A bonding tool and a pressing assembly thereof

Abstract

The present application discloses a bonding tool and a pressing assembly thereof, wherein the pressing assembly includes a base plate, a pressing member, and a driving member. The base plate is used to place the assembly to be bonded; the pressing member is arranged on the base plate, and is used to press the assembly to be bonded along a first direction so that the assembly to be bonded maintains a preset size after bonding. The pressing member includes a frame, a moving part, and a guide part. The moving part is used to move relative to the frame along the first direction to press the assembly to be bonded. The guide part connects the moving part and the frame, and is used to prevent the moving part from tilting during movement, thereby ensuring the movement accuracy of the moving part. The driving member is movably connected to the frame, and is used to drive the moving part. The above-mentioned pressing assembly can greatly improve the movement accuracy of the moving part, and can ensure that the moving part and the base plate are always parallel to the submicron level during the entire pressing process, thereby improving the dimensional accuracy of the assembly to be bonded after bonding, and thus achieving better high consistency after bonding multiple assemblies to be bonded.

Description

Technical Field

[0001] The present application relates to the technical field of piezoelectric ceramics, and in particular to a pressing assembly and a bonding tool having the pressing assembly. Background Art

[0002] As a key component in the field of micro-nano actuation, piezoelectric ceramic actuators are widely used in optical precision mechanics, particularly in the field of ultra-large-scale integrated circuit lithography. Inchworm-type piezoelectric ceramic actuators employ the inchworm principle to create a combined motion through the repeated expansion and contraction and deflection of multiple piezoelectric ceramic stacks. Static friction then drives the drive shaft in linear motion. To protect the piezoelectric ceramic stacks from frictional wear, a wear-resistant element, typically an alumina ceramic wear-resistant gasket, is typically added between the piezoelectric ceramic stack and the motion shaft. This alumina ceramic wear-resistant gasket is bonded to the top of the piezoelectric ceramic stack. To ensure good actuator performance and operational reliability, high consistency in the preload force between the multiple piezoelectric ceramic stacks and the drive shaft is essential. Consequently, structurally, high height consistency is required between the multiple piezoelectric ceramic stacks bonded to the alumina ceramic gasket. Height consistency refers to the degree of height similarity between the piezoelectric ceramic stacks after the alumina ceramic wear-resistant gasket is bonded to the top of the piezoelectric ceramic stack. The closer the height values, the better the consistency.

[0003] The basic principle of the existing technology is to fix the piezoelectric ceramic stack, apply a glue layer on the piezoelectric ceramic stack, and then move the alumina ceramic wear-resistant gasket toward the piezoelectric ceramic stack so that the alumina ceramic wear-resistant gasket is pressed against the piezoelectric ceramic stack. Specifically, the alumina ceramic wear-resistant gasket is fixed to the moving component by a fixed component. The moving component can move linearly along the vertical guide rail. The piezoelectric ceramic stack is positioned on the base by a positioning component. Two standard blocks are provided on the base. The piezoelectric ceramic stack is arranged between the two standard blocks. The standard blocks can be set to more than two. In this way, when the moving component moves to close contact with the standard blocks, it means that the alumina ceramic wear-resistant gasket has reached the pre-set contact position. That is, the moving component moves up and down along the vertical guide rail. When the moving component contacts the standard block, it will press the alumina ceramic wear-resistant gasket against the piezoelectric ceramic stack. That is, this position is the position where the glue layer is solidified. However, the curing position of the tooling adhesive is determined by the standard blocks. At least two standard blocks with a height difference of 1 micron are required in the tooling to ensure that the moving component does not twist or tilt after contacting the standard blocks, so as not to affect the height consistency of the multiple piezoelectric ceramic stacks after bonding. This limiting method only considers the parallelism or height consistency requirements when pressing the adhesive, but ignores the twisting and tilting that occurs when the moving component is guided by the linear guide during the downward pressing process and before contacting the standard blocks. This twisting and tilting will be partially retained when the moving component contacts the standard blocks, thereby affecting the height consistency of the multiple piezoelectric ceramic stacks after bonding. In addition, the above-mentioned setting method adopts clamping of multiple alumina ceramic wear-resistant gaskets. Usually, in piezoelectric ceramic drivers, the alumina ceramic wear-resistant gaskets are very small compared to the piezoelectric ceramic stack, so bonding and clamping are inconvenient. Once the alumina ceramic wear-resistant gasket is clamped, a small gap is left between the alumina ceramic wear-resistant gasket and the clamping component, which is bound to affect the high consistency of the piezoelectric ceramic stack and the alumina ceramic wear-resistant gasket after bonding.

[0004] Therefore, in order to reduce the difficulty of gluing the piezoelectric ceramic stack and the alumina ceramic gasket, and at the same time ensure that the multiple piezoelectric ceramic stacks have better consistency after gluing, it is necessary for those skilled in the art to provide a pressing assembly and bonding tooling in a timely manner. Summary of the Invention

[0005] The purpose of the present application is to provide a pressing assembly that can improve the dimensional accuracy of the components to be bonded after bonding, thereby ensuring the high consistency of multiple components to be bonded after bonding. Another purpose of the present application is to provide a bonding tool including the above-mentioned pressing assembly.

[0006] To achieve the above objectives, the present application provides a compression assembly, comprising:

[0007] Base plate for placing components to be bonded;

[0008] The pressing member is provided on the base plate and is used to press the assembly to be bonded in a first direction so that the assembly to be bonded maintains a preset size after bonding, and includes:

[0009] frame;

[0010] The moving part is movably provided on the frame body and is used to move relative to the frame body along a first direction to press the component to be bonded;

[0011] a guide portion connecting the moving portion and the frame, and configured to prevent the moving portion from tilting when moving along the first direction;

[0012] The driving member is movably connected to the frame and is used to drive the moving part to move along the first direction.

[0013] In some embodiments, the guide portion includes two groups of flexible beam structures, each group of flexible beam structures includes two flexible beam structures parallel to each other, the moving portion is connected to the inner wall of one side of the frame through one group of flexible beam structures, and the moving portion is connected to the inner wall of the other side of the frame through another group of flexible beam structures.

[0014] In some embodiments, a spacer is provided between the frame and the base plate, and the spacer is used to adjust the parallelism between the moving part and the base plate.

[0015] In some embodiments, the moving part includes a limiting body, which is provided with two limiting grooves, and the frame is provided with two limiting protrusions that are oppositely arranged and extend along the second direction. The two limiting protrusions respectively cooperate with the two limiting grooves to limit the displacement of the moving part.

[0016] In some embodiments, the moving portion further includes a pressing plate body integrally connected to the limiting body, and a dimension of the pressing plate body along the second direction is greater than a dimension of the limiting body along the second direction.

[0017] The present application also provides a bonding tool, comprising:

[0018] base plate;

[0019] As with the above-mentioned pressing assembly, the pressing assembly is provided on the bottom plate;

[0020] The detection component is arranged on the bottom plate and contacts and abuts against the moving part, and is used for measuring the displacement of the moving part.

[0021] In some embodiments, a positioning assembly is further included. The positioning assembly is disposed on the base plate and is used to position the components to be bonded. The positioning assembly includes:

[0022] A positioning frame, used for positioning the second to-be-bonded part of the assembly to be bonded in a plane perpendicular to the first direction;

[0023] A pressing block is provided on the positioning frame and is used to engage with the gaps between the legs on the second part to be bonded to position the second part to be bonded;

[0024] The hollow positioning plate is connected to the positioning frame and is used to position the first to-be-bonded part of the assembly to be bonded in a plane perpendicular to the first direction, wherein the first to-be-bonded part is located on the second to-be-bonded part.

[0025] In some embodiments, the positioning framework includes:

[0026] A first positioning plate connected to the hollow positioning plate, the first positioning plate being provided with a group of first arc protrusions;

[0027] A second positioning plate is connected to the first positioning plate, and the second positioning plate is provided with a second arc protrusion;

[0028] The second arc protrusion is arranged toward two first arc protrusions in a group of first arc protrusions, and the second arc protrusion and a group of first arc protrusions abut against the outer periphery of the second part to be bonded to position the second part to be bonded in a plane perpendicular to the first direction.

[0029] In some embodiments, the first positioning plate is provided with a groove, and the pressing block comprises:

[0030] a central body, disposed in the groove;

[0031] The two side wings are respectively arranged on both sides of the central body and are used to be embedded in the gaps between the legs on the second to-be-bonded part. Any side wing is provided with a third arc protrusion for abutting the second to-be-bonded part.

[0032] In some embodiments, the detection component includes:

[0033] A fixed seat, provided on the bottom plate;

[0034] The digital micrometer is installed on the fixed seat and contacts and abuts against the moving part to measure the displacement of the moving part.

[0035] With respect to the above-mentioned background technology, the clamping assembly provided in the embodiment of the present application includes a base plate, a clamping member and a driving member, wherein the base plate is used to place the component to be bonded, and the component to be bonded includes a first component to be bonded and a second component to be bonded, the first component to be bonded and the second component to be bonded are distributed along a first direction, and glue is provided between the first component to be bonded and the second component to be bonded; the clamping member is provided on the base plate, and the clamping member is used to press the component to be bonded along the first direction so that the component to be bonded maintains a preset size after bonding, further, the clamping member includes a frame, a moving part and a guide part, the moving part is movably provided on the frame, the moving part is used to move relative to the frame along the first direction to clamp the component to be bonded, the guide part connects the moving part and the frame, and the guide part is used to prevent the moving part from tilting when moving along the first direction, thereby ensuring the movement accuracy of the moving part; the driving member is movably connected to the frame, and the driving member is used to drive the moving part to move along the first direction.

[0036] That is, the driving member drives the moving portion to move in the first direction, and the moving portion contacts the component to be bonded and presses the component to be bonded, so that the component to be bonded maintains the preset size after bonding. Compared with the traditional structure, the advantages brought by the compression assembly provided in the embodiment of the application mainly include:

[0037] First, the moving part of the present application can move relative to the frame along a first direction, wherein the guide part connects the moving part and the frame, and the guide part is used to ensure that the moving part always moves along the first direction to prevent the moving part from skewing when moving along the first direction, thereby ensuring the movement accuracy of the moving part. During the pressing operation, the moving part is driven by the driving member to move along the first direction, and the moving part contacts the component to be bonded and presses the component to be bonded to achieve that the component to be bonded after bonding maintains a preset size. By adopting this movement mode, the movement accuracy of the moving part can be greatly improved, and the sub-micron level parallelism between the moving part and the base plate can be always maintained during the entire pressing process, thereby improving the dimensional accuracy of the component to be bonded after bonding, and thereby achieving better high consistency after bonding multiple components to be bonded.

[0038] Secondly, compared with the prior art in which the first part to be bonded and the second part to be bonded are fixed separately, and then the first part to be bonded is driven to move toward the second part to be bonded to achieve compression bonding; the present application adopts the method of placing or fixing the assembly to be bonded as a whole on the base plate, that is, the pre-bonded first part to be bonded and the second part to be bonded are placed or fixed as a whole on the base plate, without fixing the first part to be bonded and the second part to be bonded separately, and then moving one part toward the other to achieve bonding. In this way, there is no need to consider the bonding position of the first part to be bonded and the second part to be bonded during the compression process, thereby avoiding affecting the high consistency of the assembly to be bonded after bonding due to the deviation of the bonding position. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0040] Figure 1 This is a schematic structural diagram of the compression assembly in an embodiment of the present application;

[0041] Figure 2 This is a structural diagram of the bonding tool in the embodiment of the present application;

[0042] Figure 3 for Figure 2 The schematic diagram of the assembly of the detection component, the pressing component and the base plate in the bonding tool shown;

[0043] Figure 4 for Figure 3 A partial enlarged view of part A in the middle;

[0044] Figure 5 for Figure 2 A schematic diagram of the structure of the detection component in the bonding tool shown;

[0045] Figure 6 for Figure 2 Schematic diagram of bonding tool for bonding motion shaft and alumina ceramic wear-resistant gasket;

[0046] Figure 7 Schematic diagram of bonding between the moving shaft and the alumina ceramic wear-resistant gasket;

[0047] Figure 8 This is a structural diagram of another bonding tool in an embodiment of the present application;

[0048] Figure 9 Schematic diagram of bonding of piezoelectric ceramic stack and alumina ceramic wear-resistant gasket;

[0049] Figure 10 for Figure 8 The assembly diagram of the positioning component and the pressing component in the bonding tool shown;

[0050] Figure 11 for Figure 10 Schematic diagram of the assembly of the first positioning plate, the second positioning plate and the pressing block in the positioning assembly shown;

[0051] Figure 12 for Figure 11 A schematic structural diagram of the first positioning plate;

[0052] Figure 13 for Figure 11A schematic structural diagram of the second positioning plate;

[0053] Figure 14 for Figure 11 Schematic diagram of the structure of the medium pressure block.

[0054] in:

[0055] 1-Detection component; 101-Digital dial indicator; 102-Fixed seat;

[0056] 2-pressing assembly; 201-driving member; 202-pressing member; 2021-frame; 20211-limiting protrusion; 2022-moving part; 20221-limiting body; 20222-pressing plate body; 2023-guide part; 203-pad; 204-base plate; 2041-limiting plate;

[0057] 3- positioning assembly; 301- hollow positioning plate; 302- first positioning plate; 3021- first arc protrusion; 3022- groove; 303- second positioning plate; 3031- second arc protrusion; 304- pressing block; 3041- center body; 3042- side wings; 3043- third arc protrusion;

[0058] 4- pallet;

[0059] 5- bottom plate;

[0060] 6-Alumina ceramic wear-resistant gasket;

[0061] 7-Motion axis;

[0062] 8-Piezoelectric ceramic stack. DETAILED DESCRIPTION

[0063] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0064] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0065] It should be noted that the directional terms such as "upper end, lower end, left side, right side" described below are all defined based on the drawings in the specification.

[0066] See also Figure 1The pressing assembly 2 provided in the embodiment of the present application is used to press the assembly to be bonded along the first direction, and includes a base plate 204, a pressing member 202 and a driving member 201, wherein the base plate 204 is used to place or fix the assembly to be bonded, and the pressing member 202 is provided on the base plate 204, and the pressing member 202 is used to press the assembly to be bonded along the first direction so that the assembly to be bonded maintains a preset size after bonding, and further, the pressing member 202 includes a frame 2021, a moving portion 2022 and a guide portion 2023, and the moving portion 2022 is movably provided on the frame 2021, and the moving part 2022 is used to move relative to the frame 2021 along the first direction to press the component to be bonded, and the guide part 2023 connects the moving part 2022 and the frame 2021, and the guide part 2023 is used to prevent the moving part 2022 from tilting when moving along the first direction, thereby ensuring the movement accuracy of the moving part 2022; the driving member 201 is movably connected to the frame 2021, and the driving member 201 is used to drive the moving part 2022 to move along the first direction.

[0067] The so-called first direction is as follows Figure 1 The Z-axis direction shown is the vertical direction. That is, the driving member 201 drives the moving portion 2022 to move in the vertical direction, and the moving portion 2022 contacts the component to be bonded and presses the component to be bonded so that the component to be bonded maintains a preset size after bonding.

[0068] The driving member 201 can be a screw threaded into a threaded hole on the frame 2021. When the screw is screwed in, the screw will contact the moving part 2022, causing the moving part 2022 to move downward. At the same time, the moving part 2022 and the base plate 204 always maintain a high degree of parallelism.

[0069] It should be noted that the assembly to be bonded includes a first bonded part and a second bonded part, the first bonded part and the second bonded part are distributed along a first direction, the first bonded part is located on the second bonded part, and adhesive is pre-set between the first bonded part and the second bonded part.

[0070] For example, the first bonded part may be an alumina ceramic wear-resistant pad 6, and the second bonded part may be a moving shaft 7 or a piezoelectric ceramic stack 8. In this manner, the driving member 201 drives the moving portion 2022 to move vertically. The moving portion 2022 contacts the first bonded part and presses the first and second bonded parts together, so that the first and second bonded parts maintain a predetermined size after bonding.

[0071] Compared with the traditional structure, the moving part 2022 of the clamping assembly 2 provided in the embodiment of the present application can move relative to the frame 2021 along the first direction, wherein the guide part 2023 connects the moving part 2022 and the frame 2021, and the guide part 2023 is used to ensure that the moving part 2022 always moves along the first direction, and prevents the moving part 2022 from tilting when moving along the first direction, thereby ensuring the movement accuracy of the moving part 2022. During the clamping operation, the moving part 2022 is driven to move along the first direction by the driving member 201, and the moving part 2022 contacts the component to be bonded and presses the component to be bonded to achieve the preset size of the component to be bonded after bonding. By adopting this movement mode, the movement accuracy of the moving part 2022 can be greatly improved, and the moving part 2022 and the base plate 204 can always maintain sub-micron parallelism during the entire clamping process, thereby improving the dimensional accuracy of the component to be bonded after bonding, and thus achieving better high consistency after bonding multiple components to be bonded.

[0072] In addition, compared with the prior art in which the first part to be bonded and the second part to be bonded are fixed separately, and then the first part to be bonded is driven to move toward the second part to be bonded to achieve compression bonding; the present application adopts the method of placing or fixing the assembly to be bonded as a whole on the base plate 204, that is, the pre-bonded first part to be bonded and the second part to be bonded are placed or fixed as a whole on the base plate 204, without fixing the first part to be bonded and the second part to be bonded separately, and then moving one part toward the other to achieve bonding. In this way, there is no need to consider the bonding position of the first part to be bonded and the second part to be bonded during the compression process, thereby avoiding affecting the high consistency of the assembly to be bonded after bonding due to the deviation of the bonding position.

[0073] Of course, depending on actual needs, the guide portion 2023 may be a double parallel flexible hinge. A double parallel flexible hinge is a type of hinge that utilizes the principle of parallelogram deformation and the difference in stiffness of a cantilever beam in different directions for guidance. The moving portion 2022 is connected to the frame 2021 via the double parallel flexible hinge. In this way, the deformation function of the double parallel flexible hinge can achieve the function of the moving portion 2022 moving relative to the frame 2021 in the first direction. The guide portion 2023 may also be a high-precision linear guide fixed to the frame 2021, and the moving portion 2022 can move along the linear guide. In this article, the use of a double parallel flexible hinge is preferred.

[0074] Specifically, the double parallel flexible hinge includes two groups of flexible beam structures, and any group of flexible beam structures includes two flexible beam structures parallel to each other. The moving part 2022 is connected to the inner wall of one side of the frame 2021 through one group of flexible beam structures, and the moving part 2022 is connected to the inner wall of the other side of the frame 2021 through another group of flexible beam structures.

[0075] It should be noted that the two flexible beam structures located above in the two groups of flexible beam structures and the two flexible beam structures located below in the two groups of flexible beam structures are all arranged in the same plane, and the two flexible beam structures above have a gap with the top inner wall of the frame 2021, and the two flexible beam structures below have a gap with the moving part 2022.

[0076] The entire moving portion 2022 is an axisymmetric structure. By rationally designing the dimensions and tolerances of the flexible beam structures, the parallelism between the pressing member 202 and the base plate 204 can be ensured to reach the sub-micron level.

[0077] In some embodiments, a spacer 203 is provided between the frame 2021 and the base plate 204 . The spacer 203 is used to adjust the parallelism between the moving portion 2022 and the base plate 204 .

[0078] Specifically, the spacer 203 is a flat, "I"-shaped, uniformly thick part. Grinding the thickness of the spacer 203 allows for fine adjustment of the parallelism between the clamping member 202 and the base plate 204. The spacer 203 has threaded clearance holes and locating pin holes. The locating pins position the spacer 203 on the base plate 204. The screws on the clamping member 202 pass through the threaded clearance holes in the spacer 203 and screw into the threaded holes in the base plate 204, securing the clamping member 202 and spacer 203 to the base plate 204.

[0079] In some embodiments, the moving part 2022 includes a limiting body 20221 and a pressure plate body 20222. The pressure plate body 20222 is integrally connected to the limiting body 20221. The size of the pressure plate body 20222 along the second direction is larger than the size of the limiting body 20221 along the second direction. This can greatly increase the contact area between the pressure plate body 20222 and the component to be bonded, or increase the number of components to be bonded that can be pressed at one time.

[0080] The second direction is as follows Figure 1 The X-axis direction is shown.

[0081] In some embodiments, the limiting body 20221 may be a body with an I-shaped cross-section, and two limiting grooves are provided on the limiting body 20221. Correspondingly, two limiting protrusions 20211 are provided on the frame body 2021, which are oppositely arranged and extend along the second direction. The two limiting protrusions 20211 respectively cooperate with the two limiting grooves to limit the displacement of the moving part 2022.

[0082] It can be understood that the size of the limiting groove along the first direction is greater than the size of the corresponding limiting protrusion 20211 along the first direction, that is, the size of the limiting groove along the first direction determines the maximum stroke of the moving part 2022.

[0083] In summary, the clamping member 202 in the clamping assembly 2 adopts a double parallel flexible hinge guide structure. This guide method has no motion gap and no wear. After reasonable material selection and size optimization, the guide stiffness that meets the requirements can be obtained. By high-precision measurement under the double parallel flexible hinge guide conditions, the parallelism change of the moving part 2022 during the movement is corrected; at the same time, the degradation of parallelism is reduced by matching the pad 203. Specifically, the pad 203 used to support and ensure the parallelism of the clamping member 202 in the clamping assembly 2 is obtained by processing multiple pieces with heights in the same tolerance band, and during tooling adjustment, different pads 203 are selected for adjustment according to the value of the parallelism degradation during the movement of the clamping member 202 and the tilt direction of the clamping member 202, so as to ensure sub-micron parallelism with the base plate 204 at all times during the movement of the clamping member 202.

[0084] Please also refer to Figure 2-4 The present application also provides a bonding tool, comprising a base plate 5, a detection assembly 1, and a clamping assembly 2 as described in the above embodiment. The detection assembly 1 is connected to the base plate 5 via bolts, and contacts and abuts against the moving portion 2022 to measure the displacement of the moving portion 2022. The clamping assembly 2 is connected to the base plate 5 via locating pins and bolts.

[0085] Please also refer to Figure 5 In some embodiments, the detection assembly 1 includes a fixed base 102 and a digital micrometer 101. The fixed base 102 is connected to the base plate 5 by bolts. The digital micrometer 101 is fixed to the fixed base 102 in a flexible clamping manner. The digital micrometer 101 contacts and abuts against the moving part 2022. The digital micrometer 101 is used to measure the displacement of the moving part 2022. Specifically, the probe of the digital micrometer 101 passes through the gap hole on the frame 2021 of the clamping assembly 2 and is placed on the measuring surface (the top surface of the moving part 2022) to measure the displacement of the moving part 2022. At the same time, the probe of the digital micrometer 101 is acted upon by the elastic force of the elastic member (compression spring). This elastic force can cause the probe to have a downward movement tendency, so that the probe is always held on the measuring surface of the moving part 2022.

[0086] It should be noted that the bonding tool provided in the embodiment of the present application is as follows Figure 6 As shown in the figure, it can be used for bonding the motion axis components in piezoelectric ceramic actuators. Figure 7 As shown, it includes a moving shaft 7 and an alumina ceramic wear-resistant gasket 6.

[0087] Of course, the embodiment of the present application can also be used for bonding the piezoelectric ceramic stack 8 and the alumina ceramic wear-resistant gasket 6. The bonding tool for the piezoelectric ceramic stack 8 and the alumina ceramic gasket is as follows: Figure 8As shown, the bonding tooling includes a detection assembly 1, a clamping assembly 2, and a base plate 5. To facilitate maintaining a specific positional relationship between the piezoelectric ceramic stack 8 and the alumina ceramic gasket when they are compressed, the bonding tooling also includes a positioning assembly 3. This positioning assembly 3 can be fixed within the clamping assembly 2 by bolts and can also be withdrawn as a whole.

[0088] In some embodiments, the positioning assembly 3 can be fixed to the base plate 204 by bolts. The positioning assembly 3 is used to position the assembly to be bonded, which includes the compressed piezoelectric ceramic stack 8 and the alumina ceramic wear-resistant gasket 6.

[0089] Please also refer to Figure 9 The piezoelectric ceramic stack 8 in this application is a single piece, divided into four leg structures, and an alumina ceramic wear-resistant gasket 6 is bonded to the top of each leg. The height dimension H error from the top to the bottom of each leg is required to be as small as possible, that is, to have good height consistency.

[0090] Specifically, please see Figure 10-14 The positioning component 3 includes a positioning frame, a pressure block 304 and a hollow positioning plate 301, wherein the positioning frame is used to position the second part to be bonded of the assembly to be bonded in a plane perpendicular to the first direction, and the second part to be bonded is the piezoelectric ceramic stack 8; the pressure block 304 is provided on the positioning frame, and the pressure block 304 is used to fit into the gaps between the legs on the piezoelectric ceramic stack 8 to position the piezoelectric ceramic stack 8; the hollow positioning plate 301 is connected to the positioning frame, and the hollow positioning plate 301 is used to position the alumina ceramic wear-resistant gasket 6 of the assembly to be bonded in a plane perpendicular to the first direction, and the alumina ceramic wear-resistant gasket 6 is located on the piezoelectric ceramic stack 8.

[0091] In some embodiments, the positioning frame includes a first positioning plate 302 and a second positioning plate 303, the first positioning plate 302 is connected to the hollow positioning plate 301, and the first positioning plate 302 is provided with a group of first arc protrusions 3021; ​​the second positioning plate 303 is connected to the first positioning plate 302, and the second positioning plate 303 is provided with a second arc protrusion 3031; wherein, the second arc protrusion 3031 is arranged toward two first arc protrusions 3021 in a group of first arc protrusions 3021, and the second arc protrusion 3031 and a group of first arc protrusions 3021 abut against the outer periphery of the second part to be bonded to position the second part to be bonded in a plane perpendicular to the first direction.

[0092] In some embodiments, the first positioning plate 302 is provided with a groove 3022, and the pressure block 304 includes a central body 3041 and two side wings 3042, wherein the central body 3041 is installed in the groove 3022, and the two side wings 3042 are respectively provided on both sides of the central body 3041, and the two side wings 3042 are used to fit into the gaps between the legs on the piezoelectric ceramic stack 8, and any side wing 3042 is provided with a third arc protrusion 3043 for abutting the piezoelectric ceramic stack 8.

[0093] More specifically, the hollow positioning plate 301 is fastened to the first positioning plate 302 by screws, and is used for the alumina ceramic wear-resistant gasket 6 to be positioned between the piezoelectric ceramic stack 8 ( Figure 10 The first positioning plate 302 is shaped like an I and is used to position the piezoelectric ceramic stack 8. The second positioning plate 303 can be provided with a hinge having a second arc-shaped protrusion 3031. The second positioning plate 303 is used to press the piezoelectric ceramic stack 8 against the first positioning plate 302 from the side. The first and second positioning plates 302 and 303 are fastened together by screws. The two second positioning plates 303 are screwed together with one first positioning plate 302 to form a positioning frame. The screws on the second positioning plates 303 can secure the positioning frame as a whole to the base plate 204.

[0094] like Figure 11 The figure shows the internal structure of the positioning assembly 3 after the hollow positioning plate 301 is removed. Figure 11 There are four piezoelectric ceramic stacks 8 and sixteen alumina ceramic wear-resistant pads 6 that need to be glued; the positioning component 3 adopts the kinematic constraint principle for positioning, and the first positioning plate 302 is in the shape of an "I", such as Figure 12 As shown, there are three first arc protrusions 3021 between the first positioning plate 302 and each piezoelectric ceramic stack 8 for positioning, wherein two first arc protrusions 3021 are arranged in the transverse direction and one first arc protrusion 3021 is arranged in the longitudinal direction; Figure 13 As shown, the second positioning plate 303 has two symmetrical horn-like hinges with second arc protrusions 3031, which are respectively in contact with the two piezoelectric ceramic stacks 8 to form a compact positioning; the two pressing blocks 304 are respectively installed in the grooves 3022 of the first positioning plate 302, and each side of the pressing block 304 has a side wing 3042, which is a rotating hinge structure. The end of the side wing 3042 has a third arc protrusion 3043 for compacting in the gap between the legs of the piezoelectric ceramic stack 8, as shown in FIG. Figure 14 shown.

[0095] In summary, in addition to the degree of freedom of horizontal translation, the above-mentioned clamping method uses a combination of point contact and surface contact to limit the piezoelectric ceramic stack 8 to five degrees of freedom, rather than six degrees of freedom, without forming over-constraint, thereby reducing the tiny displacement introduced by excessive constraints, and has high positioning accuracy, which can meet the positioning accuracy requirements during the gluing process.

[0096] In this way, in the bonding tool provided in the embodiment of the present application, the detection component 1 is outside the clamping component 2, and the displacement value measured by the digital micrometer 101 is not the actual height of the piezoelectric ceramic after gluing. The actual height of the piezoelectric ceramic stack 8 after gluing is the limited height value of the clamping component 2 (the so-called limited height value is the distance between the moving part 2022 and the base plate 204 when the top screw is not screwed downward) minus the displacement value measured by the detection component 1 (the displacement value measured by the detection component 1 is the distance that the moving part 2022 moves downward).

[0097] Compared with the prior art, the bonding tool provided in the embodiment of the present application does not use a standard block to limit the bonding position, but instead calculates the displacement of the moving part 2022 in the clamping assembly 2 based on the bonding height between the piezoelectric ceramic stack 8 and the alumina ceramic wear-resistant gasket 6, and relies on a digital micrometer 101 to measure the displacement of the moving part 2022.

[0098] At the same time, the bonding tool provided in the embodiment of the present application does not clamp multiple alumina ceramic wear-resistant gaskets 6, but clamps the pre-bonded piezoelectric ceramic stack 8 and multiple alumina ceramic wear-resistant gaskets 6 as a whole, which can minimize the gap left due to uneven clamping. After evenly applying glue on the top of each leg of the piezoelectric ceramic stack 8, each alumina ceramic wear-resistant gasket 6 is positioned and flattened through a hollow grid plate, and then compressed with a clamping assembly 2. This can ensure that the glue layer is more uniform, thereby solving the problem of inconvenience in clamping traditional alumina ceramic wear-resistant gaskets 6 and leaving a tiny gap after clamping the alumina ceramic wear-resistant gasket 6, which affects the high consistency of the piezoelectric ceramic stack 8 and the alumina ceramic wear-resistant gasket 6 after bonding.

[0099] Furthermore, a single gluing operation of the tooling can complete the bonding of the alumina wear-resistant pads 6 of the multiple branch legs of all (not limited to four) piezoelectric ceramic stacks 8 used in a single piezoelectric ceramic actuator. Both the pressure block 304 and the second positioning plate 303 in the positioning assembly 3 utilize flexible hinges that adapt to the varying heights and thicknesses of the piezoelectric ceramic stacks 8, preventing over-constraint or under-constraint of the piezoelectric ceramic stacks 8 by the positioning assembly 3 and improving positioning accuracy.

[0100] Of course, depending on actual needs, the positioning of each piezoelectric ceramic stack 8 in the positioning assembly 3 can be implemented by dividing it into multiple parts, such as dividing a single pressure block 304 or second positioning plate 303 into two pressure blocks or flexible plates. The flexible hinge between the pressure block 304 and the second positioning plate 303 can also be replaced with a delicate compression spring or torsion spring.

[0101] In some embodiments, the bonding tool also includes a support plate 4, which is arranged on the base plate 5. The support plate 4 is used to install the piezoelectric ceramic stack 8 and the alumina ceramic gasket into the positioning component 3, making it convenient to push the positioning component 3 as a whole into the clamping component 2.

[0102] During use, the positioning component 3 is first placed on the pallet 4, the height of the pallet 4 is the same as the height of the base plate 204, that is, the pallet 4 and the base plate 204 can form the same support surface, and then each component to be bonded is placed in the positioning component 3 for clamping, and then the positioning component 3 is pushed from the pallet 4 to the base plate 204 of the clamping component 2.

[0103] In some embodiments, the pressing assembly 2 is provided with a limit plate 2041, which is used to block the movement of the positioning assembly 3 along the third direction, that is, to limit the position of the positioning assembly 3 when it moves on the base plate 204. The so-called third direction is as follows: Figure 8 The Y-axis direction is shown.

[0104] In actual use, the limiting plate 2041 can be fixed to the base plate 204 by screws, and the limiting plate 2041 is higher than the upper surface of the base plate 204. In this way, when the positioning assembly 3 is pushed into the pressing assembly 2, the positioning assembly 3 moves on the base plate 204 and eventually hits the limiting plate 2041.

[0105] It should be noted that the embodiments of the present application can also be used to bond the motion shaft assembly in a piezoelectric ceramic actuator. The motion shaft assembly includes a motion shaft 7 and an alumina ceramic wear-resistant gasket 6. When bonding the motion shaft 7 and the alumina ceramic wear-resistant gasket 6, the positioning assembly 3 is not required. Simply apply adhesive between the motion shaft 7 and the alumina ceramic wear-resistant gasket 6, push the support plate 4 into the clamping assembly 2, screw in the top screw on the clamping assembly 2, and observe the reading on the digital micrometer 101 until it reaches the specified value.

[0106] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0107] The above is a detailed introduction to the bonding tooling and the clamping assembly provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the scheme of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A bonding tool, characterized in that: include: base plate; A pressing assembly is provided on the bottom plate, comprising a base plate and a moving portion, the base plate being used to place the component to be bonded, and the moving portion being used to move along a first direction to press the component to be bonded; A detection component is provided on the bottom plate and contacts and abuts against the moving part, and is used to measure the displacement of the moving part; The bonding tool further includes a positioning component, which is provided on the base plate and is used to position the component to be bonded. The positioning component includes: A positioning frame, used for positioning the second to-be-bonded part of the assembly to be bonded in a plane perpendicular to the first direction; A pressing block is provided on the positioning frame and is used to engage with the gaps between the legs of the second part to be bonded to position the second part to be bonded; a hollow positioning plate connected to the positioning frame, used for positioning the first part to be bonded of the assembly to be bonded in a plane perpendicular to the first direction, wherein the first part to be bonded is located on the second part to be bonded; The positioning framework includes: A first positioning plate connected to the hollow positioning plate, wherein the first positioning plate is provided with a group of first arc protrusions; a second positioning plate connected to the first positioning plate, the second positioning plate being provided with a second arc protrusion; The second arc protrusion is arranged toward two of the first arc protrusions in a group of the first arc protrusions, and the second arc protrusion and the group of the first arc protrusions abut against the outer periphery of the second to-be-bonded part to position the second to-be-bonded part in a plane perpendicular to the first direction; The first positioning plate is provided with a groove, and the pressing block comprises: a central body disposed in the groove; Two side wings are respectively provided on both sides of the central body and are used to be engaged with the gaps between the legs on the second part to be bonded. Any of the side wings is provided with a third arc protrusion for abutting against the second part to be bonded.

2. The bonding tool according to claim 1, characterized in that: The detection component includes: A fixing seat, provided on the bottom plate; A digital display micrometer is arranged on the fixing seat and contacts and abuts against the moving part, and is used for measuring the displacement of the moving part.

3. The bonding tool according to claim 1, wherein: The compression assembly further comprises: A pressing member is provided on the base plate and is used to press the assembly to be bonded along a first direction so that the assembly to be bonded maintains a preset size after bonding, comprising: frame; a guide portion, connecting the moving portion and the frame, and configured to prevent the moving portion from tilting when moving along the first direction; a driving member, movably connected to the frame, and configured to drive the moving portion to move along the first direction; The guide portion includes two groups of flexible beam structures, each group of the flexible beam structures includes two mutually parallel flexible beam structures, the moving portion is connected to the inner wall of one side of the frame through one group of the flexible beam structures, and the moving portion is connected to the inner wall of the other side of the frame through the other group of the flexible beam structures; A pad is provided between the frame and the base plate, and the pad is used to adjust the parallelism between the moving part and the base plate.

4. The bonding tool according to claim 3, characterized in that: The moving part includes a limiting body, which is provided with two limiting grooves. The frame is provided with two limiting protrusions that are oppositely arranged and extend along the second direction. The two limiting protrusions respectively cooperate with the two limiting grooves to limit the displacement of the moving part.

5. The bonding tool according to claim 4, characterized in that: The moving part further includes a pressing plate body integrally connected to the limiting body, and a dimension of the pressing plate body along the second direction is greater than a dimension of the limiting body along the second direction.

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