Micro component mass transfer apparatus and method of manufacturing micro component panel

Abstract

The present application provides a micro component mass transfer device, which comprises a base platform, a moving platform, a substrate platform, a laser component, a rolling pressure mechanism and a heating mechanism. The moving platform is movably arranged on the base platform and has a moving path. The substrate platform is movably arranged on the base platform and is adapted to move between different positions overlapped with the moving platform. The laser component is movably arranged on the base platform. The laser component is adapted to move relative to the substrate platform and emit a laser beam towards the substrate platform. The rolling pressure mechanism is arranged on the moving path of the moving platform and forms a contact area with the moving platform. The heating mechanism is arranged corresponding to the contact area and is adapted to heat the contact area between the moving platform and the rolling pressure mechanism. A manufacturing method of a micro component panel is also provided.

Description

TECHNICAL FIELD

[0001] The present invention relates to a mass transfer technique of micro components, and more particularly, to a mass transfer apparatus of micro components and a manufacturing method of a micro component panel. BACKGROUND

[0002] Micro light emitting diode display has excellent optical performance, such as high color saturation, fast response speed and high contrast, in addition to the advantages of low energy consumption and long service life of materials. In order to achieve lower production cost and larger product design margin, the manufacturing technology of micro light emitting diode display adopts the way of transferring the crystal grains. For example: the mass transfer technology of directly transferring the pre-made micro light emitting diode crystal grains to the driving circuit backboard. Specifically, the crystal grain manufacturer needs to make (or place) the micro light emitting diode crystal grains required by the customer on the temporary substrate, and the customer transfers the micro light emitting diode crystal grains stored on the temporary substrate to the driving circuit board of different products according to different application requirements.

[0003] Because the process time required for the transfer and bonding of the crystal grains is not the same, the slower process step often becomes the process bottleneck and affects the overall production capacity. In addition, the general bonding step mostly adopts the whole surface heating method, which is easy to affect the operating electrical properties of the non-bonding area (such as the bonded area). SUMMARY

[0004] The present invention is directed to a mass transfer apparatus of micro components, which can provide better bonding yield for micro components, and also takes into account the production capacity and transfer precision.

[0005] The present invention is directed to a manufacturing method of a micro component panel, which has better continuity of the transfer process and the bonding process of the micro components.

[0006] According to an embodiment of the present invention, the mass transfer apparatus of micro components includes a base platform, a moving stage, a substrate stage, a laser component, a rolling press mechanism and a heating mechanism. The moving stage is movably arranged on the base platform and has a moving path. The substrate stage is movably arranged on the base platform and is adapted to move between different positions overlapped with the moving stage. The laser component is movably arranged on the base platform. The laser component is adapted to move relative to the substrate stage and emit a laser beam towards the substrate stage. The rolling press mechanism is arranged on the moving path of the moving stage and forms a contact area with the moving stage. The heating mechanism is arranged corresponding to the contact area and is adapted to heat the contact area between the moving stage and the rolling press mechanism.

[0007] In the micro component mass transfer apparatus according to the embodiment of the present application, the moving stage is adapted to move along a first direction or a second direction parallel to the base platform. The substrate stage is adapted to move along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0008] In the micro component mass transfer apparatus according to the embodiment of the present application, the moving stage moves along the first direction while the laser beam moves along the second direction.

[0009] In the micro component mass transfer apparatus according to the embodiment of the present application, the substrate stage moves along the second direction while the laser beam moves along the second direction.

[0010] In the micro component mass transfer apparatus according to the embodiment of the present application, the moving stage is adapted to pass through the substrate stage at a first rate, and is adapted to pass through the rolling press mechanism at a second rate. The first rate is greater than or equal to the second rate.

[0011] In the micro component mass transfer apparatus according to the embodiment of the present application, the rolling press mechanism comprises a roller.

[0012] In the micro component mass transfer apparatus according to the embodiment of the present application, the rolling press mechanism further comprises a buffer layer disposed on the roller.

[0013] In the micro component mass transfer apparatus according to the embodiment of the present application, the buffer layer is a plurality of buffer bumps separated from each other.

[0014] In the micro component mass transfer apparatus according to the embodiment of the present application, the roller has a roundness, each buffer bump has a thickness, and the roundness is less than the thickness of the buffer bump.

[0015] In the micro component mass transfer apparatus according to the embodiment of the present application, the heating mechanism comprises a laser source disposed in the base platform and located at a side of the moving stage away from the rolling press mechanism, and is adapted to irradiate another laser beam toward the contact area to heat the contact area. The light transmittance of the moving stage to the other laser beam is greater than 90%.

[0016] In the micro component mass transfer apparatus according to the embodiment of the present application, the micro component mass transfer apparatus further comprises a plurality of base platforms, a plurality of substrate stages and a plurality of rolling press mechanisms. Each of the base platforms is provided with one substrate stage or one rolling press mechanism. The moving path of the moving stage extends between the base platforms.

[0017] In the micro component mass transfer apparatus according to the embodiment of the present application, the heating mechanism comprises a plurality of heating units, and the heating units are dispersedly disposed on the circumferential surface of the rolling press mechanism.

[0018] According to an embodiment of the present application, a method for manufacturing a micro component panel includes: arranging a target substrate on a moving stage; arranging at least one micro component substrate on a substrate stage; irradiating at least one micro component on the at least one micro component substrate by using a laser component, so as to separate the at least one micro component from the at least one micro component substrate and transfer the at least one micro component to the target substrate; moving the moving stage, so that the target substrate provided with the at least one micro component passes through a rolling pressure bonding mechanism and a contact area is heated, so as to electrically connect the at least one micro component with the target substrate. The moving stage is adapted to move the target substrate relative to the base platform. The substrate stage is adapted to move the at least one micro component substrate to approach or move away from the base platform. The at least one micro component substrate has a substrate and at least one micro component. The at least one micro component is arranged on the surface of the substrate facing the target substrate. When the target substrate passes through the rolling pressure bonding mechanism, each of the at least one micro component has a contact area with the rolling pressure bonding mechanism.

[0019] In the method for manufacturing a micro component panel according to an embodiment of the present application, the target substrate is adapted to move relative to the base platform along a first direction or a second direction. The at least one micro component substrate is adapted to move along a third direction. The first direction, the second direction and the third direction are perpendicular to each other. The at least one micro component of the at least one micro component substrate is a plurality of micro components. The micro components are arranged on the substrate along the first direction with a first pitch. After the micro components are separated from the substrate and transferred to the target substrate, the micro components are arranged on the target substrate along the first direction with a second pitch, and the second pitch is greater than the first pitch.

[0020] In the method for manufacturing a micro component panel according to an embodiment of the present application, during the process of separating the at least one micro component from the at least one micro component substrate, the moving stage moves at a first speed. During the process of the target substrate provided with the at least one micro component passing through the rolling pressure bonding mechanism, the moving stage moves at a second speed, and the first speed is greater than or equal to the second speed.

[0021] In the method for manufacturing a micro component panel according to an embodiment of the present application, the rolling pressure bonding mechanism includes a roller and a buffer layer arranged on the roller, and during the process of the roller rolling the at least one micro component, the buffer layer is in contact with the at least one micro component.

[0022] In the method for manufacturing a micro component panel according to an embodiment of the present application, the buffer layer is a plurality of buffer bumps separated from each other.

[0023] In the method for manufacturing a micro component panel according to an embodiment of the present application, the width of any one of the buffer bumps is less than the width of each of the micro components.

[0024] In the method for manufacturing a micro component panel according to an embodiment of the present application, the step of heating the contact area includes: heating the roller.

[0025] Based on the above, in the micro component mass transfer device and the manufacturing method of the micro component panel of the embodiment of the present application, the micro component needs to pass through the rolling and pressing mechanism after being transferred to the target substrate, and the contact area of the micro component and the rolling and pressing mechanism is heated before the micro component is stably bonded to the target substrate. Since the transfer process and the bonding process of the micro component are carried out in stages, in addition to improving the flow of the transfer process and the bonding process of the micro component, the bonded micro component can also be prevented from being damaged by unintended heat flow during the bonding process of other micro components. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a schematic diagram of the micro component mass transfer device of the first embodiment of the present application;

[0027] Figures 2A to 2G is a flowchart of the micro component transfer process using the micro component mass transfer device of the first embodiment of the present application; Figure 1

[0028] Figure 3 is a top view schematic diagram of the micro component transfer process using the micro component mass transfer device of the first embodiment of the present application; Figure 1

[0029] Figure 4 is a schematic diagram of the substrate stage and the micro component substrate of the first embodiment of the present application at different viewing angles; Figure 1

[0030] Figures 5 to 7 is a cross-sectional schematic diagram of another variant embodiment of the micro component mass transfer device of the first embodiment of the present application; Figure 1

[0031] Figure 8 and Figure 9 is a schematic diagram of the micro component mass transfer device of the second embodiment of the present application.

[0032] REFERENCE NUMERALS

[0033] 10, 20: micro component mass transfer device;

[0034] 100: base platform;

[0035] 102: support column;

[0036] 104: cross beam;

[0037] 106: gantry mechanism;

[0038] 108: support arm;

[0039] 110, 110A: moving stage;

[0040] ​​​​120: substrate stage;

[0041] 120h: opening;

[0042] 120s, SBs: surface;

[0043] 130: laser element;

[0044] 135: laser source;

[0045] 140: servo motor module;

[0046] 141A, 141B, 142A, 142B, 143A, 143B: servo motor;

[0047] 200, 200A, 200B: roll press mechanism;

[0048] 210: roller;

[0049] 210S: circumferential surface;

[0050] 220, 220A: buffer layer;

[0051] 220P: buffer bump;

[0052] 250: heating unit;

[0053] 300: transposition mechanism;

[0054] 310: rotation mechanism;

[0055] 320: pickup;

[0056] CR: contact area;

[0057] DA: diameter;

[0058] LB, LB": laser beam;

[0059] MD: micro element;

[0060] MDS, MDS1, MDS2, MDS3: micro element substrate;

[0061] P1x, P1y: first pitch;

[0062] P2x, P2y: second pitch;

[0063] PTH: movement path;

[0064] Pt1, Pt2: target position;

[0065] RD: rotation direction;

[0066] RL: release layer;

[0067] S: Spacing;

[0068] SB: Substrate;

[0069] T: Thickness;

[0070] TBS, TBS1, TBS2: Thermal Bonding Station;

[0071] TFS, TFS1, TFS2: Transfer Station;

[0072] TS, TS1, TS2, TS3, TS4: Target Substrate;

[0073] V1: First Speed;

[0074] V2: Second Speed;

[0075] V3: Third Speed;

[0076] W, W': Width;

[0077] X, Y, Z: Movement Axis;

[0078] X1, Y1, Y2, Z1, Z2: Direction. DETAILED DESCRIPTION

[0079] Reference will now be made in detail to the exemplary embodiments of the present application, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

[0080] Figure 1 is a schematic view of a micro component mass transfer apparatus of a first embodiment of the present application. Figures 2A to 2G is a flowchart of transferring micro components using the micro component mass transfer apparatus of Figure 1 .

[0081] Figure 3 is a top view schematic view of the micro component mass transfer process using the micro component mass transfer apparatus of Figure 1 . Figure 4 is a schematic view of a substrate stage and a micro component substrate at different viewing angles of the micro component mass transfer apparatus of Figure 1 . Figures 5 to 7 is a cross-sectional schematic view of other variant embodiments of the micro component mass transfer apparatus of Figure 1 .

[0082] Please refer to Figure 1 and Figure 2AThe micro component mass transfer apparatus 10 includes a base platform 100, a moving stage 110, a substrate stage 120, and a laser component 130. The moving stage 110 is configured to carry the target substrate TS and move the target substrate TS relative to the base platform 100. The substrate stage 120 is configured to carry the micro component substrate MDS and move the micro component substrate MDS to approach or move away from the base platform 100.

[0083] In the present embodiment, the target substrate TS is, for example, a circuit backplane of a display panel, but not limited thereto. In other embodiments, the target substrate TS can also be a temporary substrate formed by stacking a carrier substrate and an adhesive layer. On the other hand, the micro component substrate MDS includes a substrate SB and a plurality of micro components MD disposed on the substrate SB. In the present embodiment, the substrate SB of the micro component substrate MDS is, for example, a epitaxial substrate, and the micro components MD can be micro light-emitting components, such as micro light-emitting diodes (Micro LEDs), fabricated on the epitaxial substrate, but not limited thereto. In other embodiments, the substrate SB of the micro component substrate MDS can also be a temporary carrier substrate (e.g., a glass substrate or a flexible substrate) used in a transfer process, and the micro components MD can be electronic components performing predetermined electronic functions (e.g., diodes, transistors, integrated circuits) or photonic functions (LEDs, lasers).

[0084] The laser component 130 is configured to emit a laser beam LB to irradiate a corresponding micro component substrate MDS, so that at least one micro component MD to be transferred is separated from the substrate SB and connected to the target substrate TS. More specifically, the micro component mass transfer apparatus 10 is configured to use a laser lift-off (LLO) technique to achieve the transfer of the micro components MD. In order to achieve the effect of laser lift-off, a release layer RL is further disposed between the micro components MD and the substrate SB, and the adhesion of the release layer RL is disabled after irradiation of the laser beam LB, but the present application is not limited thereto.

[0085] Further, the moving stage 110 is movably disposed on the base platform 100 and is adapted to move the target substrate TS relative to the base platform 100 along at least one direction. The base platform 100 is provided with a movement path PTH of the moving stage 110. In the present embodiment, the direction of the movement path PTH is, for example, a direction parallel to the movement axis X, but not limited thereto. The moving stage 110 is configured to move along the movement axis X and the movement axis Y in two dimensions, for example, along the direction X1 (or the opposite direction of the direction X1) and the direction Y1 (or the direction Y2). The axial direction of the movement axis X (e.g., the direction X1) intersects the axial direction of the movement axis Y (e.g., the direction Y1 or the direction Y2).

[0086] On the other hand, the substrate stage 120 is movably disposed on the base platform 100 and located on the side of the movable stage 110 away from the base platform 100. The substrate stage 120 is adapted to move the micro-component substrate MDS along at least one direction onto the movement path PTH of the movable stage 110 and overlap the movable stage 110. For example, in this embodiment, the substrate stage 120 can move the micro-component substrate MDS closer to or away from the base platform 100 along the movement axis Z (e.g., direction Z1 or direction Z2), or move the micro-component substrate MDS to different positions overlapping the movable stage 110 along the movement axis Y (e.g., direction Y1 or direction Y2). The axial directions of the movement axis Z, X, and Y are optionally perpendicular to each other.

[0087] However, the invention is not limited thereto. In other embodiments, the substrate stage 120 may also move along the moving axis X (e.g., direction X1 or the opposite of direction X1). Since the moving stage 110 and the substrate stage 120 can respectively drive the target substrate TS and the micro-component substrate MDS to move in different or opposite directions, the alignment speed of the area to be transferred on the target substrate TS and the micro-component MD to be transferred on the micro-component substrate MDS can be improved.

[0088] Furthermore, the laser element 130 is disposed on the side of the substrate stage 120 away from the moving stage 110, and is adapted to be moved to a target position corresponding to the substrate stage 120 (e.g.: Figure 2A Target position Pt1 or Figure 2B The target position is Pt2). In this embodiment, the laser element 130 can move in two dimensions relative to the substrate stage 120 along the movement axis X and the movement axis Y, respectively.

[0089] Please refer to the following at the same time Figure 4 In this embodiment, the micro-element substrate MDS is optionally disposed on the surface 120s of the substrate stage 120 facing the base platform 100, and the micro-element MD on it is disposed on the surface SBs of the substrate SB facing the target substrate TS. In order to allow the laser beam LB emitted by the laser element 130 to irradiate the corresponding micro-element substrate MDS and to connect the micro-element MD to be transposed with the target substrate TS, the substrate stage 120 has an opening 120h corresponding to the micro-element substrate MDS.

[0090] For example, in the present embodiment, the substrate carrier 120 is configured to carry three micro device substrates MDS, i.e. a first micro device substrate MDS1, a second micro device substrate MDS2 and a third micro device substrate MDS3, and the micro device substrates MDS are, for example, micro light emitting device substrates. Accordingly, the substrate carrier 120 is configured to have three openings 120h, and the micro device substrates MDS are disposed in correspondence with the openings 120h, respectively. However, the present application is not limited thereto. In other embodiments, the number of openings 120h of the substrate carrier 120 and the number of micro device substrates MDS carried thereby can be adjusted according to actual process requirements.

[0091] It is particularly noted that the width of the micro device substrates MDS in a direction parallel to the surface 120s is slightly greater than the width of the openings 120h of the substrate carrier 120 in the direction. For example, the shortest distance between the orthographic projection profile of the micro device substrates MDS on the surface 120s of the substrate carrier 120 and the openings 120h can be 3 mm, and the micro device substrates MDS are attracted to the substrate carrier 120 by overlapping the edge portions of the substrate carrier 120. For example, the vacuum attraction relationship with the micro device substrates MDS is achieved by a plurality of micro pores disposed on the surface 120s of the substrate carrier 120 adjacent to the openings 120h and exhaust channels communicating with the micro pores, but the present application is not limited thereto. In the present embodiment, the spacing S of any two adjacent micro device substrates MDS in the arrangement direction, even the size or shape, can be adjusted according to actual transfer requirements, and the present application is not limited thereto.

[0092] On the other hand, the light emitting color of the micro light emitting devices (i.e. micro devices MD) of any one of the micro device substrates MDS is different from the light emitting color of the micro light emitting devices (i.e. micro devices MD) of another one of the micro device substrates MDS. For example, the light emitting color of the micro light emitting devices of the first micro device substrate MDS1, the second micro device substrate MDS2 and the third micro device substrate MDS3 is red, green and blue, respectively, but the present application is not limited thereto.

[0093] To increase the alignment accuracy between the target substrate TS, the micro component substrate MDS and the laser component 130, servo motor modules 140 are provided on the movable stage and the support frame that carry these components. That is, the servo motor modules 140 can be used to drive the movement of the moving stage 110, the substrate stage 120 and the laser component 130 along their respective movement axes. For example, in the present embodiment, the servo motor modules 140 can include servo motors 141A and 141B provided between the moving stage 110 and the base platform 100, servo motors 142A provided between the support columns 102 and the cross beams 104, servo motors 142B provided between the cross beams 104 and the substrate stage 120, servo motors 143A provided between the cross beams 104 and the gantry mechanism 106, and servo motor 143B provided between the gantry mechanism 106 and the support arm 108, but the present application is not limited thereto.

[0094] In the present embodiment, the four support columns 102 and the two cross beams 104 can constitute a gantry type movement mechanism of the base platform 100, and the substrate stage 120 and the laser component 130 are movably arranged on this gantry type movement mechanism of the base platform 100. Specifically, the laser component 130 can be arranged on the gantry mechanism 106 via the support arm 108. However, the present application is not limited thereto. In other embodiments, the relative movement relationship between the moving stage 110, the substrate stage 120 and the laser component 130 can also be achieved using any movable support structure design known to those skilled in the art.

[0095] In detail, the servo motors 141A and 141B can drive the moving stage 110 to move relative to the base platform 100 along the movement axes X and Y, respectively. The servo motors 142A can drive the substrate stage 120 and the laser component 130 to move along the movement axis Z to approach or move away from the base platform 100. The servo motors 142B can drive the substrate stage 120 to move along the movement axis Y. The servo motors 143A and 143B can drive the laser component 130 to move relative to the substrate stage 120 along the movement axes X and Y, respectively.

[0096] It should be noted that in the present embodiment, the number of laser components 130 is exemplarily illustrated as one, and the present application is not limited thereto. In other embodiments, the number of laser components 130 can also be adjusted according to the number of micro component substrates MDS, for example, three laser components 130 can be provided corresponding to three micro component substrates MDS, respectively, and these three laser components 130 can be moved to the target positions of the corresponding micro component substrates MDS, respectively.

[0097] In the present embodiment, in addition to the transfer station TFS composed of the combination of the moving stage 110, the substrate stage 120, the laser element 130 and the moving gantry, the micro component mass transfer apparatus 10 further comprises a roll bonding mechanism 200 disposed on the base platform 100 and located on the moving path PTH of the moving stage 110. It is particularly noted that the roll bonding mechanism 200 is independent of the transfer station TFS and serves as a thermal bonding station TBS of the micro component mass transfer apparatus 10. That is, the transfer process and the bonding process of the micro components MD are performed separately. Therefore, the micro components MD on the micro component substrate MDS are not simultaneously subjected to the thermal bonding process during the transferring process by the transfer mechanism TFS to the target substrate TS, but are transferred to the roll bonding mechanism 200 for the bonding process under the driving of the moving stage 110 after all the required micro components MD are transferred to the target substrate TS.

[0098] When the moving stage 110 carrying the target substrate TS passes through the roll bonding mechanism 200, a contact region CR is formed between the moving stage 110 (or the target substrate TS) and the roll bonding mechanism 200, and the roll bonding mechanism 200 is adapted to roll through the micro components MD in the contact region CR (as shown in Figure 2E The contact region CR is adapted to be heated to bond the micro components MD to the target substrate TS. In the present embodiment, the heating step of the contact region CR can be implemented by heating the roll bonding mechanism 200. That is, the roll bonding mechanism 200 can be provided with a heating element and simultaneously serves as a heating mechanism, but is not limited thereto. The micro components MD are firmly bonded to the target substrate TS after being heated and rolled by the roll bonding mechanism 200.

[0099] The following will be exemplarily described with respect to a manufacturing method of the micro component panel applicable to the micro component mass transfer apparatus 10. Please refer to Figure 1 and Figure 2A After the target substrate TS and the micro component substrate MDS are respectively arranged on the moving stage 110 and the substrate stage 120, the transfer process of the micro components MD is started. The moving stage 110 is moved to a predetermined position on the base platform 100, so that at least one micro component substrate MDS on the substrate stage 120 is overlapped with the target substrate TS on the moving stage 110 in the axial direction of the moving axis Z. During the process, the moving stage 110 is moved, for example, in the direction X1, and the substrate stage 120 is moved, for example, in the direction Z2 to approach the target substrate TS, but is not limited thereto.

[0100] It is noted that, during the movement of the mobile stage 110 and the substrate stage 120, the laser element 130 can be moved to the corresponding target position Pt1 of the substrate stage 120 along the movement axis X and the movement axis Y simultaneously, so as to shorten the process time required for the alignment procedure among the mobile stage 110, the substrate stage 120 and the laser element 130. It is appreciated that the alignment procedure between the laser element 130 and the substrate stage 120 and the alignment procedure between the mobile stage 110 and the substrate stage 120 can be performed in any order or simultaneously, which can be adjusted according to different process requirements, and the present application is not limited thereto.

[0101] After receiving the feedback signal from the servo motor module 140 and confirming no error, the laser element 130 emits a laser beam LB. The laser beam LB is irradiated on the release layer RL between the micro elements MD to be transferred and the substrate SB through the opening 120h of the substrate stage 120, so as to reduce the adhesion between the micro elements MD to be transferred and the substrate SB. The release layer RL herein is, for example, a laser-induced adhesive release layer, but is not limited thereto.

[0102] Please refer to Figure 2B and Figure 3 for example, during the irradiation of the laser beam LB, the laser element 130 can quickly irradiate an entire row of micro elements MD along the movement axis Y, so that the entire row of micro elements MD is transferred to the target substrate TS at substantially the same time. After the irradiation of an entire row of micro elements MD (for example, the entire row of micro elements MD in the position Pt1 in Figure 2A ), the same scanning irradiation is performed on the next row of micro elements MD (for example, the entire row of micro elements MD in the position Pt2 in Figure 2B ) along the movement axis X, and so on. In other words, when the mobile stage 110 moves along the movement axis X (for example, the direction X1 of Figure 1 ), the laser beam LB moves along the movement axis Y (for example, the direction Y1 and the direction Y2 of Figure 1 ) at a faster rate simultaneously.

[0103] In the present embodiment, a plurality of micro elements MD are arranged on the micro element substrate MDS along the movement direction of the target substrate TS (for example, the axial direction of the movement axis X) at a first pitch P1x. After being detached from the substrate SB and transferred to the target substrate TS, the micro elements MD can be arranged on the target substrate TS along the movement direction of the target substrate TS at a second pitch P2x, and the second pitch P2x is greater than the first pitch P1x. It is noted that the second pitch P2x of the micro elements MD on the target substrate TS can be adjusted by changing the movement speed of the mobile stage 110.

[0104] It is particularly noteworthy that, in this embodiment, when the laser beam LB is along one axis of the moving axis Y (e.g., Figure 1 When the substrate stage 120 moves in the direction Y1), it can also move along the axis Y of the moving axis, such as Figure 2C and Figure 2D As shown. More specifically, during the rapid movement of the laser beam LB along the moving axis Y and irradiation of a row of micro-components MD, the arrangement pitch of the micro-components MD on the target substrate TS can be adjusted by changing the movement rate of the substrate stage 120 along the moving axis Y (e.g., a third rate V3). For example, in this embodiment, multiple micro-components MD are arranged on the micro-component substrate MDS with a first pitch P1y in the axial direction of the moving axis Y. After being removed from the substrate SB and transferred to the target substrate TS, these micro-components MD are arranged on the target substrate TS with a second pitch P2y in the axial direction of the moving axis Y, and the second pitch P2y is greater than the first pitch P1y.

[0105] After the transfer step of the micro-component MD is completed, the moving stage 110 is moved to another predetermined position on the base platform 100, so that the target substrate TS on which the micro-component MD is located overlaps the rolling pressing mechanism 200 in the axial direction of the moving axis Z. Figures 2E to 2G As shown, when the target substrate TS passes through the rolling pressing mechanism 200, the rolling pressing mechanism 200 rolls over the micro-component MD directly below it, forming a contact area CR. During the rolling process, the contact area CR is heated, causing the rolled micro-component MD to electrically bond with the target substrate TS.

[0106] The rolling pressing mechanism 200 may include a roller 210 and a buffer layer 220, wherein the buffer layer 220 is disposed on the surface of the roller 210. During the rolling pressing process of the rolling pressing mechanism 200 rolling the micro-element MD, the buffer layer 220 is located between the micro-element MD and the roller 210 and contacts the micro-element MD. During the rolling process, the buffer layer 220 can absorb excessive downward pressure applied to the micro-element MD to avoid damage to the micro-element MD. In this embodiment, the buffer layer 220 may be a plurality of buffer bumps 220P that are separated from each other. These buffer bumps 220P are distributed on the circumferential surface 210S (or wheel surface) of the roller 210, and the arrangement pitch along the circumferential direction of the roller 210 may depend on the arrangement pitch of the micro-element MD on the target substrate TS in the direction of movement (e.g., a second pitch P2x). However, the invention is not limited thereto. In other embodiments, the buffer layer 220A of the rolling pressing mechanism 200A may also cover the entire circumferential surface 210S of the roller 210 (e.g., ...). Figure 5 (As shown).

[0107] It should be noted that, although Figures 2E to 2GThe rotation direction RD of the roller 210 in the figure is counterclockwise, which does not mean that the present application is limited by the disclosure of the figure. In other embodiments not shown, the rotation direction of the roller 210 can be adjusted in coordination with the moving direction of the moving platform 110.

[0108] In the present embodiment, the roller 210 of the rolling press mechanism 200 can be thermally coupled to a heating source (not shown). The micro component MD can be able to form a more stable electrical connection with the target substrate TS through the heating of the buffer bump 220P and the roller 210 while being rolled and pressed by the roller 210. That is, in the present embodiment, the heating step of the contact area CR can be implemented through the heating of the roller 210, but is not limited thereto. In another embodiment, the step of heating the contact area CR can also be to irradiate the contact area CR with a laser source 135, wherein the laser source 135 is disposed in the base platform 100 and is located on the side of the moving platform 110A away from the rolling press mechanism 200 (as shown in Figure 6 In the present embodiment, the moving platform 110A has a light transmittance of greater than 90% for the laser beam LB". Figure 6

[0109] In yet another embodiment, the circumferential surface 210S of the roller 210 of the rolling press mechanism 200B can be dispersedly provided with a plurality of heating units 250 (i.e., heating mechanisms). These heating units 250 correspond to the plurality of buffer bumps 220P, respectively. Unlike the embodiment of Figure 2E the embodiment of Figure 7 the plurality of heating units 250 in the present embodiment only heat the respective contact areas CR to which they correspond, which can further improve the local heating effect of the roller 210.

[0110] In the present embodiment, the roller 210 of the rolling press mechanism 200 can have a circle diameter DA (as shown in Figure 2E The buffer bump 220P has a width W along the circumferential direction of the roller 210 and a thickness T along the radial direction of the roller 210. The circle diameter DA is preferably between 1 cm and 50 cm. The ratio of the circle diameter DA to the width W is preferably between 104 and 105, and the width W is preferably smaller than the width W' of the micro component MD.

[0111] ​Accordingly, the rolling press mechanism 200 can contact only one micro component MD during the rolling process to avoid the heating step affecting the operating electrical property or the bonding state of the micro component MD outside the contact area CR. That is, the rolling press mechanism 200 of the present embodiment can generate a local heating effect during the rolling process of the micro component MD to improve the bonding yield of the micro component MD. If the ratio of the diameter DA of the roller 210 to the width W of the buffer bump 220P is too large, the accuracy of the rolling press mechanism 200 in pressing the micro component MD in the contact area CR will decrease.

[0112] From another perspective, the roller 210 can have a roundness, which is defined by the difference between the maximum radius and the minimum radius of the roller 210. For example, the smaller the difference, the better the flatness of the surface of the roller 210, and vice versa. To meet the flatness requirement of the bonding process, the roundness of the roller 210 cannot be greater than 1 micron. Preferably, the roundness is less than 0.5 micron.

[0113] Unlike the conventional Roll-to-Roll process that simultaneously performs the transfer and bonding of the micro components, the manufacturing method of the micro component panel of the present disclosure separates the transfer process and the bonding process of the micro components MD. Therefore, in addition to having a better bonding yield, the transfer accuracy of the micro components MD can also be improved.

[0114] On the other hand, during the transfer process of the micro components MD, the moving stage 110 can move at a first speed VI. During the thermal compression bonding process of the micro components MD, the moving stage 110 can move at a second speed V2, and the first speed VI can be greater than or equal to the second speed V2. By adjusting the first speed VI and the second speed V2, the continuity of the transfer process and the bonding process of the micro components MD can be increased to facilitate the adjustment of the overall production capacity.

[0115] Although not shown in the drawings, in the present embodiment, the aforementioned transfer process and bonding process can be repeatedly performed to electrically bond the micro components MD on different micro component substrates MDS (for example, a first micro component substrate MDS1, a second micro component substrate MDS2, and a third micro component substrate MDS3) to the same target substrate TS, respectively, to complete the fabrication of the micro component panel. Figure 4

[0116] Hereinafter, other embodiments will be listed to explain the present disclosure in detail, in which the same components will be marked with the same symbols, and the description of the same technical content will be omitted. Please refer to the foregoing embodiments for the omitted parts, which will not be described hereinafter.

[0117] Figure 8 and Figure 9 ​This is a schematic diagram of a micro-component mass transfer device according to a second embodiment of the present invention. Please refer to... Figure 8 In this embodiment, the micro-component mass transfer apparatus 20 may include multiple base platforms 100, multiple substrate stages 120, and multiple rolling pressing mechanisms 200. Each base platform 100 is provided with a substrate stage 120 or a rolling pressing mechanism 200, wherein the movement path PTH of the moving stage 110 extends between these base platforms 100. For example, the micro-component mass transfer apparatus 20 may include two sets of... Figure 1 The process stations include transfer stations TFS and thermal bonding stations TBS, such as first transfer station TFS1, second transfer station TFS2, first thermal bonding station TBS1, and second thermal bonding station TBS2. These process stations can simultaneously process different target substrates, such as first target substrate TS1, second target substrate TS2, third target substrate TS3, and fourth target substrate TS4.

[0118] For example, within a first time interval, the first transfer station TFS1 can transfer micro-components on the first micro-component substrate MDS1 to the first target substrate TS1, the second transfer station TFS2 can transfer micro-components on the second micro-component substrate MDS2 to the third target substrate TS3, the first thermal bonding station TBS1 can thermally bond the micro-components on the second target substrate TS2 to the second target substrate TS2, and the second thermal bonding station TBS2 can thermally bond the micro-components on the fourth target substrate TS4 to the fourth target substrate TS4.

[0119] Once the processes at each of the above-mentioned stations are completed, the target substrate at each station can be transferred to the next station (e.g., ...). Figure 8 The movement path PTH is shown. For example: the first target substrate TS1 in the first transfer station TFS1 can be transferred to the first thermal bonding station TBS1, the second target substrate TS2 in the first thermal bonding station TBS1 can be transferred to the second transfer station TFS2, the third target substrate TS3 in the second transfer station TFS2 can be transferred to the second thermal bonding station TBS2, and the fourth target substrate TS4 in the second thermal bonding station TBS2 can be transferred to the first transfer station TFS1.

[0120] After the transferring is completed, each process station can perform corresponding process (i.e. transfer process or thermal bonding process) on the target substrate transferred from the previous process station in the second time interval. For example, in the present embodiment, the target substrate can sequentially undergo transfer process of the first micro light emitting element with the first light emitting color at the first transfer station TFS1, thermal bonding process of the first micro light emitting element at the first thermal bonding station TBS1, transfer process of the second micro light emitting element with the second light emitting color at the second transfer station TFS2, and thermal bonding process of the second micro light emitting element at the second thermal bonding station TBS2.

[0121] Since the transfer processes of the first transfer station TFS1 and the second transfer station TFS2 are similar to the transfer processes of the first transfer station TFS1 and the second transfer station TFS2 in the above-mentioned embodiment, and the bonding processes of the first thermal bonding station TBS1 and the second thermal bonding station TBS2 are similar to the bonding processes of the first thermal bonding station TBS1 and the second thermal bonding station TBS2 in the above-mentioned embodiment, the detailed description is referred to the relevant paragraphs of the above-mentioned embodiment, and thus will not be repeated here. Figure 2A Figure 2B Since the transfer processes of the first transfer station TFS1 and the second transfer station TFS2 are similar to the transfer processes of the first transfer station TFS1 and the second transfer station TFS2 in the above-mentioned embodiment, and the bonding processes of the first thermal bonding station TBS1 and the second thermal bonding station TBS2 are similar to the bonding processes of the first thermal bonding station TBS1 and the second thermal bonding station TBS2 in the above-mentioned embodiment, the detailed description is referred to the relevant paragraphs of the above-mentioned embodiment, and thus will not be repeated here. Figures 2E to 2G

[0122] Please refer to Figure 9 In the present embodiment, the micro component mass transfer apparatus 20 can further include a transfer mechanism 300 adapted to transfer the target substrate of different process stations to the next process station. For example, the transfer mechanism 300 can include a rotating mechanism 310 and a plurality of pickers 320. These pickers 320 can be respectively arranged at a plurality of positions of the rotating mechanism 310 corresponding to different process stations to facilitate picking up the corresponding target substrate. Arranging the above-mentioned four process stations around the transfer mechanism 300 can not only reduce the required configuration space of the micro component mass transfer apparatus 20, but also shorten the transfer time of the target substrate between these process stations, which helps to improve the overall productivity.

[0123] It should be noted that in other embodiments, the number of transfer stations and thermal bonding stations can be adjusted according to actual productivity requirements or product design, and the present application is not limited by the disclosed contents of the drawings.

[0124] In summary, in the micro component mass transfer apparatus and the manufacturing method of the micro component panel of an embodiment of the present application, the micro component needs to be rolled and pressed by the rolling and pressing mechanism after being transferred to the target substrate, and the micro component can be stably bonded to the target substrate after the contact area of the micro component and the rolling and pressing mechanism is heated. Since the transfer process and the bonding process of the micro component are performed in stages, in addition to improving the smoothness of the transfer process and the bonding process of the micro component, it can also avoid the damage of the bonded micro component caused by the unintended heat flow during the bonding process of other micro components.

[0125] ​​It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A device for mass transfer of micro-components, characterized in that, include: Multiple transfer sites, each suitable for its own purpose, and each including: First base platform; A substrate stage, movably disposed on the first base platform, and adapted to move along a movement axis toward or away from the first base platform; and A laser element is movably disposed on the first base platform, the laser element being adapted to move relative to the substrate stage and to emit a laser beam toward the substrate stage; Multiple thermal bonding sites, each including: Second base platform; A rolling pressing mechanism is disposed on the second base platform; and The heating mechanism is installed in the second base platform; A plurality of movable stages, each adapted to carry a plurality of target substrates, each of the plurality of movable stages being adapted to move along a movement path to a predetermined position on one of a plurality of first base platforms and a plurality of second base platforms, such that the substrate stage or the rolling pressing mechanism overlaps each of the plurality of movable stages in the axial direction of the movement axis, wherein the substrate stage is adapted to move between different positions overlapping one of the plurality of movable stages, the rolling pressing mechanism forms a contact area with another of the plurality of movable stages passing beneath it, and the heating mechanism is adapted to heat the contact area; and A transposition mechanism is adapted to transfer each of the plurality of target substrates between a first base platform of one of the plurality of transfer stations and a second base platform of one of the plurality of thermal bonding stations, and includes a rotation mechanism and a plurality of pickups, wherein the plurality of transfer stations and the plurality of thermal bonding stations are disposed around the transposition mechanism, and the plurality of pickups are respectively disposed at a plurality of positions of the rotation mechanism corresponding to the plurality of transfer stations and the plurality of thermal bonding stations to transfer the plurality of target substrates.

2. The micro-component mass transfer device according to claim 1, characterized in that, One of the plurality of movable platforms is adapted to move parallel to the first base platform along a first direction or a second direction, the substrate platform is adapted to move along a third direction, and the first direction, the second direction, and the third direction are perpendicular to each other.

3. The micro-component mass transfer device according to claim 2, characterized in that, While one of the plurality of mobile platforms moves along the first direction, the laser beam moves along the second direction.

4. The micro-component mass transfer device according to claim 3, characterized in that, As the laser beam moves along the second direction, the substrate stage also moves along the second direction.

5. The micro-component mass transfer device according to claim 1, characterized in that, The rolling pressing mechanism includes rollers.

6. The micro-component mass transfer device according to claim 5, characterized in that, The rolling pressing mechanism also includes a buffer layer disposed on the roller.

7. The micro-component mass transfer device according to claim 6, characterized in that, The buffer layer consists of multiple buffer bumps that are separated from each other.

8. The micro-component mass transfer device according to claim 7, characterized in that, The roller has a roundness, and each of the plurality of buffer bumps has a thickness, wherein the roundness is less than the thickness.

9. The micro-component mass transfer device according to claim 1, characterized in that, The heating mechanism includes: A laser source, disposed in the second base platform and located on the side of the other of the plurality of movable platforms opposite to the rolling pressing mechanism, is adapted to irradiate another laser beam toward the contact area to heat the contact area, wherein each of the plurality of movable platforms has a light transmittance of more than 90% to the other laser beam.

10. The micro-component mass transfer device according to claim 1, characterized in that, The heating mechanism includes multiple heating units, which are distributed on the circumferential surface of the rolling pressing mechanism.

11. A method for manufacturing a micro-component panel, characterized in that, include: The target substrate is placed on a moving platform, which is adapted to move the target substrate to a predetermined position on a first base platform of a first transfer station, wherein the moving path of the moving platform extends between the first base platform of the first transfer station, the second base platform of the first thermal bonding station, the third base platform of the second transfer station, and the fourth base platform of the second thermal bonding station. A first micro-component substrate is placed on a first substrate platform at the first transfer station. The first substrate platform is adapted to move the first micro-component substrate along a first moving axis toward or away from the first base platform of the first transfer station. The first micro-component substrate has a first substrate and at least one first micro-component, and the at least one first micro-component is disposed on the surface of the first substrate facing the target substrate. The laser element of the first transfer station is used to irradiate the at least one first micro-element on the first micro-element substrate, causing the at least one first micro-element to detach from the first micro-element substrate and transfer to the target substrate; The target substrate is transferred from the first transfer station to the second base platform of the first thermal bonding station using a transfer mechanism. The transfer mechanism includes a rotating mechanism and four pick-up members. The first transfer station, the first thermal bonding station, the second transfer station, and the second thermal bonding station are arranged around the transfer mechanism. The four pick-up members are respectively arranged in the rotating mechanism at four positions corresponding to the first transfer station, the first thermal bonding station, the second transfer station, and the second thermal bonding station to transfer the target substrate. The movable stage is moved to a predetermined position on the second base platform, such that the target substrate having at least one first micro-element overlaps the first rolling pressing mechanism of the first thermal bonding station in the axial direction of the first moving axis, wherein when the target substrate passes through the first rolling pressing mechanism, the first rolling pressing mechanism rolls over each of the at least one first micro-element directly below it, and each of the at least one first micro-element has a first contact area with the first rolling pressing mechanism; The first contact area is heated to electrically bond the at least one first micro-element to the target substrate; The target substrate is transferred from the second base platform of the first thermal bonding site to the third base platform of the second transfer site using the transfer mechanism. Move the mobile platform to a predetermined position on the third base platform; The second micro-component substrate is placed on the second substrate platform of the second transfer station. The second substrate platform is adapted to move the second micro-component substrate along the second moving axis toward or away from the third base platform. The second micro-component substrate has a second substrate and at least one second micro-component, and the at least one second micro-component is disposed on the surface of the second substrate facing the target substrate. The laser element of the second transfer station is used to irradiate the at least one second micro-element on the second micro-element substrate, causing the at least one second micro-element to detach from the second micro-element substrate and transfer to the target substrate; The target substrate is transferred from the third base platform of the second transfer station to the fourth base platform of the second thermal bonding station using the transfer mechanism. The movable stage is moved to a predetermined position on the fourth base platform, such that the target substrate, on which at least one second micro-element is disposed, overlaps the second rolling pressing mechanism of the second thermal bonding site axially along the second moving axis. As the target substrate passes through the second rolling pressing mechanism, the second rolling pressing mechanism rolls over each of the at least one second micro-element directly beneath it, and each of the at least one second micro-element has a second contact area with the second rolling pressing mechanism. The second contact area is heated to electrically bond the at least one second micro-element to the target substrate.

12. The method for manufacturing a micro-component panel according to claim 11, characterized in that, The target substrate is adapted to move relative to the first base platform along a first direction or a second direction, and the first micro-element substrate is adapted to move along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other. The at least one first micro-element of the first micro-element substrate is a plurality of first micro-elements, and the plurality of first micro-elements are arranged on the first substrate along the first direction at a first pitch. After the plurality of first micro-elements detach from the first substrate and are transferred to the target substrate, the plurality of first micro-elements are arranged on the target substrate along the first direction at a second pitch, and the second pitch is greater than the first pitch.

13. The method for manufacturing a micro-component panel according to claim 11, characterized in that, The first rolling pressing mechanism and the second rolling pressing mechanism each include a roller and a buffer layer disposed on the roller. During the process of the roller of the first rolling pressing mechanism rolling the at least one first micro-element, the buffer layer of the first rolling pressing mechanism contacts the at least one first micro-element. During the process of the roller of the second rolling pressing mechanism rolling the at least one second micro-element, the buffer layer of the second rolling pressing mechanism contacts the at least one second micro-element.

14. The method for manufacturing a micro-component panel according to claim 13, characterized in that, The buffer layer consists of multiple buffer bumps that are separated from each other.

15. The method for manufacturing a micro-component panel according to claim 14, characterized in that, The width of any of the plurality of buffer bumps in the first rolling pressing mechanism is less than the width of each of the at least one first micro-element, and the width of any of the plurality of buffer bumps in the second rolling pressing mechanism is less than the width of each of the at least one second micro-element.

16. The method for manufacturing a micro-component panel according to claim 13, characterized in that, The step of heating the first contact area includes heating the roller of the first rolling pressing mechanism, and the step of heating the second contact area includes heating the roller of the second rolling pressing mechanism.

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