Inspection device and inspection method

Abstract

The inspection device disclosed herein is used for an installation system including an installation device for configuring components on a substrate. The inspection device includes a control unit that extracts an area included in a captured image obtained by capturing a processing object with a viscous fluid formed at a predetermined position, calculates the center of gravity of the extracted area, and determines whether the center of gravity is included in a standard range of the predetermined position serving as a reference for the captured image, thereby determining whether a bridge of viscous fluid is generated across adjacent predetermined positions.

Description

Technical Field

[0001] This specification discloses an inspection device and an inspection method. Background Art

[0002] In the past, for example, a solder inspection device has been proposed for inspecting the printed state of solder on pads on a substrate. In this case, if a portion of the solder print, such as a substrate end portion, has light-reflecting properties similar to solder and is mistakenly identified as solder, or if solder connecting multiple solder prints on the same pad is misidentified as a "bridge," the area that contributes to these misidentifications and problems is set as a masked area that is not subject to image processing for inspection (see, for example, Patent Document 1). This mounting device performs image processing on image data with the masked area removed, eliminating inspection errors caused by image noise and solder print shape, and achieving stable and accurate inspection results. Furthermore, a printing device has been proposed that identifies defective locations and defect forms in a circuit pattern based on an image captured of a printed substrate, identifies the corresponding residual solder paste locations within the openings of a screen mask based on the defective locations and defect forms, and removes the solder paste by spraying gas from the residual locations using a jet nozzle (see, for example, Patent Document 2). This device can efficiently remove solder paste remaining in the opening.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2005-164455

[0006] Patent Document 2: Japanese Patent Application Laid-Open No. 2004-50413 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] However, the device of Patent Document 1 is inadequate for bridge detection because it cannot set shielding areas without determining the placement of the substrate. Furthermore, the device of Patent Document 2 inspects solder paste but does not consider bridge detection. In other words, inspection devices must adequately detect bridges.

[0009] The present disclosure has been made in view of such a problem, and its main object is to provide an inspection device and an inspection method that can more appropriately perform detection of a bridge formed by a viscous fluid spanning a predetermined portion.

[0010] Technical solutions to problems

[0011] The inspection device and inspection method disclosed in this specification employ the following means to achieve the above-mentioned main objects.

[0012] The inspection device disclosed herein is used for an installation system including an installation device for configuring components on a substrate, the inspection device comprising a control unit that extracts an area included in a captured image obtained by capturing a processing object having a viscous fluid formed at a predetermined position, calculates the center of gravity of the extracted area, and determines whether the center of gravity is included in a standard range of the predetermined position serving as a reference for the captured image, thereby determining whether a bridge of the viscous fluid is generated across adjacent predetermined positions.

[0013] This inspection device extracts a block of areas from an image obtained by capturing a workpiece with a viscous fluid formed at a predetermined location. The center of gravity of the extracted block is then determined. The presence of a bridge is then determined by determining whether the center of gravity of the block is within a standard range of predetermined locations, which serves as a reference for the captured image. When detecting areas where viscous fluid has formed, for example, if bridges have formed with respect to multiple predetermined locations, the block is extracted as a single block, resulting in a standard range of predetermined locations that does not include the center of gravity. By determining the presence or absence of a standard range of predetermined locations that does not include the center of gravity, this inspection device enables more appropriate bridge detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic explanatory diagram showing an example of the mounting system 10 and the mounting device 13 .

[0015] Figure 2 It is an explanatory diagram of an example of the component Pa picked up by the mounting head 32.

[0016] Figure 3 This is a flowchart showing an example of an installation processing routine.

[0017] Figure 4 1 and 2 are explanatory diagrams of a captured image 50 obtained by capturing an image of the element Pa and the electrode region A. FIG.

[0018] Figure 5 It is a photograph obtained by photographing a component and an explanatory diagram of the inspection line L.

[0019] Figure 6 This is a flowchart showing an example of a bridge detection processing routine.

[0020] Figure 7 1 and 2 are explanatory diagrams of a captured image 52 obtained by capturing a component Pa after solder transfer.

[0021] Figure 8 This is a photograph of a component after solder transfer and an explanatory diagram of the inspection line L.

[0022] Figure 9 5 is an explanatory diagram of the electrode E, the electrode region A, a block region T, and the center of gravity G in the captured image 52 . DETAILED DESCRIPTION

[0023] Hereinafter, this embodiment will be described with reference to the drawings. Figure 1 It is a schematic explanatory diagram showing an example of the mounting system 10 and the mounting device 13 . Figure 2 3 is an explanatory diagram of an example of a component Pa picked up by the mounting head 32. Figure 2 (A) is an illustration before solder B is transferred. Figure 2 (B) is an explanatory diagram after the solder B is transferred. The mounting system 10 is a system that performs mounting processing related to the process of mounting the component P on the substrate S. In addition, in this embodiment, the left-right direction (X axis), the front-back direction (Y axis), and the up-down direction (Z axis) are as follows. Figure 1 shown.

[0024] The mounting system 10 is configured as a production line in which mounting devices 13 for mounting components P on a substrate S as a mounting target are arranged in the conveying direction of the substrate S. Here, the mounting target is described as a substrate S, but it is not particularly limited as long as it is a component for mounting components P, and may also be a three-dimensional base material. Figure 1 As shown, the mounting system 10 includes a printing device 11, a print inspection device 12, a mounting device 13, a mounting inspection device 14, and a management PC 18. The printing device 11 prints solder paste, a viscous fluid, onto a substrate S. The print inspection device 12 inspects the state of the printed solder. The mounting device 13 mounts components P onto the substrate S. The mounting inspection device 14 inspects the state of the components P mounted by the mounting device 13.

[0025] The printing inspection device 12 includes a substrate processing unit 41, a control unit 42, and an inspection unit 45. The substrate processing unit 41 is a unit similar to the substrate processing unit 21 of the mounting device 13. The control unit 42 has the same structure as the control unit 25, and includes a CPU 43 and a storage unit 44. The inspection unit 45 is a unit that inspects the substrate S itself and the state of the solder paste printed on the substrate S, and includes a head moving unit 46, an inspection head 47, and a photographing unit 48. The head moving unit 46 is a unit that moves the inspection head 47 in the XY direction in the same way as the head moving unit 31. The inspection head 47 is equipped with a photographing unit 48 that photographs the substrate S from above, and is moved in the XY direction by the head moving unit 46. The printing inspection device 12 uses reference information including information such as the reference position of the printed solder paste and the shape of the printed solder paste to inspect whether the shape of the printed solder paste is abnormal and whether the solder paste is printed in the appropriate position.

[0026] like Figure 1 As shown, the mounting device 13 includes a substrate processing unit 21, a component supply unit 22, a parts camera 23, a control device 25, and a mounting unit 30. In addition to performing the mounting process of arranging the component P on the substrate S, the mounting device 13 also has the function of performing the inspection process of inspecting the component P and the substrate S. The substrate processing unit 21 is a unit that carries out the loading, transportation, fixing at the mounting position, and unloading of the substrate S. The substrate processing unit 21 has Figure 1 A pair of conveyor belts are provided at intervals in front and behind and are stretched in the left-right direction. The substrate S is transported by the conveyor belts.

[0027] The component supply unit 22 comprises multiple feeders equipped with tape reels and a tray unit, which is detachably mounted in front of the mounting device 13. A tape is wound around each reel, and multiple components P are held on the tape surface along its length. The tape is unwound from the reel toward the rear, and with the components P exposed, it is delivered by the feeder unit to a pickup position where it is suctioned by a suction nozzle 33. The tray unit comprises a tray on which multiple components P are arranged and placed, and this tray is placed and loaded to a predetermined pickup position.

[0028] The parts camera 23 is an imaging unit that captures images of one or more components P picked up and held by the mounting head 32. The parts camera 23 is located between the component supply unit 22 and the substrate processing unit 21. The imaging range of the parts camera 23 is above the parts camera 23. When the mounting head 32 holding a component P passes above the parts camera 23, the parts camera 23 captures the image and outputs the captured image data to the control device 25.

[0029] The mounting section 30 is a unit that picks up components P from the component supply section 22 and is configured toward the substrate S fixed to the substrate processing section 21. The mounting section 30 includes a head moving section 31, a mounting head 32, a suction nozzle 33, a marking camera 34, and a transfer section 35. The head moving section 31 includes a slider that is guided by a guide rail and moves in the XY direction, and a motor that drives the slider. The mounting head 32 can be detachably mounted on the slider and moves in the XY direction through the head moving section 31. The mounting head 32 is detachably mounted with one or more suction nozzles 33 (for example, 16, 8, 4, etc.) on its lower surface side, and can pick up multiple components P at a time. The suction nozzle 33 is a picking component that uses negative pressure to pick up components. In addition, the picking component can also be a mechanical chuck that holds the component P. The marking camera 34 is arranged on the lower surface side of the mounting head 32 (or slider). The marking camera 34 is, for example, a shooting device that can shoot substrates S, components P, etc. from above. The mark camera 34 moves in the XY directions along with the movement of the mounting head 32 . The mark camera 34 has an imaging area below it, which images reference marks and the like attached to the substrate S for position detection, and outputs the images to the control device 25 .

[0030] Here, the components P picked up by the mounting head 32 will be described. In addition to placing the components P on the electrodes of the substrate S to which the solder has been transferred, the mounting head 32 also places the components Pa having a plurality of electrodes E to which the solder has been transferred, toward the substrate S. Figure 2 As shown, component Pa includes circular electrodes Ea1 to EA8, rectangular electrodes Eb1 to Eb4, and rectangular electrodes Ec1 to Ec4. Here, electrodes Ea1 to EA8 are collectively referred to as electrodes Ea, electrodes Eb1 to Eb4 are collectively referred to as electrodes Eb, electrodes Ec1 to Ec4 are collectively referred to as electrodes Ec, and electrodes Ea to Ec are collectively referred to as electrodes E. Component Pa, component Pb, and the like are collectively referred to as components P. After solder is transferred to each electrode E in the transfer unit 35, the component Pa is positioned facing the substrate S.

[0031] The transfer section 35 is a unit that transfers solder to the electrodes E of a component Pa having a plurality of electrodes E. The transfer section 35 includes a disk-shaped workbench for storing solder paste, a scraper that moves relative to the workbench, and a solder supply section that supplies solder paste toward the workbench. The scraper is a component that pushes the solder paste on the workbench away as it moves relative to the workbench, thereby forming a film. In addition, the transfer section 35 may include a movable workbench and a fixed scraper, or a fixed workbench and a movable scraper. The mounting head 32 picks up the component Pa and descends toward the solder on the workbench of the transfer section 35 to contact the electrodes E, thereby transferring the solder paste to each electrode E of the component Pa.

[0032] like Figure 1As shown, the control device 25 is constructed as a microprocessor centered around the CPU 26, and is provided with a storage unit 27 for storing various data. In addition to the function of controlling the entire device of the mounting device 13, the control device 25 also has the function of performing abnormality inspections such as the presence or absence of components P and electrodes E, whether their shapes are within the allowable range, and transfer inspections such as whether the transfer of solder to the electrodes E is appropriate. The control device 25 outputs control signals to the substrate processing unit 21, the component supply unit 22, the parts camera 23, and the mounting unit 30, and inputs signals from the mounting unit 30, the component supply unit 22, the parts camera 23, and the mounting unit 30. The storage unit 27 stores mounting condition information including component information 28 related to the component Pa, the mounting order for mounting the component P toward the substrate S, the configuration position of the component P, the type of the suction nozzle 33 that can pick up the component P, and the like. In the component information 28, in addition to the electrode area A (see below) such as the position, shape, and size of the electrode E, there is also information on the mounting condition. Figure 4 In addition to the information (B) of FIG. 2 , the control device 25 also includes information such as the detection line L used as a reference when detecting the electrode E. For example, the control device 25 uses the component information 28 as a reference for the component Pa to inspect whether the shape of the component Pa and the electrode E are within the allowable range and whether the solder is properly transferred to the electrode E.

[0033] The management PC 18 is a computer that manages information about each device in the mounting system 10. The management PC 18 includes a control unit, a storage unit, a display, and an input device. The control unit is comprised of a microprocessor centered around a CPU. The storage unit stores information related to production management for the mounting system 10 as well as mounting condition information corresponding to each mounting device 13, including information such as the order in which components P are mounted on the substrate S, the placement of components P, and the types of pickup parts capable of picking up components P.

[0034] Next, the operation of the mounting system 10 of the present embodiment configured as described above will be described, firstly, the mounting process in the mounting device 13. First, the process of mounting the component P onto the substrate S by the mounting device 13 will be described. Figure 3This is a flowchart showing an example of a mounting processing routine executed by the CPU 26 of the control device 25 of the mounting device 13. The routine is stored in the storage unit 27 of the mounting device 13 and is executed based on a start instruction from the operator. When the routine is started, the CPU 26 reads and obtains the mounting condition information of the substrate S produced this time (S100), transports the substrate S to the mounting position through the substrate processing unit 21, and performs a fixing process (S110). Next, the CPU 26 sets the component P of the object to be picked up based on the mounting condition information (S120), reads and obtains the component information 28 corresponding to the component P of the picked-up object (S130). Next, the CPU 26 causes the mounting head 32 to pick up the component P from the feeder containing the component P of the picked-up object, and moves it toward the top of the part camera 23, causing the part camera 23 to photograph the component P in the state picked up by the mounting unit 30 (S140).

[0035] Next, the CPU 26 determines whether an abnormality is detected in the component P picked up by the mounting head 32 (S150). This determination is made based on the information on each component P included in the component information 28, and is based on factors such as whether the shapes of the component P body, electrodes E, etc. are within the appropriate range, whether there are any existing parts of the component P (e.g., electrodes E, reference marks, etc.), and whether the position and shape of these parts are within the appropriate range. If an abnormality is detected in the component P, the CPU 26 discards the corresponding component P to a predetermined disposal location (S160).

[0036] Here, the abnormality detection process will be described using the element Pa as an example. Figure 4 50 is an explanatory diagram of an image 50 obtained by photographing the element Pa and the electrode region A. Figure 4 (A) is an explanatory diagram of a captured image 50. Figure 4 (B) is an illustration of the electrode region A. Figure 4 (C) is an explanatory diagram in which the electrode region A is applied to the captured image 50 . Figure 5 This is a photograph of a component and an illustration of the inspection line L. Figure 5 (A) is for taking photos, Figure 5(B) is an explanatory diagram of the application of the detection line L in the captured photo. In the installation device 13, the electrode E is detected using the electrode area A and the detection line L as a reference. The electrode area A is the area where the electrode E exists in the captured image 50, and the electrode area Aa is set relative to the electrode Ea, the electrode area Ab is set relative to the electrode Eb, and the electrode area Ac is set relative to the electrode Ec. The detection line L is used to detect the brightness difference between the area across the electrode E and the area outside the area, and multiple detection lines are arranged on the periphery of the electrode area A. The pattern of the length, configuration position, number, etc. of the detection line L is determined based on experience to more accurately detect the range of the outer edge of the electrode E and is pre-set for each electrode E. The CPU 26 can detect the point where the brightness value on the detection line L crosses a predetermined threshold as the outer edge (edge) of the electrode E. In the installation device 13, as Figure 4 (A) Figure 5 As shown in (A), sometimes, by reflection of light, etc., a captured image of the outer edge of the main body of the element Pa connected to the electrode E is obtained. Therefore, in the mounting device 13, it is set so that when the number of detection lines L detecting the outer edge meets a predetermined tolerance (for example, 60%, 70%, 80%, etc.) relative to the number of detection lines L of the entire electrode E, the position of the electrode E is detected based on the detection lines L detecting the outer edge. In this way, in the mounting device 13, even if there is a change in the brightness value and the detection line L of the outer edge of the electrode E cannot be detected, the position of the electrode E can be detected. The CPU 26 can also roughly set the position of the electrode area A and the detection line L by applying a pre-set pattern of the detection line L of the electrode E to the outer edge of the electrode E in the captured image 50, and then move the electrode area A and the detection line L to a more appropriate position. Based on the brightness value on the detection line L, the CPU 26 can grasp the presence, position, and shape of the electrode E, and thus can detect abnormalities in the electrode E.

[0037] After S160, or in S150, when there is no abnormality in the component P, the CPU 26 determines whether the component P picked up by the mounting portion 30 contains the component Pa with transferred solder (S170). When the component Pa with transferred solder is not included, the CPU 26 corrects the offset of the angle and position of the component P picked up based on the captured image, and configures the component P toward the substrate S (S210). Then, the CPU 26 determines whether the installation process of the substrate S currently fixed to the installation position is completed (S220). When the installation process is not completed, the process after S120 is executed. That is, the CPU 26 then repeatedly performs the following process: setting the component P to be picked up and configured, causing the mounting portion 30 to pick up the component P, detecting the abnormality of the component P, correcting the offset of the component P, and configuring the component P toward the substrate S.

[0038] On the other hand, in S220, when the installation process of the substrate S currently fixed to the installation position is completed, the CPU 26 causes the substrate processing unit 21 to discharge the substrate S that has been installed (S230) and determines whether the production of all substrates S set in the installation condition information is completed (S240). If the production of all substrates S is not completed, the CPU 26 executes the processing after S110. That is, the CPU 26 repeatedly carries out the process of transporting and fixing the next substrate S and arranging the component P toward the substrate S. On the other hand, when the production of all substrates S is completed in S240, the CPU 26 ends the routine.

[0039] On the other hand, if the components P picked up by the mounting unit 30 in S170 include a component Pa to which solder has been transferred, the CPU 26 transfers solder to the component Pa and others (S180), moves the component Pa toward the upper portion of the parts camera 23 and performs imaging processing (S190), performs bridge detection processing for the transferred solder (S200), and then performs processing from S210 onwards. The bridge detection processing is a process for determining whether a bridge of solder paste has formed across adjacent electrodes E.

[0040] Figure 6 This is a flowchart showing an example of a bridge detection processing routine executed by the CPU 26 of the control device 25 . Figure 7 5 is an explanatory diagram of a captured image 52 obtained by capturing the component Pa after solder transfer. Figure 7 (A) is a conceptual diagram in which the electrode area A and the detection line L are superimposed on the captured image 52. Figure 7 (B) is a conceptual diagram of an area T. Figure 7 (C) is a conceptual diagram that overlaps the center of gravity G. Figure 8 This is a photo taken of the component after solder transfer ( Figure 8 (A)) and detection line L( Figure 8 (B)) is an illustration of . Figure 9 52 is an explanatory diagram of the electrode E, the electrode area A, the block area T, and the center of gravity G in the captured image 52. Figure 9 (A) Figure 9 (C) is an explanatory diagram of the captured image 52 without a bridge. Figure 9 (B) Figure 9 (D) is an explanatory diagram of the captured image 52 after bridging. Figure 7 、 Figure 9, the area of ​​solder on electrode Ea is collectively referred to as a block area Ta, the area of ​​solder on electrode Eb is collectively referred to as a block area Tb, the area of ​​solder on electrode Ec is collectively referred to as a block area Tc, and the blocks Ta to Tc are collectively referred to as a block area T. Similarly, the center of gravity of a block area Ta is collectively referred to as the center of gravity Ga, the center of gravity of a block area Tb is referred to as the center of gravity Gb, the center of gravity of a block area Tc is referred to as the center of gravity Gc, and the centers of gravity Ga to Gc are collectively referred to as the center of gravity G.

[0041] When the bridge detection processing routine is started, the CPU 26 makes the electrode area A including the detection line L overlap with the captured image 52 to perform positioning of the electrode area A (S300). Figure 7 As shown in (A), by using the allowable rate of the detection line L in the same manner as S150, even in the case of Figure 4 When an image is obtained in which the outer edge of the main body is connected to the electrode E, the CPU 26 can also detect the electrode E and locate the electrode area A in the area where the electrode E exists. Next, the CPU 26 binarizes the captured image 52 after the solder is transferred, and extracts an area with the same brightness value as an area T (S310). In this process, a threshold value for extracting the binarization of the area to which the solder is transferred is pre-set based on experience, and the CPU 26 detects its outer edge and extracts the area inside the outer edge as an area T to which the solder is transferred. Figure 7 As shown in FIG. 5B , the CPU 26 extracts as one area T the area to which the solder is transferred in the captured image 52 .

[0042] Next, CPU26 obtains the center of gravity G of all the extracted areas T (S320). CPU26 calculates the center of gravity G based on the range of the area without considering the distribution of brightness values ​​within an area T. Next, CPU26 sets each electrode E to be detected to one (S330), and obtains the position and size of the electrode area A serving as the reference for the corresponding electrode E from the component information 28 (S340). Next, CPU26 determines whether the center of gravity G of an area T is included in the reference electrode area A (S350). When the center of gravity G is included in the electrode area A, CPU26 determines whether all electrodes E have been detected in S350 (S360). When all electrodes E have not been detected in S350, the processing after S330 is executed. That is, CPU26 sets the electrode E to be inspected next, and determines whether the center of gravity G of an area T is included in the reference electrode area A.

[0043] On the other hand, if the center of gravity G is not included in the reference electrode area A in S350, the CPU 26 determines that a solder bridge has been formed across the plurality of electrodes E, and discards the component Pa currently being inspected (S370). Figure 9 (A) Figure 9 As shown in (C), when no bridge is generated, one electrode area A must contain the center of gravity G of one area T. On the other hand, Figure 9 (B) Figure 9 As shown in (D), if a bridge forms between electrodes E, an electrode region A that does not include the center of gravity G is generated. CPU 26 detects the formation of a bridge based on the relationship between the center of gravity G of a block region T and the electrode region A. Alternatively, CPU 26 could determine the formation of a bridge based on whether the number of centers of gravity G of a block region T matches the number of electrode regions A. However, this method may result in false detection due to the possibility of detecting a block region T outside of the electrode region A, such as a reference mark. This control device 25 can reliably detect the formation of a bridge during solder transfer based on whether the center of gravity G of a block region T is included in the electrode region A.

[0044] Then, after S370 or after the detection of S350 is performed on all electrodes E in S360, the CPU 26 records the detection result in the storage unit 27 (S380), and ends this routine.

[0045] Here, the correspondence between the components of this embodiment and the components of the present disclosure is clarified. The control device 25 of this embodiment corresponds to the inspection device of the present disclosure, and the CPU 26 corresponds to the control unit. In addition, any one of the electrodes Ea to Ec corresponds to the predetermined portion, the solder paste corresponds to the viscous fluid, the component Pa corresponds to the processing object, the block T corresponds to the block area, the center of gravity G corresponds to the center of gravity, the electrode area A corresponds to the standard range, and the detection line L corresponds to the detection line. In addition, in this embodiment, by explaining the operation of the control device 25, an example of the inspection method of the present disclosure is also clarified.

[0046] The control device 25 (inspection device) of the present embodiment described above extracts a primary region T from a captured image of a component Pa, a processing object, in which solder, a viscous fluid, is formed on an electrode E, a predetermined location. The device then determines the center of gravity G of the extracted primary region T and determines whether the center of gravity G of a region T is included within an electrode region A (a standard range of the predetermined location) serving as a reference for the captured image, thereby determining whether a bridge is present. When detecting regions where solder is formed, for example, if bridges occur with respect to multiple electrodes E, the multiple regions are connected and extracted as a single region, resulting in electrode regions A that do not include the center of gravity G. By determining the presence or absence of electrode regions A that do not include the center of gravity G, the control device 25 can more appropriately perform bridge detection.

[0047] Furthermore, in the control device 25, the processing target is a component Pa having two or more electrodes E and to which solder is transferred, the viscous fluid is solder, and the predetermined portion is the electrode E. The CPU 26 determines whether a solder bridge has occurred. This control device 25 can more appropriately detect solder bridges in components Pa having two or more electrodes E.

[0048] Furthermore, CPU 26 uses multiple detection lines L to detect the brightness difference between the area spanning electrode E and the area outside electrode E in the captured image. Based on the detection lines L that meet a predetermined tolerance, the position of electrode E is determined. After detecting the configuration of component Pa, CPU 26 determines whether a bridge has occurred. Even if an image is captured showing electrode E formally connected to another area, CPU 26 uses detection lines L and the tolerance to flexibly detect the position of electrode E, enabling positioning of component Pa based on the position of electrode E. Furthermore, CPU 26 can appropriately perform bridge detection based on the position of electrode E.

[0049] Furthermore, the inspection device and the inspection method disclosed in this specification are not limited to the above-described embodiments, and can of course be implemented in various forms as long as they fall within the technical scope of the present disclosure.

[0050] For example, in the above embodiment, the object to be processed is a component Pa having two or more electrodes E. However, any component that generates a bridge formed by a viscous fluid across adjacent predetermined locations is not particularly limited to this. Examples of the object to be processed include a substrate S having multiple electrodes E and a three-dimensional substrate. Furthermore, in the above embodiment, the viscous fluid is solder. However, any viscous fluid that forms a bridge across predetermined locations is not particularly limited to this. Examples of viscous fluids include conductive pastes, adhesives, and resins such as insulating materials. Similarly, in the above embodiment, the control device 25 determines the presence of solder bridges. However, this is not particularly limiting and the control device 25 may also detect bridges formed by the adhesive at multiple bonding locations. In particular, the inspection device may also be configured such that the object to be processed is a substrate S having two or more electrodes, the viscous fluid is solder, and the CPU 26 determines whether a solder bridge has formed. This inspection device can more appropriately detect solder bridges for substrates S having two or more electrodes. Furthermore, when the object to be processed is a component, it is preferable because solder detection is easy from the viewpoint of color difference.

[0051] In the above embodiment, the CPU 26 determines the position of the electrode E based on the detection line L that satisfies the tolerance and detects the arrangement of the component Pa. However, this is not particularly limiting and this process may be omitted, or the arrangement of the component Pa may be detected using a method other than this process. Furthermore, as an inspection device, even when the use of the detection line reveals that the predetermined portion is formally connected to another portion, the position of the predetermined portion can be flexibly detected. Therefore, it is preferable to determine the position of the predetermined portion based on the detection line L that satisfies the tolerance.

[0052] In the above embodiment, the inspection device of the present invention is described as the control device 25 and the mounting device 13, but the present invention is not particularly limited to this and may be an inspection method. In addition, in the above embodiment, the mounting device 13 includes the control device 25 that functions as an inspection device, but the present invention is not particularly limited to this. Any of the mounting-related devices of the mounting system 10 that are related to the process of mounting the component P on the substrate S may also function as the inspection device of the present invention. For example, in the case where the processing object is the substrate S and the bridge of the solder printed on the substrate S by the printing device 11 is detected, the printing inspection device 12 may also function as the above-mentioned inspection device. In this case, the substrate information similar to the component information 28 is stored in the storage unit 44, and the CPU 43 of the control device 42 controls the inspection unit 45 to execute the bridge detection processing routine.

[0053] Here, the inspection device and the inspection method disclosed in the present invention may also be configured as follows. For example, in the inspection device disclosed in the present invention, the processing object may be a component having two or more electrodes, the viscous fluid may be solder, and the control unit may determine whether a bridge of the solder has been generated. In this inspection device, for components having two or more electrodes, a bridge of the solder can be detected more appropriately. Alternatively, the processing object may be a substrate having two or more electrodes, the viscous fluid may be solder, and the control unit may determine whether a bridge of the solder has been generated. In this inspection device, for substrates having two or more electrodes, a bridge of the solder can be detected more appropriately. In addition, when the processing object is a component, it is preferable because solder detection is easy from the perspective of color difference.

[0054] In the inspection device disclosed herein, the control unit may use a plurality of detection lines for detecting brightness differences between an area of ​​the captured image that spans the predetermined portion and an area outside the predetermined portion, determine the position of the predetermined portion based on the detection lines that satisfy a predetermined tolerance, and determine whether the bridge has occurred after detecting the configuration of the processing object. In this inspection device, the use of detection lines allows for flexible detection of the position of the predetermined portion even when the predetermined portion is detected as being formally connected to another portion, enabling positioning of the processing object based on the position of the predetermined portion. Furthermore, in this inspection device, bridge detection can be performed more appropriately based on the knowledge of the position of the predetermined portion.

[0055] The inspection method disclosed herein is used for an installation system including an installation device for configuring components on a substrate, wherein the inspection method includes the following steps: (a) extracting an area included in a captured image obtained by capturing a processing object having a viscous fluid formed at a predetermined position; and (b) calculating the center of gravity of the area extracted in step (a), determining whether the center of gravity is included in a standard range of the predetermined position serving as a reference for the captured image, and thereby determining whether a bridge of the viscous fluid is generated across adjacent predetermined positions.

[0056] In this inspection method, similar to the above-mentioned inspection device, by determining a predetermined location that does not include the center of gravity, the bridge can be inspected more appropriately. In addition, in this inspection method, various forms of the above-mentioned inspection device can be adopted, and steps for implementing various functions of the above-mentioned inspection device can be added.

[0057] Industrial Applicability

[0058] The inspection device and inspection method disclosed herein can be applied to the technical field of devices that perform processes such as picking up and arranging components.

[0059] Description of Reference Numerals

[0060] 10: Installation system 11: Printing device 12: Print inspection device 13: Installation device 14: Installation inspection device 18: Management PC 21: Substrate processing unit 22: Component supply unit 23: Parts camera 25: Control device 26: CPU 27: Storage unit 28, 28B: Component information 30: Installation unit 31: Head moving unit 32: Installation head 33: Suction nozzle 34: Marking camera 35: Transfer unit 41: Substrate processing unit 42: Control device 43: CPU 44: Storage unit 45: Inspection unit 46: Head moving unit 47: Inspection head 48: Shooting unit 50, 52: Captured images A, Ab2, Ac: Electrode areas E, Ea1~EA8, Eb1~Eb4, Ec1~Ec4: Electrodes P, Pa: Component S: Substrate.

Claims

1. An inspection device used in a mounting system including a mounting device for placing a component on a substrate, wherein: The inspection device includes a control unit that extracts a region included in a captured image obtained by capturing a target object having a viscous fluid formed at a predetermined portion, calculates a center of gravity of the extracted region, and determines whether the center of gravity is included within a predetermined range of the predetermined portion serving as a reference for the captured image, thereby determining whether a bridge of the viscous fluid has formed across adjacent predetermined portions. The control unit uses a plurality of detection lines for detecting brightness differences across an area of ​​the predetermined part and an area outside the predetermined part in the captured image, determines the position of the predetermined part based on the number of detection lines where the number of points where the brightness difference is detected to cross a predetermined threshold satisfies a predetermined tolerance relative to the number of the plurality of detection lines, and determines whether the bridge is generated after detecting the configuration state of the processing object.

2. The inspection device according to claim 1, wherein: The processing object is a device having two or more electrodes, The viscous fluid is solder, The control unit determines whether a bridge of the solder has occurred.

3. An inspection method for use in a mounting system including a mounting device for placing a component on a substrate, wherein: The inspection method comprises the following steps: (a) extracting a region included in a captured image of an object to be processed in which a viscous fluid is formed at a predetermined portion; and (b) Calculating the center of gravity of the area extracted in step (a), determining whether the center of gravity is included in a predetermined range of the predetermined part serving as a reference for the captured image, thereby determining whether a bridge of the viscous fluid is generated across adjacent predetermined parts, using a plurality of detection lines for detecting brightness differences across an area of ​​the predetermined part and outside an area of ​​the predetermined part for the captured image, determining the position of the predetermined part based on the number of detection lines where the number of points where the brightness difference is detected to cross a predetermined threshold satisfies a predetermined tolerance relative to the number of the plurality of detection lines, and determining whether the bridge is generated after detecting the configuration state of the processing object.

Images