Mobile stocker and method of operating the same

Abstract

Embodiments of the present invention describe a mobile stocker configured to be easily installed and repositioned to various locations in a semiconductor manufacturing facility and methods of operation thereof. The mobile stocker can be programmed according to the layout of the semiconductor manufacturing facility and / or autonomously learn the layout of the semiconductor manufacturing facility and automatically reposition to a new location using a navigation system based on the layout. Thus, the mobile stocker can be flexibly repositioned in the semiconductor manufacturing facility to dynamically support changes in demand and production capacity. Furthermore, the ability to quickly assign a location identifier to the mobile stocker and automatically interface with the transportation system in the semiconductor manufacturing facility reduces downtime of the mobile stocker, thereby increasing productivity in the semiconductor manufacturing facility.

Description

Technical Field

[0001] This invention relates to a mobile storage device and its operating method. Background Technology

[0002] A stocker is a system contained in a semiconductor manufacturing facility that stores transport carriers, such as wafer carriers (e.g., front-opening unified pods (FOUPs)), mask carriers, or other types of transport carriers. Summary of the Invention

[0003] This invention provides a mobile storage device, comprising a storage unit and a navigation system. The storage unit is configured to store a plurality of transport vehicles, wherein the storage unit includes at least one of the following: a plurality of rows configured to store corresponding subsets of the plurality of transport vehicles; or a plurality of columns configured to store corresponding subsets of the plurality of transport vehicles; and a plurality of wheels located at the bottom of the storage unit, configured to allow movement of the mobile storage device. The navigation system is configured to autonomously navigate the mobile storage device within a semiconductor manufacturing facility.

[0004] This invention provides a method for operating a mobile storage device, comprising: receiving communication indicating a location identifier associated with a second location in a semiconductor manufacturing facility via the mobile storage device at a first location in the semiconductor manufacturing facility; autonomously moving from the first location to the second location via the mobile storage device and using the location identifier; deploying one or more fastening devices via the mobile storage device to secure the mobile storage device in place at the second location; and after the mobile storage device is secured in place at the second location, transmitting instructions via the mobile storage device for one or more parameters associated with the second location to facilitate the provisioning or receiving of a transport carrier at the second location.

[0005] This invention provides an operating method for a mobile storage device, comprising: determining, via a material control system of a semiconductor manufacturing facility, to reposition the mobile storage device from a first position to a second position; transmitting, via the material control system and based on the determination to reposition the mobile storage device, a first communication indicating that the mobile storage device will be repositioned to the second position; receiving, via the material control system and from the mobile storage device, a second communication indicating that the mobile storage device is in the second position; and transmitting, via the material control system, a third communication indicating the following to an overhead lifting transport vehicle: a location identifier associated with the second position, and an instruction to unload a transport vehicle onto the mobile storage device at the second position or to retrieve a transport vehicle from the mobile storage device at the second position. Attached Figure Description

[0006] The various aspects of this disclosure are best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with industry standard practice, the various features are not drawn to scale. In fact, for clarity of explanation, the dimensions of the various features may be arbitrarily increased or decreased.

[0007] Figure 1 This is a diagram of the example semiconductor manufacturing facility described in this article.

[0008] Figures 2A to 2C For the purposes described in this article Figure 1 A diagram of an example moving storage device in an example semiconductor manufacturing facility.

[0009] Figures 3A to 3F , Figure 4A as well as Figure 4B This is a diagram of the implementation scheme of the example described in this article.

[0010] Figure 5 for Figure 1 A diagram of one or more instance components of a device.

[0011] Figure 6 and Figure 7 This is a flowchart of an example process related to the operation of a moving storage device. Detailed Implementation

[0012] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to simplify this disclosure. These are, of course, merely examples and are not intended to be limiting. For example, in the following description, embodiments in which a first feature is formed on or over a second feature may include those where the first and second features are in direct contact, and embodiments in which an additional feature may be formed between the first and second features such that the first and second features are not in direct contact. Furthermore, this disclosure may repeat reference numerals and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0013] Transport vehicles can be moved to or from storage units via overhead hoist transport (OHT) systems or other types of transport systems within semiconductor manufacturing facilities. Storage units are complex systems involving intricate and time-consuming installation processes, and are therefore typically fixed in a single location within the semiconductor manufacturing facility. Furthermore, when a storage unit is relocated, other systems and components interacting with it are reconfigured according to the new location, further complicating the installation process and potentially causing downtime for other systems and components.

[0014] Some embodiments described herein provide mobile stockers configured for easy installation and repositioning to various locations within a semiconductor manufacturing facility. The mobile stocker is programmable to and / or autonomously learns the layout of the semiconductor manufacturing facility and automatically repositions itself to the new location using a navigation system based on the layout. Once repositioned, the mobile stocker can communicate with the material control system (MCS) to automatically set its location identifier, enabling the OHT system and / or another type of transport system within the semiconductor manufacturing facility to load transport containers from the mobile stocker at the new location and / or unload transport containers to the mobile stocker at the new location.

[0015] In this way, mobile storage units can be flexibly repositioned within semiconductor manufacturing facilities to dynamically support changes in demand and production capacity. Furthermore, the ability to quickly assign location identifiers to mobile storage units and automatically interface with transport systems within the semiconductor manufacturing facility reduces downtime, thereby increasing productivity within the facility.

[0016] Figure 1 This is a diagram of an example semiconductor manufacturing facility 100 described herein. Semiconductor manufacturing facility 100 includes semiconductor foundries, semiconductor cleanrooms, semiconductor processing facilities and / or manufacturing facilities, as well as other examples. Semiconductor manufacturing facility 100 includes various types of semiconductor processing tools for manufacturing and / or processing semiconductor devices, such as deposition tools (e.g., spin coating tools, physical vapor deposition (PVD) tools, chemical vapor deposition (CVD) tools), exposure tools (e.g., immersion lithography tools, extreme ultraviolet (EUV) tools), developing tools, etching tools (e.g., wet etching tools, plasma etching tools), planarization tools (chemical mechanical planarization (CMP) tools), plating tools (e.g., electroplating tools), and / or another type of semiconductor processing tool.

[0017] like Figure 1 As illustrated, in addition to the semiconductor processing tools included in the semiconductor manufacturing facility 100, the semiconductor manufacturing facility 100 includes a transport system 102, a mobile storage unit 104 configured to store transport carriers 106, and a material control system (MCS) 108.

[0018] Transport system 102 includes an automated material handling system (AMHS), overhead lift (OHT) system, or another type of system configured to transfer transport vehicles 106 throughout the semiconductor manufacturing facility 100. Transport vehicles 106 include reticle transport vehicles, wafer transport vehicles (e.g., front-opening unified compartment (FOUP), standard mechanical interface (SMIF) vehicles, and / or other types of wafer transport vehicles), and / or other types of transport vehicles. Transport system 102 may include an overhead track 110 configured to support and allow OHT vehicles 112 to move within the semiconductor manufacturing facility 100 along the overhead track 110. The overhead track 110 may include guide rails and / or another type of track configured to allow guides, wheels, and / or rollers of the OHT vehicles 112 to move along the overhead track 110.

[0019] OHT vehicle 112 may include a lift configured to retrieve transport vehicle 106 and / or deliver transport vehicle 106 to a location within semiconductor manufacturing facility 100, such as moving storage unit 104 and / or loading port associated with semiconductor processing tools, and other examples. The lift may include a belt system, pulley system, hydraulic lift, and / or another type of lifting mechanism configured to selectively load (e.g., by raising transport vehicle 106) into and unload transport vehicle 106 from OHT vehicle 112 (e.g., by lowering transport vehicle 106).

[0020] The mobile storage unit 104 includes storage units 114 configured to store a plurality of transport vehicles 106. The transport vehicles 106 can be stored in racks, storage spaces, and / or other storage configurations within the storage units 114. The storage units 114 include multiple rows and / or multiple columns configured to store respective subsets of the transport vehicles 106. The storage units 114 may include a top opening 116 through which the mobile storage unit 104 interfaces with an OHT vehicle 112 to receive and deliver the transport vehicles 106. The storage units 114 also include one or more staging areas 118 through which the mobile storage unit 104 interfaces with ground (or ground-based) transport vehicles, such as mobile robots, automated guided vehicles (AVGs), transport vehicles, and / or other types of ground transport vehicles. The mobile storage unit 104 includes terminals 120. Terminal 120 includes a display screen, a computing device and / or one or more input devices, through which the moving storage device 104 is programmed, controlled and / or maintained.

[0021] This mobile storage unit 104 is movable because it is configured to travel, reposition, and / or otherwise move throughout the semiconductor manufacturing facility 100. In this way, the mobile storage unit 104 can flexibly reposition itself within the semiconductor manufacturing facility 100 to dynamically support changes in demand and production capacity. Therefore, the mobile storage unit 104 includes a transport system 122. The transport system 122 includes wheels, rollers, anchoring devices, and / or other components that enable the mobile storage unit 104 to move autonomously within the semiconductor manufacturing facility 100.

[0022] MCS 108 includes means or systems configured to analyze, control, adjust, and / or otherwise manage the transfer and flow of semiconductor substrates (or substrate batches) in semiconductor manufacturing facility 100. In some embodiments, MCS 108 is responsible for providing signals to OHT vehicle 112 to cause OHT vehicle 112 to retrieve transport carrier 106 from semiconductor processing tools and / or moving storage tank 104. In some embodiments, MCS 108 is responsible for providing signals to OHT vehicle 112 to cause vehicle 112 to unload or deliver transport carrier 106 to semiconductor processing tools and / or moving storage tank 104. In some embodiments, MCS 108 is responsible for providing signals to OHT vehicle 112 to cause OHT vehicle 112 to move transport carrier 106 between semiconductor processing tools.

[0023] MCS 108 is also configured to control, adjust, and / or otherwise manage the operation, positioning, and / or movement of the mobile storage unit 104. In some embodiments, MCS 108 is responsible for providing signals to the mobile storage unit 104 to cause it to move or travel to a specific location within the semiconductor manufacturing facility 100. As an example, MCS 108 may cause the mobile storage unit 104 to be repositioned near a semiconductor processing tool to support production at that tool. In some embodiments, MCS 108 is responsible for providing signals to the mobile storage unit 104 to cause it to deliver the transport carrier 106 to the OHT vehicle 112. In some embodiments, MCS 108 is responsible for providing signals to the mobile storage unit 104 to cause it to receive the transport carrier 106 from the OHT vehicle 112.

[0024] As indicated above, Figure 1 Provided as an instance. Other instances can be compared to... Figure 1 The instances described are different.

[0025] Figures 2A to 2C For the purposes described in this article Figure 1 A diagram of an example semiconductor manufacturing facility 100 and an example mobile storage device 104. Figures 2A to 2C Various details of the moving storage device 104 and / or its components are shown.

[0026] Figure 2A Several dimensional parameters of the movable storage device 104 are shown. For example... Figure 2AAs illustrated, the dimensional parameters include the height (H), length (L), and width (W) of the mobile storage unit 104. The height (H), length (L), and / or width (W) of the mobile storage unit 104 can be configured such that it can store a specific number of transport carriers 106 while maintaining a relatively compact size, thus facilitating easy movement throughout the semiconductor manufacturing facility 100. For example, the height (H) can range from approximately 2 meters to approximately 3 meters, and the length (L) and width (W) can each range from approximately 1.2 meters to approximately 2.1 meters, enabling the mobile storage unit 104 to store, for example, 30 or more transport carriers 106 while providing sufficient mobility. However, other values ​​for the height (H), length (L), and width (W) are also within the scope of this disclosure. In some embodiments, the mobile storage unit 104 is configured to be repositioned or moved within the semiconductor manufacturing facility 100 when the mobile storage unit 104 is loaded with the transport carrier 106. In some embodiments, the mobile storage unit 104 is configured to be repositioned or moved within the semiconductor manufacturing facility 100 after the transport carrier 106 has been unloaded from the mobile storage unit 104 and when the mobile storage unit 104 is empty.

[0027] Figure 2B Details of the transport system 122 for the mobile storage unit 104 are shown. The transport system 122 includes a plurality of supports 202 attached to the storage unit 114. Wheels 204 are mounted on the supports 202 to the mobile storage unit 104. The wheels 204 enable the mobile storage unit 104 to move or travel throughout the semiconductor manufacturing facility 100. In some embodiments, the mobile storage unit 104 includes four (4) wheels 204 (one wheel 204 at each corner of the storage unit 114) to achieve smooth and stable movement of the mobile storage unit 104. However, the mobile storage unit 104 may include a larger number of wheels 204.

[0028] The transport system 122 includes an elongated support member 206 attached to the storage unit 114 via a plurality of supports 208. A fastening device is attached to and supported by the elongated support member 206. The fastening device is configured to secure the movable storage unit 104 in place to increase the stability of the movable storage unit 104 and minimize its movement. The fastening device includes a plurality of drill bits 210 and a plurality of anchors 212. The drill bits 210 are configured to automatically drill holes into the floor of the semiconductor manufacturing facility 100, and the anchors 212 are configured to automatically insert into the holes to secure the movable storage unit 104 to the floor of the semiconductor manufacturing facility 100. Anchors include nuts and bolts, molly bolts, expansion anchors and screws, toggle bolts, and / or other anchoring devices. In some implementations, the drill bit 210 and the anchor 212 are combined into a single device comprising a self-tapping or self-drilling anchor.

[0029] Alternatively, drill bit 210 can be omitted, and anchor 212 can be configured to attach or fasten to a threaded hole or latch contained in the substrate of semiconductor manufacturing facility 100. This reduces damage to the substrate of semiconductor manufacturing facility 100 and reduces the number of substrate panels that are periodically replaced in semiconductor manufacturing facility 100. Moving reservoir 104 may include an image sensor or camera device configured to scan the substrate of semiconductor manufacturing facility 100 to locate holes or latches to which anchor 212 can be mounted. Furthermore, the image sensor or camera device can be used to align anchor 212 to holes or latches.

[0030] Figure 2C A schematic diagram of the control system 214 for the mobile storage device 104 is shown. The control system 214 is configured to autonomously navigate and move the mobile storage device 104 within the semiconductor manufacturing facility 100, to communicate with other devices and systems within the semiconductor manufacturing facility 100, and / or to perform other control functions on the mobile storage device 104. Figure 2C As illustrated, the control system 214 includes a plurality of wheel motors 216. The wheel motors 216 include electric motors, brushed motors, or brushless motors, and / or other types of wheel motors configured to generate movement of the movable storage unit 104 by causing the wheels 204 to rotate. In some embodiments, the wheel motors 216 are also responsible for manipulating the movement of the movable storage unit 104, because one or more wheel motors 216 can rotate the associated wheels 204 at different rotational speeds relative to other wheels 204 to rotate or manipulate the movable storage unit 104.

[0031] As in Figure 2C Further illustration shows that the control system 214 includes a navigation system 218 configured to autonomously navigate the moving storage unit 104 within the semiconductor manufacturing facility 100. The navigation system 218 includes one or more navigation devices 220a to 220n and one or more sensors 222a to 222m. The navigation system 218 uses one or more navigation devices 220a to 220n and one or more sensors 222a to 222m to generate a navigation map of the semiconductor manufacturing facility 100, and autonomously navigates the moving storage unit 104 within the semiconductor manufacturing facility 100 based on the navigation map. The navigation map may include information identifying the trajectories of walkways, semiconductor processing tools, and other equipment, other autonomous equipment within the semiconductor manufacturing facility 100, and / or other map-building information for the semiconductor manufacturing facility 100.

[0032] In some embodiments, navigation system 218 uses map generation techniques to generate a navigation map, such as simultaneous localization and mapping (SLAM) and / or another map generation technique. In these embodiments, navigation system 218 generates the navigation map as the moving storage unit 104 travels throughout the semiconductor manufacturing facility 100. As the moving storage unit 104 travels throughout the semiconductor manufacturing facility 100, one or more navigation devices 220a to 220n generate sensor data, and navigation system 218 uses the sensor data to generate the navigation map. One or more navigation devices 220a to 220n include: a time-of-flight (ToF) sensor configured to generate ToF data (e.g., for detecting the distance from an object to the moving storage unit 104); a lidar sensor configured to generate three-dimensional laser scan data; a radar sensor configured to generate radar data; a camera sensor configured to generate images and / or videos of the semiconductor manufacturing facility 100; a proximity sensor configured to generate proximity data; an inertial sensor configured to generate inertial data; and / or another type of sensor.

[0033] One or more navigation devices 220a to 220n include a global positioning sensor (GPS) device, a wireless station calibration device, a quick response (QR) code reader device, a SLAM device, a compass device, and / or another type of navigation device. Navigation system 218 may use one or more navigation devices 220a to 220n to identify a path from a first location to a second location within the semiconductor manufacturing facility 100 based on a navigation map using various wiring techniques. Wiring techniques include shortest path wiring, shortest travel time wiring, and / or another wiring technique. Navigation system 218 may use one or more navigation devices 220a to 220n to identify a travel path based on the paths taken by other autonomous devices within the semiconductor manufacturing facility 100 to prevent collisions between the mobile storage unit 104 and other autonomous devices. In some embodiments, the mobile storage device 104 communicates with the MCS 108 to obtain initial navigation information for navigating to a specific location within the semiconductor manufacturing facility 100 (e.g., an unknown or undiscovered location of the mobile storage device 104). In these embodiments, the MCS 108 may provide the mobile storage device 104 with information identifying GPS coordinates associated with the unknown or undiscovered location, information identifying another location near the unknown or undiscovered location and the direction or distance from said other location and the unknown or undiscovered location, and / or other information.

[0034] The control system 224 includes a controller 224 configured to receive information from the navigation system 218 (and / or one or more navigation devices 220a to 220n and one or more sensors 222a to 222m) and provide instructions to cause one or more other devices and / or components to perform various actions, and other examples. As an example, the controller 224 may provide signals to the wheel motor 216 to enable the mobile storage unit to move autonomously throughout the semiconductor manufacturing facility 100. As another example, the controller 224 may provide signals to the transport system 122 to cause the drill bit 210 to drill holes in the bottom layer of the semiconductor manufacturing facility 100 and / or to cause the anchor 212 to deploy or retract.

[0035] Control system 224 includes multiple wired and / or wireless communication interfaces configured to communicate with various devices and systems in semiconductor manufacturing facility 100. Communication interface 226 includes a wired or wireless interface configured to communicate with MCS 108. As an example, communication interface 226 may include a Wi-Fi interface, a cellular interface, an Ethernet interface, and / or another type of communication interface. Communication interface 228 includes a wired or wireless interface configured to communicate with OHT system 102. As an example, communication interface 228 includes an E84 interface, a Wi-Fi interface, and / or another type of communication interface.

[0036] As indicated above, Figures 2A to 2C Provided as an instance. Other instances can be compared to... Figures 2A to 2C The examples described are different.

[0037] Figures 3A to 3F This is a diagram of Example Implementation 300 described herein. Example Implementation 300 includes an example process for repositioning a moving feeder 104 in a semiconductor manufacturing facility 100.

[0038] Figure 3A The process flow of example implementation scheme 300 is shown. For example... Figure 3A As illustrated, a location is assigned to mobile storage device 104 for repositioning (box 302). Mobile storage device 104 autonomously travels to the assigned location (e.g., based on being assigned to the location via MCS 108) (box 304). Once mobile storage device 104 reaches the assigned location, it self-installs at the assigned location (box 306). Configuration parameters are set, and communication is established between mobile storage device 104 at the assigned location and other devices and systems in the semiconductor manufacturing facility 100 (box 308). Subsequently, transport carrier 106 is retrieved from mobile storage device 104 at the assigned location and / or transport carrier 106 is provided to mobile storage device 104. Mobile storage device 104 may then be reassigned to another location in the semiconductor manufacturing facility 100 (box 310), which may include performing one or more of the operations described in conjunction with boxes 302 to 308.

[0039] like Figure 3BAs illustrated, MCS 108 can transmit communications to mobile storage unit 104 to assign a location to mobile storage unit 104 (block 302). MCS 108 can transmit communications to mobile storage unit 104 via a wireless and / or wired connection. Mobile storage unit 104 receives communications from MCS 108 using communication interface 226. In some embodiments, the communications include a location identifier associated with the location (to which mobile storage unit 104 will be reassigned) and instructions to travel or reposition to the location associated with the location identifier. In some embodiments, the communications include a location identifier, and mobile storage unit 104 determines or identifies the location based on the location identifier.

[0040] MCS 108 transmits communications based on determining the reassignment of the mobile storage device 104, based on receiving an input instructing the mobile storage device 104 to be reassigned to a new location, based on receiving a request to be reassigned to another location (e.g., from the mobile storage device 104, from a semiconductor processing tool, and other instances), and / or based on another factor.

[0041] In some implementations, MCS 108 determines the reallocation of the moving feeder 104 based on production demands associated with one or more semiconductor processing tools in the semiconductor manufacturing facility 100. As an example, MCS 108 may decide to reallocate the moving feeder 104 closer to a semiconductor processing tool experiencing high utilization, thereby providing additional throughput for the transport carrier 106 to the semiconductor processing tool. In this way, the transport carrier 106 can be transported to the moving feeder 104 more quickly and efficiently, enabling the semiconductor processing tool to continuously process additional semiconductor substrates with minimal latency.

[0042] In some implementations, MCS 108 determines to reallocate the mobile storage unit 104 based on a production schedule or process flow for the semiconductor substrates stored in the transport carrier 106 (which is stored in the mobile storage unit 104). As an example, MCS 108 may determine to reallocate the mobile storage unit 104 to a location closer to a semiconductor processing tool that is intended to process a larger proportion (e.g., 50%, 75%, or another percentage) of the semiconductor substrates stored in the transport carrier 106 stored in the mobile storage unit 104.

[0043] In some implementations, MCS 108 determines to reallocate mobile storage device 104 based on the downtime of another mobile storage device (or non-mobile storage device), or based on scheduled and / or unscheduled maintenance of another mobile storage device (or non-mobile storage device), such that mobile storage device 104 replaces another mobile storage device (or non-mobile storage device). In this way, the impact on planning and production can be minimized. In some implementations, MCS 108 determines to reallocate mobile storage device 104 for other purposes and / or based on other factors.

[0044] like Figure 3C As illustrated, the mobile storage unit 104 autonomously moves from position 312 to position 314 (box 304) based on communication from the MCS 108. The mobile storage unit 104 is mounted on wheels 204. Figure 2B The wheel 204 moves to position 314 via the wheel motor 216. Figure 2B Driven by the controller 224, the wheel motor 216 is controlled to maneuver the mobile storage device 104 to position 314 via the semiconductor manufacturing facility 100. The controller 224 may use sensor data from sensors 222a to 222m to maneuver the mobile storage device 104 to avoid obstacles and navigate around obstacles, and / or prevent the mobile storage device 104 from colliding with other equipment and personnel in the semiconductor manufacturing facility 100.

[0045] Furthermore, controller 224 can control wheel motor 216 to maneuver mobile storage unit 104 through semiconductor manufacturing facility 100 to location 314 based on a navigation map of semiconductor manufacturing facility 100. The navigation map can be generated by navigation system 218 (e.g., using navigation devices 220a to 220n and / or sensors 222a to 222m) or provided to mobile storage unit 104 or a combination thereof via MCS 108. In these embodiments, navigation system 218 provides navigation input to controller 224 to autonomously navigate mobile storage unit 104 from location 312 to location 314 based on the navigation map.

[0046] Navigation system 218 can use a navigation map to determine a path from location 312 to location 314 based on a location address associated with location 314. In some embodiments, the location address may be provided via MCS 108. In some embodiments, controller 224 or navigation system 218 determines the location address based on a location identifier provided by MCS 108. In some embodiments, controller 224 or navigation system 218 determines the location address based on other information identified in communications from MCS 108. As an example, communications from MCS 108 may instruct mobile storage unit 104 to reposition itself closer to a specific semiconductor processing tool, and controller 224 or navigation system 218 determines location 314 (and its associated location address) based on the fact that location 314 is close to the specific semiconductor processing tool and under overhead track 110. In this way, controller 224 or navigation system 218 determines location 314 such that mobile storage unit 104 will be close to the specific semiconductor processing tool and accessible by OHT vehicle 112 at location 314.

[0047] In addition to receiving communications from MCS 108 to relocate the mobile storage unit 104, controller 224 additionally or alternatively enables the mobile storage unit to autonomously travel to position 314 based on a navigation schedule (or production schedule). The navigation schedule may be received from MCS 108, programmed at the mobile storage unit 104, and / or received by the mobile storage unit 104 from another device. The navigation schedule identifies a sequence of positions within the semiconductor manufacturing facility 100 to which the mobile storage unit 104 will travel. Furthermore, the navigation schedule identifies the time at which the mobile storage unit 104 will reposition itself to each position in the position sequence. Therefore, controller 224 can autonomously determine, based on determining that position 314 is the next position in the position sequence in the navigation schedule, to reposition the mobile storage unit 104 from position 312 to position 314 at a specified time.

[0048] like Figure 3DAs illustrated, the mobile reservoir 104 arrives at position 314 and self-mounts at position 314 (box 306). The self-mounting process includes deploying one or more fastening devices to anchor the mobile reservoir 104 to the bottom layer of the semiconductor manufacturing facility 100 at position 314. The mobile reservoir 104 is secured in place at position 314 to prevent the mobile reservoir 104 from moving, tilting, and / or otherwise becoming unstable. In some embodiments, the controller 224 communicates with the transport system 122 to cause the drill bit 210 to drill a hole into the bottom layer of the semiconductor manufacturing facility 100, and to cause the anchor 212 to be inserted into the hole in the bottom layer to secure the mobile reservoir 104 in place. In some embodiments, the controller 224 communicates with the transport system 122 to cause the anchor 212 to be inserted into the hole pre-drilled into the bottom layer of the semiconductor manufacturing facility 100.

[0049] In some embodiments, the anchor 212 raises or lifts the wheels 204 of the mobile storage device 104 away from the bottom layer of the semiconductor manufacturing facility 100 to prevent the mobile storage device 104 from moving on the wheels 204. In some embodiments, the wheels 204 retract so that the mobile storage device 104 is supported by the anchor 212 to prevent the mobile storage device 104 from moving on the wheels 204.

[0050] like Figure 3E As illustrated, the mobile storage unit 104, MCS 108, and transport system 102 can establish a communication connection and communicate to configure one or more parameters for the mobile storage unit 104 (block 308). The mobile storage unit 104 can maintain a communication connection with the MCS 108, or can establish a new communication connection with the MCS 108 once at location 314 (e.g., using communication interface 226). The communication connection with the MCS 108 can include a wireless communication connection and / or a wired communication connection. In embodiments where the communication connection with the MCS 108 is a wired communication connection, the mobile storage unit 104 can automatically establish a physical connection for the wired communication connection (e.g., automatically insert a network connection cable into a network connection port) or can manually establish a wired communication connection.

[0051] The transport system 102 and the mobile storage unit 104 can establish a wireless communication connection (e.g., using communication interface 228) through a handshake procedure. The handshake procedure includes an E84 handshake procedure or another type of communication establishment handshake procedure, where handshake signals for parallel input / output interfaces are used to automate transport vehicle delivery and removal. In some embodiments, the handshake procedure is performed between the transport system 102 and the mobile storage unit 104 for each transport vehicle delivery or removal operation. In some embodiments, the handshake procedure is performed between the transport system 102 and the mobile storage unit 104 for the exchange of multiple transport vehicles 106.

[0052] In some embodiments, the mobile storage device 104 transmits communication (e.g., using communication interface 226) to the MCS 108 to indicate that the mobile storage device 104 has arrived and is secured at location 314. In some embodiments, the mobile storage device 104 transmits communication (e.g., using communication interface 226 and / or communication interface 228) to the MCS 108 and / or the transport system 102 to indicate one or more parameters for the mobile storage device 104. Alternatively or additionally, the MCS 108, the mobile storage device 104, and the OHT vehicle 112 negotiate one or more parameters for the mobile storage device 104. These one or more parameters include those facilitating the provision and / or receipt of the transport vehicle 106 at location 314, including location identifiers, loading port identifiers, and unloading port identifiers, among others.

[0053] The loading port identifier contains an identifier associated with the mobile storage unit 104, indicating that a loading operation will be performed in conjunction with the mobile storage unit 104. For example, the MCS 108 may use the loading port identifier to instruct the OHT vehicle 112 to load the transport vehicle 106 from the mobile storage unit 104 (e.g., to a port of the mobile storage unit 104) at location 314. The unloading port identifier contains an identifier associated with the mobile storage unit 104, indicating that an unloading operation will be performed in conjunction with the mobile storage unit 104. For example, the MCS 108 may use the unloading port identifier to instruct the OHT vehicle 112 to unload the transport vehicle 106 to the mobile storage unit 104 (e.g., to an unloading port of the mobile storage unit 104) at location 314.

[0054] Once a communication connection is established and one or more parameters for the mobile storage unit 104 are configured, the mobile storage unit 104 can be accessed by the transport system 102 at location 314. In some embodiments, the MCS 108 transmits a location identifier associated with location 314 and an instruction to unload the transport vehicle 106 (e.g., via top opening 116) to the mobile storage unit 104 at location 314 to the OHT vehicle 112. In these embodiments, the instruction may indicate an unloading port identifier associated with the mobile storage unit 104. In some embodiments, the MCS 108 transmits a location identifier associated with location 314 and an instruction to retrieve the transport vehicle 106 from the mobile storage unit 104 at location 314 (e.g., via top opening 116) to the OHT vehicle 112. In these embodiments, the instruction may indicate a loading port identifier associated with the mobile storage unit 104.

[0055] like Figure 3FAs illustrated, MCS 108 can transmit communication to the mobile storage device 104 at location 314 to reassign the mobile storage device 104 to another location (box 310). MCS 108 and mobile storage device 104 can perform one or more of the operations described in combination of boxes 302 to 308 to reassign the mobile storage device 104 to another location.

[0056] As indicated above, Figures 3A to 3F Provided as an instance. Other instances can be compared to... Figures 3A to 3F The instances described are different.

[0057] Figure 4A and Figure 4B This is a diagram of the example implementation scheme 400 described in this document. (See diagram for example.) Figure 4A and Figure 4B As illustrated, Example Implementation 400 includes an example process of accessing a mobile storage device 104 in a semiconductor manufacturing facility 100 using a mobile transport vehicle 402. In some embodiments, one or more of the operations of Example Implementation 300 may be combined with Example Implementation 400 to reposition the mobile storage device 104 before and / or after the mobile transport vehicle 402 accesses the mobile storage device 104.

[0058] Mobile transport vehicle 402 includes ground-based transport vehicles capable of automatically and / or autonomously traveling along the bottom layer of the semiconductor manufacturing facility 100. Mobile transport vehicle 402 includes AVGs, mobile robots, and / or similar types of mobile transport vehicles.

[0059] like Figure 4A As illustrated, MCS 108 can transmit communication 404 to the mobile transport vehicle 402. The communication indicates a location identifier associated with the location of the mobile storage unit 104. The communication further indicates instructions to unload the transport vehicle 106 into or retrieve the transport vehicle 106 from the assembly waiting area 118 of the mobile storage unit at the location.

[0060] like Figure 4B As illustrated, the mobile transport vehicle 402 travels to the location of the mobile storage unit 104 based on a location identifier. As illustrated by reference numeral 406 in the attached figure, the mobile transport vehicle 402 may approach the mobile storage unit 104 through the assembly waiting area 118 to retrieve the transport carrier 106 from the mobile storage unit 104 and / or deliver the transport carrier 106 to the mobile storage unit 104.

[0061] As indicated above, Figure 4A and Figure 4B Provided as an instance. Other instances can be compared to... Figure 4A and Figure 4B The instances described are different.

[0062] Figure 5 The diagram illustrates example components of device 500, which may correspond to the control system 214, wheel motor 216, navigation system 218, navigation devices 220a to 220n, sensors 222a to 222m, controller 224, and / or another device described herein, of the MCS 108, OHT vehicle 112, mobile storage device 104, and other devices. In some embodiments, the control system 214, wheel motor 216, navigation system 218, navigation devices 220a to 220n, sensors 222a to 222m, controller 224, and / or another device described herein may comprise one or more devices 500 and / or one or more components of device 500. Figure 5 As illustrated, device 500 may include bus 510, processor 520, memory 530, storage component 540, input component 550, output component 560, and communication component 570.

[0063] Bus 510 includes components for wired and / or wireless communication among the components of device 500. Processor 520 includes a central processing unit, graphics processing unit, microprocessor, controller, microcontroller, digital signal processor, field-programmable gate array, application-specific integrated circuit, and / or another type of processing component. Processor 520 is implemented in hardware, firmware, or a combination of hardware and software. In some embodiments, processor 520 includes one or more processors that can be programmed to perform functions. Memory 530 includes random access memory, read-only memory, and / or another type of memory (e.g., flash memory, magnetic memory, and / or optical memory).

[0064] Storage component 540 stores information and / or software related to the operation of device 500. For example, storage component 540 may include a hard disk drive, disk drive, optical disk drive, solid-state drive, compressed optical disk, digital versatile optical disk, and / or another type of non-transitory computer-readable media. Input component 550 enables device 500 to receive input, such as user input and / or sensor input. For example, input component 550 may include a touchscreen, keyboard, keypad, mouse, buttons, microphone, switch, sensor, GPS component, accelerometer, gyroscope, and / or actuator. Output component 560 enables device 500 to provide output, for example, via a display, speaker, and / or one or more light-emitting diodes. Communication component 570 enables device 500 to communicate with other devices, for example, via a wired connection and / or wireless connection. For example, communication component 570 may include a receiver, transmitter, transceiver, modem, network interface card, and / or antenna.

[0065] Device 500 may perform one or more of the processes described herein. For example, a non-transitory computer-readable medium (e.g., memory 530 and / or storage component 540) may store a set of instructions (e.g., one or more instructions, code, software code, and / or program code) that can be executed by processor 520. Processor 520 may execute the set of instructions to perform one or more of the processes described herein. In some embodiments, the set of instructions is executed by one or more processors 520 to cause one or more processors 520 and / or device 500 to perform one or more of the processes described herein. In some embodiments, hardwired circuitry may be used in place of or in combination with instructions to perform one or more of the processes described herein. Therefore, the embodiments described herein are not limited to any particular combination of hardware circuitry and software.

[0066] Figure 5 The number and arrangement of components shown are provided as examples. Figure 5 Compared to the components illustrated herein, device 500 may include additional components, fewer components, different components, or components arranged in a different manner. Alternatively, a set of components of device 500 (e.g., one or more components) may be described as performing one or more functions by another set of components of device 500.

[0067] Figure 6 This is a flowchart of an example process 600 associated with the operation of a moving feeder. In some implementations, Figure 6 One or more process frames can be executed by a moving feeder (e.g., moving feeder 104). In some embodiments, Figure 6One or more process frames may be performed by another device or group of devices separate from or including the mobile storage unit, such as a transport system (e.g., transport system 102) and / or an MCS (e.g., MCS 108), and other examples. Alternatively or additionally, Figure 6 One or more process blocks may be executed by one or more components of device 500, such as processor 520, memory 530, storage component 540, input component 550, output component 560, and / or communication component 570. In some embodiments, one or more operations described in process 600 may be performed in conjunction with the example embodiment 300 described above.

[0068] like Figure 6 As illustrated, process 600 may include receiving communication indicating a location identifier associated with a second location in a semiconductor manufacturing facility (block 610). For example, as described above, a mobile reservoir 104 located at a first location 312 may receive communication indicating a location identifier associated with a second location 314 in the semiconductor manufacturing facility 100.

[0069] like Figure 6 As further illustrated, process 600 may include autonomously moving from a first position to a second position using a location identifier (box 620). For example, as described above, the moving feeder 104 may autonomously move from a first position 312 to a second position 314 using a location identifier.

[0070] like Figure 6 As further illustrated, process 600 may include deploying one or more fastening devices to secure the mobile storage device in the appropriate position at the second location (box 630). For example, as described above, the mobile storage device 104 may be deployed with one or more fastening devices (e.g., drill bit 210, anchor 212) to secure the mobile storage device 104 in place at the second location 314.

[0071] like Figure 6 As further illustrated, process 600 may include transmitting an indication of one or more parameters associated with the second position after being secured to the appropriate position, to facilitate the provision or receipt of a transport vehicle at the second position (box 640). For example, as described above, the mobile storage device 104 may transmit an indication of one or more parameters associated with the second position 314 after being secured to the appropriate position, to facilitate the provision or receipt of a transport vehicle at the second position (106).

[0072] Process 600 may include additional embodiments, such as any single embodiment or any combination of one or more other processes described below and / or in combination with those described elsewhere in this document.

[0073] In a first embodiment, the instruction to transmit one or more parameters includes transmitting the instruction to at least one of the MCS 108 or the transport system 102. In a second embodiment, individually or in combination with the first embodiment, the one or more parameters include at least one of a load port identifier, an unload port identifier, or a location identifier. In a third embodiment, individually or in combination with one or more of the first and second embodiments, process 600 includes generating a navigation map of the semiconductor manufacturing facility 100 and autonomously navigating to a second location 314 using the navigation map.

[0074] In a fourth embodiment, generating a navigation map, either alone or in combination with one or more of the first to third embodiments, includes generating the navigation map using SLAM technology. In a fifth embodiment, either alone or in combination with one or more of the first to fourth embodiments, process 600 includes receiving a navigation plan from MCS 108 identifying a sequence of locations within the semiconductor manufacturing facility 100, wherein a first location and a second location are included in the location sequence, and traveling from the first location to the second location includes autonomously traveling from the first location to the second location based on the navigation plan.

[0075] although Figure 6 The diagram illustrates an instance of process 600, but in some implementations, it is different from... Figure 6 Compared to the boxes depicted, process 600 may include additional boxes, fewer boxes, different boxes, or boxes arranged in a different manner. Alternatively, two or more boxes of process 600 may be performed in parallel.

[0076] Figure 7 This is a flowchart of an example process 700 associated with the operation of a moving feeder. In some implementations, Figure 7 One or more process blocks can be executed by an MCS (e.g., MCS 108). In some implementations, Figure 7 One or more process frames may be performed by another device or group of devices separate from or including the MCS, such as a transport system (e.g., transport system 102) and / or a mobile storage device (e.g., mobile storage device 104), and other examples. Alternatively or additionally, Figure 7 One or more process frames may be performed by one or more components of the device 500, such as processor 520, memory 530, storage component 540, input component 550, output component 560 and / or communication component 570.

[0077] like Figure 7 As illustrated, process 700 may include deciding to reposition the moving reservoir from a first position to a second position (box 710). For example, as described above, MCS 108 may decide to reposition the moving reservoir 104 from a first position 312 to a second position 314.

[0078] like Figure 7 As further illustrated, process 700 may include transmitting a first communication (box 720) instructing the mobile storage device to reposition to a second position based on a determination to reposition the mobile storage device. For example, as described above, MCS 108 may transmit a first communication instructing the mobile storage device 104 to reposition to a second position 314 based on a determination to reposition the mobile storage device 104.

[0079] like Figure 7 As further illustrated, process 700 may include receiving a second communication (block 730) from the mobile storage device indicating that the mobile storage device is in a second position. For example, as described above, MCS 108 may receive a second communication from the mobile storage device 104 indicating that the mobile storage device 104 is in a second position 314.

[0080] like Figure 7 As further illustrated, process 700 may include transmitting a third communication indicating a location identifier associated with the second location and instructions to unload the transport vehicle onto or retrieve the transport vehicle from the mobile storage unit at the second location to the OHT vehicle (box 740). For example, as described above, MCS 108 may transmit a third communication indicating a location identifier associated with the second location 314 and instructions to unload the transport vehicle 106 onto or retrieve the transport vehicle 106 from the mobile storage unit 104 at the second location 314 to the OHT vehicle 112.

[0081] Process 700 may include additional embodiments, such as any single embodiment or any combination of embodiments of one or more other processes described below and / or in combination with those described elsewhere in this document.

[0082] In a first embodiment, determining to reposition the mobile storage unit 104 from a first location 312 to a second location 314 includes determining to reposition the mobile storage unit 104 from the first location 312 to the second location 314 based on the production needs of the semiconductor processing tool at the second location 314 to support the production needs of the semiconductor processing tool. In a second embodiment, either alone or in combination with the first embodiment, process 700 includes transmitting a fourth communication indicating a location identifier (e.g., communication 404) and instructions to unload the transport carrier 106 into or retrieve the transport carrier 106 from the assembly waiting area 118 of the mobile storage unit at the second location 314 to a mobile robot (e.g., a mobile transport vehicle 402).

[0083] In a third embodiment, either alone or in combination with one or more of the first and second embodiments, the third communication indicates an instruction to unload the transport carrier 106 to the mobile storage unit 104 at the second location 314, and the third communication further indicates an unloading port identifier associated with the unloading port of the transport carrier 106. In a fourth embodiment, either alone or in combination with one or more of the first to third embodiments, the third communication indicates an instruction to load the transport carrier 106 from the mobile storage unit 104 at the second location 314, and the third communication further indicates a loading port identifier associated with the loading port of the transport carrier 106.

[0084] Although Figure 7 The diagram shows an instance frame of process 700, but in some implementations, it is different from... Figure 7 Compared to the frames depicted, process 700 may include additional frames, fewer frames, different frames, or frames arranged in a different manner. Alternatively, two or more frames of process 700 may be performed in parallel.

[0085] In this way, the mobile storage unit described herein is configured for easy installation and repositioning to various locations within a semiconductor manufacturing facility. The mobile storage unit can be programmed according to the layout of the semiconductor manufacturing facility and / or autonomously learn the layout, automatically repositioning itself to a new location based on the layout using a navigation system. Therefore, the mobile storage unit can flexibly reposition itself within the semiconductor manufacturing facility to dynamically support changes in demand and production capacity. Furthermore, the ability to quickly assign location identifiers to the mobile storage unit and automatically interface with the transport system within the semiconductor manufacturing facility reduces downtime, thereby increasing productivity within the semiconductor manufacturing facility.

[0086] As described in more detail above, some embodiments described herein provide a mobile storage device. The mobile storage device includes storage units configured to store a plurality of transport vehicles. The storage unit includes at least one of a plurality of rows configured to store a respective subset of the plurality of transport vehicles or a plurality of columns configured to store a respective subset of the plurality of transport vehicles.

[0087] The mobile storage device includes multiple wheels located at the bottom of the storage unit, configured to allow movement of the mobile storage device. The mobile storage device includes a navigation system configured to autonomously navigate the mobile storage device within a semiconductor manufacturing facility.

[0088] In the aforementioned mobile storage device, the navigation system includes one or more navigation devices, which include at least one of the following: a global positioning system device, a radio station calibration device, a fast response code reader device, or a simultaneous positioning and mapping device.

[0089] In the aforementioned mobile storage device, the navigation system includes one or more sensors, the sensors comprising at least one of the following: a camera sensor, an inertial sensor, a lidar sensor, or a proximity sensor.

[0090] The aforementioned mobile storage device further includes one or more anchors configured to raise the storage unit away from the bottom layer of the semiconductor manufacturing facility, such that the plurality of wheels do not contact the bottom layer.

[0091] The aforementioned mobile storage device further includes one or more drill bits configured to drill holes into the underlying layer of the semiconductor manufacturing facility for securing the one or more anchors.

[0092] The aforementioned mobile storage device further includes: a first communication interface configured to communicate with the material control system.

[0093] In the aforementioned mobile storage device, the first communication interface is configured to receive a location address associated with a location in the semiconductor manufacturing facility from the material control system; and the navigation system is configured to autonomously navigate the mobile storage device to the location on the plurality of wheels based on the location address.

[0094] The aforementioned mobile storage device further includes a second communication interface configured to communicate with an overhead lifting transport vehicle to perform at least one of the following: providing a transport vehicle to the overhead lifting transport vehicle at the location, or receiving a transport vehicle from the overhead lifting transport vehicle at the location.

[0095] In the aforementioned mobile storage device, the second communication interface is configured to perform a handshake procedure with the overhead lifting transport vehicle to establish a communication connection with the overhead lifting transport vehicle.

[0096] As described in more detail above, some embodiments described herein provide a method. The method includes receiving communication via a mobile storage device at a first location in a semiconductor manufacturing facility, indicating a location identifier associated with a second location in the semiconductor manufacturing facility. The method includes autonomously moving from the first location to the second location via the mobile storage device and using the location identifier. The method includes deploying one or more fastening devices via the mobile storage device to secure the mobile storage device to an appropriate position at the second location. The method includes, after the mobile storage device is secured to an appropriate position at the second location, transmitting via the mobile storage device an indication of one or more parameters associated with the second location to facilitate the provisioning or receiving of a transport carrier at the second location.

[0097] In the above method, the instruction to transmit the one or more parameters includes: transmitting the instruction to at least one of the following: a material control system or an elevated lifting and transport system.

[0098] In the above method, the one or more parameters include at least one of the following: load port identifier, unload port identifier, or location identifier.

[0099] The above method further includes: generating a navigation map of the semiconductor manufacturing facility; and autonomously navigating to the second location using the navigation map.

[0100] In the above method, generating the navigation map includes: generating the navigation map using simultaneous localization and mapping (SMR) technology.

[0101] The above method further includes: receiving from a material control system a navigation plan identifying a sequence of locations in the semiconductor manufacturing facility, wherein the first location and the second location are included in the sequence of locations; and autonomously navigating from the first location to the second location based on the navigation plan.

[0102] As described in more detail above, some embodiments described herein provide a method. The method includes determining, via the MCS (Multi-Semiconductor System) of a semiconductor manufacturing facility, to reposition a mobile storage unit from a first location to a second location. The method includes transmitting, via the MCS and based on the determination to reposition the mobile storage unit, a first communication indicating that the mobile storage unit will be repositioned to the second location. The method includes receiving, via the MCS and from the mobile storage unit, a second communication indicating that the mobile storage unit is in the second location. The method includes transmitting, via the MCS, a third communication indicating a location identifier associated with the second location and an instruction to unload a transport vehicle onto the mobile storage unit at the second location or to retrieve a transport vehicle from the mobile storage unit at the second location, to an OHT (Out-of-House Transport) vehicle.

[0103] In the above method, determining to reposition the mobile storage device from the first position to the second position includes: determining to reposition the mobile storage device from the first position to the second position based on the production needs of the semiconductor processing tool at the second position, so as to support the production needs of the semiconductor processing tool.

[0104] The above method further includes transmitting a fourth communication to the mobile robot indicating the following: the location identifier, and an instruction to unload the transport vehicle into the assembly waiting area of ​​the mobile storage unit at the second location or to retrieve the transport vehicle from the assembly waiting area at the second location.

[0105] In the above method, the third communication indicates the instruction to unload the transport vehicle to the mobile storage device at the second location; and the third communication further indicates an unloading port identifier associated with the unloading port for unloading the transport vehicle.

[0106] In the above method, the third communication indicates the instruction to load the transport vehicle from the mobile storage unit at the second location; and the third communication further indicates a loading port identifier associated with the loading port where the transport vehicle will be loaded.

[0107] The foregoing summary of the features of several embodiments enables those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art will understand that this disclosure can be readily used as the basis for designing or modifying other processes and structures for implementing the embodiments introduced herein and / or achieving the same objectives and / or advantages. Those skilled in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made herein without departing from the spirit and scope of this disclosure.

Claims

1. A mobile storage device, comprising: The storage unit is configured to store multiple transport vehicles. The storage unit described herein includes at least one of the following: Multiple rows, configured to store corresponding subsets of the multiple transport vehicles, or Multiple columns are configured to store corresponding subsets of the multiple transport vehicles; Multiple wheels are located at the bottom of the storage unit and configured to allow the mobile storage device to move; One or more anchors are configured to raise the storage cell away from the bottom layer of the semiconductor manufacturing facility, such that the plurality of wheels do not contact the bottom layer; One or more drill bits are configured to drill holes into the underlying layer of the semiconductor manufacturing facility for securing the one or more anchors; as well as A navigation system configured to autonomously navigate the mobile storage unit within the semiconductor manufacturing facility.

2. The mobile storage device of claim 1, wherein the navigation system comprises one or more navigation devices, the navigation devices comprising at least one of the following: Global Positioning System (GPS) devices Wireless station calibration device, Fast response code reader device, or Simultaneous positioning and mapping device.

3. The mobile storage device of claim 1, wherein the navigation system comprises one or more sensors, the sensors comprising at least one of the following: Camera sensor, Inertial sensors, LiDAR sensor, or Proximity sensor.

4. The mobile storage device according to claim 1, further comprising: The first communication interface is configured to communicate with the material control system.

5. The mobile storage device according to claim 4, wherein the first communication interface is configured to: Receive a location address associated with a location within the semiconductor manufacturing facility from the material control system; and The navigation system is configured as follows: Based on the location address, the mobile storage device autonomously navigates to the location on the plurality of wheels.

6. The mobile storage device according to claim 5, further comprising: The second communication interface is configured to communicate with the elevated lifting transport vehicle to perform at least one of the following: The elevated lifting transport vehicle that provides the transport carrier to the location, or The transport vehicle receives the transport carrier from the elevated lifting transport vehicle at the location.

7. The mobile storage device according to claim 6, wherein the second communication interface is configured to perform a handshake procedure with the overhead lifting transport vehicle to establish a communication connection with the overhead lifting transport vehicle.

8. A method for operating a mobile storage device, comprising: Communication is received via a movable storage device at a first location in a semiconductor manufacturing facility, indicating a location identifier associated with a second location in the semiconductor manufacturing facility, wherein the movable storage device includes a storage unit, a plurality of wheels, one or more anchors, and one or more drill bits, the plurality of wheels being located at the bottom of the storage unit and configured to allow movement of the movable storage device, the one or more anchors being configured to raise the storage unit away from the bottom layer of the semiconductor manufacturing facility such that the plurality of wheels do not contact the bottom layer, and the one or more drill bits being configured to drill holes into the bottom layer of the semiconductor manufacturing facility for securing the one or more anchors; The device autonomously moves from the first location to the second location using the mobile storage device and the location identifier. One or more fastening devices are deployed via the mobile storage unit to secure the mobile storage unit in place at the second position. as well as After the mobile storage device is secured in place at the second position, an indication of one or more parameters associated with the second position is transmitted through the mobile storage device to facilitate the provision or receipt of a transport vehicle at the second position.

9. The method of operating a mobile storage device according to claim 8, wherein the instruction for transmitting the one or more parameters includes: The indication of the one or more parameters is transmitted to at least one of the following: Material control system, or Elevated transport system.

10. The method of operating the mobile storage device according to claim 8, wherein the one or more parameters include at least one of the following: Load port identifier, Unload port identifier, or Location identifier.

11. The method of operating the mobile storage device according to claim 8, further comprising: Generate a navigation map of the semiconductor manufacturing facility; as well as Use the navigation map to autonomously travel to the second location.

12. The method of operating a mobile storage device according to claim 11, wherein generating the navigation map comprises: The navigation map is generated using simultaneous localization and mapping (SMR) techniques.

13. The method of operating the mobile storage device according to claim 8, further comprising: Receive navigation plans from the materials control system, which identify the sequence of locations within the semiconductor manufacturing facility. The first position and the second position are included in the position sequence; and Based on the navigation plan, the vehicle autonomously travels from the first location to the second location.

14. A method for operating a mobile storage device, comprising: The material control system of the semiconductor manufacturing facility determines to reposition a mobile storage device from a first position to a second position, wherein the mobile storage device includes a storage unit, a plurality of wheels, one or more anchors, and one or more drill bits. The plurality of wheels are located at the bottom of the storage unit and configured to allow the mobile storage device to move. The one or more anchors are configured to raise the storage unit away from the bottom layer of the semiconductor manufacturing facility such that the plurality of wheels do not contact the bottom layer, and the one or more drill bits are configured to drill holes into the bottom layer of the semiconductor manufacturing facility for securing the one or more anchors. The material control system transmits a first communication instructing the mobile storage device to be repositioned to the second position based on the determination to reposition the mobile storage device. The material control system receives a second communication from the mobile storage device indicating that the mobile storage device is in the second position; as well as The material control system transmits third communication instructions to the elevated lifting transport vehicle: The location identifier associated with the second location, and Instructions to unload the transport vehicle onto the mobile storage unit at the second location or to retrieve the transport vehicle from the mobile storage unit at the second location.

15. The method of operating a mobile storage device according to claim 14, wherein determining to reposition the mobile storage device from the first position to the second position comprises: Based on the production needs of the semiconductor processing tool at the second location, it is determined that the mobile storage device should be repositioned from the first location to the second location to support the production needs of the semiconductor processing tool.

16. The method of operating the mobile storage device according to claim 14, further comprising: The fourth communication, which instructs the following items, will be transmitted to the mobile robot: The location identifier, and Instructions to unload the transport vehicle into the assembly and waiting area of ​​the mobile storage unit at the second location or to retrieve the transport vehicle from the assembly and waiting area at the second location.

17. The method of operating a mobile storage device according to claim 14, wherein the third communication indicates the instruction to unload the transport carrier to the mobile storage device at the second location; and The third communication further indicates an unloading port identifier associated with the unloading port where the transport vehicle will be unloaded.

18. The method of operating a mobile storage device according to claim 14, wherein the third communication indicates the instruction to load the transport carrier from the mobile storage device at the second location; and The third communication further indicates a loading port identifier associated with the loading port on which the transport vehicle will be loaded.

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