Display panel and manufacturing method thereof

Abstract

The present application discloses a display panel and a manufacturing method thereof. The manufacturing method of the display panel includes providing a substrate, and the substrate includes conductive pads. A conductive material layer is formed on the substrate. The conductive material layer is patterned to form at least two conductive parts. The conductive parts are disposed on the conductive pads. A light-emitting diode device is disposed on the conductive parts. In the embodiments of the present application, at least two conductive parts are formed by forming a conductive material layer on the substrate and patterning the conductive material layer. Compared with the existing technology of manufacturing conductive parts by using a brushing process, the precision of manufacturing conductive parts is improved.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display panel and a manufacturing method thereof. Background Art

[0002] Micro Light-Emitting Diode (Micro LED) display panels or Mini Light-Emitting Diode (Mini LED) have become one of the hotspots in future display technologies. Compared with current Organic Light-Emitting Diode (OLED) display panels and Liquid Crystal Display (LCD) devices, they have advantages such as fast response, high color gamut, high PPI, and low power consumption.

[0003] However, there are many technical difficulties and the technology is complex. The high-precision / high-speed transfer technology is an important technical bottleneck. The transfer technology includes a brushing process of a conductive part (such as conductive adhesive, solder paste, or flux). The precision of the conductive part brushing process determines the size of the smallest solder pad that can be supported and the gap between two adjacent solder pads, further affecting the size of the pitch, thereby determining the lower limit range of the pitch of Mini LED. Therefore, the high-precision conductive part brushing process has always been particularly important in the entire preparation process of Mini LED. At present, the main process of conductive part brushing is screen printing, that is, using the openings of a steel mesh as a mask template, and then using the brushing process to achieve front-side brushing on the surface of the steel mesh. The conductive part will remain where there are openings, thereby completing the conductive part brushing process. However, the precision of screen printing is not very high, and the low precision of the conductive part greatly limits the gap (Gap) and size (Size) of the Mini-LED solder pads. Moreover, the existing conductive part brushing requires repeated process debugging, which is time-consuming and laborious; and the biggest problem with screen printing is that it relies on a mask template. Different products require different mask templates, which are difficult to share and need to be frequently replaced, greatly increasing the process cost. Summary of the Invention

[0004] Embodiments of this application provide a display panel and a manufacturing method thereof, which are used to solve the technical problem of the low precision of the existing method for manufacturing a conductive part.

[0005] Embodiments of this application provide a manufacturing method of a display panel, including the following steps:

[0006] Provide a substrate, where the substrate includes conductive pads;

[0007] Form a conductive material layer on the substrate;

[0008] Pattern the conductive material layer to form at least two conductive portions, and the conductive portions are disposed on the conductive pads;

[0009] Dispose light-emitting diode devices on the conductive portions.

[0010] Optionally, in some embodiments provided by the present application, patterning the conductive material layer to form at least two conductive portions includes the following steps:

[0011] Use a laser to pattern the conductive material layer to form at least two of the conductive portions.

[0012] Optionally, in some embodiments provided by the present application, patterning the conductive material layer to form at least two conductive portions includes the following steps:

[0013] Dispose a mask on the substrate, the mask having a light-transmitting opening and a light-blocking portion, and the light-blocking portion corresponding to the conductive pad;

[0014] Use a laser to align with the light-transmitting opening to remove the conductive material layer corresponding to the light-transmitting opening, and form the conductive portions corresponding to the light-blocking portion.

[0015] Optionally, in some embodiments provided by the present application, patterning the conductive material layer to form at least two conductive portions includes the following steps:

[0016] Form a photoresist layer on the conductive material layer;

[0017] Dispose a mask on the conductive material layer, the mask having a light-transmitting opening and a light-blocking portion;

[0018] Use a laser to align with the light-transmitting opening to remove the photoresist layer corresponding to the light-transmitting opening;

[0019] Use an etching process to pattern the conductive material layer to form at least two of the conductive portions;

[0020] Strip the photoresist layer corresponding to the light-blocking portion.

[0021] Correspondingly, embodiments of the present application further provide a display panel, including:

[0022] A substrate, the substrate including conductive pads;

[0023] At least two conductive portions, the conductive portions being disposed on the conductive pads, wherein the conductive portions are formed by patterning a conductive material layer;

[0024] Light-emitting diode devices, the light-emitting diode devices being disposed on a side of the conductive portions away from the conductive pads.

[0025] Optionally, in some embodiments provided by the present application, the substrate includes:

[0026] a substrate;

[0027] a driving circuit layer disposed on the substrate, and the conductive pad is disposed on a side of the driving circuit layer away from the substrate.

[0028] Optionally, in some embodiments provided by the present application, the substrate includes a display area and a border area, the conductive pad includes a first conductive pad and a second conductive pad, the width of the first conductive pad is greater than the width of the second conductive pad, the first conductive pad corresponds to the display area, and the second conductive pad corresponds to the border area; the conductive portion includes a first conductive portion and a second conductive portion, the first conductive portion is disposed on the first conductive pad, and the second conductive portion is disposed on the second conductive pad.

[0029] Optionally, in some embodiments provided by the present application, the display panel further includes a driving chip, and the driving chip is disposed on a side of the second conductive portion away from the driving circuit layer.

[0030] Optionally, in some embodiments provided by the present application, the light-emitting diode device includes an LED chip and a connection pad disposed on a side of the LED chip close to the substrate.

[0031] Optionally, in some embodiments provided by the present application, the display panel is for direct display, and the LED chip is for displaying an image; or

[0032] the display panel further includes a liquid crystal cell, the liquid crystal cell is disposed on the light-emitting diode device, and the LED chip is for providing a backlight source.

[0033] Embodiments of the present application provide a display panel and a manufacturing method thereof. The manufacturing method of the display panel includes providing a substrate, and the substrate includes a conductive pad. Forming a conductive material layer on the substrate. Patterning the conductive material layer to form at least two conductive portions. The conductive portions are disposed on the conductive pads. Disposing a light-emitting diode device on the conductive portions. In the embodiments of the present application, by forming a conductive material layer on the substrate and patterning the conductive material layer to form at least two conductive portions, compared with the existing technology of manufacturing conductive portions by a brushing process, the precision of manufacturing the conductive portions is improved. Description of the Drawings

[0034] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0035] Figure 1 It is a schematic structural diagram of a display panel provided by an embodiment of the present application;

[0036] Figure 2 It is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application;

[0037] Figure 3 It is the first schematic diagram of a method for manufacturing a display panel provided by an embodiment of the present application;

[0038] Figure 4 It is the second schematic diagram of a method for manufacturing a display panel provided by an embodiment of the present application;

[0039] Figure 5 It is the third schematic diagram of a method for manufacturing a display panel provided by an embodiment of the present application. Detailed implementation manners

[0040] In order to make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the present application in detail with reference to the accompanying drawings. Please refer to the diagrams in the accompanying drawings, where the same component symbols represent the same components. The following description is based on the specific embodiments of the present application shown, and it should not be regarded as limiting other specific embodiments of the present application not described in detail herein. The term "embodiment" used in this specification means an instance, example, or illustration.

[0041] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0042] Embodiments of the present application provide a display panel and a manufacturing method thereof. The following will be described in detail respectively. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments.

[0043] The display panel provided by the present application will be elaborated in detail through specific embodiments below.

[0044] Embodiments of the present application provide a display panel. Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of the display panel provided by the embodiments of the present application. The display panel 100 includes a substrate 10, at least two conductive parts 20, a light-emitting diode device 30, an adhesive layer 40, and a driving chip 50. Among them, the conductive part 20 is formed by patterning a conductive material layer.

[0045] In some embodiments, the conductive part 20 is formed by laser cutting the conductive material layer.

[0046] The substrate 10 includes a display area AA and a border area NA. The substrate 10 includes a substrate 101, a driving circuit layer 102, and a conductive pad 103. The driving circuit layer 102 is disposed on the substrate 101. The conductive pad 103 is disposed on the driving circuit layer 102. The conductive pad 103 includes a first conductive pad 103a and a second conductive pad 103b. The first conductive pad 103a corresponds to the display area AA. The second conductive pad 103b corresponds to the border area NA. The conductive part 20 includes a first conductive part 201 and a second conductive part 202. The first conductive part 201 is disposed on the first conductive pad 103a. The second conductive part 202 is disposed on the second conductive pad 103b. The driving chip 50 is disposed on the second conductive part 202.

[0047] The light-emitting diode device 30 includes an LED chip 301 and a connection pad 302 disposed on the LED chip 301. The connection pad 302 is disposed on the first conductive part 201. The following will describe in detail the method for manufacturing the display panel 100 using specific embodiments.

[0048] It should be noted that the display panel 100 of the embodiments of the present application can be used for direct display, and the LED chip 301 is used for displaying images.

[0049] In some embodiments, the display panel 100 may further include a liquid crystal cell, and the liquid crystal cell is disposed on the light-emitting diode device 30. The LED chip 301 is used to provide a backlight source.

[0050] Correspondingly, embodiments of the present application provide a manufacturing method of a display panel. Please refer to Figure 2 , Figure 2A flowchart showing the steps of a method for manufacturing a display panel provided by an embodiment of the present application. The method for manufacturing a display panel includes providing a substrate, the substrate including conductive pads. A conductive material layer is formed on the substrate. The conductive material layer is patterned to form at least two conductive portions. The conductive portions are disposed on the conductive pads. A light-emitting diode device is disposed on the conductive portions. In the embodiment of the present application, at least two conductive portions are formed by forming a conductive material layer on the substrate and patterning the conductive material layer. Compared with the existing technology of manufacturing conductive portions by a brushing process, the accuracy of manufacturing the conductive portions is greatly improved.

[0051] The following elaborates in detail on the method for manufacturing a display panel provided by the embodiment of the present application through specific embodiments.

[0052] An embodiment of the present application provides a method for manufacturing a display panel. Please refer to Figure 3 , Figure 3 FIG. 1 is a first schematic diagram showing the method for manufacturing a display panel provided by the embodiment of the present application. The method for manufacturing a display panel includes the following steps:

[0053] Step B101: Provide a substrate 10, the substrate 10 including conductive pads 103.

[0054] In some embodiments, step B101 includes providing a substrate 101. Next, a driving circuit layer 102 is formed on the substrate 101. Finally, conductive pads 103 are formed on a side of the driving circuit layer 102 away from the substrate 101.

[0055] Among them, the substrate 101 may be a glass substrate, a BT (Bismalemide Triazine) substrate, a printed circuit board substrate, or an aluminum substrate.

[0056] Among them, the substrate 10 includes a display area AA and a border area NA. The border area NA is located on one side of the display area AA. The conductive pads 103 include a first conductive pad 103a and a second conductive pad 103b. The first conductive pad 103a corresponds to the display area AA. The second conductive pad 103b corresponds to the border area NA.

[0057] In some embodiments, the conductive pads 103 may be formed by a single yellow light process.

[0058] Step B102: Form a conductive material layer 200 on the substrate 10.

[0059] In some embodiments, the conductive material layer 200 is formed on the substrate 10 by processes such as sputtering and chemical vapor deposition.

[0060] Among them, the material of the conductive material layer 200 can be selected from one or more of anisotropic conductive adhesive (ACA), anisotropic conductive adhesive, metal solder, solder paste, flux, liquid metal, etc., but is not limited thereto.

[0061] Step B103: Pattern the conductive material layer 200 to form at least two conductive parts 20. The conductive parts 20 are arranged on the conductive pads 103.

[0062] In some embodiments, step B103 includes patterning the conductive material layer 200 with a laser L to form at least two conductive parts 20.

[0063] First, cut the conductive material layer 200 with a laser L to form two spaced conductive parts 20. Subsequently, move the laser light source to a preset distance in the area where the conductive material layer 200 is located, and turn on the laser light source again to irradiate the conductive material layer 200, thereby forming the conductive parts 20. Among them, the preset distance is the horizontal distance between the centers of two adjacent conductive parts 20. In the example of the present application, the conductive material layer 200 is directly irradiated with a laser. Since the laser has high energy, when the laser acts on the surface of the conductive material layer 200, the released energy causes the conductive material layer 200 to melt and evaporate to achieve the purpose of cutting.

[0064] In some embodiments, the phenomenon of excessive cutting can be prevented by adjusting the laser irradiation time.

[0065] In some embodiments, after the step of forming the conductive parts 20, the present application embodiment can also use circulating air to process the substrate 10 to remove the conductive particles that are re-cured on the substrate 10, so as to prevent the melted conductive material layer 200 from being re-cured at a low temperature, resulting in device short circuit.

[0066] In some embodiments, the laser L can be any one of a laser laser, an excimer laser or a solid-state laser.

[0067] In the embodiment of the present application, due to the advantages of high precision, high speed and high collimation of the laser direct imaging technology, therefore, using the laser L as a light source to cut the conductive material layer 200 to form a plurality of conductive parts 20 arranged in an array can improve the precision of manufacturing the conductive parts 20.

[0068] Among them, the conductive part 20 includes a first conductive part 201 and a second conductive part 202. The first conductive part 201 is arranged on the first conductive pad 103a. The second conductive part 202 is arranged on the second conductive pad 103b.

[0069] In some embodiments, the width of the first conductive portion 201 is greater than the width of the second conductive portion 202. Therefore, when patterning the conductive material layer 200 using the laser L, it is only necessary to increase the cutting range of the second conductive portion 202. In the embodiments of the present application, the first conductive portion 201 and the second conductive portion 202 can be formed through a single laser imaging process, greatly shortening the production time and production cost of the display panel.

[0070] In some embodiments, after the step of patterning the conductive material layer 200 to form at least two conductive portions 20, it further includes disposing a driving chip 50 on the second conductive portion 202. The driving chip 50 is used to drive the display panel to emit light.

[0071] Step B104: Dispose a light-emitting diode device 30 on the conductive portion 20.

[0072] The light-emitting diode device 30 includes an LED chip 301 and a connection pad 302 disposed on the LED chip 301. Step B104 includes disposing the connection pad 302 on the first conductive portion 201 to form the display panel 100.

[0073] In some embodiments, the light-emitting diode device 30 is mounted on the first conductive portion 201 through Surface Mounted Technology (SMT).

[0074] The LED chip 301 can be a Mini LED chip or a Micro LED chip.

[0075] In some embodiments, the LED chip includes a substrate, a first electrode portion, and a second electrode portion. The first electrode portion and the second electrode portion protrude from the surface of the substrate close to the substrate 10. The height of the second electrode portion is lower than the height of the first electrode portion. The connection pad 302 is disposed on the first electrode portion and the second electrode portion. When the LED chip 301 is bonded and pressed with the substrate 10, the first electrode portion is pressed onto a first conductive portion 201. The second electrode portion is pressed onto another first conductive portion 201.

[0076] In some embodiments, after the step of disposing the light-emitting diode device 30 on the conductive portion 20, it may further include forming an adhering layer 40 between the substrate 10 and the light-emitting diode device 30 for adhering the substrate 10 and the light-emitting diode device 30. The adhering layer 40 corresponds to the display area AA. The adhering layer 40 is used to tightly bond the substrate 10 and the light-emitting diode device 30 together, and at the same time completely wrap the first conductive pad 103a, the first conductive portion 201, and the connection pad 302, which not only ensures the tight fit between the substrate 10 and the light-emitting diode device 30, enhances the bonding reliability between the substrate 10 and the light-emitting diode device 30, but also forms a protective layer between the first conductive portion 201 and the connection pad 302 to block the intrusion of water and oxygen on the first conductive portion 201 and the connection pad 302.

[0077] In some embodiments, the adhering layer 40 is a commonly used silicone hydrogel, acrylic hydrogel, epoxy glue, polyurethane, etc.

[0078] In the method for manufacturing a display panel provided in the present application, the conductive material layer 200 is cut by using laser imaging technology. Since the laser imaging process has advantages such as high precision, high speed, and high collimation, the conductive material layer 200 can be cut into a plurality of conductive portions 20 with a small gap. Compared with the prior art of using a brushing process to manufacture the conductive portion, the precision of manufacturing the conductive portion 20 is greatly improved, the pitch is further reduced, and the process cost is reduced. Moreover, the method for manufacturing a display panel provided in the embodiments of the present application can achieve a larger slope angle (Tape) to meet the diverse needs of customers. In addition, the method for manufacturing a display panel provided in the embodiments of the present application has strong practicability and a fast production speed.

[0079] Please refer to Figure 4 , Figure 4 is the second schematic diagram of the method for manufacturing a display panel provided in the embodiments of the present application. The difference between the method for manufacturing a display panel provided in the embodiments of the present application and the method for manufacturing a display panel in Figure 2 is that the step of patterning the conductive material layer 200 to form at least two conductive portions 20 includes disposing a mask plate M on the substrate 10. The mask plate M has a light-transmitting opening T and a non-light-transmitting portion NT, and the non-light-transmitting portion NT corresponds to the conductive pad 103. The laser L is aligned with the light-transmitting opening T to remove the conductive material layer 200 corresponding to the light-transmitting opening T, and form a conductive portion 20 corresponding to the non-light-transmitting portion NT.

[0080] In an embodiment of the present application, by disposing a mask M on the substrate 10 such that the non-transmissive portion NT of the mask M corresponds to the conductive pad 103, and then aligning the laser L with the light transmissive opening T to remove the conductive material layer 200 corresponding to the light transmissive opening T, the conductive portion 20 is thus formed. That is, the step of patterning the conductive material layer 200 provided in the embodiment of the present application only requires aligning the laser light source with the light transmissive opening T and moving the laser L within the plane where the mask is located to form a plurality of conductive portions 20 arranged in an array. Compared with the prior art technique of fabricating the conductive portion using a brushing process, the accuracy of fabricating the conductive portion 20 is greatly improved, and the manufacturing time of the display panel is greatly shortened. In some embodiments, the conductive portion 20 includes a first conductive portion 201 and a second conductive portion 202. Among them, the first conductive portion 201 is used to bond the first conductive pad 103a and the connection pad 302. The second conductive portion 202 corresponds to the border area NA, and is used to bond the driving chip 50 and the driving circuit layer 102 to drive the display panel 100 to display.

[0081] In some embodiments, the width of the first conductive portion 201 is greater than the width of the second conductive portion 202. Therefore, when setting the mask M, the width of the mask M of the non-transmissive portion NT corresponding to the second conductive pad 103b can be reduced. Therefore, in the embodiment of the present application, the first conductive portion 201 and the second conductive portion 202 can be formed by a single laser imaging process, greatly shortening the manufacturing time and manufacturing cost of the display panel.

[0082] Please refer to Figure 5 , Figure 5 FIG. 3 is a third schematic diagram of the method for manufacturing a display panel provided by an embodiment of the present application. The difference between the method for manufacturing a display panel provided by an embodiment of the present application and the method for manufacturing a display panel provided by Figure 3 is that the step of patterning the conductive material layer 200 to form at least two conductive portions 20 includes forming a photoresist layer PL on the conductive material layer 200. A mask M is disposed on the conductive material layer 200. The mask M has a light transmissive opening T and a non-transmissive portion NT. The photoresist layer PL is patterned to remove the photoresist layer PL corresponding to the light transmissive opening T. The conductive material layer 200 is patterned using an etching process to form at least two conductive portions 20. The photoresist layer PL corresponding to the non-transmissive portion NT is stripped.

[0083] In the method for manufacturing a display panel provided by the present application, by forming a photoresist layer PL on the conductive material layer 200, patterning the photoresist layer PL, and then patterning the conductive material layer 200 using an etching process to form an array of conductive portions 20. Compared with the prior art technique of fabricating the conductive portion using a brushing process, the accuracy of fabricating the conductive portion 20 is greatly improved, and the manufacturing time of the display panel is greatly shortened.

[0084] In some embodiments, patterning the photoresist layer PL includes aligning a laser L with the light transmissive opening T to remove the photoresist layer PL corresponding to the light transmissive opening T. In the embodiments of the present application, a method of using a laser L to assist the yellow light process is utilized to form a plurality of electrically conductive portions 20 arranged in an array. This method combines the advantages of high collimation and high energy of laser imaging and the yellow light process, promoting the rapid industrialization process of Mini LED display panels and Mirco LED display panels.

[0085] In some embodiments, patterning the photoresist layer PL may further include aligning ultraviolet light with the light transmissive opening T to remove the photoresist layer PL corresponding to the light transmissive opening T. In the embodiments of the present application, a method of using the yellow light process is utilized to form a plurality of electrically conductive portions 20 arranged in an array. This method promotes the rapid industrialization process of Mini LED display panels and Mirco LED display panels.

[0086] In summary, although the present application has been disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Those of ordinary skill in the art can make various modifications and refinements without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be subject to the scope defined by the claims.

Claims

1. A method for manufacturing a display panel, characterized in that Comprising the following steps: Providing a substrate, the substrate comprising conductive pads; Forming a conductive material layer on the substrate, the material of the conductive material layer comprising one or more of anisotropic conductive adhesive, anisotropic conductive binder, metal solder, solder paste, flux, liquid metal; Patterning the conductive material layer to form at least two conductive portions, the conductive portions being disposed on the conductive pads; Disposing a light-emitting diode device on the conductive portions; Wherein, patterning the conductive material layer to form at least two conductive portions comprises one of the following steps: Patterning the conductive material layer by laser to form at least two of the conductive portions; Providing a mask on the substrate, the mask having a light-transmitting opening and a non-light-transmitting portion, the non-light-transmitting portion corresponding to the conductive pad; aligning a laser with the light-transmitting opening to remove the conductive material layer corresponding to the light-transmitting opening, forming the conductive portions corresponding to the non-light-transmitting portion; or Forming a photoresist layer on the conductive material layer; providing a mask on the conductive material layer, the mask having a light-transmitting opening and a non-light-transmitting portion; aligning a laser with the light-transmitting opening to remove the photoresist layer corresponding to the light-transmitting opening; patterning the conductive material layer by an etching process to form at least two of the conductive portions; stripping the photoresist layer corresponding to the non-light-transmitting portion.

2. A display panel, characterized in that, Comprising a display panel manufactured by the method for manufacturing a display panel according to claim 1, the display panel comprising: The substrate, the substrate comprising conductive pads; At least two of the conductive portions, the conductive portions being disposed on the conductive pads; The light-emitting diode device, the light-emitting diode device being disposed on a side of the conductive portion away from the conductive pad.

3. The display panel according to claim 2, wherein The substrate comprises: A substrate; A driving circuit layer disposed on the substrate, the conductive pads being disposed on a side of the driving circuit layer away from the substrate.

4. The display panel according to claim 3, wherein The substrate comprises a display area and a border area, the conductive pads comprise a first conductive pad and a second conductive pad, the width of the first conductive pad is greater than the width of the second conductive pad, the first conductive pad corresponds to the display area, the second conductive pad corresponds to the border area; the conductive portions comprise a first conductive portion and a second conductive portion, the first conductive portion is disposed on the first conductive pad, the second conductive portion is disposed on the second conductive pad.

5. The display panel according to claim 4, wherein The display panel further comprises a driving chip, the driving chip being disposed on a side of the second conductive portion away from the driving circuit layer.

6. The display panel according to claim 3, wherein The light-emitting diode device comprises an LED chip and a connection pad disposed on a side of the LED chip close to the substrate.

7. The display panel according to claim 6, wherein The display panel is for direct display, the LED chip is for displaying an image; or The display panel further comprises a liquid crystal cell, the liquid crystal cell being disposed on the light-emitting diode device, the LED chip being for providing a backlight source.

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