electronic control device

Abstract

An electronic control device (100) includes a non-conductive resin case (7), a circuit board (5), a metal case (6), a waterproof sealing material (9), and an adhesive (1) having conductivity. The circuit board (5) has a circuit ground (GND pattern (4)) and is held on the resin case (7). The metal case (6) covers the circuit board (5) and is mounted on the resin case (7). The waterproof sealing material (9) seals the resin case (7) and the metal case (6) and performs waterproofing. The adhesive (1) having conductivity is in contact with the metal case (6) and the circuit ground, and electrically connects the metal case (6) and the circuit ground at multiple sites.

Description

Technical Field

[0001] This invention relates to electronic control devices. Background Technology

[0002] In recent years, for the purpose of vehicle weight reduction, automotive electronic control devices have been undergoing development towards direct mounting structures that shorten the length of connecting cables between control devices and sensors or actuators, and resin-based housings (for example, see Patent Document 1). Direct mounting structures for automotive electronic control devices include direct mounting to the engine block and direct mounting to the transmission. Resin-based housings aim to achieve weight reduction by replacing the previously widely used, high-density metal materials with resin materials.

[0003] Here, when the assembly workers are energized, there is a concern that static electricity may be applied to the electronic components through the housing of the electronic control unit and cause damage to the electronic components when the electronic control unit is installed on the vehicle.

[0004] Patent document 1 describes a structure that achieves grounding by providing a convex structure from a metal casing and bringing it close to the circuit board.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2019-133858 Summary of the Invention

[0008] The technical problem that the invention aims to solve

[0009] In the electronic control device disclosed in Patent Document 1, when there is space between the convex structure of the metal casing and the circuit board, there is a problem of increased impedance and deteriorated noise resistance.

[0010] The purpose of this invention is to provide an electronic control device capable of discharging static electricity applied to a metal casing to the circuit ground with low impedance.

[0011] Technical means for solving technical problems

[0012] To achieve the above objectives, the electronic control device of the present invention includes: a non-conductive resin housing; a circuit board having a circuit ground and held on the resin housing; a conductive metal housing covering the circuit board and mounted on the resin housing; a waterproof sealing material that seals the resin housing and the metal housing and is waterproof; and a conductive adhesive that contacts the metal housing and the circuit ground, electrically connecting the metal housing and the circuit ground at multiple locations.

[0013] Invention Effects

[0014] According to the present invention, static electricity applied to a metal casing can be discharged to the circuit ground with low impedance. Other problems, structures, and effects beyond those described above become clearer through the following embodiments. Attached Figure Description

[0015] Figure 1 This is a schematic perspective view of a transmission equipped with electronic control devices.

[0016] Figure 2 This is a perspective view of the electronic control device according to an embodiment of the present invention.

[0017] Figure 3 This is an example of an exploded perspective view of an electronic control device according to an embodiment of the present invention.

[0018] Figure 4A This is a top view of the electronic control device of Comparative Example 1.

[0019] Figure 4B yes Figure 4A A cross-sectional view of the electronic control device shown.

[0020] Figure 5A This is a top view of the electronic control device of Comparative Example 2.

[0021] Figure 5B yes Figure 5A A cross-sectional view of the electronic control device shown.

[0022] Figure 6A This is a top view of the electronic control device according to Embodiment 1 of the present invention.

[0023] Figure 6B yes Figure 6A A cross-sectional view of the electronic control device shown.

[0024] Figure 7A This is a top view of the electronic control device according to Embodiment 2 of the present invention.

[0025] Figure 7B yes Figure 7A A cross-sectional view of the electronic control device shown.

[0026] Figure 8A This is a top view of the electronic control device according to Embodiment 3 of the present invention.

[0027] Figure 8B yes Figure 8A A cross-sectional view of the electronic control device shown.

[0028] Figure 9AThis is a top view of the electronic control device according to Embodiment 4 of the present invention.

[0029] Figure 9B yes Figure 9A A cross-sectional view of the electronic control device shown.

[0030] Figure 10A This is a top view of the electronic control device according to Embodiment 5 of the present invention.

[0031] Figure 10B yes Figure 10A A cross-sectional view of the electronic control device shown.

[0032] Figure 11A This is a top view of the electronic control device according to Embodiment 6 of the present invention.

[0033] Figure 11B yes Figure 11A A cross-sectional view of the electronic control device shown.

[0034] Figure 12A This is a top view of the electronic control device according to Embodiment 7 of the present invention.

[0035] Figure 12B yes Figure 12A A cross-sectional view of the electronic control device shown.

[0036] Figure 13A This is a top view of the area near the rectangular recess of the electronic control device according to Embodiment 8 of the present invention.

[0037] Figure 13B This is a top view of the area near the arc-shaped recess of the electronic control device according to Embodiment 8 of the present invention.

[0038] Figure 13C This is a top view of the electronic control device according to Embodiment 8 of the present invention, near the U-shaped recess.

[0039] Figure 14A This is a top view of the electronic control device according to Embodiment 9 of the present invention.

[0040] Figure 14B yes Figure 14A A cross-sectional view of the electronic control device shown.

[0041] Figure 15A This is a top view of the electronic control device according to Embodiment 10 of the present invention.

[0042] Figure 15B yes Figure 15A A cross-sectional view of the electronic control device shown.

[0043] Figure 16A This is a top view of the electronic control device according to Embodiment 11 of the present invention, near the rectangular hole.

[0044] Figure 16B This is a top view of the area near the arc-shaped hole of the electronic control device according to Embodiment 11 of the present invention.

[0045] Figure 16C This is a top view of the vicinity of the U-shaped hole in the electronic control device according to Embodiment 11 of the present invention. Detailed Implementation

[0046] Hereinafter, embodiments of the electronic control device according to the present invention will be described in detail with reference to the accompanying drawings. The electronic control device controls, for example, actuators (such as solenoid valves) used in engines, transmissions, etc. Furthermore, in the accompanying drawings, the same reference numerals denote the same or equivalent parts.

[0047] The purpose of this embodiment is to provide an electronic control device in which the material on the vehicle-mounted side of the electronic control device is replaced with a resin material. Even when an ESD (Electro-Static Discharge) countermeasure structure and a conductive adhesive are disposed between the metal housing and the circuit board, and when the conductive adhesive is wetted and diffused, the mixing with the waterproof sealing material can be suppressed while achieving miniaturization of the unit size.

[0048] (Comparative Example)

[0049] First, use Figure 1 , Figure 4A , Figure 4B , Figure 5A , Figure 5B The structure of the electronic control device described in the comparative example of the present invention will be explained.

[0050] Regarding the direct mounting structure of electronic control devices, for example Figure 1 This illustrates an example of a directly fixed structure in a transmission. Figure 1 In this transmission, the transmission 103 has a transmission housing 131 that houses the mechanism for transmitting rotational drive force from an engine or the like. An electronic control unit 100 is mounted on the transmission housing 131. Transmission connectors 132 are electrically connected (on the electronic control unit side and the transmission side) via a connecting cable 133.

[0051] Here, while the assembly worker is energized, when installing the electronic control device 100 onto the vehicle, such as... Figure 4A , 4BAs shown, there is a concern that static electricity may be applied to the electronic components 8 through the housing (metal housing 6) of the electronic control device, causing damage to the electronic components 8.

[0052] When the component (resin housing 7) on the vehicle-mounted side of the electronic control device is made of insulating resin, and the circuit board 5 is mounted on this resin, static electricity does not flow to the vehicle grounding side. Therefore, it is necessary to control the metal housing 6 and the circuit board 5 with a narrow gap to allow static electricity to flow to the vehicle grounding side. However, this results in higher impedance and poor noise immunity. Therefore, in order to improve noise immunity through reliable grounding, a structure in which a conductive adhesive 1 is disposed between the metal housing 6 and the circuit board 5 is considered.

[0053] However, if Figure 5B If the conductive material (conductive adhesive 1) comes into contact with the electronic component 8, it may cause a short circuit. Therefore, a component stop band needs to be set around the conductive material. In addition, in order to keep the component stop band as small as possible, it needs to be placed at the end of the circuit board 5.

[0054] Here, the waterproof electronic control device 100 requires a waterproof sealant 9 on its outer periphery. However, if a conductive material (a conductive adhesive 1) is applied to the end of the circuit board 5, it may mix with the waterproof sealant 9 on the outer periphery due to coating diffusion during assembly. This reduces the carbon content of the conductive adhesive 1 and increases its resistance, potentially causing ESD defects. As a countermeasure, one could propose separating the waterproof sealant 9 from the conductive adhesive 1 to prevent mixing. However, this would result in an increased unit size.

[0055] (Implementation Method 1)

[0056] like Figure 6A , Figure 6B As shown, for example, a conductive adhesive 1 is configured to electrically connect the metal housing 6 to the circuit board 5, and the configuration sites are set at 4 or more locations on the circuit board 5.

[0057] In detail, the electronic control device 100 includes at least a non-conductive resin housing 7, a circuit board 5, a metal housing 6, a waterproof sealant 9, and a conductive adhesive 1. The circuit board 5 has a grounding point (GND pattern 4) and is held on the resin housing 7. The metal housing 6 covers the circuit board 5 and is mounted on the resin housing 7. The waterproof sealant 9 seals the resin housing 7 and the metal housing 6 for waterproofing. The conductive adhesive 1 contacts the metal housing 6 and the grounding point (GND pattern 4), electrically connecting the metal housing 6 and the grounding point at multiple locations. This allows static electricity applied to the metal housing 6 to be discharged to the grounding point with low impedance.

[0058] That is, when static electricity is applied to the metal casing 6, the static current can be reliably grounded through the circuit (GND pattern 4), thus preventing damage to the electronic components 8.

[0059] In this embodiment, a conductive adhesive 1 electrically connects the metal housing 6 and the circuit ground (GND pattern 4) at more than four points. Figure 6A In the example, because electronic component 8 is located on circuit board 5 Figure 6A Near the upper edge, connector 132 is located on the circuit board 5. Figure 6A Near the lower edge, a conductive adhesive 1 is disposed near the left and right edges of the circuit board 5. Since there are two conductive adhesives 1 on each of the left and right edges of the circuit board 5, static electricity can be released even if poor conductivity occurs in one of the two conductive adhesives 1 for each edge.

[0060] That is, by distributing the conductive adhesive 1 at at least four locations on the circuit board 5, static electricity can be reliably conducted to the circuit ground regardless of where it is applied on the metal housing 6. Even if poor adhesion of the conductive adhesive 1 occurs relative to the metal housing 6 or the circuit board 5 after assembly, the occurrence of ESD defects can be suppressed due to the presence of at least four locations, thus enabling a highly reliable electronic control device 100.

[0061] A conductive adhesive 1 is located at the edge of the circuit board 5. This prevents short circuits in the circuit.

[0062] (Implementation Method 2)

[0063] like Figure 7A , 7B As shown, for example, a recess 3 is provided between a conductive adhesive 1 disposed on a circuit board 5 and a waterproof sealant 9 disposed on the outer periphery. That is, the electronic control device 100 includes a recess (recess 3) provided between the waterproof sealant 9 and the conductive adhesive 1.

[0064] Therefore, it is possible to prevent the waterproof sealant 9 from mixing with the conductive adhesive 1 without increasing the unit size, thus more reliably suppressing ESD defects and enabling a highly reliable electronic control device 100.

[0065] (Implementation Method 3)

[0066] In the shape of embodiment 2, such as Figure 8A , 8BAs shown, for example, a structure is formed in which the recess 3 disposed between the conductive adhesive 1 and the waterproof sealant 9 on the circuit board 5 extends into the lower side of the circuit board 5. In other words, the recess 3 is a recess 3 provided in the resin housing 7, and the recess 3 extends into the lower side of the circuit board 5.

[0067] Therefore, compared with embodiment 2, the unit size can be miniaturized, the waterproof sealing material 9 can be prevented from mixing with the conductive adhesive 1, thus the occurrence of ESD defects can be suppressed more reliably, and a more reliable electronic control device can be realized.

[0068] (Implementation Method 4)

[0069] In the shape of embodiment 2, such as Figure 9A , 9B As shown, for example, a wall 10 is provided on the side of the waterproof sealant 9, and a recess 3 is provided on the side of the conductive adhesive 1. Thus, the waterproof sealant 9 is inhibited from wetting and spreading by the wall 10, and the conductive adhesive 1, after wetting and spreading, falls into the recess 3, thereby preventing the waterproof sealant 9 from mixing with the conductive adhesive 1.

[0070] Furthermore, compared to embodiment 2, by providing wall 10, the unit size can be made smaller while achieving ESD countermeasures. In other words, the electronic control device 100 includes a protrusion (wall 10) adjacent to the inner wall of the recess (recess 3) on the side of the waterproof sealant 9. As a result, the waterproof sealant 9 is less likely to flow into the recess (recess 3), and thus the size of the recess can be reduced by considering only the flow of the conductive adhesive 1.

[0071] In this embodiment, the viscosities of the conductive adhesive 1 and the waterproof sealant 9 are v1 and v9, respectively, with v9 being greater than v1. Furthermore, the protrusion (wall 10) is adjacent to the inner wall of the recess (recess 3) on the side of the conductive adhesive 1 and the waterproof sealant 9 with the higher viscosity (waterproof sealant 9). Therefore, the conductive adhesive 1 with the lower viscosity easily flows into the recess (recess 3).

[0072] (Implementation Method 5)

[0073] In the shape of embodiment 4, such as Figure 10A , Figure 10B As shown, for example, the height h of the wall 10 is set to be higher than the thickness t of the waterproof sealant relative to the metal casing 6. That is, the height h of the protrusion (wall 10) is higher than the thickness t of the waterproof sealant 9.

[0074] Therefore, compared with embodiment 4, the diffusion of the waterproof sealant coating can be reliably suppressed, thus enabling a more reliable electronic control device.

[0075] (Implementation Method 6)

[0076] In the shape of embodiment 4, such as Figure 11A , 11B As shown, for example, a recess 3 is provided on the side of the waterproof sealant 9, and a wall 10 is provided on the side of the conductive adhesive 1. In other words, a protrusion (wall 10) is provided on the resin housing 7 and is adjacent to the inner wall of the recess (recess 3) on the side of the conductive adhesive 1.

[0077] As a result, the waterproof sealant 9, after wetting and diffusion, falls into the recess 3, and the conductive adhesive 1, after wetting and diffusion, is suppressed on the wall 10, thus achieving the same effect as in embodiment 4. Furthermore, the wall 10 in this embodiment can also be used as a positioning mechanism for the circuit board 5 during assembly.

[0078] In this embodiment, the viscosities of the conductive adhesive 1 and the waterproof sealant 9 are v1 and v9, respectively, with v9 being greater than v1. Furthermore, the protrusion (wall 10) is adjacent to the inner wall of the recess (recess 3) on the side of the conductive adhesive 1 or the waterproof sealant 9 with the higher viscosity (the conductive adhesive 1). Therefore, the waterproof sealant 9 with lower viscosity easily flows into the recess (recess 3).

[0079] (Implementation Method 7)

[0080] In the shapes of embodiments 4, 5, and 6, such as Figure 12A , 12B As shown, for example, a tapered member 12 is provided on the wall 10. In other words, a tapered member 12 is provided on the protrusion (wall 10).

[0081] Therefore, the same effects as in embodiments 4, 5, and 6 can be obtained, and the formability of the wall 10 provided on the resin housing 7 can be improved, thereby reducing the defect rate during molding.

[0082] (Implementation Method 8)

[0083] In the shapes of embodiments 4, 5, 6, and 7, such as Figure 13A , 13B As shown in Figures 1 and 13C, for example, the shape of recess 3 is rectangular, arc-shaped, or U-shaped.

[0084] exist Figure 13A In the example, the cross-section of the recess (recess 3) viewed from the depth direction is rectangular. Therefore, the machining of the recess (recess 3) becomes easier.

[0085] exist Figure 13BIn the example, the cross-section of the recess (recess 3) viewed from the depth direction has an arc-shaped form. Specifically, the cross-section of the recess (recess 3) viewed from the depth direction includes a curve along the outer periphery of the conductive adhesive 1. Thus, the conductive adhesive 1 easily flows radially towards the recess (recess 3).

[0086] exist Figure 13C In the example, the cross-section of the recess (recess 3) viewed from the depth direction is U-shaped. Specifically, the cross-section of the recess (recess 3) viewed from the depth direction includes three straight lines surrounding the conductive adhesive 1. Thus, for example, in Figure 13C The adhesive 1, which is conductive in the longitudinal direction of the circuit board 5, will not wet or spread.

[0087] In addition, they can achieve the same effect as implementation methods 4, 5, 6, and 7.

[0088] (Implementation Method 9)

[0089] like Figure 14A , 14B As shown, a cutout 13 is provided on the circuit board, creating a space between the waterproof sealant 9 and the conductive adhesive 1. In other words, the recess is the cutout 13 provided on the circuit board 5.

[0090] As a result, the conductive adhesive 1, which wets and diffuses, falls into the space, thus achieving the same effect as in Embodiment 4. Furthermore, by omitting the recess 3 formed by the resin housing 7, improved formability of the resin housing 7 can be expected.

[0091] The circuit board 5 is disposed below the surface of the resin housing 7, which is in contact with the waterproof sealant 9. As a result, for example, the distance from the waterproof sealant 9 to the cut 13 becomes longer.

[0092] (Implementation Method 10)

[0093] like Figure 15A , 15B As shown, for example, a hole 11 is provided on the circuit board 5 between the waterproof sealant 9 and the conductive adhesive 1. In other words, the recess is a hole 11 provided on the circuit board 5.

[0094] Therefore, the wetting and diffusion of the waterproof sealing material 9 is suppressed by the thickness of the circuit board 5, and the conductive adhesive 1 falls into the holes 11 formed in the circuit board 5, thus achieving the same effect as in Embodiment 4. In addition, by not providing the wall 10 and the recess 3 formed by the resin housing 7, the formability of the resin housing 7 can be improved.

[0095] The surfaces of the resin housing 7 that are in contact with the waterproof sealing material 9 and the resin housing 7 that are in contact with the circuit board 5 are located on the same plane. As a result, the assembly of electronic control devices, for example, becomes easier.

[0096] (Implementation Method 11)

[0097] In the shape of embodiment 10, such as Figure 16A , 16B As shown in Figures 16C, for example, the shape of the hole 11 formed on the substrate is rectangular, arc-shaped, or U-shaped.

[0098] exist Figure 16A In the example, the cross-section of the recess (hole 11) viewed from the depth direction is rectangular. This makes the machining of the recess (hole 11) easier.

[0099] exist Figure 16B In the example, the cross-section of the recess (hole 11) viewed from the depth direction has an arc-shaped form. Specifically, the cross-section of the recess (hole 11) viewed from the depth direction includes a curve along the outer periphery of the conductive adhesive 1. Thus, the conductive adhesive 1 easily flows radially towards the recess (hole 11).

[0100] exist Figure 16C In the example, the cross-section of the recess (hole 11) viewed from the depth direction is U-shaped. Specifically, the cross-section of the recess (hole 11) viewed from the depth direction includes three straight lines surrounding the conductive adhesive 1. Thus, for example, in Figure 16C The adhesive 1, which is conductive in the longitudinal direction of the circuit board 5, will not wet or spread.

[0101] In addition, they can achieve the same effect as implementation method 10.

[0102] This invention is not limited to the embodiments described above, and includes various modifications. For example, the above embodiments are detailed descriptions provided for ease of understanding, and the invention is not necessarily limited to including all the structures described. Furthermore, a portion of the structure of one embodiment may be replaced with a structure of another embodiment; conversely, a structure of another embodiment may be added to the structure of a certain embodiment. Additionally, a portion of the structure in each embodiment may be added to, deleted from, or replaced with other structures.

[0103] The present invention can also be implemented in the following ways.

[0104] (1). An electronic control device, characterized in that it comprises: a resin housing 7 formed of resin material, a circuit board 5 on which electronic components 8 are mounted and held on the resin housing 7, a metal housing 6 covering the circuit board 5 and mounted on the resin housing 7, a waterproof sealing material 9 disposed on the outer periphery of the resin housing 7 and the metal housing 6, and a conductive adhesive 1 electrically connecting the circuit board 5 and the metal housing 6, wherein the conductive adhesive 1 connects the circuit board 5 and the metal housing 6 at 4 or more points.

[0105] (2). An electronic control device, characterized in that it comprises: a resin housing 7 formed of resin material, a circuit board 5 on which electronic components 8 are mounted and held on the resin housing 7, a metal housing 6 covering the circuit board 5 and mounted on the resin housing 7, a waterproof sealing material 9 disposed on the outer periphery of the resin housing 7 and the metal housing 6, a conductive adhesive 1 electrically connecting the circuit board 5 and the metal housing 6, and a recess 3 formed by the resin housing 7 between the waterproof sealing material 9 and the conductive adhesive 1.

[0106] (3). An electronic control device, characterized in that it comprises: a resin housing 7 formed of resin material, a circuit board 5 on which electronic components 8 are mounted and held on the resin housing 7, a metal housing 6 covering the circuit board 5 and mounted on the resin housing 7, a waterproof sealing material 9 disposed on the outer periphery of the resin housing 7 and the metal housing 6, a conductive adhesive 1 electrically connecting the circuit board 5 and the metal housing 6, and a recess 3 formed by the resin housing 7 between the waterproof sealing material 9 and the conductive adhesive 1, the recess 3 extending below the circuit board 5.

[0107] (4). An electronic control device, characterized in that it comprises: a resin housing 7 formed of a resin material, a circuit board 5 on which electronic components 8 are mounted and held on the resin housing 7, a metal housing 6 covering the circuit board 5 and mounted on the resin housing 7, a waterproof sealing material 9 disposed on the outer periphery of the resin housing 7 and the metal housing 6, a conductive adhesive 1 electrically connecting the circuit board 5 and the metal housing 6, a recess 3 formed by the resin housing 7 between the waterproof sealing material 9 and the conductive adhesive 1, and a protrusion (wall 10) formed by the resin housing 7 between the waterproof sealing material 9 and the conductive adhesive 1, wherein the recess 3 is formed on the side of the conductive adhesive 1 and the protrusion (wall 10) is formed on the side of the waterproof sealing material 9.

[0108] (5) The electronic control device as described in (4) is characterized in that the height of the protrusion (wall 10) is set to be higher than the thickness of the waterproof sealing material 9.

[0109] (6) An electronic control device, characterized in that it comprises: a resin housing 7 formed of a resin material; a circuit board 5 on which electronic components 8 are mounted and held on the resin housing 7; a metal housing 6 covering the circuit board 5 and mounted on the resin housing 7; a waterproof sealing material 9 disposed on the outer periphery of the resin housing 7 and the metal housing 6; a conductive adhesive 1 electrically connecting the circuit board 5 and the metal housing 6; a recess formed by the resin housing 7 between the waterproof sealing material 9 and the conductive adhesive 1; and a protrusion (wall 10) formed by the resin housing 7 between the waterproof sealing material 9 and the conductive adhesive 1, wherein the recess 3 is formed on the side of the waterproof sealing material 9 and the protrusion (wall 10) is formed on the side of the conductive adhesive 1.

[0110] (7). The electronic control device as described in (4), (5) or (6) is characterized in that a tapered member 12 (inclined) is provided on the protrusion (wall 10).

[0111] (8) The electronic control device as described in (2) or (3) or (4) or (5) or (6), characterized in that the recess 3 is rectangular in shape.

[0112] (9) The electronic control device as described in (2) or (3) or (4) or (5) or (6) is characterized in that the recess 3 is arc-shaped.

[0113] (10) The electronic control device as described in (2) or (3) or (4) or (5) or (6), characterized in that the recess 3 is shaped like a コ (ko).

[0114] (11). An electronic control device, characterized in that it comprises: a resin housing 7 formed of resin material, a circuit board 5 on which electronic components 8 are mounted and held on the resin housing 7, a metal housing 6 covering the circuit board 5 and mounted on the resin housing 7, a waterproof sealing material 9 disposed on the outer periphery of the resin housing 7 and the metal housing 6, and a conductive adhesive 1 electrically connecting the circuit board 5 and the metal housing 6, wherein a cutout 13 is provided on the circuit board 5 between the conductive adhesive 1 and the waterproof sealing material 9.

[0115] (12). An electronic control device, characterized in that it comprises: a resin housing 7 formed of resin material, a circuit board 5 on which electronic components 8 are mounted and held on the resin housing 7, a metal housing 6 covering the circuit board 5 and mounted on the resin housing 7, a waterproof sealing material 9 disposed on the outer periphery of the resin housing 7 and the metal housing 6, and a conductive adhesive 1 electrically connecting the circuit board 5 and the metal housing 6, wherein a hole 11 is provided on the circuit board 5 between the conductive adhesive 1 and the waterproof sealing material 9.

[0116] (13). The electronic control device as described in (12) is characterized in that the hole 11 is rectangular.

[0117] (14). The electronic control device as described in (12) is characterized in that the hole 11 is arc-shaped.

[0118] (15). The electronic control device as described in (12) is characterized in that the hole 11 is U-shaped.

[0119] (16). The electronic control device as described in (4) or (5) or (6) is characterized in that, relative to the conductive adhesive 1 and the waterproof sealing material 9, the protrusion (wall 10) is disposed in the adhesive with higher viscosity and the recess 3 is disposed in the adhesive with lower viscosity.

[0120] (17). The electronic control device as described in (1) is characterized in that the conductive adhesive 1 and the waterproof sealing material 9 are made of silicone, epoxy resin, acrylic, polyurethane, etc.

[0121] (18). The electronic control device as described in (1) is characterized in that the material of the resin housing 7 is PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), PA (polyamide), POM (polyacetal), etc.

[0122] (19). The electronic control device as described in (1) is characterized in that the material of the metal housing 6 is A5052, A1050, ADC12, steel, etc.

[0123] According to (1) to (19), by using a conductive adhesive, a cheap and reliable ESD countermeasure can be achieved. In addition, even when the unit size is miniaturized, it is possible to prevent the conductive adhesive from mixing with the waterproof sealant disposed on the periphery.

[0124] Label Explanation

[0125] 1…Conductive adhesives

[0126] 2… Thermal conductive agent

[0127] 3…depression

[0128] 4…GND pattern

[0129] 5…Circuit board

[0130] 6… Metal casing

[0131] 7… Resin casing

[0132] 8… Electronic Components

[0133] 9… Waterproof sealing materials

[0134] 10…wall (protrusion)

[0135] 11…hole

[0136] 12…conical parts

[0137] 13…Incision

[0138] 100… Electronic control device

[0139] 103… Transmission

[0140] 131…Transmission housing

[0141] 132… connector

[0142] 133… Connecting cable (wire harness)

Claims

1. An electronic control device, characterized in that, include: Non-conductive resin casing; It has a circuit board grounded and held on the resin housing; A conductive metal housing that covers the circuit board and is mounted on the resin housing; A waterproof sealing material that seals the resin housing and the metal housing and is waterproof; A conductive adhesive is located near the edge of the circuit board and makes contact with the metal housing and the circuit ground, electrically connecting the metal housing and the circuit ground at multiple locations; as well as The recess, which is a hole provided on the circuit board, is located between the waterproof sealant and the conductive adhesive. The conductive adhesive and the waterproof sealant are separated by a portion of the circuit board between a hole (recess) on the circuit board and the side of the circuit board.

2. The electronic control device as described in claim 1, characterized in that, The cross-section of the recess, when viewed in the depth direction, is rectangular.

3. The electronic control device as described in claim 1, characterized in that, The cross-section of the recess, when viewed in the depth direction, contains an arc-shaped form.

4. The electronic control device as described in claim 1, characterized in that, The cross-section of the recess, when viewed in the depth direction, is U-shaped.

5. The electronic control device as described in claim 1, characterized in that, The conductive adhesive electrically connects the metal casing and the circuit ground at more than four points.

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