Electronic component

Abstract

An electronic board spanning between battery cell terminals of multiple energy storage units. The electronic board includes: at least one terminal coupling region configured as a main path for current between the electronic board and the battery cell terminals; at least one circuit region including at least a first conductive layer and a second non-conductive layer; and two or more electronic components disposed on one or more electronic boards and connected to the conductive layer in the circuit region. At least a portion of the terminal coupling region and / or the circuit region has defined mechanical bending characteristics and / or combined thickness characteristics to allow for at least some displacement from a predetermined geometric alignment.

Description

Technical Field

[0001] The present invention generally relates to electronic components associated with an energy storage system, and more particularly to an apparatus for facilitating mechanical or thermal stress relief between energy storage cells and a component including the apparatus. Background Art

[0002] Energy storage systems for applications such as all-electric vehicles, hybrid electric vehicles, and stationary energy storage for grid-connected or off-grid applications often include an arrangement of multiple energy storage battery cells.

[0003] In an energy storage system including multiple energy storage battery cells, conductive connectors (such as busbars, metal sheets, or metal strips) are typically used to connect the multiple cells to each other. These conductive connectors are typically constructed of copper or aluminum. Additionally, an energy storage system having multiple battery cells typically has separate control connectors to each battery cell terminal for the purpose of battery control (such as measuring the voltage of the battery cell and conducting current to or from a particular battery cell to balance the battery cells). These control connectors typically include a flexible wire that may have a conductive core and a non-conductive electrical insulator. In summary, this common method has the advantage of high electrical conductivity between battery cells via the conductive connectors, and by having separate conductive connectors along with flexible wires between each set of battery cells, this common method is able to achieve good electrical connection to the battery cells with low resistance and high vibration tolerance. However, the busbars and strips have the disadvantage that the assembly requires an additional electronic board with a large number of wires (such as measurement and balancing electronics for connection to the flexible wires), which increases cost, assembly complexity, and the risk of breakage.

[0004] A less common method is to interconnect an energy storage system by using an electronic board. These electronic boards typically combine both conductive and non-conductive layers, are structurally rigid, and can provide both electrical connections between battery cells and electrical connections for measuring and controlling each battery cell. An electronic board as a single physical component can provide electrical connections between multiple battery cells, measurement, and balancing, which reduces complexity and aids in speed and simple assembly. Additionally, a single electronic board can integrate electronic components such as those required for measurement or balancing. However, this less common method has the following disadvantages: If the connection points of at least multiple battery cells are not perfectly aligned in a single plane, a single board connected to multiple connection points can potentially cause mechanical stress in the board as well as a poor electrical connection. Additionally, since battery cells are typically heavy, when these cells are subjected to vibration (as may be common in their intended applications), the movement of these cells transfers mechanical stress into the electronic board, which can lead to failure of the board or components on the board.

[0005] Another disadvantage of a single electronic board is that during significant heating and cooling processes, the battery and the board can experience different thermal expansions, which can also cause mechanical stress in the board. Additionally, to provide high current capabilities, these boards can have two or more conductive material layers separated by other layers including one or more non-conductive layers, where the two conductive layers are electrically connected by an electronic via. However, the distance between the conductive layers (e.g., due to the non-conductive layers) limits the thermal conductivity between the conductive layer near the via and the portion without the via, which can in turn limit heat dissipation and thus limit the performance (e.g., current capabilities) of such boards and the electronic components mounted thereon.

[0006] Accordingly, an object of the present invention is to mitigate or improve the above disadvantages of the prior art, or at least to provide a useful alternative to the public. Other objects will be apparent to those skilled in the art. Summary of the Invention

[0007] According to some broad embodiments, the present invention relates to an electronic assembly that includes one or more electronic boards adapted to span between the terminals of three or more energy storage units; conductive terminals arranged in a predetermined geometric alignment and configured as the main path for current to or from the energy storage units; the one or more electronic boards including: at least one terminal coupling region and at least one circuit region, the at least one terminal coupling region being configured as the main path for current between the electronic board and the unit terminals; the at least one circuit region including at least a first conductive layer and a second non-conductive layer; wherein at least a portion of the terminal coupling region and / or at least a portion of the circuit region is characterized by mechanical bending properties and / or combined thickness properties that allow at least some displacement from the predetermined geometric alignment.

[0008] According to some broad embodiments, the present invention relates to an electronic assembly that includes one or more electronic boards adapted to span between the terminals of three or more energy storage units; battery unit terminals arranged in a predetermined geometric alignment and configured as the main path for current to or from the energy storage units; the one or more electronic boards including: at least one terminal coupling region, at least one circuit region, and two or more electronic components, the at least one terminal coupling region being configured as the main path for current between the electronic board and the battery unit terminals; the at least one circuit region including at least a first conductive layer and a second non-conductive layer; the two or more electronic components being disposed on the one or more electronic boards and connected to the conductive layers in the circuit region; and

[0009] wherein at least a portion of the terminal coupling region and / or at least a portion of the circuit region is characterized by mechanical bending properties and / or combined thickness properties to allow at least some displacement from the predetermined geometric alignment.

[0010] In some embodiments, the circuit region includes a main current path between at least two terminal coupling regions, wherein at least one of the electronic components is a switching component that is disposed in the main current path and configured to selectively bypass and reversibly disconnect any one or more of the storage units from a series connection.

[0011] In some embodiments, at least one of the terminal coupling regions is electrically coupled to one or more junctions between two serially connected energy storage units.

[0012] In some embodiments, at least one of the plurality of energy storage units includes a charge capacity of at least 20 ampere-hours.

[0013] In some embodiments, at least one of the electronic components includes an electronic circuit board or an integrated electronic circuit element with discrete components mounted thereon.

[0014] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions further includes an elastically deformable material layer.

[0015] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions further includes at least two conductive layers separated by at least one non-conductive layer, and one or more vias extending between the at least two conductive layers.

[0016] In some embodiments, at least one of the circuit regions further includes a layer that is substantially continuous with at least one of the terminal coupling regions.

[0017] In some embodiments, at least one of the circuit regions further includes one or more support layers to alter mechanical bending characteristics and / or combined thickness characteristics in the circuit region proximate the one or more support layers.

[0018] In some embodiments, one or more support layers are substantially continuous with at least one of the circuit region and / or the terminal coupling region of the electronic board.

[0019] In some embodiments, at least one of the plurality of energy storage units includes a charge capacity of at least 20 ampere-hours.

[0020] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions further includes an elastically deformable material layer.

[0021] In certain embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions further includes at least two conductive layers separated by at least one non-conductive layer, and one or more vias extending between the at least two conductive layers.

[0022] In some embodiments, at least one of the circuit regions further includes a layer that is substantially continuous with at least one of the terminal coupling regions.

[0023] In some embodiments, at least one of the circuit regions further includes one or more support layers to modify mechanical bending characteristics and / or combined thickness characteristics in the circuit region adjacent to the one or more support layers.

[0024] In some embodiments, one or more support layers are substantially continuous with at least one of the circuit regions and / or terminal coupling regions of the electronic board.

[0025] In some embodiments, at least one of the circuit regions includes: a main current path between terminal coupling regions of at least two energy storage units, and one or more switching components disposed in the main current path and operable to selectively bypass and reversibly disconnect one or more energy storage units.

[0026] In some embodiments, the terminals include terminals electrically coupled to a junction between two energy storage units.

[0027] In some embodiments, the circuit region includes: one or more switching components connected to a junction between serially connected storage units, the switching components being configured to selectively bypass and reversibly disconnect any one or more of the serially connected storage units.

[0028] In some embodiments, the terminal coupling regions are arranged to be rigidly coupled to the terminals of the storage units by fasteners, fusing, or welding.

[0029] In some embodiments, the terminal coupling region further includes a temperature sensor configured to measure the temperature of components adjacent to the terminals.

[0030] In some embodiments, the terminal coupling region further includes a voltage sensor configured to measure the voltage at the terminals.

[0031] In some embodiments, the terminal coupling region further includes a plurality of conductive segments, at least one segment being configured to be coupled to the temperature sensor and / or the voltage sensor, and the main current path includes one or more other segments.

[0032] In some embodiments, the support layer includes one or more slits, ridges, holes, and / or depressions disposed between at least some of the plurality of conductive segments of the terminal coupling region.

[0033] In some embodiments, one or more layers include one or more slits, ridges, holes, and / or recesses, which are arranged to at least partially abut a terminal coupling region.

[0034] In some embodiments, the terminal region includes a conductive pad segmented by a plurality of non-conductive regions, and at least some of the non-conductive regions include one or more slits, ridges, holes, and / or recesses.

[0035] In some embodiments, the main current path further includes one or more fusible circuits, which are arranged to couple at least one of the terminal coupling regions to at least one of the circuit region and / or other terminal coupling regions.

[0036] In some embodiments, one or more fusible circuits include printed conductive traces having geometric constraints nominally configured for rupture at higher than about 1000 amperes.

[0037] In some embodiments, the electronic board includes polyimide or polyimide film (Kapton).

[0038] In some embodiments, the electronic component further includes a plurality of energy storage units, each having a conductive terminal configured as a main path for current to or from the unit.

[0039] In some embodiments, the electronic component further includes one or more tether fastener arrangements that hold bolts in place when not in a fastened state relative to the electronic component and / or one or more energy storage units.

[0040] In some embodiments, the bending characteristics are defined as:

[0041] a) The electronic component has a flexural modulus of less than 12 GPa at room temperature;

[0042] b) The electronic component has a flexural modulus of about 6 GPa at room temperature;

[0043] c) The material in one or more non-conductive layers has a flexural modulus of less than 10 GPa at room temperature;

[0044] d) The material in one or more non-conductive layers has a flexural modulus of about 3 GPa at room temperature;

[0045] e) The electronic component has a flexural strength of less than 300 MPa at room temperature;

[0046] f) The electronic component has a flexural strength of about 150 MPa at room temperature;

[0047] g) The material in one or more non-conductive layers has a flexural strength of less than 300 MPa at room temperature;

[0048] The material in one or more non-conductive layers has a flexural strength of less than 150 MPa at room temperature.

[0049] In some embodiments, the combined thickness characteristics are defined by:

[0050] h) One or more support layers have a thickness of about 1 mm;

[0051] i) One or more support layers are greater than 0.4 mm;

[0052] j) One or more thin non-conductive layers and one or more conductive layers have a combined thickness of up to 0.4 mm;

[0053] k) One or more thin non-conductive layers and one or more conductive layers have a combined thickness of up to 0.2 mm;

[0054] l) One or more thin non-conductive layers and one or more conductive layers have a combined thickness of about 0.1 mm;

[0055] m) The first non-conductive layer has a thickness of up to 0.08 mm; and / or

[0056] n) The first non-conductive layer has a thickness of up to 0.02 mm.

[0057] In some embodiments, the present invention relates to any one or more of the above statements in combination with any one or more of the other statements. Other aspects of the present invention will become apparent from the following description, which is given by way of example only and with reference to the accompanying drawings.

[0058] The entire disclosures of all applications, patents, and publications (if any) cited above and below are hereby incorporated by reference. The present invention can also be broadly said to include the parts, elements, and features individually or jointly mentioned or indicated in the specification of this application, and any or all combinations of any two or more of said parts, elements, or features, where when referring to a particular entity having known equivalents in the field to which the present invention pertains, such known equivalents are considered incorporated herein as if set forth individually.

[0059] For those skilled in the art of the field to which the present invention pertains, many variations in the construction and widely different embodiments and applications of the present invention will be proposed without departing from the scope of the present invention as defined in the appended claims. The disclosure and description herein are illustrative only and are not intended to be limiting in any sense.

[0060] As used in this specification and the claims, the term "and / or" means "and" or "or", or both. The term "comprising" as used in this specification and the claims means "consisting at least in part of". When interpreting statements in this specification and the claims that include this term, the features starting with this term in each statement are required to be present, but other features may also be present. Related terms, such as "comprise" and "comprised", will be understood in the same way.

[0061] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless expressly stated otherwise. It will be further understood that when the terms "include", "comprise", "including", and / or "comprising" are used in this specification, the presence of the specified features, integers, steps, operations, elements, and / or components is indicated, but the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof is not excluded. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] The present invention can be better understood with reference to the following drawings. The elements of the drawings need not be to scale relative to each other, but rather emphasis is placed on clearly showing the principles of the invention. Further, throughout the various views, like reference numerals refer to corresponding parts.

[0063] Figure 1 An exemplary electronic assembly attached to eight battery modules is shown.

[0064] FIG. 2A and FIG. 2B show an exemplary electronic assembly attached to twenty-four battery modules.

[0065] Figure 3 Is shown in more detail Figure 1 of the electronic assembly.

[0066] Figure 4 An example of an electronic assembly is shown that has a switching component attached to three battery modules and is arranged to selectively bypass any one or more of these battery modules.

[0067] Figure 5 Is shown Figure 1 and Figure 3 a cross-section of an exemplary electronic assembly.

[0068] Figure 6Shows a detailed cross-sectional view of an exemplary embodiment of an electronic component having different layers.

[0069] Figure 7 Shows an exemplary embodiment of an electronic component having a conductive layer, a non-conductive layer, and a heat sink element.

[0070] Figure 8 Shows an exemplary embodiment of an electronic component

[0071] Figure 9(A) shows Figure 8 a top isometric view of the component, and Figure 9(B) shows a bottom view of the component.

[0072] Figure 10 Shows a bottom view of another exemplary electronic component.

[0073] Figure 11 Shows another exemplary embodiment of an electronic component.

[0074] Figure 12 Shows a close-up view of an exemplary electronic component, particularly a terminal coupling region.

[0075] Figure 13 Shows an example electronic circuit for implementation on any of the described electronic components.

[0076] Figure 14 Shows an example electronic circuit for implementation on any of the described electronic components, the electronic component having mechanical bending characteristics and / or combined thickness characteristics that allow for a shift from a predetermined geometric alignment.

[0077] Figure 15 Shows a top view of an exemplary embodiment of an electronic component, where a single electronic board is adapted to span between multiple battery cell terminals.

[0078] Figure 16 Shows an example of an electronic circuit for implementation on any electronic component.

[0079] Figure 17 Shows a bottom isometric view of an exemplary embodiment of the bottom of an electronic component.

[0080] Figure 18 Shows a bottom view of another exemplary embodiment of an electronic component having a notch at the attachment point on a battery cell.

[0081] Figure 19 Shows an exemplary embodiment of an electronic component of a six-layer electronic board laminate, the board also supporting electronic components. Detailed Description

[0082] This document describes exemplary methods, devices, components, and systems. It should be understood that the term "exemplary" is used herein to mean "serving as an example, instance, or illustration". Any embodiment or feature described herein as "exemplary" or "illustrative" is not necessarily to be construed as preferred over or superior to other embodiments or features. More generally, the embodiments described herein are not meant to be limiting. It will be readily understood that certain aspects of the disclosed systems and methods can be arranged and combined in a variety of different configurations, all of which are contemplated herein.

[0083] The present invention includes one or more electronic boards and a component including an electronic board spanning between terminals of a plurality of energy storage battery cells. To address the above drawbacks, the electronic board integrates one or more features that contribute to the measurement of flexibility, deformability, or elasticity, such that mechanical stress, thermal stress, or thermal energy generated in the board itself, in components attached to the board, and / or transferred from the battery cells to the board does not destructively affect the board or the components supported by the board, or at least mitigates such stress or heating.

[0084] In this specification, the term "battery cell unit" or "battery cell" generally refers to a component capable of storing charge, and can refer to an individual battery cell or a block of battery cells connected in parallel, or a mixture of multiple individual battery cells or parallel battery cell blocks, or battery cells connected in series. The energy storage unit can also refer to a block of battery cells connected in parallel and / or in series, and the energy storage unit also includes circuit components connected in series and / or in parallel with individual battery cells, such as fuses, resistors, passively controlled diodes, capacitors, or inductors, etc. The terms "energy storage unit", "storage unit", "battery cell unit" or "battery cell" can also refer to non-battery energy storage elements, such as fuel cells and supercapacitors.

[0085] In some embodiments, the energy storage unit can be designed to include one or more energy storage units capable of achieving a charge capacity of at least 10 Ah, 20 Ah, 40 Ah, 60 Ah, 100 Ah, 200 Ah, or 400 Ah ampere-hours. In some embodiments, the plurality of energy storage units can include a first energy storage unit and a second energy storage unit, wherein the first energy storage unit has a charge capacity substantially greater than that of the second energy storage unit.

[0086] In a preferred embodiment, there is one or more electronic boards adapted to span between the terminals of three or more energy storage units. In industrial applications, due to variations in battery cell size or inconsistencies in battery cell alignment or other reasons (such as proximity to an electrical load or a cooling source), the terminals of the storage units will be arranged in a predetermined alignment to best suit the packaging constraints of the application. The predetermined geometric alignment of the conductive terminals is configured as the main path of the current to or from the energy storage unit.

[0087] The terminals will have a predetermined geometric arrangement typically dictated by the requirements of their application or purpose. For example, to optimize the coupling of current between cells, the terminals of the cells are typically arranged such that electronic components in a single plane can contact all the terminals. However, the terminals can be in an arrangement where at least one terminal is spatially offset compared to one or more other terminals. For example, there may be physical constraints due to one or more other parts of the energy storage module, a rack, a housing, or other nearby parts that may collide with the plane of the terminals (subsequently potentially indicating misalignment of the terminals).

[0088] One or more electronic boards have a plurality of terminal coupling regions intended to be attached to the terminals of the storage units. The terminal coupling regions are configured as the main path of the current between the electronic board and the unit terminals and are used to charge or discharge the energy storage unit as needed.

[0089] Further, the electronic board has at least one circuit region, which is generally used to support components such as discrete components, sensors, or any other electrical device that can be usefully connected to the at least one circuit region. The circuit region has at least a first conductive layer and a second non-conductive layer in some areas to form a circuit path and a substrate for the circuit path.

[0090] A preferred implementation of the electronic board is a printed circuit board. The circuit board is typically constructed from a laminate of layers. Any layer in the laminate can be a conductive layer or a non-conductive layer. In some embodiments, the conductive layer can include aluminum or copper. In some embodiments, the non-conductive layer material includes polyimide, Kapton tape, polyethylene terephthalate, or polyethylene naphthalate. In some embodiments, one or more support layers can include a glass-reinforced epoxy laminate, such as FR4, or aluminum.

[0091] The conductive layer is typically a metal, such as copper or copper-plated. In the case of using two or more conductive layers separated by non-conductive layers, vias can be used to electrically and thermally connect these layers. Heat is often generated from electronic components mounted on the electronic assembly (such as switches, diodes, fuses, or other components), and this heat can be effectively transferred by arranging the conductive layers and vias.

[0092] To address mechanical stress, thermal stress, or thermal energy, the terminal coupling region and / or the circuit region are characterized by: mechanical bending characteristics that allow for at least some displacement from a predetermined geometric alignment or allow for connection to terminals that are not in precise alignment, and / or combined thickness characteristics.

[0093] A region of the circuit region or the terminal region contributes to the mechanical bending characteristics, where the region is relatively flexible to form a deformation region and / or a relatively thin region. This has one or more of the following advantages:

[0094] - If connection points (e.g., multiple battery cell terminals) are not perfectly aligned, the electronic board can be bent without excessive stress on the board.

[0095] - During significant heating and cooling, if the battery and the board experience different thermal expansions, the electronic board can be bent without excessive stress on the board.

[0096] - A non - typical thin board (e.g., having two conductive layers on either side of a thin non - conductive layer) can have high thermal conductivity between the two conductive layers at vias and in regions without vias, and thus achieve high performance, such as current - carrying capacity, in the board and the electronic components mounted thereon.

[0097] Bending characteristics

[0098] In some exemplary embodiments, one or more of the electronic boards are characterized by a measurement of the bending of a portion of the terminal coupling region or a portion of the circuit region according to the following: the conductive layer is operable to allow current to flow throughout the bending process and after the bending: bending 10 degrees or more at a bending radius of up to 5 cm, bending 15 degrees or more at a bending radius of up to 5 cm, bending 30 degrees or more at a bending radius of up to 5 cm, or bending 45 degrees or more at a bending radius of up to 5 cm.

[0099] In some exemplary embodiments, one or more of the electronic boards are characterized by a measurement (at approximately 20 degrees Celsius) of the bending of a portion of the terminal coupling region or a portion of the circuit region according to the following: a flexural modulus of less than 12 GPa, a flexural modulus of approximately 6 GPa, a flexural strength of less than 300 MPa, or a flexural strength of approximately 150 MPa.

[0100] In some exemplary embodiments, one or more of the non - conductive layers are characterized (at approximately 20 degrees Celsius) by: a flexural modulus of less than 10 GPa, a flexural modulus of approximately 3 GPa, a flexural strength of less than 300 MPa, or a flexural strength of approximately 150 MPa.

[0101] Thickness characteristics

[0102] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions is characterized by a combined thickness characteristic. In other embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions is characterized by the thickness characteristic of at least one specific layer. The thickness characteristic is selected to optimize or improve the heat transfer behavior.

[0103] In some embodiments having two or more conductive layers separated by one or more non-conductive layers, having a relatively thin non-conductive layer between the conductive layers can enable the conductive layers to more effectively disperse heat energy.

[0104] In some embodiments, one or more electronic boards include at least a first non-conductive layer and at least a first conductive layer, and the electronic board is characterized by a combined thickness of less than 0.4 mm, less than 0.2 mm, or about 0.1 mm.

[0105] In some embodiments, one or more electronic boards include at least a first non-conductive layer and at least a first conductive layer, and the electronic board is characterized by a combined thickness of about 0.05 mm to 0.4 mm, 0.1 mm to 0.4 mm, 0.15 mm to 0.4 mm, 0.2 mm to 0.4 mm, 0.25 mm to 0.4 mm, 0.3 mm to 0.4 mm, 0.35 mm to 0.4 mm, 0.05 mm to 0.35 mm, 0.05 mm to 0.3 mm, 0.05 mm to 0.25 mm, 0.05 mm to 0.2 mm, 0.05 mm to 0.15 mm, or 0.05 mm to 0.1 mm.

[0106] In some embodiments, one or more electronic boards include at least a first non-conductive layer and at least a first conductive layer, and the electronic board is characterized by a combined thickness of about 0.05 mm to 0.2 mm, 0.1 mm to 0.2 mm, 0.15 mm to 0.2 mm, 0.05 mm to 0.15 mm, or 0.05 mm to 0.1 mm.

[0107] In some embodiments, the optimal value for the flexure of one conductive layer is about 0.08 mm. Other values are possible; however, performance may be reduced in the case of achieving a deviated value. In some embodiments, the optimal value for the flexure of two conductive layers is about 0.1 mm. Other values are possible; however, performance may be reduced in the case of achieving a deviated value.

[0108] In some embodiments, the thickness value of a board including two conductive layers ranges between about 0.05 mm and about 0.1 mm. Note that increasing the spacing between the conductive layers reduces the heat transfer between the layers, which can in turn reduce the heat dissipation efficiency. That is, as the non-conductive layer becomes thinner, the heat dissipation performance can be improved.

[0109] In some embodiments, the thickness value range of a board including more than two conductive layers or thicker conductive layers is between about 0.05 mm and about 0.2 mm.

[0110] In some embodiments, for non-conductive layer material implementations, the non-conductive layer has an actual minimum thickness of about 0.01 mm or 0.025 mm. In some embodiments, the first non-conductive layer is characterized by the following thicknesses: up to 0.08 mm, or up to 0.02 mm. In some embodiments, the optimal thickness of the non-conductive layer of non-conductive material is 0.0125 mm or 0.025 mm. In some embodiments, the optimal range of layer thickness is at least about 0.005 mm to 0.025 mm. In some embodiments, the non-conductive layer is between about 0.005 mm and 0.025 mm, between 0.01 mm and 0.025 mm, between 0.015 mm and 0.025 mm, between 0.020 mm and 0.025 mm, between 0.005 mm and 0.020 mm, between 0.005 mm and 0.015 mm, or between 0.005 mm and 0.010 mm.

[0111] In contrast, FR4 PCB material has an actual thickness of about 1 mm. Although it is noted that thin FR4 boards can be manufactured with a thickness of 0.2 mm. In some embodiments, the non-conductive layer includes FR4 or a similar material layer of about 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm. Additionally, in some embodiments, the non-conductive layer includes FR4 or a similar material layer of about 0.2 to 1.0, 0.3 to 1.0, 0.4 to 1.0, 0.5 to 1.0, 0.6 to 1.0, 0.7 to 1.0, 0.8 to 1.0, or 0.9 to 1.0. Additionally, in some embodiments, the non-conductive layer includes FR4 or a similar material layer of about 0.2 mm to 0.9 mm, 0.2 mm to 0.8 mm, 0.2 mm to 0.7 mm, 0.2 mm to 0.6 mm, 0.2 mm to 0.5 mm, 0.2 mm to 0.4 mm, or 0.2 mm to 0.3 mm.

[0112] In some embodiments, in addition to the non-conductive layer and the conductive layer, additional adhesive layers interspersed between other layers may be present. In some embodiments, additional prepreg layers or other reinforcing layers interspersed between other layers may also be present.

[0113] Support layer

[0114] In some embodiments, some regions of the electronic board are supported by one or more discrete segments that facilitate alignment with the points to which the segments are attached and further rigidity in the regions of the segments near that point. Such segments are referred to herein as support layers. In effect, the support layer changes the mechanical bending characteristics and / or combined thickness characteristics in the circuit regions near one or more support layers. In some embodiments, one or more support layers are characterized by a thickness of about 1 mm or greater than 0.4 mm. In some embodiments, the electronic board is a laminate in which some layers are arranged to span between multiple terminal coupling regions and other layers are located on regions of the support board where increased rigidity is desired.

[0115] The additional rigidity provided by the support layer is beneficial in regions where electronic components are connected to optional discrete electronic parts or elements, which are relatively sensitive to mechanical stress in the connected electronic components, and thus where additional mechanical rigidity can protect against breakage or other problems.

[0116] In some embodiments, the support layer is conductive and configured to carry current within the electronic component.

[0117] In some embodiments, the support layer includes one or more slits, ridges, holes, and / or depressions. The optimal locations of the support layers are where they are arranged to at least partially surround, abut, and / or pass through the terminal coupling regions. The specific arrangement is determined by combining the arrangement of the interconnected battery cells and the load paths generated by the battery cell blocks with the local regions of thermal expansion.

[0118] Terminal coupling region

[0119] The above terminal coupling region is configured to couple the electronic board to the terminals of the battery cell. The terminal coupling region can be attached by any conventional coupling method (such as by fasteners, fusing, or welding).

[0120] In some embodiments, the terminal coupling region is configured to connect to one or more sensors. For example, a voltage sensor or a temperature sensor. Due to the resistive losses that occur in any conductor, it is advantageous to connect the voltage sensor or the sensing coupling to a separate measurement connection rather than on the connection of the main current path. Similarly, it is advantageous for the temperature sensor to be positioned to measure the temperature of the components near the terminal such that the temperature best represents the temperature of the components at that battery cell.

[0121] In some embodiments, the terminal coupling region is divided into a plurality of conductive segments. The segments are arranged such that some segments are configured as part of the main current conduction path and other segments are configured for connection to a temperature sensor and / or a voltage sensor. By isolating segments of the terminal coupling region from other segments, the voltage sensor location has improved isolation from the main current path and any voltage offsets generated on that path. The exemplary embodiments discussed below illustrate a segmented terminal coupling region and implementation.

[0122] Gap feature

[0123] In some embodiments, the support layer is defined by one or more cutouts or recessed regions of the electronic board to facilitate relative displacement of the electronic board regions on either side of the cutout or recessed region. In some different embodiments, the terminal coupling region incorporates the form of a cutout. In some embodiments, such a cutout may form the above-described segments of the terminal coupling region.

[0124] In some embodiments, the support layer is defined by one or more of a slit, a ridge, a hole, and / or a recess that is arranged to at least partially abut the terminal coupling region.

[0125] In some embodiments, the terminal region has a conductive pad as the outermost layer, the conductive pad being segmented by a plurality of non-conductive outermost layers, and at least some regions in the region include one or more slits, ridges, holes, and / or recesses.

[0126] Other features

[0127] In some embodiments, the main current path formed by the conductive layer of the electronic board has one or more fusing circuits that are arranged to couple at least one of the terminal coupling regions to at least one of a circuit region and / or other terminal coupling regions. The fusing link is intended to prevent large currents from discharging from the battery cell (e.g., in the unlikely event of a component failure or in an accident event that causes damage to an electrical component or current path). The fusing link is intended to remain intact during normal use and fail when subjected to current levels far above any operating level.

[0128] In some embodiments, at the location of the fusing link, the conductive layer including the link is covered by non-conductive layers on either side of the conductive layer. The non-conductive layers prevent any contaminants that may adversely affect the performance of the fusing link. The non-conductive layers provide a certain level of protection for the activated fuse component that significantly deviates from its position to an adverse position.

[0129] In other embodiments, at the location of the fusing link, the conductive layer including the link is covered by a non-conductive layer on only one side. In other embodiments, the fusing link is not covered on both sides.

[0130] In some embodiments, the terminal coupling region may define a conductive layer having a geometrically constrained circuit path designed to fail under conditions of about 50 amperes or greater, about 100 amperes or greater, about 200 amperes or greater, about 500 amperes or greater, about 1000 amperes or greater, about 2000 amperes or greater, and / or about 5000 amperes or greater.

[0131] In some embodiments, these energy storage units may be designed to achieve a maximum charge current or discharge current of at least 3 amperes, 10 amperes, 30 amperes, 50 amperes, 100 amperes, 400 amperes, or different current levels for one or more of the energy storage units.

[0132] In some embodiments, an electronic component supports an electronic switching component that is selectively operated to connect or bypass any one or more battery cells from a series arrangement. This operation may further require selective disconnection and reconnection, where disconnecting a battery cell from the series arrangement is performed in a reversible manner such that the battery cell can thereafter be selectively reconnected to the series arrangement. Selectively bypassing a battery cell from the series arrangement achieves different connection states and allows, for example, variation of the output voltage of the series arrangement. Operation of the electronic switching component is possible during charging and / or discharging of one or more battery cells in the series arrangement.

[0133] In the presence of three battery cells, the connection states may include a first state where the first and second battery cells are electrically connected in series and the third battery cell is disconnected; a second state where the first and third battery cells are electrically connected in series and the second battery cell is disconnected; and a third state where the second and third battery cells are electrically connected in series and the first battery cell is disconnected.

[0134] When there are four battery cells, the states may include the above three states, and a fourth state where the first, second, and fourth battery cells are electrically connected in series and the third battery cell is disconnected; and a fifth state where the first, second, third, and fourth battery cells are electrically connected in series.

[0135] By controlling the number of battery cells connected in series, the electronic component may be able to control the voltage generated at the output of one or more electronic components.

[0136] In some embodiments, an electronic component supports an electronic part that operates in such a way that, in addition to connecting or bypassing any of a plurality of battery cells in a series arrangement, individual battery cells or groups of battery cells can be additionally inverted. In one control state, such an electronic component can have a first output terminal that has a relatively positive voltage potential with respect to a second output terminal. In a second control state, such an electronic component can have a first output terminal that has a relatively negative voltage potential with respect to a second output terminal.

[0137] In some embodiments, the electronic part on the electronic component can be operated such that a plurality of battery cells are connected in series while one or more battery cells are connected to a resistive element for the purpose of discharging these one or more battery cells or reducing the charging of these one or more battery cells. In another embodiment, the electronic part on the electronic component can be operated such that a plurality of battery cells are connected in series while one or more battery cells are connected to an energy transfer element for the purpose of transferring energy from a first battery cell to one or more other battery cells, or transferring energy from one or more other battery cells to the first battery cell. The energy transfer element can include, for example, one or more of a capacitor, an inductor, a transformer, a DC / DC converter, and / or a battery.

[0138] Figure 1 An exemplary electronic component is shown. In this example, the electronic component has an electronic board 200 that is designed to be attached to eight battery modules 202a - 202h. In the depicted example, each battery module has two battery cells connected in series. However, many other combinations of battery cells are possible. This means that the positive terminal of the first battery cell within the first module 202a and the negative terminal of the second serially connected battery cell within module 202a are connected together at terminal 210a and are connected to the electronic component at a contact point 206a. The negative terminal of the first battery cell is connected to the electronic component at a separate contact point 204a. The positive terminal of the second battery cell is also connected to the electronic component at a separate contact point 208a.

[0139] Figures 2A and 2B illustrate an exemplary electronic assembly attached to twenty-four battery modules 302a - 302x. In this example, the electronic assembly has twelve discrete electronic boards 304a - 304l. Each board is configured to be attached to two battery modules. It should be understood that any number of modules or boards or battery cells in each module can be implemented depending on the desired voltage, current, or capacity requirements. Each battery module includes two battery cell units connected in series. The electronic boards are connected to adjacent boards via electrical connectors 306a - 306k that conduct current flowing through one or more battery cells. The electronic boards are also connected to each other via control connectors 308a - 308k and 310a - 310k that enable sharing of encoded communication signals or physical control signals (such as pulses, sine waves, or other time-varying unencoded signals).

[0140] Further, the electronic assembly includes electronic components 320aa - 320xb, which are electronic circuit boards with discrete components mounted thereon. The electronic assembly also includes electronic components 315aa - 315xb, which are switch components disposed in the main current path and configured to selectively bypass and reversibly disconnect any one or more battery cell units from the series connection of the battery cell units.

[0141] Figure 3 Shown in more detail Figure 1 the electronic assembly. In this exemplary embodiment, the electronic assembly is a single electronic board that includes a repetitive structure intended for connection and attachment to eight battery modules. Each battery module includes two battery cell units connected in series. The largest component of the electronic assembly can be a printed circuit board implemented according to the thickness and / or bending characteristics outlined above. The large raised square along the outside is an electronic circuit element, such as a secondary electronic circuit board with components mounted thereon or other integrated electronic circuit elements (such as an FPGA or ASIC).

[0142] The two sets of three small raised squares for each module are optional electronic components. The electronic component can be a switching component, such as a transistor, IGBT or field effect transistor, which can be used to implement a connection state capable of changing the connection state of batteries connected in series with each other. For example, in this embodiment, sixteen battery cell units connecting the electronic assembly, at a specific time point, the electronic component on the electronic assembly can be operated such that ten specific battery units can be electrically connected in series, and the remaining six battery units can be not electrically connected in series with the ten battery units. At different time points, the electronic component on the electronic assembly can be operated such that nine battery units (which can be a mixture of some of the previous ten battery units and the previous six battery units) can be electrically connected in series, and the remaining seven battery units can be not electrically connected in series with the nine battery units. In fact, the electronic component on the electronic assembly can be configured such that it can achieve different operating states, the different operating states enabling any selected number and group of battery cell units to be connected in series, while any other battery cell units connected to the electronic assembly can be not electrically connected in series with the battery cell units connected in series.

[0143] Figure 4 An example of a battery system is shown, which includes an electronic assembly 100 having switching components (122 - 144) that are attached to three battery modules (104a - f) and are arranged to selectively bypass any one or more of these battery modules. Each battery module includes two battery cell units connected in series. The electronic assembly has a predetermined geometric alignment and / or combined thickness characteristics, and the switching components are configured as battery cell bypass switch electronic components. In addition, terminals are electrically coupled to the joints between two energy storage units.

[0144] Battery system 100 includes a circuit module 102 for coupling to a plurality of battery cell units 104. For exemplary purposes, battery system 100 includes six battery cell units 104a, 104b, 104c, 104d, 104e, 104e, 104f. However, any suitable number of battery cell units 104 can be used in battery system 100. Battery system 100 includes battery package terminals 101 and 103 for supplying electrical energy to an external load or receiving electrical energy from an external power source (not shown).

[0145] The circuit module 102 includes six sets of terminals 106 - 116 for coupling to battery cells 104. Each set of terminals has a positive terminal 106a, 108a, 110a, 112a, 114a, 116a and a corresponding negative terminal 106b, 108b, 110b, 112b, 114b, 116b. Each set of terminals 106 - 116 is configured to be coupled to a battery cell 104 (referred to herein as the associated battery cell 104). However, those skilled in the art will understand that any number of terminals and battery cells may be used in the battery system 100 or any battery system described herein without departing from the scope of the present invention.

[0146] In the battery system 100, the components of the circuit module 102 are arranged such that the positive terminals in one set of terminals 106a, 110a, 114a are directly coupled to the negative terminals in an adjacent set of terminals 108b, 118b, 116b through conductors 118a - 118c.

[0147] The negative terminal 106b of the first set of terminals 106 is coupled to a switch assembly 120a. The switch assembly 120a includes a first switch 122 and a second switch 124. The first switch 122 is for connecting the battery cell 104a to the circuit module 102 when closed, and the second switch 124 is for bypassing the battery cell 104a when closed. More specifically, when the first switch 122 is closed and the second switch 124 is open, the battery cell 104a is active or connected to the circuit module 102, and when the first switch 122 is open and the second switch 124 is closed, the battery cell 104a is inactive or bypassed from the circuit module 102.

[0148] Similarly, the positive terminal 108a of the second set of terminals 108 is coupled to a second switch assembly 120b. The switch assembly 120b includes a first switch 126 and a second switch 128. The first switch 126 is for connecting the battery cell 104b to the circuit module 102 when closed, and the second switch 128 is for bypassing the battery cell 104b when closed. More specifically, when the first switch 126 is closed and the second switch 128 is open, the battery cell 104b is connected to the circuit module 102, and when the first switch 126 is open and the second switch 128 is closed, the battery cell 104b is bypassed from the circuit module 102.

[0149] Therefore, the current flowing through the battery cell unit 104a is controlled via the switches 122, 124. If the switch 122 is closed and the switch 124 is open, any current flowing between the package terminals 101, 103 flows through the switch 122 and the battery cell unit 104a. If the switch 122 is open and the switch 124 is closed, any current flowing between the package terminals 101, 103 passes through the switch 124 but does not pass through the battery cell unit 104a. The other battery cell units 104b - 104f are controlled in a similar manner via their associated switch assemblies.

[0150] The circuit layouts including two sets of terminals 106, 108 and the associated switch assemblies 120a, 120b respectively form a single circuit unit block 131a of the battery system 100. The battery system 100 includes two other circuit unit blocks 131b, 131c arranged in the same manner as the unit block 131a. The three circuit units 131a, 131b, 131c are coupled together to form the entire system 100. However, it should be understood that the system 100 may include any suitable number of unit blocks 131 to meet the energy storage requirements of a particular upcoming application.

[0151] As described above, the positive terminal 106a of the battery cell unit 104a is directly connected to the negative terminal 108b of the battery cell unit 104b. Arranging the circuit in this way allows the switches 122, 124, 126, 128 to be in physically adjacent positions on one side of the battery cell units 104a, 104b without lengthening the length of the current path between the battery cell units 104 and the switches 122, 124, 126, 128. This advantageously results in reduced manufacturing costs, reduced space requirements, and avoidance of additional resistance, and thus avoidance of energy loss caused by an increased current path length.

[0152] However, in the battery system 100, in order to connect the positive terminal 106a of the battery cell unit 104a to the negative terminal 112b of 104d through the battery cell units 104b and 104c, the current passes through two switches 126, 130. In this embodiment, if all six battery cell units 104a - 104f carry current, the current must also pass through the switches 122, 126, 130, 134, 138, and 142. This corresponds to one switch per battery cell through which the current flows, and each switch has a conduction resistance and an associated energy loss.

[0153] Figure 4The arrangement of the bypass switches shown is exemplary, and other arrangements of cell-to-cell bypass switches configured and operable to bypass any one or more of the battery cells are possible. Additional example circuits are shown in publications US20190363311A1, US 2020144830A1, and US 10573935B2, which are hereby incorporated by reference in this specification.

[0154] Figure 5 is shown Figure 1 and Figure 3 A cross-section of an exemplary electronic component is shown. The depicted embodiment has four or more layers, which are characterized from top to bottom as follows: (1) a thin conductive layer (part of the flexible circuit); (2) a thin non-conductive layer (part of the flexible circuit); (3) a thin conductive layer (part of the flexible circuit); (4) a support layer (reinforcement). In this exemplary embodiment, the first to third layers form an electronic board, specifically the terminal coupling region of the board. The fourth layer is a support layer arranged adjacent to the region of the terminal contacting the electronic board. (1) The thin conductive layer has the function of carrying current within the electronic component. (2) The thin non-conductive layer has the function of electrically isolating the (1) thin conductive layer and the (3) thin conductive layer in certain positions. (3) The thin conductive layer has the function of carrying current within the electronic component. (4) The thick support layer is conductive or non-conductive, or has a combination of conductive and non-conductive regions, and in some embodiments is intended to improve the mechanical rigidity of the electronic component. In the case where the (4) support layer is conductive, this layer may additionally have the function of carrying current within the electronic component.

[0155] Figure 6Shows a detailed cross-sectional view of an exemplary embodiment of an electronic component having different layers. The electronic component has components and six layers, which are characterized in the following order from top to bottom: (1) a thin non-conductive layer ("PI - polyimide - layer"); (2) a thin conductive layer; (3) a thin non-conductive layer ("PI layer"), (3) a thin conductive layer; (4) a thin non-conductive layer ("PI layer") and (5) a thick support layer ("reinforcement"). (1) The thin non-conductive layer has the function of providing electrical isolation between (2) the thin conductive layer and the outside world. (2) The thin conductive layer is configured to carry current within the electronic component. (3) The thin non-conductive layer is configured to electrically isolate the regions of (2) the thin conductive layer and (4) the thin conductive layer. (4) The thin conductive layer is configured to carry current within the electronic component. (5) The thin non-conductive layer is configured to electrically isolate (4) the thin conductive layer from the surrounding environment. (6) The support layer can be conductive, non-conductive, or a mixture having conductive and non-conductive regions, and is configured to provide mechanical rigidity to the electronic component. This embodiment also has electronic vias that form conductive vertical connections between two or more conductive layers. The number and / or size and / or density of the vias can be large in order to achieve a desired thermal conductivity between two or more conductive layers, and can allow the heat energy generated by any component connected to one conductive layer to be dispersed and effectively dissipated.

[0156] Figure 7 Shows an exemplary embodiment of an electronic component having a conductive layer, a non-conductive layer, and a heat sink element. The heat sink element is configured to provide heat exchange between the electronic component and other media (such as ambient air, other gases, and / or liquid cooling systems) that can be integrated within a final application. In this embodiment, the heat sink element is made of aluminum and does not have any moving parts. In other embodiments, the heat sink element can be active and include a fan or other moving parts. In some embodiments, the heat sink element can be made of other materials (such as materials suitable for high heat transfer). In some embodiments, the heat sink element can include or be connected to a heat pipe or other heat transfer arrangement.

[0157] In this embodiment, the support layer has slits, and the heat sink element is connected to the electronic component at the slits on opposite sides of the electronic component. Alternatively, the heat sink element can be located on the same side as the electronic component, or on the same side or opposite side of other potential heat sources.

[0158] Figure 8 Shows an exemplary embodiment of an electronic component, Figure 9(A) shows a top isometric view of the component, and Figure 9(B) shows a bottom view of the component.

[0159] Figure 8An exemplary embodiment is an electronic component that includes an electronic board adapted to span across a plurality of terminals of an energy storage unit. The terminals are arranged in a predetermined geometric alignment and are configured as the main paths for current to or from the energy storage unit. The electronic board includes a terminal coupling region and a circuit region. The terminal coupling region is configured as the main path for current between the electronic board and the unit terminals. The circuit region includes at least a first conductive layer and a second non-conductive layer. At least a portion of the terminal coupling region and / or at least a portion of the circuit region are characterized by mechanical bending properties and / or combined thickness properties that allow for at least some displacement from the predetermined geometric alignment. The electronic board is a plurality of individual boards arranged to span across a geometric region defined by the unit terminals. The individual boards can be defined by discrete portions of the board or by gaps in the board so as to define board regions between these gaps. Additionally, one or more support layers are provided to the electronic board to increase the mechanical bending properties and / or combined thickness properties of the board in regions near the support layer.

[0160] In some embodiments, the gaps in the board are spanned by one or more support layers. In this way, some mechanical displacement of the terminal coupling region is allowed, but the regions of the board with support layers have increased rigidity to support the application of discrete components at that location of the board.

[0161] The electronic component is a double-layer electronic component adapted to be attached to three battery cell units, each battery cell unit having a positive terminal and a negative terminal for connection to the electronic component. The electronic component includes a conductive layer adapted to support electronic components and a support layer that provides mechanical rigidity to the component and maintains the spacing between different portions of the conductive layer. The layers of the component are characterized by the above-measured bending and / or combined thickness. The conductive layer of the electronic component is configured to carry current within the electronic component and carry current to or from the terminals. A rigid non-conductive support layer is located below the conductive layer. The conductive layer has gaps that can be formed by slots or cuts. The support layer is located below some or all of these gaps. In some embodiments, the support layer is configured to span across and separate different regions of the conductive layer. In some embodiments, the conductive layer has one or more gaps that are spanned by one or more electronic components.

[0162] Figure 10 A bottom view of another exemplary electronic component having conductive outer regions 400a - 400f is shown. The conductive outer regions 400a - 400f include the terminal coupling region of this example. The electronic component is adapted to be attached to two battery modules, each battery module having two serially-connected battery cell units, where the positive terminal of one battery cell is connected to the negative terminal of the other battery cell, and respectively share connection points 402b, 402e connected to the board.

[0163] The exemplary embodiment includes one or more electronic boards adapted to span between a plurality of terminals of an energy storage unit, the terminals being arranged in a predetermined geometric alignment and configured as the main path of current to or from the energy storage unit. The electronic board includes a terminal coupling region and a circuit region, the terminal coupling region being configured as the main path of current between the electronic board and the unit terminals, and the circuit region including at least a first conductive layer and a second non-conductive layer. Further, at least one of the terminal coupling regions includes a conductive segment, a segment configured as a measurement pad, and a segment configured as the main current path.

[0164] Each of the terminal coupling regions 400a - 400f has a segment 404a - 404f configured for measurement, which is electrically isolated from the other segments 402a - 402f of the terminal coupling region. In this example, the isolation is provided by the layout of the conductive layers of the electronic board. However, other exemplary embodiments employ other methods of segmenting the terminal coupling region, such as providing a physical gap in the electronic board at the location of the terminal coupling region.

[0165] The separate measurement segments 404a - 404f each define a measurement pad. The measurement pads are isolated from the other segments of the terminal coupling region when not connected to a battery cell unit. In the example shown, the large conductive regions 402a - 402f of each terminal region are configured such that the main current can flow between the electronic component and the connected battery cell unit, while the small conductive regions 404a - 404f near each terminal can be used for voltage and / or temperature measurement.

[0166] By separating the contact regions 402a - 402f that experience the main current flow from the contact regions 404a - 404f for measurement, more precise measurements can be made, such as measurements of battery cell voltage and / or battery cell temperature. In some embodiments, two or more battery cell voltage measurements can be made, including at least one in the region 402a - 402f that experiences the main current flow and another in a region separated from the region 404a - 404f where the main current flows. Comparing these two measurements can provide a measurement of the contact resistance, including when the battery cell unit is under load.

[0167] The terminal coupling region further includes holes 408a - 408f configured to allow a fastener device to pass through in order to mechanically fix the terminal coupling region and the electronic board to the battery cell terminals.

[0168] In some embodiments, the terminal coupling region has an exposed conductive material region near the terminal attachment point, and the exposed conductive material region further includes vias that form conductive vertical connections between two or more conductive layers. In some embodiments, the number of vias in the electronic component can be as high as 1, 5, 10, 1000, or 10000, or different numbers. In some embodiments, some regions can have vias with a density of up to 1 / cm 2 、10 / cm 2 、100 / cm 2 、1000 / cm 2 or vias with different spatial densities.

[0169] This embodiment also shows connectors 410a - 410b, which are configured to allow connection to other electronic boards, one or more power supplies, electrical loads, inverter circuits (such as an h - bridge circuit or other circuits), or external devices.

[0170] Figure 11 Another exemplary embodiment of the electronic component is shown. The component has a single electronic board 500, which is adapted to span the geometric positions of a number of battery cell terminals (shown here as eight battery modules), each battery cell terminal having two series - connected battery monomer units, and a positive terminal of one battery cell being connected to the negative terminal of another battery cell and sharing a connection point to the board.

[0171] The electronic component has a fastener retention device 510, which is adapted to hold fasteners for attaching the board in place, even when the fasteners are not tightened to the battery module. This has several advantages, including facilitating the disassembly and reassembly of the electronic component to the module. The fasteners provide the additional function of substantially enclosing the exposed conductive material (such as any part related to the fastener assembly) and thus limiting the risk of any external contact with the exposed conductive material. In this embodiment, the retention device 510 is a plastic cage around a bolt, which is clamped in a slit on the board. In other embodiments, other tethered fastener arrangements can be used for a similar purpose.

[0172] As will be further explained below with reference to Figures 12 - 14 the depicted component further includes an optional recess, which is arranged to segment the terminal coupling region.

[0173] Figure 11An exemplary embodiment is an electronic component that includes one or more electronic boards adapted to span between multiple terminals of an energy storage unit, the terminals being arranged in a predetermined geometric alignment and configured as the main path for current to or from the energy storage unit. The electronic board includes a terminal coupling region and a circuit region, the terminal coupling region being configured as the main path for current between the electronic board and the unit terminals, and the circuit region including at least a first conductive layer and a second non-conductive layer. Additionally, a fastener holding cage is adapted to hold one or more fasteners in alignment with the terminal coupling region.

[0174] Figure 12 A close-up view of an exemplary electronic component, particularly the terminal coupling region, is shown. The terminal coupling region has holes that allow fasteners to pass through to connect the component to the terminals of at least one battery cell unit. In this embodiment, the fasteners, such as bolts, nuts, and / or any washers used, are conductive and capable of carrying current between the electronic component and one or more battery cell units. However, in different embodiments, the fasteners can be non-conductive, and the main current is carried by other means, such as contact of conductive regions between the board and the battery cell, or contact of other conductive materials between them.

[0175] As in the above embodiment, the electronic component has exposed metal regions near the holes to form low-resistance contacts with adjacent battery cell unit terminals, nuts, bolts, and / or washers.

[0176] The terminal coupling region includes conductive pads that are segmented by the arrangement of physical slits in all layers of the electronic component. However, in different embodiments, the slits can be applied to only some layers of the electronic component rather than all layers. The first type of slits is connected to the holes and extends diagonally outwards. These slits can provide additional mechanical flexibility when connecting to one or more terminals of one or more battery cell units that may or may not be well-aligned. Additionally, these slits can form two or more exposed metal regions that are electrically isolated from each other when not connected to the battery cell unit. One or more such regions can be used to allow the main current to flow between the electronic component and the connected battery cell unit. One or more other such regions can be used as measurement pads for voltage and / or temperature measurement. By separating the contact regions that experience the main current from the contact regions for measurement, more accurate measurements, such as battery cell voltage and temperature, can be made.

[0177] In some embodiments, the notch is defined by a slit arranged to create a narrow conductive trace in the first conductive layer. By this narrow or relatively narrow size, the narrow trace is deliberately weakened to define the fusible circuit described above. The fuse is ideally located between one or more connection points of the battery cell unit and one or more other connection points of one or more battery cell units, optional electronic components, power sources, and / or electrical loads. These deliberately weakened traces can be designed such that at particularly high currents, one or more layers of material melt or otherwise react, significantly or completely reducing the conductivity of the connection of the traces. This can allow the electronic assembly in this embodiment to integrate functions otherwise provided by fuse components, which can avoid associated component costs. The materials of some layers (such as non-conductive layers) can be selected to have a high melting point so that the molten conductive material can be prevented from discharging from the electronic board.

[0178] In some embodiments, the notch is arranged to reduce the thermal conductivity between the connection points of the electronic assembly to one or more battery cells and other areas of the electronic assembly. For example, this can reduce the thermal conductivity between the connection points of the battery cell unit and the electronic components connected to the electronic assembly, which can exhibit a certain level of heating during operation. As a result, this can reduce the thermal energy transferred to the connected battery cell unit, which can increase the lifespan of such a battery cell unit. This can also reduce the thermal energy transferred to one or more temperature sensors placed at or near the connection points of the battery cell unit, which in turn can allow the temperature sensors to measure a temperature that can be more similar to the temperature inside the battery cell unit.

[0179] Figure 12 An exemplary embodiment is an electronic assembly that includes one or more electronic boards adapted to span between multiple terminals of an energy storage unit, the terminals being arranged in a predetermined geometric alignment and configured as the main path of the current to or from the energy storage unit. The electronic board includes a terminal coupling region and a circuit region, the terminal coupling region being configured as the main path of the current between the electronic board and the unit terminals, and the circuit region including at least a first conductive layer and a second non-conductive layer. At least one of the terminal coupling regions includes a conductive section, a section configured as a measurement pad, and a section configured as the main current path, wherein the conductive section is defined by one or more notches or at least the first conductive layer having a depth.

[0180] In some embodiments, the notch is configured to define the above-described measurement of the mechanical bending characteristics. In some embodiments, the electronic board includes a heating component, and the notch is located between the heating component and the terminal coupling region to limit the transfer of thermal energy between the heating component and the terminal coupling region.

[0181] Figure 13An exemplary electronic circuit assembly for placement on a circuit board is shown. The assembly has a predetermined geometric alignment and / or combined thickness characteristics optimized for the arrangement of the connected battery cells. The circuit also has electronic components in the form of switch components S1 - S6 disposed in the main current paths of battery cells C1 - C3. The circuit also has fusible circuits F1 - F3. Each fusible circuit prevents a short circuit in the event of a failure or incorrect operation of one or more switch components. For example, if switch component S1 fails short and switch component S2 is closed, the short circuit seen by battery cell C1 will be prevented by fusible circuit F1. In this example, the fusible circuit is connected in the bypass path of battery cell C1.

[0182] Figure 14 An example electronic circuit for implementation on any of the described electronic assemblies having a predetermined geometric alignment and / or combined thickness characteristics is shown. The assembly has terminals that are electrically coupled to a junction between two energy storage units. Fusible circuit F1 is connected to a terminal between the junctions coupled between battery cells C1 and C2. In this example, only one fusible circuit is needed to prevent a short circuit in the event of a closed - circuit failure in any of the switch assemblies in the two battery cells. For example, if switch component S1 fails short and switch component S2 is closed, the short circuit seen by battery cell C1 will be prevented by fusible circuit F1. In a different case, if switch component S3 fails short and switch component S4 is closed, the short circuit seen by battery cell C2 will be prevented by fusible circuit F1. Such an electronic assembly can have the advantage of requiring fewer fusible circuits than an electronic assembly having one or more fusible circuits per battery cell, which can reduce component costs. The circuit can further have the advantage that the fusible circuits are not included in the current when all battery cells are connected, which can improve efficiency. The circuit can further have the advantage that when all battery cells are bypassed, the fusible circuits are not included in the current, which can avoid an increased resistance in the bypass path.

[0183] In some embodiments that can have one, two, or more battery cells firmly connected in series and switch components for selectively bypassing and reversibly disconnecting one or more battery cells, there is at least one fusible circuit for each battery cell. In some embodiments, the fusible circuit for each battery cell is located in the bypass path of the battery cell unit, which can have the advantage of reducing losses in the electronic assembly when the battery cells are connected in series. In other embodiments, the fusible battery cell circuit is located directly in series with the battery cell unit, which can have the advantage of reducing losses in the electronic assembly when bypassing the battery cell unit.

[0184] Figure 15A top view of an exemplary embodiment of an electronic component is shown, where a single electronic board is adapted to span across multiple battery cell terminals. Specifically, five battery monomer cells each have a positive connection point and a negative connection point to the electronic component. In this embodiment, the electronic component has a conductive terminal coupling region that has areas (shown as having a circular shape, but can be square or any other shape) intended to create a soldering connection to one or more terminals of the battery monomer cells. This can be achieved, for example, by capacitor discharge resistance welding, laser welding, or ultrasonic welding, and separate tab conductors can further be used as part of the connection.

[0185] In this exemplary embodiment, the terminal coupling region is defined by slits near the connection points. In this embodiment, these slits are straight lines on three sides of the connection that passes through all layers of the electronic component. However, different embodiments can implement the slits as curves or can be along any number of sides, for example, two sides, in whole or in part. These slits are used to focus any mechanical stress applied to the component due to movement and / or misalignment of the battery cells to the region of the board that lies between the edges of the slits. This region of the board serves as a hinge or otherwise provides additional mechanical flexibility when connected to the battery monomer cells.

[0186] Figure 15 An exemplary embodiment of is an electronic component that includes one or more electronic boards adapted to span across multiple terminals of an energy storage unit, the terminals being arranged in a predetermined geometric alignment and configured as the main path for current to or from the energy storage unit. The electronic board includes a terminal coupling region and a circuit region, the terminal coupling region being configured as the main path for current between the electronic board and the unit terminals, the circuit region including at least a first conductive layer and a second non-conductive layer. Further, at least one of the terminal coupling regions is defined by the arrangement of one or more cuts in one or more of the electronic boards so as to define an attachment region of the terminal coupling region to the circuit region of the board; and wherein the attachment region defines the mechanical bending characteristics and / or combined thickness characteristics of the board.

[0187] Figure 16Shows an example of an electronic circuit implemented on any electronic component having a predetermined geometric alignment and / or combined thickness characteristics, the circuit including an electronic component in the form of a switching component attached to four battery cells, each battery cell having a positive terminal and a negative terminal directly or via a circuit connection to the electronic component. The switching component is operable to selectively bypass and reversibly disconnect one or more energy storage units. For example, when switching components S1, S3, S5, and S7 are closed and all other switches are open, then switching components S1, S3, S5, and S7 are set in the main current path and battery cells C1 - C4 are electrically connected in series with each other and in series electrical connection with the shown circuit output terminals. If then switching component S1 is opened and switching component S2 is closed, then switching component S2 is set in the main current path, and battery cell C1 is selectively bypassed and reversibly disconnected from the series arrangement with the other battery cells and the output. Similarly, by opening and closing the respective switches, each of battery cells C2 - C4 can be selectively bypassed and reversibly disconnected. Multiple battery cells can be selectively disconnected from the arrangement simultaneously.

[0188] Figure 17 Shows a bottom isometric view of an exemplary embodiment of the bottom of an electronic component that has one or more cuts in one or more layers in the region where one or more battery cells are connected to the electronic component. These cuts can be applied to layers including relatively rigid layers. In the case where the relatively rigid layer has any cuts, this can allow the electronic component to have additional mechanical flexibility near the connection points with the battery cells. This can allow the electronic component to be connected to one of a plurality of battery cells using connection points that can move in a plane or are not well-aligned, without causing excessive stress in the electronic component or any optional electronic components or elements.

[0189] The additional mechanical flexibility can further enable the electronic component to better conform to the shape of the battery cell contacts to be connected, which can reduce the electrical contact resistance and improve the operating efficiency. It can also enable the electronic component to be shaped to the shape and profile of a battery module, including ridges or other raised portions of the battery module that can be raised compared to the plane of the battery cell connection points. The mechanical flexibility of the electronic board can further be used to increase the surface area of the electronic board between two fixed points by, for example, forming an approximate waveform (such as a square wave or a sine wave), which can be used to implement the integration of additional electronic components and / or increase heat dissipation. Additionally, the additional mechanical flexibility can also dampen vibrations, for example, between the connected battery cells and the electronic component.

[0190] This embodiment may have four or more layers, which are characterized in the following order from top to bottom: (1) flexible conductive, (2) flexible non-conductive, (3) flexible conductive, (4) rigid. In some embodiments, an additional flexible non-conductive layer may be present between the (3) flexible conductive layer and the (4) rigid layer. In some embodiments, an additional flexible non-conductive layer may be present on top of the (1) flexible conductive layer.

[0191] In some embodiments, one or more flexible conductive layers may include aluminum or copper. In some embodiments, one or more flexible non-conductive layers may include polyimide, Kapton tape, polyethylene terephthalate, or polyethylene naphthalate. In some embodiments, one or more rigid layers may include a glass-reinforced epoxy laminate or aluminum.

[0192] Figure 18 A bottom view of another exemplary embodiment of an electronic component having a cutout at a point of attachment to a battery cell is shown. The electronic component also has cutouts in one or more regions other than the battery cell connection points. These regions may be aligned with a plane where at least two battery modules are adjacent to each other. These cutouts may be applied to layers including a relatively rigid layer and may enable all remaining layers in the cutout region to be relatively flexible layers. In the case where the relatively rigid layer has one or more cutouts and these cutouts are aligned with a plane where two battery modules are adjacent, this may allow the electronic component to have additional mechanical flexibility to be able to connect to two battery modules that may have some misalignment in one or more directions without stress.

[0193] In some embodiments, the flexible layer is implemented with Kapton or polyimide tape and spans the component. The flexible layer is laminated to the relatively rigid layer of the electronic board to define a support region. The flexibility may enable the combination of all layers present at one or more locations to be defined by the above mechanical bending characteristics.

[0194] Figure 19 An exemplary embodiment of an electronic component having a six-layer electronic board laminate is shown, and the board also supports electronic components. The layers are characterized in the following order from top to bottom: (1) a flexible and thin non-conductive layer (“PI - polyimide - layer”); (2) a flexible and thin conductive layer; (3) a flexible and thin non-conductive layer (“PI layer”); (4) a support layer; (5) a flexible and thin conductive layer; and (6) a thin non-conductive layer (“solder mask layer”).

[0195] (1) The thin non-conductive layer may have the function of providing electrical isolation between (2) the thin conductive layer and the outside world. (2) The thin conductive layer may have the function of carrying current within the electronic component. (3) The thin non-conductive layer may have the function of providing electrical isolation between (2) the thin conductive layer and the outside world, especially in areas without (4) the support layer. (4) The support layer may be conductive or non-conductive or have a mixture of conductive and non-conductive regions, and may have the function of providing mechanical rigidity to the electronic component. When the support layer is conductive, the support layer may have the function of carrying current or improving heat transfer between regions from (2) the thin conductive layer, (5) the conductive layer, and / or the outside world or between regions of (2) the thin conductive layer, (5) the conductive layer, and / or the outside world. (5) The conductive layer may have the function of carrying current within the electronic component. (6) The non-conductive layer may have the function of providing electrical isolation between (5) the conductive layer and the environment.

[0196] In different embodiments, there may be two or more support layers. In other embodiments, there may be three, four or more conductive layers, which may or may not be thin and / or flexible. In some embodiments, there may also be layers of adhesive materials (such as glue, resin and / or reinforcing materials such as fiberglass cloth), which may increase the adhesion between different layers.

[0197] From the above, it will be understood that while specific embodiments have been described herein for purposes of illustration, various modifications may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not limited except as by the appended claims and the elements recited therein. Additionally, while certain aspects of the invention are presented below in certain claim forms, the inventors contemplate various aspects of the invention in any available claim form.

Claims

1. An electronic component, comprising: one or more electronic boards, the one or more electronic boards comprising: a terminal coupling region, the terminal coupling region being arranged in a predetermined geometric alignment and adapted to connect to the terminals of an energy storage unit; at least one circuit region, the at least one circuit region comprising at least a first conductive layer and a second non-conductive layer, and two or more electronic components, the two or more electronic components being disposed on the conductive layer of the circuit region and connected to the conductive layer of the circuit region; wherein the at least one circuit region defines a main path for the current between two terminal coupling regions for defining at least two serially connected energy storage units; wherein at least one of the electronic components is a switching component disposed in the main current path between two serially connected energy storage units and configured to reversibly disconnect the serial connection; wherein at least one of the electronic components is a switching component disposed in the main current path and configured to selectively bypass an energy storage unit from the serial connection of two serially connected energy storage units; wherein at least a portion of the terminal coupling region and / or at least a portion of the circuit region is characterized by: a mechanical bending property and / or a combined thickness property, the mechanical bending property being configured to allow at least some displacement from the predetermined geometric alignment.

2. The electronic component according to claim 1, wherein, the terminal coupling region of the electronic board comprises at least three terminal coupling regions, the at least three terminal coupling regions being adapted to span between the cell terminals of at least three energy storage units in the geometric alignment.

3. The electronic component according to claim 2, wherein, at least one of the two or more electronic components comprises a DC / DC conversion component.

4. The electronic component according to claim 3, wherein, at least one of the terminal coupling regions is electrically coupled to one or more joints between two serially connected energy storage units.

5. The electronic component according to claim 4, wherein, at least one of the plurality of energy storage units comprises a charge capacity of at least 20 ampere-hours.

6. The electronic component according to claim 5, wherein, at least one of the electronic components comprises an electronic circuit board or an integrated electronic circuit element with discrete components mounted thereon.

7. The electronic component according to claim 6, wherein, at least one of the terminal coupling regions and / or at least one of the circuit regions further comprises an elastically deformable material layer.

8. The electronic component according to claim 7, wherein, at least one of the terminal coupling regions and / or at least one of the circuit regions further comprises at least two conductive layers separated by at least one non-conductive layer, and one or more vias extending between the at least two conductive layers.

9. The electronic component according to claim 8, wherein, at least one of the circuit regions further comprises a layer continuous with at least one of the terminal coupling regions.

10. The electronic component according to claim 9, wherein, At least one of the circuit region and / or the terminal coupling region further includes one or more support layers, thereby changing the mechanical bending characteristics and / or the combined thickness characteristics in the circuit region adjacent to the one or more support layers.

11. The electronic component according to claim 10, wherein, the one or more support layers are continuous with at least one of the circuit region and / or the terminal coupling region of the electronic board.

12. The electronic component according to claim 11, wherein, the terminal coupling region is configured to be coupled to the terminals of the storage unit by fasteners, fusion or welding.

13. The electronic component according to claim 12, wherein, the terminal coupling region further includes a temperature sensor configured to measure the temperature of the component near the terminal.

14. The electronic component according to claim 13, wherein, the terminal coupling region further includes a plurality of conductive segments, wherein one conductive segment is configured to connect a voltage sensor configured to measure the voltage at the terminal coupling region, and the other conductive segments form part of the main current path.

15. The electronic component according to claim 14, wherein, the support layer includes one or more slits, ridges, holes, and / or depressions disposed between at least some of the plurality of conductive segments in the terminal coupling region.

16. The electronic component according to claim 15, wherein, one or more layers include one or more slits, ridges, holes, and / or depressions, and the one or more slits, ridges, holes, and / or depressions are arranged to at least partially abut the terminal coupling region.

17. The electronic component according to claim 16, wherein, the terminal region includes conductive pads segmented by a plurality of non-conductive regions, and at least some of the non-conductive regions include one or more slits, ridges, holes, and / or depressions.

18. The electronic component according to claim 17, wherein, the main current path further includes one or more fusible circuits arranged to couple at least one of the terminal coupling regions to at least one of the circuit region and / or other terminal coupling regions.

19. The electronic component according to claim 18, wherein, the one or more fusible circuits include printed conductive traces nominally configured to break with a geometric constraint above 1000 amperes.

20. The electronic component according to claim 19, wherein, the electronic board includes polyimide, polyimide film (Kapton), polyethylene terephthalate, or polyethylene naphthalate.

21. The electronic component according to claim 20, wherein, the electronic component further includes one or more tethered fastener structures that hold bolts in place when not in a fastened state relative to the electronic component and / or one or more energy storage units.

22. The electronic component according to claim 21, wherein, the bending characteristics are defined as: the electronic component has a flexural modulus of less than 12 GPa at room temperature; The material in one or more non-conductive layers has a flexural modulus of less than 10 GPa at room temperature; The electronic component has a flexural strength of less than 300 MPa at room temperature; The material in one or more non-conductive layers has a flexural strength of less than 300 MPa at room temperature.

23. The electronic component according to claim 21, wherein, The bending characteristics are defined as: The electronic component has a flexural modulus of 6 GPa at room temperature; The material in one or more non-conductive layers has a flexural modulus of 3 GPa at room temperature; The electronic component has a flexural strength of 150 MPa at room temperature; The material in one or more non-conductive layers has a flexural strength of less than 150 MPa at room temperature.

24. The electronic component according to claim 22 or 23, wherein, The combined thickness characteristics are defined by: One or more support layers have a thickness of 1 mm; One or more thin non-conductive layers and one or more conductive layers have a combined thickness of up to 0.4 mm; The first non-conductive layer has a thickness of up to 0.08 mm.

25. The electronic component according to claim 22 or 23, wherein, The combined thickness characteristics are defined by: One or more support layers are greater than 0.4 mm; One or more thin non-conductive layers and one or more conductive layers have a combined thickness of up to 0.2 mm; The first non-conductive layer has a thickness of up to 0.02 mm.

26. An electronic component, comprising: One or more electronic boards, the one or more electronic boards being adapted to be connected to an energy storage unit, the boards collectively comprising: A main path for charging and discharging current between the energy storage units, the main path comprising: A terminal coupling region, the terminal coupling region being arranged in a predetermined geometric alignment and configured to connect the one or more electronic boards to the terminals of the energy storage unit aligned in the geometric alignment; and At least one circuit region, the at least one circuit region comprising at least a first conductive layer and a second non-conductive layer; Two or more electronic components, the two or more electronic components being disposed on the conductive layer of the at least one circuit region and connected to the conductive layer of the at least one circuit region; wherein the two or more electronic components include a first switch and a second switch, the first switch being configured to reversibly disconnect the main current path of the series connection between the first energy storage unit and the second energy storage unit; the second switch being configured to selectively bypass the second energy storage unit to connect the first energy storage unit in series with the third energy storage unit, and wherein at least a part of the terminal coupling region and / or at least a part of the circuit region are characterized by: mechanical bending characteristics and / or combined thickness characteristics to allow at least some displacement from the predetermined geometric alignment.

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