PCB manufacturing methods, PCB drilling methods, and PCB manufacturing systems

Abstract

This invention relates to the field of PCB board processing technology. The embodiments disclose a PCB board manufacturing method, a PCB board drilling method, and a PCB manufacturing system. The manufacturing method includes the following steps: obtaining multiple core boards; dividing each core board into multiple pre-processing areas according to a preset partitioning method; setting multiple targets at the edges and / or inside each pre-processing area according to preset target parameters, the preset target parameters being used to determine the positions of the multiple targets; stacking the multiple core boards, and pre-fusing and fixing a portion of the area between two adjacent core boards; and pressing the multiple core boards together to form a PCB board. When processing PCB boards using the PCB board manufacturing method of this invention, the alignment accuracy during PCB board processing can be increased, improving processing quality.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, and in particular to a PCB board manufacturing method, a PCB board drilling method, and a PCB board manufacturing system. Background Technology

[0002] In the PCB manufacturing process, the lamination process involves pressing the core board layer, prepreg, and copper foil together to form a multilayer board structure. As the number of core board layers increases, the uniformity variation between the core boards becomes larger due to the stress on the core boards and prepreg, making it increasingly difficult to control local and overall expansion and contraction. This can easily lead to misalignment in subsequent PCB processing, affecting the overall PCB quality. To improve the alignment accuracy of PCB processing, the existing method uses an X-ray drilling machine to drill four target holes at the four corners of the core board. During subsequent PCB processing, a target gripper captures the coordinates of the four target holes after lamination, compares these coordinates with the initial coordinates before lamination, and calculates the expansion and contraction coefficient. Alignment is then performed based on this coefficient.

[0003] However, as the size of the PCB board increases, the distance between the target holes also increases, leading to a greater error in the expansion and contraction value obtained by the target gripper for positioning the target holes. This results in lower alignment accuracy during PCB board processing, thus affecting the processing quality of the PCB board. Summary of the Invention

[0004] Based on this, it is necessary to propose a PCB manufacturing method, a PCB drilling method, and a PCB manufacturing system to improve the alignment accuracy of the PCB board in the above-mentioned problems.

[0005] On one hand, embodiments of the present invention provide a PCB board manufacturing method, the PCB board manufacturing method comprising:

[0006] Obtain multiple core boards, and divide each core board into multiple pre-processing areas according to a preset partitioning method;

[0007] Multiple targets are set at the edge and / or inside each pre-processing area according to preset target parameters, wherein the preset target parameters are used to determine the positions of the multiple targets;

[0008] The multiple core boards are stacked together, and a portion of the area between two adjacent core boards is pre-fused and fixed.

[0009] The multiple core boards are pressed together to form a PCB board.

[0010] In some embodiments of the PCB manufacturing method, the step of obtaining multiple core boards and dividing each core board into multiple pre-processing areas according to a preset partitioning method includes:

[0011] Obtain the processing layout diagram of the core board, and divide the core board into functional areas and the plurality of pre-processing areas according to the processing layout diagram.

[0012] In some embodiments of the PCB manufacturing method, after the step of dividing each core board into multiple pre-processing areas according to a preset partitioning method, the method further includes:

[0013] The size of the target is determined based on the distance between the pre-processed area and the edge of the core board, wherein the edge of the target does not extend beyond the edge of the core board.

[0014] In some embodiments of the PCB manufacturing method, the steps of stacking the plurality of core boards and pre-fusion fixing a portion of the area between two adjacent core boards include:

[0015] A first graphic is set along the outer edge of each pre-processing area according to preset graphic parameters;

[0016] After aligning the areas containing the first pattern on each of two adjacent core boards, they are fused together and fixed.

[0017] In some embodiments of the PCB manufacturing method, the step of setting the first pattern along the outer edge of each pre-processing area according to preset graphic parameters includes:

[0018] The first pattern is etched on the extension line of the overlapping edge of two adjacent pre-processed areas, the first pattern being located between the edge line of the target and the core plate.

[0019] In some embodiments of the PCB manufacturing method, after the step of etching the first pattern on the extension line of the overlapping edge of two adjacent pre-processing areas, the method further includes:

[0020] At least one second pattern is etched between two adjacent first patterns, wherein the positions of the at least one second pattern on each of the core boards correspond one-to-one.

[0021] In some embodiments of the PCB manufacturing method, after aligning and fusing the areas containing the first pattern on each of two adjacent core boards among the plurality of core boards, the method further includes:

[0022] After aligning the corresponding areas of the second pattern on two adjacent core boards, they are fused and fixed.

[0023] On the other hand, embodiments of the present invention also provide a PCB board drilling method, wherein the PCB board is a PCB board manufactured by the aforementioned PCB board manufacturing method, and the PCB board drilling method includes:

[0024] Based on the position information of multiple targets on each core plate after lamination, the position information of multiple targets on each core plate after lamination is compared with the preset target parameters to determine the expansion and contraction value;

[0025] The location of the through-hole is determined based on the expansion and contraction value in order to drill through-holes in the PCB board.

[0026] In some embodiments of the PCB drilling method, the step of comparing the position information of multiple targets on each core board after lamination with the preset target parameters to determine the expansion / contraction value includes:

[0027] Multiple targets on each core board are identified using an X-RAY device to obtain shadow areas, which represent the areas formed by the overlapping of targets at corresponding positions on each core board.

[0028] Determine the center of gravity of the shaded area, use the center of gravity as the drill bit center, drill a target hole on the PCB board, and compare the position information of the target hole with the preset target parameters to determine the expansion and contraction value.

[0029] In another aspect, embodiments of the present invention also provide a PCB board manufacturing system, comprising:

[0030] An acquisition module is used to acquire multiple core boards, divide each core board into multiple pre-processing areas according to a preset partitioning method, and set multiple targets at the edge and / or inside each pre-processing area according to preset target parameters, wherein the preset target parameters are used to determine the positions of the multiple targets.

[0031] A fusion module is used to stack the plurality of core boards and to pre-fuse and fix a portion of the area between two adjacent core boards;

[0032] A pressing module is used to press the multiple core boards together to form a PCB board.

[0033] The embodiments of the present invention have the following beneficial effects:

[0034] According to the PCB manufacturing method, PCB drilling method, and PCB manufacturing system of the above embodiments, in a first aspect, by pre-fusion fixing a portion of adjacent core boards, the expansion and contraction of the core boards during subsequent overall pressing is hindered in one or more directions, thereby reducing the expansion and contraction of the core boards in those directions. In a second aspect, by dividing the core board into multiple pre-processing areas and setting multiple targets at the edges and / or inside each pre-processing area, compared to setting targets only at the four corners of the core board, the distance between adjacent target holes in each pre-processing area is reduced, resulting in higher accuracy of the obtained local expansion and contraction values ​​of the core board.

[0035] Compared with existing target design schemes, the PCB board manufacturing method of this invention increases the alignment accuracy of the PCB board and improves the processing quality when processing PCB boards. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] in:

[0038] Figure 1 A flowchart of a PCB board manufacturing method according to an embodiment of the present invention is shown;

[0039] Figure 2 A flowchart of a PCB board drilling method according to an embodiment of the present invention is shown;

[0040] Figure 3 This diagram illustrates the structure of a core board formed by a PCB manufacturing method according to an embodiment of the present invention.

[0041] Figure 4 A cross-sectional view of a PCB board manufactured according to an embodiment of the present invention is shown.

[0042] Explanation of key component symbols:

[0043] 1. Core board; 2. Pre-processing area; 3. Target; 4. First pattern; 5. Second pattern; 6. Target hole; 7. Functional area. Detailed Implementation

[0044] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0045] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0047] On the one hand, embodiments of the present invention provide a PCB board manufacturing method. When manufacturing a PCB board using this PCB board manufacturing method, the expansion and contraction coefficient on the PCB board can be obtained more accurately while minimizing the expansion and contraction of the PCB board.

[0048] In one embodiment, please refer to Figure 1 The PCB manufacturing method includes the following steps:

[0049] S10. Obtain multiple core boards and divide each core board into multiple pre-processing areas according to a preset partitioning method;

[0050] S20. Multiple targets are set at the edge and / or inside each pre-processing area according to preset target parameters, wherein the preset target parameters are used to determine the positions of the multiple targets;

[0051] S30. Stack the plurality of core boards together, and pre-weld and fix a portion of the area between two adjacent core boards;

[0052] S40. Press the plurality of core boards together to form a PCB board.

[0053] Please combine Figure 3 During PCB manufacturing, corresponding patterns need to be drawn on the copper layer surface of each core board 1 according to customer requirements. When drawing patterns on the core board 1, target 3 needs to be drawn on it so that target 3 can be etched out simultaneously when etching the copper layer on the surface of the core board 1. It should be noted that target 3 can be a copper ring left after etching on the core board 1, or a circular copper sheet left after etching. Due to expansion and contraction during lamination, the degree of expansion and contraction can be reflected by the change in the position of the same target 3 before and after lamination of the core board 1.

[0054] It should be noted that the same partitioning method on each core board 1 means that the number of partitions on each core board 1 is the same, and when each core board 1 is stacked in the manner of pressing the core boards 1 into a complete PCB board, the pre-processing areas 2 on each core board 1 correspond one-to-one. It is worth mentioning that the preset target parameters used to form the target 3 in the corresponding pre-processing areas 2 on different core boards 1 are consistent. That is, the target 3 inside the corresponding pre-processing areas 2 on different core boards 1 is etched according to the same set of preset target parameters. In other words, when each core board 1 is stacked in the manner of pressing the core boards 1 into a complete PCB board, the target 3 inside the corresponding pre-processing areas 2 on different core boards 1 correspond one-to-one.

[0055] It is important to note that after obtaining the expansion and contraction coefficient using the above method, the expansion and contraction value of the core board 1 after pressing needs to be calculated by the system. This expansion and contraction value can be used to calculate the actual location of the through-hole to be drilled. The calculation of both the expansion and contraction value and the location of the through-hole are performed using existing pre-designed software, which will not be elaborated upon here.

[0056] On the one hand, by pre-fixing a portion of the adjacent core plates 1, the two adjacent core plates 1 are pre-fixed. When the core plates 1 are subsequently pressed together, the expansion and contraction between the core plates 1 is hindered by the pre-fixed position, thereby reducing the degree of expansion and contraction of the core plates 1. On the other hand, by dividing the core plate 1 into multiple pre-processing areas 2, and setting multiple targets 3 on the edge and / or inside of each pre-processing area 2, the multiple targets 3 can reflect the degree of expansion and contraction of the core plate 1 in the pre-processing area 2 during the pressing process. After the pressing is completed, the expansion and contraction coefficient of the pre-processing area 2 can be obtained by comparing the position information of the target 3 in each pre-processing area 2 with the preset target parameters. Compared to directly setting targets 3 at the four corners of the entire core board 1 to determine the expansion and contraction coefficient of the entire core board 1, dividing the core board 1 into multiple pre-processing areas 2, the distance between the multiple targets 3 used to determine the expansion and contraction coefficient of each pre-processing area 2 is significantly smaller than the distance between the multiple targets 3 set at the four corners of the core board 1. Therefore, the accuracy of the expansion and contraction coefficient obtained for each pre-processing area 2 is higher than that determined by setting targets 3 at the four corners of the entire core board 1, which is more beneficial for the subsequent drilling accuracy of the PCB board. Thus, through the above setup, not only can the expansion and contraction degree of the core board 1 be minimized during lamination, but a more accurate expansion and contraction coefficient can also be obtained after the core board 1 is lamination, resulting in more accurate alignment during subsequent PCB board processing.

[0057] In one specific embodiment, step S10 includes: S11, obtaining the processing layout diagram of the core board, and dividing the core board into functional areas and the plurality of pre-processing areas according to the processing layout diagram.

[0058] Please refer to Figure 3, during the PCB board processing, it is necessary to etch the corresponding processing layout diagram on the core board 1 according to the customer's requirements through a pre-designed pattern. There is a functional area 7 between the edge of the processing layout diagram and the edge of the core board 1. When designing the pre-processing area 2, the edge of the pre-processing area 2 is made to coincide with the edge of the processing layout diagram, and the functional area 7 is arranged outside the pre-processing area 2 along the edge line of the pre-processing area 2. It should be noted that in order to evenly obtain the expansion and contraction coefficient on the core board 1, the shapes and sizes of the multiple pre-processing areas 2 set on the core board 1 are equal. The number of pre-processing areas 2 can be set to four, six, or eight according to the size of the core board 1. A larger core board 1 requires a larger number of partition areas. In the embodiment of the present invention, a core board 1 with four pre-processing areas 2 is taken as an example for illustration.

[0059] It should be noted that, please refer to Figure 3 , when dividing the core board 1 into multiple areas, it is preferable to set each pre-processing area 2 as a rectangle, and the sizes of each pre-processing area 2 are the same. In this way, the core board 1 can be evenly divided into four pre-processing areas 2, and the sides of two adjacent pre-processing areas 2 coincide. It should be noted that one specific solution for partitioning the core board 1 can be to set multiple mutually parallel horizontal lines and multiple mutually parallel vertical lines on the core board 1, and the vertical lines and horizontal lines intersect perpendicularly, thereby dividing the pre-processing area 2 into multiple ones. Specifically, taking the example of setting four pre-processing areas 2, three parallel and equally spaced horizontal lines and three parallel and equally spaced vertical lines are set. The outermost horizontal line and vertical line are connected end to end to enclose the core board 1 into a large processing area, and the other horizontal lines and vertical lines are located within this large processing area to divide the processing area into multiple equal pre-processing areas 2. For example, when the core board 1 is divided into four rectangular areas, through the above partitioning method, the four pre-processing areas 2 are combined into a "field" shape.

[0060] It is worth mentioning that, please refer to Figure 3 , as mentioned above, the pre-processing area 2 is set as a rectangle. When setting the target 3, the target 3 can be set inside the pre-processing area 2 or on the edge of the pre-processing area 2. Setting it on the edge of the pre-processing area 2 means that a part of the target 3 coincides with the pre-processing area 2. In the embodiment of the present invention, it is preferable to set the target 3 at the four corners of each pre-processing area 2. When setting, it is necessary to determine the position parameters of the four corners of the rectangular area of each pre-processing area 2, and set the target 3 at the four corners of the pre-processing area 2 according to the position parameters. Since there is a coincident side and two common corners between every two adjacent pre-processing areas 2, the common corner of two adjacent pre-processing areas 2 shares one target 3.

[0061] It is important to note that the size of the target 3 is set according to the distance between the edge of the pre-processing area 2 and the edge of the core board 1, so that the range of the target 3 does not exceed the edge line of the core board, that is, the edge line of the target 3 needs to be within the functional area 7. It is also important to note that when pre-fusion fixing two adjacent core boards 1, the corresponding areas within their respective functional areas 7 are fused. Therefore, when considering the size of the target 3, it is also necessary to reserve space between the edge line of the target 3 and the core board 1 for pre-fusion. Depending on the actual processing situation, the shape of the target 3 is not fixed and can be circular, square, or elliptical, etc. This embodiment of the invention uses a circular target 3 as an example for explanation. To ensure rapid capture of the target 3 and to avoid the size of the target 3 exceeding the entire range of the core board 1, the diameter of the target 3 is set to 0.25-0.5 mm according to actual production conditions. If the distance between the edge of the pre-processing area 2 and the edge of the core board 1 is large, the diameter of the target 3 can be set accordingly larger; if the distance between the edge of the pre-processing area 2 and the edge of the core board 1 is small, the diameter of the target 3 can be set accordingly smaller.

[0062] In one specific embodiment, step S30 includes: S31, setting a first graphic on the outer edge of each pre-processing area according to preset graphic parameters;

[0063] S32. Align the areas containing the first pattern on each pair of adjacent core boards and then fuse and fix them together.

[0064] Please refer to Figure 3 The first graphic 4 is located within the functional area 7. Specifically, according to customer requirements, a corresponding processing layout diagram needs to be etched onto the core board 1 using a pre-designed pattern. Before etching the processing layout diagram, the position of the first graphic 4 needs to be drawn on the corresponding position of the processing layout diagram so that the first graphic 4 can be etched simultaneously when the processing layout diagram is etched onto the core board 1. The position of the first graphic 4 is located on the extension line of the overlapping edges of two adjacent pre-processing areas 2, between the edge line of the target 3 and the core board 1. It is worth mentioning that the preset graphic parameters of the first graphic 4 used to form on different core boards 1 are consistent, that is, when multiple core boards 1 overlap, the first graphics 4 on multiple core boards 1 can overlap one-to-one.

[0065] It should be noted that the first pattern 4 refers to the copper foil area with a certain shape left after etching the copper foil layer on the core board 1. To avoid the first pattern 4 affecting the layout on the core board 1, the first pattern 4 is etched into the functional area 7 of the core board 1, that is, the area located between the edge of the pre-processing area 2 and the edge of the core board 1. Therefore, when setting the size of the first pattern 4, the distance between the edge of the pre-processing area 2 and the edge of the core board 1 also needs to be considered. It should be noted that it is preferable to set the position of the first pattern 4 on the extension line of the overlapping edge between two adjacent pre-processing areas 2, which can reduce the offset inside the core board 1.

[0066] In a more specific embodiment, step S31 further includes: etching at least one second pattern between two adjacent first patterns, wherein the positions of the at least one second pattern on each of the core boards correspond one-to-one.

[0067] Please refer to Figure 3 When designing the processing layout of the core board 1, in addition to setting the first graphic 4, at least one second graphic 5 can be set between two adjacent first graphics 4. Since the first graphic 4 is set on the extension line of the overlapping edge of two adjacent pre-processing areas 2, there are two edges of a pre-processing area 2 between two adjacent first graphics 4, and at least one second graphic 5 is set on the extension path of each edge. It should be noted that the second graphic 5 is also located between the edge of the pre-processing area 2 and the edge of the core board 1, and the second graphic 5 on each core board 1 can be set one-to-one, that is, after the core boards 1 are stacked, the corresponding second graphics 5 overlap.

[0068] It should be noted that after step S32, the method further includes: aligning the corresponding areas of the second pattern on two adjacent core plates and then fusing and fixing them.

[0069] Electromagnetic fusion is used to fuse and fix the area containing the first pattern, which is equivalent to pre-fixing multiple core plates along the edge. This pre-fixing can make the expansion and contraction of the core plates along their length and width directions tend to be consistent when they are pressed. Furthermore, by fixing the area containing the first pattern, it can also prevent the deflection between two adjacent core plates when they are pressed.

[0070] Then, the area containing the second pattern is fused and fixed. After the first pattern is fused and fixed, the core plates between two adjacent first patterns will expand and contract to a certain extent. By fusing and fixing the second pattern, the expansion and contraction between the two adjacent first patterns can be released. At the same time, fixing the second pattern can further reduce the deflection between the two adjacent core plates during core plate pressing. It is worth mentioning that the areas containing the first and second patterns can be fused simultaneously or sequentially. If the areas containing the first and second patterns are fused simultaneously, the area fused at one time will increase, which may cause deflection between the two adjacent core plates during fusion. Therefore, it is generally necessary to fuse the area containing the first pattern first, and then fuse the area containing the second pattern.

[0071] On the other hand, please refer to Figure 2 This invention also provides a PCB board drilling method, which includes:

[0072] S100. Based on the position information of multiple targets on each core plate after pressing, the position information of multiple targets on each core plate after pressing is compared with the preset target parameters to determine the expansion and contraction value.

[0073] S200. Determine the location of the through hole based on the expansion and contraction value, so as to drill through holes in the PCB board.

[0074] Before lamination, preset target parameters for determining the position of each target are saved. After laminating multiple core boards, the position of each target is determined again. Due to expansion and contraction during core board lamination, the position of the same target on the core board may change. After obtaining the actual position of each target, the initial and actual positions of each target on the core board are input into the system's preset software. The expansion and contraction values ​​can then be calculated. These values ​​are used to compensate for the initial position data used for drilling through holes, thereby obtaining the precise position of the through holes on the PCB board.

[0075] In one specific embodiment, step S100 includes:

[0076] S101. Multiple targets on each core board are identified using an X-RAY device to obtain a shadow area, which is used to represent the area formed by the overlapping of each target at the corresponding position of each core board.

[0077] S102. Determine the center of gravity of the shaded area, and drill a target hole on the PCB board with the center of gravity as the drill bit center. Compare the position information of the target hole with the preset target parameters to determine the expansion and contraction value.

[0078] Please refer to Figure 4The expansion and contraction degrees of the multiple core boards 1 after lamination are different. That is, the offset of the multiple targets 3 determined by the same preset target parameters at the same position after lamination is also different. In this embodiment of the invention, the target 3 is illuminated by an X-ray device perpendicular to the PCB board surface. The shadow area formed by the multiple overlapping targets 3 at the same position after offset can be obtained. The centroid of the shadow area is found, which is the target center. By comparing the coordinates of the target center with the preset target parameters when setting the corresponding target 3, the expansion and contraction coefficient is calculated. The centroid of the shadow area is determined as the target center, and the average expansion and contraction degree of the multiple core boards 1 at the target center position is obtained.

[0079] It should be noted that after finding and determining the target center, a drilling machine is needed to drill the target hole 6 with the target center as the center. Because expansion and contraction will occur inside the core board 1 during subsequent PCB board processing, whenever a process requiring precise alignment is performed on the PCB board, a CCD can be used to target the hole 6. By setting the target hole 6, the expansion and contraction coefficient of the core board 1 can be obtained in real time, thereby increasing the alignment accuracy during subsequent PCB board processing. For example, after drilling the PCB board, the outer layer pattern is transferred. At this time, the PCB board needs to be coated with a resist dry film before exposure. It should be noted that the exposure here is mainly based on the exposure steps in the existing technology, which will not be elaborated here. The difference is that in this embodiment of the invention, the expansion and contraction coefficient is obtained by the aforementioned method, and each of the pre-processed areas on the PCB board is exposed one by one, thereby increasing the alignment accuracy during exposure.

[0080] It is worth mentioning that the target-grabbing method mainly uses visible light such as red or blue light to illuminate the target hole 6. The light passes through the target hole 6 to form a light spot. At this time, a CCD camera is used to take a picture, and the centroid coordinates of the light spot are calculated by visual recognition software. The expansion and contraction coefficient can be obtained by comparing it with the preset target parameters.

[0081] In another aspect, embodiments of the present invention also provide a PCB manufacturing system, including an acquisition module, a fusion module, and a pressing module. The acquisition module acquires multiple core boards, dividing each core board into multiple pre-processing areas according to a preset partitioning method; multiple targets are set at the edges and / or inside each pre-processing area according to preset target parameters, the preset target parameters being used to determine the positions of the multiple targets. The fusion module stacks the multiple core boards and pre-fuses and fixes a portion of the area between two adjacent core boards. The pressing module presses the multiple core boards to form a PCB board.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A PCB board manufacturing method characterized by, The method comprises the following steps: obtaining a plurality of core plates, and dividing each of the core plates into a plurality of pre-processing areas according to a preset division mode; setting a plurality of targets on the edge and / or inside of each of the pre-processing areas according to preset target parameters, the preset target parameters being used to determine the positions of the plurality of targets; pre-fusing and fixing the edge area between two adjacent core plates in the plurality of core plates; pressing the plurality of core plates to form a PCB plate; the step of pre-fusing and fixing the edge area between two adjacent core plates in the plurality of core plates comprises: setting a first pattern on the outer edge of each of the pre-processing areas according to preset pattern parameters; aligning and fusing the areas where the first patterns on each of the plurality of core plates are located; the step of setting a first pattern on the outer edge of each of the pre-processing areas according to preset pattern parameters comprises: etching the first pattern on the extension line of the overlapping edge of two adjacent pre-processing areas, the first pattern being located between the target and the edge line of the core plate; after the step of etching the first pattern on the extension line of the overlapping edge of two adjacent pre-processing areas, the method further comprises: etching at least one second pattern between two adjacent first patterns, wherein the at least one second pattern on each of the core plates corresponds one by one; after the step of aligning and fusing the areas where the first patterns on each of the plurality of core plates are located, the method further comprises: aligning and fusing the areas where the corresponding second patterns on two adjacent core plates are located.

2. The PCB board manufacturing method of claim 1, wherein, the step of obtaining a plurality of core plates and dividing each of the core plates into a plurality of pre-processing areas according to a preset division mode comprises: obtaining a processing layout of the core plate, and dividing the core plate into a functional area and the plurality of pre-processing areas according to the processing layout.

3. The PCB board manufacturing method of claim 1, wherein, after the step of dividing each of the core plates into a plurality of pre-processing areas according to a preset division mode, the method further comprises: determining the size of the target according to the distance between the pre-processing area and the edge line of the core plate, wherein the edge of the target does not exceed the edge line of the core plate.

4. A PCB plate drilling method, the PCB plate being manufactured by the PCB plate manufacturing method of any one of claims 1-3, the drilling method comprising: comparing the position information of the plurality of targets on each of the core plates after pressing with the preset target parameters based on the position information of the plurality of targets on each of the core plates after pressing, to determine a shrinkage value; determining the position of the through hole according to the shrinkage value, to drill a through hole in the PCB plate.

5. The PCB board drilling method of claim 4, wherein, the step of comparing the position information of the plurality of targets on each of the core plates after pressing with the preset target parameters based on the position information of the plurality of targets on each of the core plates after pressing, to determine a shrinkage value comprises: identifying the plurality of targets on each of the core plates by an X-RAY device, to obtain a shadow area, the shadow area being used to represent the area formed by the superposition of the plurality of targets at the corresponding position of each of the core plates; A center of gravity of the shadow area is determined, a target hole is drilled on the PCB board with the center of gravity as a drill center, and a comparison is made between position information of the target hole and the preset target parameters to determine a shrinkage value.

6. A PCB board manufacturing system that executes the PCB board manufacturing method according to any one of claims 1 to 3, characterized by The application relates to a PCB manufacturing method and device. An acquisition module is used to acquire a plurality of core plates, and each core plate is divided into a plurality of pre-processing areas according to a preset partition mode; A plurality of targets are arranged on the edges and / or interiors of each pre-processing area according to preset target parameters, and the preset target parameters are used to determine the positions of the plurality of targets; A fusion module is used to stack the plurality of core plates, and a partial area between two adjacent core plates is fixed by pre-fusion; A pressing module is used to press the plurality of core plates to form a PCB plate.

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