Lead flattening device for inductance component assembly

Abstract

The application discloses a kind of lead flattening processing equipment for inductance assembly, including device base, the top position fixed mounting of device base is processing station, the bottom position positioning installation of device base is supported strengthening bottom plate, the bottom position installation of supporting strengthening bottom plate is support leg, the upper end of processing station is installed vibration feeding tray, feed seat, positioning support, support column, discharge mechanism, discharge seat, mould feeding seat and rotating seat.The lead flattening processing equipment for inductance assembly described in the application is provided with vibration feeding mechanism, glue dispensing processing mechanism, lead flattening mechanism and discharge mechanism, can conveniently better the lead of inductance assembly is fed, automatically feeds, reduces manual operation, and the integration of glue dispensing and processing is more convenient, and lead can be conveniently flattened better, more stable, simple and fast, improve work efficiency, more practical.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of inductance assembly, in particular to an inductance assembly lead flattening processing equipment. BACKGROUND

[0002] The inductance assembly lead flattening processing equipment is a supporting device for flattening the position of the leads at both ends of the inductance assembly. During the assembly of the inductance assembly, the position of the leads at both ends needs to be flattened. With the continuous development of science and technology, people's requirements for the manufacturing process of the inductance assembly lead flattening processing equipment are also increasing.

[0003] The existing inductance assembly lead flattening processing equipment has certain disadvantages in use. First, it is not convenient and quick to load during operation, and the processing is troublesome, which is not conducive to people's use. In addition, it is inconvenient to process the leads, and the automation performance is poor, which brings certain disadvantages to the use process of people. Therefore, we propose an inductance assembly lead flattening processing equipment. SUMMARY

[0004] (I) Technical problems solved

[0005] In view of the deficiencies in the prior art, the present application provides an inductance assembly lead flattening processing equipment which can conveniently and better load the leads of the inductance assembly, automatically feed, reduce manual operation, integrate dispensing and processing, be more convenient, and better flatten the leads, be more stable, simple and fast, improve work efficiency, be more practical, and effectively solve the problems in the background art.

[0006] (II) Technical solutions

[0007] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows: an inductance assembly lead flattening processing equipment, comprising a device base, a processing station is fixedly installed at the top position of the device base, a support and reinforcement bottom plate is positioned and installed at the bottom position of the device base, a support foot is installed at the bottom position of the support and reinforcement bottom plate, a vibration feeding disc, a feeding seat, a positioning support, a support column, a discharging mechanism, a discharging seat, a mold feeding seat and a rotating seat are installed on the upper end of the processing station.

[0008] As a preferred technical solution of the present application, an installation frame is installed between the vibration feeding disc and the processing station, a No. 1 air cylinder is installed at the end of the feeding seat, a material body feeder is arranged at the outer side position of the feeding seat, and a material blocking frame is installed at the upper end position of the feeding seat.

[0009] As one preferred technical scheme of the present application, the upper end of the positioning support is provided with a sliding seat, the end of the sliding seat is provided with a second air cylinder, the upper end of the sliding seat is provided with a movable frame, the bottom of the sliding seat is provided with a dispensing seat, and the outer side of the device base is provided with a driving mechanism.

[0010] As one preferred technical scheme of the present application, the upper end of the supporting column is provided with a positioning support plate, the upper end of the positioning support plate is provided with a driving cylinder and a cylinder body, the bottom of the driving cylinder is provided with a pressing plate, the bottom of the pressing plate is provided with a flattening processing seat, the upper end of the rotating seat is provided with a lead wire mold, the lead wire mold is provided with a lead wire flattening groove, and the middle of the rotating seat is provided with a rotating disc.

[0011] As one preferred technical scheme of the present application, the device base is positioned and installed between the processing station and the supporting reinforced bottom plate in a bolt positioning manner, the supporting reinforced bottom plate is positioned and installed between the supporting feet, and the processing station is positioned and installed between the vibrating feeding disc, the feeding seat, the positioning support, the supporting column, the discharging mechanism, the discharging seat, the mold feeding seat and the rotating seat.

[0012] As one preferred technical scheme of the present application, the bottom of the vibrating feeding disc is installed on the processing station through a mounting frame, the feeding seat is positioned and installed between the first air cylinder, the feeding seat is movable relative to the material feeder, and the feeding seat is positioned and installed between the material blocking frame.

[0013] As one preferred technical scheme of the present application, the positioning support is positioned and installed between the sliding seat, the sliding seat is positioned and installed between the second air cylinder, the movable frame is movable on the sliding seat, and the movable frame is positioned and installed between the dispensing seat.

[0014] As one preferred technical scheme of the present application, the driving cylinder drives the pressing plate to move up and down, the pressing plate is positioned and installed between the flattening processing seat, and the flattening processing seat processes between the lead wire mold and the lead wire flattening groove.

[0015] (Three) beneficial effects

[0016] Compared with the prior art, the present application provides an inductance component assembly lead flattening processing equipment, which has the following advantages: the inductance component assembly lead flattening processing equipment can conveniently and better perform lead feeding operation on the inductance component, automatically feed, reduce manual operation, integrate glue dispensing and processing, be more convenient, and can conveniently and better perform lead flattening processing, be more stable, simple, fast, improve work efficiency, and be more practical. First, the material is fed at the position of the vibrating feeding disc, enters the feeding seat and moves forward, performs glue dispensing at the position of the glue dispensing seat and the movable frame, enters the lead mold after glue dispensing, enters the rotating seat through the mold feeding seat, performs pressing and flattening at the position of the lead flattening groove through the pressing plate and the flattening processing seat, and finally is discharged from the discharging mechanism. The whole processing flow is more integrated and mechanized, reduces manual operation, improves work efficiency, and the inductance component assembly lead flattening processing equipment has simple structure, convenient operation, and better use effect compared with the traditional mode. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a whole structure schematic view of the inductance component assembly lead flattening processing equipment.

[0018] Figure 2 It is a whole structure schematic view of the inductance component assembly lead flattening processing equipment.

[0019] Figure 3 It is a whole structure schematic view of the inductance component assembly lead flattening processing equipment.

[0020] Figure 4 It is a whole structure schematic view of the inductance component assembly lead flattening processing equipment.

[0021] In the figure: 1, device base; 2, mounting frame; 3, feeding seat; 4, vibrating feeding disc; 5, material blocking frame; 6, positioning support; 7, No. 2 cylinder; 8, sliding seat; 9, movable frame; 10, glue dispensing seat; 11, positioning support plate; 12, mold feeding seat; 13, supporting column; 14, driving mechanism; 15, discharging seat; 16, discharging mechanism; 17, supporting foot; 18, material feeder; 19, No. 1 cylinder; 20, driving cylinder; 21, cylinder body; 22, pressing plate; 23, flattening processing seat; 24, rotating seat; 25, lead mold; 26, lead flattening groove; 27, processing station; 28, supporting reinforcement bottom plate; 29, rotating disc. DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of the present invention, but not all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0023] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0025] Example 1:

[0026] like Figures 1-4 As shown, a lead flattening processing device for inductor assembly includes a device base 1, a processing station 27 fixedly installed at the top of the device base 1, a supporting reinforcing base plate 28 positioned at the bottom of the device base 1, a supporting foot 17 installed at the bottom of the supporting reinforcing base plate 28, and a vibrating feeding plate 4, a feeding seat 3, a positioning support 6, a supporting column 13, a discharging mechanism 16, a discharging seat 15, a mold feeding seat 12, and a rotating seat 24 installed at the upper end of the processing station 27.

[0027] Furthermore, a mounting bracket 2 is installed between the vibrating feeding plate 4 and the processing station 27, a cylinder 19 is installed at the end of the feeding seat 3, a material feeder 18 is provided on the outer side of the feeding seat 3, and a baffle 5 is installed at the upper end of the feeding seat 3.

[0028] Furthermore, the device base 1 is positioned and installed with the processing station 27 and the supporting reinforcement base plate 28 by bolt positioning. The supporting reinforcement base plate 28 is positioned and installed with the support foot 17. The processing station 27 is positioned and installed with the vibrating feeding plate 4, the feeding seat 3, the positioning support 6, the supporting column 13, the discharging mechanism 16, the discharging seat 15, the mold feeding seat 12, and the rotating seat 24.

[0029] Furthermore, the bottom of the vibrating feed plate 4 is mounted on the processing station 27 via the mounting bracket 2, the feed seat 3 is positioned between the feed seat 3 and the first cylinder 19, the feed seat 3 moves between the feeder 18 and the material feeder 18, and the feed seat 3 is positioned between the feeder 5 and the baffle.

[0030] Example 2:

[0031] Based on Example 1, such as Figures 1-4 As shown, a lead flattening processing device for inductor assembly includes a device base 1, a processing station 27 fixedly installed at the top of the device base 1, a supporting reinforcing base plate 28 positioned at the bottom of the device base 1, a supporting foot 17 installed at the bottom of the supporting reinforcing base plate 28, and a vibrating feeding plate 4, a feeding seat 3, a positioning support 6, a supporting column 13, a discharging mechanism 16, a discharging seat 15, a mold feeding seat 12, and a rotating seat 24 installed at the upper end of the processing station 27.

[0032] Furthermore, a slide 8 is installed on the upper end of the positioning support 6, a second cylinder 7 is installed at the end of the slide 8, a movable frame 9 is installed on the upper end of the slide 8, a dotted seat 10 is installed on the bottom of the slide 8, and a drive mechanism 14 is installed on the outer side of the device base 1.

[0033] Furthermore, the positioning support 6 is positioned and installed between the slide block 8 and the second cylinder 7, the movable frame 9 moves on the slide block 8, and the movable frame 9 is positioned and installed between the dispensing seat 10.

[0034] Example 3:

[0035] Based on Embodiment 1 and Embodiment 2, as follows Figures 1-4 As shown, a lead flattening processing device for inductor assembly includes a device base 1, a processing station 27 fixedly installed at the top of the device base 1, a supporting reinforcing base plate 28 positioned at the bottom of the device base 1, a supporting foot 17 installed at the bottom of the supporting reinforcing base plate 28, and a vibrating feeding plate 4, a feeding seat 3, a positioning support 6, a supporting column 13, a discharging mechanism 16, a discharging seat 15, a mold feeding seat 12, and a rotating seat 24 installed at the upper end of the processing station 27.

[0036] Further, the upper end position of the support column 13 is provided with a positioning support plate 11, the upper end of the positioning support plate 11 is provided with a driving cylinder 20 and a cylinder body 21, the bottom of the driving cylinder 20 is provided with a pressing plate 22, the bottom of the pressing plate 22 is provided with a flattening processing seat 23, the upper end of a rotating seat 24 is provided with a lead wire mold 25, the lead wire mold 25 is provided with a lead wire flattening groove 26, and the middle part of the rotating seat 24 is provided with a rotating disc 29.

[0037] Further, the driving cylinder 20 drives the up-down movement of the position of the pressing plate 22, the pressing plate 22 is positioned and installed between the flattening processing seat 23, and the flattening processing seat 23 processes between the lead wire mold 25 and the lead wire flattening groove 26.

[0038] Working principle: the application includes a device base 1, a mounting frame 2, a feeding seat 3, a vibrating feeding disc 4, a material blocking frame 5, a positioning support 6, a No. 7 air cylinder, a sliding seat 8, a movable frame 9, a dispensing seat 10, a positioning support plate 11, a mold feeding seat 12, a support column 13, a driving mechanism 14, a discharging seat 15, a discharging mechanism 16, a supporting leg 17, a material feeder 18, a No. 19 air cylinder, a driving cylinder 20, a cylinder body 21, a pressing plate 22, a flattening processing seat 23, a rotating seat 24, a lead wire mold 25, a lead wire flattening groove 26, a processing station 27, a supporting reinforcing bottom plate 28, and a rotating disc 29. When in use, first, the vibrating feeding disc 4 is used for feeding, the material enters the feeding seat 3 through the vibrating feeding disc 4 and moves forward, the movable frame 9 and the dispensing seat 10 are used for dispensing, the lead wire enters the lead wire mold 25 after dispensing, the lead wire mold 25 enters the rotating seat 24 through the mold feeding seat 12, the lead wire enters the lead wire mold 25 and is pressed and flattened in the lead wire flattening groove 26 through the pressing plate 22 and the flattening processing seat 23, and finally, the material is discharged from the discharging mechanism 16. The whole processing flow is more integrated and mechanized, the manual operation is reduced, and the work efficiency is improved.

[0039] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0040] The foregoing is considered as illustrative only of the principles of the application. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the application to the exact construction and practice described. Accordingly, all such variations and modifications are intended to be included within the scope of the application as defined in the following claims.

Claims

1. A lead flattening apparatus for assembling an inductive component, comprising a device base (1), characterized in that: The top of the device base (1) is fixedly installed with a processing station (27), the bottom of the device base (1) is fixedly installed with a support reinforced bottom plate (28), the bottom of the support reinforced bottom plate (28) is installed with a support foot (17), the upper end of the processing station (27) is installed with a vibrating feeding disc (4), a feeding seat (3), a positioning support (6), a support column (13), a discharging mechanism (16), a discharging seat (15), a mold feeding seat (12) and a rotating seat (24); The upper end of the support column (13) is installed with a positioning support plate (11), the upper end of the positioning support plate (11) is installed with a driving cylinder (20) and a cylinder body (21), the bottom of the driving cylinder (20) is installed with a pressing plate (22), the bottom of the pressing plate (22) is installed with a flattening processing seat (23), the upper end of the rotating seat (24) is provided with a lead wire mold (25), the lead wire mold (25) is provided with a lead wire flattening groove (26), and the middle of the rotating seat (24) is provided with a rotating disc (29); The driving cylinder (20) drives the pressing plate (22) to move up and down, and the pressing plate (22) and the flattening processing seat (23) are fixedly installed; After the dispensing is completed, the lead wire enters the inside of the lead wire mold (25), the lead wire mold (25) enters the position of the rotating seat (24) through the mold feeding seat (12), and the lead wire enters the lead wire mold (25) and is pressed and flattened in the position of the lead wire flattening groove (26) through the pressing plate (22) and the flattening processing seat (23); The upper end of the positioning support (6) is installed with a sliding seat (8), the end of the sliding seat (8) is installed with a No. 2 air cylinder (7), the upper end of the sliding seat (8) is installed with a movable frame (9), the bottom of the sliding seat (8) is installed with a dispensing seat (10), and the outer side of the device base (1) is installed with a driving mechanism (14).

2. A lead flattening apparatus for assembling an inductive component according to claim 1, characterized in that: The vibrating feeding disc (4) and the processing station (27) are installed with a mounting frame (2), the end of the feeding seat (3) is installed with a No. 1 air cylinder (19), the outer side of the feeding seat (3) is provided with a material feeder (18), and the upper end of the feeding seat (3) is installed with a material blocking frame (5).

3. The apparatus according to claim 1, wherein: The device base (1), the processing station (27) and the support reinforced bottom plate (28) are positioned and installed in a bolt positioning manner, the support reinforced bottom plate (28) and the support foot (17) are positioned and installed, and the processing station (27), the vibrating feeding disc (4), the feeding seat (3), the positioning support (6), the support column (13), the discharging mechanism (16), the discharging seat (15), the mold feeding seat (12) and the rotating seat (24) are positioned and installed.

4. The apparatus according to claim 2, wherein: The bottom of the vibrating feeding disc (4) is installed on the processing station (27) through the mounting frame (2), the feeding seat (3) and the No. 1 air cylinder (19) are positioned and installed, and the feeding seat (3) and the material blocking frame (5) are positioned and installed.

5. The apparatus according to claim 1, wherein: The positioning support (6) is positioned and installed between the sliding seat (8), the sliding seat (8) is positioned and installed between the second air cylinder (7), the movable frame (9) is movable on the sliding seat (8), and the movable frame (9) is positioned and installed between the glue dispensing seat (10).

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