A POE power supply module
By integrating capacitors, overvoltage protection and rectifier bridges and forming a package structure, the problem of large space occupancy of POE power supply modules in the prior art is solved, and the miniaturization of electronic products is realized.
Patent Information
- Application Number
- CN202210589662.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-05-27
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2042-05-27
AI Technical Summary
The existing POE power supply modules take up a lot of space on PCB boards, making it difficult to miniaturize electronic products.
A POE power supply module is designed to form a POE power supply through integrated capacitors, overvoltage protection and at least one set of rectifier bridges, and a POE power supply through a specific connection relationship to form a package structure to reduce the occupied area.
The integration of POE power supply has been achieved, greatly reducing the area occupied on the PCB board, which is conducive to the miniaturization of electronic products.
Smart Images
Figure CN114980505B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic component packaging, and particularly to a POE power supply module. Background Art
[0002] POE (Power Over Ethernet) refers to a technology that, without making any changes to the existing Ethernet Cat.5 cabling infrastructure, can provide DC power to some IP-based terminals (such as IP telephones, wireless LAN access points AP, network cameras, etc.) while transmitting data to them. The POE technology can ensure the safety of the existing structured cabling while ensuring the normal operation of the existing network, and minimize costs to the greatest extent.
[0003] The existing POE power supply generally requires installing multiple rectifier bridges, capacitors, TVS and other electronic components on the PCB board. The circuit diagram is as Figure 6 shown. The disadvantage is that it occupies a large space on the PCB board, which is not conducive to the miniaturization of electronic products. With the continuous development of electronic products, the production volume of electronic products is getting higher and higher, the product models are diversified, and the competition is becoming increasingly fierce. There are also higher and higher requirements for high density, high strength, high heat dissipation, low cost, etc. of product packaging; at the same time, the power of electronic products is getting larger and larger, and the volume size is continuously decreasing, and there are also higher and higher requirements for the size, heat dissipation, etc. of components.
[0004] Therefore, in a limited space, integrating a high-power, strong heat dissipation, small-volume PCB power supply module has become an urgent problem to be solved. Summary of the Invention
[0005] The present invention provides a POE power supply module for the above problems existing in the prior art. The technical problem to be solved is: to realize the integration of a POE power supply module including multiple rectifier bridges, capacitors, TVS and other electronic components, which is conducive to the miniaturization development of electronic products.
[0006] The technical solution of the present invention to solve the above technical problems is as follows: A POE power supply module, characterized in that it includes a capacitor, overvoltage protection and at least one group of rectifier bridges, and also includes a VIN terminal, a VOUT terminal and a GND terminal.
[0007] Each group of rectifier bridges is formed by connecting four diode chips. The AC input of the rectifier bridge is connected to the VIN terminal, the positive output of the rectifier bridge is connected to the VOUT1 terminal, and the negative output of the rectifier bridge is connected to the VOUT4 terminal.
[0008] A first capacitor, one end of which is connected to the negative output of the rectifier bridge, and the other end is connected to the VOUT2 terminal.
[0009] A second capacitor, one end of which is connected to the VOUT2 terminal and the other end of which is connected to the GND terminal;
[0010] A third capacitor, one end of which is connected to the VOUT4 terminal and the other end of which is connected to the GND terminal;
[0011] A first overvoltage protection, one end of which is connected to the GND terminal, the other end of which is respectively connected to one end of a second overvoltage protection and a third overvoltage protection, the other end of the second overvoltage protection is connected to the VOUT2 terminal, and the other end of the third overvoltage protection is connected to the VOUT4 terminal.
[0012] Further, the POE power supply module forms a package structure, and at least one rectifier bridge, at least one capacitor, and at least one overvoltage protection are encapsulated in the package, wherein the capacitor is at least one of the first capacitor, the second capacitor, and the third capacitor, and the overvoltage protection is at least one of the first overvoltage protection, the second overvoltage protection, and the third overvoltage protection.
[0013] Even further, the rectifier bridge, the first capacitor, the second capacitor, the third capacitor, the first overvoltage protection, the second overvoltage protection, and the third overvoltage protection are encapsulated in the same plastic package.
[0014] Even further, the chips in each rectifier bridge can adopt one of four P-type substrate diode chips, four N-type substrate diode chips, two P-type substrate diode chips and two N-type substrate diode chips used in combination.
[0015] Further, the overvoltage protection element adopts a varistor or a TVS tube chip.
[0016] Even further, the overvoltage protection element adopts a single-layer TVS tube chip or multiple stacked TVS tube chips.
[0017] The beneficial effect of the present invention is that the present invention integrates a capacitor, an overvoltage protection, and at least one rectifier bridge into one body and forms a POE power supply through corresponding connection relationships, which can realize the integration of POE power supply, greatly reduce the occupied area on the PCB board, and is beneficial to the miniaturization of electronic products. Description of the Drawings
[0018] Figure 1 is a schematic circuit diagram of a POE power supply module according to an embodiment of the present invention;
[0019] Figure 2 is a schematic structural diagram of a plastic package of a POE power supply module according to an embodiment of the present invention;
[0020] Figure 3 is Figure 2 a three-dimensional structural diagram except for the plastic package;
[0021] Figure 4It is a schematic structural diagram of the plastic package of the POE power supply module according to another embodiment of the present invention;
[0022] Figure 5 It is a schematic structural diagram of the plastic package of the POE power supply module according to yet another embodiment of the present invention;
[0023] Figure 6 It is a POE power supply circuit diagram not integrated in the prior art;
[0024] In the figure: 1. First bracket, 2. Second bracket, 3. Third bracket, 4. Fourth bracket, 5. First chip, 6. Second chip, 7. TVS tube chip, 8. Capacitor, 9. Jumper, 10. Plastic package. Detailed implementation mode
[0025] The principle and features of the present invention will be described below. The examples given are only used to explain the present invention and are not intended to limit the scope of the present invention.
[0026] As Figure 1 shown, the POE power supply module of this embodiment includes three capacitors, three overvoltage protections and two rectifier bridges, and also includes a VIN terminal, a VOUT terminal and a GND terminal.
[0027] Each rectifier bridge is formed by connecting four diode chips. The AC input of the rectifier bridge is connected to the VIN terminal, the positive output of the rectifier bridge is connected to the VOUT1 terminal, and the negative output of the rectifier bridge is connected to the VOUT4 terminal;
[0028] The first capacitor, one end of which is connected to the negative output of the rectifier bridge and the other end is connected to the VOUT2 terminal;
[0029] The second capacitor, one end of which is connected to the VOUT2 terminal and the other end is connected to the GND terminal;
[0030] The third capacitor, one end of which is connected to the VOUT4 terminal and the other end is connected to the GND terminal;
[0031] The first overvoltage protection, one end of which is connected to the GND terminal and the other end is respectively connected to one end of the second overvoltage protection and the third overvoltage protection. The other end of the second overvoltage protection is connected to the VOUT2 terminal, and the other end of the third overvoltage protection is connected to the VOUT4 terminal.
[0032] In this embodiment, the rectifier bridge, the first capacitor, the second capacitor, the third capacitor, the first overvoltage protection, the second overvoltage protection, and the third overvoltage protection are encapsulated in the same plastic package, as Figure 2 shown. In this embodiment, two P-type substrate diode chips and two N-type substrate diode chips are used in combination for the chips in each rectifier bridge, and a TVS tube chip is used for the overvoltage protection element. The specific structure is as follows:
[0033] The POE power supply module includes a first bracket 1, a second bracket 2, a third bracket 3, a fourth bracket 4, four effective first chips 5, four effective second chips 6, three TVS tube chips 7, and three capacitors 8. The first chip 5 is a P-type substrate diode chip, and the second chip 6 is an N-type substrate diode chip. The four effective first chips 5, the four effective first chips 5, the three TVS tube chips 7, and the three capacitors 8 are encapsulated in the same plastic package 10;
[0034] Among them, the four first chips 5 are arranged on the first bracket 1 and are respectively connected to the first bracket 1 through their bottom surfaces. The four second chips are arranged on the second bracket 2 and are respectively connected to the second bracket 1 through their bottom surfaces. The first chip 5 and the second chip 6 are in a one-to-one correspondence relationship, and the first chip 5 and the second chip 6 in each group are connected through a connecting member on the top surface; the three TVS tube chips 7 are respectively arranged on the second bracket 2, the third bracket 3, and the fourth bracket 4, and the top surfaces of the three TVS tube chips 7 are connected to each other. A capacitor 8 is connected between the second bracket 2 and the third bracket 3, between the third bracket 3 and the fourth bracket 4, and between the fourth bracket 4 and the second bracket 2 respectively;
[0035] The four connecting members respectively extend outside the plastic package 10 to form VIN1 pins, VIN2 pins, VIN3 pins, and VIN4 pins. The first bracket 1, the second bracket 2, the third bracket 3, and the fourth bracket 4 respectively extend outside the plastic package 10 to form VOUT1 pins, VOUT4 pins, VOUT2 pins, and GND3 pins.
[0036] In this embodiment, the first chip 5 and the second chip 6 in each group are connected through a jumper 9 on the top surface, and the top surfaces of the three TVS tube chips 7 are connected through a jumper 9. In other embodiments, alternative structures such as leads can also be used.
[0037] In this embodiment, the first bracket 1 and the second bracket 2 are respectively in an inverted L-shaped and L-shaped structure. The TVS tube chip 7 on the second bracket 2 is arranged on the second bracket 2 near the VOUT4 pin, and this TVS tube chip 7 is located between the connection of the second chip 6 on the second bracket 2 and the VOUT4 pin. The frame structure of this layout can effectively solve the heat dissipation problem between the components encapsulated in the plastic package and ensure the stable operation of the POE power supply.
[0038] In another embodiment of the present invention, the positions of the first chip and the second chip are swapped, that is, the four second chips 6 are arranged on the first bracket 1 and are respectively connected to the first bracket 1 through their bottom surfaces, and the four first chips 5 are arranged on the second bracket 2 and are respectively connected to the second bracket 1 through their bottom surfaces. Other structures are the same as those in the above embodiment.
[0039] In other embodiments of the present invention, according to actual overvoltage protection requirements, multiple stacked TVS tube chips may be used as the overvoltage protection element, or a varistor may be used.
[0040] In other embodiments of the present invention, in addition to using two P-type substrate diode chips and two N-type substrate diode chips in combination for the chip used in the rectifier bridge within the plastic package, four P-type substrate diode chips may also be connected to form a rectifier bridge, as Figure 4 shown, or four N-type substrate diode chips may be connected to form a rectifier bridge, as Figure 5 shown.
Claims
1. A POE power supply module, characterized in that, it includes a capacitor, overvoltage protection and at least one set of rectifier bridges, and also includes a VIN terminal, a VOUT terminal and a GND terminal. Each set of rectifier bridges is formed by connecting four diode chips. The AC input of the rectifier bridge is connected to the VIN terminal, the positive output of the rectifier bridge is connected to the VOUT1 terminal, and the negative output of the rectifier bridge is connected to the VOUT4 terminal. A first capacitor, one end of which is connected to the negative output of the rectifier bridge, and the other end is connected to the VOUT2 terminal. A second capacitor, one end of which is connected to the VOUT2 terminal, and the other end is connected to the GND terminal. A third capacitor, one end of which is connected to the VOUT4 terminal, and the other end is connected to the GND terminal. A first overvoltage protection, one end of which is connected to the GND terminal, and the other end is respectively connected to one end of the second overvoltage protection and the third overvoltage protection. The other end of the second overvoltage protection is connected to the VOUT2 terminal, and the other end of the third overvoltage protection is connected to the VOUT4 terminal.
2. The POE power supply module according to claim 1, characterized in that, it forms a package structure. The package is potted with at least one set of rectifier bridges, at least one capacitor, and at least one overvoltage protection. Wherein the capacitor is at least one of the first capacitor, the second capacitor and the third capacitor, and the overvoltage protection is at least one of the first overvoltage protection, the second overvoltage protection and the third overvoltage protection.
3. The POE power supply module according to claim 1, characterized in that, the rectifier bridge, the first capacitor, the second capacitor, the third capacitor, the first overvoltage protection, the second overvoltage protection and the third overvoltage protection are encapsulated in the same plastic package.
4. The POE power supply module according to claim 2 or 3, characterized in that, the chips in each set of rectifier bridges can adopt one of four P-type substrate diode chips, four N-type substrate diode chips, two P-type substrate diode chips and two N-type substrate diode chips used in combination.
5. The POE power supply module according to claim 1, characterized in that, the overvoltage protection element adopts a varistor or a TVS tube chip.
6. The POE power supply module according to claim 5, characterized in that, the overvoltage protection element adopts a single-layer TVS tube chip or multiple stacked TVS tube chips.
Citation Information
Patent Citations
POE power supply module
CN217608051U