Impedance anomaly detection method, circuit and socket device

Abstract

The application provides an impedance anomaly detection method, circuit and socket device, and relates to the technical field of sockets. The impedance detection method comprises the following steps: receiving a current value, wherein the current value represents a current flowing through the socket; receiving a first temperature value, wherein the first temperature value represents the temperature of the socket; receiving at least one second temperature value, wherein the second temperature value represents the temperature of the socket at a first preset time interval from the step of receiving the first temperature value; and issuing an impedance anomaly signal according to the first temperature value, the second temperature value and the current value. The application also provides an impedance anomaly detection circuit and a socket device. The impedance anomaly detection method, circuit and socket device provided by the application can improve the technical problem of delayed detection in the related art, which may cause safety accidents.

Description

Technical Field

[0001] The present application relates to the field of socket technology, and in particular to an impedance anomaly detection method, circuit, and socket device. Background Art

[0002] During use, switches and sockets are prone to problems such as improperly inserted pins, improperly connected terminal wires, surface oxidation of the socket, and insufficient clamping force. This increases the contact resistance between the pins and sockets, significantly increasing the heat generated at the same operating current compared to normal operation. This can cause a sharp increase in heat generation even when the device is used within the rated operating current. In severe cases, this can even lead to safety accidents such as softening of the terminals, melting of the device casing, and smoke and fire. Existing technical solutions use the MCU's built-in temperature sensor to set an overtemperature protection point to prevent the device from overheating.

[0003] Since the MCU is usually far away from the heat source and cannot sense the temperature increase and identify abnormal conditions in time, when the over-temperature protection is triggered, part of the device may have exceeded the temperature, causing irreversible damage to the internal components of the device and leading to safety accidents. Summary of the Invention

[0004] The purpose of this application includes providing an impedance anomaly detection method, circuit and socket device, which can improve the technical problem of safety accidents caused by untimely detection in related technologies.

[0005] An embodiment of the present application provides an impedance anomaly detection method, which is applied to a socket device, wherein the socket device includes a socket for receiving a plug. The impedance detection method includes:

[0006] receiving a current value, wherein the current value represents a current flowing through the socket;

[0007] receiving a first temperature value, wherein the first temperature value represents a temperature of the socket;

[0008] receiving at least one second temperature value, wherein the second temperature value represents the temperature of the socket at a first preset time interval from the step of receiving the first temperature value;

[0009] An impedance abnormality signal is issued according to the first temperature value, the second temperature value, and the current value.

[0010] The present application provides a socket device, including an impedance anomaly detection circuit. The impedance anomaly detection circuit includes: a control module, a current detection module, a temperature detection module, a temperature sensor, a pin, and a socket; one end of the pin is electrically connected to the control module, and the other end is used to electrically connect to the socket; one end of the socket is electrically connected to the control module, and the other end is used to electrically connect to the plug; one end of the current detection module is electrically connected to the control module, and the other end is electrically connected to the pin, and is used to detect the current flowing through the socket device; the temperature detection module is electrically connected to the control module, and the temperature sensor is electrically connected to the temperature detection module; the temperature sensor is in contact with the socket and is used to detect the temperature of the socket; the control module is used to perform an impedance anomaly detection method. The impedance detection method includes: receiving a current value, wherein the current value represents the current flowing through the socket; receiving a first temperature value, wherein the first temperature value represents the temperature of the socket; receiving at least one second temperature value, wherein the second temperature value represents the temperature of the socket after a first preset time interval from the step of receiving the first temperature value; and issuing an impedance anomaly signal based on the first temperature value, the second temperature value, and the current value.

[0011] The present application also provides an impedance anomaly detection circuit and a socket device, both of which can execute the above-mentioned impedance anomaly detection method.

[0012] The advantages of the impedance anomaly detection method, circuit, and socket device provided by this application over the prior art include:

[0013] When the socket device executes the impedance anomaly detection method to perform impedance anomaly detection, the temperature of the socket can be directly detected, and a comprehensive judgment can be made based on the current value, the first temperature value and the second temperature value at an interval of a first preset time. In this way, when the impedance between the contact surface of the socket and the plug is abnormal due to the poor connection between the plug and the socket, the plug is not properly inserted or the surface is oxidized, the socket is loose or the socket surface is oxidized, etc., an impedance anomaly signal can be issued in time to prompt the user, which can facilitate the user to take measures in advance to prevent safety accidents such as softening of the socket device terminals, melting of the device casing, or smoke and fire, and can improve the technical problem of safety accidents caused by untimely detection in the existing technology.

[0014] Socket equipment BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 An application environment schematic diagram suitable for the embodiments of the present application is shown.

[0017] Figure 2 Another application environment schematic diagram suitable for the embodiments of the present application is shown.

[0018] Figure 3 A schematic diagram of the impedance anomaly detection circuit provided in the embodiments of the present application is shown.

[0019] Figure 4 A structural schematic diagram of a part of the socket device provided in some embodiments of the present application is shown.

[0020] Figure 5 A structural schematic diagram of a part of the socket device provided in some other embodiments of the present application is shown.

[0021] Figure 6 A structural schematic diagram of a part of the socket device provided in some other embodiments of the present application is shown.

[0022] Figure 7 A structural schematic diagram of a part of the socket device provided in some other embodiments of the present application is shown.

[0023] Figure 8 A flow chart of the impedance anomaly detection method provided in the embodiments of the present application is shown.

[0024] Figure 9 A flow chart of step S4 in the impedance anomaly detection method provided in some embodiments of the present application is shown.

[0025] Figure 10 A flow chart of step S412 in the impedance anomaly detection method provided in the embodiments of the present application is shown.

[0026] Figure 11 A flow chart of step S4 in the impedance anomaly detection method provided in some other embodiments of the present application is shown.

[0027] Figure 12 A flow chart of step S422 in the impedance anomaly detection method provided in the embodiments of the present application is shown.

[0028] Icon: 1 - socket device; 2 - socket; 3 - plug; 4 - plug sleeve; 11 - first plug-in part; 12 - second plug-in part; 20 - PCB board; 30 - impedance anomaly detection circuit; 110 - control module; 120 - current detection module; 130 - temperature detection module; 140 - temperature sensor; 150 - plug pin; 160 - heat conduction piece; 10 - smart home system; 100 - gateway device; 200 - home device; 300 - server; 400 - terminal device; 500 - router. DETAILED DESCRIPTION

[0029] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0031] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0032] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, only for the convenience of describing the present application and simplifying the description, and it is not intended to indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application.

[0033] In addition, if the terms "first", "second" and the like appear, they are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0034] It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.

[0035] The following will introduce an application environment related to the present application.

[0036] Please refer to Figure 1 ,Figure 1 An application environment suitable for the embodiments of the present application is shown in the figure. In the figure, Figure 1 A smart home system 10 is provided, which includes a gateway device 100, a home device 200 connected with the gateway device 100, and a server 300 connected with the gateway device 100. The number of gateway devices 100 can be at least one, and the number of home devices 200 can be at least one. In addition, when the number of gateway devices 100 is more than one, the different gateway devices 100 can also be connected in communication.

[0037] In the embodiments of the present application, the gateway device 100 can be a smart gateway for smart home control, which can realize functions such as collection of system information, information input, information output, centralized control, remote control, and linkage control. The gateway device can be responsible for specific security alarm, home appliance control, and power consumption information collection. The gateway device 100 can also interact with smart interaction terminals and other products through wireless means. The gateway device 100 also has wireless routing function, excellent wireless performance, network security, and coverage area.

[0038] In the embodiments of the present application, the home device 200 can include various smart home appliances, sensing devices, and detection devices arranged in indoor spaces, such as smart televisions, smart refrigerators, smart air conditioners, temperature and humidity sensors, pressure sensors, smoke sensors, human body sensors, door and window sensors, smart switches, sockets, electric lamps, infrared emitting devices, camera devices, and the like. The home device 200 connected with the gateway device 100 can interact with the gateway device 100 in information and instructions. The gateway device 100 and the home device 200 can be connected through communication modes such as Bluetooth, WiFi (Wireless-Fidelity), ZigBee (ZigBee Technology), and the like. Of course, the connection mode of the gateway device 100 and the home device 200 is not limited in the embodiments of the present application.

[0039] In the embodiments of the present application, the server 300 can be a local server, a cloud server, or the like, and the specific type of server is not limited in the embodiments of the present application. The server 300 connected with the gateway device 100 can interact with the gateway device 100 in information through wireless means. The gateway devices 100 arranged in different indoor spaces can be connected in communication with the same server 300 through a network to interact in information between the server 300 and the gateway devices 100.

[0040] Further, the smart home system 10 can further include a terminal device 400. The terminal device 400 can include a personal computer (PC), a tablet computer, a smart phone, a personal digital assistant (PDA), and the like, which are not limited herein. The terminal device 400 can interact with the server 300 through wireless communication such as 2G / 3G / 4G / 5G / WiFi. Of course, the connection between the terminal device 400 and the server 300 is not limited in the embodiments. In some embodiments, the terminal device 400 can also be used to interact with the user, so that the user can communicate with the gateway device 100 through the terminal device 400 based on the router 500. In addition, the user can add an account information to the gateway device 100 and the terminal device 400 at the same time, so as to synchronize the information of the gateway device 100 and the terminal device 400 through the account information.

[0041] In some embodiments, the user can set different trigger scenes or automation links through an application (APP) of the terminal device 400. As a way, the terminal device 400 can upload the scene configuration information or the automation scheme to the server 300, so that when the trigger condition of the trigger scene or automation is reached, the server 300 can find the device corresponding to the execution action in the scene configuration information or the automation scheme according to the stored scene configuration information or automation scheme, so as to notify the device to perform the execution action to meet the execution result of the trigger scene or automation. As another way, the server 300 can also send the scene configuration information or the automation scheme to the gateway device 100, and the gateway device 100 can find the device corresponding to the execution action in the scene configuration information or the automation scheme according to the stored scene configuration information or automation scheme. At the same time, the gateway device 100 can feed back the execution of the device to the server 300.

[0042] For example, referring to Figure 2 , the automation scheme set by the user through the APP of the terminal device 400 is "open the light automatically when the door and window are opened", the trigger condition of the automation scheme is "the door and window are opened", and the execution action is "the smart switch controls the bulb to turn on". At this time, based on the automation scheme, the trigger device is the door and window sensor 200a, and the execution device is the smart switch 200b connected with the bulb 200c. The automation scheme can be stored in the gateway device 100 or the server 300, and the path of executing the automation link can be through the local area network or the wide area network.

[0043] If the automation is performed locally at the gateway device 100 through the local network path, the door and window sensor 200a senses that the door and window is opened, and reports the information event of the door and window being opened to the gateway device 100. After receiving the information event, the gateway device 100 can find the device corresponding to the execution action in the automation scheme according to the stored automation scheme, and in this example, the smart switch 200b, and notify the smart switch 200b to control the light to be turned on, thereby realizing the automation linkage of the door and window being opened and the light being turned on automatically.

[0044] If the automation is performed at the server 300 through the wide area network path, the door and window sensor 200a senses that the door and window is opened, and reports the information event of the door and window being opened to the gateway device 100. After receiving the event, the gateway device 100 reports the event to the server 300. According to the stored automation scheme, the server 300 finds the device corresponding to the execution action in the automation scheme, and in this example, the smart switch 200b, and notifies the smart switch 200b to control the light to be turned on through the gateway device 100, thereby realizing the automation linkage of the door and window being opened and the light being turned on automatically.

[0045] Further, after the light is turned on, the execution result of the light being turned on successfully can be fed back to the gateway device 100. After receiving the information, the gateway device 100 can report the current time, the identifier (ID) of the automation scheme, and the execution result of the automation scheme to the server 300 for storage. The ID can be a symbol uniquely identifying the automation scheme, and can be a number, a character, or the like, which is not limited herein.

[0046] The embodiments in the present application will be described in detail below with reference to the accompanying drawings.

[0047] In the embodiments of the present application, a socket device 1 is provided, which can be plugged on a socket 2 to facilitate the electrical connection of an electrical appliance. It should be noted that the electrical appliance can be an air conditioner, a charger, or a fan, etc. having a plug 3. The socket device 1 is configured to be plugged with the plug 3 to realize the electrical connection of the electrical appliance; and the socket device 1 is also configured to be plugged on the socket 2 to realize the power-on of the socket device 1, and supply power to the plug 3.

[0048] In the prior art, if the plug 3 and the socket 4 are not connected well, the plug 3 is not inserted well, or the surface of the plug 3 or the socket 4 is oxidized, the socket 4 is loose, or the surface of the socket 4 is oxidized, etc., the impedance between the contact surfaces of the socket 4 and the plug 3 will be abnormal, which may further cause the terminal of the socket device 1 to soften, the shell of the device to melt or smoke, or a fire accident, etc. In the prior art, the over-temperature protection point is set by the MCU built-in temperature sensor 140 to avoid over-temperature of the device. Since the MCU is usually far away from the heat source and cannot timely sense the temperature rise to identify the abnormal condition, when the over-temperature protection is triggered, the part of the device may have been over-temperature, which has caused irreversible damage to the internal devices of the device, leading to a safety accident.

[0049] The socket device 1 provided in the embodiments of the present application can improve the above technical problems.

[0050] Among them, please refer to Figure 3 The socket device 1 can further include an impedance abnormality detection circuit 30, which can detect whether the impedance of the contact surface between the socket 4 and the plug 3 is abnormal, and send an impedance abnormality signal to prompt the user to take preventive measures in time in the case of impedance abnormality of the contact surface between the socket 4 and the plug 3, so as to prevent the terminal of the socket device 1 from softening, the shell of the device from melting or smoking, or a fire accident, etc.

[0051] The impedance abnormality detection circuit 30 includes a control module 110, a current detection module 120, a temperature detection module 130, a temperature sensor 140, a plug pin 150, and the socket 4. The plug pin 150 is configured to be electrically connected with the socket 2 to realize power-on of the socket device 1 and supply power to the plug 3. The socket 4 is configured to be plugged by the plug 3 to realize electrical connection between the plug 3 and the socket device 1, so as to realize power supply from the socket device 1 to the plug 3.

[0052] One end of the plug pin 150 is electrically connected with the control module 110, and the other end is configured to be electrically connected with the socket 2. One end of the socket 4 is electrically connected with the control module 110, and the other end is configured to be plugged by the plug 3. One end of the current detection module 120 is electrically connected with the control module 110, and the other end is electrically connected with the plug pin 150, and the current detection module 120 is configured to detect the current flowing from the plug pin 150 to the control module 110, in other words, the current detection module 120 is configured to detect the current flowing through the socket device 1. The temperature detection module 130 is electrically connected with the control module 110, the temperature sensor 140 is electrically connected with the temperature detection module 130, and the temperature sensor 140 is in contact with the socket 4, in other words, the temperature sensor 140 is configured to detect the temperature of the socket 4. After the temperature sensor 140 detects the temperature of the socket 4, the temperature value detected by the temperature sensor 140 is sent to the control module 110 by the temperature detection module 130.

[0053] It should be noted that please refer to Figure 4 , Figure 5 , Figure 6 and Figure 7 , the control module 110 can include a PCB board 20, the plug sleeve 4 can include a first plug-in part 11 and a second plug-in part 12. The first plug-in part 11 and the second plug-in part 12 are arranged at intervals, and the first plug-in part 11 and the second plug-in part 12 are both electrically connected with the PCB board 20. In the case of electrical connection between the plug 3 and the plug sleeve 4, the terminal on the plug 3 is plugged between the first plug-in part 11 and the second plug-in part 12.

[0054] In order to facilitate the temperature sensor 140 to detect the temperature value of the plug sleeve 4, the temperature sensor 140 can be arranged as follows: for example, the temperature sensor 140 is arranged outside the first plug-in part 11, or the temperature sensor 140 is arranged outside the second plug-in part 12; in other words, the detection end of the temperature sensor 140 is in contact with the outside of the first plug-in part 11, or the detection end of the temperature sensor 140 is in contact with the outside of the second plug-in part 12, as shown in Figure 4 and Figure 5 . For another example, the temperature sensor 140 is arranged on the PCB board 20 and located between the first plug-in part 11 and the second plug-in part 12; in other words, the temperature sensor 140 is in contact with the end of the first plug-in part 11 connected to the PCB board 20, and is also in contact with the end of the second plug-in part 12 connected to the PCB board 20, as shown in Figure 6 . For another example, a heat-conducting member 160 can also be arranged on the PCB board 20, the temperature sensor 140 is arranged on the PCB board 20 and in contact with the heat-conducting member 160; at the same time, the heat-conducting member 160 is in contact with the first plug-in part 11 or the second plug-in part 12; in the case of arranging the heat-conducting member 160, the heat-conducting member 160 can transmit the heat on the first plug-in part 11 or the second plug-in part 12 to the temperature sensor 140, and the temperature sensor 140 can detect the temperature of the first plug-in part 11 or the second plug-in part 12 by detecting the temperature of the heat-conducting member 160, that is, the temperature of the plug sleeve 4, as shown in Figure 7 .

[0055] Optionally, in order to enable the temperature sensor 140 to respond quickly and improve the detection accuracy of the temperature sensor 140, a heat-conducting material can be filled between the temperature sensor 140 and the plug sleeve 4, which includes but is not limited to heat-conducting gel, heat-conducting gasket, heat-conducting silicone grease, etc. In addition, the temperature sensor 140 can adopt NTC, digital temperature sensor 140, infrared temperature sensor 140, thermal resistance, thermocouple, etc.

[0056] It should be noted that, when the temperature sensor 140 contacts the outside of the first plug-in portion 11, the temperature sensor 140 can be protruded and arranged on the PCB board 20, and the detection end of the temperature sensor 140 contacts the middle position of the first plug-in portion 11, such as Figure 4 Alternatively, the temperature sensor 140 may also be provided on the PCB board 20, and the temperature sensor 140 contacts the end portion of the first plug portion 11 connected to the PCB board 20, such as Figure 5 .

[0057] The control module 110 is configured to receive the current value detected and issued by the current detection module 120, and is also configured to receive the temperature value issued by the temperature detection module 130. The control module 110 is further configured to determine whether there is an abnormality in the impedance of the contact surface between the socket 4 and the plug 3 based on the received current and temperature values, and is configured to issue an impedance abnormality signal if an impedance abnormality is detected.

[0058] The control module 110 can be an integrated circuit chip with signal processing capabilities. The control module 110 can be a general-purpose processor, including a central processing unit (CPU), a single-chip microcomputer, a microcontroller unit (MCU), a complex programmable logic device (CPLD), a field programmable gate array (FPGA), an application-specific integrated circuit (ASIC), an embedded ARM, and the like. The control module 110 can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present application.

[0059] Optionally, in some embodiments of the present application, the number of pins 150 and sockets 4 is two. Both pins 150 are configured to be electrically connected to the socket 2; one of the pins 150 is configured to be electrically connected to the live wire, and the other pin 150 is configured to be electrically connected to the neutral wire. Both sockets 4 are configured to be electrically connected to the plug 3, and the two sockets 4 are electrically connected to the two pins 150 respectively. In other words, one socket 4 is electrically connected to one of the pins 150, and the other socket 4 is electrically connected to the other pin 150. In addition, the current detection module 120 is electrically connected to the pin 150 connected to the neutral wire. In addition, optionally, the number of temperature sensors 140 is two, and the two temperature sensors 140 are respectively in contact with the two sockets 4 to detect the temperatures of the two sockets 4 respectively, thereby ensuring comprehensive detection.

[0060] In addition, in some embodiments of the present application, in order to provide protection to the current detection module 120, a first resistor is arranged on the pin 150, and the first resistor is arranged in parallel with the current detection module 120. Wherein, the first resistor is denoted as R0.

[0061] It should be noted that, in Figure 3 , R1 and R2 respectively represent the equivalent contact resistance between the pin 150 and the socket 2, and R3 and R4 respectively represent the equivalent contact resistance between the socket 4 and the plug 3. N represents the neutral line end, and L represents the live line end. The impedance abnormality detection resistance can be regarded as the impedance abnormality detection circuit 30 detecting whether the resistance of R3 and R4 is abnormal in the case of impedance abnormality detection.

[0062] Optionally, in order to improve the technical problem of not timely detection in the prior art causing safety accidents, the present application also provides an impedance abnormality detection method, which can be executed by the above-mentioned impedance abnormality detection circuit 30 and the socket device 1. Please refer to Figure 8 , the impedance abnormality detection method comprises:

[0063] Step S1, receiving a current value.

[0064] Wherein, the current value is a value obtained by the current detection module 120 detecting the current flowing through the socket device 1, and in the case that the current detection module 120 detects the current value, the current detection module 120 sends the current value to the control module 110, so that the control module 110 can receive the current value.

[0065] Step S2, receiving a first temperature value.

[0066] Wherein, the first temperature value represents the temperature of the socket 4. The first temperature value is detected by the temperature sensor 140 and sent by the temperature detection module 130. In the case that the temperature detection module 130 sends the first temperature value, the first temperature value is received by the control module 110.

[0067] Step S3, receiving at least one second temperature value.

[0068] Wherein, the second temperature value represents the temperature of the socket 4 at a first preset time interval from the step of receiving the first temperature value; in other words, after the temperature sensor 140 detects the first temperature value, the temperature sensor 140 continues to detect the temperature value of the socket 4 at a first preset time interval, and obtains the second temperature value.

[0069] Step S4, sending an impedance abnormality signal according to the first temperature value, the second temperature value and the current value.

[0070] It should be noted that in the case that the control module 110 issues an impedance abnormality signal, the control module 110 can directly control the socket device 10 to perform a protection action and prompt the user according to the impedance abnormality signal; or the control module 110 can also send the impedance abnormality signal to the gateway device 100, so that the gateway device 100 can be automatically executed locally, in other words, in the case that the gateway device 100 receives the impedance abnormality signal, the corresponding device performing the action in the automatic scheme can be found according to the stored automatic scheme, so as to control the corresponding device to perform the protection action; or in the case that the control module 110 sends the impedance abnormality signal to the gateway device 100, the gateway device 100 reports the event to the server 300 when receiving the event, and the server 300 finds the corresponding device according to the stored automatic scheme and notifies the gateway device 100 to control the corresponding device to perform the protection action.

[0071] It should be noted that the protection action that can be performed includes but is not limited to disconnecting the relay, sending a signal to the downstream device to close or reduce power, controlling the air conditioner in the room to reduce the environmental temperature, etc.

[0072] Of course, in the case that the control module 110 sends the impedance abnormality signal to the gateway device 100, the gateway device 100 reports the event to the server 300, and the server 300 can report the event to the user's terminal device 400 to perform user prompting. User prompting includes but is not limited to indicator light prompting, alarm sound prompting by a loudspeaker or buzzer, prompting the user through a smart speaker or a mobile phone terminal device, etc.

[0073] It should be noted that the protection action and the user prompting can adopt one or more of the above, and the execution action can be performed simultaneously or in sequence.

[0074] As described above, in the case that the control module 110 receives the current value, the first temperature value and the second temperature value, the control module 110 can determine whether the impedance is abnormal according to the current value, the first temperature value and the second temperature value. The first temperature value and the second temperature value detected by the temperature sensor 140 can effectively reflect the temperature of the plug sleeve 4, so that the detection of impedance abnormality can be quickly completed when the temperature of the plug sleeve 4 changes, and the detection of impedance abnormality can be timely completed; and the current value can be comprehensively judged to improve the accuracy of judging whether the impedance is abnormal, so that the technical problem of not timely detection in the prior art causing safety accidents can be improved.

[0075] Optionally, please refer to Figure 9 In some embodiments of the present application, step S4 can include:

[0076] Step S411: calculating a first temperature rising speed value according to the first temperature value and the second temperature value.

[0077] The first temperature rising speed value represents a temperature rising speed of the plug sleeve 4. It should be noted that the first temperature rising speed value can be calculated by dividing the difference between the second temperature value and the first temperature value by the first preset time, in other words, the first temperature rising speed value represents the temperature rising speed in the first preset time.

[0078] Optionally, the formula for calculating the first temperature rising speed value in step S411 is as follows:

[0079] W=(W2-W1) / t0;

[0080] In the above formula, W represents the first temperature rising speed value; W1 represents the first temperature value; W2 represents the second temperature value; and t0 represents the first preset time.

[0081] In addition, in some other embodiments of the present application, if the first preset time is the unit time for calculating the temperature rising speed, in this case, the formula for calculating the first temperature rising speed value in step S411 can also be as follows:

[0082] W=W2-W1

[0083] In the above formula, W represents the first temperature rising speed value; W1 represents the first temperature value; and W2 represents the second temperature value.

[0084] As described above, the first temperature rising speed value represents the temperature rising speed in the first preset time interval, and the difference between the first temperature value and the second temperature value can be used to represent the temperature rising speed of the position where the plug sleeve 4 and the plug 3 cooperate with each other. Of course, it should be understood that in other embodiments of the present application, the temperature rising amount of the plug sleeve 4 per unit time in the first preset time interval can also be used as the first temperature rising speed value.

[0085] Step S412: issuing an impedance abnormality signal according to the current value and the first temperature rising speed value.

[0086] It should be noted that the temperature rising speed of the plug sleeve 4 is used to determine whether the contact surface between the plug sleeve 4 and the plug 3 has impedance abnormality, and the current value is also used for comprehensive determination, which can improve the accuracy of the impedance abnormality detection method.

[0087] Optionally, referring to Figure 10 , step S412 can include:

[0088] Step S4121: obtaining a preset temperature rising speed range matched with the current value.

[0089] It should be noted that the preset temperature rise speed range matched with the current value can represent that, in the case that the cooperation between the plug sleeve 4 and the plug 3 is normal, the allowable range of the temperature rise speed of the plug sleeve 4 corresponding to the current flowing through the plug sleeve 4, and in the case that the temperature rise speed of the plug sleeve 4 is within the range, it indicates that the impedance of the contact surface between the plug sleeve 4 and the plug 3 is in a normal state. The cooperation between the plug sleeve 4 and the plug 3 in a normal state can include the following cases: for example, the plug sleeve 4 and the plug 3 are well cooperated, and there is no surface oxidation on the plug sleeve 4 and the plug 3, and there is also no relaxation of the plug sleeve 4.

[0090] The preset temperature rise speed range can be obtained by comparing with the temperature rise curve of the same current in the normal working state, or can be obtained by machine learning algorithm to collect historical temperature rise data of the user to learn the user habits as the basis for abnormal prediction and judgment.

[0091] Step S4122, comparing the preset temperature rise speed range with the first temperature rise speed value.

[0092] In other words, step S4122 can also be regarded as judging whether the first temperature rise speed value is within the preset temperature rise speed range.

[0093] Step S4123, if the first temperature rise speed value is outside the preset temperature rise speed range, an impedance abnormality signal is sent out.

[0094] In the case that the first temperature rise speed value is outside the preset temperature rise speed range, it indicates that the equivalent contact resistance of the contact surface between the plug sleeve 4 and the plug 3 is large, so that the temperature rise speed of the position where the plug sleeve 4 contacts the plug 3 is too fast, which can easily cause the terminal of the socket device 1 to soften, the device shell to melt or smoke, and fire accidents, etc. Therefore, the control module 110 sends out an impedance abnormality signal to prompt the user, so that the user can take timely measures to prevent the terminal of the socket device 1 from softening, the device shell from melting or smoking, and fire accidents, etc.

[0095] The above-described impedance abnormality detection method can compare the preset temperature rise speed range matched with the current value with the first temperature rise speed value to judge whether there is an impedance abnormality; in other words, the temperature rise speed of the contact surface between the plug sleeve 4 and the plug 3 is judged to determine whether the impedance is abnormal, which can ensure the accuracy of the impedance abnormality detection, and also can timely and efficiently prompt the user to take measures, thereby improving the technical problem of not timely detection in the prior art causing safety accidents.

[0096] It should be noted that the first temperature rising speed value represents the speed of temperature rising of the plug sleeve 4 in the first preset time, and the temperature rising speed of the plug sleeve 4 can be used to predict whether the temperature of the plug sleeve 4 will cause damage to the plug sleeve 4 or the plug 3, so that time can be reserved before the temperature of the plug sleeve 4 is too high to cause damage to the plug sleeve 4 or the plug 3, and a protection action or a user reminder can be performed within the reserved time, so as to effectively prevent the terminal of the socket device 1 from softening, the device shell from melting or smoking, and other safety accidents.

[0097] In some other embodiments of the present application, referring to Figure 11 , the step S4 can further include:

[0098] The step S421 can further include:

[0099] Optionally, the step of calculating the integral value in the step S421 can include:

[0100] A plurality of second temperature rising speed values are calculated according to the first temperature value and the plurality of second temperature values.

[0101] It should be noted that the first temperature value can be replaced by the temperature value of the environment in which the socket device 1 is located. The plurality of second temperature rising speed values are calculated by subtracting the first temperature value from any one of the second temperature values, and the plurality of second temperature rising speed values can be obtained by calculating the plurality of second temperature values with the first temperature value.

[0102] In this step, the integral value is calculated according to the following formula.

[0103]

[0104] Wherein, A represents the integral value, X1 represents the first temperature value; X2 to X i+1 represent the plurality of second temperature values.

[0105] Of course, in other embodiments of the present application, other formulas can also be used to calculate the integral value, for example:

[0106]

[0107] Wherein, A represents the integral value; X1 represents the first temperature value; X2 to X i+1 represent the plurality of second temperature values; t represents the interval time between X i and X i+1 , for example, in the case where i is 1, t represents the interval time between X1 and X2, i.e. the first preset time.

[0108] For example, in the case of n = 3, it means that the control module 110 receives two second temperature values, represented by X2 and X3, after receiving the first temperature value X1, and the first preset time is t1 and the interval between X2 and X3 is t2; the calculation formula of the integral value A can be as follows:

[0109] A = (X1 + X2) x t1 / 2 + (X2 + X3) x t2 / 2.

[0110] It should be noted that in the case of integral calculation, the value of t should be as small as possible to improve the accuracy of integral calculation and thus improve the accuracy of the impedance anomaly detection method.

[0111] Step S422, issuing an impedance anomaly signal according to the integral value and the current value.

[0112] In the case of judging the integral value calculated according to the first temperature value and the plurality of second temperature values, the error of individual temperature values can be avoided to cause false detection; similarly, in the case of judging the integral value calculated according to the first temperature rise speed value and the plurality of second temperature rise speed values, the error of individual temperature rise speed values can be avoided to cause false detection. Thus, the purpose of improving the detection accuracy is achieved.

[0113] Optionally, referring to Figure 12 , step S422 can include:

[0114] Step S4221, obtaining a matching preset integral range according to the current value.

[0115] The preset integral range can represent the allowable range of the integral value calculated by the first temperature value and the plurality of second temperature values in the case that the plug sleeve 4 and the plug 3 are in a normal state of mutual cooperation, or can represent the allowable range of the integral value calculated by the first temperature rise speed value and the plurality of second temperature rise speed values. In the case that the integral value is within the preset integral range, it means that the impedance of the contact surface between the plug sleeve 4 and the plug 3 is in a normal state. The cooperation between the plug sleeve 4 and the plug 3 in a normal state can include the following cases: for example, the plug sleeve 4 and the plug 3 are well cooperated, and there is no surface oxidation on the plug sleeve 4 and the plug 3, and there is also no relaxation of the plug sleeve 4.

[0116] The value of the preset integral range can be obtained by comparing with the integral result curve of the same current under the normal working state, or can be obtained by machine learning algorithm to collect the historical integral result data of the user to learn the user habits as the basis for anomaly prediction and judgment.

[0117] Step S4222, comparing the preset integral range with the integral value.

[0118] In other words, step S4222 can be regarded as judging whether the integral value is within the preset integral range.

[0119] Step S4223, if the integral value is outside the preset integral range, an impedance abnormality signal is sent out.

[0120] In the case where the integral value is outside the preset integral range, it indicates that the temperature of the contact surface between the socket 4 and the plug 3 is high or the temperature rising speed is high, so that the position where the socket 4 and the plug 3 contact is prone to cause the terminal of the socket device 1 to soften, the device shell to melt or smoke to fire, etc. safety accidents; therefore the control module 110 sends out an impedance abnormality signal to prompt the user, so that the user can take timely measures to prevent the terminal of the socket device 1 from softening, the device shell from melting or smoking to fire, etc. safety accidents.

[0121] As described above, the impedance abnormality detection method can compare the preset integral range matched with the current value with the integral value to judge whether there is an impedance abnormality; in other words, according to the integral condition of the temperature of the contact surface between the socket 4 and the plug 3, whether the temperature is too high or the temperature rising speed is too high can be judged, which can accurately judge the impedance abnormality and also can timely and efficiently prompt the user to take measures, improving the technical problem of not timely detection in the prior art causing safety accidents.

[0122] As described above, in the case where the socket device 1 or the impedance abnormality detection circuit 30 performs the impedance abnormality detection method to detect the impedance abnormality, the temperature of the socket 4 can be directly detected, and a comprehensive judgment can be made according to the current value, the first temperature value and the second temperature value at the interval first preset time; for example, the preset temperature rising speed range matched with the current value is used to judge the first temperature rising speed value; for another example, the preset integral range matched with the current value is used to judge the integral value calculated according to the first temperature value and the plurality of second temperature values. In the case where the plug 3 and the socket 4 are not connected well, the plug 3 is not inserted well or the surface is oxidized, the socket 4 is relaxed or the surface of the socket 4 is oxidized, etc. causing the impedance abnormality between the contact surfaces of the socket 4 and the plug 3, an impedance abnormality signal can be sent out in time to prompt the user, which can facilitate the user to take measures in advance to prevent the terminal of the socket device 1 from softening, the device shell from melting or smoking to fire, etc. safety accidents, and can improve the technical problem of not timely detection in the prior art causing safety accidents.

[0123] As described above, only the specific embodiments of the present application are described, but the protection scope of the present application is not limited thereto, any changes or replacements within the technical range disclosed in the present application can be easily thought by those skilled in the art, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An impedance abnormality detection method applied to a socket device including a socket for plugging a plug, characterized by, The impedance anomaly detection method comprises: receiving a current value, wherein the current value represents a current flowing through the socket; receiving a first temperature value, wherein the first temperature value represents a temperature of the socket; receiving at least one second temperature value, wherein the second temperature value represents a temperature of the socket at a first preset time interval from the step of receiving the first temperature value; issuing an impedance anomaly signal according to the first temperature value, the second temperature value and the current value; the step of issuing the impedance anomaly signal according to the first temperature value, the second temperature value and the current value comprises: calculating a first temperature rise speed value according to the first temperature value and the second temperature value, wherein the first temperature rise speed value represents a temperature rise speed of the socket; obtaining a preset temperature rise speed range matched with the current value; comparing the preset temperature rise speed range with the first temperature rise speed value; if the first temperature rise speed value is outside the preset temperature rise speed range, issuing the impedance anomaly signal.

2. The impedance abnormality detection method according to claim 1, characterized by, the step of calculating the first temperature rise speed value according to the first temperature value and the second temperature value comprises: dividing a difference between the second temperature value and the first temperature value by the first preset time interval.

3. The impedance abnormality detection method according to claim 1, characterized by, the step of issuing the impedance anomaly signal according to the first temperature value, the second temperature value and the current value further comprises: calculating an integral value according to the first temperature value and a plurality of continuous second temperature values within a first preset time interval; issuing the impedance anomaly signal according to the integral value and the current value.

4. The impedance abnormality detection method according to claim 3, characterized by, the step of issuing the impedance anomaly signal according to the integral value and the current value comprises: obtaining a preset integral range matched with the current value; comparing the preset integral range with the integral value; if the integral value is outside the preset integral range, issuing the impedance anomaly signal.

5. The impedance abnormality detection method according to claim 3, characterized by, the step of calculating the integral value according to the first temperature value and a plurality of continuous second temperature values within a first preset time interval comprises: calculating a plurality of second temperature rise speed values according to the first temperature value and a plurality of second temperature values respectively; calculating the integral value according to the plurality of first temperature rise speed values.

6. An impedance abnormality detection circuit applied to the socket device, characterized by, The impedance anomaly detection circuit comprises: a control module, a current detection module, a temperature detection module, a temperature sensor, a plug pin and a plug sleeve; one end of the plug pin is electrically connected to the control module, and the other end is used for being electrically connected to a socket; one end of the plug sleeve is electrically connected to the control module, and the other end is used for being electrically connected to a plug; one end of the current detection module is electrically connected to the control module, and the other end is electrically connected to the plug pin and used for detecting a current flowing through a socket device; the temperature detection module is electrically connected to the control module, and the temperature sensor is electrically connected to the temperature detection module; the temperature sensor is in contact with the plug sleeve and is used for detecting a temperature of the plug sleeve; the control module is used for executing the impedance anomaly detection method according to any one of claims 1-5.

7. The impedance abnormality detection circuit according to claim 6, characterized by, The temperature sensor is at least two, and the two temperature sensors are respectively in contact with two plug sleeves.

8. The impedance abnormality detection circuit according to claim 6, characterized by, A first resistor is further arranged on the plug pin, and the first resistor is arranged in parallel with the current detection module.

9. A socket apparatus, characterized by The impedance anomaly detection circuit comprises any one of claims 6-8.

10. The socket apparatus of claim 9, wherein, The control module comprises a PCB board, the plug sleeve comprises a first plug part and a second plug part arranged at intervals, and the first plug part and the second plug part are electrically connected with the PCB board; The temperature sensor is arranged outside the first plug part, or the temperature sensor is arranged outside the second plug part; Alternatively, the temperature sensor is arranged on the PCB board and located between the first plug part and the second plug part; Alternatively, a heat conduction member is further arranged on the PCB board; the temperature sensor is arranged on the PCB board and in contact with the heat conduction member; and the heat conduction member is in contact with the first plug part or the second plug part.

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