Lead positioning tool for solving skew problem of double-layer aluminum substrate reflow soldering lead

Abstract

The utility model relates to the technical field of aluminum substrate processing, in particular to a lead positioning tool for solving skewing of a reflow soldering lead of a double-layer aluminum substrate. The lead positioning tool comprises a carrier, two long lead positioning clamps and a short lead positioning clamp, the carrier is horizontally arranged, the upper end face of the carrier is provided with an assembling groove matched with the double-layer aluminum substrate, the short lead positioning clamp is detachably installed at the upper end of the carrier, and the long lead positioning clamps are detachably installed at the lower end of the carrier. A plurality of groups of short lead channels vertically penetrating through the double-layer aluminum substrate are arranged on the double-layer aluminum substrate, the two long lead positioning clamps are detachably arranged at two ends of the upper part of the double-layer aluminum substrate respectively, and the long lead positioning clamps are respectively provided with long lead channels vertically penetrating through the long lead positioning clamps. The structure has the advantages that the structure design is simple and reasonable, the long lead of a product can be ensured to be in a vertical state after being welded with the double-layer aluminum substrate, the stress caused by lead deflection in the assembly process is avoided, and the lead distance is ensured to meet the design requirement.

Description

Technical Field

[0001] The utility model relates to the technical field of aluminum substrate processing, and particularly relates to a lead positioning tooling for solving the problem of lead skew in the reflow soldering of double-layer aluminum substrates. Background Art

[0002] An aluminum substrate is a metal-based copper clad laminate, which consists of a copper foil, a thermally conductive insulating layer, and an aluminum substrate. The difference between a double-layer aluminum substrate and a single-layer aluminum substrate is that the double-layer aluminum substrate uses a double-sided copper clad laminate, which is laminated on the aluminum substrate through a thermally conductive insulating material. Since the double-sided copper clad laminate is used, the thickness becomes thicker. When the thickness of the finished substrate remains unchanged, the aluminum substrate becomes thinner, and the influence of temperature deformation on the aluminum substrate is more obvious (as shown in Figure 1 shown, Figure 1 where A refers to the aluminum substrate in

[0003] In high-power standard brick modules or non-standard module products, the main power circuit is arranged on the aluminum substrate, and the input and output leads of the module are directly led out from the aluminum substrate by means of surface mount soldering. The control circuit and the drive part circuit are arranged on the PCB board and are interconnected with the aluminum substrate through surface mount leads. Therefore, there are many surface mount leads on the aluminum substrate module product, and the welding positioning requirements are high. In order to meet the positioning accuracy requirements of the leads, generally a fixture is used to position all the leads to achieve soldering. Due to the characteristics of the double-layer aluminum substrate material itself, at the solid-liquid phase transition temperature point of the solder, the aluminum substrate deforms, but due to being fixed by the positioning fixture, the leads are in a vertical state, but are inclined relative to the aluminum substrate (as shown in Figure 2 shown, Figure 2 where B refers to the aluminum substrate in Figure 3 shown, Figure 3 where C refers to the aluminum substrate in

[0004] When the solder solidifies, the leads are fixed. When the soldering is completed and the temperature returns to room temperature, the leads are skewed (as shown in Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a lead positioning tooling for solving the problem of lead skew in the reflow soldering of double-layer aluminum substrates, which effectively overcomes the defects of the prior art.

[0006] The technical solution of the utility model for solving the above technical problems is as follows:

[0007] A lead positioning tooling for solving the problem of lead skew in reflow soldering of double-layer aluminum substrates, including a carrier, two long lead positioning jigs and a short lead positioning jig. The above-mentioned carrier is horizontally arranged, and its upper end surface is provided with an assembly groove adapted to the double-layer aluminum substrate. The above-mentioned short lead positioning jig is detachably installed on the upper end of the above-mentioned carrier, and is provided with multiple groups of short lead channels vertically penetrating it. The two above-mentioned long lead positioning jigs are respectively detachably installed at both ends of the upper part of the above-mentioned double-layer aluminum substrate, and the above-mentioned long lead positioning jigs are respectively provided with long lead channels vertically penetrating them.

[0008] On the basis of the above technical solution, the present utility model can also be improved as follows.

[0009] Further, a detachable first adhesive layer is pasted on the upper surface of the above-mentioned long lead positioning jig.

[0010] Further, a detachable second adhesive layer is pasted on the upper surface of the above-mentioned short lead positioning jig.

[0011] Further, the above-mentioned carrier is a rectangular plate member, the above-mentioned assembly groove is a rectangular groove body, and correspondingly, the above-mentioned double-layer aluminum substrate is a rectangular substrate.

[0012] Further, mounting holes are respectively penetrated through the four right angles of the above-mentioned double-layer aluminum substrate. The above-mentioned long lead positioning jig is a gate-shaped member and is perpendicular to the upper surfaces of both ends of the above-mentioned double-layer aluminum substrate. First positioning columns for inserting into two of the above-mentioned mounting holes at the corresponding ends are respectively provided at the lower ends of both ends of the above-mentioned long lead positioning jig. The above-mentioned long lead channel is provided on the horizontal section at the upper end of the above-mentioned long lead positioning jig.

[0013] Further, the above-mentioned short lead positioning jig is a rectangular and hollow frame member. Vertical support columns are respectively provided at the lower ends of the four right angles of the above-mentioned short lead positioning jig. Second positioning columns are respectively vertically provided at the lower ends of the above-mentioned support columns. Two positioning holes adapted to the above-mentioned second positioning columns are respectively provided on both sides of the above-mentioned carrier along its edge lines. The four above-mentioned second positioning columns of the above-mentioned short lead positioning jig are respectively inserted into the four above-mentioned positioning holes.

[0014] Further, weight reduction holes are opened at the bottom of the above-mentioned assembly groove.

[0015] Further, process blind holes are respectively provided at the four right angles of the above-mentioned assembly groove.

[0016] Further, multiple long lead channels are provided on the above-mentioned long lead positioning jig, and multiple groups of the above-mentioned short lead channels are spaced on the above-mentioned short lead positioning jig, and each group of the above-mentioned short lead channels has multiple.

[0017] Further, handles are respectively provided at both ends of the above-mentioned carrier.

[0018] The beneficial effects of the present utility model are as follows: The structure design is simple and reasonable, which can ensure that the long leads of the product are in a vertical state after being welded to the double-layer aluminum substrate, avoid stress caused by lead skew during the assembly process, and ensure that the lead spacing meets the design requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. is a schematic structural view of the aluminum substrate after temperature deformation mentioned in the background art of the present utility model;

[0020] Figure 2 FIG. is a schematic structural view of the welded leads of the aluminum substrate after temperature deformation mentioned in the background art of the present utility model;

[0021] Figure 3 FIG. is a schematic structural view of the lead connection after the aluminum substrate returns to room temperature and restores its deformation in the background art of the present utility model;

[0022] Figure 4 FIG. is a schematic structural view of the lead positioning tooling for solving the lead skew in the reflow soldering of the double-layer aluminum substrate of the present utility model;

[0023] Figure 5 FIG. is a schematic structural view of the cooperation between the long lead positioning fixture and the double-layer aluminum substrate in the lead positioning tooling for solving the lead skew in the reflow soldering of the double-layer aluminum substrate of the present utility model;

[0024] Figure 6 FIG. is a product diagram after welding the leads using the lead positioning tooling for solving the lead skew in the reflow soldering of the double-layer aluminum substrate of the present utility model.

[0025] In the drawings, the list of components represented by each reference numeral is as follows:

[0026] 1, carrier; 2, long lead positioning fixture; 3, short lead positioning fixture; 4, double-layer aluminum substrate; 11, assembly groove; 12, positioning hole; 21, long lead channel; 31, short lead channel; 32, support column; 41, mounting hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The principles and features of the present utility model will be described below with reference to the accompanying drawings. The examples given are only for explaining the present utility model and are not intended to limit the scope of the present utility model.

[0028] Example: As Figure 4As shown in the figure, the lead positioning tooling for solving the lead skew in the reflow soldering of the double-layer aluminum substrate in this embodiment includes a carrier 1, two long lead positioning jigs 2, and a short lead positioning jig 3. The above-mentioned carrier 1 is horizontally arranged, and its upper end surface is provided with an assembly groove 11 adapted to the double-layer aluminum substrate 4. The above-mentioned short lead positioning jig 3 is detachably installed on the upper end of the above-mentioned carrier 1, and is provided with multiple groups of short lead channels 31 vertically penetrating it. The two above-mentioned long lead positioning jigs 2 are respectively detachably installed at both ends of the upper part of the above-mentioned double-layer aluminum substrate 4, and the above-mentioned long lead positioning jigs 2 are respectively provided with long lead channels 21 vertically penetrating them.

[0029] When the lead positioning tooling for solving the lead skew in the reflow soldering of the double-layer aluminum substrate in this embodiment is in use, the double-layer aluminum substrate 4 after chip mounting is loaded into the assembly groove 11, and then the long leads (such as Figure 5 , denoted by D in the figure) and short leads are loaded into the long lead channels 21 of the long lead positioning jig 2 and the short lead channels 31 of the short lead positioning jig 3 respectively, and the long leads and short leads are temporarily fixed in the corresponding channels. Next, the short lead positioning jig 3 is positioned and installed on the upper end of the carrier 1, and the temporary fixation of the short leads in the short lead channels 31 is released. The short leads fall onto the pads of the aluminum substrate. Next, the long lead positioning jigs 2 are respectively positioned and installed at both ends of the double-layer aluminum substrate 4, and the temporary fixation of the long leads in the long lead channels 21 is released. The long leads fall onto the pads of the aluminum substrate. Finally, the whole is sent into the reflow soldering furnace to realize the soldering of the devices and leads on the double-layer aluminum substrate 4. Since the long lead positioning jig 2 is directly positioned and installed on the double-layer aluminum substrate 4, and the long lead channel 21 is perpendicular to the corresponding part of the double-layer aluminum substrate 4, even after the double-layer aluminum substrate 4 deforms under temperature change and recovers the deformation at room temperature, the long leads will always remain perpendicular to the corresponding part of the double-layer aluminum substrate 4 (as Figure 6 shown), and will not be skewed relative to the double-layer aluminum substrate 4. Overall, the structural design is simple and reasonable, which can ensure that the long leads of the product are in a vertical state after being soldered to the double-layer aluminum substrate, avoid being stressed due to lead skew during the assembly process, and ensure that the lead spacing meets the design requirements.

[0030] It should be added that: the lead positioning tooling for solving the lead skew in the reflow soldering of the double-layer aluminum substrate in this embodiment mainly solves the problem of the perpendicularity of the soldering between the long leads and the double-layer aluminum substrate 4, and the short leads are not within the scope of this problem.

[0031] In this embodiment, a peelable first adhesive layer is pasted on the upper surface of the above-mentioned long lead positioning jig 2. Before loading the short leads into the long lead channels 21, first paste the first adhesive layer on the upper surface of the long lead positioning jig 2. After the long leads are loaded into the long lead channels 21, one end adheres to the first adhesive layer, playing a role of temporary fixation. Subsequently, tearing off the first adhesive layer can release the temporarily fixed state, and the operation is very simple and fast.

[0032] In this embodiment, a detachable second adhesive layer is pasted on the upper surface of the above-mentioned short lead positioning fixture 3. Before loading the short leads into the short lead channel 31, the second adhesive layer is first pasted on the upper surface of the short lead positioning fixture 3. After the short leads are loaded into the short lead channel 31, one end of the short leads adheres to the second adhesive layer, playing a role of temporary fixation. Subsequently, the temporary fixation state can be released by tearing off the second adhesive layer, and the operation is very simple and fast.

[0033] In this embodiment, the above-mentioned carrier 1 is a rectangular plate member, the above-mentioned assembly groove 11 is a rectangular groove body, and correspondingly, the above-mentioned double-layer aluminum substrate 4 is a rectangular substrate. The shape design is regular, and the shape of the carrier 1 is consistent with that of the double-layer aluminum substrate 4, ensuring stable loading.

[0034] As a preferred embodiment, mounting holes 41 are respectively provided through the four right-angled corners of the above-mentioned double-layer aluminum substrate 4. The above-mentioned long lead positioning fixture 2 is a gantry-shaped member and is perpendicular to the upper surfaces of both ends of the above-mentioned double-layer aluminum substrate 4. First positioning columns for inserting into two of the above-mentioned mounting holes 41 at the corresponding ends are respectively provided at the lower ends of both ends of the above-mentioned long lead positioning fixture 2, and a long lead channel 21 is provided on the horizontal section at the upper end of the above-mentioned long lead positioning fixture 2.

[0035] In the above-mentioned implementation scheme, by making full use of the four mounting holes 41 inherent in the double-layer aluminum substrate 4 itself and inserting the first positioning columns at the lower ends of both ends of the long lead positioning fixture 2 into two of the mounting holes 41 at the corresponding ends, the positioning and installation of the long lead positioning fixture 2 on the double-layer aluminum substrate 4 can be realized. At the same time, the perpendicularity of their installation is maintained, that is, the perpendicularity of the welding of the long leads to the corresponding parts of the double-layer aluminum substrate 4 is ensured. The structure design is simple and reasonable.

[0036] As a preferred embodiment, the above-mentioned short lead positioning fixture 3 is a rectangular and hollow frame member. Vertical support columns 32 are respectively provided at the lower ends of the four right-angled corners of the above-mentioned short lead positioning fixture 3. Second positioning columns are respectively provided vertically at the lower ends of the above-mentioned support columns 32. Two positioning holes 12 adapted to the above-mentioned second positioning columns are respectively provided along the side edges on both sides of the above-mentioned carrier 1, and the four above-mentioned second positioning columns of the above-mentioned short lead positioning fixture 3 are respectively inserted into the four above-mentioned positioning holes 12.

[0037] In the above-mentioned implementation scheme, since there are relatively many short leads, the short lead positioning fixture 3 is designed as a hollow frame member with a relatively large area. Its weight is reduced through the hollow design, and short lead channels 31 can be designed at multiple points on the double-layer aluminum substrate 4. The installation is also realized by stably inserting the four support columns 32 into the corresponding positioning holes 12 on both sides of the carrier 1. The design is very reasonable and the installation is very simple.

[0038] In this embodiment, a weight-reducing hole is provided at the bottom of the above-mentioned assembly groove 11, which can greatly reduce the weight of the carrier 1 and reduce the consumable cost.

[0039] In this embodiment, process blind holes are respectively provided at the four right-angled corners of the above-mentioned assembly groove 11. These process blind holes are mainly designed for chamfering the four right-angled parts during the milling process of the assembly groove 11.

[0040] As a preferred implementation manner, a plurality of long lead channels 21 are provided on the above-mentioned long lead positioning fixture 2, and multiple groups of the above-mentioned short lead channels 31 are provided at intervals on the above-mentioned short lead positioning fixture 3, and each group of the above-mentioned short lead channels 31 has a plurality of them.

[0041] In the above-mentioned implementation scheme, at least two long lead channels 21 are respectively designed at both ends of the double-layer aluminum substrate 4, and are specifically adjusted reasonably according to the actual production model and requirements. The number of the short lead channels 31 can be set according to the actual processing requirements of the double-layer aluminum substrate 4, and no specific limitation is made here.

[0042] In this embodiment, handles are respectively provided at both ends of the above-mentioned carrier 1, which facilitates moving the entire carrier 1 through the handles.

[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention.

[0044] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0045] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0046] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0047] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0048] Although the embodiments of the present utility model have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present utility model. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present utility model.

Claims

1. A lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrates, characterized by: The invention comprises a carrier (1), two long lead positioning fixtures (2) and a short lead positioning fixture (3); the carrier (1) is arranged horizontally, and its upper end surface is provided with an assembly groove (11) adapted to a double-layer aluminum substrate (4); the short lead positioning fixture (3) is detachably mounted on the upper end of the carrier (1), and is provided with a plurality of groups of short lead channels (31) vertically penetrating thereon; the two long lead positioning fixtures (2) are respectively detachably mounted on the two ends of the upper part of the double-layer aluminum substrate (4), and the long lead positioning fixtures (2) are respectively provided with long lead channels (21) vertically penetrating thereon.

2. According to claim 1, a lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrates, characterized in that: The upper surface of the long lead positioning fixture (2) is adhered with a tearable first adhesive layer.

3. The lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrate according to claim 1, characterized in that: A second adhesive layer that can be torn off is adhered to the upper surface of the short lead positioning fixture (3).

4. The lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrate according to claim 1, characterized in that: The carrier (1) is a rectangular plate, the assembly groove (11) is a rectangular groove body, and the corresponding double-layer aluminum substrate (4) is a rectangular substrate.

5. The lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrate according to claim 4, characterized in that: The four right angles of the double-layer aluminum substrate (4) are respectively penetrated by mounting holes (41); the long lead positioning fixture (2) is a door-shaped component and is perpendicular to the upper surfaces of the two ends of the double-layer aluminum substrate (4); the lower ends of the two ends of the long lead positioning fixture (2) are respectively provided with first positioning columns for inserting into the two mounting holes (41) at the corresponding ends; and the long lead channel (21) is provided on the upper horizontal section of the long lead positioning fixture (2).

6. The lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrate according to claim 4, characterized in that: The short lead positioning fixture (3) is a rectangular and hollow frame member, and the lower ends of the four right angles of the short lead positioning fixture (3) are respectively provided with vertical support columns (32), and the lower ends of the support columns (32) are respectively provided with second positioning columns vertically, and two sides of the carrier (1) are respectively provided with two positioning holes (12) adapted to the second positioning columns along the edge lines thereof, and the four second positioning columns of the short lead positioning fixture (3) are respectively inserted into the four positioning holes (12).

7. The lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrate according to claim 4, characterized in that: The bottom of the assembly groove (11) is provided with a weight-reducing hole.

8. The lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrate according to claim 4, characterized in that: Process blind holes are respectively provided at four right angles of the assembly groove (11).

9. A lead positioning tool for solving the problem of lead skewness in reflow soldering of a double-layer aluminum substrate according to any one of claims 1 to 8, characterized in that: The long lead wire positioning fixture (2) is provided with a plurality of long lead wire channels (21), and the short lead wire positioning fixture (3) is provided with a plurality of groups of short lead wire channels (31) at intervals, and each group of short lead wire channels (31) is provided with a plurality of channels.

10. A lead positioning tool for solving the problem of lead skewness in reflow soldering of double-layer aluminum substrates according to any one of claims 1 to 8, characterized in that: The carrier (1) is provided with handles at both ends.

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