Chip mounter

Abstract

The present application provides a chip mounter, comprising: a machine table; a transmission device installed on the machine table for transmitting a substrate; a first chip mounting device including a feeding mechanism for supplying solder, a first calibration mechanism for calibrating the solder, and a chip mounting mechanism for mounting the solder on the first calibration mechanism onto the substrate, the feeding mechanism, the first calibration mechanism, and the chip mounting mechanism being installed on the machine table; and a second chip mounting device for mounting the chips on the crystal ring onto the substrate, the second chip mounting device being installed on the machine table. The chip mounter provided by the present application can transmit the substrate to the chip mounting positions corresponding to the chip mounting mechanism and the second chip mounting device through the transmission device; it can achieve continuous and automatic chip and solder mounting, avoid manual transfer of semi-finished products, ensure the accuracy of the chip mounting position and the stability of operation, and meet the chip mounting and assembly requirements of different materials for IGBT products.

Description

Technical Field

[0001] This application belongs to the technical field of chip mounters, and more specifically, relates to a chip mounter. Background Art

[0002] IGBT (Insulated Gate Bipolar Transistor) products include a substrate, a variety of solders mounted on the substrate, and LED (Light-Emitting Diode) chips mounted on the substrate. During its production, there are many types of materials required, and there are also certain differences in the mounting methods of various materials.

[0003] Existing chip mounters can usually only handle the production in the mode of loose materials (such as, loading solders on a carrier board) or wafers (such as, loading chips on a wafer ring). When assembling different types of materials on the substrate, multiple chip mounters need to be used for assembly respectively. After the assembly of one material is completed, the semi-finished product needs to be manually transferred to the next machine for assembling the next material. The assembly accuracy and operation stability are poor, and it cannot meet the production requirements of the diverse materials of IGBT products. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a chip mounter to solve the technical problem in the existing technology that the chip mounter cannot meet the production requirements of the diverse materials of IGBT products.

[0005] To achieve the above purpose, the technical solution adopted in this application is: providing a chip mounter, including:

[0006] A machine table;

[0007] A transmission device, installed on the machine table and used for transmitting the substrate;

[0008] A first chip mounting device, including a feeding mechanism for supplying solder, a first calibration mechanism for calibrating the solder, and a chip mounting mechanism for mounting the solder on the first calibration mechanism onto the substrate. The feeding mechanism, the first calibration mechanism, and the chip mounting mechanism are installed on the machine table; and,

[0009] A second chip mounting device, used for mounting the chips on the wafer ring onto the substrate. The second chip mounting device is installed on the machine table.

[0010] The substrate is transported through a transport device, and the substrate can be transported to the placement positions corresponding to the placement mechanism and the second placement device; through the first calibration mechanism, the position and angle of the solder can be calibrated, so that the placement mechanism can accurately attach the solder to the substrate, realizing the placement of the solder and meeting the production requirements of the loose material mode; through the second placement device, the chips on the crystal ring can be attached to the substrate, realizing the placement of the chips and meeting the production requirements of the wafer mode. Therefore, the continuous automatic placement of the chips and the solder can be realized, avoiding manual transfer of semi-finished products, ensuring the placement position accuracy and the operation stability, and meeting the different material placement and assembly requirements of IGBT products. Moreover, in this way, the method of using glue to fix the solder and the chips can be cancelled, simplifying the assembly steps and costs.

[0011] In one embodiment, the first calibration mechanism includes a support head, a rotation driver for driving the support head to rotate to adjust the angle of the solder, a first moving platform for driving the rotation driver to move to adjust the position of the solder, a first CCD camera for detecting the position and angle of the solder, and a first support for supporting the first CCD camera. The support head is installed at the power output end of the rotation driver, the rotation driver is installed on the first moving platform, and the first moving platform and the first support are installed on the machine table.

[0012] By adopting the above technical means, the position and angle of the solder can be adjusted to ensure the accuracy of solder placement.

[0013] In one embodiment, the support head is provided with a first adsorption hole suitable for adsorbing the first solder and a plurality of second adsorption holes suitable for adsorbing the second solder. The first adsorption hole is located in the middle of the support head, and the plurality of second adsorption holes are arranged around the first adsorption hole; a valve assembly for controlling the communication between the first adsorption hole and the second adsorption holes and an external vacuum mechanism is installed on the first moving platform, and the valve assembly is respectively connected to the first adsorption hole and the second adsorption holes through pipelines.

[0014] By adopting the above technical means, the adsorption requirements of different solders can be met.

[0015] In one embodiment, a spraying member for spraying alcohol on the lower surface of the solder is installed on the first moving platform, and the spraying member is located on one side of the support head close to the transport device.

[0016] By adopting the above technical means, the stability after solder placement can be enhanced. Description of the Drawings

[0017] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0018] Figure 1 Schematic three-dimensional structure diagram of the mounter provided by the embodiment of the present application;

[0019] Figure 2 For Figure 1 Schematic three-dimensional structure of the feeding mechanism in;

[0020] Figure 3 For Figure 2 Exploded view of the magazine in;

[0021] Figure 4 For Figure 2 Exploded view of the board taking component in;

[0022] Figure 5 For Figure 4 Schematic three-dimensional structure diagram of the hook plate structure in;

[0023] Figure 6 For Figure 1 Schematic three-dimensional structure diagram of the partial structure of the first calibration mechanism, the chip mounter mechanism and the first connection mechanism in;

[0024] Figure 7 For Figure 6 Schematic three-dimensional structure diagram of the partial structure of the first calibration mechanism in;

[0025] Figure 8 For Figure 7 Exploded view of the support head, the first connecting plate, the second connecting plate, etc. in;

[0026] Figure 9 For Figure 1 Schematic three-dimensional structure diagram of the transmission mechanism in;

[0027] Figure 10 For Figure 1 Exploded view of the crystal feeding mechanism in;

[0028] Figure 11 For Figure 1 Schematic three-dimensional structure diagram of the ejecting component in;

[0029] Figure 12 For Figure 10 Exploded view of the needle sleeve, the ejector pin, the heat insulation plate, the first lifting driver and the second lifting driver in.

[0030] Among them, the reference numerals in the figures:

[0031] 100 - Machine platform; 200 - Transmission device; 300 - First chip mounter; 400 - Second chip mounter;

[0032] 10 - Feeding mechanism; 11 - Magazine; 111 - Magazine box; 112 - Bracket; 113 - Lifting drive; 114 - Upright frame; 12 - First detector; 121 - Support plate; 122 - First clamp seat; 123 - Support rod; 124 - Second clamp seat; 13 - Plate taking assembly; 131 - Plate rack; 132 - Hook plate structure; 1321 - Lever; 1322 - First drive; 1323 - Linear drive unit; 13231 - Synchronous belt; 13232 - First synchronous pulley; 13233 - Second synchronous pulley; 13234 - Second drive; 1324 - Sliding seat; 1325 - Second support; 133 - Second moving platform; 14 - First picking component;

[0033] 20 - First calibration mechanism; 21 - Support head; 2101 - First adsorption hole; 2102 - Second adsorption hole; 2103 - First air outlet hole; 2104 - Second air outlet hole; 22 - Rotary drive; 23 - First moving platform; 24 - First CCD camera; 25 - First support; 261 - First connecting plate; 2611 - First opening; 2612 - First air extraction hole; 262 - Second connecting plate; 2621 - Second opening; 2622 - Second air extraction hole; 263 - First sealing ring; 264 - Second sealing ring; 27 - First connecting seat; 28 - Valve assembly; 281 - First control valve; 282 - Second control valve; 29 - Spraying part;

[0034] 30 - Chip mounting mechanism; 31 - Second nozzle; 32 - Third drive; 33 - Third support; 34 - Fourth drive; 35 - Fourth support; 36 - Fifth drive; 37 - First base;

[0035] 40 - Loading mechanism;

[0036] 50 - Crystal feeding mechanism; 51 - Rotary assembly; 52 - Ejecting assembly; 521 - Needle sleeve; 5211 - Sleeve; 5212 - Second connecting seat; 522 - Ejector pin; 523 - Heating part; 524 - First jacking drive; 5241 - First lifting seat; 525 - Second jacking drive; 5251 - Second lifting seat; 526 - Third moving platform; 527 - Heat insulation plate; 528 - Temperature sensor; 53 - Heating assembly;

[0037] 60 - Second calibration mechanism;

[0038] 70 - Transmission mechanism; 71 - Crystal ring transmission component; 72 - Second material taking component; 73 - Mounting component; 74 - Linear drive component; 75 - First slide; 76 - Second slide; 77 - Third slide; 78 - Second CCD camera; 79 - Second detector;

[0039] 81 - First connection mechanism; 82 - Second connection mechanism. Detailed implementation manners

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer and more understandable, the following further details this application in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0042] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0043] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more unless otherwise specifically defined.

[0044] Please refer to Figure 1 、 Figure 2 and Figure 6, the pick-and-place machine provided by the embodiments of the present application will be described. The pick-and-place machine includes a machine table 100, a transmission device 200, a first chip placement device 300, and a second chip placement device 400; the transmission device 200 is installed on the machine table 100, and the transmission device 200 is used to transmit the substrate; the first chip placement device 300 includes a feeding mechanism 10, a first calibration mechanism 20, and a chip placement mechanism 30. The feeding mechanism 10 is used to supply solder, and the first calibration mechanism 20 is used to calibrate the solder; after the first calibration mechanism 20 finishes calibrating the position and angle of the solder, the chip placement mechanism 30 is used to place the solder on the first calibration mechanism 20 on the substrate. The feeding mechanism 10, the first calibration mechanism 20, and the chip placement mechanism 30 are installed on the machine table 100; the second chip placement device 400 is used to place the chips on the crystal ring on the substrate, and the second chip placement device 400 is installed on the machine table 100. By transmitting the substrate through the transmission device 200, the substrate can be transmitted to the chip placement positions corresponding to the chip placement mechanism 30 and the second chip placement device 400; through the first calibration mechanism 20, the position and angle of the solder can be calibrated, so that the chip placement mechanism 30 can accurately attach the solder to the substrate, realizing the soldering of the solder and meeting the production requirements of the loose material mode; through the second chip placement device 400, the chips on the crystal ring can be attached to the substrate, realizing the chip placement and meeting the production requirements of the wafer mode. Thus, continuous automatic chip and solder placement can be achieved, avoiding manual transfer of semi-finished products, ensuring the accuracy of the placement position and the stability of operation, and meeting the different material placement and assembly requirements of IGBT products. Moreover, this can eliminate the use of the dispensing method to fix the solder and chips, simplifying the assembly steps and costs.

[0045] In an embodiment of the present application, please refer to Figures 6 to 8 , the first calibration mechanism 20 includes a support head 21, a rotation driver 22, a first moving platform 23, a first CCD camera 24, and a first support 25. The support head 21 is used to support the solder; the rotation driver 22 is used to drive the support head 21 to rotate to adjust the angle of the solder; the first moving platform 23 is used to drive the rotation driver 22 to move to adjust the position of the solder; the first CCD camera 24 is used to detect the position and angle of the solder, and the first support 25 supports the first CCD camera 24; the support head 21 is installed at the power output end of the rotation driver 22, and the rotation driver 22 is installed on the first moving platform 23. Please refer to Figure 1 , the first moving platform 23 and the first support 25 are installed on the machine table 100. This can calibrate the position and angle of the solder before solder placement, thus ensuring the accuracy of the position and angle of the solder on the substrate during placement. The rotation driver 22 can be a motor or the like.

[0046] In an embodiment, please refer to Figures 6 to 8, a first adsorption hole 2101 and a plurality of second adsorption holes 2102 are formed in the support head 21. The first adsorption hole 2101 is adapted to adsorb the first solder, and the plurality of second adsorption holes 2102 are adapted to adsorb the second solder. The first adsorption hole 2101 is located in the middle of the support head 21, and the plurality of second adsorption holes 2102 are arranged around the first adsorption hole 2101. A valve assembly 28 is installed on the first moving platform 23. The valve assembly 28 is used to control the communication between the first adsorption hole 2101 and the second adsorption hole 2102 and an external vacuum mechanism. The valve assembly 28 is respectively communicated with the first adsorption hole 2101 and the second adsorption hole 2102 through pipelines. In this way, by switching between the first adsorption hole 2101 and the second adsorption hole 2102, the adjustment of the adsorption area can be realized, so as to realize the adsorption of solders of different sizes, avoid vacuum leakage when adsorbing the smaller first solder, and ensure the stable adsorption of the second solder when adsorbing the larger second solder, meet the adsorption requirements in the correction process of solders of different sizes, and thus adapt to the chip mounting requirements of different solders.

[0047] In one embodiment, please refer to Figure 6 to Figure 8 , a first air outlet hole 2103 and a second air outlet hole 2104 are formed in the outer peripheral surface of the support head 21. The first air outlet hole 2103 is communicated with the first adsorption hole 2101, and the second air outlet hole 2104 is communicated with the second adsorption hole 2102. A first connecting plate 261 and a second connecting plate 262 are installed on the first moving platform 23. The first connecting plate 261 and the second connecting plate 262 are both rotatably sleeved on the support head 21. A first air extraction hole 2612 communicated with the first air outlet hole 2103 is formed in the first connecting plate 261, and a second air extraction hole 2622 communicated with the second air outlet hole 2104 is formed in the second connecting plate 262. The first air extraction hole 2612 and the second air extraction hole 2622 are respectively communicated with the valve assembly 28 through pipelines. In this way, it is convenient to connect the valve assembly 28 and avoid pipeline interference with the rotation of the support head 21.

[0048] Optionally, a first hole channel and a second hole channel are formed in the support head 21. The first hole channel is arranged along the axial direction of the support head 21, and each second hole channel is arranged along the axial direction of the support head 21. The first hole channel communicates the first adsorption hole 2101 with the first air outlet hole 2103, and the second hole channel communicates the second adsorption hole 2102 with the second air outlet hole 2104. In this way, the depths of the first adsorption hole 2101 and the second adsorption hole 2102 can be reduced, facilitating the communication between the first air outlet hole 2103 and the first adsorption hole 2101, and the communication between the second adsorption hole 2102 and the second air outlet hole 2104, and facilitating the processing of the support head 21.

[0049] Optionally, the number of the first air outlets 2103 is plural, and the number of the second air outlets 2104 is plural. The plural second air outlets 2104 are arranged circumferentially around the first adsorption hole 2101, and the plural second channels are arranged around the first adsorption hole 2101; the plural first air outlets 2103 are respectively communicated with the first channel and the first air extraction hole 2612, and each second air outlet 2104 communicates the corresponding second channel with the second air extraction hole 2622. In this way, the suction force can be balanced, and it is beneficial to prevent blockage.

[0050] In one embodiment, please refer to Figure 7 and Figure 8 . A first opening 2611 is formed in the first connection plate 261. The support head 21 is inserted into the first opening 2611. First sealing rings 263 are respectively installed at both ends of the first opening 2611 of the first connection plate 261. Each first sealing ring 263 seals the gap between the first connection plate 261 and the support head 21. The intake end of the first air extraction hole 2612 and the outlet end of the first air outlet 2103 are both located between the two first sealing rings 263. In this way, air leakage between the first air outlet 2103 and the first air extraction hole 2612 can be prevented. Optionally, first annular grooves are respectively formed at both ends of the first opening 2611 of the first connection plate 261, and each first sealing ring 263 is placed in the corresponding first annular groove. In this way, seal failure can be avoided.

[0051] In one embodiment, please refer to Figure 7 and Figure 8 . A second opening 2621 is formed in the second connection plate 262. The support head 21 is inserted into the second opening 2621. Second sealing rings 264 are respectively installed at both ends of the second opening 2621 of the second connection plate 262. Each second sealing ring 264 seals the gap between the second connection plate 262 and the support head 21. The intake end of the second air extraction hole 2622 and the outlet end of the second air outlet 2104 are both located between the two second sealing rings 264. In this way, vacuum leakage between the second air outlet 2104 and the second air extraction hole 2622 can be prevented. Optionally, second annular grooves are respectively formed at both ends of the second opening 2621 of the second connection plate 262, and each second sealing ring 264 is placed in the corresponding second annular groove. In this way, seal failure can be avoided.

[0052] In one embodiment of the present application, please refer to Figure 1 , Figure 7 and Figure 8, the first calibration mechanism 20 further includes a first connection seat 27. The first connection seat 27 is detachably connected to the support head 21. The first connection seat 27 is connected to the power output end of the rotary drive 22. The first connection seat 27 seals one end of the first channel and the second channel away from the first adsorption hole 2101 and the second adsorption hole 2102. In this way, it can seal the end of the support head 21 away from the first adsorption hole 2101 and prevent the first adsorption hole 2101 and the second adsorption hole 2102 from leaking vacuum. Optionally, a seal is installed between the support seat and the first connection seat 27. In this way, the sealing effect between the support seat and the first connection seat 27 can be ensured. Optionally, the seal is a third sealing ring. A third annular groove is provided on the side of the support seat close to the first connection seat 27. The third sealing ring is placed in the third annular groove. In this way, seal failure can be prevented.

[0053] In an embodiment of the present application, please refer to Figures 1 to 3 , the valve assembly 28 includes a first control valve 281 and a second control valve 282. The first control valve 281 is communicated with the first adsorption hole 2101, and the second control valve 282 is communicated with the second adsorption hole 2102. By using the first control valve 281, it is possible to control the connection or disconnection between the external vacuum mechanism and the first air extraction hole 2612; by using the second control valve 282, it is possible to control the connection or disconnection between the external vacuum mechanism and the second air extraction hole 2622. Specifically, the first control valve 281 is communicated with the first air extraction hole 2612, and the second control valve 282 is communicated with the second air extraction hole 2622. Optionally, both the first control valve 281 and the second control valve 282 are three-way valves. Through the three-way valves, the loading and release of vacuum can be realized respectively.

[0054] In an embodiment, please refer to Figure 1 , Figure 6 and Figure 7 , the first moving platform 23 is an XY-axis moving platform or an XYZ three-axis moving platform. In this way, the position of the solder pad can be adjusted. Among them, the first moving platform 23 can drive the solder pad to move along the X-axis and the Y-axis.

[0055] In an embodiment of the present application, please refer to Figure 1 and Figure 6 , a spraying part 29 is installed on the first moving platform 23. The spraying part 29 is used to spray alcohol on the lower surface of the solder. The spraying part 29 is located on the side of the support head 21 close to the transmission device 200. In this way, when the solder pad is pasted, the lower surface of the solder pad and the surface of the substrate can be wetted by alcohol, so that the solder pad adheres to the substrate. When the alcohol volatilizes, the vacuum generated by the volatilization of alcohol can enhance the adhesion between the solder pad and the substrate, thereby preventing the solder pad from sliding when the substrate moves and ensuring the pasting accuracy. Optionally, the spraying part 29 is an atomizing nozzle. In this way, the alcohol can be sprayed evenly on the surface of the solder pad and prevent the alcohol from dripping and accumulating.

[0056] In one embodiment of the present application, please refer to Figures 1 to 3 , the feeding mechanism 10 includes a magazine 11, a first detector 12, a board taking assembly 13 and a first material taking assembly 14; the magazine 11 is used for supplying carrier boards, the carrier boards are used for carrying solder, and the magazine 11, the first detector 12, the board taking assembly 13 and the first material taking assembly 14 are installed on the machine table 100; each carrier board has an identification area, through which the solder carried on the carrier board can be identified to determine the type of solder, and the first detector 12 is used for detecting the identification area of the carrier board. After the first detector 12 detects the identification area, the type of solder on the corresponding carrier board can be identified; when the type of solder on the carrier board in the magazine 11 is the same as the required type of solder, the board taking assembly 13 is used for transporting the carrier board to the material taking position S1; when the carrier board is at the material taking position S1, the first material taking assembly 14 is used for transporting the solder on the carrier board to the first calibration mechanism 20. In this way, the solder on the carrier board in the magazine 11 can be automatically identified, and when changing the production product, automatic switching of the solder can be realized, so that there is no need for manual shutdown for material change, avoiding shutdown; and it is beneficial to prevent material feeding errors, and the carrier board can be automatically selected for feeding according to different products, and the first calibration mechanism 20 can be controlled to perform calibration according to the type of solder, making the production more flexible. Among them, the material feeding position S1 is the position of the carrier board when the first suction nozzle on the material taking arm of the first material taking assembly 14 sucks the solder.

[0057] In one embodiment of the present application, please refer to Figures 1 to 3 , the magazine 11 includes two magazine boxes 111, a bracket 112, a lifting driver 113 and a vertical frame 114. Each magazine box 111 is used for storing carrier boards, the bracket 112 supports the magazine boxes 111, the lifting driver 113 is used for driving the bracket 112 to lift, the vertical frame 114 is connected to the machine table 100, the lifting driver 113 is installed on the vertical frame 114, and the power output end of the lifting driver 113 is connected to the bracket 112. By driving the bracket 112 to lift through the lifting driver 113, the two magazine boxes 111 can be driven to lift, so as to facilitate the identification and output of the carrier boards. Optionally, the lifting driver 113 is a lead screw nut drive unit, which is convenient for accurately controlling the lifting height of the bracket 112. Optionally, a first slide rail is vertically installed on the vertical frame 114, and a first slider is installed on the bracket 112, and the first slider is slidably connected to the first slide rail. In this way, the stability of the lifting of the magazine boxes 111 can be improved.

[0058] In one embodiment, please refer to Figure 1 , Figure 2 and Figure 4, the plate taking assembly 13 includes two plate frames 131, two hook plate structures 132 and a second moving platform 133. Each plate frame 131 is used to carry the carrier plate. When each plate frame 131 is docked with the corresponding magazine 11, the corresponding hook plate structure 132 is used to transfer the carrier plate between the corresponding cartridge 111 and the corresponding plate frame 131. The second moving platform 133 is used to drive the plate frame 131 and the hook plate structure 132 to move for transferring the carrier plate. The plate frame 131 and the hook plate structure 132 are installed on the second moving platform 133, and the second moving platform 133 is installed on the machine table 100. In this way, the carrier plate in the cartridge 111 can be transferred to the picking position S1 to facilitate the picking by the first picking assembly 14, and the empty carrier plate can be transferred from the picking position S1 to the cartridge 111 for storage to achieve continuous feeding of solder. Specifically, the two cartridges 111 are arranged side by side, the two plate frames 131 correspond to the two cartridges 111 respectively, and the two hook plate structures 132 correspond to the two plate frames 131 respectively. In this way, the two cartridges 111 can simultaneously pick or deposit the carrier plates, so as to facilitate simultaneous feeding of two kinds of solder when multiple kinds of solder are required.

[0059] Optionally, the number of the first detectors 12 is two, and the positions of the two first detectors 12 correspond to the positions of the two cartridges 111 respectively. In this way, the carrier plates in the two cartridges 111 can be detected respectively by the two first detectors 12, so as to facilitate automatic identification and feeding of two kinds of solder simultaneously when changing the production product.

[0060] In one embodiment, please refer to Figure 2 , Figure 4 and Figure 5 , the hook plate structure 132 includes a lever 1321, a first driver 1322, a sliding seat 1324, a second support 1325 and a linear driving unit 1323. The first driver 1322 is used to drive the lever 1321 to stand up. The first driver 1322 is installed on the sliding seat 1324. The sliding seat 1324 is slidably installed on the second support 1325. The linear driving unit 1323 is used to drive the sliding seat 1324 to approach or move away from the magazine 11. The lever 1321 is installed at the power output end of the first driver 1322. The sliding seat 1324 is connected to the power output end of the linear driving unit 1323. The linear driving unit 1323 and the second support 1325 are installed on the second moving platform 133. In this way, the hook plate structure 132 can be located under the carrier plate, which can hide the hook plate structure 132 and effectively save space. Optionally, the first driver 1322 is a rotary telescopic driver, such as a rotary telescopic cylinder, which can reduce the stroke of the linear driving unit 1323.

[0061] In an embodiment of the present application, please refer to Figure 2 , Figure 4 and Figure 5, the linear drive unit 1323 includes a timing belt 13231, a first timing pulley 13232, a second timing pulley 13233, and a second driver 13234. The timing belt 13231 is connected to the sliding seat 1324. The second timing pulley 13233 cooperates with the first timing pulley 13232 to support the timing belt 13231. The second driver 13234 is used to drive the first timing pulley 13232 to rotate. The second driver 13234 and the second timing pulley 13233 are installed on the second moving platform 133, and the first timing pulley 13232 is installed at the power output end of the second driver 13234. In this way, by using the timing belt 13231 for transmission, the timing belt 13231 has a certain flexibility and can play a buffering role, which is beneficial to reducing noise. Optionally, a third slider is installed on the sliding seat 1324, and a third slide rail is installed on the second support 1325. The third slider is slidably connected to the third slide rail. In this way, the stability can be improved and the noise can be reduced. The second driver 13234 can be a motor or the like.

[0062] In one embodiment, please refer to Figure 1 and Figure 2 , the feeding mechanism 10 further includes a support plate 121, a first clamping seat 122, a support rod 123, and a second clamping seat 124. The support plate 121 is installed on the machine table 100, the first clamping seat 122 is installed on the support plate 121, the first clamping seat 122 clamps the support rod 123, the second clamping seat 124 clamps the support rod 123, and the first detector 12 is connected to the second clamping seat 124. In this way, by adjusting the rotation angle and position of the second clamping seat 124 and the first clamping seat 122 on the support rod 123, the angle and horizontal position of the first detector 12 can be adjusted, so that the first detector 12 can correspond to the position of the identification area on the corresponding carrier plate.

[0063] Optionally, a bracket is installed on the machine table 100, and the support plate 121 is installed on the bracket. In this way, the height of the support plate 121 can be made to correspond to the height position of the output of the carrier plate in the magazine 11. Optionally, a strip hole is opened on the support plate 121, and the length direction of the strip hole is perpendicular to both the vertical direction and the length direction of the support plate 121; a screw is inserted into the strip hole, and the screw is used to lock the support plate 121 to the bracket. In this way, it is convenient to adjust the horizontal position of the first detector 12 and control the distance between the first detector 12 and the cartridge case 111.

[0064] In an embodiment of the present application, please refer to Figure 1 and Figure 2 , the first detector 12 is a code reader. In this way, a bar code can be set in the identification area, and the type of solder on the carrier plate can be identified by reading the bar code with the code reader. Of course, the first detector 12 can also be a camera, and bar codes, two-dimensional codes, patterns, color blocks, etc. can be set in the identification area to distinguish the types of solder on the carrier plate.

[0065] In one embodiment of the present application, please refer to Figures 1 to 3 , a position sensor for detecting the position of the carrier board is installed on the machine platform 100, and the position sensor is located between the magazine 111 and the first detector 12. When the board taking assembly 13 extracts or inserts the carrier board into the magazine 111, the carrier board triggers the position sensor, and a signal indicating that the carrier board is extracted or inserted can be obtained. The position sensor can be a fiber optic opposed sensor. In this way, the fiber optic signal can be triggered when the carrier board is extracted or inserted.

[0066] In one embodiment of the present application, please refer to Figure 1 , Figure 2 and Figure 4 , the second moving platform 133 is an XY-axis moving platform or an XYZ three-axis moving platform. In this way, the position of the carrier board can be adjusted. Among them, the second moving platform 133 can drive the board rack 131 and the hook plate structure 132 to move along the X-axis and the Y-axis.

[0067] In one embodiment of the present application, please refer to Figure 1 and Figure 6 , the chip mounting mechanism 30 includes a second suction nozzle 31, a third driver 32, a third support 33, a fourth driver 34, a fourth support 35, a fifth driver 36 and a first base 37. The second suction nozzle 31 is used to suck solder. The third driver 32 is used to drive the second suction nozzle 31 to move up and down. The third support 33 supports the third driver 32. The fourth driver 34 is used to drive the third support 33 to move in the Y-axis direction. The fourth support 35 supports the fourth driver 34. The fifth driver 36 is used to drive the fourth support 35 to move in the X-axis direction. The first base 37 supports the fifth driver 36. The power output end of the third driver 32 is connected to the second suction nozzle 31. The third support 33 is slidably connected to the fourth support 35. The power output end of the fourth driver 34 is connected to the third support 33. The fourth support 35 is slidably connected to the first base 37. The first base 37 is connected to the machine platform 100. In this way, the movement of the solder along the X-axis direction, the Y-axis direction and the vertical direction can be controlled, so as to facilitate attaching the solder to the substrate. Moreover, through the second moving platform 133 and the fourth driver 34, the support head 21, the spraying part 29, the second suction nozzle 31 and the substrate can be controlled to be arranged along the X-axis direction, so as to facilitate the transmission of the solder. Optionally, the third driver 32 can be a rotary telescopic driver. In this way, the lifting and rotation of the second suction nozzle 31 can be realized. Optionally, the fourth driver 34 can be a lead screw nut drive unit, so that the Y-axis position of the second suction nozzle 31 can be accurately controlled. Optionally, the fifth driver 36 is a flat linear motor. In this way, the movement of the second suction nozzle 31 along the X-axis direction can be controlled. Among them, the Z-axis direction is the vertical direction.

[0068] In one embodiment of the present application, please refer to Figure 1 andFigure 6 , the transfer device 200 includes a first connection mechanism 81 and a second connection mechanism 82. The first connection mechanism 81 is used to transfer the substrate. The first connection mechanism 81 is located on the transfer path of the chip mounting mechanism 30. The second connection mechanism 82 is used to transfer the substrate, and the second connection mechanism 82 can be docked with the first connection mechanism 81. The second connection mechanism 82 is located on the transfer path of the second chip mounting device 400. In this way, the position of the substrate can be controlled by the first connection mechanism 81 so that the chip mounting mechanism 30 can mount the solder on the substrate on the first connection mechanism 81; the position of the substrate can be controlled by the second connection mechanism 82 so that the second chip mounting device 400 can mount the chip on the substrate on the second connection mechanism 82. This can avoid interference between the substrate on the first connection mechanism 81 and the substrate on the second connection mechanism 82, making the operation of the first chip mounting device 300 and the second chip mounting device 400 relatively independent, ensuring the chip mounting efficiency, and improving the stability of the operation of the chip mounter.

[0069] In one embodiment, please refer to Figure 1 and Figure 6 , the first connection mechanism 81 includes a transfer component, a second base, a linear drive module, and a third base. The transfer component is used to drive the substrate to move along the Y-axis. The second base supports the transfer component. The linear drive module is used to drive the second base to move along the Y-axis. The transfer component is installed on the second base. The second base is slidably installed on the third base. The linear drive module is installed on the third base. The third base is connected to the machine table 100. The power output end of the linear drive module is connected to the second base. In this way, the second base can be driven to move by the linear drive module, driving the transfer component to dock with the second connection mechanism 82; after docking, the transfer component can transfer the substrate to the second connection mechanism 82. Optionally, the transfer component is a belt transfer component, which is convenient for transferring the substrate to the second connection mechanism 82. The linear drive module component is a lead screw and nut transfer component. In this way, the position of the transfer component can be accurately controlled.

[0070] Optionally, the structure of the second connection mechanism 82 is the same as that of the first connection mechanism 81. In this way, it is convenient for the first connection mechanism 81 to dock with the second connection mechanism 82, which is beneficial to reducing the equipment cost. The first connection mechanism 81 and the second connection mechanism 82 are arranged along the Y-axis direction, which is convenient for connecting multiple chip mounters to achieve pipeline operation.

[0071] In one embodiment of the present application, please refer to Figure 1 and Figure 9, the second chip mounting device 400 includes a loading mechanism 40, a crystal supply mechanism 50, a second calibration mechanism 60, and a transfer mechanism 70. The loading mechanism 40 is used to supply a crystal ring. The crystal supply mechanism 50 is used to adjust the rotation angle of the crystal ring. The second calibration mechanism 60 is used to calibrate the position and angle of the chip. The transfer mechanism 70 includes a crystal ring transfer component 71, a second pick-up component 72, a mounting component 73, and a linear drive component 74. The crystal ring transfer component 71 is used to transfer the crystal ring from the loading mechanism 40 to the crystal supply mechanism 50. The second pick-up component 72 is used to transfer the chip from the crystal supply mechanism 50 to the second calibration mechanism 60. The mounting component 73 is used to mount the chip on the second calibration mechanism 60 onto the substrate. The linear drive component 74 is used to drive the crystal ring transfer component 71, the second pick-up component 72, and the mounting component 73 to reciprocate in the same direction. The linear drive component 74 is connected to the crystal ring transfer component 71, the second pick-up component 72, and the mounting component 73. The loading mechanism 40, the crystal supply mechanism 50, the second calibration mechanism 60, and the linear drive component 74 are installed on the machine table 100. This can make the crystal ring loading and chip attachment paths straight, facilitating the layout of the second chip mounting device 400, convenient for control, and conducive to improving the chip mounting position accuracy. Optionally, the structure of the second calibration mechanism 60 is the same as that of the first calibration mechanism 20. In this way, the calibration of different chips can be realized to meet the feeding requirements of different chips.

[0072] In one embodiment, please refer to Figure 1 and Figure 9 , a fourth base for supporting the linear drive component 74 is installed on the machine table 100. A first sliding seat 75, a second sliding seat 76, and a third sliding seat 77 are slidably installed on the fourth base. The first sliding seat 75 supports the crystal ring transfer component 71. The second sliding seat 76 supports the second pick-up component 72. The third sliding seat 77 supports the mounting component 73. In this way, the stability and position accuracy of the crystal ring and chip transfer can be improved.

[0073] In one embodiment, please refer to Figure 9 , the linear drive component 74 is a flat linear motor. The linear drive component 74 includes a linear stator, a first mover, a second mover, and a third mover. The first mover is installed on the first sliding seat 75. The second mover is installed on the second sliding seat 76. The third mover is installed on the third sliding seat 77. In this way, the crystal ring transfer component 71, the second pick-up component 72, and the mounting component 73 can be respectively controlled to reciprocate linearly.

[0074] In one embodiment, please refer to Figure 9, a second detector 79 is installed on the first sliding seat 75. The second detector 79 can be a barcode scanner, a camera, or the like. The second detector 79 is used to detect the identification area of the crystal ring to identify the type of chip on the crystal ring. Of course, the first detector 12 can also be a camera, and barcodes, two-dimensional codes, patterns, color blocks, etc. can be set in the identification area to distinguish the types of chips on the crystal ring.

[0075] Optionally, a second CCD camera 78 is installed on the first sliding seat 75. The second CCD camera 78 is used to detect the position and angle of the chip of the crystal supply mechanism 50, so as to adjust the rotation angle of the crystal ring and control the position and angle of the chip when the second picking component 72 picks up the chip.

[0076] In one embodiment, please refer to Figure 1 and Figure 10 , the crystal supply mechanism 50 includes a rotating component 51 and an ejecting component 52. The rotating component 51 is used to drive the crystal ring to rotate to adjust the rotation angle of the crystal ring. The rotating component 51 and the ejecting component 52 are installed on the machine table 100. The ejecting component 52 is used to pierce the blue film and eject the chip. After the crystal ring transmission component 71 transmits the crystal ring to the rotating component 51, the rotating component 51 fixes the crystal ring, and then adjusts the rotation angle of the crystal ring so that the angle of the chip on the crystal ring meets the feeding requirement; then the ejecting component 52 ejects upward, pierces the blue film on the crystal ring, and ejects the chip on the blue film to facilitate the second picking component 72 to pick up the chip.

[0077] In this embodiment, please refer to Figure 1 and Figure 10 , the crystal supply mechanism 50 further includes a heating component 53 installed on the machine table 100. The heating component 53 is used to heat the blue film to facilitate the separation of the chip from the blue film. The heating component 53 can be a hot air blower, so that the blue film can be heated by hot air.

[0078] Please refer to Figures 10 to 12, the ejecting assembly 52 includes a needle sleeve 521, a ejector pin 522, a heating element 523, a first lifting driver 524, a second lifting driver 525 and a third moving platform 526. The needle sleeve 521 is used to adsorb the blue film; the ejector pin 522 is used to pierce the blue film and lift the chip on the blue film. The ejector pin 522 is slidably inserted into the needle sleeve 521; the heating element 523 is installed on the needle sleeve 521, and the heating element 523 is used to heat the needle sleeve 521; the first lifting driver 524 is used to drive the needle sleeve 521 to lift and lower, and the power output end of the first lifting driver 524 is connected to the needle sleeve 521; the second lifting driver 525 is used to drive the ejector pin 522 to lift and lower, and the power output end of the second lifting driver 525 is connected to the ejector pin 522. When the second lifting driver 525 drives the ejector pin 522 to rise, the top end of the ejector pin 522 can extend out of the needle sleeve 521, pierce the blue film adsorbed on the needle sleeve 521, and lift the chip on the blue film; the third moving platform 526 is used to drive the first lifting driver 524 and the second lifting driver 525 to move to adjust the positions of the needle sleeve 521 and the ejector pin 522. The first lifting driver 524 and the second lifting driver 525 are installed on the third moving platform 526. By adopting the heating element 523, the needle sleeve 521 can be heated, and when the needle sleeve 521 contacts the blue film, the blue film can be heated to change the viscosity between the chip and the blue film, making the viscosity between the blue film and the chip more stable and the stability of chip separation higher, thereby improving the crystal suction effect.

[0079] In an embodiment of the present application, please refer to Figures 10 to 12 , the needle sleeve 521 includes a sleeve 5211 and a second connecting seat 5212. The second connecting seat 5212 supports the sleeve 5211. The sleeve 5211 and the second connecting seat 5212 are sleeved on the ejector pin 522. The sleeve 5211 is located on the side of the second connecting seat 5212 away from the second lifting driver 525. The second connecting seat 5212 is connected to the power output end of the first lifting driver 524, and the heating element 523 is connected to the second connecting seat 5212. This facilitates the installation of the heating element 523 and can prevent the heating element 523 from occupying the space around the sleeve 5211.

[0080] In an embodiment of the present application, please refer to Figures 10 to 12 , the second connecting seat 5212 includes a mounting plate and a support cylinder. The support cylinder is arranged on the mounting plate. The mounting plate is connected to the power output end of the first lifting driver 524. The support cylinder is connected to the sleeve 5211, and the heating element 523 is installed on the mounting plate. Using the mounting plate is convenient for connecting to the power output end of the first lifting driver 524 and is also convenient for installing the heating element 523. The first lifting driver 524 can be a motor eccentric wheel structure or a linear motor, and the second lifting driver 525 can be a voice coil motor or a linear motor, etc.

[0081] In an embodiment of the present application, please refer toFigures 10 to 12 On the third moving platform 526, a first lifting seat 5241 is slidably installed. The power output end of the first lifting driver 524 is connected to the first lifting seat 5241. A heat insulation plate 527 is installed on the first lifting seat 5241, and the heat insulation plate 527 supports the needle sleeve 521. By slidably connecting the first lifting seat 5241 with the third moving platform 526, the stability of the lifting of the needle sleeve 521 can be improved, and the position accuracy of the top of the sleeve 5211 can be improved. The heat insulation plate 527 is spaced between the first lifting seat 5241 and the mounting plate, which can prevent heat from being transferred to the first lifting driver 524 and reduce heat dissipation. In addition, this facilitates the sealing of the ejector pin 522, avoiding the sealing failure caused by the heating of the corresponding connection part when the heating element 523 is heated. Optionally, there is a gap between the heat insulation plate 527 and the ejector pin 522, which can prevent the heat insulation plate 527 from directly contacting the ejector pin 522 and causing the ejector pin 522 to heat up and rise in temperature.

[0082] Optionally, a guide rail assembly is vertically installed on the third moving platform 526. The third moving platform 526 and the first lifting seat 5241 are slidably connected through the guide rail assembly. In this way, it is convenient to control the lifting of the first lifting seat 5241 in the vertical direction. The guide rail assembly can be a crossed roller guide rail, which has high precision and good stability.

[0083] In an embodiment of the present application, please refer to Figures 10 to 12 A third air extraction hole is formed in the heat insulation plate 527. One end of the third air extraction hole is used for connecting with an external vacuum mechanism, and the other end of the third air extraction hole is communicated with the inner cavity of the needle sleeve 521. In this way, the third air extraction hole can be connected to the external vacuum mechanism, and the external vacuum mechanism is used to extract vacuum, so that the top of the sleeve 5211 adsorbs the blue film. Setting the third air extraction hole on the heat insulation plate 527 is convenient for processing. Since the heat insulation plate 527 has strong heat resistance, it is convenient to seal between the heat insulation plate 527 and the mounting plate and the first lifting seat 5241, and it is convenient to connect the external vacuum mechanism, which can prevent vacuum leakage. Optionally, the heat insulation plate 527 is a silica gel plate or a nylon plate, etc.

[0084] In an embodiment of the present application, please refer to Figures 10 to 12 The heat insulation plate 527 and the first lifting seat 5241 are sleeved on the ejector pin 522. Both sides of the heat insulation plate 527 are hermetically connected to the needle sleeve 521 and the first lifting seat 5241 respectively, and the first lifting seat 5241 is hermetically connected to the ejector pin 522. Specifically, the heat insulation plate 527 is hermetically connected to the mounting plate. This can prevent air leakage between the heat insulation plate 527, the first lifting seat 5241 and the mounting plate, and can ensure the stability of the suction force when the sleeve 5211 adsorbs the blue film.

[0085] Optionally, a fourth sealing ring is installed between the heat insulation plate 527 and the first lifting seat 5241, so that the sealing between the heat insulation plate 527 and the first lifting seat 5241 can be achieved through the fourth sealing ring. Optionally, a fourth annular groove is formed on the side of the heat insulation plate 527 close to the first lifting seat 5241, and the fourth sealing ring is placed in the fourth annular groove. This facilitates the positioning of the fourth sealing ring, can prevent the fourth sealing ring from being damaged or displaced, and prevent sealing failure.

[0086] Optionally, a fifth sealing ring is installed between the heat insulation plate 527 and the mounting plate, so that the sealing between the heat insulation plate 527 and the mounting plate can be achieved through the fifth sealing ring. Optionally, a fifth annular groove is formed on the side of the heat insulation plate 527 close to the mounting plate, and the fifth sealing ring is placed in the fifth annular groove. This facilitates the positioning of the fifth sealing ring, can prevent the fifth sealing ring from being damaged or displaced, and prevent sealing failure.

[0087] In an embodiment of the present application, please refer to Figures 10 to 12 , a second lifting seat 5251 is slidably installed on the first lifting seat 5241. The power output end of the second lifting driver 525 is connected to the second lifting seat 5251, and the ejector pin 522 is connected to the second lifting seat 5251. By slidingly connecting the second lifting seat 5251 with the first lifting seat 5241, the stability of the lifting of the ejector pin 522 can be improved, and the position accuracy of the top of the ejector pin 522 can be improved.

[0088] Optionally, a second slide rail is vertically installed on the first lifting seat 5241, and a second slider is installed on the second lifting seat 5251. The second slider is slidably connected to the second slide rail. In this way, it is convenient to control the stability of the second lifting seat 5251 to lift in the vertical direction.

[0089] In an embodiment of the present application, please refer to Figures 10 to 12 , the heating element 523 is a heating rod. An installation hole is formed in the needle sleeve 521, and the heating element 523 is inserted into the installation hole. Specifically, the installation hole is formed in the mounting plate, so that the heating rod can be in full contact with the mounting plate, thereby increasing the heat transfer efficiency, preventing the heating rod from being exposed, and improving safety. Optionally, the heating rod is located near the support cylinder, so as to reduce the heat transfer distance. Optionally, the number of heating rods is two, and the two heating rods are respectively located on opposite sides of the support cylinder, which is beneficial to the uniform heating of the mounting plate, the support cylinder and the sleeve 5211.

[0090] In an embodiment of the present application, please refer to Figures 10 to 12, a temperature sensor 528 is installed on the needle sleeve 521. The temperature sensor 528 is used to detect the temperature of the needle sleeve 521. In this way, the heating power of the heating element 523 can be adjusted according to the temperature of the needle sleeve 521, which is convenient for real-time control of the temperature of the needle sleeve 521 and ensures the stability of the temperature of the needle sleeve 521. Optionally, the temperature sensor 528 is connected to the mounting plate, and the temperature sensor 528 is located near the support cylinder. In this way, the measured temperature can be close to the temperature of the connection part between the support cylinder and the mounting plate, so as to quickly adjust the power of the heating element 523.

[0091] In an embodiment of the present application, please refer to Figures 10 to 12 , the third moving platform 526 is an XY-axis moving platform or an XYZ three-axis moving platform. In this way, the positions of the ejector pin 522 and the needle sleeve 521 can be adjusted. Among them, the third moving platform 526 can drive the first lifting driver 524 and the second lifting driver 525 to move along the X-axis and the Y-axis.

[0092] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip mounter, characterized in that, Including: Machine platform (100); Transfer device (200), installed on the machine platform (100) for transferring substrates; First chip mounter (300), including a feeding mechanism (10) for supplying solder, a first calibration mechanism (20) for calibrating the solder, and a chip mounting mechanism (30) for mounting the solder on the first calibration mechanism (20) onto the substrate. The feeding mechanism (10), the first calibration mechanism (20), and the chip mounting mechanism (30) are installed on the machine platform (100); And, Second chip mounter (400), for mounting chips on the crystal ring onto the substrate. The second chip mounter (400) is installed on the machine platform (100).

2. The mounter according to claim 1, characterized in that: The first calibration mechanism (20) includes a support head (21), a rotation driver (22) for driving the support head (21) to rotate to adjust the angle of the solder, a first moving platform (23) for driving the rotation driver (22) to move to adjust the position of the solder, a first CCD camera (24) for detecting the position and angle of the solder, and a first support (25) for supporting the first CCD camera (24). The support head (21) is installed at the power output end of the rotation driver (22), the rotation driver (22) is installed on the first moving platform (23), and the first moving platform (23) and the first support (25) are installed on the machine platform (100).

3. The mounter according to claim 2, characterized in that: The support head (21) is provided with a first adsorption hole (2101) suitable for adsorbing the first solder and a plurality of second adsorption holes (2102) suitable for adsorbing the second solder. The first adsorption hole (2101) is located in the middle of the support head (21), and the plurality of second adsorption holes (2102) are arranged around the first adsorption hole (2101). A valve assembly (28) for controlling the connection of the first adsorption hole (2101) and the second adsorption holes (2102) to an external vacuum mechanism is installed on the first moving platform (23), and the valve assembly (28) is respectively connected to the first adsorption hole (2101) and the second adsorption holes (2102) through pipelines.

4. The mounter according to claim 3, characterized in that: On the outer peripheral surface of the support head (21), a first air outlet hole (2103) communicating with the first adsorption hole (2101) and a second air outlet hole (2104) communicating with the second adsorption hole (2102) are provided; on the first moving platform (23), a first connecting plate (261) and a second connecting plate (262) are installed. The first connecting plate (261) and the second connecting plate (262) are both rotatably sleeved on the support head (21). A first air extraction hole (2612) communicating with the first air outlet hole (2103) is provided on the first connecting plate (26), and a second air extraction hole (2622) communicating with the second air outlet hole (2104) is provided on the second connecting plate (262). The first air extraction hole (2612) and the second air extraction hole (2622) are respectively communicated with the valve assembly (28).

5. The mounter according to claim 2, characterized in that: On the first moving platform (23), a spraying member (29) for spraying alcohol on the lower surface of the solder is installed. The spraying member (29) is located on one side of the support head (21) close to the conveying device (200).

6. The mounter according to claim 1, wherein: The feeding mechanism (10) includes a magazine (11) for supplying carrier plates, a first detector (12) for detecting an identification area on the carrier plate to identify the type of the solder, a plate taking assembly (13) for conveying the corresponding carrier plate to the material taking position (S1) when the solder on the carrier plate is the required solder, and a first material taking assembly (14) for conveying the solder on the carrier plate to the first calibration mechanism (20). The magazine (11), the first detector (12), the plate taking assembly (13), and the first material taking assembly (14) are respectively installed on the machine table (100).

7. The mounter according to claim 6, characterized in that: The magazine (11) includes two magazine boxes (111) for respectively storing carrier plates, a bracket (112) for supporting the two magazine boxes (111), a lifting driver (113) for driving the bracket (112) to lift, and a vertical frame (114) for supporting the lifting driver (113). The vertical frame (114) is connected to the machine table (100), and the power output end of the lifting driver (113) is connected to the bracket (112).

8. The mounter according to claim 7, characterized in that: The plate taking assembly (13) includes a plate frame (131) for respectively docking with each magazine box (111), a hook plate structure (132) for respectively conveying the carrier plate between each magazine box (111) and the corresponding plate frame (131), and a second moving platform (133) for driving the hook plate structure (132) and the plate frame (131) to move. Each plate frame (131) and each hook plate structure (132) are installed on the second moving platform (133). The second moving platform (133) is installed on the machine table (100); the number of the first detectors (12) is two, and the positions of the two first detectors (12) respectively correspond to the positions of the two magazine boxes (111) one by one.

9. The pick-and-place machine according to any one of claims 1 to 8, characterized in that: The transmission device (200) comprises a first docking mechanism (81) for transmitting the substrate, and a second docking mechanism (82) for transmitting the substrate and docking with the first docking mechanism (81); the first docking mechanism (81) is located on the transmission path of the patch mechanism (30), and the second docking mechanism (82) is located on the transmission path of the second patch device (400).

10. The mounter according to any one of claims 1 to 8, characterized in that: The second chip placement device (400) includes a loading mechanism (40) for supplying a crystal ring, a crystal supply mechanism (50) for adjusting the rotation angle of the crystal ring, a second correction mechanism (60) for correcting the position and angle of the chip, and a transmission mechanism (70); the transmission mechanism (70) includes a crystal ring transmission component (71) for transmitting the crystal ring from the loading mechanism (40) to the crystal supply mechanism (50), a second material removal component (72) for transmitting the chip from the crystal supply mechanism (50) to the second correction mechanism (60), and a second correction mechanism (60) for correcting the position and angle of the chip. 0) is mounted on a mounting assembly (73) on the substrate, and a linear drive assembly (74) for respectively driving the crystal ring transmission assembly (71), the second material picking assembly (72) and the mounting assembly (73) to move back and forth in the same direction; the linear drive assembly (74) is connected to the crystal ring transmission assembly (71), the second material picking assembly (72) and the mounting assembly (73), and the loading mechanism (40), the crystal supply mechanism (50), the second correction mechanism (60) and the linear drive assembly (74) are installed on the machine (100).

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