A non-contact type loading and unloading machine for plate frame

Abstract

The present invention relates to the field of IC substrate production technology, specifically to a non-contact substrate frame loading and unloading machine, including a substrate frame conveying device, a material picking robot, and a plate conveyor for conveying IC substrate materials; the substrate frame conveying device includes an upper conveying assembly and a lower conveying assembly distributed in two layers, which are used to convey the substrate frame in the horizontal direction; a substrate frame lifting mechanism is provided between the upper conveying assembly and the lower conveying assembly, which is used to lift the lower substrate frame onto the upper conveying assembly. The IC substrate material is conveyed by the plate conveyor, and the IC substrate clamping assembly is driven by a multi-axis mechanical arm to clamp the IC substrate material and load it on the material frame plate of the substrate frame, so as to realize automatic conveying, filling, and loading and unloading operations of the entire substrate frame, and the components on the IC substrate material will not be bumped, which reduces the possibility of touching the IC substrate surface, and ensures that the IC substrate is not easily exposed to dust during transportation and stagnation.

Description

Technical Field

[0001] The invention relates to the technical field of IC carrier board production, and in particular to a non-contact carrier board frame loading and unloading machine. Background Art

[0002] IC packaging substrate is a key special basic material, which mainly protects the chip and serves as an integrated circuit chip and external interface. It is in the form of a strip. In the specific use process, the integrated circuit card chip is generally attached to the IC card packaging frame by a fully automatic placement machine, and then the contacts on the integrated circuit chip and the nodes on the IC card packaging frame are connected by a wire bonding machine to realize the interconnection of the circuit. Finally, the integrated circuit chip is protected by packaging materials to form an integrated circuit card module.

[0003] In order to realize contactless storage of IC carrier materials, the inventor has designed a non-contact material carrier frame to solve the problem that the IC carrier is easily exposed to dust and contaminated by dust during the transfer and stagnation of the IC carrier. The non-contact material frame is mainly composed of a frame body and a material frame plate, wherein a accommodating cavity with an opening on one side is formed in the frame body, and a positioning hook for hanging the IC carrier is provided on the material frame plate. After the IC carrier is mounted on the material frame plate, it can be pushed into the accommodating cavity of the frame body together with the material frame plate for storage. For details, please refer to Figure 6 and Figure 7 The non-contact material carrier frame realizes contactless storage of IC carrier materials to reduce the possibility of touching components on the touch panel, ensuring that the IC carrier is not easily exposed to dust during transportation and stagnation.

[0004] Since the IC substrate needs to be removed manually during the board hanging process, each time the board is removed, it is necessary to ensure that only the edge of the IC substrate is touched. It is also easy to accidentally touch the board surface, and the efficiency of the entire board loading and unloading is relatively low. Summary of the invention

[0005] The present invention aims at the technical problems existing in the prior art and provides a non-contact type carrier frame loading and unloading machine to solve the problem of low efficiency of IC carrier loading.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a non-contact carrier frame loading and unloading machine, including a carrier frame conveying device, a material picking robot and a plate conveyor for conveying IC carrier materials; the carrier frame conveying device includes an upper conveying assembly and a lower conveying assembly distributed in two layers, which are used to convey the carrier frame in the horizontal direction; a carrier frame lifting mechanism is provided between the upper conveying assembly and the lower conveying assembly, which is used to lift the lower carrier frame to the upper conveying assembly; the material picking robot includes a multi-axis robotic arm and an IC carrier clamping assembly assembled on the multi-axis robotic arm, and the multi-axis robotic arm is used to drive the IC carrier clamping assembly to clamp the IC carrier material and load it on the material frame plate of the carrier frame.

[0007] Based on the above technical solution, the present invention can also be improved as follows.

[0008] Furthermore, the upper conveying assembly includes two groups of relatively arranged upper plate frame linear transmission mechanisms; the lower conveying assembly includes two groups of relatively arranged lower plate frame linear transmission mechanisms; the plate frame lifting mechanism includes a vertical lifting mechanism and a movable frame transmission-connected to the vertical lifting mechanism, for driving the movable frame to reciprocate in the vertical direction; the movable frame includes a horizontal adjustment table and an adjustment table translation mechanism connected to the horizontal adjustment table, for horizontally adjusting the horizontal adjustment table; a plate frame bearing seat and a lifting cylinder connected to the plate frame bearing seat are arranged on the horizontal adjustment table, for lifting and lowering the plate frame bearing seat.

[0009] Furthermore, a conveying channel for the carrier frame bearing seat is reserved between the two groups of the upper carrier frame linear transmission mechanisms; the horizontal adjustment platform and the adjustment platform translation mechanism are both arranged below the upper carrier frame linear transmission mechanism.

[0010] Furthermore, the horizontal adjustment platform is also provided with two sets of plate carrier frame clamping components which are arranged oppositely on both sides of the plate carrier frame bearing seat.

[0011] Furthermore, the carrier frame clamping assembly includes a clamping plate, a linear guide rail and a clamping cylinder; the clamping plate is slidably arranged on a horizontal adjustment table through the linear guide rail; the clamping cylinder and the clamping plate, and the movement path are directly opposite to the carrier frame.

[0012] Furthermore, the vertical lifting mechanism is a screw guide rail conveyor.

[0013] Furthermore, the upper plate frame linear transmission mechanism and the lower plate frame linear transmission mechanism are both assembled from transmission rollers, conveyor belts and drive motors; the conveyor belt transmission is arranged on the transmission rollers, and the output end of the drive motor is connected to the transmission roller drive through a transmission shaft.

[0014] Furthermore, the IC carrier clamping assembly comprises a clamp suspension, on which two sets of opposing support arms are mounted; and a plurality of pneumatic clamping claws are arranged on the support arms.

[0015] Furthermore, it also includes a plate taking mechanism, which includes a plate taking moving component facing the opening of the plate carrier frame accommodating cavity, and the plate taking moving component is equipped with a frame plate clamp facing the frame plate inside the plate carrier frame.

[0016] Furthermore, it also includes a feeding auxiliary vehicle, which includes a vehicle body, and the vehicle body is provided with two layers of conveying rollers respectively connected to the upper conveying assembly and the lower conveying assembly.

[0017] The beneficial effects of the present invention are:

[0018] 1) The non-contact type substrate frame loading and unloading machine involved in the present invention transports IC substrate materials through a plate conveyor, and utilizes a multi-axis robotic arm to drive an IC substrate clamping assembly to clamp the IC substrate materials and load them onto a material frame plate of a substrate frame, thereby realizing automatic transportation, loading, and loading and unloading operations of the IC substrate materials on the entire substrate frame, and will not bump against components on the IC substrate materials, thereby reducing the possibility of touching the IC substrate surface, and ensuring that the IC substrate is not easily exposed to dust during transportation and stagnation.

[0019] 2) The non-contact board frame loading and unloading machine involved in the present invention, when the upper board frame is full of IC boards, the upper board frame with full content is sent out through the upper conveying assembly, and at the same time, the lower board frame can be lifted onto the upper conveying assembly under the action of the board frame lifting mechanism, and the board loading operation can be carried out on the lower board frame, which reduces the time for replacing the board frame and improves the loading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a top view of the structure of the present invention;

[0022] Figure 3 For the present invention Figure 2 The enlarged view of point A in the middle;

[0023] Figure 4 It is a schematic diagram of the overall structure of the plate carrier frame conveying device of the present invention;

[0024] Figure 5 It is a front view of the plate carrier frame conveying device of the present invention;

[0025] Figure 6 It is a structural schematic diagram of the non-contact material carrier frame of the present invention;

[0026] Figure 7 For the present invention Figure 6 The enlarged view of point B in the middle;

[0027] Figure 8 It is a structural schematic diagram of the plate taking mechanism of the present invention.

[0028] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0029] 1. Sheet material conveyor, 2. Upper conveying assembly, 21. Upper plate carrier frame linear transmission mechanism, 3. Lower conveying assembly, 31. Lower plate frame linear transmission mechanism, 4. Plate carrier frame lifting mechanism, 41. Horizontal adjustment table, 42. Adjustment table translation mechanism, 43. Plate carrier frame bearing seat, 44. Lifting cylinder, 5. Multi-axis robotic arm, 6. IC plate carrier clamping assembly, 61. Clamp suspension, 62. Support arm, 63. Pneumatic clamp, 7. Clamp, 8. Linear guide, 9. Clamping cylinder, 10. Car body, 11. Conveyor roller, 12. Plate taking mechanism.

[0030] 100, frame, 200, material frame plate, 201, positioning hook, 300, IC carrier board material. DETAILED DESCRIPTION

[0031] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0032] It should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrally formed structure. For ordinary technicians in this field, the specific meanings of such terms in this patent can be understood according to specific circumstances.

[0033] At present, in the process of IC board processing, the traditional process and equipment is to divide the substrate into equal parts with the center and reserve a 10 mm wide field-shaped contact process edge, which solves the loading problem to a certain extent, but there are still certain quality problems. Since the process edge will rub against the carrier for a long time, dust will still be generated, polluting the board surface, and causing trouble for cleaning the carrier. In addition, since the carrier material is expensive, the cross process edge in the middle of the field shape is also a waste of materials, and the IC carrier manufacturing process is complicated and has many processes, which is equivalent to processing the process edge in each process. Not only is the substrate wasted, but the materials of each process are also seriously wasted, such as electroplating, high-tech chemical industry, etc.! The most fatal problem is that carriers below 0.1 cannot be used, because the carrier is too thin, and the board surface in the middle of the field grid will hang down and contact the carrier, causing friction, with serious consequences. In response to this, the inventor has designed a non-contact material carrier frame to ensure that the IC carrier is not easily exposed to dust during transportation and stagnation.

[0034] The inventor has designed a non-contact material carrier frame, see Figure 6 and Figure 7The non-contact material carrier frame is mainly composed of a frame body 100 and a material frame plate 200. A storage cavity with an opening on one side is formed in the frame body. A positioning hook 201 for hanging the IC carrier is provided on the material frame plate. After the IC carrier is mounted on the material frame plate 201, it is pushed into the storage cavity of the frame body together with the material frame plate 200 for storage. Among them, a plurality of equidistantly arranged material frame plates 200 can be arranged in one frame body 100, ensuring that two adjacent IC carriers can be stored independently without interfering with each other, and the stability is high.

[0035] During use of the above-mentioned non-contact material carrier frame, the material frame 200 needs to be manually moved to be installed in the accommodating cavity of the frame body 100, which is not only relatively inefficient, but also easy to accidentally touch the components inside the board. For this reason, the inventor has also designed a non-contact carrier frame loading and unloading machine for use with the non-contact material carrier frame.

[0036] The embodiments of the present invention are as follows

[0037] like Figure 1 and Figure 2 As shown, the non-contact carrier frame loading and unloading machine designed by the present invention includes a carrier frame conveying device, a material picking robot and a plate conveyor 1 for conveying IC carrier materials, wherein the plate conveyor 1 is a roller conveyor to convey the IC carrier materials along the conveying line in a directional manner; the carrier frame conveying device includes an upper conveying component 2 and a lower conveying component 3 distributed in two layers, which are used to convey the carrier frame in the horizontal direction; a carrier frame lifting mechanism 4 is provided between the upper conveying component 2 and the lower conveying component 3, which is used to lift the lower carrier frame to the upper conveying component 2; the material picking robot includes a multi-axis robot arm 5 and an IC carrier clamping component 6 assembled on the multi-axis robot arm 5, and the multi-axis robot arm 5 is used to drive the IC carrier clamping component 6 to clamp the IC carrier material and load it on the material frame plate of the carrier frame, so as to realize automatic conveying and filling of the IC carrier material and loading and unloading operations of the entire carrier frame. The substrate frame conveying device can realize synchronous feeding of the upper and lower layers. When the upper substrate frame is full of IC substrates, the upper substrate frame with full materials is sent out through the upper conveying component 2. At the same time, the lower substrate frame can be lifted onto the upper conveying component 2 under the action of the substrate frame lifting mechanism 4. At this time, the lower substrate frame can be loaded with panels, which reduces the time for replacing the substrate frame and improves the loading efficiency.

[0038] It should be noted that the non-contact carrier frame loading and unloading machine provided by the present invention can not only realize the loading operation of IC carrier materials on the carrier frame, but also realize the demand for unloading IC carrier materials. The carrier frame is filled with IC carrier materials through the upper conveying component 2 and the lower conveying component 3 respectively. When the upper carrier frame enters the corresponding loading and unloading area, the material frame plate 200 with the IC carrier is pulled out, and the IC carrier clamping component 6 is driven by the multi-axis robotic arm 5 to clamp the IC carrier material on the material frame plate 200 and place it on the plate conveyor 1. At this time, the IC carrier material can be transported to the next processing station to realize the unloading operation of the IC carrier material.

[0039] As an implementation method, Figure 4 and Figure 5 As shown, the upper conveying assembly 2 includes two groups of upper plate frame linear transmission mechanisms 21 arranged oppositely; the lower conveying assembly 3 includes two groups of lower plate frame linear transmission mechanisms 31 arranged oppositely; the plate frame lifting mechanism 4 includes a vertical lifting mechanism and a movable frame connected to the vertical lifting mechanism for driving the movable frame to reciprocate in the vertical direction, and the vertical lifting mechanism is a screw guide conveying member; the movable frame includes a horizontal adjustment table 41 and an adjustment table translation mechanism 42 connected to the horizontal adjustment table 41, which is used to horizontally adjust the horizontal adjustment table 41; a plate frame bearing seat 43 and a lifting cylinder 44 connected to the plate frame bearing seat 43 are arranged on the horizontal adjustment table 41, which is used to lift and lower the plate frame bearing seat 43. During the lifting process of the plate carrier frame, after the plate carrier frame is transferred to the top of the plate carrier frame bearing seat 43 by the lower conveying component 3, the vertical lifting mechanism drives the entire mobile frame to rise, so that the plate carrier frame bearing seat 43 lifts the plate carrier frame. After the plate carrier frame is lifted from the lower layer to the upper loading area, the loading operation of the corresponding plate carrier frame can be realized. When the loading of the plate carrier frame is completed, the lifting cylinder 44 lifts the plate carrier frame bearing seat 43, so that the plate carrier frame bearing seat 43 and the plate carrier frame are higher than the upper plate carrier frame linear transmission mechanism 21; the adjustment platform translation mechanism 42 pushes the horizontal adjustment platform 41 to approach the upper plate carrier frame linear transmission mechanism 21, until the plate carrier frame is completely located directly above the upper plate carrier frame linear transmission mechanism 21, the lifting cylinder 44 contracts to drive the plate carrier frame to descend, so that the plate carrier frame can be released to the upper plate carrier frame linear transmission mechanism 21, and the plate carrier frame filled with materials is sent out through the upper plate carrier frame linear transmission mechanism 21, that is, a loading cycle of the plate carrier frame is completed.

[0040] It should be noted that the adjustment table translation mechanism 42 can adopt an electric slide driven by a servo motor, which has high control accuracy. When the plate carrier frame is loading or taking materials, each time a frame plate is taken and placed, the electric slide is moved once, so that the next level frame plate of the plate carrier frame enters the corresponding plate taking position, so that the plate taking mechanism can accurately take out the frame plate in the plate carrier frame to ensure accurate hanging of the plate.

[0041] like Figure 2 and Figure 8 As shown, in order to realize automatic picking up and delivering of the frame plate inside the carrier frame, the contactless carrier frame loading and unloading machine is also provided with a plate picking mechanism 12, which includes a plate picking moving component 121 facing the opening of the carrier frame accommodating cavity, and the plate picking moving component 121 is provided with a frame plate clamp 122 facing the frame plate inside the carrier frame; in this embodiment, the plate picking moving component 121 can adopt an electric slide driven by a servo motor; the frame plate clamp 122 can adopt an electric or pneumatic clamp, and two groups are symmetrically installed along the plate picking moving component 121, which are used to clamp the upper and lower ends of the frame plate respectively. When the adjustment platform translation mechanism 42 controls the corresponding frame plate in the carrier frame to enter the plate taking position, the frame plate clamp 122 is pushed to move toward the frame plate by the plate taking moving component 121 until the frame plate clamp 122 effectively clamps the frame plate, and then the frame plate clamp 122 is driven to move in the opposite direction by the plate taking moving component 121 to take out the corresponding frame plate along the carrier frame, so as to facilitate the material taking robot to accurately load the IC carrier material on the material frame plate of the carrier frame. After the IC carrier material is assembled, the frame plate on which the IC carrier material is placed is pushed into the carrier frame for storage by the plate taking moving component 121, which reduces the loading interval of each frame plate and improves the loading efficiency. When a frame plate is loaded, the adjustment platform translation mechanism 42 is used to move the next time, and the above working process is repeated until all the frame plates are loaded. After all the plate frames in the carrier frame are loaded, they can be moved out by the upper carrier frame linear transmission mechanism 21.

[0042] In addition, during the process of taking out the plate carrier frame by the plate moving component 121, in order to ensure that the material taking robot can accurately hang the plate, the travel of the plate frame can be positioned to ensure that the plate frame can accurately reach the loading position during the process of taking out; for example, a limit block is added to the plate frame movement path, or the travel of the frame plate clamp 122 is limited to keep the distance of the plate frame pulled out constant to ensure the loading accuracy.

[0043] In order to ensure that no mechanical interference occurs when the adjustment platform translation mechanism 42 pushes the horizontal adjustment platform 41 to approach the upper board frame linear transmission mechanism 21, a conveying channel for the board frame bearing seat 43 is reserved between the two groups of the upper board frame linear transmission mechanisms 21; the horizontal adjustment platform 41 and the adjustment platform translation mechanism 42 are arranged below the upper board frame linear transmission mechanism 21. This allows the horizontal adjustment platform 41 to pass under the upper board frame linear transmission mechanism 21, and during the movement, the board frame can be conveyed to the upper part of the upper board frame linear transmission mechanism 21 along the conveying channel through the board frame bearing seat 43.

[0044] As an implementation method, Figure 2 and Figure 3As shown, the horizontal adjustment platform 41 is also provided with two groups of carrier frame clamping assemblies which are relatively arranged on both sides of the carrier frame supporting seat 43. The carrier frame supporting seat 43 is fixed by using the carrier frame clamping assemblies so that the position of the carrier frame will not deviate during the movement process, thereby ensuring the accuracy of loading and unloading.

[0045] Specifically, the carrier frame clamping assembly includes a clamping plate 7, a linear guide rail 8 and a clamping cylinder 9; the clamping plate 7 is slidably arranged on the horizontal adjustment platform 41 through the linear guide rail 8; the clamping cylinder 9 and the clamping plate 7, and the movement path is directly opposite to the carrier frame. When the carrier frame is placed on the carrier frame bearing seat 43, the clamping plate 7 is pushed by the clamping cylinder 9, and the two clamping plates 7 clamp the carrier frame synchronously to position the carrier frame.

[0046] As an implementation method, the upper plate carrier frame linear transmission mechanism 21 and the lower plate frame linear transmission mechanism 31 are both assembled by transmission rollers, conveyor belts and drive motors; the conveyor belts are arranged on the transmission rollers, and the output end of the drive motor is connected to the transmission rollers through a transmission shaft. The drive motor drives the transmission rollers to drive the conveyor belts to run synchronously, so as to realize the directional movement of the plate carrier frame.

[0047] As an embodiment, the IC carrier board clamping assembly 6 includes a clamp suspension 61, and the clamp suspension 61 is equipped with two sets of opposite support arms 62; the support arms 62 are provided with multiple pneumatic clamps 63. When the IC carrier board material is transported to the corresponding material picking area along the board conveyor 1, the clamp suspension 61 is driven by the multi-axis robot arm 5 to move to the corresponding material picking position, and the pneumatic clamps 63 are clamped along the side edge of the IC carrier board to achieve contactless material picking of the IC carrier board material. Then the multi-axis robot arm 5 drives the clamp suspension 61 to enter the loading position and hangs the IC carrier board material on the IC carrier board material.

[0048] It should be noted that, in order to ensure that the IC carrier board material is stably mounted on the material frame, a positioning hanging hole matching the positioning hook 201 is opened on the side edge of the IC carrier board material.

[0049] As an embodiment, the non-contact type loading and unloading machine for plate carrier frames further includes a feeding auxiliary vehicle, which includes a vehicle body 10, and two layers of conveying rollers 11 are provided in the vehicle body 10, which are respectively connected to the upper conveying assembly 2 and the lower conveying assembly 3. The two layers of conveying rollers 11 are used to respectively pick up and deliver the plate carrier frames on the upper conveying assembly 2 and the lower conveying assembly 3, which further improves the work efficiency and facilitates the subsequent transportation of the plate carrier frames.

[0050] The working principle of the present invention is as follows:

[0051] 1) Assemble the carrier frame

[0052] The empty carrier frame is pre-placed on the upper conveying component 2, and the carrier frame is transported to the corresponding loading area; at the same time, the next carrier frame to be loaded is transported to the lower conveying component 3 by the lower conveying roller 11. At this time, the vertical lifting mechanism controls the moving frame to descend to the lowest position, and the lower carrier frame is transported to the top of the carrier frame supporting seat 43 through the lower conveying component 3, completing the lifting preparation process of the lower carrier frame.

[0053] 2) Loading the carrier frame

[0054] When the IC carrier sheet material is conveyed to the corresponding material taking position along the sheet conveyor 1, the multi-axis robot arm 5 drives the IC carrier sheet clamping assembly 6 to clamp the IC carrier sheet material and load it on the material frame plate of the carrier frame, and then the material frame plate is pushed into the accommodating cavity of the carrier frame for storage by manual or robot arm until the carrier frame is filled with IC carrier sheet material.

[0055] 3) Replace the carrier frame

[0056] When the upper board frame is loaded, the board frame filled with materials is sent out through the upper conveying assembly 2. When the board frame is completely transferred to the upper conveying roller 11, the IC board material is pushed to the next process through the vehicle body 10. At the same time, the entire mobile frame is driven up by the vertical lifting mechanism, so that the board frame bearing seat 43 lifts the board frame. After the board frame is lifted from the lower layer to the upper loading area, the loading operation of the corresponding board frame can be realized. When the loading of the plate carrier frame is completed, the lifting cylinder 44 lifts the plate carrier frame bearing seat 43, so that the plate carrier frame bearing seat 43 and the plate carrier frame are higher than the upper plate carrier frame linear transmission mechanism 21; the adjusting table translation mechanism 42 pushes the horizontal adjusting table 41 to approach the upper plate carrier frame linear transmission mechanism 21, until the plate carrier frame is completely located directly above the upper plate carrier frame linear transmission mechanism 21, the lifting cylinder 44 contracts to drive the plate carrier frame to descend, so that the plate carrier frame can be released to the upper plate carrier frame linear transmission mechanism 21, and the plate carrier frame filled with materials is sent out through the upper plate carrier frame linear transmission mechanism 21, thus completing a plate carrier frame loading cycle until the subsequent plate carrier frames are continuously loaded.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A non-contact loading and unloading machine for a plate frame, characterized in that: The invention comprises a carrier frame conveying device, a material picking robot and a plate conveyor (1) for conveying IC carrier plate materials; the carrier frame conveying device comprises an upper conveying assembly (2) and a lower conveying assembly (3) arranged in two layers, and is used to convey the carrier frame in a horizontal direction; a carrier frame lifting mechanism (4) is provided between the upper conveying assembly (2) and the lower conveying assembly (3), and is used to lift the lower carrier frame to the upper conveying assembly (2); the material picking robot comprises a multi-axis mechanical arm (5) and an IC carrier plate clamping assembly (6) mounted on the multi-axis mechanical arm (5); the multi-axis mechanical arm (5) is used to drive the IC carrier plate clamping assembly (6) to clamp the IC carrier plate materials and load them onto the material frame plate of the carrier frame; The upper conveying assembly (2) comprises two sets of upper plate frame linear transmission mechanisms (21) arranged oppositely; the lower conveying assembly (3) comprises two sets of lower plate frame linear transmission mechanisms (31) arranged oppositely; the plate frame lifting mechanism (4) comprises a vertical lifting mechanism and a moving frame connected to the vertical lifting mechanism, used to drive the moving frame to move back and forth in the vertical direction; the moving frame comprises a horizontal adjustment table (41) and an adjustment table translation mechanism (42) connected to the horizontal adjustment table (41), used to horizontally adjust the horizontal adjustment table (41); a plate frame bearing seat (43) and a lifting cylinder (44) connected to the plate frame bearing seat (43) are arranged on the horizontal adjustment table (41), used to lift and lower the plate frame bearing seat (43); A conveying channel for the plate carrier frame bearing seat (43) is reserved between the two groups of the upper plate carrier frame linear transmission mechanisms (21); the horizontal adjustment platform (41) and the adjustment platform translation mechanism (42) are both arranged below the upper plate carrier frame linear transmission mechanism (21); The upper plate frame linear transmission mechanism (21) and the lower plate frame linear transmission mechanism (31) are both assembled from transmission rollers, conveyor belts and drive motors; the conveyor belt drive is arranged on the transmission rollers, and the output end of the drive motor is connected to the transmission rollers through a transmission shaft; The IC carrier clamping assembly (6) comprises a clamp suspension (61), on which two sets of opposing support arms (62) are mounted; and on the support arms (62) are a plurality of pneumatic clamping claws (63).

2. The non-contact type plate frame loading and unloading machine according to claim 1 is characterized in that: The horizontal adjustment platform (41) is also provided with two sets of plate carrier frame clamping components which are arranged oppositely on both sides of the plate carrier frame bearing seat (43).

3. The non-contact type plate frame loading and unloading machine according to claim 2 is characterized in that: The plate carrier frame clamping assembly comprises a clamping plate (7), a linear guide rail (8) and a clamping cylinder (9); the clamping plate (7) is slidably arranged on a horizontal adjustment platform (41) via the linear guide rail (8); the clamping cylinder (9) and the clamping plate (7) have a movement path facing the plate carrier frame.

4. The non-contact type board frame loading and unloading machine according to claim 1, characterized in that: The vertical lifting mechanism is a screw guide rail conveying member.

5. The non-contact type board frame loading and unloading machine according to claim 1, characterized in that: It also comprises a plate taking mechanism (12), the plate taking mechanism (12) comprising a plate taking moving assembly (121) facing the opening of the plate carrier frame accommodating cavity, the plate taking moving assembly (121) being provided with a frame plate clamp (122) facing the frame plate inside the plate carrier frame.

6. The non-contact type plate frame loading and unloading machine according to any one of claims 1 to 5, characterized in that: It also comprises a feeding auxiliary vehicle, the feeding auxiliary vehicle comprising a vehicle body (10), wherein the vehicle body (10) is provided with two layers of conveying rollers (11) respectively docked with an upper conveying assembly (2) and a lower conveying assembly (3).

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