Backlight module and method for preparing the same

Abstract

The present application discloses a backlight module and a preparation method thereof. The backlight module includes: a substrate; light-emitting chips, which are arranged in an array on the substrate; a barrier structure, which is arranged between adjacent light-emitting chips; a temperature-responsive light-emitting layer, which covers the light-emitting chips; wherein, the material of the barrier structure includes a temperature-responsive reflective material; the material of the temperature-responsive light-emitting layer includes a temperature-responsive reflective material. The backlight module of the present application can spontaneously adjust the light intensity according to the ambient temperature or light intensity, thereby greatly increasing the eye comfort of viewers.

Description

Technical Field

[0001] The present application relates to the field of display technology, and particularly relates to a backlight module and a preparation method thereof. Background Art

[0002] In recent years, Mini-LED display technology has become a hot spot for major panel manufacturers due to its outstanding advantages and rapid development. Compared with current LCD and OLED display devices, both have advantages such as fast response, high color gamut, high PPI, low power consumption, precise dimming with an ultra-high number of partitions, and ultra-high contrast. Defining MicroLED and MiniLED technologies collectively as MLED technology is a technology that transfers LEDs to a backplane, and the backplane itself or the transferred device drives the LEDs to emit light; such products can be used as backlights, and the LED blue light plays a role in zonal control. In addition, those with a small pitch (Pitch / pixel pitch) can be used as direct display products. However, in the design of small-pitch light-emitting diodes (MiniLED) on a glass substrate, when ambient light irradiates the glass surface, reflection will occur, which may cause the problem that viewers may not be able to clearly see the picture. Moreover, there are differences in the reflectivity at various places on the glass (such as pixel positions, between pixels, and glass splicing points), which easily leads to different degrees of distortion of the picture.

[0003] Therefore, there is an urgent need to provide a backlight module that can have a more intelligent and multi-stimulus factor adjustment method for the light output to reduce the phenomenon of different degrees of distortion of the picture caused by ambient light. Summary of the Invention

[0004] The purpose of the present application is to provide a backlight module that can reduce the phenomenon of picture distortion and increase eye comfort.

[0005] An embodiment of the present application provides a backlight module, including:

[0006] A substrate;

[0007] Light-emitting chips, arranged in an array on the substrate;

[0008] A retaining wall structure, arranged between adjacent light-emitting chips;

[0009] A temperature-responsive light-emitting layer, covering the light-emitting chips;

[0010] Wherein, the material of the retaining wall structure includes a temperature-responsive reflective material; the material of the temperature-responsive light-emitting layer includes a temperature-responsive reflective material.

[0011] Optionally, in some embodiments of the present application, the light-emitting chips are LED light-emitting chips.

[0012] Optionally, in some embodiments of the present application, in the material of the retaining wall structure, the weight percentage of the temperature-responsive reflective material is 75-90 wt%.

[0013] Optionally, in some embodiments of the present application, in the material of the temperature-responsive light-emitting layer, the weight percentage of the temperature-responsive reflective material is 95-98 wt%.

[0014] Optionally, in some embodiments of the present application, the material of the retaining wall structure includes, by weight percentage: the temperature-responsive reflective material as the main body: 75-90 wt%; carbon powder: 7-10 wt%; dispersant: 0.2-0.5 wt%.

[0015] Optionally, in some embodiments of the present application, the material of the temperature-responsive light-emitting layer includes, by weight percentage: the temperature-responsive reflective material as the main body: 95-98 wt%; other additives: 2-5 wt%.

[0016] Optionally, in some embodiments of the present application, the surface of the retaining wall structure facing away from the substrate is a rough surface.

[0017] Optionally, in some embodiments of the present application, the thickness of the retaining wall structure is 1-2 μm.

[0018] Optionally, in some embodiments of the present application, the raw materials of the temperature-responsive reflective material include: acrylamide, sodium dodecyl sulfate, and stearyl methacrylate.

[0019] Optionally, in some embodiments of the present application, in the retaining wall structure, when the temperature drops below T1, the temperature-responsive units in the temperature-responsive reflective material aggregate in the micelles, causing the micelle size to increase, reducing the number of reflective particles of the temperature-responsive reflective material, and thus weakening the overall light-reflecting property of the retaining wall structure, resulting in a decrease in light intensity.

[0020] Optionally, in some embodiments of the present application, in the retaining wall structure, when the temperature rises above T1, the hydrogen bonds are broken, causing the micelle size to decrease, and the temperature-responsive units are gradually released, increasing the number of reflective particles in the temperature-responsive reflective material, and thus increasing the overall light-reflecting property of the retaining wall structure, resulting in an increase in light intensity.

[0021] Optionally, in some embodiments of the present application, T1 is 25-30 °C.

[0022] Correspondingly, an embodiment of the present application further provides a method for manufacturing a backlight module, including the following steps:

[0023] Provide a substrate;

[0024] Arrange a light-emitting chip on the substrate;

[0025] Form a barrier structure at the gap between adjacent light-emitting chips;

[0026] Form a temperature-responsive light-emitting layer on the light-emitting chip, and the temperature-responsive light-emitting layer covers the temperature-responsive light-emitting layer;

[0027] Among them, the material of the barrier structure includes a temperature-responsive reflective material; the material of the temperature-responsive light-emitting layer includes a temperature-responsive reflective material. The light-emitting chip is an LED light-emitting chip.

[0028] Optionally, in some embodiments of the present application, in the material of the barrier structure, the weight percentage of the temperature-responsive reflective material is 75-90 wt%.

[0029] Optionally, in some embodiments of the present application, in the material of the temperature-responsive light-emitting layer, the weight percentage of the temperature-responsive reflective material is 95-98 wt%.

[0030] Optionally, in some embodiments of the present application, the preparation raw materials of the temperature-responsive reflective material include: acrylamide, sodium dodecyl sulfate, stearyl methacrylate.

[0031] Optionally, in some embodiments of the present application, the preparation method of the temperature-responsive reflective material includes the following steps:

[0032] Dissolve sodium dodecyl sulfate in an NaCl solution, a LiCl solution or a KCl solution, and stir until the solution becomes transparent;

[0033] Then add stearyl methacrylate to the solution and continue stirring;

[0034] Add acrylamide monomer and dissolve it, introduce nitrogen, then add a cross-linking agent, an initiator and a catalyst, and stir to obtain a temperature-responsive reflective material.

[0035] The cross-linking agent can be N,N'-methylenebisacrylamide. The initiator can be persulfuric acid. The catalyst can be N,N,N',N'-tetramethylethylenediamine.

[0036] Optionally, in some embodiments of the present application, the formation process of the temperature-responsive light-emitting layer includes the following steps:

[0037] Use the material of the temperature-responsive light-emitting layer to form a film and cure it in the area covering the temperature-responsive light-emitting layer to obtain the temperature-responsive light-emitting layer.

[0038] The beneficial effects of the present application are as follows:

[0039] The backlight module of the present application can automatically adjust the light intensity according to the ambient temperature or light intensity, thereby enhancing the eye comfort of viewers. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0041] Figure 1 It is a schematic structural diagram of the backlight module provided by the embodiment of the present application;

[0042] Figure 2 It is a schematic diagram of the action mechanism of the temperature-responsive reflective material provided by the embodiment of the present application;

[0043] Figure 3 It is a schematic diagram of the light rays acting on the backlight module provided by the embodiment of the present application;

[0044] Figure 4 It is a schematic structural diagram of the manufacturing process of the backlight module provided by the embodiment of the present application;

[0045] Figure 5 It is a curve graph of the light output intensity - temperature of the backlight module provided by the embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application. In addition, in the description of the present application, the term "including" means "including but not limited to". The terms first, second, third, etc. are only used as labels and do not impose numerical requirements or establish an order. The various embodiments of the present invention may exist in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be construed as a rigid limitation on the scope of the present invention; therefore, it should be considered that the described range description has specifically disclosed all possible sub-ranges and single values within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numbers within the range, such as 1, 2, 3, 4, 5, and 6, which applies regardless of the range. In addition, whenever a numerical range is indicated herein, it means including any cited number (fraction or integer) within the indicated range.

[0047] In the process of research, the inventors found that in the design of small-pitch light-emitting diodes (Mini LEDs) on a glass substrate, there are several directions for improvement that need to be considered: First, the problem of intelligent feedback of ambient temperature. According to the different environments where the display is located (such as in the shade and in direct sunlight, etc.), the amount of light output required for the human eye to read the display information is also different: the amount of light output required in the shade is smaller than that required in direct sunlight (generally speaking, the ambient temperature in the shade is also lower than that in direct sunlight). Therefore, the display needs a more intelligent and multi-stimulus factor adjustment method for the light output. Second, the problem of reflection of ambient light. The reflectivity of the glass itself is relatively high. When ambient light irradiates the glass surface, reflection will occur, which may cause the viewer to be unable to clearly see the picture. Moreover, the reflectivity varies at different positions on the glass (such as pixel positions, between pixels, and at the glass joints), which is likely to cause different degrees of distortion of the picture.

[0048] The embodiments of the present application provide a backlight module and a preparation method thereof. The following will be described in detail respectively. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments.

[0049] The embodiments of the present application provide a backlight module, including:

[0050] A substrate;

[0051] Light-emitting chips, arranged in an array on the substrate;

[0052] A retaining wall structure is disposed between adjacent light-emitting chips;

[0053] A temperature-responsive light-emitting layer covers the light-emitting chips.

[0054] Please refer to Figure 1 , an embodiment of the present application provides a backlight module 100, including: a substrate 110, an LED light-emitting chip 120, a retaining wall structure 130, and a temperature-responsive light-emitting layer 140.

[0055] In this embodiment, the LED light-emitting chip 120 is disposed on the substrate 110. Further, there are multiple LED light-emitting chips 120, and they are arranged in an array on the substrate 110.

[0056] In this embodiment, the retaining wall structure 130 is disposed between adjacent LED light-emitting chips 120. The temperature-responsive light-emitting layer 140 covers the LED light-emitting chips 120. It can be understood that the temperature-responsive light-emitting layer 140 is disposed between adjacent retaining wall structures 130 and covers the LED light-emitting chips 120.

[0057] In the embodiment of the present application, the material of the retaining wall structure 130 includes a temperature-responsive reflective material. The material of the temperature-responsive light-emitting layer 140 includes a temperature-responsive reflective material.

[0058] Please refer to Figure 2 , the characteristics of the temperature-responsive reflective material are as follows: when the temperature drops below T1, the temperature-responsive units in the temperature-responsive reflective material aggregate in the micelles, which can further increase the size of the micelles, reduce the number of its reflective particles, and weaken its overall light-reflecting property, resulting in a weakened light intensity; when the temperature rises above T1, the high temperature causes hydrogen bonds to break, and then the micelle size decreases, the temperature-responsive units are gradually released, increasing the number of its reflective particles and increasing its overall light-reflecting property, resulting in an enhanced light intensity. Specifically, in a place directly irradiated by sunlight, when the temperature is higher than T1, the high temperature triggers the temperature-responsive material to emit light, increasing the overall light output of the display and enhancing the light intensity; in a shady place, when the temperature is lower than T1, the temperature-responsive light-emitting layer is not triggered, and the overall light output of the display is not increased. Further, the temperature range of T1 can be 25 - 30 °C. For example, T1 can be 25 °C, 26 °C, 27 °C, 28 °C, 29 °C, or 30 °C.

[0059] It can be imagined that in the shaded area, i.e., when the temperature is lower than T1, the overall reflected light of the temperature-responsive reflective material weakens, resulting in a decrease in light intensity; in the direct sunlight area, i.e., when the temperature is higher than T1, the overall reflected light of the temperature-responsive reflective material increases, resulting in an increase in light intensity. Thus, by using the temperature-responsive reflective material of the present application, the reflection effect of the display can be spontaneously adjusted according to the ambient temperature or light intensity, enhancing eye comfort.

[0060] In some embodiments, in the material of the retaining wall structure 130, the weight percentage of the temperature-responsive reflective material is 75-90 wt%. For example, in the material of the retaining wall structure, the weight percentage of the temperature-responsive reflective material can be 75 wt%, 76 wt%, 80 wt%, 85 wt%, 88 wt% or 90 wt%.

[0061] In some embodiments, the material of the retaining wall structure 130 includes a temperature-responsive reflective material as the main material, and also includes carbon powder and a dispersant. For example, in the material of the retaining wall structure, the weight percentage of the carbon powder can be 7 wt%, 8 wt%, 9 wt% or 10 wt%. For example, in the material of the retaining wall structure, the weight percentage of the dispersant can be 0.2 wt%, 0.3 wt%, 0.4 wt% or 0.5 wt%.

[0062] In some embodiments, in the material of the temperature-responsive light-emitting layer 140, the weight percentage of the temperature-responsive reflective material is 95-98 wt%. For example, in the material of the temperature-responsive light-emitting layer, the weight percentage of the temperature-responsive reflective material can be 95 wt%, 96 wt%, 97 wt% or 98 wt%.

[0063] In some embodiments, the material of the temperature-responsive light-emitting layer 140 includes a temperature-responsive reflective material as the main material, and also includes other additives. For example, the weight percentage of the other additives in the material of the temperature-responsive light-emitting layer can be 2 wt%, 3 wt%, 4 wt% or 5 wt%.

[0064] In some embodiments, please continue to refer to Figure 1 , the surface of the retaining wall structure 130 facing away from the substrate 110 is a rough surface. It can be imagined that the surface of the retaining wall structure 130 facing away from the substrate 110 is not a smooth surface; for example, it is a matte surface. For example, the rough surface can be a serrated structure. Further, the thickness of the retaining wall structure can be 1-2 μm.

[0065] In the embodiments of the present application, the rough structure of the retaining wall structure 130 can enhance the light scattering on the upper top surface of the retaining wall structure, reduce the reflection of light in a single direction, and alleviate the problem that because the reflectivity of the glass itself is relatively high, when ambient light irradiates the glass surface, reflection will occur, resulting in the possibility that the viewer may not be able to clearly see the picture.

[0066] In some embodiments, the raw materials of the temperature-responsive reflective material include: acrylamide, sodium dodecyl sulfate, and stearyl methacrylate. Further, the raw materials of the temperature-responsive reflective material include: acrylamide, sodium dodecyl sulfate, ammonium persulfate, N,N'-methylenebisacrylamide, N,N,N',N'-tetramethylethylenediamine, stearyl methacrylate, lithium chloride (or sodium chloride, or potassium chloride), and deionized water. The raw materials and / or reagents used in the present application are all commercially available products. For example, the raw materials and reagents in the present application are purchased from Aladdin.

[0067] Please refer to Figure 3 , Figure 3 which shows the direction of the light rays of the backlight structure. Specifically, the backlight structure emits light from the LED light-emitting chip 120. Then, a part of the emitted light irradiates the retaining wall structure 130. Subsequently, the retaining wall structure 130 can reflect this part of the light rays. And, as known from the foregoing, the intensity of the reflected light rays of the retaining wall structure 130 can adjust the intensity of the light rays according to the temperature; at the same time, the light emitted by the LED light-emitting chip 120 will pass through the temperature-responsive light-emitting layer 140 and then emit from the backlight structure. As known from the foregoing, at this time, the temperature-responsive light-emitting layer 140 can adjust the intensity of the light rays according to the external temperature, thereby achieving the purpose of increasing eye comfort.

[0068] Please refer to Figure 4 , the embodiments of the present application further provide a method for manufacturing a backlight module, including the following steps:

[0069] Provide a substrate 110;

[0070] Arrange the LED light-emitting chip 120 on the substrate 110;

[0071] Form a retaining wall structure 130 at the gap between adjacent LED light-emitting chips 120;

[0072] Form a temperature-responsive light-emitting layer 140 on the LED light-emitting chip 120, and the temperature-responsive light-emitting layer 140 covers the temperature-responsive light-emitting layer 140;

[0073] Among them, the material of the retaining wall structure 130 includes a temperature-responsive reflective material; the material of the temperature-responsive light-emitting layer 140 includes a temperature-responsive reflective material.

[0074] In some embodiments, in the material of the retaining wall structure 130, the weight percentage of the temperature-responsive reflective material is 75-90 wt%. In the material of the temperature-responsive light-emitting layer 140, the weight percentage of the temperature-responsive reflective material is 95-98 wt%.

[0075] In some embodiments of the present application, the raw materials of the temperature-responsive reflective material include: acrylamide, sodium dodecyl sulfate, and stearyl methacrylate.

[0076] Further, the preparation raw materials of the temperature-responsive reflective material include: acrylamide, sodium dodecyl sulfate, ammonium persulfate, N,N'-methylenebisacrylamide, N,N,N',N'-tetramethylethylenediamine, stearyl methacrylate, lithium chloride, and deionized water. The lithium chloride therein can be replaced with sodium chloride or potassium chloride.

[0077] In some embodiments, the preparation method of the temperature-responsive reflective material includes the following steps:

[0078] Dissolve sodium dodecyl sulfate in an NaCl solution, a LiCl solution, or a KCl solution, and stir until the solution becomes transparent; then add stearyl methacrylate to the solution and continue stirring; subsequently, dissolve acrylamide monomer in the above solution, introduce nitrogen into the solution, and then add a crosslinking agent, an initiator, and a catalyst, and stir.

[0079] Further, the crosslinking agent can be N,N'-methylenebisacrylamide. The initiator can be persulfuric acid. The catalyst can be N,N,N',N'-tetramethylethylenediamine.

[0080] Further, the preparation method of the temperature-responsive reflective material includes the following steps:

[0081] Dissolve sodium dodecyl sulfate in an NaCl solution, a LiCl solution, or a KCl solution at 50°C, and stir until the solution becomes transparent;

[0082] Then add stearyl methacrylate to the solution and continue stirring (150-250 rpm) for 0.5-1.5 hours;

[0083] Subsequently, dissolve acrylamide monomer in the above solution, introduce nitrogen into the solution for 20-40 minutes, and then add a crosslinking agent, an initiator, and a catalyst; meanwhile, stir at a stirring speed of 300-500 rpm for 10-20 minutes to obtain the temperature-responsive reflective material.

[0084] Further, the preparation method of the temperature-responsive reflective material includes the following steps:

[0085] Dissolve sodium dodecyl sulfate in an NaCl solution, a LiCl solution, or a KCl solution at 50 °C, and stir until the solution becomes transparent;

[0086] Then add stearyl methacrylate to the solution and continue stirring (200 revolutions per minute) for 1 hour;

[0087] Subsequently, dissolve acrylamide monomer in the above solution. After purging nitrogen into the solution for 30 minutes, add a crosslinking agent (such as N,N'-methylenebisacrylamide), an initiator (such as persulfuric acid), and a catalyst (such as N,N,N',N'-tetramethylethylenediamine); meanwhile, increase the stirring speed (400 revolutions per minute) and stir for 15 minutes.

[0088] Specifically, the preparation method of the temperature-responsive reflective material may include the following steps:

[0089] First, dissolve sodium dodecyl sulfate (2.10 g) in a 0.8 mol / L NaCl solution (or 0.8 mol / L LiCl, 0.8 mol / L KCl) (30 mL) at 50 °C, and stir until the solution becomes transparent. Then add stearyl methacrylate (0.25 g) to the solution and continue stirring (200 revolutions per minute) for 1 hour; subsequently, dissolve 1.5 g of acrylamide monomer in the above solution. After purging nitrogen into the solution for 30 minutes, add 0.003 g of N,N'-methylenebisacrylamide (crosslinking agent), 0.08 g of persulfuric acid (initiator), and 15 μL of N,N,N',N'-tetramethylethylenediamine (catalyst); meanwhile, increase the stirring speed (400 revolutions per minute) and stir vigorously for 15 minutes.

[0090] In some embodiments, the thickness of the retaining wall structure may be 1 to 2 μm. One side of the retaining wall structure 130 facing away from the substrate 110 is a rough surface. Further, continue to refer to Figure 4 , during the preparation process of the retaining wall structure 130, first form a prefabricated retaining wall structure 130' at the gap between adjacent LED light-emitting chips 120 on the substrate 110, and then roughen the surface of the prefabricated retaining wall structure 130' on the side facing away from the substrate 110 to finally obtain the retaining wall structure 130.

[0091] In some embodiments, the formation process of the temperature-responsive light-emitting layer 140 may include the following steps: Using the material of the temperature-responsive light-emitting layer, form a film in the area covering the temperature-responsive light-emitting layer and cure it to obtain the temperature-responsive light-emitting layer. Further, the curing temperature is 80 °C and the curing time is 30 min.

[0092] In some embodiments, the temperature-responsive light-emitting layer 140 can be formed by the following method: using a template to pre-form the pattern to be formed on the substrate 110, and then performing hot pressing at 80 °C after attachment.

[0093] In the embodiments of the present application, the relationship between the light-emitting intensity and temperature of the obtained backlight module is also detected, and Figure 5 . According to Figure 5 it can be seen that the light-emitting intensity of the backlight module of the present application can be changed according to the temperature, thereby achieving an intelligent light-emitting adjustment effect.

[0094] In summary, in view of the problem of intelligent feedback to the ambient temperature and the drawback of ambient light reflection in the present application, it is proposed to use a temperature-responsive reflective material to achieve an intelligent light-emitting adjustment effect for the display. Specifically, in direct sunlight, that is, when the temperature is high, the high temperature triggers the temperature-responsive material to emit light, increasing the overall light output of the display and strengthening the light intensity; in the shade, that is, when the temperature is low, the temperature-responsive light-emitting layer is not triggered and does not increase the overall light output of the display.

[0095] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0096] The above has introduced in detail a backlight module and a method for preparing the same provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A backlight module, characterized in that, Comprising: Substrate; Light-emitting chips, arranged in an array on the substrate; Barrier structure, arranged between adjacent light-emitting chips; Temperature-responsive light-emitting layer, covering the light-emitting chips; Wherein, the material of the barrier structure comprises a temperature-responsive reflective material; the material of the temperature-responsive light-emitting layer comprises a temperature-responsive reflective material; One side surface of the barrier structure facing away from the substrate is a rough surface.

2. The backlight module according to claim 1, characterized in that, In the material of the barrier structure, the weight percentage of the temperature-responsive reflective material is 75-90wt%; In the material of the temperature-responsive light-emitting layer, the weight percentage of the temperature-responsive reflective material is 95-98wt%.

3. The backlight module according to claim 1, characterized in that, The material of the barrier structure comprises by weight percentage: temperature-responsive reflective material as the main body: 75-90wt%; carbon powder: 7-10wt%; dispersant: 0.2-0.5wt%; The material of the temperature-responsive light-emitting layer comprises by weight percentage: temperature-responsive reflective material as the main body: 95-98wt%; other additives: 2-5wt%.

4. The backlight module according to claim 1, characterized in that, The thickness of the barrier structure is 1-2μm.

5. The backlight module according to claim 1, characterized in that, The raw materials of the temperature-responsive reflective material include: acrylamide, sodium dodecyl sulfate, stearyl methacrylate.

6. A method for manufacturing a backlight module, characterized in that, Including the following steps: Provide a substrate; Arrange light-emitting chips on the substrate; Form a barrier structure in the gap between adjacent light-emitting chips; Form a temperature-responsive light-emitting layer on the light-emitting chips, and the temperature-responsive light-emitting layer covers the light-emitting chips; Wherein, the material of the barrier structure comprises a temperature-responsive reflective material; the material of the temperature-responsive light-emitting layer comprises a temperature-responsive reflective material; One side surface of the barrier structure facing away from the substrate is a rough surface.

7. The method for manufacturing a backlight module according to claim 6, characterized in that, In the material of the barrier structure, the weight percentage of the temperature-responsive reflective material is 75-90wt%; In the material of the temperature-responsive light-emitting layer, the weight percentage of the temperature-responsive reflective material is 95-98wt%.

8. The method for manufacturing a backlight module according to claim 6, characterized in that, The preparation method of the temperature-responsive reflective material includes the following steps: Dissolve sodium dodecyl sulfate in NaCl solution, LiCl solution or KCl solution, and stir until the solution becomes transparent; Add stearyl methacrylate to the solution and continue stirring; Add acrylamide monomer and dissolve, introduce nitrogen into the solution, then add a cross-linking agent, an initiator and a catalyst, and stir.

9. The method for manufacturing a backlight module according to claim 6, characterized in that, The formation process of the temperature-responsive light-emitting layer includes the following steps: Use the material of the temperature-responsive light-emitting layer to form a film and cure in the area covering the light-emitting chips to obtain the temperature-responsive light-emitting layer.

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