. Therefore, even if the laser L irradiates the pad 5, damage to the pad 5 can be prevented.

[0178] In the manufacturing method of the radiation detector 1A, the protective film 20 is cut by irradiation with laser L (step S15). According to step S15, the adhering portion 23 and the extension portion 24 can be formed with good precision on the outer edge 22 of the protective film 20. Even if the pads 5 are arranged at predetermined intervals along multiple sides (e.g., 2 to 4 sides) instead of along one side of the outer edge of the substrate 2, the laser L can be scanned on each side. Therefore, the adhering portion 23 and the extension portion 24 can be easily formed on the outer edge 22.

[0179] The above describes the second embodiment; however, the present invention is not limited to the second embodiment. For example, the outer edge 11a of the inorganic membrane 11 may together with the outer edge 10a of the first organic membrane 10 and the outer edge 12a of the second organic membrane 12 to form the outer edge 20a of the protective membrane 20.

[0180] The inorganic film 11 can also be a resin film containing a white pigment. Examples of white pigments include alumina, titanium dioxide, zirconium oxide, and yttrium oxide. When a resin film containing a white pigment is used as the inorganic film 11, after forming the second organic film 12, a metal film (e.g., aluminum) and a third protective film (made of the same material as the first and second organic films) are sequentially laminated. The metal film can also be made of aluminum. Furthermore, the third protective film can be made of the same type of material as the first organic film. Also, the third protective film can be made of the same type of material as the second organic film. According to these processes, even a resin-based reflective film with poor moisture resistance can achieve moisture resistance equivalent to that of a metal-based reflective film. Furthermore, higher light output than that of a metal-based reflective film can also be obtained. Thus, an inorganic film 11 with light reflectivity can be achieved.

[0181] <Third Implementation Method>

[0182] In the first embodiment, the formation of excessively deep grooves in the resin frame 9 due to laser irradiation is suppressed. Similarly, in the second embodiment, the formation of excessively deep grooves in the shielding member M1 due to laser irradiation is suppressed. Excessively deep grooves are caused by excessive energy irradiation of either the resin frame 9 or the shielding member M1. One cause of excessive energy irradiation is repeated irradiation of the same position relative to the resin frame 9 and the shielding member M1, the so-called irradiated object. Therefore, in the first and second embodiments, methods for shifting the scan line are provided to prevent repeated irradiation of the same position.

[0183] Hereinafter, a method different from the first and second embodiments will be described. In the following description, examples of methods different from the first and second embodiments will be described that are applicable to the manufacture of the radiation detector 1A of the first embodiment. Furthermore, the method of the third embodiment is also applicable to the manufacture of the radiation detector 1A of the second embodiment.

[0184] Excessive energy irradiation during laser irradiation (step S5) used to cut the protective film 13 may occur due to reasons different from those of irradiating the same location of the irradiated object multiple times.

[0185] Figure 30 (a) and Figure 30 (b) represents the concept of laser control. Figure 30 (a) is the time history of the energy received by the irradiated body. Figure 30 (b) is the time history of the laser head speed.

[0186] Here, a cutoff threshold is defined. The cutoff threshold is the value at which an irradiated object will be cut off if it is irradiated with energy exceeding this value. Furthermore, in this specification, "cutoff" means the formation of a gap in the irradiated object that extends from the surface receiving the laser irradiation to the back surface opposite the surface receiving the laser irradiation. Therefore, if the gap does not extend from the surface receiving the laser irradiation to the back surface and has a bottom, it is not referred to as "cutoff".

[0187] The cutting threshold is determined based on factors such as the type of material and the thickness of the object. Taking the radiation detector 1 of the first embodiment as an example, as... Figure 30 As shown in (a), the cutting threshold Q1 for the protective film 13 and the cutting threshold Q2 for the resin frame 9 are set. The cutting threshold Q2 for the resin frame 9 is larger than the cutting threshold Q1 for the protective film 13. In step S5 of cutting the protective film 13, the protective film 13 is cut but the resin frame 9 is not cut. Therefore, in Figure 30 (a) The energy (Qs) of the laser to be irradiated should be between the cutting threshold Q2 of the resin frame 9 and the cutting threshold Q1 of the protective film 13.

[0188] When laser irradiation begins, the laser energy on the surface of the irradiated object rises from zero (non-irradiation) to a specified energy over a specified time period. Figure 30 (a) t1) is the time it takes for the laser head to move from zero to the specified speed. Figure 30 (b) The t1 to t3) is much shorter.

[0189] Therefore, the laser energy (Q3-Qs) received by the irradiated object per unit time (length) during the acceleration period (t1-t3) from zero to a specified speed is different from the laser energy (Qs) received by the irradiated object per unit time (length) during the constant period (t3-t4) when the laser head moves at the specified speed. Specifically, the laser head's speed (0-Vs) during the acceleration period (t1-t3) is slower than its speed (Vs) during the constant period (t3-t4). Therefore, the laser energy (Q3-Qs) received by the irradiated object during the acceleration period (t1-t3) is greater than that received during the constant period (t3-t4). Thus, if the laser head's speed is too slow during this acceleration period (t1-t3), there may be a situation where excessive energy is irradiated onto the irradiated object. If this energy exceeds the energy (Q2) at which the resin frame 9 is cut off, it may damage the photoelectric conversion element array 7 located under the resin frame 9.

[0190] This phenomenon can also occur when laser irradiation is stopped. Therefore, in order to prevent the irradiated object from receiving excessive energy when laser irradiation begins and ends, the laser irradiation method must be controlled.

[0191] For example, such as Figure 31 As shown, the settings are: the history of the energy received by the irradiated body per unit length (time) from the start of laser irradiation to the end of irradiation (hereinafter referred to as "unit energy"). The energy history includes the period ta for maintaining the unit energy, the period ts for increasing the unit energy, and the period te for decreasing the unit energy.

[0192] The period ta for maintaining unit energy is the period for forming the specified groove 30. For example, in the first embodiment, the period ta corresponds to the period for forming such... Figure 12 The periods of the first irradiation line R1, the second irradiation line R2, the third irradiation line R3, and the fourth irradiation line R4 are shown. Therefore, the energy ta during this period, i.e., the constant value Qs, is greater than the cutting threshold Q1 of the protective film 13. Furthermore, the constant value Qs is smaller than the cutting threshold Q2 of the resin frame 9.

[0193] The period ts during which the unit energy is increased corresponds to the period of the front irradiation line RS. This period ts includes intervals ts1 and ts2. Interval ts1 is used to increase the unit energy from a value smaller than the cutoff threshold Q1 (Q0) to the cutoff threshold Q1 of the protective film 13. Interval ts2 is used to increase the unit energy from the cutoff threshold Q1 of the protective film 13 to a constant energy value Qs. The groove 30 formed during the period ts during which the unit energy is increased is such that the depth of the groove 30 gradually increases along the scanning direction of the laser. For example, interval ts2 may correspond to, for example, as shown in the image. Figure 5 The formation of the first groove end 32 shown.

[0194] The period *te* during which the unit energy is reduced corresponds to the period of the post-irradiation line *RE*. This period *te* includes intervals *te2* and *te1*. Interval *te2* is used to reduce the unit energy from a constant value *Qs* to the cut-off threshold *Q1* of the protective film 13. Interval *te1* is used to reduce the unit energy from the cut-off threshold *Q1* of the protective film 13 to a value smaller than the cut-off threshold *Q1* (*Q0*). The groove formed during the period *te* during which the unit energy is reduced is such that the depth of the groove gradually decreases along the scanning direction of the laser. For example, interval *te2* may correspond to... Figure 5 The formation of the second groove end 33 shown.

[0195] like Figure 31 The energy history per unit shown can be achieved by selecting one control variable from a set of control variables. Alternatively, the energy history per unit can also be achieved by combining multiple control variables.

[0196] As control variables, examples include the moving speed of the laser head, the irradiation energy of the laser, and the focal position of the laser.

[0197] Figure 32 (a) is used to implement Figure 31 Examples of the history of the laser head's movement speed per unit energy. During the period ts, the speed decreases simultaneously with the passage of time (V0→Vs). During the period ta, the speed is maintained (Vs). During the period te, the speed increases simultaneously with the passage of time (Vs→V0).

[0198] Figure 32 (b) is used to achieve Figure 31 Examples of the irradiation energy history of a laser head per unit energy. During period ts, the energy increases (Q0→Qs) as time elapses. During period ta, the energy is maintained (Qs). During period te, the energy decreases (Qs→Q0) as time elapses.

[0199] Figure 32 (c) is used to implement Figure 31Examples of the history of the focal position of a laser with unit energy. During period ts, as time elapses, the focal position is brought closer to the surface of the irradiated object (P0→Ps). During period ta, the focal position is maintained at the surface of the irradiated object (Ps). During period te, as time elapses, the focal position is moved away from the surface of the irradiated object (Ps→P0).

[0200] According to the laser control method described above, not only can the scintillator protective film be reliably prevented from reaching the resin frame. That is, the scintillator protective film can be reliably cut off, and the surface of the light detection panel with the resin frame will not be damaged by laser irradiation. Therefore, the generation of defective products can be suppressed, and productivity can be improved.

[0201] <Fourth Implementation Method>

[0202] The technical problem described in the third embodiment can also be solved by a control method different from that described in the third embodiment. The technical problem described at the beginning of the third embodiment is based on the premise that the time point at which laser irradiation begins and the time point at which the laser head begins to move are simultaneous. For example, by shifting the time point at which laser irradiation begins to begin and the time point at which the laser head begins to move is shifted, excessive energy can be prevented from irradiating the irradiated object.

[0203] For example, when starting laser irradiation, proceed as follows: First, begin moving the laser head ( Figure 33 (a) at t0). At this point, laser irradiation has not yet begun. Simultaneously with the passage of time (t0→t1), the speed of the laser head increases. Then, when the speed of the laser head reaches a predetermined value (Va), laser irradiation begins. This predetermined value can be a constant speed (Vs) or a more specific value. Figure 30 The velocity threshold (V1) shown in (b) is larger than the constant velocity (Vs). That is, the time point (ts) at which the laser irradiation begins is set later than the time point (t0) at which the laser head begins to move.

[0204] Furthermore, when laser irradiation ends, the time point for stopping laser irradiation is set earlier than the time point for stopping the movement of the laser head. For example, laser irradiation can be stopped when the speed of the laser head is constant (Vs). During the period of decelerating the speed of the laser head, laser irradiation can also be stopped at a speed at which unit energy below the cutting threshold Q1 of the resin frame 9 can be irradiated. In addition, as explained in the third embodiment, if the speed of the laser head increases, the energy per unit length decreases. Therefore, it is also possible to increase the speed of the laser head while stopping laser irradiation.

[0205] According to the laser control method described above, not only can the scintillator protective film be reliably prevented from reaching the resin frame. That is, the scintillator protective film can be reliably cut off, and the surface of the light detection panel with the resin frame will not be damaged by laser irradiation. Therefore, the generation of defective products can be suppressed, and productivity can be improved.

[0206] Furthermore, in the cutting process S5 of the protective film 13, the method shown in the first embodiment may be combined only with the method shown in the third embodiment. Alternatively, the method shown in the first embodiment may be combined only with the method shown in the fourth embodiment. Furthermore, the method shown in the first embodiment may be combined with the method shown in the fourth embodiment, in addition to the method shown in the third embodiment.

[0207] Symbol Explanation

[0208] 1,1A: Radiation detector

[0209] 2:Substrate

[0210] 3: Light-receiving part

[0211] 3a: Photoelectric conversion element

[0212] 4: Signal line

[0213] 5: Solder pads

[0214] 6: Passivation film

[0215] 7: Photoelectric conversion element array

[0216] 8: Scintillator layer

[0217] 8a: Flasher

[0218] 8b: Peripheral part

[0219] 9: Resin frame

[0220] 10: The first organic membrane

[0221] 11: Inorganic membranes (metal membranes)

[0222] 12: Second organic membrane

[0223] 13: Protective film

[0224] 13a: Outer edge of protective film 13

[0225] 14: Coating resin

[0226] 30: slot

[0227] D1: First distance

[0228] D2: Second distance

[0229] d, d1, d3: Height

[0230] d2: width

[0231] E1: Inner edge of resin frame 9

[0232] E2: Outer edge of resin frame 9

[0233] E3: Outer edge of scintillator layer 8

[0234] E4: Outer edge of photoelectric conversion element array 7

[0235] M1: Shielding component.

Claims

1. A radiation detector, wherein, have: A light-detecting panel has a light-receiving part and multiple pads. The light-receiving part includes multiple photoelectric conversion elements arranged in one or two dimensions. The pads are electrically connected to the photoelectric conversion elements and are disposed on the outside of the light-receiving part. A scintillator layer, which is stacked on the light detection panel to cover the light-receiving part, converts radiation into light; A resin frame is formed on the light detection panel such that, when viewed from the stacking direction of the scintillator layer, it is separated from the scintillator layer and the pads, passes between the scintillator layer and the pads, and surrounds the scintillator layer. and A scintillator protective film covers the scintillator layer and has an outer edge located on the resin frame. A groove is formed in the resin frame that is continuous with the outer edge of the scintillator protective film. The groove has a repeating region comprising a first groove end and a second groove end that are partially repeated in a direction intersecting the extension direction of the groove.

2. The radiation detector as claimed in claim 1, wherein, It also includes: a coating resin that covers the outer edge of the scintillator protective film.

3. The radiation detector as described in claim 2, wherein, The coating resin further covers the resin frame. The coating resin has the material properties of being able to remain in the resin frame in such a way that the edge of the contact surface between the coating resin and the resin frame is formed on the resin frame.

4. The radiation detector as described in claim 2 or 3, wherein, The central portion of the resin frame is higher than the two edges of the resin frame. The groove is located on the resin frame, biased towards the pad side.

5. The radiation detector as claimed in any one of claims 1 to 4, wherein, The width of the resin frame is greater than 700 micrometers and less than 1000 micrometers.

6. The radiation detector as claimed in any one of claims 1 to 5, wherein, The height of the resin frame is above 100 micrometers and below 300 micrometers.

7. The radiation detector as claimed in any one of claims 1 to 6, wherein, The light detection panel is rectangular in shape. The resin frame has four sides surrounding the scintillator layer. The repeating region is set in any one of the four sides.

8. A method for manufacturing a radiation detector, wherein, have: The process of preparing a light detection panel and stacking a scintillator layer on the light detection panel in a manner that covers the light receiving part, wherein the light detection panel has a light receiving part and a plurality of pads, the light receiving part includes a plurality of photoelectric conversion elements arranged in one or two dimensions, the pads are electrically connected to the photoelectric conversion elements and are disposed on the outside of the light receiving part, and the scintillator layer converts radiation into light; The process of configuring a panel protection portion on the light detection panel in a manner that surrounds the scintillator layer when viewed from the stacking direction of the scintillator layer; The process of forming a scintillator protective film in such a way that it covers the entire surface of one side of the light detection panel on which the scintillator layer is stacked and the surface of the panel protective portion; The process of cutting the scintillator protective film by irradiating the panel protective portion with a laser; and The process of removing the outer portion of the scintillator protective film, In the process of cutting the scintillator protective film, the outer edge of the scintillator protective film is formed due to the cutting of the scintillator protective film, and a groove is formed on the panel protection portion that is continuous with the outer edge of the scintillator protective film, and the groove has a repeating region including a first groove end and a second groove end that are partially repeated in a direction that intersects with the extension direction of the groove, and the laser is irradiated.

9. The method for manufacturing a radiation detector as described in claim 8, wherein, The light detection panel is rectangular in shape. The panel protective portion has four sides surrounding the scintillator layer. In the process of cutting the scintillator protective film, the repeating area is set at any one of the four sides.

10. The method for manufacturing a radiation detector as described in claim 9, wherein, The process of cutting off the scintillator protective film includes: The process of setting at least one of the positions of the four corners formed by the four sides as a reference position; and The process of irradiating each of the four sides with the laser based on the reference position.

11. The method of manufacturing a radiation detector as described in any one of claims 8 to 10, wherein, The panel protection part is a resin frame. In the process of configuring the panel protection portion, the resin frame is configured on the light detection panel in a manner that separates it from the scintillator layer and the pads, passes between the scintillator layer and the pads, and surrounds the scintillator layer.

12. The method for manufacturing a radiation detector as claimed in claim 11, wherein, In the process of configuring the panel protection portion, the resin frame is formed such that the central portion of the resin frame is higher than the two edges of the resin frame. In the process of cutting the scintillator protective film, the laser is irradiated at a position on the resin frame biased towards the pad side.

13. The method of manufacturing a radiation detector as described in any one of claims 8 to 10, wherein, The panel protection part is a shielding component. In the process of configuring the panel protection section, the shielding member is configured on the light detection panel to cover the area between the scintillator layer and the pad, as well as the pad itself. In the process of forming the scintillator protective film, the scintillator protective film is formed on the entire surface of the side of the light detection panel on which the scintillator layer is stacked and on the surface of the shielding member.

14. The method for manufacturing a radiation detector as described in claim 13, wherein, The process of removing the outer portion of the scintillator protective film also includes a process of removing the shielding member.

15. The method of manufacturing a radiation detector as described in claim 13 or 14, wherein, After the step of removing the outer portion of the scintillator protective film, the process further includes a step of forming a coating resin covering the outer edge of the scintillator protective film.

Images