Power adapter

Abstract

The present application provides a power adapter, the power adapter includes a housing, a circuit board assembly and a heat dissipation duct, the housing has an air inlet and an air outlet, the circuit board assembly is located inside the housing, the heat dissipation duct is located in the housing and / or the spacing area between the housing and the circuit board assembly, the heat dissipation duct surrounds the circuit board assembly and is connected to the air inlet and the air outlet, and the heat dissipation duct is used to dissipate heat for the housing and / or the circuit board assembly. The technical solution of the present application can improve the thermal conductivity of the power adapter and has good heat dissipation reliability.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a power adapter. Background Art

[0002] With the rapid development of electronic devices such as smart phones and laptops, power adapters are widely used in people's lives and offices as auxiliary devices for power supply voltage conversion. When the adapter is working, the internal electronic components will generate a lot of heat, and heat dissipation must be carried out in time to release the heat inside the adapter. However, the heat dissipation capacity of traditional power adapters is low and the heat dissipation reliability is low. Summary of the invention

[0003] The embodiments of the present application provide a power adapter, which can improve the heat conduction capability of the power adapter and has good heat dissipation reliability.

[0004] An embodiment of the present application provides a power adapter, the power adapter comprising:

[0005] A housing having an air inlet and an air outlet;

[0006] a circuit board assembly, the circuit board assembly being located inside the housing; and

[0007] A heat dissipation duct is located in the housing and / or the spacing area between the housing and the circuit board assembly, the heat dissipation duct surrounds the circuit board assembly and is connected to the air inlet and the air outlet, and the heat dissipation duct is used to dissipate heat for the housing and / or the circuit board assembly.

[0008] It can be understood that the shell has an air inlet and an air outlet, and both the air inlet and the air outlet are connected to the heat dissipation duct. The air inlet can be understood as an opening that allows natural wind to enter the inside of the power adapter from the environment outside the power adapter, and the air outlet can be understood as an opening that allows air carrying the heat of the power adapter to flow from the inside of the power adapter to the external environment. Cold air enters the inside of the power adapter through the air inlet, and in the flow of the heat dissipation duct in the power adapter, it carries the heat generated by the power adapter and becomes hot air. The hot air flows out of the power adapter through the air outlet and flows into the external environment. The cold and hot air circulate alternately and repeatedly to complete the uninterrupted heat exchange between the power adapter and the external environment, ensuring that the power adapter always has good thermal conductivity.

[0009] Therefore, by setting up a heat dissipation duct and making the heat dissipation duct surround the circuit board assembly, the heat dissipation duct can be used as the main heat dissipation structure to fully surround the circuit board assembly. On the one hand, the heat generated at any position of the circuit board assembly can be conducted to the heat dissipation duct, and the heat conducted by the circuit board assembly can be effectively expanded through the air flowing in the heat dissipation duct, thereby reducing the thermal resistance and temperature of the circuit board assembly. On the other hand, the heat dissipation duct can fully exert its temperature equalization effect through direct contact with the shell, so that the temperature difference at various positions of the shell is uniform, thereby making the power adapter as a whole have a good thermal conductivity temperature difference and heat transfer efficiency, and effectively improving the thermal conductivity performance of the power adapter.

[0010] The heat dissipation duct can be arranged in the housing, in the spacing area between the housing and the circuit board assembly, or in the housing and the spacing area between the housing and the circuit board assembly. That is, the heat dissipation duct has a variety of layout schemes, which can be flexibly arranged according to the needs of actual applications. On the one hand, it is conducive to adapting to the heat dissipation needs of the power adapter in multiple scenarios, and the heat dissipation reliability is good. On the other hand, the thermal conductivity of the power adapter can be improved, so that the hot spot temperature of the housing can be greatly reduced under the condition that the power adapter has the same charging power. That is, when the hot spot of the housing under the same conditions is dissipated, that is, when the same heat dissipation target is achieved, the heat dissipation capacity of the power adapter can be greatly improved. It is conducive to better improving the charging power of the power adapter and the user experience.

[0011] In addition, the differentiated layout of the heat dissipation duct enables the heat dissipation duct to have the dual function of dissipating heat for the circuit board assembly and the shell, and can transfer heat from the high-temperature area of ​​the shell to the low-temperature area through forced air cooling, which is beneficial to the temperature uniformity of the shell and improves the user experience. It can also reduce the temperature of the corresponding hot spots inside the power adapter to avoid failure of the power adapter due to local overheating.

[0012] That is, the technical solution of the present application is to provide a heat dissipation duct connected to the air inlet and the air outlet of the shell, and the heat dissipation duct has a variety of layout forms. On the one hand, it can break through the engineering limit of natural heat dissipation in the prior art and improve the heat dissipation capacity of the power adapter. On the other hand, it can further improve the power of the power adapter by optimizing the heat conduction capacity of the power adapter, and improve reliability.

[0013] In a possible implementation, the heat dissipation duct is located in a gap area between the shell and the circuit board assembly, at least a portion of the shell is a double-layer shell structure, the gap area in the double-layer shell structure constitutes a sealed cavity, and the sealed cavity is filled with a cooling medium.

[0014] It is understandable that after the components in the power adapter generate heat and the shell temperature rises, the cooling medium filled in the sealed cavity can circulate rapidly under thermal drive to form heat convection, so that the heat is transferred from the high-temperature area to the low-temperature area, fully ensuring the uniform temperature performance of the shell. Under this setting, the cooling medium filled in the sealed cavity can be used as an auxiliary heat dissipation structure to assist the heat dissipation duct in the power adapter to further improve the heat dissipation performance of the power adapter. On the one hand, it is beneficial to significantly reduce the temperature of the hot spot and protect the internal heating components. On the other hand, when the shell is hit by external force, the gap area in the double-layer shell structure can be used as a buffer to effectively prevent the internal structure of the power adapter from being damaged due to impact, greatly improving the anti-collision ability of the shell, and enabling the shell to meet higher anti-collision level requirements.

[0015] In a possible implementation manner, the shell includes a middle shell and a front cover and a rear cover respectively connected to two ends of the middle shell, and one or more of the middle shell, the front cover and the rear cover is the double-layer shell structure.

[0016] It is understandable that the shell can be a double-layer shell structure in its entirety, that is, the front cover, the back cover and the middle shell are all double-layer shell structures. Alternatively, the shell can also be partially a double-layer shell structure, that is, one or two of the middle shell, the front cover and the back cover are double-layer shell structures. For example, the middle shell is a double-layer shell structure, the middle shell and the front cover are double-layer shell structures, and the middle shell and the back cover are double-layer shell structures. Therefore, at least setting the middle shell to a double-layer shell structure can more effectively disperse and conduct the heat generated by the electronic components on the circuit board, so that the shell is evenly heated, which is beneficial to improving the overall heat dissipation effect of the power adapter and the user experience.

[0017] In a possible implementation manner, the middle shell, the front cover and the rear cover are an integrated structure, or the middle shell and the front cover are an integrated structure, or the middle shell and the rear shell are an integrated structure.

[0018] It is understandable that the front cover, the middle shell and the back cover can be split structures, and can be connected by means of snap-fit, buckling, fixed connection with connectors (such as screws, etc.). Many of the front cover, the middle shell and the back cover can also be integrated structures, for example, the middle shell, the front cover and the back cover are integrated structures, or the middle shell and the front cover are integrated structures, or the middle shell and the back shell are integrated structures. The processing of the integrated structure is relatively simple, which is beneficial to reduce the material processing cost of the power adapter and improve the production efficiency of the power adapter. The materials of the front cover, the middle shell and the back cover can be the same or different. When the various structures of the front cover, the middle shell and the back cover all have a double-layer shell structure, they can have the same double-layer shell structure or different double-layer shell structures. This embodiment does not impose strict restrictions on this.

[0019] In a possible implementation, the shell includes an inner shell and an outer shell disposed outside the inner shell, a gap is provided between the inner shell and the outer shell, and the gap area between the inner shell and the outer shell forms the heat dissipation duct.

[0020] Therefore, the arrangement of the inner shell and the outer shell makes the shell a double-shell structure, and the interval area between the inner shell and the outer shell forms a heat dissipation duct, which can make full use of the structural form of the shell. When the components in the power adapter heat up and the shell heats up, the air can circulate quickly in the heat dissipation duct and take away the heat of the power adapter, fully ensuring the temperature uniformity of the shell. On the one hand, it is helpful to significantly reduce the temperature of the hot spot and protect the internal heating components. On the other hand, when the shell is hit by external force, the gap area between the inner shell and the outer shell can be used as a buffer to effectively prevent the internal structure of the power adapter from being damaged due to the impact, greatly improving the anti-collision ability of the shell, and enabling the shell to meet higher anti-collision level requirements.

[0021] In a possible implementation manner, the thermal conductivity of the inner shell is greater than the thermal conductivity of the outer shell.

[0022] That is, the outer shell can be formed of a material with a relatively low thermal conductivity to keep the touch temperature of the outer shell at an acceptably low level. The inner shell can be formed of a material with a relatively high thermal conductivity to better conduct and disperse the heat inside the adapter, which is conducive to the diffusion of heat from the inside to the outside.

[0023] In a possible implementation manner, the inner wall of the housing is in direct contact with the circuit board assembly; or,

[0024] The inner wall of the housing is connected to the circuit board assembly via a heat-conducting medium; or,

[0025] A gap is formed between the inner wall of the housing and the circuit board assembly.

[0026] In a possible implementation manner, the housing includes a first surface, the first surface is provided with a first receiving groove for receiving the first pin and a second receiving groove for receiving the second pin, and the first receiving groove and the second receiving groove are arranged at intervals;

[0027] The air inlet is arranged on the groove wall of the first receiving groove, and the air outlet is arranged on the groove wall of the second receiving groove.

[0028] It can be understood that cold air enters the heat dissipation duct from the air inlet provided in the first receiving slot and flows in the heat dissipation duct. Since the cold air flows circumferentially in the heat dissipation duct and takes away heat, the cold air flowing in the heat dissipation duct will heat up into hot air. After a circle of flow, the hot air will flow out of the power adapter from the air outlet provided in the second receiving slot, thereby realizing heat exchange and cooling of the power adapter.

[0029] The air inlet and the air outlet are respectively arranged in the first receiving slot and the second receiving slot. On the one hand, the first receiving slot can have the dual functions of receiving the first pin and guiding the cold air to enter the power adapter, and the second receiving slot can have the dual functions of receiving the second pin and guiding the hot air to flow out of the power adapter. On the other hand, it can minimize the problem of the shell being vulnerable to damage and not meeting the appearance specifications of the power adapter due to the additional air inlet and air outlet on the surface of the shell. The ventilation (air inlet and air outlet) of the power adapter can be achieved on the basis of meeting the appearance requirements and safety specifications of the power adapter, and the heat dissipation performance is excellent.

[0030] It should be understood that the size of the first receiving slot is larger than the size of the first pin, so that a space can be reserved for air to enter the power adapter, so that the air can smoothly enter the power adapter. The size of the second receiving slot is larger than the size of the second pin, so that a space can be reserved for air to flow out of the power adapter, so that the air carrying heat can smoothly flow out of the power adapter.

[0031] In a possible implementation manner, the housing includes a first surface and a second surface disposed opposite to each other, the first surface is provided with a first receiving groove for receiving the first pin and a second receiving groove for receiving the second pin, and the first receiving groove and the second receiving groove are spaced apart;

[0032] The air inlet is arranged on the second surface, and the air outlet includes a first sub-air outlet and a second sub-air outlet, the first sub-air outlet is arranged on the groove wall of the first receiving groove, and the second sub-air outlet is arranged on the groove wall of the second receiving groove.

[0033] It can be understood that the cold air enters the heat dissipation duct from the air inlet provided on the second surface and is divided into two parts, one part flows toward the air outlet side of the first receiving slot, and the other part flows toward the air outlet side of the second receiving slot. The two parts of cold air flow in the heat dissipation duct and cooperate to surround the circuit board assembly, thereby cooperating to take away the heat of the power adapter. The cold air flowing in the heat dissipation duct will heat up to hot air, one part flows out of the power adapter from the air outlet provided in the first receiving slot, and the other part flows out of the power adapter from the air outlet provided in the second receiving slot, thereby realizing heat exchange and cooling of the power adapter.

[0034] The air inlet is arranged on the second surface, and the first sub-air outlet and the second sub-air outlet are arranged in the first receiving groove and the second receiving groove respectively, so that the first receiving groove can have the dual functions of accommodating the first pin and guiding the hot air to flow out of the power adapter, and the second receiving groove can have the dual functions of accommodating the second pin and guiding the hot air to flow out of the power adapter, and the heat dissipation performance is excellent.

[0035] It should be understood that the size of the first receiving slot is larger than the size of the first pin, so that a space can be reserved for air to enter the power adapter, so that the air can smoothly enter the power adapter. The size of the second receiving slot is larger than the size of the second pin, so that a space can be reserved for air to flow out of the power adapter, so that the air carrying heat can smoothly flow out of the power adapter.

[0036] In a possible implementation, the power adapter further includes a cooling fan, and at least a portion of the cooling fan is located in the cooling air duct and is disposed close to the air inlet.

[0037] It is understandable that the cooling fan is a power source that enables the air in the cooling air duct to flow, and it is at least partially located in the cooling air duct and arranged near the air inlet, and the cooling fan can be electrically connected to the circuit board assembly. Thus, the air entering the power adapter through the air inlet can flow in the cooling air duct driven by the cooling fan, which is beneficial to improving the fluidity of the air and the heat dissipation performance of the power adapter. Exemplarily, the cooling fan is partially located in the cooling air duct and partially exposed at the air inlet, or the cooling fan is entirely located in the cooling air duct. The cooling fan can be, but is not limited to, a centrifugal fan, an axial flow fan, and a piezoelectric fan.

[0038] In a possible implementation, the power adapter further includes an anti-static structure, at least a portion of the anti-static structure is located at the air inlet and / or the air outlet, and the anti-static structure is electrically connected to the circuit board assembly.

[0039] Therefore, by setting an anti-static structure at the opening of the shell and electrically connecting the anti-static structure to the circuit board, when static electricity is generated, it can be directly conducted to the floor of the circuit board to achieve static electricity shielding and avoid affecting the working performance of the power adapter (such as affecting the pins of conductive metal materials). BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a schematic diagram of the structure of a power adapter provided in an embodiment of the present application;

[0041] Figure 2 is a first cross-sectional schematic diagram of a power adapter provided in the first embodiment of the present application;

[0042] Figure 3is a second cross-sectional schematic diagram of the power adapter provided in the first embodiment of the present application;

[0043] Figure 4 is a third cross-sectional schematic diagram of the power adapter provided in the first embodiment of the present application;

[0044] Figure 5 is a fourth cross-sectional schematic diagram of the power adapter provided in the first embodiment of the present application;

[0045] Figure 6 is a fifth cross-sectional schematic diagram of the power adapter provided in the first embodiment of the present application;

[0046] Figure 7 is a sixth cross-sectional schematic diagram of the power adapter provided in the first embodiment of the present application;

[0047] Figure 8 is a seventh cross-sectional schematic diagram of the power adapter provided in the first embodiment of the present application;

[0048] Fig. 9 is a partial cross-sectional schematic diagram of a power adapter provided in the first embodiment of the present application;

[0049] Fig.10 is a cross-sectional schematic diagram of a power adapter provided in the second embodiment of the present application;

[0050] Fig.11 This is another cross-sectional schematic diagram of the power adapter provided in the second embodiment of the present application. DETAILED DESCRIPTION

[0051] For ease of understanding, the terms involved in the embodiments of the present application are first explained.

[0052] And / or: It is just a way to describe the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0053] Multiple: refers to two or more than two.

[0054] Fixed: should be understood in a broad sense. For example, A is fixed to B. It can be that A and B are directly connected and their relative positions do not change after the connection, or A and B are indirectly connected through an intermediate medium and their relative positions do not change after the connection.

[0055] The specific implementation of the present application will be clearly described below in conjunction with the accompanying drawings.

[0056] The embodiment of the present application provides a power adapter, which can be configured to transmit rated output power (such as 22.5W or 40W) as required, and its volume can be as small as possible when permitted, and can support slow charging and fast charging. The power adapter can be an adapter for a mobile terminal, an adapter for a large household appliance, or an adapter for equipment such as a server or a data center. For example, the power adapter can be, but is not limited to, a mobile phone adapter, a tablet adapter, a laptop adapter, and a car charger.

[0057] In the embodiments of the present application, for ease of understanding, a mobile phone adapter, which is a power adapter with a wide range of users and rich application scenarios, is taken as an example for explanation, but the invention is not limited thereto.

[0058] Please refer to Figure 1-Figure 11 The power adapter 100 includes a housing 10, a plug pin 20, a USB (Universal Serial Bus) interface 30, a circuit board assembly 40, a heat dissipation duct 50 and a heat dissipation fan 60. Figure 1-Figure 11 The arrow in the middle points to the direction of air flow.

[0059] The housing 10 is the outer shell structure of the power adapter 100, which can accommodate and encapsulate various components of the power adapter 100, so that the various components of the power adapter 100 are protected from external dust, water vapor, etc., and have good protection performance. During the use of the power adapter 100, the housing 10 will generate hot spots due to heat accumulation, and because of its appearance structure, it can directly exchange heat with the human body, objects, and the external environment, so the temperature of the housing 10 will also directly affect the working performance and service life of the power adapter 100.

[0060] The pin 20 is an input port of the power adapter 100, which is connected to the housing 10 and can be exposed to the external environment, so that it can be plugged into an external power source to form a reliable electrical connection between the external power source and the power adapter 100, so that the external power source can supply power to the power adapter 100. Specifically, one end of the pin 20 is connected to the housing 10, and the other end of the pin 20 is used to be electrically connected to the external power source. The pin 20 is electrically connected to the circuit board assembly 40 to serve as an electrical conductive component to supply power to the circuit board assembly 40.

[0061] It should be noted that the material, shape, number, size and other specifications of the pins 20 can be set according to actual applications, and the embodiments of the present application do not impose strict restrictions on this. For example, the number of pins 20 can be two, so that the power adapter 100 presents the form of a two-pin plug. The number of pins 20 can also be three, so that the power adapter 100 presents the form of a three-pin plug.

[0062] For example, the pin 20 can be rotatably connected to the housing 10. That is, the pin 20 can be rotated relative to the housing 10, so that when electrical connection is required, the pin 20 is exposed outside the housing 10 and plugged into an external power source. When electrical connection is not required, the pin 20 is accommodated in the housing 10 without occupying more space of the power adapter 100, which is conducive to the storage and miniaturization of the power adapter 100.

[0063] The USB interface 30 is an output port of the power adapter 100, which is provided on the surface of the housing 10 and is electrically connected to the circuit board assembly 40. The USB interface 30 can be connected to the device to be charged. The number of USB interfaces 30 can be selected according to the actual application needs, and it can be one or more. Specifically, when the number of USB interfaces 30 is one, the power adapter 100 is configured to charge one device to be charged. When the number of USB interfaces 30 is multiple, the power adapter 100 is configured to charge multiple devices to be charged at the same time. Of course, other types of interfaces can also be provided on the housing 10 according to application needs, and the embodiments of the present application do not strictly limit this.

[0064] For example, the plug pins 20 and the USB interface 30 may be disposed on two adjacent surfaces of the housing 10 , or the plug pins 20 and the USB interface 30 may also be disposed on two opposite surfaces of the housing 10 .

[0065] The circuit board assembly 40 is a core component of the power adapter 100, which is housed inside the housing 10 and can integrate the various important components of the power adapter 100 together, so as to play their respective roles. The circuit board assembly 40 may include a circuit board 41 and a plurality of electronic components 42 arranged on the circuit board 41. The circuit board 41 may be understood as a carrier of the electronic component 42, which may provide electrical connection, protection, support, heat dissipation, assembly and other functions for the electronic component 42, and may also be used as a heat conductor to conduct the heat of the electronic component 42. The electronic component 42 may be understood as a component that generates heat during the operation of the power adapter 100, which may transfer the heat to the circuit board 41 by being attached to the circuit board 41. Exemplarily, the electronic component 42 may be a chip or a circuit.

[0066] The heat dissipation duct 50 is the main heat dissipation structure of the power adapter 100. Through the good heat dissipation effect of the heat dissipation duct 50, the heat inside the power adapter 100 (such as the heat generated by the circuit board assembly 40) can be timely and effectively dissipated to the external environment and the housing 10 can be cooled, thereby improving the heat dissipation reliability of the power adapter 100 during normal operation. Exemplarily, the heat dissipation duct 50 is located in the housing 10 and / or the spacing area between the housing 10 and the circuit board assembly 40, the heat dissipation duct 50 surrounds the circuit board assembly 40, and the heat dissipation duct 50 is used to dissipate heat for the housing 10 and / or the circuit board assembly 40.

[0067] Therefore, by providing the heat dissipation duct 50 and making the heat dissipation duct 50 surround the circuit board assembly 40, the heat dissipation duct 50 can be used as the main heat dissipation structure to fully surround the circuit board assembly 40. On the one hand, the heat generated at any position of the circuit board assembly 40 can be conducted to the heat dissipation duct 50, and the heat conducted by the circuit board assembly 40 can be effectively expanded through the air flowing in the heat dissipation duct 50, thereby reducing the thermal resistance and temperature of the circuit board assembly 40. On the other hand, the heat dissipation duct 50 can fully exert its temperature equalization effect through the direct contact between the heat dissipation duct 50 and the housing 10, so that the temperature difference at various positions of the housing 10 is uniform, thereby making the power adapter 100 as a whole have a good thermal conductivity temperature difference and heat transfer efficiency, and effectively improving the thermal conductivity performance of the power adapter 100.

[0068] The heat dissipation duct 50 can be arranged in the housing 10, in the spacing area between the housing 10 and the circuit board assembly 40, or in the housing 10 and the spacing area between the housing 10 and the circuit board assembly 40. That is, the heat dissipation duct 50 has a variety of layout schemes and can be flexibly arranged according to the needs of actual applications. On the one hand, it is conducive to adapting to the heat dissipation requirements of the power adapter 100 in multiple scenarios, and the heat dissipation reliability is good. On the other hand, it can improve the thermal conductivity of the power adapter 100, so that under the condition that the power adapter 100 has the same charging power, the hot spot temperature of the housing 10 can be greatly reduced. That is, when the hot spot of the housing 10 under the same conditions is dissipated, that is, when the same heat dissipation target is achieved, the heat dissipation capacity of the power adapter 100 can be greatly improved. It is conducive to better improving the charging power of the power adapter 100 and the user experience.

[0069] In addition, the differentiated layout of the heat dissipation duct 50 enables the heat dissipation duct 50 to have the dual function of dissipating heat for the circuit board assembly 40 and the housing 10, and can conduct heat from the high temperature area of ​​the housing 10 to the low temperature area by forced air cooling, which is beneficial to the temperature uniformity of the housing 10 and improves the user experience. In addition, the temperature of the corresponding hot spot inside the power adapter 100 can be reduced to avoid failure of the power adapter 100 due to local overheating.

[0070] In the embodiment of the present application, the housing 10 has an air inlet 101 and an air outlet 102, and both the air inlet 101 and the air outlet 102 are connected to the heat dissipation duct 50. The air inlet 101 can be understood as an opening that allows natural wind to enter the inside of the power adapter 100 from the environment outside the power adapter 100, and the air outlet 102 can be understood as an opening that allows air carrying the heat of the power adapter 100 to flow from the inside of the power adapter 100 into the external environment. Cold air enters the inside of the power adapter 100 through the air inlet 101, and in the flow of the heat dissipation duct 50 in the power adapter 100, it carries the heat generated by the power adapter 100 and becomes hot air. The hot air flows out of the power adapter 100 through the air outlet 102 and flows into the external environment. The cold and hot air circulate alternately and repeatedly to complete the uninterrupted heat exchange between the power adapter 100 and the external environment, ensuring that the power adapter 100 always has good thermal conductivity.

[0071] Exemplarily, the air inlet 101 and the air outlet 102 can be arranged on the same surface of the housing 10, or the air inlet 101 and the air outlet 102 can also be arranged on different surfaces of the housing 10 (such as two surfaces arranged opposite to each other), and it is only necessary to ensure that the air can take away the heat of the circuit board assembly 40 and the housing 10 when flowing in the heat dissipation duct 50. The air inlet 101 and the air outlet 102 can be set as a groove structure as needed, or the air inlet 101 and the air outlet 102 can also be designed as a hole structure as needed, and the embodiments of the present application do not strictly limit this. In addition, the power adapter 100 may also include an anti-static structure, at least part of which is located at the air inlet 101 and / or the air outlet 102, and the anti-static structure is electrically connected to the circuit board assembly 40 (such as the ground of the circuit board 41). Therefore, by providing an antistatic structure at the opening of the housing 10 and electrically connecting the antistatic structure to the circuit board 41, when static electricity is generated, the static electricity can be directly conducted to the floor of the circuit board 41 to achieve static shielding and avoid affecting the working performance of the power adapter 100 (such as affecting the pins 20 made of conductive metal). Alternatively, the outer surface of the housing 10 can be covered with a layer of antistatic film to achieve static shielding.

[0072] The cooling fan 60 is a power source that enables the air in the cooling air duct 50 to flow. It is at least partially located in the cooling air duct 50 and is arranged near the air inlet 101. The cooling fan 60 can be electrically connected to the circuit board assembly 40. As a result, the air entering the power adapter 100 through the air inlet 101 can flow in the cooling air duct 50 driven by the cooling fan 60, which is beneficial to improving the fluidity of the air and the heat dissipation performance of the power adapter 100. Exemplarily, the cooling fan 60 is partially located in the cooling air duct 50 and partially exposed at the air inlet 101, or the cooling fan 60 is entirely located in the cooling air duct 50. The cooling fan 60 can be, but is not limited to, a centrifugal fan, an axial flow fan, and a piezoelectric fan.

[0073] It should be noted that Figure 1-Figure 11 The purpose is only to schematically describe the connection relationship between the housing 10, the pin 20, the USB interface 30, the circuit board assembly 40, the heat dissipation duct 50 and the heat dissipation fan 60, and it does not specifically limit the connection position, specific structure and quantity of each device. The structure illustrated in the embodiment of the present application does not constitute a specific limitation on the power adapter 100. In other embodiments of the present application, the power adapter 100 may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or arrange the components differently. The illustrated components can be implemented in hardware, software, or a combination of software and hardware.

[0074] It is understandable that during the operation of the power adapter 100, the electronic component 42, as a heating element, will generate a large amount of heat, thereby forming a hot spot at the corresponding position inside the power adapter 100. The temperature of the hot spot is relatively high. If the heat generated by the hot spot is not effectively dissipated in time, it will directly affect the working performance of the power adapter 100. For example, if the heat is locally overheated, the power adapter 100 will fail. In addition, the temperature of the shell 10 at the corresponding position of the hot spot will also be relatively high, resulting in local overheating of the shell 10, seriously affecting the user experience. In other words, the heat balance of the power adapter 100 will directly affect the working performance of the power adapter 100. This type of hot spot problem is particularly prominent in small-sized, high-power power adapters 100, thus limiting the power increase and miniaturization development trend of the power adapter 100.

[0075] Therefore, the embodiment of the present application provides a heat dissipation duct 50 connected to the air inlet 101 and the air outlet 102 of the housing 10, and the heat dissipation duct 50 has a variety of layout forms. On the one hand, it can break through the engineering limit of natural heat dissipation in the prior art and improve the heat dissipation capacity of the power adapter 100. On the other hand, it can further improve the power of the power adapter 100 by optimizing the thermal conductivity of the power adapter 100, and the reliability is good.

[0076] The following will use two specific embodiments to illustrate the structure, connection position and connection relationship of the housing 10, the circuit board assembly 40 and the heat dissipation duct 50 to illustrate the structural possibilities of the power adapter 100. It should be noted that the following will only take the heat dissipation duct 50 located in the housing 10 and in the interval area between the circuit board 41 and the housing 10 as an example for illustration, but the heat dissipation duct 50 can also be located in the housing 10 or in the interval area between the circuit board 41 and the housing 10, and is not limited to this.

[0077] First embodiment:

[0078] Please refer to Figure 1-Figure 8 In the first embodiment of the present application, the heat dissipation duct 50 is located in the interval area between the housing 10 and the circuit board assembly 40. That is, the heat dissipation duct 50 is annular and is circumferentially arranged around the circuit board assembly 40. The heat dissipation duct 50 is annular and can also be fully in contact with the inner surface of the housing 10 (that is, the surface of the housing 10 that is not exposed to the external environment), ensuring that all positions of the housing 10 can achieve heat exchange and cooling with the heat dissipation duct 50.

[0079] Therefore, when air flows in the heat dissipation duct 50 , it can pass between the housing 10 and the circuit board assembly 40 , and remove the heat of the circuit board assembly 40 and the housing 10 by air cooling, thereby improving the heat dissipation reliability.

[0080] Exemplarily, there are two pins 20, namely a first pin 21 and a second pin 22. The first pin 21 and the second pin 22 can rotate relative to the housing 10 so as to protrude relative to the housing 10 when electrical connection is required, and be received in the housing 10 when electrical connection is not required.

[0081] Specifically, the housing 10 includes a first surface 103 and a second surface 104 disposed opposite to each other, the first surface 103 is provided with a first receiving groove 107 and a second receiving groove 108 disposed at intervals, and the second surface 104 is provided with a USB interface 30. The first receiving groove 107 is used to receive the first plug pin 21, and the second receiving groove 108 is used to receive the second plug pin 22. The first plug pin 21 and the second plug pin 22 protrude relative to the housing 10 when an electrical connection with an external power source is required, and are respectively received in the first receiving groove 107 and the second receiving groove 108 when an electrical connection with an external power source is not required.

[0082] Therefore, by configuring the accommodation space for the pins 20 on the housing 10 , the space occupied by the power adapter 100 can be saved, which is beneficial to the miniaturization development trend of the power adapter 100 .

[0083] Please refer to Figure 1 and Figure 2In a possible implementation manner, the air inlet 101 is provided on the groove wall of the first receiving groove 107, and the air inlet 101 is communicated with the heat dissipation duct 50. The air outlet 102 is provided on the groove wall of the second receiving groove 108, and the air outlet 102 is communicated with the heat dissipation duct 50. That is, the groove wall of the first receiving groove 107 is provided with the air inlet 101, and the groove wall of the second receiving groove 108 is provided with the air outlet 102. Exemplarily, the air inlet 101 can be provided near the connection between the first pin 21 and the housing 10, and the air outlet 102 can be provided near the connection between the second pin 22 and the housing 10. The positions of the air inlet 101 and the air outlet 102 can be provided on the groove wall of the first receiving groove 107 and the groove wall of the second receiving groove 108, and this embodiment does not impose strict restrictions on this.

[0084] It can be understood that cold air enters the heat dissipation duct 50 from the air inlet 101 provided in the first receiving groove 107 and flows in the heat dissipation duct 50. Since the cold air flows circumferentially in the heat dissipation duct 50 and takes away heat, the cold air flowing in the heat dissipation duct 50 will be heated up to become hot air. After a circle of flow, the hot air will flow out of the power adapter 100 from the air outlet 102 provided in the second receiving groove 108, thereby realizing heat exchange and cooling of the power adapter 100.

[0085] The air inlet 101 and the air outlet 102 are respectively arranged in the first receiving groove 107 and the second receiving groove 108. On the one hand, the first receiving groove 107 can have the dual functions of receiving the first pin 21 and guiding the cold air to enter the inside of the power adapter 100, and the second receiving groove 108 can have the dual functions of receiving the second pin 22 and guiding the hot air to flow out of the power adapter 100. On the other hand, the problem of the shell 10 being vulnerable to damage and not meeting the appearance specifications of the power adapter 100 due to the additional arrangement of the air inlet 101 and the air outlet 102 on the surface of the shell 10 can be minimized, and the ventilation (air inlet and air outlet) of the power adapter 100 can be achieved on the basis of meeting the appearance requirements and safety specifications of the power adapter 100, and the heat dissipation performance is excellent.

[0086] It should be understood that the size of the first receiving slot 107 is larger than the size of the first pin 21, so that a space can be reserved for air to enter the power adapter 100, so that the air can smoothly enter the inside of the power adapter 100. The size of the second receiving slot 108 is larger than the size of the second pin 22, so that a space can be reserved for air to flow out of the power adapter 100, so that the air carrying heat can smoothly flow out of the power adapter 100. Of course, the number of pins 20 can also be three or more, and the air inlet 101 and the air outlet 102 can be set on the slot wall of the receiving slot that accommodates different pins 20, and there is no strict restriction on this.

[0087] In this embodiment, the cooling fan 60 can be completely located in the cooling air duct 50, which can be located as follows: Figure 2 Of course, the position of the cooling fan 60 is not limited to Figure 2 The positions shown can all be provided with cooling fans 60 at positions that can provide power for the air entering the cooling air duct 50 through the air inlet 101 to flow. The number of cooling fans 60 can be one or more, and there is no strict limitation on this.

[0088] Please refer to Figure 1 and Figure 3 In another possible embodiment, the air inlet 101 is provided on the second surface 104 and is spaced apart from the USB interface 30, and the air inlet 101 is communicated with the heat dissipation duct 50. The air outlet 102 includes a first sub-air outlet 1021 and a second sub-air outlet 1022. The first sub-air outlet 1021 is provided on the groove wall of the first receiving groove 107, and the first sub-air outlet 1021 is communicated with the heat dissipation duct 50. The second sub-air outlet 1022 is provided on the groove wall of the second receiving groove 108, and the second sub-air outlet 1022 is communicated with the heat dissipation duct 50. That is, the second surface 104 is provided with the air inlet 101, the groove wall of the first receiving groove 107 is provided with the first sub-air outlet 1021, and the groove wall of the second receiving groove 108 is provided with the second sub-air outlet 1022.

[0089] It can be understood that the cold air enters the heat dissipation duct 50 from the air inlet 101 provided on the second surface 104 and is divided into two parts, one part flows toward the first sub-air outlet 1021 side of the first receiving slot 107, and the other part flows toward the second sub-air outlet 1022 side of the second receiving slot 108. The two parts of cold air flow in the heat dissipation duct 50 and cooperate to surround the circuit board assembly 40, thereby taking away the heat of the power adapter 100. The cold air flowing in the heat dissipation duct 50 will heat up to hot air, one part flows out of the power adapter 100 from the first sub-air outlet 1021 provided in the first receiving slot 107, and the other part flows out of the power adapter 100 from the second sub-air outlet 1022 provided in the second receiving slot 108, thereby realizing heat exchange and cooling of the power adapter 100.

[0090] The air inlet 101 is arranged on the second surface 104, and the first sub-air outlet 1021 and the second sub-air outlet 1022 are respectively arranged in the first receiving groove 107 and the second receiving groove 108, so that the first receiving groove 107 can have the dual functions of accommodating the first pin 21 and guiding the hot air to flow out of the power adapter 100, and the second receiving groove 108 can have the dual functions of accommodating the second pin 22 and guiding the hot air to flow out of the power adapter 100, and the heat dissipation performance is excellent.

[0091] It should be understood that the size of the first receiving slot 107 is larger than the size of the first pin 21, so that a space can be reserved for air to enter the power adapter 100, so that the air can smoothly enter the inside of the power adapter 100. The size of the second receiving slot 108 is larger than the size of the second pin 22, so that a space can be reserved for air to flow out of the power adapter 100, so that the air carrying heat can smoothly flow out of the power adapter 100. Of course, the number of pins 20 can also be three or more, and the first sub-air outlet 1021 and the second sub-air outlet 1022 can be set on the slot wall of the receiving slot that accommodates different pins 20, and there is no strict restriction on this.

[0092] See also Figure 4 In another possible embodiment, the housing 10 further includes a third surface 105 and a fourth surface 106 connected between the first surface 103 and the second surface 104, and the third surface 105 and the fourth surface 106 are arranged opposite to each other. The air inlet 101 is arranged on the second surface 104 and is spaced apart from the USB interface 30, and the air inlet 101 is connected to the heat dissipation duct 50. The air outlet 102 includes a first sub-air outlet 1021 and a second sub-air outlet 1022. The first sub-air outlet 1021 and the second sub-air outlet 1022 are respectively arranged at the connection between the third surface 105 and the first surface 103 and the connection between the fourth surface 106 and the first surface 103, and the first sub-air outlet 1021 and the second sub-air outlet are connected to the heat dissipation duct 50. That is, the second surface 104 is provided with an air inlet 101 , the connection between the third surface 105 and the first surface 103 is provided with a first sub-air outlet 1021 , and the fourth surface 106 and the first surface 103 are also provided with a second sub-air outlet 1022 .

[0093] Based on the above description, it should be understood that the settings of the air inlet 101 and the air outlet 102 have various possibilities, and the layout scheme of the air inlet 101 and the air outlet 102 is not limited to the scheme described above. The layout scheme that allows the air entering the heat dissipation channel to surround the circuit board assembly 40 is sufficient, and this embodiment does not impose strict restrictions on this.

[0094] In this embodiment, the housing 10 may be Figure 2-Figure 4 The solid shell 10 structure shown, or the shell 10 can also be as shown Figure 5-Figure 8 The structure of the hollow shell 10 shown can be designed according to actual needs.

[0095] Please refer to Figure 2 , Figure 3 and Figure 4 In a possible implementation, the housing 10 is a solid housing structure. Thus, the housing 10 has high strength and can reduce the possibility of damage caused by mechanical impact to a minimum.

[0096] Please refer to Figure 5 , Figure 6 , Figure 7 and Figure 8 In another possible embodiment, at least part of the housing 10 is a double-shell structure, and the gap region in the double-shell structure constitutes a sealed cavity 11, and the sealed cavity 11 is filled with a cooling medium. The double-shell structure can be understood as the housing 10 having two layered shell structures, and a gap is provided between the two layered shell structures.

[0097] It should be understood that the cooling medium can be a single substance, or the cooling medium can be a combination of multiple substances. The cooling medium can have a higher boiling point (such as greater than or equal to 100°C), so as to effectively avoid the adverse effects caused by the boiling and vaporization of the liquid, and improve the working performance and safety performance of the power adapter 100 in extreme environments (such as high temperatures). For example, for areas with high ambient temperatures, a cooling medium with a relatively higher boiling point can be selected. For areas with low ambient temperatures, a cooling medium with a relatively low boiling point can be selected. The cooling medium can also have a lower freezing point (such as less than or equal to 0°C), so as to effectively avoid the adverse effects caused by the solidification of the cooling medium, and improve the storage of the power adapter 100 in extreme environments (such as low temperatures), as well as the effectiveness and safety of use. For example, for areas with high ambient temperatures, the liquid can be a liquid with a relatively higher freezing point. For areas with low ambient temperatures, the liquid should be a liquid with a relatively lower freezing point that is not easy to freeze.

[0098] Exemplarily, the cooling medium may include a combination of one or more of antifreeze, water, methanol, ethanol, ethylene glycol, propylene glycol, glycerol, lubricating oil, sugar and honey.

[0099] The amount of cooling medium filled will affect the heat conduction efficiency, thus affecting the temperature equalization effect. Too little filling will limit the amount of heat transferred. Therefore, in order to better utilize the cooling medium to achieve the temperature equalization effect, the filling volume of the cooling medium can be greater than or equal to 80% of the total volume of the sealed cavity 11. That is, the volume of the cooling medium accounts for a proportion of greater than or equal to 80% of the total volume of the sealed cavity 11.

[0100] Thus, the circulating flow of the cooling medium can be better utilized to achieve uniform temperature, thereby avoiding adverse effects caused by violent shaking of the cooling medium in the sealed cavity 11 due to a small amount of the cooling medium.

[0101] See also Fig. 9, the gap width W of the gap area in the double shell structure may be less than or equal to 40% of the total thickness H of the shell 10. For example, the gap width W is 5%-30% of the total thickness H of the shell 10, or the gap width W is 10%-25% of the total thickness H of the shell 10, or the gap width W is 10%-20% of the total thickness H of the shell 10. Exemplarily, the gap width W may be less than or equal to 1 mm. The total thickness H of the shell 10 may be in the range of 1 mm-2 mm.

[0102] Therefore, setting the gap width W of the gap area in the double-shell structure to a suitable size can, on the one hand, ensure the overall strength requirement of the shell 10, so that the shell 10 has a certain impact resistance. On the other hand, it can better ensure that the cooling medium in the shell 10 has a sufficient volume and effectively play its temperature equalization role.

[0103] It is understandable that after the components in the power adapter 100 generate heat and the shell 10 is heated up, the cooling medium filled in the sealed cavity 11 can circulate rapidly under thermal drive to form heat convection, so that the heat is transferred from the high-temperature area to the low-temperature area, fully ensuring the temperature uniformity of the shell 10. Under this setting, the cooling medium filled in the sealed cavity 11 can be used as an auxiliary heat dissipation structure to assist the heat dissipation duct 50 in the power adapter 100, further improving the heat dissipation performance of the power adapter 100. On the one hand, it is beneficial to significantly reduce the temperature of the hot spot and protect the internal heating components. On the other hand, when the shell 10 is hit by an external force, the gap area in the double-layer shell structure can be used as a buffer to effectively prevent the internal structure of the power adapter 100 from being damaged due to the impact, which greatly improves the anti-collision ability of the shell 10 and enables the shell 10 to meet higher anti-collision level requirements.

[0104] It should be noted that the sealed cavity 11 can be a vacuum environment or a non-vacuum environment as long as it can adapt to the circulation flow of the cooling medium, and this embodiment does not impose strict restrictions on this.

[0105] Please refer to Figure 5 , Figure 6 , Figure 7 and Figure 8 In a possible embodiment, the housing 10 includes a middle shell 12 and a front cover 13 and a rear cover 14 respectively connected to both ends of the middle shell 12. The middle shell 12, the front cover 13 and the rear cover 14 enclose a receiving space, and the circuit board assembly 40 is located inside the receiving space, wherein the middle shell 12 is arranged around the circuit board assembly 40, which is the part directly affected by the heat generated by the electronic components 42 on the circuit board 41, and is also the main contact part when the user uses the power adapter 100. For example. The pin 20 can be arranged on the front cover 13, and the USB interface 30 can be arranged on the rear cover 14.

[0106] The housing 10 may be a double-shell structure. Figure 5 The front cover 13, the rear cover 14 and the middle shell 12 are all double-layer shell structures. Alternatively, the shell 10 can also be partially double-layer shell structure, that is, Figure 6 , Figure 7 and Figure 8 One or two of the middle shell 12, front cover 13 and rear cover 14 shown are double-layer shell structures. Figure 6 The middle shell 12 shown is a double shell structure. Figure 7 The middle shell 12 and the front cover 13 shown are double-layer shell structures. Figure 8 The middle shell 12 and the back cover 14 are shown as double-layer shell structures. Therefore, at least the middle shell 12 is set as a double-layer shell structure, which can more effectively disperse and conduct the heat generated by the electronic components 42 on the circuit board 41, so that the shell 10 is evenly heated, which is beneficial to improving the overall heat dissipation effect of the power adapter 100 and the user experience.

[0107] It should be understood that the front cover 13, the middle shell 12 and the back cover 14 can be split structures, and can be connected by means of snap-fit, buckling, fixed connection with connectors (such as screws, etc.). Many of the front cover 13, the middle shell 12 and the back cover 14 can also be an integrated structure, for example, the middle shell 12, the front cover 13 and the back cover 14 are an integrated structure, or the middle shell 12 and the front cover 13 are an integrated structure, or the middle shell 12 and the back cover are an integrated structure. The processing of the integrated structure is relatively simple, which is conducive to reducing the material processing cost of the power adapter 100 and improving the production efficiency of the power adapter 100. The materials of the front cover 13, the middle shell 12 and the back cover 14 can be the same or different. When the various structures of the front cover 13, the middle shell 12 and the back cover 14 all have a double-layer shell structure, they can have the same double-layer shell structure or different double-layer shell structures, and this embodiment does not impose strict restrictions on this.

[0108] Second embodiment:

[0109] Please refer to Figure 1 , Fig.10 and Fig.11 In the second embodiment of the present application, the structure of the power adapter 100 in the first embodiment can be applied to the structure of the power adapter 100 in the second embodiment described below without conflict. In this embodiment, the same contents as those in the first embodiment are not repeated. The difference from the first embodiment is that the heat dissipation duct 50 is located in the housing 10.

[0110] The shell 10 includes an inner shell 15 and an outer shell 16 arranged outside the inner shell 15, there is a gap between the inner shell 15 and the outer shell 16, and the gap area between the inner shell 15 and the outer shell 16 forms a heat dissipation duct 50, wherein the air inlet 101 and the air outlet 102 are both opened in the outer shell 16.

[0111] Thus, the arrangement of the inner shell 15 and the outer shell 16 makes the shell 10 a double-shell structure, and the spacing area between the inner shell 15 and the outer shell 16 forms a heat dissipation duct 50, which can make full use of the structural form of the shell 10. When the components in the power adapter 100 heat up and the shell 10 heats up, the air can circulate quickly in the heat dissipation duct 50, and take away the heat of the power adapter 100, so as to fully ensure the temperature uniformity of the shell 10. On the one hand, it is helpful to significantly reduce the temperature of the hot spot and protect the internal heating components. On the other hand, when the shell 10 is hit by an external force, the gap area between the inner shell 15 and the outer shell 16 can be used as a buffer, effectively preventing the internal structure of the power adapter 100 from being damaged due to the impact, greatly improving the anti-collision ability of the shell 10, and enabling the shell 10 to meet higher anti-collision level requirements.

[0112] It should be noted that the materials of the outer shell 16 and the inner shell 15 can be the same or different, and this embodiment does not impose a strict limitation on this. The difference in the materials of the outer shell 16 and the inner shell 15 will be described in detail below.

[0113] Exemplarily, the material of the outer shell 16 may include one or more hard plastics. The hard plastic may be, but is not limited to, polycarbonate (PC), polyvinyl chloride (PVC), polyolefin, polyphenylene ether, polysulfone, epoxy resin, phenolic resin, amino resin, silicone ether resin, and polyamide. Hard plastic has a low thermal conductivity, which is conducive to keeping the temperature of the outer surface of the outer shell 16 at a low level, thereby improving the temperature experience of the user when holding the power adapter 100. At the same time, hard plastic has low cost and is easy to shape, which can better match the requirements of adapters of different models and shapes. Hard plastic also has a high shape retention ability, which can effectively avoid deformation of the shell 10 due to impact, falling, etc., which affects the appearance of the adapter and the stability of internal electronic components.

[0114] The material of the inner shell 15 may include one or more deformable flexible materials, such as rubber or resin. The deformable flexible material can alleviate the force exerted by air flow on the shell 10, improve the structural stability of the shell 10, and also provide a buffer space for impact.

[0115] In this embodiment, in order to improve the heat dissipation performance of the housing 10, the thermal conductivity of the inner shell 15 may be greater than that of the outer shell 16. That is, the outer shell 16 may be formed of a material with a relatively low thermal conductivity to keep the external touch temperature of the housing 10 at an acceptable low level. The inner shell may be formed of a material with a relatively high thermal conductivity, which can better disperse the heat conduction inside the adapter and facilitate the diffusion of heat from the inside to the outside.

[0116] Exemplarily, the inner shell 15 may include one or more phase change materials (PCM, Phase Change Material), which may be organic phase change materials with heat storage function, such as paraffin, polyols, fatty acids (such as acetic acid), or inorganic phase change materials with heat storage function, such as low melting point metals, alloys, hydrated salts, molten salts, and ionic liquids. Phase change material refers to a substance that changes the state of matter and can provide latent heat without changing the temperature, and the process of changing its physical properties is called a phase change process. During the phase change process, the phase change material will absorb or release a large amount of latent heat. The phase change material has a phase change function, and can store heat energy after absorbing it, keeping its own temperature unchanged, thereby delaying the temperature rise time of the shell 10, optimizing product performance, and improving user experience.

[0117] Taking the phase change material that changes from solid to liquid as an example, when the power adapter 100 is working, the phase change material absorbs and stores heat energy, and then gradually changes from solid to liquid with a constant temperature. When the power adapter 100 is not working, the heat stored in the phase change material is released and then changes from liquid to solid. After the phase change material absorbs heat energy, the temperature is constant and the phase state is changed.

[0118] In this embodiment, the thickness of the outer shell 16 can be greater than the thickness of the inner shell 15. The outer shell 16 is the main layer structure that provides strength to the shell 10. A relatively large thickness can better ensure the strength of the shell 10 and improve the anti-collision performance of the shell 10. The inner shell 15 is the inner layer structure that defines the heat dissipation duct 50. It can be relatively thin. The total thickness of the shell 10 can be reduced as much as possible while ensuring safe use, thereby reducing the overall size of the power adapter 100 and meeting the needs of miniaturization of the adapter. Of course, the thickness of the outer shell 16 can also be equal to the thickness of the inner shell 15, or the thickness of the outer shell 16 can also be less than the thickness of the inner shell 15. This embodiment does not impose strict restrictions on this.

[0119] The appearance structure of the outer shell 16 can be the same as that of the inner shell 15, for example, both are rectangular. Alternatively, the appearance structure of the outer shell 16 can be different from that of the inner shell 15, for example, the appearance structure of the outer shell 16 is rectangular, while the appearance structure of the inner shell 15 is elliptical. The overall outer contour of the housing 10 can be a rectangular body or a quasi-rectangular body structure, or other shapes and structures, which are not strictly limited in this embodiment and can be determined according to the product appearance design requirements of the power adapter 100.

[0120] In this embodiment, the inner wall of the housing 10 (i.e., the surface of the inner shell 15 facing away from the outer shell 16) and the circuit board assembly 40 may be directly contacted or connected via a heat-conducting medium, or there may be a certain gap between the two. Exemplarily, the heat-conducting medium may be a heat-conducting glue, a heat-conducting pad, a heat-conducting gasket, or a heat-conducting carbon fiber.

[0121] In a possible implementation, in order to further improve the effects of temperature uniformity and heat dissipation, a heat sink that is conducive to temperature uniformity and heat dissipation may be further provided on the circuit board assembly 40. The heat sink may be provided corresponding to the electronic component 42 on the circuit board 41, for example, it may be attached to the surface of the electronic component 42. The specific structural form of the heat sink is not limited, as long as it can achieve the effect of temperature uniformity and heat dissipation. For example, the heat sink may be a heat-conducting metal foil, such as copper foil.

[0122] In another possible implementation, in order to further improve the heat dissipation effect, the inner wall of the housing 10 (such as the inner shell 15 and / or the outer shell 16) may be set to a rough surface or an uneven structure to better absorb heat and dissipate heat, thereby enhancing the heat dissipation effect. For example, the inner wall of the housing 10 may be provided with heat dissipation fins.

[0123] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A mobile terminal power adapter, characterized in that: The mobile terminal power adapter comprises: USB interface; A housing, wherein a receiving groove for receiving a pin is provided on the surface of the housing, the receiving groove comprises a first receiving groove for receiving a first pin and a second receiving groove for receiving a second pin, the first receiving groove and the second receiving groove are arranged on the same side and at intervals, the USB interface is arranged on the surface of the housing and is used to connect with a device to be charged, the USB interface and the receiving groove are arranged on two adjacent surfaces or two opposite surfaces of the housing, the housing has an air inlet and an air outlet, the air inlet is arranged on the groove wall of the first receiving groove, the air inlet is the gap area between the first receiving groove and the first pin, the air outlet is arranged on the groove wall of the second receiving groove, the air outlet is the gap area between the second receiving groove and the second pin, and the housing is a closed housing except for the receiving groove and the USB interface; A circuit board assembly, the circuit board assembly is located inside the housing and is electrically connected to the USB interface; A heat dissipation duct, wherein the heat dissipation duct is located in the spacing area between the shell and / or the shell and the circuit board assembly, the heat dissipation duct is arranged around the outer edge of the circuit board assembly along the circumference of the circuit board assembly, the heat dissipation duct surrounds the circuit board assembly and is connected to the air inlet and the air outlet, and the heat dissipation duct is used to dissipate heat for the shell and / or the circuit board assembly.

2. The mobile terminal power adapter according to claim 1, characterized in that: The housing comprises a first surface and a second surface which are arranged opposite to each other, the first surface is provided with the first receiving groove and the second receiving groove, and the USB interface is arranged on the second surface.

3. The mobile terminal power adapter according to claim 2, characterized in that: The mobile terminal power adapter also includes a cooling fan, which is located in the cooling air duct and is arranged close to the air inlet.

4. The mobile terminal power adapter according to any one of claims 1 to 3, characterized in that: The heat dissipation duct is located in the spacing area between the shell and the circuit board assembly. At least a part of the shell is a double-layer shell structure. The gap area in the double-layer shell structure constitutes a sealed cavity, and the sealed cavity is filled with a cooling medium.

5. The mobile terminal power adapter according to claim 4, characterized in that: The shell includes a middle shell and a front cover and a rear cover respectively connected to two ends of the middle shell, and one or more of the middle shell, the front cover and the rear cover are of the double-layer shell structure.

6. The mobile terminal power adapter according to claim 5, characterized in that: The middle shell, the front cover and the rear cover are an integrated structure, or the middle shell and the front cover are an integrated structure, or the middle shell and the rear cover are an integrated structure.

7. The mobile terminal power adapter according to any one of claims 1 to 3, characterized in that: The shell comprises an inner shell and an outer shell arranged outside the inner shell, a gap is provided between the inner shell and the outer shell, and the gap area between the inner shell and the outer shell forms the heat dissipation duct.

8. The mobile terminal power adapter according to claim 7, characterized in that: The thermal conductivity of the inner shell is greater than the thermal conductivity of the outer shell.

9. The mobile terminal power adapter according to claim 7, characterized in that: The inner wall of the housing is in direct contact with the circuit board assembly; or, The inner wall of the housing is connected to the circuit board assembly via a heat-conducting medium; or, A gap is formed between the inner wall of the housing and the circuit board assembly.

10. The mobile terminal power adapter according to any one of claims 1-3, 5-6, 8-9, characterized in that: The mobile terminal power adapter further includes an anti-static structure, at least a portion of which is located at the air inlet and / or the air outlet, and the anti-static structure is electrically connected to the circuit board assembly.

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