Flexible circuit board, method for preparing flexible circuit board and display device

Abstract

The present invention provides a flexible circuit board, a method for preparing the flexible circuit board and a display device, which solves the problem that copper ions of a voltage signal line migrate and cause the insulating layer to burn. The flexible circuit board comprises: a plurality of drive signal lines arranged with mutually insulated gates, the drive signal lines comprising at least two adjacently arranged voltage signal lines; and at least one isolation protection line, the isolation protection line being located between the two adjacently arranged voltage signal lines.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a flexible circuit board, a method for preparing the flexible circuit board, and a display device. Background Art

[0002] The flexible circuit boards in existing displays all include adjacent VDD1 signals and VDD2 signals. Since VDD1 and VDD2 are a pair of adjacent high and low voltage signals, copper ions in the conductive layer of the pins migrate and cause the insulating layer to burn out. Summary of the invention

[0003] In view of this, the present invention provides a flexible circuit board, a method for preparing the flexible circuit board and a display device, which solve the problem of the insulating layer being burned due to the migration of copper ions of the pins.

[0004] A flexible circuit board provided by an embodiment of the present invention comprises: a plurality of drive signal lines insulated from each other, wherein the drive signal lines comprise at least two voltage signal lines arranged adjacent to each other;

[0005] At least one isolation protection line, wherein the isolation protection line is located between the two adjacent voltage signal lines.

[0006] In one implementation, no voltage signal is passed into the isolation protection line.

[0007] In one implementation, when the flexible circuit board is connected to an external power source, the isolation protection line is configured not to be connected to the external power source, or the isolation protection line is grounded.

[0008] In one embodiment, the voltage signal line includes:

[0009] Conductive layer and planar layer;

[0010] an insulating layer disposed between the conductive layer and the planar layer;

[0011] The electrode layer is arranged on a side of the planar layer away from the conductive layer.

[0012] In one embodiment, the isolation protection line includes:

[0013] Conductive layer and planar layer;

[0014] an insulating layer disposed between the conductive layer and the planar layer;

[0015] The electrode layer is arranged on a side of the planar layer away from the conductive layer.

[0016] In one embodiment, the voltage signal line includes at least two voltage signal pins;

[0017] The isolation protection line includes at least one isolation protection pin.

[0018] A method for preparing a flexible circuit board, comprising:

[0019] Prepare a plurality of drive signal lines with mutually insulated gates, wherein the drive signal lines include at least two adjacently arranged voltage signal lines;

[0020] An isolation protection line is prepared between the two adjacent voltage signal lines.

[0021] In one embodiment, the voltage signal line includes at least two voltage signal pins;

[0022] The isolation protection line includes at least one isolation protection pin.

[0023] In one implementation, the voltage signal pin and the isolation protection pin are prepared in the same layer.

[0024] A display device comprises any one of the above-mentioned flexible circuit boards.

[0025] The embodiments of the present invention provide a flexible circuit board, a method for preparing the flexible circuit board, and a display device, wherein the flexible circuit board includes a plurality of mutually insulated drive signal lines, wherein the drive signal lines include at least two adjacently arranged voltage signal lines; and at least one isolation protection line, wherein the isolation protection line is located between the two adjacently arranged voltage signal lines. The present invention sets an isolation protection line between adjacently arranged voltage signal lines, and since the isolation protection line plays a blocking role, the occurrence of the undesirable phenomenon of copper ions migrating and causing the insulation layer to burn is prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The figure shows a distribution diagram of a VDD1 signal pin and a VDD2 signal pin in the prior art.

[0027] Figure 2 The figure shows a distribution diagram of a VDD1 signal pin and a VDD2 signal pin in the prior art.

[0028] Figure 3 FIG. 1 is a time signal diagram of a VDD1 signal and a VDD2 signal in a frame in the prior art.

[0029] Figure 4 FIG. 1 is a schematic diagram showing the state of the art when water vapor enters the interior of the array substrate glass.

[0030] Figure 5 Shown is a schematic diagram of electrochemical corrosion of copper ions in the prior art.

[0031] Figure 6 FIG. 1 is a schematic diagram of chip pin distribution in an embodiment of the present invention.

[0032] Figure 7 FIG. 1 is a schematic diagram of chip pin distribution in an embodiment of the present invention.

[0033] Figure 8 FIG. 1 is a schematic diagram of the structure of an isolation protection line in an embodiment of the present invention.

[0034] Fig. 9 FIG. 1 is a schematic diagram of a process for preparing an isolation protection line in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] The existing flexible circuit board includes a plurality of voltage signal lines. For example, the flexible circuit board includes a first voltage signal line and a second voltage signal line arranged adjacent to each other. Figure 1 and Figure 2 As shown, the first voltage signal is a VDD1 signal, and the second voltage signal is a VDD2 signal. Since VDD1 and VDD2 are a pair of adjacent high and low voltage signals, copper ions in the conductive layer of the pin migrate and cause the insulating layer to burn. In view of the above problem, the present invention provides an isolation protection line between adjacent voltage signal lines to play a blocking role, preventing copper ions from migrating and causing the insulating layer to burn. The specific method is described in the following embodiment.

[0037] In one embodiment of the present invention, the inventor of the present application has found that the signal diagram of the VDD1 signal and the VDD2 signal within one frame time is as follows: Figure 3 As shown, in the first half of a cycle, VDD1 is high and VDD2 is low; in the second half of a cycle, VDD2 is high and VDD1 is low. Optionally, the time of a cycle can be 2s, 2.5s or 3s, etc. The present invention does not limit the time of a frame. It can be seen that VDD1 and VDD2 are a pair of signals with opposite levels, that is, when working, VDD1 and VDD2 are a pair of adjacent high and low voltage signals. Since there is a pressure difference signal between the VDD1 signal line and the VDD2 signal line, and water vapor is prone to enter near the optical glue of the flexible circuit board (such as Figure 4As shown in the figure, when water vapor enters the inside of the array substrate glass, a large amount of electrolyte is provided near the pin end. Since the chip pin is made of copper and there is a voltage difference between the two ends, these three points just meet the sufficient and necessary conditions for electrochemical corrosion. In a high temperature and high humidity environment, electrochemical corrosion is very likely to occur, forming the following Figure 5 The electrochemical corrosion shown in the figure causes the pin to be unable to provide normal signals to the display panel. The corrosion phenomenon that occurs in the actual flexible circuit board during use. To solve the above problem, the present invention adds an isolation protection line between adjacent voltage signal lines, and the specific solution is described in the following embodiment.

[0038] Figure 6 FIG. 1 is a schematic diagram of chip pin distribution in an embodiment of the present invention. Figure 7 FIG. 1 is a schematic diagram of chip pin distribution in an embodiment of the present invention.

[0039] refer to Figure 6 and Figure 7 , the flexible circuit board includes a plurality of drive signal lines with mutually insulated gates, wherein the plurality of drive signal lines with mutually insulated gates may include: voltage signal lines and clock signal lines, etc. Among them, the plurality of drive signal lines with mutually insulated gates include at least two adjacently arranged voltage signal lines. In addition to the plurality of voltage signal lines, the flexible circuit board also includes at least one isolation protection line, wherein each of the isolation protection lines is arranged between adjacent voltage signal lines, and the isolation protection line is a virtual signal line. It can be understood that the isolation protection line simply plays the role of isolation protection between adjacent voltage signal lines, the purpose of which is to prevent the copper ions of adjacent voltage signal lines from electronic migration. In addition, the isolation protection line does not affect the normal function of the flexible circuit board.

[0040] In one embodiment of the present invention, the isolation protection line does not pass voltage signals, so the isolation protection line itself does not have a voltage level and does not affect the normal function of the flexible circuit board. Therefore, the isolation protection line can only play an isolation protection role to prevent the copper ions of adjacent voltage signal lines from migrating and causing the insulating layer to burn out.

[0041] In one embodiment of the present invention, the isolation protection line is a virtual line, and the virtual line can be set in such a way that when the flexible circuit board is connected to an external power supply, the isolation protection line is set to be disconnected from the external power supply, or the isolation protection line is grounded. Setting the isolation protection line to be disconnected from the external power supply or grounded can make the isolation protection line itself have no electrical level and does not affect the normal function of the flexible circuit board. Therefore, the isolation protection line can only play a blocking role to prevent the migration of copper ions and cause the insulating layer to burn out.

[0042] In one embodiment of the present invention, optionally, the flexible circuit board includes two voltage signal lines, namely, a first voltage signal line and a second voltage signal line, the first voltage signal line is led out from the first voltage signal pin, and the second voltage signal line is led out from the second voltage signal pin. The first voltage signal line and the second voltage signal line are a pair of signals with opposite levels, that is, when working, the first voltage signal line and the second voltage signal line are a pair of adjacent high and low voltage signals, and there is a voltage difference signal between the first voltage signal pin and the second voltage signal pin. The flexible circuit board also includes an isolation protection line, which is located between the first voltage signal line and the second voltage signal line. This isolation protection line is a virtual signal line. It can be understood that the virtual protection line simply plays the role of isolation protection between adjacent voltage signal lines, the purpose of which is to prevent the copper ions of the adjacent voltage signal lines from electronic migration. In addition, the isolation protection line does not affect the normal function of the flexible circuit board. The isolation protection line can play the role of isolation protection between the first voltage signal line and the second voltage signal line, preventing the metal copper ions of the first voltage signal line and the second voltage signal line from migrating, thereby avoiding the burning of the insulating layer.

[0043] In one embodiment of the present invention, Figure 8 As shown, the structure of the voltage signal line is the same as that of the isolation protection line. The structure of the isolation protection line includes a conductive layer 01 and a flat layer 03; an insulating layer 02 arranged between the conductive layer 01 and the flat layer 03; and an electrode layer 04 arranged on the side of the flat layer 03 away from the conductive layer 01. Similarly, the structure of the voltage signal line may also include a conductive layer 01 and a flat layer 03; an insulating layer 02 arranged between the conductive layer 01 and the flat layer 03; and an electrode layer 04 arranged on the side of the flat layer 03 away from the conductive layer 01. The conductive layer 01 of the voltage signal line and the conductive layer 01 of the isolation protection line may be arranged in the same layer; the insulating layer 02 of the voltage signal line and the insulating layer 02 of the isolation protection line may be arranged in the same layer; and the flat layer 03 of the voltage signal line and the flat layer 03 of the isolation protection line may be arranged in the same layer. The electrode layer 04 of the voltage signal line and the electrode layer 04 of the isolation protection line may be arranged in the same layer.

[0044] Optionally, the material of the conductive layer 01 of the isolation protection line includes metal, such as MoNbCu, etc. In addition, the conductive layer 01 of the isolation protection line can also be made of other materials, and the present invention does not limit the material of the conductive layer 01 of the isolation protection line.

[0045] Optionally, the material of the insulating layer 02 of the isolation protection line includes SiN x In addition, the insulating layer 02 of the isolation protection line can also be made of other materials, and the present invention does not limit the material of the insulating layer 02 of the isolation protection line.

[0046] Optionally, the material of the planar layer 03 of the isolation protection line includes SiN x In addition, the flat layer 03 of the isolation protection line can also be made of other materials, and the present invention does not limit the material of the flat layer 03 of the isolation protection line.

[0047] Optionally, the material of the electrode layer 04 of the isolation protection line includes IN203SnO2. In addition, the electrode layer 04 of the isolation protection line can also be made of other materials. The present invention does not limit the material of the electrode layer 04 of the isolation protection line.

[0048] In one embodiment of the present invention, the voltage signal line includes at least two voltage signal pins; the isolation protection line includes at least one isolation protection pin. The isolation protection pin is a virtual pin, and the virtual pin can be set in such a way that when the flexible circuit board is connected to an external power supply, the isolation protection pin is set to be not connected to the external power supply, or the isolation protection pin is grounded. Setting the isolation protection pin to be not connected to the external power supply or to be grounded can make the isolation protection pin itself have no electrical level and does not affect the normal function of the flexible circuit board. Therefore, the isolation protection pin can only play a blocking role to prevent the migration of copper ions and cause the occurrence of the undesirable phenomenon of burning of the insulating layer.

[0049] In one embodiment of the present invention, a method for preparing a flexible circuit board includes: preparing a plurality of mutually insulated drive signal lines, wherein the drive signal lines include at least two adjacently arranged voltage signal lines; and preparing an isolation protection line between the two adjacently arranged voltage signal lines. The present invention prepares an isolation protection line between adjacently arranged voltage signal lines, so that the isolation protection line plays a blocking role, thereby preventing the occurrence of the undesirable phenomenon of copper ions migrating and causing the insulation layer to burn.

[0050] In one embodiment of the present invention, the voltage signal line includes at least two voltage signal pins; the isolation protection line includes at least one isolation protection pin. The method for preparing a flexible circuit board also includes: preparing at least two voltage signal pins, the at least two voltage signal pins lead out the voltage signal line; preparing at least one isolation protection pin, the at least one isolation protection pin leads out the isolation protection line.

[0051] In one embodiment of the present invention, the voltage signal line and the isolation protection line can be prepared in the same layer. Optionally, the preparation process of the isolation protection line can be the same as that of the voltage signal line. Fig. 9As shown, the preparation method of the isolation protection line includes: forming an insulating layer 02 on a conductive layer 01; forming a flat layer 03 on the insulating layer 02, etching the flat layer 03 to form a pattern, and depositing an electrode layer 04 on the flat layer 03. Similarly, the preparation method of the voltage signal line includes: forming an insulating layer 02 on a conductive layer 01; forming a flat layer 03 on the insulating layer 02, etching the flat layer 03 to form a pattern, and depositing an electrode layer 04 on the flat layer 03. The conductive layer 01 of the voltage signal line and the conductive layer 01 of the isolation protection line are the same layer and can be prepared simultaneously; the insulating layer 02 of the voltage signal line and the insulating layer 02 of the isolation protection line are the same layer and can be prepared simultaneously; the planarization layer of the voltage signal line and the planarization layer of the isolation protection line are the same layer and can be prepared simultaneously; the electrode layer 04 of the voltage signal line and the electrode layer 04 of the isolation protection line are the same layer and can be prepared simultaneously.

[0052] In one embodiment of the present invention, the flexible circuit board can be packaged using Chip On Flex (COF). Chip On Film is a soft film assembly technology that fixes the integrated circuit (IC) on the flexible circuit board, and uses a soft additional circuit board as a package chip carrier to combine the chip with the soft substrate circuit, or refers to a soft additional circuit board without a packaged chip, including tape and reel packaging production (TAB substrate, whose process is called TCP), soft board connection chip assembly, and soft IC carrier packaging.

[0053] In one embodiment of the present invention, the display device includes the flexible circuit board described in the above embodiment. It can be understood that the display device can be an electronic display device such as a mobile phone or a computer. The types of display devices are diverse and optional. The present invention does not limit the specific type of the display device.

[0054] In one embodiment of the present invention, a display panel is further included, and the display panel is arranged on a flexible circuit board. One end of the isolation protection pin is not connected to the circuit inside the display panel, and the other end of the isolation protection pin is not connected to the external power supply, or the isolation protection pin is grounded. It can be understood that the isolation protection pin is a virtual pin. Among them, the isolation protection pin is arranged on one side of the display panel. The present invention sets an isolation protection pin on one side of the display panel to prevent electrochemical corrosion between adjacent pins due to the voltage difference between adjacent voltage signals when the display panel is driven normally, and copper ions migrate, causing copper metal corrosion of the pins, resulting in no voltage signal when the display panel is driven normally, thereby causing a poor display terminal phenomenon.

[0055] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0056] The block diagrams of devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems may be connected, arranged, or configured in any manner.

[0057] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0058] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0059] In the description of the application, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise clearly and specifically limited. In the embodiment of the present application, all directional indications (such as up, down, left, right, front, back, top, bottom ...) are only used to explain the relative position relationship, motion conditions, etc. between the components under a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their deformations are intended to cover non-exclusive inclusions. For example, the process, method, system, product or equipment comprising a series of steps or units are not limited to the steps or units listed, but optionally also include the steps or units not listed, or optionally also include other steps or units inherent to these processes, methods, products or equipment.

[0060] The embodiments of the present application and the features therein can be combined with each other without conflict, and the technical solutions formed are within the protection scope of the present application. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0061] The embodiments of the present application and the various features in the embodiments can be combined with each other without conflict, and the technical solutions formed are within the scope of protection of the present application. In the accompanying drawings, for clarity, the sizes and relative sizes of the layers and regions may be exaggerated. The same reference numerals represent the same elements from beginning to end. It should be understood that although the terms "first", "second", "third" and the like can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part. It will be appreciated that spatially relative terms such as "above", "above", "below", "below", etc., may be used herein for convenience of description to describe the relationship of one element or feature to other elements or features shown in the figures. It will be appreciated that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation shown in the figures. For example, if the device in the figures is turned over, then elements or features described as "below other elements" would be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "under" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptors used herein interpreted accordingly.

[0062] Embodiments of the present application are described herein with reference to cross-sectional views that are schematic diagrams of ideal embodiments (and intermediate structures) of the present application. Thus, variations from the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments of the present application should not be limited to the specific shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing.

[0063] In order to thoroughly understand the present application, detailed structures and steps will be presented in the following description to illustrate the technical solution proposed by the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0064] In addition, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0065] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A flexible circuit board, characterized in that: include: A plurality of drive signal lines are arranged with mutually insulated gates, wherein the drive signal lines include a first voltage signal line and a second voltage signal line arranged adjacent to each other; the first voltage signal and the second voltage signal are a pair of signals with opposite levels, and in the first half of a cycle time, the first voltage signal is at a high level and the second voltage signal is at a low level; in the second half of a cycle time, the second voltage signal is at a high level and the first voltage signal is at a low level, and there is a voltage difference signal between the first voltage signal line and the second voltage signal line; at least one virtual isolation protection line, the virtual isolation protection line being located between the first voltage signal line and the second voltage signal line; When the flexible circuit board is connected to an external power source, the virtual isolation protection line is configured not to be connected to the external power source, or the virtual isolation protection line is grounded.

2. The flexible circuit board according to claim 1, characterized in that: The virtual isolation protection line does not allow voltage signals to pass through it.

3. The flexible circuit board according to claim 1, characterized in that: The voltage signal line comprises: Conductive layer and planar layer; an insulating layer disposed between the conductive layer and the planar layer; The electrode layer is arranged on a side of the planar layer away from the conductive layer.

4. The flexible circuit board according to claim 1, characterized in that: The virtual isolation protection line includes: Conductive layer and planar layer; an insulating layer disposed between the conductive layer and the planar layer; The electrode layer is arranged on a side of the planar layer away from the conductive layer.

5. The flexible circuit board according to claim 1, characterized in that: The voltage signal line includes at least two voltage signal pins; The virtual isolation protection line includes at least one isolation protection pin.

6. A method for preparing a flexible circuit board, characterized in that: include; A plurality of mutually insulated drive signal lines are prepared, wherein the drive signal lines include a first voltage signal line and a second voltage signal line that are adjacently arranged; the first voltage signal and the second voltage signal are a pair of signals with opposite levels, and in the first half of a cycle, the first voltage signal is at a high level and the second voltage signal is at a low level; in the second half of a cycle, the second voltage signal is at a high level and the first voltage signal is at a low level, and there is a voltage difference signal between the first voltage signal line and the second voltage signal line; A virtual isolation protection line is prepared between two adjacent first voltage signal lines and a second voltage signal line. When the flexible circuit board is connected to an external power supply, the virtual isolation protection line is set to be disconnected from the external power supply, or the virtual isolation protection line is grounded.

7. The method for preparing a flexible circuit board according to claim 6, characterized in that: The voltage signal line includes at least two voltage signal pins; The virtual isolation protection line includes at least one isolation protection pin.

8. The method for preparing a flexible circuit board according to claim 7, characterized in that: The voltage signal pin and the isolation protection pin are prepared on the same layer.

9. A display device, characterized in that: A flexible circuit board comprising any one of claims 1 to 5.

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