Display panel and its manufacturing method, display device

Abstract

This invention provides a display panel, its fabrication method, and a display device. The display panel includes a substrate, an auxiliary electrode and a first conductive layer located above the substrate, a first film layer located on the auxiliary electrode, a conductor, an organic layer located above the first conductive layer and the first film layer, and a second conductive layer located above the organic layer. The first film layer has a first through-hole exposing the auxiliary electrode. The conductor is located within the first through-hole. Within the first through-hole, the organic layer is disconnected at a notch region, and a second electrode is electrically connected to the auxiliary electrode through the conductor at the notch region. In this embodiment of the invention, by placing a conductor within the first through-hole, the conductor breaks / penetrates the organic layer to form a notch region, allowing the second electrode and the auxiliary electrode to be electrically connected through the conductor at the notch region of the organic layer, thereby reducing the resistance value of the first through-hole between the auxiliary electrode and the second electrode.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Active-matrix organic light-emitting diode (AMOLED) is an emerging display technology that offers advantages over traditional LCDs, including superior color quality, faster response times, and smaller thickness. AMOLED pixel driving circuitry utilizes various vacuum-processed transistor backplanes. The OLED and transistors are typically fabricated on the same glass substrate. Because the aperture ratio is limited by the pixel area occupied by the transistors, OLEDs employ a top-emitting structure.

[0003] Because AMOLED displays are driven by current, the luminous intensity of each pixel is controlled by the current (I). For a single OLED element on the panel, the magnitude of the current is controlled by the voltage difference between the anode and cathode. When the driving signal is input or output from the ground side of the panel, due to the difference in distance between different pixels from the input and output terminals of the driving signal, the image will exhibit a phenomenon of changing from bright to dark from bottom to top, i.e., there is an IR drop phenomenon. The IR drop effect varies among different pixel units, resulting in variations in luminous intensity at different locations on the panel, causing uneven overall panel brightness. This is especially true for top-emission structures, which use a surface cathode design. Because the surface cathode has a smaller film thickness, its impedance is high, leading to severe IR drop, which in turn increases power consumption and limits panel specifications.

[0004] One solution to IR drop in large-size OLEDs is to introduce auxiliary cathodes, which involves adding auxiliary cathode traces and contact holes to the array. A common approach is to design strip or mesh cathodes in other metal layers, connecting them to the surface cathode through contact holes in areas with severe IR drop at the center of the panel. Simultaneously, different VSS voltage values ​​are applied to the surface cathode and auxiliary cathode to improve the IR drop situation in the center. The challenge of this method lies in reducing the contact hole resistance between the auxiliary cathode and the surface cathode.

[0005] Therefore, existing display panels have a technical problem of high contact hole resistance between the auxiliary cathode and the surface cathode, which needs to be improved. Summary of the Invention

[0006] This invention provides a display panel and its manufacturing method, as well as a display device, to alleviate the technical problem of high contact hole resistance between the auxiliary cathode and the surface cathode in existing display panels.

[0007] To solve the above problems, the technical solution provided by the present invention is as follows:

[0008] This invention provides a display panel, comprising:

[0009] substrate;

[0010] An auxiliary electrode is located on the substrate;

[0011] A first film layer is located on the auxiliary electrode and has a first through hole that exposes the auxiliary electrode;

[0012] A conductor is located inside the first through hole;

[0013] A first conductive layer is disposed above the substrate and includes a plurality of first electrodes;

[0014] An organic layer is disposed above the first conductive layer and the first film layer;

[0015] A second conductive layer is disposed above the organic layer and includes a second electrode, wherein a portion of the organic layer is electrically connected between the first electrode and the second electrode.

[0016] In the first through-hole, the organic layer is broken in the notch region, and the second electrode is electrically connected to the auxiliary electrode in the notch region through the conductor.

[0017] In the display panel provided in this embodiment of the invention, the conductor includes a metallic material.

[0018] In the display panel provided in this embodiment of the invention, the conductor is a solder bead.

[0019] In the display panel provided in this embodiment of the invention, the resistivity of the conductor is less than the resistivity of the organic layer.

[0020] In the display panel provided in this embodiment of the invention, the organic layer is an electron transport layer.

[0021] In the display panel provided in the embodiments of the present invention, the organic layer includes a first portion, the first portion being disposed on the first film layer, and the distance between the top of the conductor and the auxiliary electrode is greater than the distance between the top surface of the first portion and the auxiliary electrode.

[0022] In the display panel provided in the embodiments of the present invention, the organic layer further includes a second portion, which is disconnected from the first portion and is located between the conductor and the second electrode.

[0023] In the display panel provided in this embodiment of the invention, the melting point of the conductor is lower than the damage temperature of the organic layer.

[0024] Furthermore, embodiments of the present invention also provide a method for manufacturing a display panel, comprising:

[0025] Provide a substrate;

[0026] An auxiliary electrode and a first conductive layer are formed on the substrate, the first conductive layer including a plurality of first electrodes;

[0027] A first film layer is formed on the auxiliary electrode, and the first film layer is treated to form a first through hole exposing the auxiliary electrode;

[0028] A conductor in a first state is formed within the first through hole;

[0029] An organic layer is formed on the first conductive layer, the first film layer, and the conductor in the first state;

[0030] The first type of conductor is processed to form a second type of conductor, wherein the organic layer is broken in the notch region within the first through-hole;

[0031] A second conductive layer is formed on the organic layer, the second conductive layer including a second electrode, the second electrode being electrically connected to the auxiliary electrode in the notched region through a conductor of the second morphology.

[0032] Furthermore, embodiments of the present invention also provide a display device, including the display panel described in any of the above embodiments or the display panel prepared according to the method described in the above embodiments.

[0033] The beneficial effects of this invention are as follows: This invention provides a display panel and its manufacturing method, as well as a display device; the display panel includes a substrate, an auxiliary electrode and a first conductive layer located above the substrate, a first film layer located on the auxiliary electrode, a conductor, an organic layer located above the first conductive layer and the first film layer, and a second conductive layer located above the organic layer, wherein the first film layer has a first through-hole exposing the auxiliary electrode, the conductor is located within the first through-hole, and within the first through-hole, the organic layer is disconnected in a notch region, and the second electrode is electrically connected to the auxiliary electrode through the conductor in the notch region. In this embodiment of the invention, by providing a conductor within the first through-hole, the conductor breaks / penetrates the organic layer to form a notch region, allowing the second electrode and the auxiliary electrode to be electrically connected through the conductor in the notch region of the organic layer, thereby reducing the resistance value of the first through-hole between the auxiliary electrode and the second electrode. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 A schematic cross-sectional view of a display panel in the prior art provided for an embodiment of the present invention;

[0036] Figures 2a to 2f This is a schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present invention;

[0037] Figures 3a to 3c This is a schematic diagram of a cross-sectional structure of another display panel provided in an embodiment of the present invention. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0040] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0041] Please see Figure 1The diagram shows a cross-sectional structure of a display panel in the prior art. The display panel includes an auxiliary cathode 10, a contact hole 13 above the auxiliary cathode 10, an electron transport layer (ETL) 11, and a surface cathode 12 above the electron transport layer 11. The resistance between the auxiliary cathode 10 and the surface cathode 12 within the contact hole 13 is relatively high, resulting in a significant voltage drop in the display panel. Currently, the most likely technical solution is to improve the resistance of the electron transport layer. However, this solution is only applicable to structures with a thin or non-existent electron transport layer and adjacent pixel arrangement (SBS, Side by Side) designs. Furthermore, it requires the absence of IJP (Inkjet Print) material within the hole. In addition, this technical solution depends on the OLED device technology roadmap, requiring only minor adjustments to the IJP device structure or special treatment of the auxiliary cathode. Therefore, this technical solution faces numerous challenges, and the problem of high contact hole resistance between the auxiliary cathode and the surface cathode in the display panel cannot be improved.

[0042] The present invention can alleviate the technical problem of high contact hole resistance between the auxiliary cathode and the surface cathode in existing display panels.

[0043] To alleviate the above problems, this application provides a display panel. Specifically, the display panel provided by this application includes a substrate, an auxiliary electrode and a first conductive layer located above the substrate, a first film layer located on the auxiliary electrode, a conductor, an organic layer located above the first conductive layer and the first film layer, and a second conductive layer located above the organic layer. The first film layer has a first through-hole exposing the auxiliary electrode, and the conductor is located in the first through-hole. In the first through-hole, the organic layer is disconnected in a notch region, and the second electrode is electrically connected to the auxiliary electrode in the notch region through the conductor.

[0044] The display panel provided in this application will be described in detail below through specific embodiments.

[0045] In one embodiment, please refer to the figure. Figure 2f This is a schematic cross-sectional view of a display panel provided in an embodiment of the present invention. Figure 2f As shown, the display panel provided in this embodiment of the invention includes:

[0046] substrate 21;

[0047] Auxiliary electrode 22 is located on the substrate 21;

[0048] The first film layer 23 is located on the auxiliary electrode 22 and has a first through hole 24 that exposes the auxiliary electrode 22;

[0049] Conductor 25 is located inside the first through hole 24;

[0050] A first conductive layer is disposed above the substrate 21 and includes a plurality of first electrodes 26;

[0051] An organic layer 27 is disposed above the first conductive layer and the first film layer 23;

[0052] A second conductive layer is disposed above the organic layer 27 and includes a second electrode 28, wherein a portion of the organic layer 27 is electrically connected between the first electrode 26 and the second electrode 28.

[0053] Within the first through-hole 24, the organic layer 27 is disconnected in the notch region, and the second electrode 28 is electrically connected to the auxiliary electrode 22 in the notch region through the conductor 25.

[0054] This embodiment provides a display panel including a substrate, an auxiliary electrode and a first conductive layer located above the substrate, a first film layer located on the auxiliary electrode, a conductor, an organic layer located above the first conductive layer and the first film layer, and a second conductive layer located above the organic layer. The first film layer has a first through-hole exposing the auxiliary electrode. The conductor is located within the first through-hole. Within the first through-hole, the organic layer is disconnected at a notch region. The second electrode is electrically connected to the auxiliary electrode through the conductor at the notch region. This embodiment of the invention reduces the resistance of the first through-hole between the auxiliary electrode and the second electrode by providing a conductor within the first through-hole. This conductor breaks / penetrates the organic layer to form a notch region, allowing the second electrode and the auxiliary electrode to be electrically connected through the conductor at the notch region of the organic layer. This reduces / avoids voltage drop in the display panel. Furthermore, the display panel provided by this embodiment is compatible with existing manufacturing equipment, requires no additional investment, and has low production costs.

[0055] In one embodiment, the conductor 25 comprises a metallic material. It should be noted that the metallic material used in the conductor 25 has low resistivity and strong conductivity. Specifically, in the embodiments provided by this invention, the conductor enables the second electrode and the auxiliary electrode to be electrically connected in the gap region of the organic layer within the first through-hole, reducing the resistance value of the auxiliary electrode and the second electrode during conduction, thereby reducing / avoiding voltage drop in the display panel.

[0056] In one embodiment, the conductor 25 is a tin bead. Specifically, tin is a metal with a low melting point and is chemically stable, not easily oxidized by oxygen at room temperature. In this embodiment of the invention, taking advantage of tin's low melting point, tin paste is injected at the location of the first through-hole by printing, followed by the deposition of an organic layer, and then vacuum heating or laser / microwave sintering is used to melt the tin paste into a tin bead, which then penetrates / breaks the organic layer. Preferably, the shape of the tin bead can be controlled by temperature and heating time, and it can include a circular or elliptical shape.

[0057] In one embodiment, the resistivity of the conductor 25 is less than that of the organic layer 27. Specifically, the organic layer 27 is located between the auxiliary electrode 22 and the second electrode 28. Because the resistivity of the organic layer 27 is relatively high, the resistance values ​​of the auxiliary electrode 22 and the second electrode 28 at the first via 24 are relatively high, resulting in a severe voltage drop in the display panel. In this embodiment, by providing a conductor with lower resistivity in the gap region of the organic layer within the first via, the auxiliary electrode and the second electrode are electrically connected through the conductor, reducing the resistance value at the first via and improving the voltage drop phenomenon of the display panel.

[0058] In one embodiment, the organic layer 27 is an electron transport layer. Specifically, the electron transport layer is made of a material with high resistivity.

[0059] It should be noted that, in one embodiment, the electron transport layer is relatively thin, or an electron transport layer may not be provided.

[0060] In one embodiment, such as Figure 2f As shown, the first film layer 23 is a pixel definition layer, and the organic layer 27 includes a first portion P1, which is disposed on the first film layer 23. The distance between the top of the conductor 25 and the auxiliary electrode 22 is greater than the distance between the top surface of the first portion P1 and the auxiliary electrode 22. Specifically, after the conductor 25 transforms from the first form to the second form, it will break the organic layer 27, causing the first portion P1 of the organic layer 27 to tilt and be located on both sides of the notch region of the organic layer 27.

[0061] It should be noted that the conductor can only break or penetrate the organic layer if the distance between the top of the conductor and the auxiliary electrode is greater than the distance between the top surface of the first part and the auxiliary electrode. Therefore, in this embodiment, the distance between the top of the conductor and the auxiliary electrode is limited to be greater than the distance between the top surface of the first part and the auxiliary electrode.

[0062] In one embodiment, such as Figure 2fAs shown, the organic layer 27 further includes a second portion P2, which is disconnected from the first portion P1 and is located between the conductor 25 and the second electrode 28. Specifically, the second portion P2 refers to the portion of the organic layer 27 remaining at the top of the conductor 25 after the conductor 25 breaks off the organic layer 27.

[0063] In one embodiment, the melting point of the conductor 25 is lower than the damage temperature of the organic layer 27. It should be noted that, in this embodiment, the damage temperature of the organic layer refers to the temperature at which the properties of the organic layer material can be altered. Specifically, before forming the second-form tin beads, the conductor is in the first-form tin paste. After the organic layer is deposited, vacuum heating or laser / microwave sintering is required to melt the tin paste into tin beads. Therefore, the melting point of the conductor must be lower than the damage temperature of the organic layer to ensure that the properties of the organic layer are not affected when the conductor transforms from the first form to the second form.

[0064] Please see Figure 3c , Figure 3c This is a schematic cross-sectional view of another display panel provided in an embodiment of the present invention. Figure 3c As shown, another display panel provided in this embodiment of the invention includes:

[0065] substrate 31;

[0066] The auxiliary electrode 32 is located on the substrate 31;

[0067] The first film layer 33 is located on the auxiliary electrode 32 and has a first through hole 34 that exposes the auxiliary electrode 32;

[0068] Conductor 35 is located inside the first through hole 34;

[0069] A first conductive layer is disposed above the substrate 31 and includes a plurality of first electrodes 36;

[0070] An organic layer 37 is disposed above the first conductive layer and the first film layer 33;

[0071] The second conductive layer is disposed above the organic layer 37 and includes a second electrode 38. A portion of the organic layer 37 is electrically connected between the first electrode 36 and the second electrode 38. In the first through hole 34, the organic layer 37 is disconnected in the notch region, and the second electrode 38 is electrically connected to the auxiliary electrode 32 in the notch region through the conductor 35.

[0072] In one embodiment, the conductor 35 comprises a metallic material. It should be noted that the metallic material used in the conductor has low resistivity and strong conductivity.

[0073] In one embodiment, the conductor 35 is a solder ball. Preferably, the solder ball has a circular or elliptical shape.

[0074] In one embodiment, the resistivity of the conductor 35 is lower than that of the organic layer 37. Specifically, the lower resistivity of the conductor compared to the organic layer helps reduce the on-resistance between the auxiliary electrode and the second electrode in the first via, thus mitigating voltage drop in the display panel.

[0075] In one embodiment, the organic layer 37 is an electron transport layer. Specifically, the electron transport layer is made of a material with high resistivity.

[0076] In one embodiment, such as Figure 3c As shown, the organic layer 37 includes a first portion A1, which is disposed on the first film layer 33. The distance between the top of the conductor 35 and the auxiliary electrode 32 is greater than the distance between the top surface of the first portion A1 and the auxiliary electrode 32. Specifically, after the conductor transforms from the first form to the second form, it will penetrate the organic layer, causing the first portion of the organic layer to tilt and be located on both sides of the gap region of the organic layer.

[0077] It should be noted that in this embodiment, the conductor 35 penetrates the organic layer 37 on its top to form a gap region. Therefore, in this embodiment, only the first part A1 of the organic layer 37 exists in the first through hole 34.

[0078] This application embodiment also provides a method for manufacturing a display panel, the method comprising:

[0079] Provide a substrate;

[0080] An auxiliary electrode and a first conductive layer are formed on the substrate, the first conductive layer including a plurality of first electrodes;

[0081] A first film layer is formed on the auxiliary electrode, and the first film layer is treated to form a first through hole exposing the auxiliary electrode;

[0082] A conductor in a first state is formed within the first through hole;

[0083] An organic layer is formed on the first conductive layer, the first film layer, and the conductor in the first state;

[0084] The first type of conductor is processed to form a second type of conductor, wherein the organic layer is broken in the notch region within the first through-hole;

[0085] A second conductive layer is formed on the organic layer, the second conductive layer including a second electrode, the second electrode being electrically connected to the auxiliary electrode in the notched region through a conductor of the second morphology.

[0086] Now combined Figures 2a to 2f and Figures 3a to 3b The method for manufacturing a display panel provided in the embodiments of this application will be described.

[0087] like Figures 2a to 2f and Figures 3a to 3b As shown, the display panel manufacturing method provided in this application includes the following steps:

[0088] Step 1: Prepare the auxiliary electrode and the first conductive layer.

[0089] like Figure 2a As shown, an auxiliary electrode 22 and a first conductive layer are formed on the provided substrate 21. The first conductive layer includes a plurality of first electrodes 26. Specifically, after the first conductive layer is formed on the substrate 21, the first conductive layer is patterned to form a plurality of first electrodes 26. The first electrodes 26 are insulated from the auxiliary electrode 22.

[0090] Step 2: Prepare the first film layer and form the first through-hole.

[0091] like Figure 2b As shown, a first film layer 23 is formed on the auxiliary electrode 22, and the first film layer 23 is patterned to form a first through hole 24 exposing the auxiliary electrode.

[0092] Step 3: Form a conductor in the first state within the first through hole.

[0093] Specifically, the conductor in the first form is tin paste, such as... Figure 2c As shown, solder paste is injected into the first through hole 24 by printing. The volume of the injected solder paste needs to be determined according to the volume of the pixel, and generally does not exceed half of the pixel volume.

[0094] Preferably, in one embodiment, such as Figure 2d As shown, the thickness of the first type of conductor is more than twice the thickness of the organic layer. When the first type of conductor solder paste is converted into the second type of conductor solder ball, the solder ball is larger and can break off the organic layer and lift up the broken part.

[0095] Optionally, in another embodiment, such as Figure 3a As shown, the thickness of the first type of conductor is about 1.5 times the thickness of the organic layer. When the first type of conductor solder paste is transformed into the second type of conductor solder ball, the solder ball is smaller and can break through the organic layer on the top of the solder ball, exposing part of the solder ball.

[0096] Step 4: Prepare the organic layer.

[0097] Specifically, such as Figure 2d As shown, an organic layer 27 is deposited on the first conductive layer, the first film layer 23, and the conductor in the first morphology.

[0098] Step 5: Process the first-mode conductor.

[0099] Specifically, in one embodiment, such as Figure 2e As shown, after the organic layer 27 is vapor-deposited, the first-form tin paste is sintered by vacuum heating or laser / microwave to melt it into a second-form tin bead, thereby breaking off the organic layer 27. In the first through-hole 24, the organic layer 27 is broken in the notch region. In the first through-hole 24, the organic layer 27 includes a first part P1 and a second part P2.

[0100] In another embodiment, such as Figure 3b As shown, after the organic layer 37 is vapor-deposited, the first-form tin paste is sintered by vacuum heating or laser / microwave to melt it into a second-form tin bead, thereby breaking through the organic layer 37. In the first through-hole 34, the organic layer 37 is broken in the notch region. In the first through-hole 34, the organic layer 37 only includes the first part A1.

[0101] Step 6: Prepare the second conductive layer.

[0102] Specifically, such as Figure 2f As shown, a second conductive layer is deposited on the organic layer by vapor deposition. The material of the second conductive layer is magnesium (Mg) or silver (Ag). The second conductive layer is patterned to form a second electrode 28. The second electrode 28 is electrically connected to the auxiliary electrode 22 in the notch region through a tin bead of the second morphology.

[0103] This completes the fabrication of the display panel.

[0104] As can be seen from the above description, in the method for manufacturing a display panel provided in this application, a conductor is provided in the notch region of the organic layer in the first through hole, so that the second electrode and the auxiliary electrode are electrically connected in the notch region through the conductor, thereby reducing the resistance value of the first through hole between the auxiliary electrode and the second electrode, thereby reducing / avoiding the voltage drop phenomenon of the display panel. Moreover, the display panel provided in the embodiments of the present invention is compatible with existing process equipment, requires no additional investment, and has a low production cost.

[0105] Accordingly, embodiments of the present invention also provide a display device, which includes the display panel provided by the present invention or a display panel prepared according to the method described in the present invention. The display device can be an electronic terminal with display function, such as a desktop computer, a television, or other fixed terminal; it can also be a smartphone, a tablet computer, or other mobile terminal; or it can be a smart glasses, a smartwatch, or other wearable device.

[0106] As can be seen from the above embodiments:

[0107] This invention provides a display panel, its fabrication method, and a display device. The display panel includes a substrate, an auxiliary electrode and a first conductive layer located above the substrate, a first film layer located on the auxiliary electrode, a conductor, an organic layer located above the first conductive layer and the first film layer, and a second conductive layer located above the organic layer. The first film layer has a first through-hole exposing the auxiliary electrode. The conductor is located within the first through-hole. Within the first through-hole, the organic layer is disconnected at a notch region. The second electrode is electrically connected to the auxiliary electrode through the conductor at the notch region. By placing a conductor within the first through-hole, which breaks / penetrates the organic layer to form a notch region, the second electrode and the auxiliary electrode are electrically connected through the conductor at the notch region of the organic layer. This reduces the resistance value of the first through-hole between the auxiliary electrode and the second electrode, thereby reducing the voltage drop of the display panel. Furthermore, the display panel provided by this invention is compatible with existing manufacturing equipment, requires no additional investment, and has low production costs.

[0108] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A display panel, characterized in that, include: substrate; An auxiliary electrode is located on the substrate; A first film layer is located on the auxiliary electrode and has a first through hole that exposes the auxiliary electrode; A conductive element is located inside the first through hole, and the conductive element is a solder bead. A first conductive layer is disposed above the substrate and includes a plurality of first electrodes; An organic layer is disposed above the first conductive layer and the first film layer, wherein the resistivity of the conductor is less than the resistivity of the organic layer, and the melting point of the conductor is less than the damage temperature of the organic layer; A second conductive layer is disposed above the organic layer and includes a second electrode, wherein a portion of the organic layer is electrically connected between the first electrode and the second electrode. Within the first through-hole, the organic layer is broken at the notch region, and the second electrode is electrically connected to the auxiliary electrode through the conductor at the notch region; The organic layer includes a first portion disposed on the first film layer, wherein the distance between the top of the conductor and the auxiliary electrode is greater than the distance between the top surface of the first portion and the auxiliary electrode; The organic layer further includes a second portion, which is disconnected from the first portion and is located between the conductor and the second electrode.

2. The display panel according to claim 1, characterized in that, The organic layer is an electron transport layer.

3. A method for manufacturing a display panel, characterized in that, include: Provide a substrate; An auxiliary electrode and a first conductive layer are formed on the substrate, the first conductive layer including a plurality of first electrodes; A first film layer is formed on the auxiliary electrode, and the first film layer is treated to form a first through hole exposing the auxiliary electrode; A conductor in a first state is formed within the first through hole; An organic layer is formed on the first conductive layer, the first film layer, and the conductor in the first state; The first type of conductor is processed to form a second type of conductor, wherein the organic layer is broken in the notch region within the first through-hole; A second conductive layer is formed on the organic layer, the second conductive layer including a second electrode, the second electrode being electrically connected to the auxiliary electrode in the notched region through a conductor of the second morphology.

4. A display device, characterized in that, Includes a display panel as described in any one of claims 1 to 2 or a display panel prepared according to the method described in claim 3.

Images