Integrated circuit package including a cross-dipole antenna

Abstract

An integrated circuit package is provided. The integrated circuit package includes a transceiver radio frequency integrated circuit (RFIC) and at least one antenna array formed in a redistribution metal layer of the integrated circuit package and arranged in a fan-out region of the RFIC. The at least one antenna array includes at least one cross-dipole antenna (10). Each cross-dipole antenna includes: a first dipole including two first legs (11); and a second dipole including two second legs (12); and two leg pairs (10a, 10b), each leg pair including a first leg of the first dipole and a second leg of the second dipole; and two feed lines (20a, 20b). Each feed line is coupled to a corresponding leg pair at a center (15) of the cross-dipole antenna. At least a portion of each feed line is arranged between the two leg pairs.

Description

Technical Field

[0001] The present invention generally relates to an integrated circuit package including at least one crossed dipole antenna. Background Art

[0002] The use of smart devices is growing exponentially, and smart devices generally need to be able to transmit and receive signals via wireless communication links. Further, the emergence of 5G has increased and will continue to increase the use of antennas operating in the 1 GHz to 30 GHz spectrum. Therefore, the use of millimeter wave antennas is increasing rapidly. Some solutions use antennas integrated with integrated circuit chips. For example, the integrated circuit chip can be an RF chip using integrated fan-out wafer-level packaging (InFO-WLP) technology or similar packaging technology. The transmission line of such a solution typically uses rectangular waveguides to transmit and / or receive signals to / from the antenna of the integrated circuit package. The main driving factor for combining InFO-WLP and integrated antennas has been to reduce signal loss in the feed line between the chip and the antenna. The problem with current technology is that it cannot provide matching polarization for circularly polarized antennas. Additionally, the problem with current technology is that it couples with each other and / or disturbances from other parts of the device, which can disturb and / or block the antenna of the device.

[0003] US 9,583,811 B2 discloses a microwave device comprising a semiconductor package including a microwave semiconductor chip and a waveguide component associated with the semiconductor package. Summary of the Invention

[0004] It is of interest to provide an integrated circuit package including at least one cross-dipole antenna formed in a redistributed metal layer of the integrated circuit package, the integrated circuit package having a small form factor, reduced jitter, and increased antenna gain. Additionally, it is of interest to provide a circularly polarized antenna, whereby orientation is independent of the antenna element of a device communicating with the circularly polarized antenna. Furthermore, by providing the antenna within the package, the need for specialized high-frequency materials is replaced by the use of standard, cost-effective PCB materials.

[0005] These concerns are met by providing an arrangement having the features of the independent claim. Preferred embodiments are defined in the dependent claims.

[0006] Therefore, according to one aspect of the present invention, an integrated circuit package is provided. The integrated circuit package may be an embedded wafer-level ball grid array (eWLB). The integrated circuit package may include a transceiver radio frequency integrated circuit (RFIC). The RFIC may be understood as, for example, a chip, a chipset, and / or a die. The RFIC may be a transceiver RFIC. The RFIC may be a transceiver RFIC configured for any frequency between 1 GHz and 45 GHz. Preferably, the RFIC may be a 24.25 GHz-29.5 GHz transceiver RFIC or a 37 GHz-43.5 GHz transceiver RFIC. More preferably, the RFIC may be a 28 GHz transceiver RFIC. The integrated circuit package may include at least one antenna array. The antenna array may be configured for beam steering. The antenna array may be capable of ±50° beam steering. The at least one antenna array may be formed in a redistribution metal layer (RDL) of the integrated circuit package. The term "the at least one antenna array may be formed in a redistribution metallization layer (RDL) of the integrated circuit package" may mean, for example, that the at least one antenna array includes the RDL, the at least one antenna array is implemented in the RDL, and / or the at least one antenna array is disposed within the RDL. The at least one antenna array may be a planar antenna array. The at least one antenna array may be disposed in a fan-out region of the integrated circuit package. The at least one fan-out region may include a molding compound. The at least one antenna array may be configured to transmit and / or receive signals through the molding compound of the fan-out region. The at least one antenna array may include at least one cross-dipole antenna. Each cross-dipole antenna may include a first dipole comprising two first legs, a second dipole comprising two second legs, and two leg pairs. The first legs and the second legs may be understood as, for example, dipole legs of the first dipole and the second dipole, respectively. Each leg pair may include a first leg of the first dipole and a second leg of the second dipole of its corresponding cross-dipole antenna. The integrated circuit package may include at least one pair of feed lines formed in the RDL. Each feed line in each pair of feed lines can be coupled between the corresponding leg pair of the corresponding cross-dipole antenna and the RFIC. Each pair of feed lines can extend from the center of the corresponding cross-dipole antenna toward the RFIC between the adjacent first leg and the adjacent second leg of the two leg pairs of the corresponding cross-dipole antenna. The adjacent first leg and the adjacent second leg can belong to different leg pairs of the two leg pairs. These feed lines can be understood as, for example, transmission lines. Therefore, the cross-dipole antenna and its corresponding feed lines can be implemented with planar transmission line technology. In other words, the cross-dipole antenna and its corresponding feed lines can be implemented in a single metal layer.

[0007] According to one aspect of the present invention, an arrangement is provided. The arrangement may include an integrated circuit package according to another aspect of the present invention. The arrangement may further include a heat sink element. The heat sink element may be arranged on an RFIC of the integrated circuit package.

[0008] According to one aspect of the present invention, a system is provided. The system may include an arrangement according to another aspect of the present invention. The system may further include a printed circuit board (PCB). The arrangement may be mounted to the PCB. The term "mounted" further includes, for example, attaching, arranging, and / or soldering.

[0009] The at least one antenna array and the at least one pair of feeders can be arranged in the plane of the RDL. In other words, the at least one antenna array and the at least one pair of feeders can be arranged in a plane and / or along a plane, wherein in a plane is arranged within the RDL. The plane can be further understood as a surface. Therefore, the form factor of the integrated circuit package can be reduced. The at least one antenna array and the at least one pair of feeders can be implemented with planar technology. Further, the at least one antenna array and the at least one pair of feeders can be implemented with planar technology within the RDL.

[0010] Each pair of feed lines can extend from the center of the corresponding cross-dipole antenna in a first direction. The first direction can be arranged at a substantially 45° angle relative to the longitudinal axes of the adjacent first legs and the adjacent second legs of the two leg pairs. The adjacent first legs and the adjacent second legs can include different leg pairs from the two leg pairs. Thus, interference caused by the feed lines on the cross-dipole antenna that degrades antenna performance can be mitigated and / or reduced. In other words, the first direction can be arranged at a substantially 45° angle relative to the longitudinal axes of the first leg of the first leg pair of the two leg pairs and the second leg of the second leg pair of the two leg pairs. Correspondingly, the first direction can be arranged at a substantially 45° angle relative to the longitudinal axes of the second leg of the first leg pair of the two leg pairs and the first leg of the second leg pair of the two leg pairs. When the feed lines are arranged at a substantially 45° angle relative to the longitudinal axes of the adjacent first legs and the adjacent second legs of the two leg pairs, interference can be minimized. However, it should be understood that the angle may be between 35° and 45° relative to the longitudinal axis of one of the adjacent first leg and the adjacent second leg. Each pair of feed lines may extend along the first direction from the center of the corresponding cross-dipole antenna to a turning point. The distance between the center and the turning point may be less than the length of the second leg. The feed lines may be arranged parallel to each other from the center of the cross-dipole antenna. The distance between the two feed lines may be substantially zero, or less than the width of the feed lines.

[0011] Each cross-dipole antenna can be a circularly polarized antenna. In order for a cross-dipole antenna to be circularly polarized, a relationship must exist between the lengths of the first leg and the second leg of the cross-dipole antenna. For a cross-dipole antenna arranged in a redistribution metal layer, when a feed line is not coupled to the cross-dipole antenna or when the feed line extends orthogonally to the cross-dipole antenna, this relationship is 1.55. When a feed line is introduced into the redistribution metal layer and coupled to the cross-dipole antenna, this relationship must be adjusted to maintain the circular polarization of the cross-dipole antenna. The first length of each first leg of the at least one cross-dipole antenna can be longer than the second length of each second leg of the at least one cross-dipole antenna. The first length may need to be increased by 11% and the second length may need to be increased by 6% to adjust the specific relationship so that the cross-dipole antenna to which the feed line is coupled maintains circular polarization. The relationship between the first length of each first leg of the at least one cross-dipole antenna and the second length of each second leg of the at least one cross-dipole antenna is between 1.52 and 1.68. Preferably, the relationship between the first length of each first leg of the at least one cross-dipole antenna and the second length of each second leg of the at least one cross-dipole antenna is 1.62. Thus, the cross-dipole antenna can be a circularly polarized antenna formed in a redistribution metal layer, and the circularly polarized antenna is coupled to a feed line formed in the same redistribution metal layer.

[0012] The length and width of the legs of a cross-dipole antenna determine its impedance. Relatively wide legs are desirable because they make the cross-dipole antenna easier to create. Furthermore, wider legs reduce ohmic losses. The relationship between the length and width of the first leg of the cross-dipole antenna can be between 6.8 and 7.6. Preferably, the relationship between the length and width of the first leg of the cross-dipole antenna can be 7.2. It should be understood that the length of the first legs is greater than their width. The relationship between the length and width of the second leg of the cross-dipole antenna can be between 4.2 and 4.8. Preferably, the relationship between the length and width of the second leg of the cross-dipole antenna can be 4.5. It should be understood that the length of the second legs is greater than their width. The widths of the first and second legs are equal. The widths of the first and second legs can be between 0.018 and 0.022 of the wavelength at which the cross-dipole antenna is configured. Preferably, the width of the first legs and the second legs can be 0.02 of the wavelength of the cross-dipole antenna. The length of the first legs can be 0.14 or 1 / 7 of the wavelength of the cross-dipole antenna. The length of the second legs can be 0.09 or 1 / 11 of the wavelength of the cross-dipole antenna. The wavelength of the cross-dipole antenna can be understood as the free space wavelength.

[0013] Thus, the phase difference between the first dipole and the second dipole of the cross-dipole antenna can be adjusted. In other words, the phase difference between the first dipole and the second dipole of the cross-dipole antenna can be adjusted by adjusting the first length and the second length.

[0014] The first dipole of each cross-dipole antenna may have a first input admittance angle, and the second dipole of each cross-dipole antenna may have a second input admittance angle. The first input admittance angle and the second input admittance angle may differ by 90°. The first length and the second length may be determined such that the first input admittance angle and the second input admittance angle differ by 90°.

[0015] The two feeders can be understood as, for example, transmission lines, groundless transmission lines, differential transmission lines and / or groundless differential transmission lines. The two feeders in a pair of feeders can each be fed with a signal by the RFIC. The two signals fed to the two feeders in each pair of feeders can have a phase difference of 180°. The RFIC can feed a first signal to one feeder in a pair of feeders and a second signal to the other feeder in the pair of feeders. The term "feed" further means, for example, to output, provide and / or supply. The RFIC may include at least two phase shifter outputs configured to feed the first signal and / or the second signal. Separate phase shifter outputs can be for the first signal and the second signal, respectively.

[0016] The integrated circuit package may include at least two antenna arrays. A first antenna array of the at least two antenna arrays may be arranged in a first fan-out region of the fan-out region. A second antenna array of the at least two antenna arrays may be arranged in a second fan-out region of the fan-out region. The first fan-out region and the second fan-out region may be arranged on opposite sides of the RFIC. The first antenna array and the second antenna array of the at least two antenna arrays may be arranged on opposite sides of the RFIC.

[0017] Each antenna array may include at least four cross-dipole antennas. However, it should be understood that each antenna array may include any number of cross-dipole antennas. For example, the antenna array may include, for example, one, two, three, four, five, six, seven, eight or more cross-dipole antennas. Further, the integrated circuit package may include at least two antenna arrays, wherein different antenna arrays may include different numbers of cross-dipole antennas. The cross-dipole antennas of the antenna array may be arranged in a row, multiple rows, a column, multiple columns, a grid and / or a matrix. For example, the cross-dipole antennas of the antenna array may be arranged along multiple aligned rows, wherein each row may include the same number of cross-dipole antennas.

[0018] The radiator element may be configured to cool the RFIC. The radiator element of this arrangement may be arranged between the first fan-out area and the second fan-out area. The radiator element may be arranged on top of the RFIC. The radiator may be arranged so that it does not cover the at least one antenna array. The radiator may be arranged so that the first fan-out area and the second fan-out area are not covered by the radiator element. Thus, disturbances and / or obstructions of the at least one antenna array may be reduced. Additionally, the radiator element may be at least a portion of a reflector wall, which may be configured to increase the gain of the at least one antenna array.

[0019] The PCB may include a reflective metal layer. The PCB may further include a plurality of through holes. The RFIC of the printed circuit board may be mounted at the plurality of through holes. The plurality of through holes may be understood as, for example, fences and / or through-hole fences. The plurality of through holes may be arranged to pass through the PCB, or from the top side of the PCB toward the bottom side of the PCB, and / or from the top side of the PCB to the reflective metal layer of the PCB. The plurality of through holes may be arranged along a rectangular shape. The rectangular shape may be arranged in a plane parallel to the reflective metal layer. The plurality of through holes may be at least a portion of a reflector wall, which may be configured to increase the gain of the at least one antenna array.

[0020] The at least one antenna array of the arrangement can be configured to communicate at a specific wavelength. For example, the wavelength of 28 GHz is 10.7 mm, and the at least one antenna array can be configured to communicate at a wavelength of 10.7 mm. The term "communication" further refers to, for example, transmitting and / or receiving signals. The at least one antenna array can be arranged at a first distance from the reflective metal layer. The at least one antenna array can be arranged at a second distance from the plurality of through-holes. The first distance can be one-quarter of the specific wavelength. This creates constructive interference of the waves, which can increase antenna gain. The second distance can be between one-half and three-quarters of the specific wavelength. This maintains the circular polarization of the cross-dipole antenna. In other words, the performance of the circular polarization can be improved. This can increase the gain of the at least one antenna array. The height of the radiator element can be substantially equal to three-tenths of the specific wavelength. This reduces the disturbance of the radiator element, thereby optimizing the antenna gain. However, the height of the radiator element can be less than three-tenths of the specific wavelength.

[0021] The radiator element, the RFIC, and the plurality of through-holes can form a reflector wall. The reflector wall can be arranged between the antenna arrays of an integrated circuit package comprising at least two antenna arrays. The reflective metal layer and the reflector wall can form a corner reflector antenna. The placement of the corner reflector antenna can be configured to maintain the circular polarization of the cross-dipole antenna without adversely affecting gain. Thus, the corner reflector antenna can improve circular polarization performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] This and other aspects of the present invention will now be described in more detail, with reference to the accompanying drawings, which show embodiment(s) of the invention.

[0023] Figure 1 A cross-sectional view of an integrated circuit package according to an exemplary embodiment of the present invention is schematically shown.

[0024] Figure 2 A perspective view of a cross-dipole antenna according to an exemplary embodiment of the present invention is schematically shown.

[0025] Figure 3 A perspective view of an integrated circuit package according to an exemplary embodiment of the present invention is schematically shown.

[0026] Figure 4 A cross-sectional view of a system according to an exemplary embodiment of the present invention is schematically shown.

[0027] Figure 5 A perspective view of a system according to an exemplary embodiment of the present invention is schematically shown. DETAILED DESCRIPTION

[0028] Figure 1 A cross-sectional view of an integrated circuit package 2 according to an exemplary embodiment of the present invention is schematically shown. The integrated circuit package 2 includes a first side 2a and a second side 2b. The first side 2a and the second side 2b are opposite to each other. The first side 2a includes protrusions 26a, 26b. The protrusions 26a, 26b include interconnect elements 26a. Further, the protrusions 26a, 26b include dummy protrusions 26b. The integrated circuit package 2 includes three passivation layers. One of the passivation layers includes the first side 2a. The passivation layers extend along the length and width of the integrated circuit package 2. The integrated circuit package 2 includes a first redistribution metal layer RDL 25. The first RDL 25 is arranged between the two passivation layers. The integrated circuit package 2 includes two antenna arrays 100, see Figure 3 It should be understood that each antenna array 100 may include multiple antennas and / or antenna arrays. The antenna arrays 100 may each include at least one cross-dipole antenna 10, see Figure 2. The antenna array 100 is formed in the first RDL 25. The integrated circuit package 2 includes a die constituting a radio frequency integrated chip RFIC 21. The RFIC 21 is arranged on top of the passivation layer, opposite to the first side 2a. Further, the RFIC 21 is arranged in the middle of the integrated circuit package 2 relative to the length and width of the integrated circuit package 2. The first RDL 25 is coupled to the RFIC 21. Therefore, a portion of the first RDL 25 extends through one of the passivation layers to reach the RFIC 21. The antenna array 100 is coupled to the RFIC 21 via the first RDL 25. The integrated circuit package 2 includes a second RDL. A portion of the second RDL extends through two of the passivation layers to reach the RFIC 21. The interconnection element 26a is coupled to the RFIC 21 via the second RDL. The first RDL 25 and the second RDL are arranged between the passivation layers. Thus, the second RDL is disposed between the passivation layer including the first side 2a and the intermediate passivation layer, and the first RDL 25 is disposed between the intermediate passivation layer and the passivation layer adjacent to the RFIC 21. The integrated circuit package 2 includes a fan-out region 22. The fan-out region 22 includes a molding compound. The fan-out region 22 includes a first fan-out region 22a and a second fan-out region 22b, see Figure 4 . The first fan-out area 22a and the second fan-out area 22b are arranged on the sides of the tube core constituting the RFIC21. The first fan-out area 22a and the second fan-out area 22b are parts of the fan-out area 22 that include at least one antenna array 100. The molding compound of the fan-out area 22 is arranged on top of the passivation layer and the metal redistribution layer, opposite to the first side 2a and surrounding the RFIC21. The top of the RFIC 21 is exposed. The molding compound does not cover the top of the RFIC 21. However, it should be understood that the molding compound can also be arranged on the top of the RFIC 21. The top of the RFIC 21 and the molding compound include the second side 2b. At least one antenna array 100 is configured to transmit and / or receive radio signals through the molding compound of the first fan-out area 22a and the second fan-out area 22b.

[0029] Figure 2 A perspective view of a cross-dipole antenna 10 according to an exemplary embodiment of the present invention is schematically shown. Figure 2The perspective view shows a cross-dipole antenna 10 arranged in a plane, with the viewing angle perpendicular to the plane. The cross-dipole antenna 10 is arranged in a first RDL 25, which can be understood as including the plane. The cross-dipole antenna 10 can be understood as being formed in, formed by, and / or including the first RDL 25. The cross-dipole antenna 10 includes a first dipole and a second dipole. The first dipole includes two first legs 11. The second dipole includes two second legs 12. Further, the cross-dipole antenna 10 includes two leg pairs 10a, 10b, which can be understood as first leg pairs 10a, 10b. Each leg pair 10a, 10b includes a first leg 11 of the first dipole and a second leg 12 of the second dipole. The first leg 11 and the second leg 12 of each leg pair 10a, 10b are arranged at right angles to the longitudinal axis of the first leg 11 and the second leg 12. The two first legs 11 are arranged parallel to the longitudinal axis of the first legs 11. The two first legs 11 are aligned relative to the longitudinal axis of the first legs 11. The two second legs 12 are arranged parallel to the longitudinal axis of the second legs 12. The first leg pair 10a and the second leg pair 10b have substantially the same shape. However, the first leg pair 10a and the second leg pair 10b are rotated 180° relative to each other within a plane. The cross-dipole antenna 10 includes a center 15. Each leg 11 and 12 includes a proximal end and a distal end. The proximal ends of the legs 11 and 12 are arranged at the center 15. The first legs 11 extend in opposite directions from their respective proximal ends to their respective distal ends. The second legs 12 extend in opposite directions from their respective proximal ends to their respective distal ends. The direction of extension of the first legs 11 is perpendicular to the direction of extension of the second legs 12. Therefore, the first legs 11 and the second legs 12 can be understood as being arranged in an X-shape, a +-shape, or a cross-shape. First leg 11 and second leg 12 have a rectangular shape that narrows at their respective proximal ends. Therefore, first leg 11 and second leg 12 can be understood as having a rectangular arrow shape. First leg 11 is longer than second leg 12. Therefore, first leg 11 and second leg 12 have different lengths. As a result, the first and second dipoles of cross-dipole antenna 10 have different dipole lengths. First leg 11 and second leg 12 have the same width. The relationship between the length and width of first leg 11 is 7.2. The relationship between the length and width of the second leg is 4.5. The relationship between the length of first leg 11 and the length of the second leg is 1.62. The different dipole lengths enable circular polarization of cross-dipole antenna 10. In other words, the relationship between the lengths of first leg 11 and second leg 12 is configured so that cross-dipole antenna 10 is circularly polarized.

[0030] A pair of feed lines 20a, 20b are coupled to the cross-dipole antenna 10. The pair of feed lines 20a, 20b can be understood as including a first feed line 20a and a second feed line 20b. The first feed line 20a is coupled to the first leg pair 10a at the center 15. Each feed line 20a, 20b is divided into two parts at the center 15, and the two parts are coupled to the first leg 11 and the second leg 12 of the first leg pair 10a and the second leg pair 10b, respectively. Thus, the first feed line 20a is coupled to the first leg 11 and the second leg 12 of the first leg pair 10a, and the second feed line 20b is coupled to the second leg pair 10b at the center 15. Thus, the second feed line 20b is coupled to the first leg 11 and the second leg 12 of the second leg pair 10b. The feed lines 20a, 20b extend from the center 15 between the first leg pair 10a and the second leg pair 10b. The feed lines 20a, 20b extend in an extension direction, wherein the extension direction makes an angle α, β relative to the adjacent legs. The angles α, β are 45 degrees. When the angles α, β are 45 degrees, the interference caused by the feed lines 20a, 20b to the cross-dipole antenna 10 is minimized. The term "adjacent legs" means, for example, the two closest legs of the cross-dipole antenna 10, and / or the second leg 12 of the first leg pair 10a and the first leg 11 of the second leg pair 10b. The extension direction of the feed lines 20a, 20b can best reduce interference and / or disturbances of the first dipole and the second dipole of the cross-dipole antenna. The feed lines 20a, 20b are arranged adjacent to each other along their extension from the center 15. The feed lines 20a, 20b are directed toward the RFIC 21 (not shown, see Figure 1 and Figure 3 ) extension. The exemplary embodiment described above eliminates the need for a feed line crossover to feed the cross-dipole antenna 10, thereby creating a simpler and more compact solution. The exemplary embodiment described above implements the cross-dipole antenna 10 using planar technology. In other words, the cross-dipole antenna 10 and the pair of feed lines 20a, 20b are implemented within a single RDL of the integrated circuit package 2.

[0031] Figure 3 A perspective view of an integrated circuit package 2 according to an exemplary embodiment of the present invention is schematically shown. Figure 3 The perspective view of FIG shows the integrated circuit package 2 from below. In other words, Figure 3 The perspective view of FIG. 1 shows the first side 2a of the integrated circuit package 2, wherein the viewing angle is perpendicular to the first side 2a. Figure 3As shown in FIG, the integrated circuit package 2 has a rectangular shape with four sides. The integrated circuit package 2 includes an RFIC 21 and a fan-out region 22. The RFIC 21 has a rectangular shape and is arranged in the center of the integrated circuit package 2. The side surfaces of the RFIC 21 are parallel to the adjacent sides of the integrated circuit package 2. The fan-out region 22 is arranged around the RFIC 21. The fan-out region 22 includes two antenna arrays 100. Each antenna array 100 is arranged in a corresponding fan-out region of the fan-out region 22. One of the antenna arrays 100 is arranged in a first fan-out region 22a of the fan-out region 22, and the other antenna array 100 is arranged in a second fan-out region 22b of the fan-out region 22. The fan-out region 22 further includes two ground portions 27. The ground portions 27 are configured to reduce interference and / or disturbance between the RFIC 21 and the antenna arrays 100, and between the antenna arrays 100. The ground portions 27 may include ground vias and / or ground lines. Each ground portion 27 is arranged between one side of the RFIC 21 , a side of the integrated circuit package 2 adjacent to the side of the RFIC 21 , and two antenna arrays 100 .

[0032] Each antenna array 100 includes four cross-dipole antennas 10. The four dipole antennas 10 of each antenna array 100 are arranged in a row. The two rows are parallel to the width of the integrated circuit package 2. The four dipole antennas 10 are arranged so that the longitudinal axis of the first dipole 11 of each dipole antenna 10 is parallel to the diagonal of the first side 2a of the integrated circuit package 2. The four dipole antennas 10 of each antenna array 100 are similarly oriented. The integrated circuit package 2 includes eight pairs of feed lines 20a, 20b. Each pair of feed lines 20a, 20b is coupled to a corresponding cross-dipole antenna 10. The feed lines 20a, 20b coupled to the two cross-dipole antennas 10 arranged in the middle of the row of four dipole antennas 10 in each antenna array 100 extend from the center of their corresponding cross-dipole antennas 10 to the RFIC 21. The first portions of the feed lines 20a, 20b of the two cross-dipole antennas 10 arranged at the beginning and end of the row of four dipole antennas 10 of each antenna array 10 extend from the center of their respective cross-dipole antennas 10 to the nearest ground portion 27. The second portions of the feed lines 20a, 20b of the two cross-dipole antennas 10 arranged at the beginning and end of the row of four dipole antennas 10 of each antenna array 10 extend from the first portions of the feed lines 20a, 20b to the RFIC 21.

[0033] The integrated circuit package 2 includes a plurality of protrusions 26a, 26b, similar to Figure 1The bumps arranged at the RFIC 21 are interconnection elements 26a. The interconnection elements 26a can be understood as solder bumps, for example. The interconnection elements 26a are configured to couple the integrated circuit package 2 to the PCB 5 (not shown; see FIG. Figure 4 and Figure 5 ) and / or another circuit. The ridges arranged at the fan-out region are dummy ridges 26b. Dummy ridges 26b are arranged around each cross-dipole antenna 10. Dummy ridges 26b may not be configured to couple to another circuit. When coupled to PCB 5 or a circuit, dummy ridges 26b may be configured to provide support and / or stability to integrated circuit package 2. Further, dummy ridges 26b may be configured to reduce disturbances and / or interference between RFIC 21 and cross-dipole antenna 10 or between dipole antennas 10.

[0034] Figure 4 A cross-sectional view of a system 500 according to an exemplary embodiment of the present invention is schematically shown. System 500 includes an arrangement 1 and a printed circuit board 5. Arrangement 1 includes an integrated circuit package 2 and a heat sink element 50. Heat sink element 50 is arranged on the RFIC 21 of integrated circuit package 2. Heat sink element 50 is arranged between the first fan-out region 22a and the second fan-out region 22b of integrated circuit package 2. Heat sink element 50 has a curved shape, which can be understood as a semi-circular shape including a bottom. The bottom of heat sink element 50 is arranged on RFIC 21. Heat sink element 50 is widest at the bottom. The shape and placement of heat sink element 50 can be adapted to reduce interference and / or perturbations between antenna arrays 100 and to enhance the beam steering performance of antenna array 100. Arrangement 1 is mounted to PCB 5. Arrangement 1 is mounted to the PCB via solder bumps 26a and 26b. Solder bump 26b is arranged below fan-out regions 22a and 22b. Solder bump 26a comprises an interconnection element and is configured to connect integrated circuit package 2 to PCB 5. Solder bumps 26a, 26b are part of the design and provide increased antenna performance and mechanical stability for integrated circuit package 2. PCB 5 includes a reflective metal layer 6. Reflective metal layer 6 is arranged on the bottom side of PCB 5, opposite the side of the PCB to which integrated circuit package 2 is mounted. Integrated circuit package 2 is arranged to PCB 5 such that antenna array 100 of integrated circuit package 2 is arranged at a first distance d1 from reflective metal layer 6. First distance d1 is measured in a direction perpendicular to reflective metal layer 6. Arranging antenna array 100 at first distance d1 from reflective metal layer 6 results in constructive interference and / or increased gain of antenna array 100.

[0035] PCB 5 includes a plurality of through-holes 7. These through-holes 7 are configured to reflect antenna signals from antenna array 100. These through-holes 7 are arranged along a shape associated with the perimeter of RFIC 21. Integrated circuit package 2 is attached to PCB 5 such that the through-holes 7 are arranged along and / or around the perimeter of RFIC 21, or along and / or around a distance from the perimeter of the RFIC. The through-holes 7 may also include through-holes within the perimeter of RFIC 21. Integrated circuit package 2 is attached to PCB 5 such that the antenna array 100 of integrated circuit package 2 is positioned at a second distance d2 from the through-holes 7. The second distance d2 is measured in a direction parallel to reflective metal layer 6. In other words, the second distance d2 is measured in a direction perpendicular to the first distance d1. The second distance d2 is measured from the center of antenna array 100 to the through-holes 7. It should be understood that the second distance d2 is the shortest distance between the center of antenna array 100 and the through-holes 7. The heat sink element 50, the RFIC 21, and the plurality of through-holes 7 together form a side wall reflector 8. The side wall reflector 8 can be understood as an electric wall. The side wall reflector 8 can increase the gain of the antenna array 100. The antenna array 100 is configured to transmit and / or receive at a specific wavelength (i.e., at a specific frequency). The first distance d1 is equal to one-quarter of the specific wavelength. The second distance d2 is equal to one-half of the specific wavelength. The combination of the side wall reflector 8 and the reflective metal layer 6 can be understood as a corner reflector antenna. The corner reflector antenna can further increase the constructive interference and / or gain of the antenna array 100.

[0036] Figure 5A perspective view of a system 500 according to an exemplary embodiment of the present invention is schematically shown. System 500 includes an integrated circuit package 2, a heat sink element 50, and a PCB 5. A first side 2a of the integrated circuit package 2 is soldered to the PCB 5 at the center of the PCB 5. The heat sink element 50 is arranged on a second side 2b of the integrated circuit package 2. The heat sink element 50 has a longitudinal extension. The heat sink element 50 includes two end sections and a middle section. The middle section of the heat sink element 50 is arranged along the middle portion of the integrated circuit package 2. The middle portion of the integrated circuit package 2 includes the RFIC 21 and the ground portion 27. The first fan-out area 22a and the second fan-out area 22b of the integrated circuit package 2 are not covered by the heat sink element 50. The width of the middle portion of the heat sink element 50 is approximately equal to the width or height of the RFIC 21. As a result, the heat sink element 50 reduces the disturbance of the antenna array 100 included in the first fan-out area 22a and the second fan-out area 22b. Furthermore, the end sections of the radiator element 50 widen from the middle section toward the corresponding longitudinal ends of the radiator element 50. Each end section of the radiator element 50 includes two fastening holes. One of the fastening holes in each end section is configured to receive a fastening device, such as a screw or a nut, for attaching the radiator element 50 to the PCB 5. The other fastening hole in each end section is configured to receive a fastening device, such as a screw or a nut, for attaching the system 500 to a housing and / or an auxiliary device. The shape of the radiator element 50 is configured to reflect signals transmitted and / or received by the antenna array 100. In other words, the shape of the radiator element 50 is configured to increase the gain of the antenna array 100.

[0037] Those skilled in the art realize that the present invention is by no means limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims.

Claims

1. An integrated circuit package (2), comprising: Transceiver radio frequency integrated circuit RFIC (21); At least one antenna array (100), formed in a redistribution metal layer (RDL) (25) of the integrated circuit package and arranged in a fan-out region (22a, 22b) of the integrated circuit package, and comprising at least one cross-dipole antenna (10), Each cross-dipole antenna includes a first dipole comprising two first legs (11), a second dipole comprising two second legs (12), and two leg pairs (10a, 10b), each leg pair comprising a first leg of the first dipole and a second leg of the second dipole; The integrated circuit package further includes at least one pair of feed lines (20a, 20b) formed in the RDL, wherein each feed line in each pair of feed lines (20a, 20b) is coupled between a corresponding leg pair of a corresponding cross-dipole antenna and the RFIC, and wherein each pair of feed lines extends from a center (15) of the corresponding cross-dipole antenna toward the RFIC between an adjacent first leg and an adjacent second leg of the two leg pairs of the corresponding cross-dipole antenna, wherein the adjacent first leg and the adjacent second leg belong to different leg pairs of the two leg pairs.

2. The integrated circuit package (2) according to claim 1, wherein: The at least one antenna array and the at least one pair of feed lines are arranged in a plane of the redistribution metal layer.

3. The integrated circuit package (2) according to claim 1 or 2, wherein: Each pair of feed lines extends from a center (15) of the corresponding cross-dipole antenna in a first direction, wherein the first direction is arranged at an angle of 45 degrees relative to the longitudinal axis of the adjacent first leg and the adjacent second leg.

4. The integrated circuit package (2) according to claim 1 or 2, wherein: Each cross-dipole antenna (10) is a circularly polarized antenna.

5. The integrated circuit package (2) according to claim 1 or 2, wherein: The relationship between the first length of each first leg of the at least one cross-dipole antenna and the second length of each second leg of the at least one cross-dipole antenna is between 1.52 and 1.

68.

6. The integrated circuit package (2) according to claim 1 or 2, wherein: The first legs of each cross-dipole antenna have a first length such that each first dipole of each cross-dipole antenna has a first input admittance angle, and the second legs of each cross-dipole antenna have a second length such that each second dipole of each cross-dipole antenna has a second input admittance angle, and wherein the first input admittance angle differs from the second input admittance angle by 90°.

7. The integrated circuit package (2) according to claim 1 or 2, wherein: The two feed lines in each pair of feed lines are each fed with a signal by the RFIC, wherein the two signals fed to the two feed lines in each pair of feed lines have a phase difference of 180°.

8. The integrated circuit package (2) according to claim 1 or 2, further comprising at least two antenna arrays, and in, A first antenna array of the at least two antenna arrays is arranged in a first fan-out area (22a) of the fan-out area (22), and wherein the second antenna array of the at least two antenna arrays is arranged in a second fan-out area (22b) of the fan-out area (22); The first fan-out region and the second fan-out region are arranged on opposite sides of the RFIC.

9. The integrated circuit package (2) according to claim 8, wherein: Each antenna array includes at least four cross-dipole antennas.

10. An integrated circuit package arrangement (1), comprising: The integrated circuit package (2) according to claim 8 or 9; as well as A heat sink element (50) is arranged on the RFIC of the integrated circuit package and is interposed between the first fan-out area and the second fan-out area.

11. An integrated circuit package system (500), comprising: The arrangement (1) according to claim 10; as well as A printed circuit board PCB (5), wherein The arrangement (1) is mounted to the printed circuit board (5).

12. The system (500) of claim 11, wherein: The PCB includes: a reflective metal layer (6), and a plurality of through holes (7); The RFIC of the printed circuit board is installed at the plurality of through holes.

13. The system (500) of claim 12, wherein: At least one antenna array of the arrangement is configured for communication at a specific wavelength, and wherein, The at least one antenna array is arranged at a first distance from the reflective metal layer and at a second distance from the plurality of through-holes, wherein The first distance is one quarter of the specific wavelength, and The second distance is between one half and three quarters of the specific wavelength.

14. The system (500) according to any one of claims 12 to 13, wherein: The heat sink element, the RFIC, and the plurality of through-holes form a reflector wall, wherein the reflector wall is configured to increase a gain of the at least one antenna array.

15. The system (500) of claim 14, wherein: The reflective metal layer and the reflector wall form a corner reflector antenna, wherein the corner reflector antenna is configured to increase a gain of the at least one antenna array.

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