A multilayer ceramic electronic component, an electronic circuit board, and a manufacturing process and application thereof

Abstract

The application provides a multilayer ceramic electronic element, an electronic circuit board and a preparation process and application thereof. The multilayer ceramic electronic element comprises a first insulating medium layer, a multilayer ceramic layer and a second insulating medium layer which are sequentially stacked; the multilayer ceramic electronic element comprises a through hole which penetrates the first insulating medium layer, the multilayer ceramic layer and the second insulating medium layer, or the through hole penetrates the multilayer ceramic layer and the second insulating medium layer; the through hole of the second insulating medium layer is provided with a tin solder ball; the multilayer ceramic layer is composed of a plurality of composite layers; the composite layer comprises a ceramic green sheet, a circuit layer and a resin layer which are sequentially stacked. Through the design of the structure of the multilayer ceramic electronic element, a plurality of ceramic green sheets can be laminated and compounded to obtain the multilayer ceramic electronic element at a lower temperature and pressure, and the great energy loss and the increase of production cost caused by the sintering process are avoided.

Description

Technical Field

[0001] This invention belongs to the field of ceramic electronic component technology, specifically relating to a multilayer ceramic electronic component, an electronic circuit board, its fabrication process, and its applications. Background Technology

[0002] With the widespread adoption and rapid development of fifth-generation wireless communication systems, the demands for high integration density, high transmission rates, multifunctionality, high reliability, and low cost in electronic devices and components are also increasing. In the rapidly developing electronics manufacturing industry, electronic packaging is a crucial component. Electronic packaging refers to the technology of arranging, assembling, bonding, and connecting the various components that make up an electronic device according to regulations, and isolating them from the external environment for protection. Electronic packaging materials, as the foundation of the entire electronic packaging technology, are mainly used for electrical connections, moisture protection and heat dissipation, mechanical support, and stress mitigation of chips, aiming to ensure that the chip and the entire system can operate normally and stably in various complex and changing environments. Ceramic materials, with their relatively high thermal conductivity, good heat and corrosion resistance, low dielectric constant, stable chemical properties, high frequency, high insulation, high reliability, dense structure, and low cost, have become the most important electronic packaging material.

[0003] CN103295982A discloses a copper-clad ceramic heat sink for electronic packaging modules. The copper-clad ceramic heat sink includes a co-fired laminated ceramic heat dissipation structure; the co-fired laminated ceramic heat dissipation structure is formed by stacking and sintering multiple monolithic ceramic sheets to form a single sintered body; and copper-clad layers are bonded to the upper and lower surfaces of the co-fired laminated ceramic heat dissipation structure.

[0004] CN106784247A discloses a multilayer ceramic package and its manufacturing process. The multilayer ceramic package includes a ceramic shell body formed by stacking multiple ceramic sheets, and a receiving cavity formed on the ceramic shell body that penetrates through the multiple ceramic sheets and is open at one end. The receiving cavity is formed by connecting through holes formed on each of the ceramic sheets, and the inner wall of the receiving cavity is partially or entirely stepped along the direction to the opening of the receiving cavity. It also includes a metal body covering the stepped inner wall of the receiving cavity and co-fired integrally with each of the ceramic sheets constituting the receiving cavity, and the inner wall of the receiving cavity is conical due to the covering of the metal body. The manufacturing process includes: (1) material preparation, preparing raw ceramic sheets for each of the ceramic sheets; (2) punching, punching holes in each of the raw ceramic sheets used to form the receiving cavity to form the through holes; (3) stacking, stacking the raw ceramic sheets so that the inner walls of each through hole are joined together to form the receiving cavity; (4) hollow metallization, allowing metal slurry to flow through the stepped inner wall of the receiving cavity, and leaving some metal slurry on the steps on the inner wall of the receiving cavity so that the inner wall of the receiving cavity is conical; (5) lamination, applying pressure to each of the stacked raw ceramic sheets to bond the layers of ceramic sheets together; (6) sintering, sintering the bonded raw ceramic sheets in a sintering furnace to form a mature ceramic piece.

[0005] CN113640927A discloses a multilayer structure encapsulation ceramic for 5G optical communication modules and its fabrication process. The multilayer structure encapsulation ceramic is characterized by comprising at least four stacked ceramic layers: a first ceramic layer, a second ceramic layer, a third ceramic layer, and a fourth ceramic layer. The upper surface of the second ceramic layer is further provided with an upper grounding layer for radio frequency (RF) lines. Multiple strip lines are spaced apart on the third ceramic layer, each strip line comprising an RF line group and a control line group. The strip lines are printed using thick-film printing, with the control line group and RF line group printed onto the third ceramic layer using tungsten paste. The upper surface of the fourth ceramic layer is provided with a lower grounding layer for RF lines, which covers the upper and lower surfaces of the RF line groups, respectively. The upper surface of the first ceramic layer is provided with an upper grounding layer for the outer casing, and the lower surface of the fourth ceramic layer is provided with a lower grounding layer for the outer casing. The upper and lower grounding layers are connected by a first grounding connection line and a second grounding connection line. The preparation process includes: stacking the first ceramic layer, the second ceramic layer, the third ceramic layer and the fourth ceramic layer according to the overall structure of the encapsulated ceramic to form a ceramic block; performing warm isostatic pressing, cutting and sintering on the ceramic block to obtain a single black alumina encapsulated ceramic; printing external connection lines on the sintered encapsulated ceramic and then sintering it again to obtain a multi-layer structure encapsulated ceramic for 5G optical communication high-frequency high-speed modules.

[0006] As can be seen from the above, existing ceramic electronic components are mainly processed by co-firing, which requires sintering at temperatures above 800℃, resulting in huge energy consumption, high production costs, and stringent equipment requirements. In addition, when ceramics are used in combination with other materials, the yield rate is prone to decrease due to thermal expansion.

[0007] Therefore, how to process multiple ceramic green sheets at lower temperatures to obtain multilayer ceramic electronic components, effectively reduce the huge energy loss and production cost of traditional ceramic sintering, avoid deformation and warping of electronic components due to excessive differences in the thermal expansion coefficients of different materials, and ensure production yield has become an urgent technical problem to be solved. Summary of the Invention

[0008] To address the shortcomings of existing technologies, the present invention aims to provide a multilayer ceramic electronic component, an electronic circuit board, its fabrication process, and its applications. Through the design of the multilayer ceramic electronic component structure, and further through the design of the first insulating dielectric layer, the second insulating dielectric layer, and the resin layer within the multilayer ceramic layers, the present invention enables the stacking and composite of multiple ceramic green sheets at relatively low temperatures and pressures to obtain multilayer ceramic electronic components, avoiding the significant energy loss and increased production costs associated with the sintering process. The multilayer ceramic electronic component provided by the present invention is suitable for fabricating antennas, filters, and tubes, etc.

[0009] To achieve this objective, the present invention adopts the following technical solution:

[0010] In a first aspect, the present invention provides a multilayer ceramic electronic component, the multilayer ceramic electronic component comprising a first insulating dielectric layer, a multilayer ceramic layer and a second insulating dielectric layer sequentially stacked thereon;

[0011] The multilayer ceramic electronic component includes a through-hole, which penetrates the first insulating dielectric layer, the multilayer ceramic layer, and the second insulating dielectric layer, or the through-hole penetrates the multilayer ceramic layer and the second insulating dielectric layer.

[0012] Solder balls are provided at the through-holes of the second insulating dielectric layer;

[0013] The multilayer ceramic layer is composed of multiple composite layers;

[0014] The composite layer comprises a ceramic green sheet, a circuit layer, and a resin layer stacked sequentially.

[0015] This invention, through the design of a multilayer ceramic electronic component structure, and further through the design of a first insulating dielectric layer, a second insulating dielectric layer, and a resin layer in the multilayer ceramic layers, enables the stacking and composite of multiple ceramic green sheets to obtain multilayer ceramic electronic components at lower temperatures and pressures. Unlike traditional ceramic electronic components, which require sintering at temperatures above 800°C, this invention reduces the enormous energy loss and production costs associated with traditional ceramic sintering, and lowers the requirements for production equipment, effectively achieving energy conservation, emission reduction, and environmental protection. Simultaneously, by selecting ceramic green sheet substrates and polymer resins with coefficients close to thermal expansion, deformation and warping caused by excessive differences in their coefficients of thermal expansion are avoided.

[0016] In this invention, the solder balls in the through-hole of the second insulating dielectric layer are used to connect the multilayer ceramic electronic component to the circuit board. In practical applications, if the multilayer ceramic electronic component only needs to be connected to the circuit board, the through-hole only needs to penetrate the multilayer ceramic layer and the second insulating dielectric layer, without needing to penetrate the first insulating dielectric layer; if one side of the solder ball of the multilayer ceramic electronic component needs to be connected to the circuit board, and the other side needs to be connected to another electronic component, then the through-hole penetrates the first insulating dielectric layer, the multilayer ceramic layer, and the second insulating dielectric layer.

[0017] It should be noted that, in this invention, the multilayer ceramic layer being composed of multiple composite layers means that the multilayer ceramic layer is composed of 3 to 200 composite layers stacked sequentially.

[0018] It should be noted that the present invention does not impose any special limitation on the number of through holes. The number of through holes can be designed according to actual needs. The through holes should be designed in locations where there are no electronic circuits to avoid damage to the electronic circuits in the circuit layer, which would render the electronic components unusable.

[0019] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. The purpose and beneficial effects of the present invention can be better achieved and realized through the following preferred technical solutions.

[0020] As a preferred embodiment of the present invention, both the first insulating dielectric layer and the second insulating dielectric layer are first polymer film layers.

[0021] Preferably, the dielectric constant of the first polymer film layer is 2 to 40, for example, it can be 2, 5, 10, 15, 20, 25, 30, 35 or 40.

[0022] Preferably, the coefficients of thermal expansion of both the first insulating dielectric layer and the second insulating dielectric layer are <25ppm·K. -1 For example, it could be 5 ppm·K -1 10ppm·K -1 15ppm·K -1 20ppm·K-1 Or 25ppm·K -1 wait.

[0023] Preferably, the thickness of the first insulating dielectric layer and the second insulating dielectric layer are each independently selected from 10 to 400 μm, for example, 10 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm or 400 μm, etc.

[0024] It should be noted that the material of the first polymer film layer in this invention can be selected from any one of insulating film, insulating dielectric film, laminated film, or ABF film. This invention does not impose any special limitations on the specific components and preparation process of the above-mentioned polymer film. For example, the insulating dielectric film can be prepared according to CN110591591A, the insulating film can be prepared according to CN113088039A, CN113831875A, CN114181652A or CN114231221A, and the ABF film can be purchased from Ajinomoto in Japan. Alternatively, materials with similar properties to ABF film can be used, such as film products from Sekisui Chemicals in Japan, film products from Taiyo Ink in Japan, and NBF film produced in China.

[0025] It should also be noted that the first insulating dielectric layer completely covers the surface of the multilayer ceramic layer away from the second insulating dielectric layer, and the second insulating dielectric layer completely covers the surface of the multilayer ceramic layer away from the first insulating dielectric layer.

[0026] As a preferred embodiment of the present invention, the multilayer ceramic layer is composed of 3 to 200 composite layers (for example, it can be 3, 5, 10, 25, 40, 50, 70, 100, 120, 140, 160, 180 or 200 layers, etc.), and is more preferably 5 to 50 layers.

[0027] Preferably, the ceramic green sheet is selected from any one or a combination of at least two of aluminum nitride-based ceramic green sheets, alumina-based ceramic green sheets, magnesium aluminate-based ceramic green sheets, and calcium silicate-based ceramic green sheets.

[0028] Preferably, the coefficient of thermal expansion of the ceramic green sheet is <25ppm·K. -1 For example, it could be 5 ppm·K -1 10ppm·K -1 15ppm·K -1 20ppm·K -1 Or 25ppm·K -1 wait.

[0029] Ceramic wafers have low dielectric constants and dielectric losses, which can effectively increase the transmission speed of electrical signals, reduce signal delay, and reduce conductor losses in high-frequency environments. In this invention, by selecting specific ceramic wafers with low coefficients of thermal expansion, thermal stress after packaging can be reduced, thereby improving the reliability and lifespan of electronic components.

[0030] Preferably, the thickness of the ceramic green sheet is 0.1 to 800 μm (e.g., it can be 0.1 μm, 1 μm, 10 μm, 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm or 800 μm, etc.), and more preferably 10 to 200 μm.

[0031] As a preferred embodiment of the present invention, the resin layer is a second polymer film layer.

[0032] Preferably, the dielectric constant of the second polymer film is 2 to 40, for example, it can be 2, 5, 10, 15, 20, 25, 30, 35 or 40.

[0033] Preferably, the coefficient of thermal expansion of the resin layer is <25ppm·K. -1 For example, it could be 5 ppm·K -1 10ppm·K -1 15ppm·K -1 20ppm·K -1 Or 25ppm·K -1 wait.

[0034] Preferably, the thickness of the resin layer is 10 to 400 μm, for example, it can be 10 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm or 400 μm.

[0035] In this invention, by controlling the thickness of the resin layer within a specific range, the prepared electronic components achieve both high production yield and moderate thickness, making them suitable for fabricating electronic devices such as antennas, filters, and tubes. If the thickness is too small, the circuit layer may come into contact with the ceramic green sheet during subsequent fabrication, resulting in low production yield; if the thickness is too large, the prepared electronic components will be too thick and will not meet the usage requirements.

[0036] It should be noted that the material of the second polymer film layer in this invention can be selected from any one of insulating film, insulating dielectric film, laminated film or ABF film; this invention does not make any special limitation on the specific components and preparation process of the above-mentioned polymer film. For example, the insulating dielectric film can be prepared according to CN110591591A, the insulating film can be prepared according to CN113088039A, CN113831875A, CN114181652A or CN114231221A, and the ABF film can be purchased from Ajinomoto, Japan.

[0037] In this invention, by selecting a resin layer with good dielectric properties, the signal transmission speed and circuit density can be improved, while power requirements and heat generation can be reduced. At the same time, the resin layer, the first insulating dielectric layer, and the first insulating dielectric layer all have low coefficients of thermal expansion, which can avoid large dimensional changes and electronic component failures caused by thermal expansion of materials during changes in ambient temperature, thereby improving the accuracy and service life of electronic components.

[0038] As a preferred embodiment of the present invention, a metal wire is provided in the through hole, the metal wire being used for connection between any two adjacent circuit layers and for connection between circuit layers adjacent to solder balls and solder balls.

[0039] The metal wire is used to connect any two adjacent circuit layers, making the two adjacent circuit layers electrically connected; the metal wire is also used to connect solder balls and circuit layers adjacent to solder balls, so that when solder balls are soldered to the circuit board, the circuits of electronic components are electrically connected to the circuits on the circuit board.

[0040] It should be noted that, in practical applications, if other electronic components are also connected to the side of the first insulating dielectric layer away from the multilayer ceramic, then metal wires will be led out from the circuit layer adjacent to the first insulating dielectric layer for connecting the multilayer ceramic electronic components and other electronic components provided by this invention.

[0041] It should also be noted that, in order to facilitate the connection between two adjacent circuit layers, the side of the resin layer that is in contact with the circuit layer can form a concave surface on the side away from the through hole, exposing the contacts of the circuit layer for easy connection; similarly, in order to facilitate the connection between solder balls and the circuit layers adjacent to the solder balls, the side of the second insulating dielectric layer that is in contact with the resin layer can form a concave surface on the side away from the through hole, exposing the contacts of the circuit layer for easy connection.

[0042] In a second aspect, the present invention provides a fabrication process for a multilayer ceramic electronic component as described in the first aspect, the fabrication process comprising the following steps:

[0043] (1) A circuit layer is formed on one side of a ceramic green sheet by laser sputtering and screen printing, and a resin layer is pressed onto the side of the ceramic green sheet with the circuit layer to obtain a composite layer.

[0044] (2) Lamination of multiple composite layers to obtain a multilayer ceramic layer;

[0045] (3) Press the first insulating dielectric layer and the second insulating dielectric layer onto both sides of the multilayer ceramic layer respectively, obtain multiple through holes by laser drilling, obtain metal wires by electrolytic plating on the through holes, and obtain solder balls by stencil printing at the through holes of the second insulating dielectric layer to obtain the multilayer ceramic electronic component.

[0046] Alternatively, step (3) can be replaced with (3)', where the second insulating dielectric layer is pressed onto one side of the multilayer ceramic layer, multiple through holes are obtained by laser drilling, metal wires are obtained by electrolytic plating on the through holes, and solder balls are obtained by stencil printing at the through holes of the second insulating dielectric layer. Then, the first insulating dielectric layer is pressed onto the side of the multilayer ceramic layer away from the second insulating dielectric layer to obtain the multilayer ceramic electronic component.

[0047] If it is necessary to prepare a through-hole that penetrates the first insulating dielectric layer, the multilayer ceramic layer, and the second insulating dielectric layer, then step (3) is used; if it is necessary to prepare a through-hole that penetrates the multilayer ceramic layer and the second insulating dielectric layer, then step (3)' is used.

[0048] As a preferred technical solution of the present invention, the pressing temperature in step (1) is 150 to 200°C, for example, it can be 150°C, 155°C, 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C or 200°C.

[0049] Preferably, the pressing pressure in step (1) is 0.1 to 10 MPa, for example, it can be 0.1 MPa, 0.5 MPa, 1 MPa, 2 MPa, 5 MPa or 10 MPa.

[0050] Preferably, the lamination temperature in step (2) is 150 to 200°C, for example, it can be 150°C, 155°C, 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C or 200°C.

[0051] Preferably, the lamination pressure in step (2) is 0.1 to 10 MPa, for example, it can be 0.1 MPa, 0.5 MPa, 1 MPa, 2 MPa, 5 MPa or 10 MPa.

[0052] Preferably, the pressing temperatures in steps (3) and (3)′ are each independently selected from 150 to 200°C, for example, 150°C, 155°C, 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C or 200°C.

[0053] Preferably, the pressing pressure in steps (3) and (3)' is independently selected from 0.1 to 10 MPa, for example, it can be 0.1 MPa, 0.5 MPa, 1 MPa, 2 MPa, 5 MPa or 10 MPa, etc.

[0054] In this invention, the fabrication process of the multilayer ceramic electronic component includes the following steps:

[0055] (1) A circuit layer is formed on a ceramic green sheet by laser sputtering and screen printing. Under the conditions of temperature of 150-200℃ and pressure of 0.1-10MPa, a resin layer is pressed onto the side of the ceramic green sheet with the circuit layer to obtain a composite layer.

[0056] (2) Under the conditions of temperature of 150~200℃ and pressure of 0.1~10MPa, multiple composite layers are laminated to obtain a multilayer ceramic layer;

[0057] (3) Under the conditions of temperature of 150~200℃ and pressure of 0.1~10MPa, the first insulating dielectric layer and the second insulating dielectric layer are respectively pressed onto both sides of the multilayer ceramic layer, and multiple through holes are obtained by laser drilling. Metal wires are obtained by electrolytic plating on the through holes, and solder balls are obtained by stencil printing at the through holes of the second insulating dielectric layer to obtain the multilayer ceramic electronic component.

[0058] Alternatively, step (3) can be replaced with (3)′ where, under conditions of 150–200°C and 0.1–10 MPa, the second insulating dielectric layer is pressed onto one side of the multilayer ceramic layer, multiple through holes are obtained by laser drilling, metal wires are obtained by electrolytic plating on the through holes, and solder balls are obtained by stencil printing at the through holes of the second insulating dielectric layer. Then, under conditions of 150–200°C and 0.1–10 MPa, the first insulating dielectric layer is pressed onto the side of the multilayer ceramic layer away from the second insulating dielectric layer to obtain the multilayer ceramic electronic component.

[0059] Thirdly, the present invention provides an electronic circuit board, the electronic circuit board comprising the multilayer ceramic electronic components as described in the first aspect;

[0060] The electronic circuit board includes multilayer ceramic electronic components bonded together and a second metal layer, wherein the second metal layer is disposed on the side of the second insulating dielectric layer away from the multilayer ceramic layer.

[0061] Preferably, the electronic circuit board further includes a first metal layer, which is disposed on the side of the first insulating dielectric layer away from the multilayer ceramic layer.

[0062] Preferably, the thickness of the first metal layer and the second metal layer are each independently selected from 0.05 to 30 μm, and more preferably 0.1 to 10 μm.

[0063] In this invention, no special limitations are made on the materials of the first metal layer and the second metal layer. Examples include, but are not limited to, metallic copper.

[0064] It should be noted that if the through hole penetrates the first insulating dielectric layer, the multilayer ceramic layer, and the second insulating dielectric layer, the electronic circuit board includes a first metal layer, a first insulating dielectric layer, a multilayer ceramic layer, a second insulating dielectric layer, and a second metal layer stacked sequentially; if the through hole penetrates the multilayer ceramic layer and the second insulating dielectric layer, the electronic circuit board includes a first insulating dielectric layer, a multilayer ceramic layer, a second insulating dielectric layer, and a second metal layer stacked sequentially.

[0065] Fourthly, the present invention provides a fabrication process for an electronic circuit board as described in the third aspect, the fabrication process comprising step (A) or step (B);

[0066] Step (A) involves obtaining a first metal layer on the side of the first insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer through an electrolytic plating process, and obtaining a second metal layer on the side of the second insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer, thereby obtaining the electronic circuit board;

[0067] Step (B) involves obtaining a second metal layer on the side of the second insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer through an electrolytic plating process, thereby obtaining the electronic circuit board.

[0068] It should be noted that if the through-hole in the multilayer ceramic electronic component penetrates the first insulating dielectric layer, the multilayer ceramic layer, and the second insulating dielectric layer, then the electronic circuit board prepared by step (A) is obtained; if the through-hole in the multilayer ceramic electronic component penetrates the multilayer ceramic layer and the second insulating dielectric layer, then the electronic circuit board prepared by step (B) is obtained.

[0069] It should also be noted that, as can be seen from the fabrication method of electronic circuit boards, since the via penetrates multiple ceramic layers (first insulating dielectric layer) and the second insulating dielectric layer, the first metal layer and / or the second metal layer cannot be formed at the via. In other words, the via also penetrates the first metal layer and / or the second metal layer.

[0070] Fifthly, the present invention provides the application of a multilayer ceramic electronic component as described in the first aspect or an electronic circuit board as described in the third aspect in antennas, filters, and tubes.

[0071] Compared with the prior art, the present invention has the following beneficial effects:

[0072] This invention, through the design of a multilayer ceramic electronic component structure, and further through the design of a first insulating dielectric layer, a second insulating dielectric layer, and a resin layer in the multilayer ceramic layers, enables the stacking and composite of multiple ceramic green sheets to obtain multilayer ceramic electronic components at relatively low temperatures (≤200℃) and pressures (0.1~10MPa). This avoids the huge energy loss and increased production costs associated with the sintering process, and the resulting multilayer ceramic electronic components have a low coefficient of thermal expansion of 15~20ppm·K. -1 With a dielectric constant of 3.4 to 3.8, the multilayer ceramic electronic components prepared thereby do not crack or warp and have an intact appearance, making them suitable for the preparation of antennas, filters, and tubes. Attached Figure Description

[0073] Figure 1 This is a schematic cross-sectional view of the multilayer ceramic electronic component at the through-hole provided in Embodiment 1 of the present invention;

[0074] Figure 2 This is a schematic cross-sectional view of the multilayer ceramic electronic component at the through-hole provided in Embodiment 5 of the present invention;

[0075] Figure 3 This is a schematic cross-sectional view of the electronic circuit board at the through-hole provided in Embodiment 1 of the present invention;

[0076] Figure 4 This is a schematic cross-sectional view of the electronic circuit board at the through hole provided in Embodiment 5 of the present invention;

[0077] Among them, 1-first insulating dielectric layer, 2-multilayer ceramic layer, 3-second insulating dielectric layer, 4-through hole, 5-solder ball, 21-composite layer, 211-ceramic green sheet, 212-circuit layer, 213-resin layer, 6-first metal layer, 7-second metal layer. Detailed Implementation

[0078] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be considered as specific limitations thereof.

[0079] The sources of some components in the following examples and comparative examples are as follows:

[0080] Insulating dielectric film: prepared according to CN110591591A;

[0081] ABF membrane: Ajinomoto ABF membrane, GZ41 (Japan);

[0082] Insulating film 1: Prepared according to CN113088039A;

[0083] Insulating film 2: prepared according to CN114231221A;

[0084] Insulating film 3: prepared according to CN114181652A;

[0085] Aluminum nitride-based ceramic green sheets: prepared according to CN112586092A;

[0086] Calcium silicate-based ceramic green sheets: prepared according to CN102863214A;

[0087] Alumina-based ceramic green sheets: prepared according to CN109156083A.

[0088] Example 1

[0089] This embodiment provides a multilayer ceramic electronic component, an electronic circuit board, and their fabrication process. A schematic cross-sectional view of the multilayer ceramic electronic component at a through-hole is shown below. Figure 1 As shown, it includes a first insulating dielectric layer 1, a multilayer ceramic layer 2, and a second insulating dielectric layer 3, which are stacked sequentially.

[0090] The multilayer ceramic electronic component includes a through-hole 4; the through-hole 4 penetrates the first insulating dielectric layer 1, the multilayer ceramic layer 2, and the second insulating dielectric layer 3, and the cross-section of the through-hole 4 is circular with a diameter of 50μm;

[0091] Solder balls 5 are provided at the through holes 4 of the second insulating dielectric layer 3;

[0092] The multilayer ceramic layer 2 is composed of 45 composite layers 21;

[0093] The composite layer 21 includes a ceramic green sheet 211, a circuit layer 212 and a resin layer 213 stacked sequentially.

[0094] The ceramic green sheet 211 is an aluminum nitride-based ceramic green sheet with a thickness of 100 μm, and the resin layer 213 is prepared by ABF film with a thickness of 45 μm;

[0095] Both the first insulating dielectric layer and the second insulating dielectric layer are prepared from an insulating dielectric film with a thickness of 40 μm.

[0096] The through-hole is provided with a metal wire, which is used to connect any two adjacent circuit layers and to connect solder balls and circuit layers adjacent to solder balls. At the same time, a metal wire is led out from the circuit layer adjacent to the first insulating dielectric layer for connecting the multilayer ceramic electronic components and other electronic components provided by the present invention.

[0097] The fabrication process of the above-mentioned multilayer ceramic electronic components is as follows:

[0098] (1) A circuit layer 212 is formed on a layer of aluminum nitride-based ceramic green sheet by laser sputtering and screen printing. Under the conditions of 200°C and 0.1MPa, ABF film is pressed onto the side of the aluminum nitride-based ceramic green sheet with circuit layer 212 to obtain composite layer 21.

[0099] (2) Under the conditions of 200℃ and 0.5MPa, 45 composite layers 21 are laminated to obtain a multilayer ceramic layer 2;

[0100] (3) Under the conditions of 200℃ and 0.1MPa, the insulating dielectric film is pressed onto both sides of the multilayer ceramic layer 2 to obtain the first insulating dielectric layer 1 and the second insulating dielectric layer 3.

[0101] Multiple through holes were obtained by laser drilling (the density of through holes is 10 / cm²). 2 Metal wires are obtained by electrolytic plating on the through hole 4, and solder balls 5 are obtained by stencil printing at the through hole 4 of the second insulating dielectric layer 3, thus obtaining the multilayer ceramic electronic component.

[0102] The electronic circuit board includes the aforementioned multilayer ceramic electronic components, and its cross-sectional structure at the through-hole is shown in the figure below. Figure 3 As shown, it includes a first metal layer 6, a first insulating dielectric layer 1, a multilayer ceramic layer 2, a second insulating dielectric layer 3, and a second metal layer 7, which are stacked sequentially.

[0103] It should be noted that the through holes in the multilayer ceramic electronic component also penetrate the first metal layer 6 and the second metal layer 7.

[0104] The manufacturing process of the above-mentioned electronic circuit board is as follows:

[0105] The electronic circuit board is obtained by electrolytic plating process on the side of the first insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer, and on the side of the second insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer.

[0106] The first and second metal layers are both made of copper and have a thickness of 8 μm.

[0107] Example 2

[0108] This embodiment provides a multilayer ceramic electronic component, an electronic circuit board, and its fabrication process. The difference from Embodiment 1 is that the multilayer ceramic layer 2 is composed of 50 composite layers 21.

[0109] The ceramic green sheet 211 is an aluminum nitride-based ceramic green sheet with a thickness of 60 μm, and the resin layer 213 is prepared from the insulating film 2 with a thickness of 100 μm.

[0110] Both the first insulating dielectric layer and the second insulating dielectric layer are prepared from insulating film 1, with a thickness of 400 μm.

[0111] The fabrication process of the multilayer ceramic electronic component is as follows:

[0112] (1) A circuit layer 212 is formed on a layer of aluminum nitride-based ceramic green sheet by laser sputtering and screen printing. Under the conditions of temperature of 180℃ and pressure of 0.2MPa, an insulating film 2 is pressed onto the side of the aluminum nitride-based ceramic green sheet with the circuit layer 212 to obtain a composite layer 21.

[0113] (2) At a temperature of 180℃ and a pressure of 1MPa, 50 composite layers 21 are laminated to obtain a multilayer ceramic layer 2.

[0114] (3) Under the conditions of 200℃ and 0.2MPa, the insulating film 1 is pressed onto both sides of the multilayer ceramic layer 2 to obtain the first insulating dielectric layer 1 and the second insulating dielectric layer 3.

[0115] Multiple through holes were obtained by laser drilling, with a density of 50 holes / cm². 2 Metal wires are obtained by electrolytic plating on the through hole 4, and solder balls 5 are obtained by stencil printing at the through hole 4 of the second insulating dielectric layer 3, thus obtaining the multilayer ceramic electronic component.

[0116] The thickness of the first metal layer and the second metal layer in the electronic circuit board is 0.05 μm.

[0117] Example 3

[0118] This embodiment provides a multilayer ceramic electronic component, an electronic circuit board, and its fabrication process. The difference from Embodiment 1 is that the multilayer ceramic layer 2 is composed of three composite layers 21.

[0119] The ceramic green sheet 211 is an alumina-based ceramic green sheet with a thickness of 200 μm, and the resin layer 213 is prepared by ABF film with a thickness of 400 μm;

[0120] Both the first insulating dielectric layer and the second insulating dielectric layer are prepared from insulating film 1, with a thickness of 10 μm.

[0121] The fabrication process of the multilayer ceramic electronic component is as follows:

[0122] (1) A circuit layer 212 is formed on a layer of aluminum nitride-based ceramic green sheet by laser sputtering and screen printing. Under the conditions of temperature of 150℃ and pressure of 0.2MPa, ABF film is pressed onto the side of the aluminum oxide-based ceramic green sheet with circuit layer 212 to obtain composite layer 21.

[0123] (2) At a temperature of 150℃ and a pressure of 1MPa, five composite layers 21 are laminated to obtain a multilayer ceramic layer 2.

[0124] (3) Under the conditions of 200℃ and 0.2MPa, the insulating film 1 is pressed onto both sides of the multilayer ceramic layer 2 to obtain the first insulating dielectric layer 1 and the second insulating dielectric layer 3.

[0125] Multiple through holes were obtained by laser drilling, with a number of 30 through holes per cm. 2 Metal wires are obtained by electrolytic plating on the through hole 4, and solder balls 5 are obtained by stencil printing at the through hole 4 of the second insulating dielectric layer 3, thus obtaining the multilayer ceramic electronic component.

[0126] The thickness of the first metal layer and the second metal layer in the electronic circuit board is 0.1 μm.

[0127] Example 4

[0128] This embodiment provides a multilayer ceramic electronic component, an electronic circuit board, and its fabrication process. The difference from Embodiment 1 is that the multilayer ceramic layer 2 is composed of 200 composite layers 21.

[0129] The ceramic green sheet 211 is a calcium silicate-based ceramic green sheet with a thickness of 0.1 μm, and the resin layer 213 is prepared from the insulating film 3 with a thickness of 10 μm;

[0130] Both the first insulating dielectric layer and the second insulating dielectric layer are prepared from insulating film 3, with a thickness of 400 μm.

[0131] The fabrication process of the multilayer ceramic electronic component is as follows:

[0132] (1) A circuit layer 212 is formed on a layer of calcium silicate-based ceramic green sheet by laser sputtering and screen printing. Under the conditions of temperature of 160℃ and pressure of 0.4MPa, an insulating film 3 is pressed onto the side of the alumina-based ceramic green sheet with the circuit layer 212 to obtain a composite layer 21.

[0133] (2) Under the conditions of 160℃ and 1MPa, 200 composite layers 21 are laminated to obtain a multilayer ceramic layer 2.

[0134] (3) Under the conditions of temperature of 160℃ and pressure of 0.4MPa, the insulating film 3 is pressed onto both sides of the multilayer ceramic layer 2 to obtain the first insulating dielectric layer 1 and the second insulating dielectric layer 3.

[0135] Multiple through holes were obtained by laser drilling, with a density of 40 holes / cm². 2 Metal wires are obtained by electrolytic plating on the through hole 4, and solder balls 5 are obtained by stencil printing at the through hole 4 of the second insulating dielectric layer 3, thus obtaining the multilayer ceramic electronic component.

[0136] The thickness of the first metal layer and the second metal layer in the electronic circuit board is 30 μm.

[0137] Example 5

[0138] This embodiment provides a multilayer ceramic electronic component, an electronic circuit board, and their fabrication process. A schematic cross-sectional view of the multilayer ceramic electronic component at a through-hole is shown below. Figure 2 As shown, it includes a first insulating dielectric layer 1, a multilayer ceramic layer 2, and a second insulating dielectric layer 3, which are stacked sequentially.

[0139] The multilayer ceramic electronic component includes a through-hole 4, which penetrates the multilayer ceramic layer 2 and the second insulating dielectric layer 3. The cross-section of the through-hole 4 is circular and the diameter is 100μm.

[0140] Solder balls 5 are provided at the through holes 4 of the second insulating dielectric layer 3;

[0141] The multilayer ceramic layer 2 is composed of 5 composite layers 21;

[0142] The composite layer 21 includes a ceramic green sheet 211, a circuit layer 212 and a resin layer 213 stacked sequentially.

[0143] The ceramic green sheet 211 is an aluminum nitride-based ceramic green sheet with a thickness of 150 μm, and the resin layer 213 is prepared by ABF film with a thickness of 160 μm;

[0144] Both the first insulating dielectric layer and the second insulating dielectric layer are prepared from an insulating dielectric film with a thickness of 240 μm.

[0145] The through-hole is provided with a metal wire, which is used to connect any two adjacent circuit layers and to connect solder balls and the circuit layer adjacent to the solder balls.

[0146] The fabrication process of the above-mentioned multilayer ceramic electronic components is as follows:

[0147] (1) A circuit layer 212 is formed on a layer of aluminum nitride-based ceramic green sheet by laser sputtering and screen printing. Under the conditions of 200°C and 0.5MPa, ABF film is pressed onto the side of the aluminum nitride-based ceramic green sheet with circuit layer 212 to obtain composite layer 21.

[0148] (2) At a temperature of 200℃ and a pressure of 0.2MPa, five composite layers 21 are laminated to obtain a multilayer ceramic layer 2;

[0149] (3) At a temperature of 200℃ and a pressure of 0.3MPa, the second insulating dielectric layer is pressed onto one side of the multilayer ceramic layer 2, and multiple through holes 4 are obtained by laser drilling, with a number of through holes of 30 / cm. 2 Metal wires are obtained by electrolytic plating on the through hole 4, and solder balls 5 are obtained by stencil printing at the through hole 4 of the second insulating dielectric layer 3. Then, under the conditions of temperature 200℃ and pressure 0.3MPa, the first insulating dielectric layer 1 is pressed onto the side of the multilayer ceramic layer 2 away from the second insulating dielectric layer 3 to obtain the multilayer ceramic electronic component.

[0150] The electronic circuit board includes the aforementioned multilayer ceramic electronic components, and its cross-sectional structure at the through-hole is shown in the figure below. Figure 4 As shown, it includes a first insulating dielectric layer 1, a multilayer ceramic layer 2, a second insulating dielectric layer 3, and a second metal layer 7, which are stacked sequentially.

[0151] It should be noted that the through holes in the multilayer ceramic electronic component also penetrate the second metal layer 7;

[0152] The manufacturing process of the above-mentioned electronic circuit board is as follows:

[0153] The electronic circuit board is obtained by electrolytic plating process to obtain a second metal layer on the side of the second insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer.

[0154] The first and second metal layers are both made of copper and have a thickness of 10 μm.

[0155] Example 6

[0156] This embodiment provides a multilayer ceramic electronic component and its fabrication process. The only difference from Embodiment 1 is that the thickness of the resin layer is 10 μm, while the other conditions are the same as in Embodiment 1.

[0157] Example 7

[0158] This embodiment provides a multilayer ceramic electronic component and its fabrication process. The only difference from Embodiment 1 is that the thickness of the resin layer is 400 μm, while the other conditions are the same as in Embodiment 1.

[0159] Example 8

[0160] This embodiment provides a multilayer ceramic electronic component and its fabrication process. The only difference from Embodiment 1 is that the thickness of the resin layer is 5 μm, while the other conditions are the same as in Embodiment 1.

[0161] Example 9

[0162] This embodiment provides a multilayer ceramic electronic component and its fabrication process. The only difference from Embodiment 1 is that the thickness of the resin layer is 500 μm, while the other conditions are the same as in Embodiment 1.

[0163] Comparative Example 1

[0164] This comparative example provides a multilayer ceramic electronic component and its fabrication process. The only difference from Example 1 is that no resin layer is provided in the composite layer.

[0165] The fabrication process of the multilayer ceramic electronic component is as follows:

[0166] (1) A circuit layer is formed on an aluminum nitride-based ceramic green sheet by laser sputtering and screen printing;

[0167] (2) Stack aluminum nitride-based ceramic green sheets with circuit layers to obtain stacked ceramic green sheets;

[0168] (3) The stacked ceramic green sheets are placed in an air atmosphere at a temperature of 950℃ and a pressure of 10 kgf / cm. 2 Multilayer ceramic electronic components were obtained by sintering under pressure for 20 minutes under the specified conditions.

[0169] The performance of the multilayer ceramic electronic components provided in the above embodiments and comparative examples was tested using the following methods:

[0170] Multilayer ceramic electronic components were cut into test pieces with a width of about 6 mm and a length of about 15 mm. Thermomechanical analysis was performed using a thermomechanical analysis device (Mettler Toledo "TMA SDTA2+") under the conditions of a preload force of 0.02 N, a heating range of 25 °C to 260 °C, and a heating rate of 10 °C / min to obtain the coefficient of thermal expansion in the range of 25 °C to 150 °C.

[0171] The multilayer ceramic electronic components were cut into 2mm×80mm test pieces (3 pieces). Then, using Agilent Technologies' "HP8362B", the dielectric constant of each test piece was determined by the cavity resonance perturbation method under the conditions of a measurement frequency of 5.8GHz and a measurement temperature of 23℃, and the average value of the 3 test pieces was calculated.

[0172] Appearance evaluation: Observe whether the prepared multilayer ceramic electronic components crack or warp.

[0173] The performance test results of the multilayer ceramic electronic components provided in the above embodiments and comparative examples are shown in Table 1 below:

[0174] Table 1

[0175]

[0176]

[0177] As shown in Table 1, this invention, through the design of the multilayer ceramic electronic component structure, and further through the design of the first insulating dielectric layer, the second insulating dielectric layer, and the resin layer in the multilayer ceramic layers, can achieve the stacking and composite of multiple ceramic green sheets at relatively low temperatures (≤200℃) and pressures (0.1~10MPa) to obtain multilayer ceramic electronic components. This avoids the huge energy loss and increased production costs caused by the sintering process, and the resulting multilayer ceramic electronic components have a low coefficient of thermal expansion of 15~20ppm·K. -1 With a dielectric constant of 3.4 to 3.8, the multilayer ceramic electronic components prepared thereby do not crack or warp and have an intact appearance, making them suitable for the preparation of antennas, filters, and tubes.

[0178] Compared with Example 1, if the resin layer is too thin (Example 8), the prepared multilayer ceramic electronic component will partially crack; if the resin layer is too thick (Example 9), the prepared multilayer ceramic electronic component will be too thick and will warp significantly, failing to meet the usage requirements.

[0179] Compared with Example 1, if the composite layer of the multilayer ceramic electronic component does not contain a resin layer (Comparative Example 1), the multilayer ceramic electronic component can only be prepared by high-temperature sintering, which results in huge energy loss and increased production costs due to the sintering process.

[0180] In summary, this invention, through the design of a multilayer ceramic electronic component structure and further through the design of the resin layer and the control of the resin layer thickness within a specific range, enables the stacking of multiple ceramic green sheets to obtain multilayer ceramic electronic components at lower temperatures and pressures. This avoids the huge energy loss and increased production costs caused by the sintering process, and the resulting multilayer ceramic electronic components have a complete appearance and do not warp, making them suitable for the fabrication of antennas, filters, and tubes.

[0181] The applicant declares that the detailed structural features and detailed process flow of the present invention are illustrated through the above embodiments, but the present invention is not limited to the above detailed structural features and detailed process flow, that is, it does not mean that the present invention must rely on the above detailed structural features and detailed process flow to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions of the components used in the present invention, additions of auxiliary components, selection of specific methods, equivalent substitutions of the raw materials of the product of the present invention, additions of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A multilayer ceramic electronic component, characterized in that, The multilayer ceramic electronic component includes a first insulating dielectric layer, a multilayer ceramic layer, and a second insulating dielectric layer that are stacked sequentially. The multilayer ceramic electronic component includes a through-hole, which penetrates the first insulating dielectric layer, the multilayer ceramic layer, and the second insulating dielectric layer, or the through-hole penetrates the multilayer ceramic layer and the second insulating dielectric layer. Solder balls are provided at the through-holes of the second insulating dielectric layer; The multilayer ceramic layer is composed of multiple composite layers; The composite layer comprises a ceramic green sheet, a circuit layer, and a resin layer stacked sequentially. The thickness of the resin layer is 10~400 μm; The multilayer ceramic electronic component is obtained by laminating multiple ceramic green sheets at a temperature ≤200℃ and a pressure of 0.1~10 MPa. The coefficient of thermal expansion of the ceramic green sheet is <25 ppm. K -1 ; The coefficient of thermal expansion of the resin layer is <25 ppm. K -1 .

2. The multilayer ceramic electronic component according to claim 1, characterized in that, Both the first insulating dielectric layer and the second insulating dielectric layer are first polymer film layers.

3. The multilayer ceramic electronic component according to claim 2, characterized in that, The dielectric constant of the first polymer film is 2 to 40.

4. The multilayer ceramic electronic component according to claim 1, characterized in that, The coefficients of thermal expansion of both the first and second insulating dielectric layers are <25 ppm. K -1 .

5. The multilayer ceramic electronic component according to claim 1, characterized in that, The thicknesses of the first insulating dielectric layer and the second insulating dielectric layer are each independently selected from 10 to 400 μm.

6. The multilayer ceramic electronic component according to claim 1, characterized in that, The multilayer ceramic layer consists of 3 to 200 composite layers.

7. The multilayer ceramic electronic component according to claim 6, characterized in that, The multilayer ceramic layer consists of 5 to 50 composite layers.

8. The multilayer ceramic electronic component according to claim 1, characterized in that, The ceramic green sheet is selected from any one or a combination of at least two of the following: aluminum nitride-based ceramic green sheet, alumina-based ceramic green sheet, magnesium aluminate-based ceramic green sheet, and calcium silicate-based ceramic green sheet.

9. The multilayer ceramic electronic component according to claim 1, characterized in that, The thickness of the ceramic green sheet is 0.1~800 μm.

10. The multilayer ceramic electronic component according to claim 9, characterized in that, The thickness of the ceramic green sheet is 10~200 μm.

11. The multilayer ceramic electronic component according to claim 1, characterized in that, The resin layer is a second polymer film layer.

12. The multilayer ceramic electronic component according to claim 11, characterized in that, The dielectric constant of the second polymer film is 2 to 40.

13. The multilayer ceramic electronic component according to claim 1, characterized in that, In the multilayer ceramic electronic component, any two adjacent circuit layers are connected by metal wires, as are the circuit layers adjacent to solder balls and the solder balls.

14. A fabrication process for a multilayer ceramic electronic component as described in any one of claims 1-13, characterized in that, The preparation process includes the following steps: (1) A circuit layer is formed on one side of a ceramic green sheet by laser sputtering and screen printing, and a resin layer is pressed onto the side of the ceramic green sheet with the circuit layer to obtain a composite layer; (2) Lamination of multiple composite layers to obtain a multilayer ceramic layer; (3) The first insulating dielectric layer and the second insulating dielectric layer are respectively pressed onto both sides of the multilayer ceramic layer, and multiple through holes are obtained by laser drilling. Metal wires are obtained by electrolytic plating on the through holes, and solder balls are obtained by stencil printing at the through holes of the second insulating dielectric layer to obtain the multilayer ceramic electronic component. Alternatively, step (3) can be replaced with (3)' pressing the second insulating dielectric layer onto one side of the multilayer ceramic layer, obtaining multiple through holes by laser drilling, obtaining metal wires by electrolytic plating on the through holes, and obtaining solder balls by stencil printing at the through holes of the second insulating dielectric layer, and then pressing the first insulating dielectric layer onto the side of the multilayer ceramic layer away from the second insulating dielectric layer to obtain the multilayer ceramic electronic component.

15. The preparation process according to claim 14, characterized in that, The pressing temperature in step (1) is 150~200℃.

16. The preparation process according to claim 14, characterized in that, The pressure for pressing in step (1) is 0.1~10MPa.

17. The preparation process according to claim 14, characterized in that, The lamination temperature in step (2) is 150~200℃.

18. The preparation process according to claim 14, characterized in that, The lamination pressure in step (2) is 0.1~10MPa.

19. The preparation process according to claim 14, characterized in that, The pressing temperatures in steps (3) and (3)' are each independently selected from 150~200℃.

20. The preparation process according to claim 14, characterized in that, The pressing pressures in steps (3) and (3)' are each independently selected from 0.1 to 10 MPa.

21. An electronic circuit board, characterized in that, The electronic circuit board includes the multilayer ceramic electronic components as described in any one of claims 1-13; The electronic circuit board includes multilayer ceramic electronic components bonded together and a second metal layer, wherein the second metal layer is disposed on the side of the second insulating dielectric layer away from the multilayer ceramic layer.

22. The electronic circuit board according to claim 21, characterized in that, The electronic circuit board further includes a first metal layer, which is disposed on the side of the first insulating dielectric layer away from the multilayer ceramic layer.

23. A manufacturing process for an electronic circuit board as described in claim 21 or 22, characterized in that, The preparation process includes step (A) or step (B); Step (A) A first metal layer is obtained on the side of the first insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer by electrolytic plating process, and a second metal layer is obtained on the side of the second insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer, thereby obtaining the electronic circuit board; Step (B) involves obtaining a second metal layer on the side of the second insulating dielectric layer of the multilayer ceramic electronic component away from the multilayer ceramic layer through an electrolytic plating process, thereby obtaining the electronic circuit board.

24. The use of a multilayer ceramic electronic component as described in any one of claims 1-13 or an electronic circuit board as described in claim 22 or 23 in antennas, filters, and tubes.

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