Electronic packaging

Abstract

The present invention relates to an electronic package, including at least one electronic component and at least one antenna structure arranged on a supporting structure, wherein the antenna structure includes a base configured with an antenna body and a plurality of supporting parts arranged on the base, so that the base is mounted on the supporting structure via the supporting parts, and a plurality of open areas are formed between the base and the supporting structure to serve as air gaps, so as to effectively improve the performance gain and efficiency of the antenna body.

Description

Technical Field

[0001] The present invention relates to a semiconductor package, in particular to an electronic package with an antenna structure. Background Art

[0002] Nowadays, wireless communication technology has been widely used in various consumer electronic products (such as mobile phones, tablet computers, etc.) to receive or send various wireless signals. At the same time, in order to meet the portability and Internet access convenience of consumer electronic products, the manufacturing and design of wireless communication modules are developed towards the requirements of lightness, thinness, shortness and smallness. Among them, the patch antenna is widely used in the wireless communication modules of electronic products due to its small size, light weight and easy manufacturing.

[0003] Figure 1 FIG. 1 is a three-dimensional schematic diagram of an existing wireless communication module. Figure 1 As shown, the wireless communication module 1 includes: a substrate 10, a plurality of electronic components 11 disposed on the substrate 10, an antenna structure 12, and a packaging material 13. The substrate 10 is a circuit board and is rectangular. The electronic component 11 is disposed on the substrate 10 and is electrically connected to the substrate 10. The antenna structure 12 is planar and has an antenna body 120 and a wire 121. The antenna body 120 is electrically connected to the electronic component 11 via the wire 121. The packaging material 13 covers the electronic component 11 and part of the wire 121.

[0004] In addition, due to the signal quality and transmission speed requirements of the 5G communication system, more antenna configurations are required to improve the signal quality and transmission speed. However, in the existing wireless communication module 1, since the antenna structure 12 is planar, the function of the antenna structure 12 is limited, resulting in the wireless communication module 1 being unable to provide the electrical functions required for running the 5G communication system, and it is difficult to meet the antenna operation requirements of the 5G communication system.

[0005] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the invention

[0006] In view of the above-mentioned defects of the prior art, the present invention provides an electronic package which can effectively improve the performance gain and efficiency of the antenna body.

[0007] The electronic package of the present invention includes: a supporting structure having a circuit layer; an electronic component, which is arranged on the supporting structure and electrically connected to the circuit layer; and an antenna structure, which is arranged on the supporting structure, and the antenna structure includes a base configured with an antenna body and at least one first supporting portion arranged on the base, so that the base is mounted on the supporting structure via the first supporting portion, so that at least one open area is formed between the base and the supporting structure, wherein the antenna body has at least one antenna layer configured on the base and at least one antenna extension portion embedded in the first supporting portion, so that the antenna layer is electrically conductive to the first supporting portion via the antenna extension portion and electrically connected to the circuit layer.

[0008] In the aforementioned electronic package, the antenna body has a plurality of antenna layers separated from each other and correspondingly arranged on both sides of the base, for example, the plurality of antenna layers transmit signals in a coupled manner.

[0009] In the aforementioned electronic package, the first support portion is combined with the supporting structure via a conductor. For example, an external pad electrically connected to the antenna extension portion is disposed between the first support portion and the conductor. Alternatively, the conductor contains solder material. Alternatively, the conductor is a composite structure.

[0010] In the aforementioned electronic package, a second supporting portion is further provided on the base, so that the base is mounted on the supporting structure via the first supporting portion and the second supporting portion, and the first antenna layer is not electrically connected to the second supporting portion. Furthermore, the first supporting portion and the second supporting portion are combined with the supporting structure via a conductor. For example, an external pad is arranged between the first supporting portion and the conductor and / or between the second supporting portion and the conductor. Alternatively, the conductor contains solder material. Alternatively, the conductor is a composite structure. Even more, the first supporting portion and the second supporting portion are separated by a plurality of the open areas to serve as air gaps.

[0011] In the aforementioned electronic package, the height of the open area is at least 400 microns.

[0012] In the aforementioned electronic package, the height of the open area is not equal to the thickness of the base.

[0013] The aforementioned electronic package also includes a coating layer that coats the electronic component.

[0014] The aforementioned electronic package also includes a shielding structure covering the electronic component.

[0015] The aforementioned electronic package also includes at least one base body disposed on the supporting structure, so that the first support portion of the antenna structure is mounted on the base body. For example, the base body has an expansion space connected to the open area. Alternatively, the base body has another antenna extension portion electrically connected to the antenna extension portion.

[0016] From the above, it can be seen that in the electronic package and the supporting substrate thereof of the present invention, a void area is mainly formed between the supporting structure and the base to effectively improve the performance gain and efficiency of the antenna body, and the electric field strength of the antenna body is enhanced to facilitate signal transmission. Therefore, compared with the prior art, the electronic package of the present invention can meet the antenna operation requirements of the 5G communication system.

[0017] In addition, the antenna structure is joined to the supporting structure via a conductor, which is not only easy to assemble, but also helps to adjust the height of the air gap to improve the design flexibility of the antenna structure. Therefore, the electronic package of the present invention can improve the process yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cross-sectional schematic diagram of an existing wireless communication module.

[0019] Figure 2 FIG. 4 is a cross-sectional schematic diagram of a first embodiment of an electronic package of the present invention.

[0020] Figure 2A for Figure 2 A partial enlarged view of .

[0021] Figure 3A FIG. 4 is a cross-sectional schematic diagram of a second embodiment of an electronic package of the present invention.

[0022] Figure 3A-1 for Figure 3A A partial enlarged view of .

[0023] Figure 3B FIG. 4 is a cross-sectional schematic diagram of a third embodiment of an electronic package of the present invention.

[0024] Figure 3B-1 for Figure 3B A partial enlarged view of .

[0025] Figure 4 FIG. 4 is a cross-sectional schematic diagram of a fourth embodiment of an electronic package of the present invention.

[0026] Figure 5A It is a partial cross-sectional schematic diagram of a fifth embodiment of the electronic package of the present invention.

[0027] Figure 5B for Figure 5A Another embodiment of .

[0028] Description of Reference Numerals

[0029] 1: Wireless communication module

[0030] 10:Substrate

[0031] 11: Electronic components

[0032] 12: Antenna structure

[0033] 120: Antenna body

[0034] 121: Wire

[0035] 13: Packaging material

[0036] 2,3a,3b,4,5a,5b:Electronic packaging

[0037] 2a, 4a: Antenna structure

[0038] 2c: Connector

[0039] 20: Bearing structure

[0040] 20a: First surface

[0041] 20b: Second surface

[0042] 200: Insulation layer

[0043] 201,201a,201b: circuit layer

[0044] 202: Pad

[0045] 203:Contact

[0046] 204: Electrical contact pad

[0047] 21: Electronic components

[0048] 21a: Action surface

[0049] 21b: Non-active surface

[0050] 210: Conductive bump

[0051] 22,52: Coating

[0052] 23: Shielding structure

[0053] 24,44: Antenna body

[0054] 240,340,440: Antenna extension

[0055] 241: First antenna layer

[0056] 242: Second Antenna Layer

[0057] 25: Base

[0058] 25a: First side

[0059] 25b: Second side

[0060] 250,350: External pad

[0061] 251: first support part

[0062] 252: Second support part

[0063] 253: Insulation protection layer

[0064] 26,36: Conductor

[0065] 360:Metal layer

[0066] 361,362:Solder layer

[0067] 37: base body

[0068] 58: Encapsulation layer

[0069] 59: Conductive element

[0070] A: Air gap

[0071] A1, A2: Open area

[0072] B: Expanded space

[0073] D:Thickness

[0074] H,H1,H2: Height

[0075] P1: Packaging area

[0076] P2: peripheral area. DETAILED DESCRIPTION

[0077] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0078] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0079] Figure 2 FIG. 2 is a cross-sectional schematic diagram of a first embodiment of an electronic package 2 of the present invention. Figure 2 As shown, the electronic package 2 includes: a supporting structure 20, at least one electronic component 21 disposed on the supporting structure 20, a covering layer 22 for covering the electronic component 21, and a plurality of (eg, four) antenna structures 2a disposed on the supporting structure 20.

[0080] The supporting structure 20 has a first surface 20 a and a second surface 20 b opposite to each other, and a packaging area P1 and a peripheral area P2 adjacent to the packaging area P1 are defined on the first surface 20 a .

[0081] In the present embodiment, the carrier structure 20 is a circuit structure with a core layer or a coreless circuit structure, such as a package substrate, which may include at least one insulating layer 200 and circuit layers 201, 201a, 201b disposed on the insulating layer 200. For example, the carrier structure 20 may form fan-out copper circuit layers 201, 201a, 201b by using a redistribution layer (RDL) method, and the material forming the insulating layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc.

[0082] In addition, one of the circuit layers 201b of the supporting structure 20 is used as a ground plane, which has at least one pad 202, such as Figure 2A For example, the pad portion 202 is disposed on the circuit layer 201 b on the second surface 20 b of the supporting structure 20 .

[0083] It should be understood that the supporting structure 20 may also be other components capable of supporting electronic components 21 such as chips, such as a silicon interposer, and is not limited to the above.

[0084] The electronic component 21 is an active component, a passive component or a combination of the two, which is arranged on the packaging area P1 of the first surface 20a of the supporting structure 20 and electrically connected to the circuit layer 201a of the first surface 20a of the supporting structure 20, wherein the active component is, for example, a radio frequency semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor.

[0085] In the present embodiment, the electronic component 21 is an active component, such as a semiconductor chip with a function of transmitting 5G millimeter waves (mmWave), which has an active surface 21a and an inactive surface 21b opposite to each other, so that the active surface 21a is disposed on the supporting structure 20 by a flip chip method through a plurality of conductive bumps 210 such as solder materials and electrically connected to the circuit layer 201a, and the conductive bumps 210 can be coated with a primer as required; or, the electronic component 21 can also be electrically connected to the circuit layer 201a by a wire bonding method through a plurality of welding wires (not shown); or, the electronic component 21 can directly contact the circuit layer 201a to be electrically connected to the circuit layer 201a. However, the method for the electronic component 21 to electrically connect to the circuit layer 201a is not limited to the above.

[0086] The encapsulation layer 22 is formed on the entire packaging area P1 of the first surface 20 a of the supporting structure 20 and encapsulates the electronic component 21 , and also encapsulates the conductive bumps 210 as required.

[0087] In this embodiment, the material forming the coating layer 22 is an insulating material such as polyimide (PI), dry film, epoxy, or molding compound, but is not limited thereto.

[0088] In addition, the coating layer 22 can cover the non-active surface 21b of the electronic component 21 as required (eg Figure 2 As shown) or the non-active surface 21b is exposed (figure omitted).

[0089] In addition, a shielding structure 23 for covering the electronic element 21 can be formed on the outer surface of the coating layer 22 as required, and the shielding structure 23 can be selectively electrically connected to the circuit layers 201, 201a, 201b. For example, the shielding structure 23 is a metal material or other materials, such as copper (Cu), nickel (Ni), iron (Fe), aluminum (Al) or stainless steel (Sus), and can be formed by electroplating, chemical plating, physical vapor deposition, sputtering or other appropriate methods (such as erecting a metal frame).

[0090] In addition, the coating layer 22 is not formed on the peripheral area P2 of the first surface 20a of the supporting structure 20, so the circuit layer 201a of the peripheral area P2 is exposed on the coating layer 22 to serve as a contact 203 for connecting a connector 2c, so that the electronic package 2 is connected to other electronic modules (not shown) via the connector 2c. For example, the electronic module is an antenna element, such as a Sub-6GHz wavelength antenna, so that the electronic package 2 and other antenna modules can be integrated into the same electronic device (such as a smart phone).

[0091] The antenna structure 2a is disposed on the second surface 20b of the supporting structure 20, and includes a base 25 configured with an antenna body 24, a first supporting portion 251 disposed on the base 25, and a plurality of second supporting portions 252 disposed on the base 25, so that the base 25 is mounted on the second surface 20b of the supporting structure 20 via the first supporting portion 251 and the second supporting portion 252, so that at least one air gap A is formed between the base 25 and the supporting structure 20, and the first supporting portion 251 is electrically connected to the antenna body 24 and the supporting structure 20.

[0092] In this embodiment, the base 25 is a plate, which is defined with a first side 25a and a second side 25b opposite to each other. Figure 2A As shown, the first support portion 251 and the second support portion 252 are disposed on the first side 25a, and the antenna body 24 has a first antenna layer 241 and a second antenna layer 242 separated from each other and correspondingly disposed on the first side 25a and the second side 25b. For example, the base 25 adopts a package substrate type, such as a package substrate with a core layer and a circuit structure or a coreless circuit structure, so as to manufacture the first antenna layer 241 and the second antenna layer 242 with a thin thickness on the dielectric material by sputtering, vaporizing, electroplating, electroless plating, chemical plating or foiling. Specifically, the first antenna layer 241 can adopt a patch structure, and the second antenna layer 242 can adopt a parasitic patch structure, and an insulating protection layer 253 covering the second antenna layer 242 can be formed on the second side 25b of the base 25 as required.

[0093] In addition, the first antenna layer 241 and the second antenna layer 242 transmit signals in a coupled manner. For example, the first antenna layer 241 and the second antenna layer 242 can generate radiation energy by alternating voltage, alternating current or radiation change, and the radiation energy is an electromagnetic field, so that the first antenna layer 241 and the second antenna layer 242 can be electromagnetically coupled to each other, so that the antenna signal can be transmitted between the first antenna layer 241 and the second antenna layer 242. Specifically, the antenna body 24 has an antenna extension portion 240 embedded in the first support portion 251 to serve as a feed line, which runs through the first support portion 251 to electrically connect the first antenna layer 241, and an external pad 250 combined with the antenna extension portion 240 can be formed on the first support portion 251 as required, so that the external pad 250 is combined with the pad portion 202 of the circuit layer 201b of the supporting structure 20 via the conductor 26, so that the first antenna layer 241 is electrically connected to the circuit layer 201b via the antenna extension portion 240, so that the antenna body 24 can be grounded via the circuit layer 201b.

[0094] In addition, at least one external pad 250 may be formed on the second support portion 252 to connect the circuit layer 201b via the conductor 26, so that the antenna structure 2a and the electronic component 21 can be grounded to the support structure 20, but the first antenna layer 241 is not electrically connected to the second support portion 252. For example, the conductors 26 are of a single structure, such as solder material. Specifically, the first support portion 251 and the second support portion 252 can be made of the same substrate, such as a package substrate type, to make the antenna extension 240 and the external pad 250 on the dielectric material by sputtering, vaporizing, electroplating, electroless plating, chemical plating or other methods, and then etch out a cavity as an air gap A. Therefore, the base 25, the first support portion 251 and the second support portion 252 can use the same plate material to make the antenna structure 2a.

[0095] In addition, the first support portion 251 and the second support portion 252 are column-shaped or wall-shaped, and the first support portion 251 is located between the two second support portions 252 (or the plurality of second support portions 252 surround the first support portion 251), so as to separate a plurality of open areas A1, A2 in the air gap A. For example, the height H of the open areas A1, A2 (or the air gap A) is at least 400 micrometers (um), and the height H of the open areas A1, A2 (or the air gap A) is not equal to the thickness D of the base 25.

[0096] Therefore, the electronic package 2 of the present invention is an AiP (Antenna-in-Package) package, which mainly uses a packaging substrate with a groove as the main body of the antenna structure 2a (base 25, first support part 251 and second support part 252) to form an air gap A between the second surface 20b of the supporting structure 20 (or the circuit layer 201b serving as the ground plane) and the first side 25a of the base 25 (or the first antenna layer 241). Therefore, compared with the prior art, the electronic package 2 of the present invention is arranged with the air gap A between the first antenna layer 241 (fed patch) and the circuit layer 201b (ground layer) to effectively improve the performance gain and efficiency of the antenna body 24, and enhance the electric field strength of the antenna body 24 to facilitate signal transmission.

[0097] In addition, since the antenna structure 2a is joined to the supporting structure 20 via the conductor 26 containing solder material, it is not only easy to assemble, but also conducive to adjusting the height H of the air gap A, so that the height H of the air gap A has flexibility in design.

[0098] In addition, if the height H of the air gap A is greater than the thickness D of the base 25 (eg Figure 2 As shown), the electronic package 2 can obtain a larger gain.

[0099] In addition, if the height H of the air gap A is smaller than the thickness D of the base 25 (not shown), the antenna structure 2a can be used for a special bandwidth, and the overall thickness of the antenna structure 2a can be reduced (such as the size of the first antenna layer 241 can be reduced, so the overall size of the antenna body 24 can be reduced).

[0100] Figure 3A 1 is a cross-sectional view of a second embodiment of an electronic package 3a of the present invention. The difference between this embodiment and the first embodiment lies in the structure of the conductor 36, and the other components are substantially the same, so the same parts will not be described in detail below.

[0101] like Figure 3A and Figure 3A-1 As shown, the conductor 36 is a composite structure, which may include two solder layers 361 , 362 and a metal layer 360 disposed between the two solder layers 361 , 362 , so as to respectively combine the circuit layer 201 b and the external pad 250 through the two solder layers 361 , 362 .

[0102] In this embodiment, the metal layer 360 can be a metal material such as copper (Cu), nickel (Ni), iron (Fe), aluminum (Al) or stainless steel (Sus), and can be formed by electroplating, chemical plating, physical vapor deposition, sputtering or other appropriate methods.

[0103] The electronic package 3a of the present invention effectively improves the performance gain and efficiency of the antenna body 24 by disposing the air gap A between the first antenna layer 241 and the circuit layer 201b, and enhances the electric field strength of the antenna body 24 to facilitate signal transmission.

[0104] In addition, since the antenna structure 2a is joined to the supporting structure 20 via a conductor 36 containing solder material, it is not only easy to assemble, but also can increase the distance between the first side 25a of the base 25 and the second surface 20b of the supporting structure 20, thereby increasing the height H1 of the air gap A (which is greater than the height H of the first embodiment), so that the electronic package 3a can obtain a greater gain.

[0105] Figure 3B 1 is a cross-sectional view of a third embodiment of an electronic package 3b of the present invention. The difference between this embodiment and the first embodiment is that a seat is added, and the other components are substantially the same, so the same parts will not be described in detail below.

[0106] like Figure 3B As shown, at least one base 37 is disposed on the second surface 20 b of the supporting structure 20 , so that the conductive body 26 is combined with the base 37 , and the antenna structure 2 a is mounted on the base 37 .

[0107] In this embodiment, the structure of the base 37 corresponds to the first supporting portion 251 and the second supporting portion 252. Figure 3B-1 For example, the base body 37 adopts a packaging substrate type, and another antenna extension 340 and a plurality of other external pads 350 are made on a dielectric material by sputtering, vaporizing, electroplating, electroless plating, chemical plating or other methods, and then a cavity is etched to serve as an expansion space B. Specifically, the antenna extension 340 of the base body 37 contacts and combines with the pad 202 to ground the antenna structure 2a.

[0108] In addition, the base body 37 is combined with the first support portion 251 and the second support portion 252 via the conductor 26 so that the antenna extension portion 240 of the single antenna structure 2a is electrically connected to the antenna extension portion 340 of the base body 37 via the two external pads 250, 350, so that the antenna body 24 of each antenna structure 2a is grounded via the circuit layer 201b.

[0109] In addition, the position of the expansion space B corresponds to the position of the open areas A1 and A2, so that the expansion space B is connected to the open areas A1 and A2 to increase the range of the air space A.

[0110] Therefore, the electronic package 3b of the present invention effectively improves the performance gain and efficiency of the antenna body 24 by disposing the air gap A between the first antenna layer 241 and the circuit layer 201b, and enhances the electric field strength of the antenna body 24 to facilitate signal transmission.

[0111] In addition, since the antenna structure 2a is joined to the supporting structure 20 via the base 37 and the conductor 26, it is not only easy to assemble, but also can increase the distance between the first side 25a of the base 25 and the second surface 20b of the supporting structure 20, so as to increase the height H2 of the air gap A (which is greater than the height H1 of the second embodiment), so that the electronic package 3b can obtain a great gain.

[0112] Figure 4 1 is a cross-sectional view of a fourth embodiment of the electronic package 4 of the present invention. The difference between this embodiment and the first embodiment lies in the number of antenna structures, and the other components are substantially the same, so the same parts will not be described in detail below.

[0113] like Figure 4 As shown, a single antenna structure 4 a is mounted on the second surface 20 b of the supporting structure 20 , wherein the antenna body 44 has a plurality of antenna extensions 440 , and a plurality of air gaps A are formed between the plurality of antenna extensions 440 .

[0114] Therefore, the electronic package 4 of the present invention further improves the performance gain and efficiency of the antenna body 44 through the design of multiple air gaps A, and makes the electric field strength of the antenna body 44 stronger, which is beneficial to signal transmission.

[0115] In addition, since the antenna structure 4a is joined to the supporting structure 20 via the conductor 26 containing solder material, it is not only easy to assemble, but also can increase the height H of the air gap A, so that the electronic package 4 can obtain a greater gain.

[0116] Figure 5A 1 is a cross-sectional view of a fifth embodiment of an electronic package 5a of the present invention. The difference between this embodiment and the first embodiment lies in the packaging method, and the other components are substantially the same, so the same parts will not be described in detail below.

[0117] like Figure 5A As shown, the conductive bump 210 is encapsulated by a packaging layer 58 such as a primer on the first surface 20 a of the supporting structure 20 , and no encapsulation layer 22 for encapsulating the electronic component 21 is formed on the packaging region P1 .

[0118] In this embodiment, the circuit layer 201a may be exposed on the first surface 20a of the supporting structure 20 to serve as an electrical contact pad 204 for combining with conductive elements 59 such as solder balls, so that the electronic package 5 can be combined with an electronic device such as a circuit board (not shown) via the conductive elements 59. It should be understood that in other embodiments, the encapsulation layer 52 may also be partially formed on the encapsulation area P1 to encapsulate the electronic element 21, such as Figure 5B The electronic package 5b is shown.

[0119] Therefore, the electronic package 5a, 5b of the present invention effectively improves the performance gain and efficiency of the antenna body by disposing the air gap A between the first antenna layer (fedpatch) and the circuit layer (ground layer), and enhances the electric field strength of the antenna body to facilitate signal transmission.

[0120] In addition, since the antenna structure 2a is joined to the supporting structure 20 via a conductor containing solder material, it is not only easy to assemble, but also can increase the height H of the air gap A, so that the electronic package 5a, 5b can obtain a greater gain.

[0121] In summary, the electronic package 2, 3a, 3b, 4, 5a, 5b provided by the present invention includes: a supporting structure 20 having multiple circuit layers 201, 201a, 201b, at least one electronic component 21 arranged on the supporting structure 20 and electrically connected to the circuit layer 201a, and at least one antenna structure 2a, 4a arranged on the supporting structure 20.

[0122] The antenna structure 2a, 4a is disposed on the supporting structure 20, and the antenna structure 2a, 4a includes a base 25 configured with an antenna body 24 and at least one first supporting portion 251 disposed on the base 25, so that the base 25 is mounted on the supporting structure 20 via the first supporting portion 251, and at least one open area A1, A2 is formed between the base 25 and the supporting structure 20, wherein the antenna body 24 has a first antenna layer 241 and a second antenna layer 242 configured on the base 25 and at least one antenna extension portion 240 embedded in the first supporting portion 251, so that the first antenna layer 241 and the second antenna layer 242 are electrically connected to the circuit layer 201b via the antenna extension portion 240.

[0123] In one embodiment, the antenna body 24 has a first antenna layer 241 and second antenna layers 241, 242 that are separated from each other and correspondingly disposed on opposite sides of the base 25. For example, the first antenna layer 241 and the second antenna layers 241, 242 transmit signals in a coupled manner.

[0124] In one embodiment, the first support portion 251 is combined with the supporting structure 20 via the conductors 26, 36. For example, an external pad 250 electrically connected to the antenna extension 240 is disposed between the first support portion 251 and the conductors 26, 36, and the conductors 26, 36 contain solder material, and even the conductor 36 is a composite structure.

[0125] In one embodiment, the base 25 is further provided with a second support portion 252, so that the base 25 is mounted on the supporting structure 20 via the first support portion 251 and the second support portion 252, and the first antenna layer 241 is not electrically connected to the second support portion 252. For example, the first support portion 251 and the second support portion 252 are combined with the supporting structure 20 via the conductors 26 and 36. Further, an external pad 250 is disposed between the first support portion 251 and the conductors 26 and 36 and / or between the second support portion 252 and the conductors 26 and 36, and the conductors 26 and 36 contain solder material, and even the conductor 36 is a composite structure.

[0126] On the other hand, the first supporting portion 251 and the second supporting portion 252 separate a plurality of open areas A1 and A2 to serve as air spaces A.

[0127] In one embodiment, the height H of the open areas A1, A2 is at least 400 microns.

[0128] In one embodiment, the height H of the open areas A1 , A2 is not equal to the thickness D of the base 25 .

[0129] In one embodiment, the electronic package 2 , 3 a , 3 b , 4 , 5 b further includes a coating layer 22 coating the electronic component 21 .

[0130] In one embodiment, the electronic package 2 , 3 a , 3 b , 4 , 5 b further includes a shielding structure 23 covering the electronic component 21 .

[0131] In one embodiment, the electronic package 3b further includes at least one base 37 disposed on the supporting structure 20, so that the first support portion 251 of the antenna structure 2a is mounted on the base 37. For example, the base 37 has an expansion space B connected to the open areas A1 and A2. Alternatively, the base 37 has another antenna extension portion 340 electrically connected to the antenna extension portion 240.

[0132] In summary, the electronic package of the present invention forms an air gap between the first antenna layer (fed patch) and the circuit layer (ground layer) to effectively improve the performance gain and efficiency of the antenna body, and enhance the electric field strength of the antenna body to facilitate signal transmission. Therefore, the electronic package of the present invention can meet the antenna operation requirements of the 5G communication system.

[0133] In addition, the antenna structure is joined to the supporting structure via a conductor, which is not only easy to assemble, but also helps to adjust the height of the air gap to improve the design flexibility of the antenna structure. Therefore, the electronic package of the present invention can improve the process yield.

[0134] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, characterized in that: include: A bearing structure having a circuit layer; An electronic component, which is disposed on the supporting structure and electrically connected to the circuit layer; as well as An antenna structure is arranged on the supporting structure, and the antenna structure includes a base configured with an antenna body and at least one first supporting portion arranged on the base, so that the base is mounted on the supporting structure via the first supporting portion, so that at least one empty area is formed between the base and the supporting structure, wherein the electronic component is not arranged between the supporting structure and the antenna structure, and the antenna body has at least one antenna layer configured on the base and at least one antenna extension portion embedded in the first supporting portion, so that the antenna layer is electrically connected to the circuit layer via the antenna extension portion.

2. The electronic package according to claim 1, wherein: The antenna body has a plurality of antenna layers which are separated from each other and correspondingly arranged on both sides of the base.

3. The electronic package as claimed in claim 2, characterized in that The plurality of antenna layers transmit signals in a coupled manner.

4. The electronic package according to claim 1, wherein: The first supporting portion is combined with the supporting structure via a conductor.

5. The electronic package as claimed in claim 4, characterized in that An external pad electrically connected to the antenna extension portion is disposed between the first supporting portion and the conductor.

6. The electronic package according to claim 1, wherein: A second supporting portion is also provided on the base, so that the base is mounted on the supporting structure via the first supporting portion and the second supporting portion, and the first antenna layer of the antenna body is not electrically connected to the second supporting portion.

7. The electronic package according to claim 6, wherein: The first supporting portion and the second supporting portion are combined with the supporting structure via a conductor.

8. The electronic package according to claim 7, wherein: An external pad is disposed between the first supporting portion and the conductor and / or between the second supporting portion and the conductor.

9. The electronic package according to claim 6, wherein: The first supporting portion and the second supporting portion separate a plurality of the open areas to serve as air intervals.

10. The electronic package according to claim 1, wherein: The height of the open area is at least 400 microns.

11. The electronic package according to claim 1, wherein: The height of the open area is not equal to the thickness of the base.

12. The electronic package according to claim 1, wherein: The electronic package also includes a shielding structure covering the electronic component.

13. The electronic package according to claim 1, wherein: The electronic package also includes at least one base body arranged on the supporting structure, so that the first supporting part of the antenna structure is mounted on the base body.

14. The electronic package according to claim 13, wherein: The seat body has an expansion space connected to the open area.

15. The electronic package according to claim 13, wherein: The base has another antenna extension portion electrically connected to the antenna extension portion.

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