An intelligent glue mounting device for wafer packaging

Abstract

The present invention discloses an intelligent glue dispensing device for wafer packaging in the technical field of wafer glue mounting, including a packaging table. Four L-shaped guiding plates arranged in a square array are fixedly connected to the top surface of the packaging table. A support plate is rotatably connected to each of the second mounting openings. An adhesive dispensing mechanism is connected inside each support plate. The adhesive dispensing mechanism performs one-time glue dispensing on the glue dispensing position on the top surface of the substrate before the support plate moves down to the top surface of the substrate. The adhesive dispensing mechanism is connected to a pulling mechanism, and the pulling mechanism is used to retract the support plate into the second mounting opening after the adhesive dispensing mechanism completes glue dispensing. By the present invention, when wafer packaging is required each time, large-scale wire drawing during the glue dispensing process can be avoided, and the residual glue liquid on the glue dispensing head can also be removed, so that the glue liquid is located between the wafer and the substrate, and wire drawing falling on the substrate after glue dispensing is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer glue mounting, and particularly to an intelligent glue mounting device for wafer packaging. Background Technique

[0002] Semiconductors are part of circuit boards. The core units of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity changes of semiconductors to process information. Common wafer materials include silicon, germanium, gallium arsenide, etc.

[0003] In the process of semiconductor packaging and forming, it is necessary to first use glue to mount the cut wafers onto the corresponding substrates, and then use ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resins to connect the bonding pads of the wafers to the corresponding pins of the substrates to form the required circuits. Then, the individual wafers and substrates are encapsulated and protected with plastic casings.

[0004] In the prior art, in the process of mounting the cut wafers onto the corresponding substrates with glue, the dispensing device needs to dispense glue on the top of the substrate, and then gently press the wafers onto the substrates to complete the mounting of the wafers and substrates during the encapsulation process. To ensure the firm bonding between the wafers and the substrates, the dispensing device needs to dispense glue four times on the top of each substrate so that the four corners of the bottom surface of the wafers are bonded to the substrates. During the four dispensing processes, the dispensing device needs to move horizontally multiple times, and the glue outlet is prone to the phenomenon of glue drawing. In this way, when the dispensing device moves horizontally, the glue will stick to the positions on the substrates where glue is not required, affecting the mounting quality of the wafers and substrates, and further affecting the service performance and lifespan of the semiconductor after encapsulation; in addition, in the above traditional wafer and substrate mounting process, during the process of pressing the wafers and substrates tightly, the glue on the substrates will spread around under the extrusion of the wafers, so that the glue will overflow to the positions where the wafers and substrates do not overlap (i.e., the positions on the substrates where glue is not required), affecting the mounting quality of the wafers and substrates, and further affecting the service performance and lifespan of the semiconductor after encapsulation.

[0005] Based on this, the present invention designs an intelligent glue mounting device for wafer packaging to solve the above problems. Summary of the Invention

[0006] The purpose of the present invention is to provide an intelligent glue mounting device for wafer packaging to solve the problems raised in the above background technique.

[0007] To achieve the above object, the present invention provides the following technical solution: An intelligent glue mounting device for wafer packaging, including a packaging table, on the top surface of the packaging table are fixedly connected with four L-shaped guiding plates arranged in a square array. Each L-shaped guiding plate is fixedly connected with an angle-iron-shaped limiting frame. At the folding corner of each limiting frame, a first mounting opening is provided. A moving angle block is slidably assembled in each first mounting opening. The inner side surface of the moving angle block is flush with the inner side surface of the limiting frame, and a second mounting opening is provided on the inner side of each moving angle block. A tray is rotatably connected in each second mounting opening. An adhesive dispensing mechanism is connected inside each tray. The adhesive dispensing mechanism performs one-time glue dispensing at the glue dispensing position on the top surface of the substrate before the tray moves down to the top surface of the substrate. The adhesive dispensing mechanism is connected with a pulling mechanism. The pulling mechanism is used to retract the tray into the second mounting opening after the adhesive dispensing mechanism completes glue dispensing. After the tray is completely retracted into the second mounting opening, it is flush with the inner side surface of the moving angle block.

[0008] Further, the adhesive dispensing mechanism includes a glue dispensing tube. One end of the glue dispensing tube is fixedly connected inside the tray, and the glue dispensing head of the glue dispensing tube is flush with the side surface of the tray. The moving angle block is connected through a first connecting plate with a first rotating rod rotatably connected to the first connecting plate. A first sliding groove is provided on the limiting frame. A first sliding block is clamped inside the first sliding groove. Limiting rods fixedly connected with the first connecting plate are arranged above and below the first sliding block. A first spring for resetting the first sliding block is connected to the limiting rod. The first sliding block is fixedly connected with a soft extrusion cylinder through a fixing frame. The other end of the glue dispensing tube bypasses the first rotating rod and penetrates through the first sliding block and then communicates with the extrusion cylinder. An extrusion mechanism is provided on one side of the extrusion cylinder. The extrusion mechanism performs one-time extrusion on the extrusion cylinder before the tray moves down to the top surface of the substrate.

[0009] Further, the extrusion mechanism includes a first support plate. The first support plate is fixedly connected to the top of the first connecting plate. The first support plate is slidably connected with a second sliding plate through a straight rod. The second sliding plate is fixedly connected with an extrusion plate for extruding the extrusion cylinder. The second sliding plate is also fixedly connected with a first guiding block. A second guiding block is provided below the first guiding block. The second guiding block is used to drive the first guiding block to carry the extrusion plate to move to extrude the extrusion cylinder.

[0010] Further, the pulling mechanism includes a third guiding block. The third guiding block is fixedly connected to the first sliding block. A fourth guiding block is provided below the third guiding block. When the third guiding block moves down and contacts the fourth guiding block, the guiding block pulls the first sliding block out of the first sliding groove and pulls the tray into the second mounting opening through the glue dispensing tube.

[0011] Furthermore, an L-shaped friction plate is fixedly connected to the outer wall of each of the four movable corner blocks, and the L-shaped friction plate is located on the outer side of the limit frame. A second rotating rod is connected to the two L-shaped guide plates on the left and right sides for common rotation. A friction disk is fixedly connected to the outer surface of the second rotating rod, and a torsion spring is commonly connected between the friction disk and the L-shaped guide plate. The two second rotating rods are fixedly connected to an extrusion rod, and the extrusion rod is used to press the chip and the substrate after the chip falls to the top of the substrate.

[0012] Furthermore, a glue adding port is provided on the top of the glue extrusion cylinder, and a U-shaped sliding frame is fixedly connected to the top of the glue extrusion cylinder. A U-shaped sealing plate is slidably connected to the inner side of the U-shaped sliding frame, and the U-shaped sealing plate is used to seal the glue adding port. The U-shaped sealing plate is connected to the U-shaped sliding frame through a second spring, and the limiting frame is fixedly connected to an extrusion block, and the extrusion block is used to squeeze the U-shaped sealing plate to be staggered with the glue adding port when the glue extrusion cylinder moves to the glue adding station.

[0013] Furthermore, a power device is installed on the packaging table, and the power device includes two electric cylinders, which are fixedly connected to both sides of the top surface of the packaging table. The top ends of the two electric cylinders are fixedly connected to a first push plate, and the first push plate is fixedly connected to the two L-shaped guide plates on the same side.

[0014] Furthermore, the movable corner block is connected to a driving mechanism for driving the movable corner block to move in the vertical direction, and the driving mechanism includes four telescopic cylinders. A U-shaped bracket is fixedly connected to the top of the packaging table, and the bottom ends of the four telescopic cylinders are respectively fixedly connected to the four movable corner blocks, and the top ends of the four telescopic cylinders are fixedly connected to the inner top of the U-shaped bracket.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention uses movable corner blocks and limit frames to precisely wrap around the four corners of the wafer when the wafer and substrate are bonded together. This allows the squeezed glue to enter only between the wafer and substrate. This effectively solves the problem of glue on the substrate diffusing in all directions due to the squeeze of the wafer during the pressing process. This can cause the glue to overflow to non-overlapping locations on the wafer and substrate (i.e., locations on the substrate where glue is not required), affecting the quality of wafer-to-substrate bonding and, consequently, the performance and life of the packaged wafer.

[0017] 2. The present invention reasonably sets the distance between the pallet moving downward to the top surface of the substrate according to the actual application situation, and performs glue dispensing when the pallet is as close as possible to the top surface of the substrate. In this way, during the process of the pallet moving into the second installation opening, the distance between the substrate and the wafer is short, and the wafer can also contact the glue outlet of the glue dispensing mechanism on the pallet in the shortest time, scraping off the glue on the glue outlet, solving the problem of glue drawing at the four corners of the mobile glue dispensing device in the prior art, and at the same time avoiding the problem of glue head blockage caused by the cooling of the glue outside the glue outlet.

[0018] 3. After the wafer lands on the top of the substrate, during the process of the driving mechanism driving the moving corner block to rise and reset, the moving corner block drives the L-shaped friction plate to rise synchronously. When the L-shaped friction plate acts on the friction disk, the friction disk rotates, the friction disk drives the second rotating rod to rotate, twists the torsion spring, the second rotating rod drives the extrusion rod to rotate, so that the extrusion rod rotates to the top of the wafer and continuously presses the wafer downward, pressing the wafer tightly on the substrate, thereby tightly fitting the wafer on the top of the substrate. When the L-shaped friction plate disengages from the friction disk, the second rotating rod and the extrusion rod reset under the action of the torsion spring, avoiding the extrusion rod from interfering with the falling of the wafer, which is beneficial to the tight mounting of the wafer.

[0019] 4. The present invention is provided with a glue adding port at the top of the glue extrusion cylinder. When the glue is extruded and the glue extrusion cylinder is driven to move upward and reset, the U-shaped sealing plate is squeezed by the extrusion push block, so that the U-shaped sealing plate releases the sealing of the glue adding port, compresses the second spring, and adds glue from the glue adding port to supplement the glue liquid inside the glue extrusion cylinder, thereby ensuring that the glue liquid inside the glue extrusion cylinder is sufficient, making the amount of glue extruded each time basically the same, which is beneficial to the encapsulation of the wafer. During glue extrusion, the U-shaped sealing plate continuously seals the glue adding port under the action of the second spring, avoiding affecting the glue extrusion and making the glue extrusion more stable. Description of the Drawings

[0020] Figure 1 is the first three-dimensional view of the overall structure of the present invention;

[0021] Figure 2 is the second three-dimensional view of the overall structure of the present invention;

[0022] Figure 3 is the top structure view of the pallet and the limit frame of the present invention (hiding the U-shaped bracket);

[0023] Figure 4 is the schematic diagram of the connection structure of the limit frame and its outer side wall of the present invention;

[0024] Figure 5 is Figure 4 the enlarged view of the structure at A in

[0025] Figure 6 is the schematic diagram of the inner side pallet and the glue outlet pipe structure of the limit connection of the present invention;

[0026] Figure 7 Schematic diagram of the connection structure between the first slider and the third guide block of the present invention;

[0027] Figure 8 Schematic diagram of the structure of the second rotating rod and the pressing rod between two limiting frames on the same side of the present invention;

[0028] Figure 9 Schematic diagram of the glue adding port at the top of the glue extrusion cylinder of the present invention.

[0029] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0030] Encapsulation table 1, L-shaped guide plate 2, limiting frame 3, moving corner block 4, support plate 5, glue outlet pipe 6, first connecting plate 7, first rotating rod 8, first sliding groove 9, first slider 10, limiting rod 11, first spring 12, fixing frame 13, glue extrusion cylinder 14, first support plate 15, second sliding plate 16, extrusion plate 17, first guide block 18, second guide block 19, third guide block 20, fourth guide block 21, L-shaped friction plate 22, second rotating rod 23, friction disk 24, torsion spring 25, extrusion rod 26, glue adding port 27, U-shaped sliding frame 28, U-shaped sealing plate 29, second spring 30, extrusion block 31, electric cylinder 32, first push plate 33, telescopic cylinder 34, U-shaped bracket 35. Detailed implementation manners

[0031] Please refer to Figure 1-9, the present invention provides a technical solution: an intelligent glue mounting device for wafer packaging, including a packaging table 1. Four L-shaped guiding plates 2 arranged in a square array are fixedly connected to the top surface of the packaging table 1. By designing four L-shaped guiding plates 2 arranged in a square array on the top surface of the packaging table 1, during operation, when placing the substrate for wafer mounting on the packaging table 1, the L-shaped guiding plates 2 can guide the lateral movement direction of the substrate, enabling the substrate to accurately enter the mounting station. Each L-shaped guiding plate 2 is fixedly connected with an angle-iron-shaped limiting frame 3. A first mounting opening is provided at the folding corner of each limiting frame 3, and a moving corner block 4 is slidably assembled in each first mounting opening. The inner side surface of the moving corner block 4 is flush with the inner side surface of the limiting frame 3. By setting the inner side surface of the moving corner block 4 to be flush with the inner side surface of the limiting frame 3, when the wafer is attached to the substrate, the moving corner block 4 and the limiting frame 3 exactly wrap the four corners of the wafer. The squeezed glue can only enter between the wafer and the substrate, effectively solving the problem that during the pressing process of the wafer and the substrate, the glue on the substrate will spread around under the extrusion of the wafer, so that the glue will flow to the position where the wafer and the substrate do not overlap (i.e., the position where the substrate does not need to be dot-glued), affecting the mounting quality of the wafer and the substrate, and further affecting the service performance and lifespan after wafer packaging. Moreover, second mounting openings are provided on the inner sides of the moving corner blocks 4, and a support plate 5 is rotatably connected in each second mounting opening. An adhesive dispensing mechanism is connected inside each support plate 5. The adhesive dispensing mechanism performs an adhesive dispensing operation on the glue dispensing position on the top surface of the substrate before the support plate 5 moves down to the top surface of the substrate. The adhesive dispensing mechanism is connected with a pulling mechanism, and the pulling mechanism is used to retract the support plate 5 into the second mounting opening after the adhesive dispensing mechanism completes the adhesive dispensing. After the support plate 5 is completely retracted into the second mounting opening, it is flush with the inner side surface of the moving corner block 4. In this technical solution, the distance between the support plate 5 moving down to the top surface of the substrate is reasonably set according to the actual application situation, so that the glue is dispensed when the support plate 5 is as close as possible to the top surface of the substrate. In this way, during the process of the support plate 5 being retracted into the second mounting opening, the distance between the substrate and the wafer is short, and the wafer can also contact the glue outlet of the glue dispensing mechanism on the support plate 5 in the shortest time to scrape off the glue on the glue outlet, solving the problem of glue drawing at the four corners of the moving glue dispensing device in the prior art, and at the same time avoiding the problem of glue head blockage caused by the cooling of the glue outside the glue outlet.

[0032] The glue discharging mechanism includes a glue discharging tube 6. One end of the glue discharging tube 6 is fixedly connected inside the support plate 5, and the dispensing head of the glue discharging tube 6 is flush with the side surface of the support plate 5. The moving angle block 4 is connected through a first connecting plate 7 to a first rotating rod 8 that is rotatably connected to the first connecting plate 7. A first sliding groove 9 is formed on the limiting frame 3, and a first sliding block 10 is clamped inside the first sliding groove 9. Limiting rods 11 fixedly connected to the first connecting plate 7 are arranged above and below the first sliding block 10. A first spring 12 for resetting the first sliding block 10 is connected to the limiting rods 11. The first sliding block 10 is fixedly connected through a fixing frame 13 to a soft glue extrusion cylinder 14. The other end of the glue discharging tube 6 bypasses the first rotating rod 8 and penetrates through the first sliding block 10 and then communicates with the glue extrusion cylinder 14. A pressing mechanism is provided on one side of the glue extrusion cylinder 14. The pressing mechanism completes one extrusion of the glue extrusion cylinder 14 before the support plate 5 moves downward to the top surface of the substrate.

[0033] The pressing mechanism includes a first support plate 15. The first support plate 15 is fixedly connected to the top of the first connecting plate 7. The first support plate 15 is slidably connected through a straight rod to a second sliding plate 16. The second sliding plate 16 is fixedly connected to a pressing plate 17. The pressing plate 17 is used to press the glue extrusion cylinder 14. The second sliding plate 16 is also fixedly connected to a first guiding block 18. A second guiding block 19 is provided below the first guiding block 18. The second guiding block 19 is used to drive the first guiding block 18 to carry the pressing plate 17 to move to press the glue extrusion cylinder 14.

[0034] The pulling mechanism includes a third guiding block 20. The third guiding block 20 is fixedly connected to the first sliding block 10, and a fourth guiding block 21 is arranged below the third guiding block 20. When the third guiding block 20 moves downward and contacts the fourth guiding block 21, the fourth guiding block 21 pulls the first sliding block 10 out of the first sliding groove 9 and pulls the support plate 5 into the second installation opening through the glue discharging tube 6.

[0035] When this technical solution is implemented, the substrate is first pushed from the side onto the mounting station of the packaging table 1, and the wafer is placed inside the limit frame 3 at the same time. The four support plates 5 support the wafer above the substrate. Then, the driving mechanism is started, and the driving mechanism drives the four moving corner blocks 4 to slide downward synchronously. The moving corner block 4 drives the first slider 10 to move downward at the same time through the first connecting plate 7 and the limit rod 11. The first slider 10 drives the glue squeezing cylinder 14 to move downward synchronously through the fixed frame 13. As the moving corner block 4 moves downward, the wafer supported on the top of the moving corner block 4 gets closer and closer to the substrate. When the extrusion block 31 slides to interact with the second guide block 19, the second guide block 1 9 squeezes the first guide block 18, causing the first guide block 18 and the second slide plate 16 to slide inward, and the second slide plate 16 drives the extrusion plate 17 fixedly connected thereto to squeeze the soft glue squeezing cylinder 14, so that the glue inside the glue squeezing cylinder 14 is squeezed into between the substrate and the wafer through the glue outlet pipe 6 and falls on the top of the substrate to achieve glue dispensing. Then, the substrate continues to make the third guide block 20 on the side wall of the first slider 10 act on the fourth guide block 21. The third guide block 20 is squeezed to drive the first slider 10 to slide outward along the first slide groove 9, driving the glue discharging mechanism to move outward together, and the glue squeezing cylinder 14 drives the support plate 5 to rotate into the inside of the movable corner block 4 by pulling the glue outlet pipe 6. The second mounting port is separated from the bottom of the wafer. When the movable corner block 4 slides to the bottom, that is, when the movable corner block 4 contacts the top of the substrate, the support plate 5 is completely separated from the wafer. At this time, the distance between the wafer and the substrate is equivalent to that of only one movable corner block 4. During the falling process, the wafer will fall to the mounting position of the substrate without basically any position deviation. In addition, the four glue discharge pipes 6 discharge glue at the corners of the substrate at the same time, continuously moving downward and squeezing glue, which solves the problem that the glue dispensing device in the prior art needs to perform four glue dispensings on the top of each substrate so that the four corners of the bottom surface of the wafer are all bonded to the substrate, and the glue dispensing device needs to perform multiple glue dispensings during the four glue dispensing processes. When the support plate 5 is pulled away from the chip, the glue squeezing cylinder 14 has been squeezed to completely discharge the glue, avoiding glue dripping during the rotation and retraction of the support plate 5. When the chip falls to the top of the substrate, the side of the chip will scrape the tube head of the glue discharge tube 6, scraping the glue at the tube head of the glue discharge tube 6 to the bottom of the chip, and removing the wire drawing at the end of the glue discharge tube 6. Then, the driving mechanism retracts and drives the movable corner block 4 to reset. The power device lifts the L-shaped guide plate 2, thereby driving the top glue discharge mechanism to rise, so that the limit frame 3 is higher than the substrate and the chip, which is convenient for taking out the substrate and the chip from the side to complete the packaging.

[0036] Furthermore, an L-shaped friction plate 22 is fixedly connected to the outer wall of each of the four movable corner blocks 4. The L-shaped friction plate 22 is located on the outer side of the limit frame 3. A second rotating rod 23 is connected to the two L-shaped guide plates 2 on the left and right sides for common rotation. A friction disk 24 is fixedly connected to the outer surface of the second rotating rod 23. A torsion spring 25 is commonly connected between the friction disk 24 and the L-shaped guide plate 2. The two second rotating rods 23 are fixedly connected to an extrusion rod 26. The extrusion rod 26 is used to press the chip and the substrate after the chip falls to the top of the substrate; during operation, in order to avoid direct extrusion of the chip to cause damage, the driving mechanism is used to move the corner block 4 downward to drive the chip downward. When the movable corner block 4 is separated from the chip, the chip falls under the action of gravity and the mounting will occur. The phenomenon of instability is that after the chip falls on the top of the substrate, the driving mechanism drives the movable corner block 4 to rise and reset, and the movable corner block 4 drives the L-shaped friction plate 22 to rise synchronously. When the L-shaped friction plate 22 acts on the friction disk 24, the friction disk 24 rotates, and the friction disk 24 drives the second rotating rod 23 to rotate, twisting the torsion spring 25, and the second rotating rod 23 drives the squeezing rod 26 to rotate, so that the squeezing rod 26 rotates to the top of the chip and continues to press the chip downward to press the chip onto the substrate, thereby tightly fitting the chip to the top of the substrate. After the L-shaped friction plate 22 is disengaged from the friction disk 24, the second rotating rod 23 and the squeezing rod 26 are reset under the action of the torsion spring 25, avoiding the squeezing rod 26 interfering with the falling of the chip, which is conducive to the firm mounting of the chip.

[0037] Furthermore, a glue filling port 27 is provided on the top of the glue extrusion cylinder 14, and a U-shaped sliding frame 28 is fixedly connected to the top of the glue extrusion cylinder 14. A U-shaped sealing plate 29 is slidably connected to the inner side of the U-shaped sliding frame 28. The U-shaped sealing plate 29 is used to seal the glue filling port 27. The U-shaped sealing plate 29 is connected to the U-shaped sliding frame 28 through a second spring 30. The limiting frame 3 is fixedly connected to a squeezing block 31. The squeezing block 31 is used to squeeze the U-shaped sealing plate 29 and the glue filling port 27 when the glue extrusion cylinder 14 moves to the glue filling station. During operation, after each drop and squeezing of the glue extrusion cylinder 14 to discharge glue, the glue liquid inside the glue extrusion cylinder 14 continues to decrease, making it easy to discharge glue. In order to solve the problem that the glue liquid decreases and the glue discharge is unstable after glue is squeezed, a glue adding port 27 is opened on the top of the glue squeezing cylinder 14. When the glue is discharged, the glue squeezing cylinder 14 is driven to move upward and reset, and the U-shaped sealing plate 29 is squeezed, so that the U-shaped sealing plate 29 releases the seal on the glue adding port 27 and compresses the second spring 30. The exposed glue adding port 27 is convenient for adding glue, and the glue liquid inside the glue squeezing cylinder 14 is replenished, thereby ensuring that the glue liquid inside the glue squeezing cylinder 14 is sufficient, so that the amount of glue discharged each time is basically the same. When squeezing glue, the U-shaped sealing plate 29 continues to seal the glue after adding glue under the action of the second spring 30, which will not affect the glue discharge.

[0038] Further, a power device is also installed on the encapsulation table 1. The power device includes two electric cylinders 32. The electric cylinders 32 are fixedly connected to both sides of the top surface of the encapsulation table 1. The top ends of the two electric cylinders 32 are fixedly connected with a first push plate 33. The first push plate 33 is fixedly connected with the two L-shaped guiding plates 2 on the same side. During operation, after the wafer is mounted on the top of the substrate, the wafer is still inside the four limit frames 3, which is not conducive to taking out the substrate and the wafer. By starting the two electric cylinders 32, the first push plate 33 fixedly connected thereto drives the four L-shaped guiding plates 2 to rise simultaneously. The four L-shaped guiding plates 2 drive the four limit frames 3 to rise, so that the limit frames 3 are separated from the wafer, and then the mounted substrate and wafer can be taken out.

[0039] Further, the moving corner block 4 is connected with a driving mechanism for driving the moving corner block 4 to move in the vertical direction. The driving mechanism includes four telescopic cylinders 34. A U-shaped bracket 35 is fixedly connected to the top of the encapsulation table 1. The bottom ends of the four telescopic cylinders 34 are respectively fixedly connected with the four moving corner blocks 4. The top ends of the four telescopic cylinders 34 are fixedly connected to the inner top of the U-shaped bracket 35. During operation, since the wafer body is relatively fragile, the wafer should not be directly pressed for mounting. By using the four telescopic cylinders 34 to drive the moving corner block 4 to move up and down, the wafer is placed on the top of the moving corner block 4 and the supporting plate 5 on its side, so that the wafer slowly falls and mounts under the action of gravity, which is beneficial to the mounting of the wafer.

Claims

1. An intelligent glue mounting device for wafer packaging, including a packaging table (1), characterized in that: On the top surface of the encapsulation table (1), four L-shaped guiding plates (2) arranged in a square array are fixedly connected. Each L-shaped guiding plate (2) is fixedly connected with an angle-iron-shaped limiting frame (3). At the folded corner of each limiting frame (3), a first installation opening is formed. A moving angle block (4) is slidably assembled in each first installation opening. The inner side surface of the moving angle block (4) is flush with the inner side surface of the limiting frame (3). And a second installation opening is formed in the inner side of each moving angle block (4). A supporting plate (5) is rotatably connected in each second installation opening. An adhesive dispensing mechanism is connected inside each supporting plate (5). The adhesive dispensing mechanism performs an adhesive dispensing operation on the top surface of the substrate at the adhesive dispensing position before the supporting plate (5) moves down to the top surface of the substrate. The adhesive dispensing mechanism is connected with a pulling mechanism. The pulling mechanism is used to retract the supporting plate (5) into the second installation opening after the adhesive dispensing mechanism completes the adhesive dispensing. After the supporting plate (5) is completely retracted into the second installation opening, it is flush with the inner side surface of the moving angle block (4).

2. The intelligent glue mounting device for wafer packaging according to claim 1, characterized in that: The adhesive dispensing mechanism includes an adhesive dispensing tube (6). One end of the adhesive dispensing tube (6) is fixedly connected inside the supporting plate (5), and the dispensing head of the adhesive dispensing tube (6) is flush with the side surface of the supporting plate (5). The moving angle block (4) is connected with a first rotating rod (8) rotatably connected to the first connecting plate (7) through the first connecting plate (7). A first sliding groove (9) is formed in the limiting frame (3). A first sliding block (10) is clamped inside the first sliding groove (9). Limiting rods (11) fixedly connected to the first connecting plate (7) are arranged above and below the first sliding block (10). A first spring (12) for resetting the first sliding block (10) is connected to the limiting rod (11). The first sliding block (10) is fixedly connected with a soft rubber extrusion cylinder (14) through a fixing frame (13). The other end of the adhesive dispensing tube (6) bypasses the first rotating rod (8) and penetrates through the first sliding block (10) and then communicates with the rubber extrusion cylinder (14). An extrusion mechanism is arranged on one side of the rubber extrusion cylinder (14). The extrusion mechanism performs an extrusion operation on the rubber extrusion cylinder (14) before the supporting plate (5) moves down to the top surface of the substrate.

3. The intelligent glue mounting device for wafer packaging according to claim 2, wherein: The extrusion mechanism includes a first supporting plate (15). The first supporting plate (15) is fixedly connected to the top of the first connecting plate (7). The first supporting plate (15) is slidably connected with a second sliding plate (16) through a straight rod. The second sliding plate (16) is fixedly connected with an extrusion plate (17). The extrusion plate (17) is used to extrude the rubber extrusion cylinder (14). The second sliding plate (16) is also fixedly connected with a first guiding block (18). A second guiding block (19) is arranged below the first guiding block (18). The second guiding block (19) is used to drive the first guiding block (18) to carry the extrusion plate (17) to move and extrude the rubber extrusion cylinder (14).

4. The intelligent glue mounting device for wafer packaging according to claim 3, characterized in that: The pulling mechanism includes a third guiding block (20), the third guiding block (20) is fixedly connected to the first slider (10), and a fourth guiding block (21) is arranged below the third guiding block (20). When the third guiding block (20) moves downward to contact the fourth guiding block (21), the fourth guiding block (21) pulls the first slider (10) out of the first sliding groove (9), and pulls the pallet (5) into the second installation opening through the glue outlet pipe (6).

5. An intelligent glue mounting device for wafer packaging according to claim 4, characterized in that: L-shaped friction plates (22) are fixedly connected to the outer side walls of the four moving corner blocks (4). The L-shaped friction plates (22) are located outside the limiting frame (3). A second rotating rod (23) is rotatably connected between the two L-shaped guiding plates (2) on the left and the right. A friction disc (24) is fixedly connected to the outer surface of the second rotating rod (23). A torsion spring (25) is jointly connected between the friction disc (24) and the L-shaped guiding plate (2). Two second rotating rods (23) are fixedly connected with pressing rods (26). The pressing rods (26) are used for pressing the wafer and the substrate tightly after the wafer falls onto the top of the substrate.

6. The intelligent glue mounting device for wafer packaging according to claim 2, wherein: A glue adding port (27) is formed in the top of the glue extrusion cylinder (14). A U-shaped sliding frame (28) is fixedly connected to the top of the glue extrusion cylinder (14). A U-shaped sealing plate (29) is slidably connected to the inside of the U-shaped sliding frame (28). The U-shaped sealing plate (29) is used for sealing the glue adding port (27). The U-shaped sealing plate (29) is connected to the U-shaped sliding frame (28) through a second spring (30). The limiting frame (3) is fixedly connected with a pressing block (31). The pressing block (31) is used for pressing the U-shaped sealing plate (29) to be staggered from the glue adding port (27) when the glue extrusion cylinder (14) moves to the glue adding station.

7. An intelligent glue mounting device for wafer packaging according to claim 1, characterized in that: A power device is further installed on the encapsulation table (1). The power device includes two electric cylinders (32). The electric cylinders (32) are fixedly connected to both sides of the top surface of the encapsulation table (1). First push plates (33) are fixedly connected to the tops of the two electric cylinders (32). The first push plates (33) are fixedly connected to the two L-shaped guiding plates (2) on the same side.

8. An intelligent glue mounting device for wafer packaging according to claim 1, characterized in that: The moving corner block (4) is connected with a driving mechanism for driving the moving corner block (4) to move in the vertical direction. The driving mechanism includes four telescopic cylinders (34). A U-shaped bracket (35) is fixedly connected to the top of the encapsulation table (1). The bottoms of the four telescopic cylinders (34) are respectively fixedly connected to the four moving corner blocks (4). The tops of the four telescopic cylinders (34) are fixedly connected to the inner top of the U-shaped bracket (35).

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