A method and system for detecting electrostatic test discharge path
Through the composite technology of infrared thermal imaging device and plane structure diagram, the problem of path detection in electrostatic testing of electronic products is solved, and efficient and low-cost electrostatic discharge path detection is achieved.
Patent Information
- Application Number
- CN202210348293.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-04-01
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2042-04-01
AI Technical Summary
In the prior art, electronic products are unable to accurately and efficiently detect the flow and discharge paths of static electricity during electrostatic testing, resulting in slow testing speed, low efficiency and high cost.
An infrared thermal imaging device is used to shoot and record the electrostatic test area, and the infrared thermal imaging image is scanned frame by frame and composited with the plane structure diagram of the device under test to determine the discharge path of static electricity in the device under test.
It achieves high-precision and rapid detection of electrostatic discharge paths, reduces test costs, improves detection efficiency, and reduces the consumption of devices under test.
Smart Images

Figure CN114966257B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of product testing, and in particular to a detection method and system for an electrostatic test discharge path. Background Art
[0002] During the production of electronic products, electrostatic testing is a crucial step. During testing, electronic products often exhibit malfunctions, such as damage from static electricity. Consequently, static electricity has long been a challenge for electronics engineers. The difficulty lies in the inability to observe the paths of static electricity ingress, egress, and discharge. This makes it difficult to analyze and assess the potential risks of electronic products damaged by static electricity in detail. To address this issue, methods are needed to capture and record the static electricity ingress and discharge paths during electrostatic testing, enabling targeted protective measures.
[0003] The current problem is that due to the different structural designs, circuit designs, product materials, and component distributions of different electronic products, the static discharge paths are also different. The existing technology can only infer the approximate discharge path by the location of the damaged electronic components. However, this method has many disadvantages: first, it is slow, requiring a large number of static electricity experiments, which is time-consuming; second, it is inefficient. Static electricity discharge sometimes has more than one path, and when there are multiple discharge paths, the workload will increase exponentially; third, it is expensive. Electrostatic discharge testing is a destructive test, and each test will result in the scrapping of the product, resulting in high testing costs.
[0004] Therefore, how to accurately and efficiently detect the flow and discharge path of static electricity in electrostatic testing has become a technical problem that urgently needs to be solved. Summary of the Invention
[0005] The present invention discloses a detection method and system for an electrostatic test discharge path, aiming to solve the technical problems existing in the prior art.
[0006] In order to solve the above problems, the present invention adopts the following technical solutions:
[0007] In one aspect, the present invention provides a method for detecting an electrostatic discharge path, comprising the following steps:
[0008] Determine the electrostatic test area on the electrostatic test board;
[0009] Perform high voltage discharge on the device under test;
[0010] Use infrared thermal imaging equipment to shoot and record the electrostatic test area;
[0011] Scan the infrared thermal imaging video frame by frame and combine the infrared thermal imaging image during discharge with the planar structure diagram of the device under test;
[0012] Determine the discharge path of static electricity in the device under test.
[0013] As a preferred embodiment, before the step of determining the electrostatic test area in the electrostatic test board, the method further includes:
[0014] The planar structure diagrams of different devices under test are stored in a computer database.
[0015] As a preferred embodiment, the step of determining the electrostatic test area in the electrostatic test board further includes:
[0016] Place the device under test flat on the insulating pad of the electrostatic test board, and insulate and fix the electric heating film on the insulating pad and two opposite corners of the device under test;
[0017] Alternatively, the electric heating films are insulated and fixed at at least four corners of the device under test.
[0018] As a preferred embodiment, the step of determining the electrostatic test area in the electrostatic test board further includes:
[0019] Turn on the electric heating film to heat up the device under test;
[0020] Adjust the camera of the infrared thermal imaging device to be perpendicular to the detection surface of the device under test, turn on the infrared thermal imaging device, locate the electrostatic test area, and determine the type and position of the device under test.
[0021] As a preferred embodiment, the step of photographing and recording the electrostatic test area by an infrared thermal imaging device further includes:
[0022] The shooting frame rate of the infrared thermal imaging device is set to be no less than 240 frames; the shooting resolution of the infrared thermal imaging device is set to be no less than 384×288.
[0023] As a preferred embodiment, the step of photographing and recording the electrostatic test area by an infrared thermal imaging device further includes:
[0024] The shooting frame rate of the infrared thermal imaging device is set to 960 frames; the shooting resolution of the infrared thermal imaging device is set to 640×480.
[0025] As a preferred embodiment, the step of scanning the infrared thermal imaging video frame by frame and combining the infrared thermal imaging image during discharge with the planar structure diagram of the device under test further includes:
[0026] The infrared thermal imaging video is output frame by frame, and the infrared thermal imaging image before discharge is used as a reference frame. The remaining frames with different brightness from the electrostatic test area in the reference frame are identified and determined to be the infrared thermal imaging images during discharge.
[0027] As a preferred embodiment, the step of scanning the infrared thermal imaging video frame by frame and combining the infrared thermal imaging image during discharge with the planar structure diagram of the device under test further includes:
[0028] Gamma correction is used to increase the contrast of infrared thermal imaging images during discharge;
[0029] The infrared thermal imaging image with increased contrast is composited with the planar structure diagram of the device under test.
[0030] As a preferred embodiment, the step of determining the discharge path of static electricity in the device under test further includes:
[0031] According to the composite image, the position and / or corresponding component of the electrostatic discharge path in the planar structure diagram of the device under test are determined.
[0032] On the other hand, the present invention also provides a detection system for electrostatic test discharge path, comprising:
[0033] -Electrostatic test board, used to perform electrostatic testing on electronic devices;
[0034] -Electrothermal film, set at the corners of the device under test in the electrostatic test board, used to locate the electrostatic test area in the electrostatic test board;
[0035] -Infrared thermal imaging device, which is placed vertically above the electrostatic test area and is used to capture and record the thermal changes of the device under test during the electrostatic test;
[0036] - A computing and processing device for analyzing infrared thermal imaging video and determining the discharge path of static electricity in the device under test.
[0037] The technical solution adopted by the present invention can achieve the following beneficial effects:
[0038] The present invention discloses a method for detecting the discharge path of an electrostatic test. Before an electrostatic test is performed on an electronic device, an electric heating film is provided at the corners of an insulating pad of the device to be tested and / or an electrostatic test board, so that a temperature difference is formed between the device to be tested and the electrostatic test board. During the electrostatic test of the electronic device, slow-motion video is recorded using an infrared thermal imaging device, and frame-by-frame scanning is performed after the test is completed. The infrared thermal imaging image during discharge is combined with a planar structure diagram of the device to be tested to determine the discharge path of static electricity in the device to be tested.
[0039] Through this method, by adjusting the relevant parameters of the infrared thermal imaging device during recording and processing the recording, the static discharge path and its corresponding position or corresponding component in the electronic device can be intuitively determined, the detection accuracy is higher, and it can be checked repeatedly and has repeatability. Compared with traditional testing methods, the present invention can test all discharge paths at one time, which is more efficient. At the same time, since there is no need for multiple tests to determine multiple discharge paths at the test point, the consumption of the device to be tested is reduced, and the testing cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments, which constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:
[0041] Figure 1 This is a flow chart of a method for detecting an electrostatic discharge path in a preferred embodiment disclosed in Example 1 of the present invention. DETAILED DESCRIPTION
[0042] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. In the description of the present invention, it should be noted that the term "or" is generally used in the sense of including "and / or" unless the content clearly indicates otherwise.
[0043] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.
[0044] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0045] In order to solve the problems existing in the prior art, an embodiment of the present application provides a method for detecting the discharge path of an electrostatic test, which method includes: determining an electrostatic test area in an electrostatic test board; performing high-voltage discharge on the device to be tested; photographing and recording the electrostatic test area through an infrared thermal imaging device; scanning the infrared thermal imaging video frame by frame, and combining the infrared thermal imaging image during discharge with the planar structure diagram of the device to be tested; and determining the discharge path of static electricity in the device to be tested.
[0046] Example 1
[0047] During the electrostatic testing process of electronic devices, they are often damaged by static electricity, resulting in abnormalities or damage. However, the paths of static electricity entry, flow, and discharge cannot be observed, making it impossible to analyze and assess the potential risks of some electronic products damaged by static electricity in detail. In traditional detection methods, the only way to infer the approximate discharge path is by the location of the damaged electronic components, which is slow and inefficient. In order to address the shortcomings of traditional detection methods, there is also a method in the prior art that displays the discharge path by spraying variable temperature paint on the surface of the device under test. However, the shortcomings of this method are also obvious: since the rise time of the instantaneous static discharge is less than nanoseconds and the duration is only hundreds of milliseconds, even if variable temperature paint is applied, it is still difficult to observe and record the discharge path when there are multiple discharge paths because the static electricity generation and disappearance time is very fast. Moreover, since this method requires spraying paint, it also causes damage to the electronic device, resulting in the risk of the electronic device being unusable even after the electrostatic test is completed.
[0048] To solve the above problems, this embodiment provides a method for detecting an electrostatic discharge path to accurately locate the path of electrostatic discharge in an electronic device. Figure 1 In a preferred embodiment, the method comprises the following steps:
[0049] S10, determining an electrostatic test area in the electrostatic test board;
[0050] Preferably, before conducting an electrostatic test, a planar structural diagram of the device under test is first stored in a computer database. During the electrostatic test, the device under test is placed flat on the insulating pad of the electrostatic test board. Optionally, an electric heating film is insulated and fixed to the insulating pad and two diagonal corners of the upper surface of the device under test, or the electric heating film is insulated and fixed to at least four corners of the device under test, or the electric heating film is insulated and fixed to at least four corners and the edge of the device under test. Preferably, although the electric heating film is insulated and fixed to the device under test, in order to prevent the presence of the electric heating film from affecting the electrostatic test, the electric heating film should not be placed at the position where the device under test is grounded.
[0051] In a preferred embodiment, the device to be tested is a display screen module; preferably, the electric heating film includes an electric heating element and an insulating layer, is rollable, has a small size, and can heat up quickly after being powered on; preferably, an insulating tape is used to fix the electric heating film to the corners of the device to be tested and / or the insulating pad. Those skilled in the art should understand that there are many specifications of electric heating films, and it is not possible to prevent heating from damaging the device to be tested or affecting the experiment. Low-temperature electric heating films are preferred, and the shape of the electric heating film is preferably sheet-shaped or strip-shaped, and the outer contour of the electric heating film is ensured to be at least the same as the outer contour of the fixed part of the device to be tested; and the specific model of the electric heating film can be specifically selected according to different devices to be tested, which will not be described in detail here.
[0052] After fixing the electric heating film and the device under test, turn on the electric heating film to heat the device under test through the electric heating film; adjust the camera of the infrared thermal imaging device to be perpendicular to the detection surface of the device under test, turn on the infrared thermal imaging device, locate the electrostatic test area, and determine the type and position of the device under test.
[0053] Specifically, since the temperature of the device under test and the electrostatic test board is the same at room temperature, if the device under test is directly photographed using an infrared thermal imaging device, the position, boundaries and outline of the device under test cannot be distinguished. Heating with an electric heating film can create a temperature difference between the device under test and the electrostatic test board, thereby helping testers determine the position of the device under test.
[0054] In a preferred embodiment, the infrared thermal imaging device and the infrared thermal imager are connected to a computer so that the images they capture and record can be processed in real time. Furthermore, after the electric heating film heats the device under test, the infrared thermal imaging device is turned on to display the position and approximate outline of the device under test on the computer screen, making it convenient for subsequent experimenters to select the corresponding plane structure diagram.
[0055] S20, performing high voltage discharge on the device under test;
[0056] Preferably, the position of the device to be tested has been determined by the electric heating film in step S10, so in this step, when performing the electrostatic test, the electric heating film can be turned off or continued to be used;
[0057] Optionally, when performing high-voltage discharge on the device to be tested, electrostatic arcs of different electrical quantities may be struck at the same test point on multiple devices to be tested, or electrostatic arcs of the same electrical quantity may be struck at the same test point on multiple devices to be tested, or multiple test points may be selected on the device to be tested, so as to reduce the error of the test result;
[0058] S30, photographing and recording the electrostatic test area using an infrared thermal imaging device;
[0059] Specifically, during electrostatic testing, the instantaneous voltage generated by electrostatic discharge usually exceeds 4000 volts, causing the temperature of the air where the arc passes to be heated to about 6000 degrees Celsius to 7000 degrees Celsius within tens to hundreds of milliseconds. Therefore, when the electrostatic arc passes, an obvious high-temperature zone will be generated along its discharge path. At the same time, since the electrostatic discharge time is extremely short, the heat is not significantly transferred to other parts outside the path, resulting in a significant temperature difference between the discharge path and other parts outside the path.
[0060] Based on the above reasons, when using an infrared thermal imaging device in electrostatic testing, the shooting frame rate of the infrared thermal imaging device is adjusted to be no less than 240 frames, and the shooting resolution of the infrared thermal imaging device is set to be no less than 384×288 to ensure higher detection accuracy of high temperature areas; in a preferred embodiment, the shooting frame rate of the infrared thermal imaging device is set to 960 frames; the shooting resolution of the infrared thermal imaging device is set to 640×480.
[0061] S40, scanning the infrared thermal imaging video frame by frame, and combining the infrared thermal imaging image during discharge with the planar structure diagram of the device under test;
[0062] In a preferred embodiment, after the electrostatic test is completed, the computer outputs the infrared thermal imaging video image frame by frame, and the infrared thermal imaging image before discharge is used as a reference frame. Since a bright / high red area will appear in the picture during electrostatic discharge, an image subtraction algorithm is used, or a dynamic threshold segmentation dythreshold operator is used in addition to conventional blob analysis to identify the remaining frames with different brightness from the electrostatic test area in the reference frame and determine them as the infrared thermal imaging image during discharge.
[0063] Furthermore, the infrared thermal imaging image during discharge is subjected to gamma correction to increase the contrast so as to more clearly display the discharge path. The infrared thermal imaging image with increased contrast is then overlapped and composited with the planar structure diagram of the device under test to facilitate determination of the position corresponding to the electrostatic path.
[0064] Preferably, when performing image composite, the position and boundary of the device under test are determined by the position of the electric heating film, and the plane structure diagram of the device under test is adjusted to an appropriate size so that the infrared thermal imaging image and the plane structure diagram of the device under test can be composited.
[0065] S50. Determine the discharge path of static electricity in the device under test.
[0066] Based on the composite image, the corresponding position and / or corresponding component of the ESD discharge path in the planar structure diagram of the device under test is determined. After the ESD test is completed, the infrared thermal imaging video can be repeatedly reviewed to help the experimenter quickly troubleshoot the device under test and identify areas of ESD damage.
[0067] Through the above-mentioned detection method, the discharge path of static electricity and its corresponding position or corresponding component in the electronic device can be intuitively determined. The detection accuracy is higher, and it can be checked repeatedly and is repeatable. Compared with traditional testing methods, the present invention can test all discharge paths at one time, which is more efficient. At the same time, since there is no need for multiple tests to determine multiple discharge paths at the test point, the consumption of the device to be tested is reduced, and the testing cost is reduced.
[0068] Example 2
[0069] In this embodiment, a detection system for electrostatic test discharge path is provided. In a preferred embodiment, the system includes an electrostatic test board, an electric heating film, an infrared thermal imager and a computer.
[0070] Preferably, an insulating pad is provided on the electrostatic test board, and the electronic device is placed on the insulating pad for electrostatic testing; preferably, an electric heating film is provided at the corners of the device to be tested and / or the corners of the insulating pad to position the electrostatic test in the electrostatic test board; preferably, an infrared thermal imager is vertically provided above the electrostatic test area to capture and record the heat changes of the device to be tested during the electrostatic test; preferably, a computer is used to store a planar structure diagram of the device to be tested, and to combine the planar structure diagram with the infrared thermal imaging diagram to determine the discharge path of static electricity in the electrostatic test.
[0071] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.
Claims
1. A method for detecting an electrostatic discharge path, characterized in that: include: Determine the electrostatic test area on the electrostatic test board, and use insulating tape to fix the electric heating film to the corners of the device under test and / or the insulating pad. The outer contour of the electric heating film is at least the same as the outer contour of the area where the device under test is fixed. The electric heating film is used to heat the device under test, so that a temperature difference is formed between the device under test and the electrostatic test board, thereby helping the tester to determine the position of the device under test. performing high voltage discharge on the device under test; photographing and recording the electrostatic test area using an infrared thermal imaging device; Scanning the infrared thermal imaging video frame by frame, using the infrared thermal imaging image before discharge as a reference frame, identifying the remaining frames with different brightness from the electrostatic test area in the reference frame through an image subtraction algorithm or using a dynamic threshold segmentation dythreshold operator and conventional blob analysis, and determining them as infrared thermal imaging images during discharge, and composite the infrared thermal imaging image during discharge with the planar structure diagram of the device under test. During the image composite, the position and boundary of the device under test are determined by the position of the electric heating film, and the planar structure diagram of the device under test is adjusted to an appropriate size. Determine the discharge path of static electricity in the device under test.
2. The detection method according to claim 1, characterized in that Before the step of determining the electrostatic test area in the electrostatic test board, the method further includes: The planar structural diagrams of the different devices under test are stored in a database of a computer.
3. The detection method according to claim 2, characterized in that The step of determining the electrostatic test area in the electrostatic test board further includes: Placing the device under test flat on the insulating pad of the electrostatic test board, and insulating and fixing electric heating films on the insulating pad and two diagonal corners of the device under test; Alternatively, electric heating films are insulated and fixed at at least four corners of the device under test.
4. The detection method according to claim 3, characterized in that The step of determining the electrostatic test area in the electrostatic test board further includes: Turning on the electric heating film to increase the temperature of the device under test through the electric heating film; The camera of the infrared thermal imaging device is adjusted to be perpendicular to the detection surface of the device under test, the infrared thermal imaging device is turned on, the electrostatic test area is located, and the type and position of the device under test are determined.
5. The detection method according to claim 1, wherein The step of photographing and recording the electrostatic test area using an infrared thermal imaging device further includes: The shooting frame rate of the infrared thermal imaging device is set to be no less than 240 frames; the shooting resolution of the infrared thermal imaging device is set to be no less than 384×288.
6. The detection method according to claim 5, characterized in that The step of photographing and recording the electrostatic test area using an infrared thermal imaging device further includes: The shooting frame rate of the infrared thermal imaging device is set to 960 frames; the shooting resolution of the infrared thermal imaging device is set to 640×480.
7. The detection method according to claim 1, characterized in that The step of scanning the infrared thermal imaging video frame by frame and combining the infrared thermal imaging image during discharge with the planar structure diagram of the device under test further includes: Gamma correction is used to increase the contrast of infrared thermal imaging images during discharge; The infrared thermal imaging image with increased contrast is combined with the planar structure diagram of the device under test.
8. The detection method according to claim 1, wherein The step of determining the discharge path of static electricity in the device under test further includes: According to the composite image, the position and / or corresponding element of the electrostatic discharge path in the planar structure diagram of the device under test are determined.
9. A detection system for electrostatic test discharge path, characterized in that: include: -Electrostatic test board, used to perform electrostatic testing on electronic devices; - an electrothermal film, disposed at the corners of the device under test in the electrostatic test board, wherein the outer contour of the electrothermal film is at least the same as the outer contour of the location where the device under test is fixed, and is used to locate the electrostatic test area in the electrostatic test board and to create a temperature difference between the device under test and the electrostatic test board to determine the position of the device under test; - an infrared thermal imaging device, vertically arranged above the electrostatic test area, for photographing and recording the thermal changes of the device under test during the electrostatic test; - A computing and processing device for analyzing infrared thermal imaging video and determining the discharge path of static electricity in the device under test.
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