A heat treatment eutectic packaging device
By incorporating an annular receiving element and a rotating mounting plate into the eutectic packaging device, the problems of high energy consumption and uneven heating in the eutectic furnace device are solved, achieving uniform heating of the substrate and simplified operation.
Patent Information
- Application Number
- CN202210487808.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-05-06
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2042-05-06
AI Technical Summary
Existing eutectic furnace devices consume a lot of energy and the substrate is heated unevenly, resulting in low heat treatment efficiency.
A heat treatment eutectic packaging device is designed. By setting an annular circumferential support on the outside of the heater and using the rotation of the mounting plate to switch the position of the substrate, the distance between the substrate and the heater is equal, thus achieving uniform heating.
It simplifies the operation process, reduces energy consumption, ensures uniform heating of the substrate, and improves heat treatment efficiency.
Smart Images

Figure CN114899292B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of LED manufacturing, and particularly relates to a heat treatment eutectic packaging device. Background Technology
[0002] LEDs can efficiently convert electrical energy into light energy and have a wide range of applications in modern society, such as lighting, displays, and medical devices.
[0003] Eutectic packaging refers to the process of fixing a chip onto a substrate. It involves placing the chip in a designated position on the substrate. The key is that the bottom of the chip is plated with pure tin or gold-tin alloy as the contact surface, and the substrate is plated with gold or silver. When the substrate is heated to a suitable eutectic temperature, the gold or silver elements penetrate the gold-tin alloy layer, changing the composition of the alloy layer and ultimately increasing its melting point. While the composition of the eutectic layer changes, the LED is firmly soldered to the heat sink or substrate.
[0004] Therefore, eutectic packaging requires heat treatment, which involves heating the substrate on which the chip is placed. This is usually done using a eutectic furnace. Existing eutectic furnaces typically have multiple supports for placing the substrate. However, since their positions are fixed and they are distributed in one direction, a heat source needs to be set up for each support to ensure that each substrate is heated to a uniform degree. As a result, the overall energy consumption of the device is relatively high, and different areas on the same substrate are also heated unevenly. Summary of the Invention
[0005] The purpose of this invention is to provide a heat treatment eutectic packaging device, which aims to solve the problems mentioned in the background art.
[0006] The present invention is implemented as follows: a heat treatment eutectic packaging device includes a cabinet, a cabinet door on one side of the cabinet, and a connecting unit and a placement unit.
[0007] The connecting unit includes a card plate fixed on one side of the cabinet door and facing the cabinet body. A sliding groove is opened on the side wall of the cabinet body. The card plate and the sliding groove are slidably inserted into each other. The placement unit includes a mounting plate rotatably mounted on the card plate and facing the inside of the cabinet body. Several rotating connecting shafts are provided on the side of the mounting plate facing the inside of the cabinet body. A receiving component is fixedly provided at the other end of the connecting shaft. A counterweight is provided on the receiving component. When the mounting plate rotates, the counterweight is used to keep the multiple receiving components facing the same direction.
[0008] A control module is provided on the side of the cabinet opposite to the mounting plate. A heater is fixedly connected to the side of the control module facing the inside of the cabinet. The heater is located between several receiving parts on the mounting plate.
[0009] Preferably, a sliding structure is provided in the groove and on the card plate to cooperate with each other, and the sliding structure is used to limit the movement direction of the card plate.
[0010] Preferably, a driving component is provided on the side of the card plate facing the outside of the cabinet, and the driving component is used to drive the mounting plate to rotate.
[0011] Preferably, the receiving component is a tray fixed to one end of the connecting shaft, and the counterweight is fixed to the bottom of the tray.
[0012] Preferably, the receiving component includes a crossbar fixed to one end of the connecting shaft, with claws on both sides of the crossbar, a counterweight located between the claws, and the counterweight connected to the claws on both sides by a pull wire.
[0013] Preferably, a limiting groove is provided on the cross frame, and the claws slide and engage in the limiting groove. An elastic element is provided in the limiting groove, and the two ends of the elastic element are connected to the claws on both sides.
[0014] Preferably, a placement groove is provided on the opposite side of the two claws.
[0015] Preferably, a sealing ring is fixed at the opening of the cabinet facing the cabinet door.
[0016] Preferably, a control component is fixed on the cabinet door, which is used to move the cabinet door.
[0017] Preferably, a raised platform is fixed to the bottom of the cabinet.
[0018] The beneficial effects of the heat treatment eutectic packaging device provided in this embodiment of the invention are: ① By setting the receiving parts on the outside of the heater and arranging them in a ring-shaped circumference, this device can ensure that the distance between each receiving part and the heater is equal when the heater is working, thereby ensuring uniform heating of the substrate.
[0019] ②Since the mounting plate can rotate and can be pulled out as a whole when the cabinet door is opened, the position of the receiving component can be switched simply by rotating the mounting plate. This makes it very convenient to place the substrate on the receiving component. Compared with existing packaging devices, this device allows for the replacement of the receiving component with only one position for picking up or storing, simplifying the operation. Attached Figure Description
[0020] Figure 1 This is a side cross-sectional view of a heat treatment eutectic packaging device provided in an embodiment of the present invention;
[0021] Figure 2 This is a front cross-sectional view of a heat treatment eutectic packaging device provided in an embodiment of the present invention;
[0022] Figure 3 A three-dimensional structural diagram of the cabinet door and the cardboard plate provided in an embodiment of the present invention;
[0023] Figure 4 A three-dimensional structural diagram of one form of the receiving component provided in an embodiment of the present invention;
[0024] Figure 5 A three-dimensional structural diagram of another form of the receiving component provided in an embodiment of the present invention;
[0025] Figure 6 for Figure 5 A magnified view of a section at point A in the middle;
[0026] Figure 7 for Figure 1 A magnified view of a section at point B in the middle;
[0027] In the attached diagram: 1-Cabinet body; 2-Cabinet door; 3-Connecting unit; 301-Panel; 4-Placement unit; 401-Mounting plate; 402-Connecting shaft; 403-Supporting component; 4031-Horizontal frame; 4032-Claw; 4033-Pull cable; 4034-Limiting groove; 4035-Elastic component; 4036-Placement groove; 404-Counterweight; 5-Slide groove; 6-Control module; 7-Heater; 8-Tray; 9-Sliding structure; 10-Elevated platform; 11-Drive component; 12-Sealing ring; 13-Operating component. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.
[0029] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.
[0030] like Figure 1 , Figure 2 and Figure 3 The diagram shown illustrates the structure of a heat treatment eutectic packaging apparatus according to an embodiment of the present invention, comprising:
[0031] Cabinet 1, with a cabinet door 2 on one side, and also includes a connecting unit 3 and a placement unit 4.
[0032] The connecting unit 3 includes a card plate 301 fixed on one side of the cabinet door 2 and facing the cabinet body 1. A sliding groove 5 is opened on the side wall of the cabinet body 1. The card plate 301 and the sliding groove 5 are slidably inserted into each other. The placement unit 4 includes a mounting plate 401 rotatably mounted on the card plate 301 and facing the inside of the cabinet body 1. Several rotating connecting shafts 402 are provided on the side of the mounting plate 401 facing the inside of the cabinet body 1. A receiving member 403 is fixedly provided at the other end of the connecting shaft 402. A counterweight 404 is provided on the receiving member 403. When the mounting plate 401 rotates, the counterweight 404 is used to keep the multiple receiving members 403 facing the same direction.
[0033] A control module 6 is provided on the side of the cabinet 1 opposite to the mounting plate 401. A heater 7 is fixedly connected to the side of the control module 6 facing the inside of the cabinet 1. The heater 7 is located between several receiving parts 403 on the mounting plate 401.
[0034] In one embodiment of the present invention, by arranging the receiving members 403 on the outside of the heater 7 in a circular pattern, this device ensures that the distance between each receiving member 403 and the heater 7 is equal when the heater 7 is working, thereby ensuring uniform heating of the substrate. Since the mounting plate 401 can rotate and can be pulled out as a whole when the cabinet door 2 is opened, the receiving members 403 can be switched by simply rotating the mounting plate 401. This makes it very convenient to place the substrate on the receiving member 403. Compared with existing packaging devices, this device allows for easy handling of the substrate by rotating the position of the receiving member 403, requiring only one position for retrieval or storage, thus simplifying the operation.
[0035] In one example of the present invention, such as Figure 4 As shown, the receiving component 403 is a tray 8 fixed to one end of the connecting shaft 402, and the counterweight 404 is fixed to the bottom of the tray 8. The counterweight 404 can be a metal block fixed to the bottom of the tray 8. Regardless of whether the mounting plate 401 rotates, since the connecting shaft 402 is rotatably connected to the mounting plate 401, the counterweight 404 can keep the receiving component 403 facing upwards, preventing the substrate from falling off after being placed on the receiving component 403. The control module 6 is used to control the working state of the heater 7, such as turning it on or off, and to control the heating temperature. Since the heater 7 is located between the receiving components 403, the receiving component 403 will move outwards after the cabinet door 2 is opened. Attention should be paid to the position of the receiving component 403 to avoid collision with the heater 7. Of course, the heater 7 can also adopt a telescopic structure, which can effectively avoid this situation. The sliding structure 9 is provided in the sliding groove 5 and the card plate 301 to cooperate with each other. The sliding structure 9 is used to limit the movement direction of the card plate 301. The sliding structure 9 can be a card strip fixed on both sides of the card plate 301. Correspondingly, guide grooves are opened on both sides of the sliding groove 5 on the cabinet body 1 to cooperate with the card strip. Of course, the sliding structure 9 can also be a card strip fixed in the sliding groove 5, and a guide groove is opened on the card plate 301. The shape of the card plate 301 matches the card groove, so that when the cabinet door 2 is closed, the card plate 301 and the card groove are completely engaged, so that the cabinet body 1 is completely sealed and heat loss is avoided. A raised platform 10 is fixed at the bottom of the cabinet body 1, which can make the cabinet door 2 move more smoothly. A control component 13 is fixed on the cabinet door 2. The control component 13 is used to drive the cabinet door 2 to move. The control component 13 can be a handle fixed on the cabinet door 2, or it can be a handle structure.
[0036] like Figure 2 As shown, in a preferred embodiment of the present invention, a driving member 11 is provided on the side of the card plate 301 facing the outside of the cabinet 1. The driving member 11 is used to drive the mounting plate 401 to rotate.
[0037] In one embodiment, the driving component 11 can be a motor, or of course a manual crank. The difference lies in whether the mounting plate 401 is driven to rotate automatically or manually. During heating, the substrates on different receiving components 403 may face the heater 7 or move away from the heater 7, which may lead to uneven heating. In this case, the mounting plate 401 can also be driven to rotate, so that the receiving components 403 rotate in position within the cabinet 1 to ensure uniform heating.
[0038] like Figure 5 As shown, in a preferred embodiment of the present invention, the receiving member 403 includes a crossbeam 4031 fixed to one end of the connecting shaft 402. The crossbeam 4031 has claws 4032 on both sides. A counterweight 404 is located between the claws 4032 and is connected to the claws 4032 on both sides by a pull wire 4033.
[0039] In one embodiment, the receiving member 403 adopts this structure, which can hold the substrate between the claws 4032. Therefore, when the heater 7 is heating, there will be no obstruction from the tray 8 mentioned above, thereby ensuring heating efficiency and ensuring that each substrate is heated evenly.
[0040] like Figure 5 and Figure 6 As shown, based on the above implementation, a supplementary explanation is provided: a limiting groove 4034 is provided on the cross frame 4031, and the claws 4032 are slidably engaged in the limiting groove 4034. An elastic element 4035 is provided in the limiting groove 4034, and the two ends of the elastic element 4035 are connected to the claws 4032 on both sides.
[0041] In one embodiment, the elastic element 4035 can be a spring, or it can be an elastic telescopic rod. In actual practice, the size of the substrate will be different when processing different LED displays. Therefore, sliding claws 4032 are provided to fix substrates of different sizes. This structure can form an effective linkage with the counterweight 404. When the counterweight 404 is lifted, the claws 4032 are not subjected to force and automatically open under the action of the elastic element 4035. Then the substrate is placed between the claws 4032. After the counterweight 404 is released, the counterweight 404 pulls the two claws 4032 downward, so that the claws 4032 move relative to each other, thereby clamping and fixing the substrate. This will not affect the function of the counterweight 404 itself in keeping the receiving member 403 facing. The opposite side of the two claws 4032 is provided with a placement groove 4036, which can facilitate the positioning of the substrate.
[0042] like Figure 1 and Figure 7 As shown, in a preferred embodiment of the present invention, a sealing ring 12 is fixed at the opening of the cabinet 1 facing the cabinet door 2.
[0043] In one embodiment, when the cabinet door 2 is closed, the cabinet door 2 can contact the sealing ring 12, thereby filling the gap between the cabinet door 2 and the cabinet body 1, effectively ensuring the sealing performance.
[0044] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0045] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A heat treatment eutectic packaging device, comprising a cabinet, wherein a cabinet door is provided on one side of the cabinet, characterized in that, It also includes a connecting unit and a placement unit; the connecting unit includes a card plate fixed to one side of the cabinet door facing the cabinet body, and a sliding groove on the side wall of the cabinet body, with the card plate slidingly inserted into the groove; the placement unit includes a mounting plate rotatably mounted on the card plate facing the inside of the cabinet body, with several rotating connecting shafts on the side of the mounting plate facing the inside of the cabinet body, and a receiving component fixedly mounted at the other end of the connecting shaft, with a counterweight on the receiving component. When the mounting plate rotates, the counterweight is used to keep the multiple receiving components facing the same direction; a control module is mounted on the side of the cabinet body opposite to the mounting plate, and a heater is fixedly connected to the side of the control module facing the inside of the cabinet body, with the heater located between several receiving components on the mounting plate; the receiving components are located outside the heater and are arranged in a ring around the circumference, with each receiving component being equally spaced from the heater; a driving component is mounted on the side of the card plate facing the outside of the cabinet body, and the driving component is used to drive the mounting plate to rotate.
2. The heat treatment eutectic packaging apparatus according to claim 1, characterized in that, The groove is equipped with a sliding structure that cooperates with the card plate. The sliding structure is used to limit the movement direction of the card plate.
3. The heat treatment eutectic packaging apparatus according to claim 1, characterized in that, The receiving component is a tray fixed to one end of the connecting shaft, and the counterweight is fixed to the bottom of the tray.
4. The heat treatment eutectic packaging apparatus according to claim 1, characterized in that, The receiving component includes a crossbar fixed to one end of the connecting shaft, with claws on both sides of the crossbar, a counterweight located between the claws, and the counterweight connected to the claws on both sides by a pull wire.
5. The heat treatment eutectic packaging apparatus according to claim 4, characterized in that, The crossbar has a limiting groove, and the claws slide and engage in the limiting groove. An elastic element is provided in the limiting groove, and the two ends of the elastic element are connected to the claws on both sides.
6. The heat treatment eutectic packaging apparatus according to claim 5, characterized in that, A placement groove is provided on the opposite side of the two claws.
7. The heat treatment eutectic packaging apparatus according to claim 1, characterized in that, A sealing ring is fixed at the opening of the cabinet facing the cabinet door.
8. The heat treatment eutectic packaging apparatus according to claim 1, characterized in that, A control component is fixed to the cabinet door, which is used to move the cabinet door.
9. The heat treatment eutectic packaging apparatus according to claim 1, characterized in that, A raised platform is fixed to the bottom of the cabinet.
Citation Information
Patent Citations
Diffusion furnace
CN113584595A
Apparatus having rotating chains or rings for carrying vertically hanging trays
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