Heat dissipation module, terminal and heat dissipation structure manufacturing method

Abstract

This disclosure relates to a heat dissipation module, terminal, and heat dissipation structure manufacturing method. The heat dissipation module includes: a housing with a heat dissipation cavity internally, at least one of the cavity walls of the heat dissipation cavity being transparent; a capillary structure located within the heat dissipation cavity; and a heat transfer medium that is in a liquid or solid phase at or below a first preset temperature, and in a gaseous phase above the first preset temperature; the heat transfer medium being opaque in the liquid or solid phase. The transparent at least one cavity wall enables visual monitoring of the heat dissipation process of the heat dissipation module. This visual monitoring improves the accuracy of the simulated heat transfer medium during application within the terminal, bringing the heat dissipation module closer to practical industrial applications.

Description

Technical Field

[0001] The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation module, a terminal, and a method for manufacturing a heat dissipation structure. Background Art

[0002] With the rapid development of communications technology and the mobile internet, terminal upgrades are accelerating to meet consumers' ever-increasing demands in business and modern life. With the advent of the Internet of Everything and the 5G era, terminal performance is improving at an ever-increasing rate. Generally speaking, higher-performance products of the same generation and architecture generate more heat. To meet users' pursuit of a comfortable experience, improving terminal heat dissipation capabilities is becoming increasingly urgent.

[0003] In the early stage of stacking the terminal heat dissipation solution, when designing the heat dissipation module, the commonly used implementation plan generally includes: according to the hardware performance of the terminal, calculate the heat dissipation capacity (i.e. heat dissipation power) that needs to be matched, and then reversely deduce the area of ​​the required heat dissipation module, and then design the solution accordingly. However, the application of heat dissipation modules in terminals is subject to many restrictions, such as the layout of the CPU (Central Processing Unit), the battery adhesive area, the overall strength of the terminal, etc., and it is almost difficult to achieve a regular rectangular shape. When estimating the heat dissipation capacity of the irregular shape of the heat dissipation module, simulation software is generally used for simulation. However, it is difficult to fully simulate the actual state of the heat dissipation medium in the heat dissipation module. In the end, it often happens that after the heat dissipation module that passes the simulation is installed in the terminal, hot spots still appear on the surface of the terminal, resulting in a poor user experience. Summary of the Invention

[0004] The present disclosure provides a heat dissipation module, a terminal, and a method for manufacturing a heat dissipation structure.

[0005] According to a first aspect of an embodiment of the present disclosure, there is provided a heat dissipation module, comprising:

[0006] The housing has a heat dissipation cavity therein, and at least one cavity wall of the heat dissipation cavity is transparent;

[0007] a capillary structure located in the heat dissipation cavity;

[0008] The heat transfer medium is in a liquid phase or a solid phase when the temperature is equal to or lower than a first preset temperature, and is in a gas phase when the temperature is higher than the first preset temperature; the heat transfer medium in the liquid phase or the solid phase is opaque.

[0009] In some embodiments, the capillary structure is a transparent structure.

[0010] In some embodiments, the housing includes a first housing and a second housing, and the second housing is combined with the first housing to form the heat dissipation cavity.

[0011] In some embodiments, the first shell and the second shell are connected by waterproof adhesive.

[0012] In some embodiments, the color of the heat transfer medium is different from the color of the housing and the color of the capillary structure.

[0013] In some embodiments, the heat transfer medium includes: water mixed with pigment.

[0014] In some embodiments, the shell and the capillary structure are both made of resin or glass.

[0015] In some embodiments, the heat dissipation module further includes:

[0016] A support column is located in the heat dissipation cavity;

[0017] The first end of the support column is connected to the first shell or the second shell, and the second end of the support column is in contact with the capillary structure; or,

[0018] The first end of the support column is connected to the first shell, the support column passes through the capillary structure, and the second end of the support column abuts against the second shell; wherein the second end is the opposite end of the first end.

[0019] According to a second aspect of an embodiment of the present disclosure, there is provided a terminal, comprising the heat dissipation module and the heat generation module according to any one of the above embodiments;

[0020] The heat dissipation module is arranged adjacent to the heat generating module and is used to dissipate heat from the heat generating module.

[0021] According to three aspects of the embodiments of the present disclosure, a method for manufacturing a heat dissipation structure is provided, comprising:

[0022] Monitoring the flow information of the heat transfer medium of the heat dissipation module provided by any of the above embodiments;

[0023] Determining whether the heat dissipation capacity of the heat dissipation module meets the expected heat dissipation requirements based on the flow condition information;

[0024] When the heat dissipation capability of the heat dissipation module meets the expected heat dissipation requirements, the structural parameters of the heat dissipation module are recorded, wherein the structural parameters are used for industrial production of the heat dissipation module.

[0025] In some embodiments, the method further comprises:

[0026] When the heat dissipation capacity of the heat dissipation module does not meet the expected heat dissipation requirements, the structural parameters of the heat dissipation module are adjusted until the heat dissipation capacity of the heat dissipation module after the structural parameters are adjusted meets the expected heat dissipation requirements.

[0027] In some embodiments, the flow condition information includes: the flow direction, flow velocity and / or flow form of the heat transfer medium; wherein the flow form includes: laminar flow or turbulent flow.

[0028] In some embodiments, monitoring the flow information of the heat transfer medium of the heat dissipation module provided in any of the above embodiments further includes:

[0029] Monitor the flow information of the heat transfer medium of the heat dissipation module provided by any of the above embodiments placed in an environment with a second preset temperature.

[0030] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0031] As can be seen from the above embodiments, the present disclosure utilizes a physical heat dissipation module during the development phase prior to industrial production, effectively simulating the flow of the heat transfer medium within the module. By utilizing at least one transparent cavity wall, visual monitoring of the heat dissipation process within the module is achieved. This visual monitoring improves the accuracy of the simulation of the heat transfer medium during application within the terminal, bringing the module closer to actual application. This ensures the heat dissipation effectiveness of an industrially applicable heat dissipation structure, manufactured using the module's structural parameters, reduces the occurrence of hot spots on the terminal surface, and enhances the user experience.

[0032] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0034] Figure 1 This is a schematic diagram of the working principle of a heat dissipation module;

[0035] Figure 2 is a schematic diagram showing the composition of a heat dissipation module according to an exemplary embodiment;

[0036] Figure 3 is a schematic flow chart of a method for manufacturing a heat dissipation structure according to an exemplary embodiment;

[0037] Figure 4 The figure is a schematic diagram of a device for heat dissipation structure according to an exemplary embodiment. DETAILED DESCRIPTION

[0038] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present disclosure. Rather, they are merely examples of devices consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0039] The present disclosure provides a heat dissipation module, comprising:

[0040] The housing 10 has a heat dissipation cavity 40 therein, and at least one cavity wall of the heat dissipation cavity 40 is transparent;

[0041] The capillary structure 20 is located in the heat dissipation cavity 40;

[0042] The heat transfer medium is in a liquid phase or a solid phase when the temperature is equal to or lower than a first preset temperature, and is in a gas phase when the temperature is higher than the first preset temperature; the heat transfer medium in the liquid phase or the solid phase is opaque.

[0043] like Figure 1 As shown, Figure 1 The solid arrow in the middle points to the flow direction of the heat transfer medium, and the hollow arrow points to the direction of heat transfer. The heat dissipation principle of the heat dissipation module is roughly as follows: the shell 10 forms the cavity wall of the heat dissipation cavity 40, and part of the cavity wall serves as the hot end, which is used to receive the heat of the heating element in the terminal. Part of the cavity wall serves as the cold end. The cavity wall serving as the cold end is generally spaced a certain distance from the cavity wall serving as the hot end. For example: the cavity walls at the two opposite surfaces of the shell 10 serve as the cold end or the hot end respectively. The heat transfer medium in the heat dissipation cavity 40 is changed from liquid phase to gas phase to absorb heat. When the gas phase heat transfer medium touches the area with lower temperature of the cavity wall (i.e., the cold end), it condenses into liquid, and the liquid heat transfer medium is recovered to the heating area (i.e., the hot end) through the capillary structure 20, and this cycle is repeated to achieve the purpose of heat dissipation.

[0044] Generally, the capillary structure 20 has pores, and the capillary structure 20 can provide power for the circulation of the heat transfer medium in the heat dissipation cavity 40 through the capillary action of the pores. Without limitation, the capillary structure 20 is a honeycomb structure or a mesh structure.

[0045] In the disclosed embodiment, the heat dissipation module can be used as a sample to simulate an industrial heat dissipation structure. It is convenient to continuously adjust the structural parameters during the development and design process to obtain a heat dissipation module that meets the expected heat dissipation capacity, and use the structural parameters of the heat dissipation module that meets the expected heat dissipation capacity for industrial production. If the flow of the heat transfer medium does not meet expectations, the structural parameters can be quickly adjusted, and the new sample can be optimized and corrected, and iterated quickly to achieve a more accurate and effective design. Among them, the structural parameters include but are not limited to: the volume of the heat dissipation cavity 40, the thickness of the cavity wall, the surface area of ​​the cavity wall, the gap size of the capillary structure 20, and the amount of heat transfer medium, etc.

[0046] In practical applications, to better accommodate the confined space within a terminal, the heat dissipation module is typically a thin, roughly sheet-like structure. The cold end and hot end can be the two walls of the heat dissipation cavity 40 with the largest surface area. These two walls are located on opposite sides of the capillary structure 20. To facilitate monitoring of the flow of the heat transfer medium, at least one of the two walls with the largest surface area of ​​the heat dissipation cavity 40 is transparent. Through the transparent cavity wall, the flow of the heat transfer medium can be easily, intuitively, and accurately monitored.

[0047] In some embodiments, the transparent cavity wall may also be the side wall connecting the two largest cavity walls, that is, the side walls at the edge of the shell are all transparent. Through the transparent side wall, it is convenient to visually monitor the rising or falling flow process of the heat transfer medium.

[0048] In some embodiments, there are multiple transparent cavity walls, which may be two adjacent ones. It is more convenient to monitor the flow of the heat transfer medium if both adjacent cavity walls are transparent.

[0049] In some embodiments, all cavity walls are transparent, ie, the housing is transparent.

[0050] The heat dissipation cavity 40 is a sealed cavity to prevent the heat dissipation medium from flowing out of or overflowing the heat dissipation cavity 40 .

[0051] Opaque heat transfer media is more conducive to monitoring the flow of heat transfer media.

[0052] In some embodiments, the pressure in the heat dissipation cavity 40 is lower than the pressure of the external environment, that is, the heat dissipation cavity 40 is in a negative pressure state. Under ideal conditions, the heat dissipation cavity 40 is in a vacuum state, and the heat transfer medium is located in a vacuum environment. Here, the external environment refers to the working environment of the heat dissipation module. For example, the external environment can be the internal space of the terminal. The pressure reduction can lower the boiling point of the heat transfer medium filled in the heat dissipation cavity 40, making the heat transfer medium in the heat dissipation cavity 40 more likely to undergo phase change, further improving the heat transfer efficiency. Generally speaking, the lower the air pressure in the heat dissipation cavity 40, the lower the boiling point of the heat transfer medium in the heat dissipation cavity 40, and the more conducive to improving the heat transfer efficiency.

[0053] The heat transfer medium within the heat dissipation cavity 40 can be in at least one of a solid, liquid, or gaseous state. For example, if the heat transfer medium is water and the heat dissipation cavity 40 is under negative pressure, the heat transfer medium can exist in a solid phase when not absorbing heat from the heat source. After absorbing heat at the hot end, the heat transfer medium first changes from a solid phase to a liquid phase, and then from a liquid phase to a gaseous phase. The gaseous heat transfer medium condenses into a liquid phase upon contact with the cold end. The liquid phase heat transfer medium then returns to the hot end under the action of the capillary structure 20, and this cycle repeats. Since the heat transfer medium also absorbs some heat when it changes from a solid phase to a liquid phase, a heat transfer medium that is initially in a solid phase can further enhance the heat dissipation capacity of the heat dissipation module.

[0054] The first preset temperature may be a phase change temperature of the heat transfer medium, for example, a vaporization temperature of the heat transfer medium.

[0055] This disclosure utilizes a physical heat dissipation module during the development phase prior to industrial production, effectively simulating the flow of heat transfer media within the module. By utilizing at least one transparent cavity wall, visual monitoring of the heat dissipation process within the module is achieved. This visual monitoring improves the accuracy of the simulated heat transfer media application within the terminal, bringing the module closer to practical industrial application. This ensures the heat dissipation effectiveness of an industrially applicable heat dissipation structure, manufactured using the module's structural parameters, reduces the occurrence of hot spots on the terminal surface, and enhances the user experience.

[0056] In other optional embodiments, the capillary structure 20 is a transparent structure.

[0057] The transparent capillary structure 20 further facilitates monitoring the flow of the heat transfer medium.

[0058] In some embodiments, the shell 10 and the capillary structure 20 are both transparent. The heat dissipation module with an overall transparent structure is more convenient for monitoring the flow of the heat transfer medium in the heat dissipation cavity 40, thereby improving the accuracy of judging the heat dissipation capacity of the heat dissipation module.

[0059] In other optional embodiments, the housing 10 includes a first housing 11 and a second housing 12 , and the second housing 1210 is combined with the first housing 11 to form the heat dissipation cavity 40 .

[0060] like Figure 2 As shown, the capillary structure 20 is located between the first shell 11 and the second shell 12, and the surface area of ​​the capillary structure 20 is substantially equal to the cross-sectional area of ​​the shell 10. The first shell 11 and / or the second shell 12 are transparent to facilitate monitoring of the flow of the heat transfer medium.

[0061] In some embodiments, the first housing 11 is a cover, that is, the first housing 11 is formed into a groove with an opening, and the second housing 12 is a plate. The second housing 12 covers the groove and is connected to the first housing 11 to form a closed heat dissipation cavity 40. Alternatively, both the first housing 11 and the second housing 12 are formed into covers.

[0062] In practical applications, when the first shell 11 serves as a hot end, the second shell 12 serves as a cold end. When the first shell 11 serves as a cold end, the second shell 12 serves as a hot end.

[0063] In other optional embodiments, the first shell 11 and the second shell 12 are connected by waterproof adhesive.

[0064] In actual applications, to extend service life and ensure product quality, the first and second shells of the heat dissipation structure within the terminal often require welding. However, during the development and design process, when simulating the heat dissipation capacity of the heat dissipation module, there is no need to overemphasize the connection strength between the first shell 11 and the second shell 12. It is only necessary to ensure the connection strength between the first shell 11 and the second shell 12 within a short period of time such as simulation testing, and an adhesive connection can meet this requirement. Moreover, the adhesive connection operation process is simple and convenient, saving time in the production process of the heat dissipation module, thereby reducing the development and design time of the heat dissipation module.

[0065] The waterproof glue can reduce the influence of the heat transfer medium and ensure the connection strength between the first shell 11 and the second shell 12 .

[0066] Waterproof glue includes but is not limited to epoxy glue or acrylic glue.

[0067] In other optional embodiments, the color of the heat transfer medium is different from the color of the housing 10 and the color of the capillary structure 20 .

[0068] Colored heat transfer media further facilitates visual monitoring of heat transfer medium flow. For example, when both the housing 10 and the capillary structure 20 are transparent, the heat transfer medium can be colored red, yellow, or blue. During the flow, the direction of the heat transfer medium can be quickly captured, revealing its actual flow status and improving the efficiency of the heat dissipation module design.

[0069] In other optional embodiments, the heat transfer medium includes: water mixed with pigment.

[0070] Different colors of pigments are used to give different colors to the heat transfer medium.

[0071] The heat transfer medium is a medium capable of undergoing phase change. Besides water mixed with color, it can also be a colored organic solvent or dry ice. Organic solvents include, but are not limited to, ethanol. Heat transfer within the heat dissipation cavity 40 is achieved by utilizing the latent heat of phase change absorbed or released by the heat transfer medium during its phase change.

[0072] In other optional embodiments, the shell 10 and the capillary structure 20 are both made of resin or glass.

[0073] Without limitation, the resin includes epoxy resin, acrylic resin, polypropylene resin, polycarbonate, polystyrene resin, polyethylene terephthalate, etc. The glass includes silicate glass, borate glass, phosphate glass, etc.

[0074] For example, the capillary structure 20 may be a mesh structure woven from glass fibers.

[0075] In industrial production, metal materials are required to manufacture various components of heat dissipation modules. Choosing metal during the design and development of heat dissipation modules is problematic due to its opaque nature, making it difficult to visually monitor. Furthermore, the production cycle for heat dissipation modules made of metal is long. Generally, the production cycle for metal heat dissipation modules takes approximately seven days, while heat dissipation modules made of materials such as glass, resin, or waterproof adhesive can be completed within a day. Therefore, heat dissipation modules made of materials such as resin or glass can improve development and design efficiency, enabling higher heat dissipation power with the same heat dissipation area, or using a smaller heat dissipation area for the same heat dissipation power.

[0076] In other optional embodiments, the heat dissipation module further includes:

[0077] The support column 30 is located in the heat dissipation cavity 40;

[0078] The first end of the support column 30 is connected to the first shell 11 or the second shell 12, and the second end of the support column 30 is in contact with the capillary structure 20; or,

[0079] The first end of the support column 30 is connected to the first shell 11 , the support column 30 passes through the capillary structure 20 , and the second end of the support column 30 abuts against the second shell 12 ; wherein the second end is the opposite end of the first end.

[0080] In the disclosed embodiment, the support column 30 provides support within the heat dissipation cavity 40 to increase the strength of the cavity wall, thereby reducing the risk of deformation of the heat dissipation module due to external forces during use or installation, and ensuring the integrity and heat dissipation performance of the heat dissipation cavity 40.

[0081] In practical applications, the support column 30 can be formed into a conjoined structure with the first shell 11 or the second shell 12, that is, the support column 30 is formed simultaneously during the manufacturing process of the first shell 11 or the second shell 12. This structure of the support column 30 helps ensure the support effect of the support column 30 and improves the connection strength between the support column 30 and the first shell 11 or the second shell 12. In a specific example, the raw materials of the first shell 11 and the second shell 12 are both transparent materials such as high-temperature resistant epoxy resin or glass. The capillary structure 20 is a mesh wick woven with transparent epoxy resin yarn. The first shell 11 and the second shell 12 are fixed using epoxy resin glue, and the heat transfer medium is a mixture of water and red ink. This forms a sealed heat dissipation cavity 40, and the heat dissipation module can be completed within one day. After the initial design work is completed, the heat-generating area of ​​the first shell 11 where the CPU or other heat source is to be placed is heated. The red ink boils and flows, and the flow can be observed and analyzed visually, under a microscope, or with a high-speed camera. In general, the expected flow of the heat transfer medium is: the liquid phase heat transfer medium is transformed into steam / steam and flows from the high temperature area of ​​the first shell 11 to the low temperature area of ​​the second shell 12 to achieve the purpose of uniform heat. However, in actual situations, due to the presence of the support column 30, the heat transfer medium is inevitably disturbed by the support column 30, and thus the flow of the heat transfer medium is not completely in line with expectations. After visual monitoring, the actual test conditions of the heat dissipation module are obtained, and the simulation results of the simulation software (Fluent and other software) in the early design of the heat dissipation module are corrected. Then the initial version of the heat dissipation module is optimized and iterated quickly until the heat dissipation capacity of the heat dissipation module meets the expected requirements. The technical solution of the embodiment of the present disclosure can obtain a fast heat dissipation module sample. In the development of the heat dissipation module, continuous iteration and rapid adjustment can be made to improve development and design efficiency.

[0082] The present disclosure also provides a terminal, comprising the heat dissipation module and the heat generation module described in any one of the above embodiments;

[0083] The heat dissipation module is arranged adjacent to the heat generating module and is used to dissipate heat from the heat generating module.

[0084] In actual applications, heat-generating modules include but are not limited to heat-generating components such as processors, memory, or batteries.

[0085] In some embodiments, the heat dissipation module may be in contact with the heat generating module, or the heat dissipation module may be in contact with the heat dissipation module through a heat conducting medium such as metal.

[0086] Without limitation, the terminal can be a communication device with heat dissipation requirements such as a mobile phone, tablet computer, laptop computer, wearable device, or other electronic or mechanical equipment that uses a heat spreader or heat pipe for heat dissipation, such as a computer case, smart speaker, automotive electronic components, etc.

[0087] like Figure 3 As shown, the embodiment of the present disclosure also provides a method for manufacturing a heat dissipation structure, which includes at least the following steps:

[0088] S101, monitoring the flow information of the heat transfer medium of the heat dissipation module provided by any of the above embodiments;

[0089] S102: determining, based on the flow condition information, whether the heat dissipation capacity of the heat dissipation module meets expected heat dissipation requirements;

[0090] S103 . When the heat dissipation capability of the heat dissipation module meets the expected heat dissipation requirement, record the structural parameters of the heat dissipation module, wherein the structural parameters are used for industrial production of the heat dissipation module.

[0091] In the embodiments of the present disclosure, the heat dissipation structure is an industrialized product manufactured according to structural parameters and can be directly used in terminals, including but not limited to mobile phones, televisions, tablet computers, laptops, computer cases, speakers, cars, or wearable devices.

[0092] In some embodiments, the application scenario of the heat dissipation module is: it is set adjacent to high-heat-generating components such as the CPU in the terminal, so that the heat of the heat-generating components diffuses to the cold end of the heat dissipation module.

[0093] In practical applications, heat dissipation modules can be used in conjunction with simulation software to develop and design heat dissipation structures. For example, the structural parameters of a heat dissipation module can be simulated using simulation software. Passing the simulation results are then used to manufacture the heat dissipation module. Only when the heat dissipation capacity of the heat dissipation module meets the expected heat dissipation requirements will the structural parameters be used in industrial heat dissipation structure production.

[0094] Without limitation, structural parameters include, but are not limited to, the volume of the heat dissipation cavity 40, the thickness of the cavity wall, the surface area of ​​the cavity wall, the size of the gaps in the capillary structure 20, and the amount of heat transfer medium used. If the material of the heat dissipation module differs from that of the industrially manufactured heat dissipation structure, the structural parameters do not include the material. In this case, during industrial production, a metal material with higher heat transfer performance can be selected, and the heat transfer performance of different metal materials is easily achievable. For example, the first shell 11 and the second shell 12 can both be made of copper or stainless steel, and the capillary structure 20 can both be made of copper mesh.

[0095] In step S101, the method further includes: aiming at the transparent cavity wall to collect flow information of the heat transfer medium; and analyzing the flow information. The flow information of the heat transfer medium can be collected by aiming at the transparent cavity wall using an image acquisition device such as a microscope or a high-speed camera.

[0096] In step S102, if the heat transfer medium in the heat dissipation cavity does not flow, the heat dissipation capacity of the heat dissipation module does not meet the expected heat dissipation requirements. The heat transfer medium flow conditions that meet the expected heat dissipation requirements include: the heat transfer medium flows, and the flow direction, flow speed or flow form all meet the requirements, wherein the flow direction is Figure 1 In the direction shown, the liquid heat transfer medium in the first shell 11 vaporizes through the capillary structure 20 and flows to the second shell 12. There, it condenses again into a liquid phase, and then returns to the first shell 11 under the action of the capillary structure 20, repeating this cycle. The expected flow pattern is laminar flow. The expected flow rate can be at or near the limit of the laminar flow rate. That is, above this flow rate, the heat transfer medium changes from laminar flow to turbulent flow.

[0097] In step S103, when the heat dissipation capacity meets the expected heat dissipation requirements, a heat dissipation structure having the same structure as the heat dissipation module is manufactured using a metal material with good thermal conductivity according to the structural parameters of the heat dissipation module.

[0098] In other optional embodiments, the method further includes:

[0099] When the heat dissipation capacity of the heat dissipation module does not meet the expected heat dissipation requirements, the structural parameters of the heat dissipation module are adjusted until the heat dissipation capacity of the heat dissipation module after the structural parameters are adjusted meets the expected heat dissipation requirements.

[0100] In actual applications, if the heat transfer medium flow information of the initial version of the heat dissipation module does not meet the requirements, the structural parameters of the heat dissipation module may need to be adjusted multiple times, resulting in multiple versions of the heat dissipation module. Only when the heat dissipation capacity of the heat dissipation module meets the expected heat dissipation requirements will the structural parameters of the corresponding version of the heat dissipation module be used in the process production.

[0101] Without limitation, structural parameters include: structural parameters of the housing, structural parameters of the capillary structure, structural parameters of the heat dissipation cavity, and structural parameters of the heat transfer medium. Structural parameters of the housing include: surface area, thickness, shape, or flatness of the housing. Structural parameters of the capillary structure include: pore diameter, pore depth, and pore density. Structural parameters of the heat dissipation cavity include: cross-sectional area, depth, or pressure of the heat dissipation cavity. Structural parameters of the heat transfer medium include: volume or type of the heat transfer medium.

[0102] For example, if it is monitored that the heat transfer medium at the hot end is boiling more violently, but the heat transfer medium condensing and reflowing at the cold end is less, you can consider increasing the pore diameter of the capillary structure to reduce the steam rising resistance.

[0103] In other optional embodiments, the flow condition information includes: the flow direction, flow velocity and / or flow form of the heat transfer medium; wherein the flow form includes: laminar flow or turbulent flow.

[0104] In some embodiments, the first shell 11 serves as the hot end, the second shell 12 serves as the cold end, and the flow direction of the heat transfer medium that meets the expected requirements is Figure 1 In the direction shown, the liquid heat transfer medium in the first shell 11 vaporizes and flows through the capillary structure 20 to the second shell 12. There, it condenses again into a liquid phase and returns to the first shell 11 under the action of the capillary structure 20, repeating the cycle. The desired flow pattern is laminar flow. In laminar flow, the greater the flow rate, the better the heat dissipation capacity.

[0105] In other optional embodiments, the monitoring of the flow information of the heat transfer medium of the heat dissipation module provided in any of the above embodiments further includes:

[0106] Monitor the flow information of the heat transfer medium of the heat dissipation module provided by any of the above embodiments placed in an environment with a second preset temperature.

[0107] In the embodiment of the present disclosure, the second preset temperature is the temperature of the space where the heat dissipation structure is located when a heat source such as a CPU in the terminal generates heat.

[0108] During the development and design process, heating can be used to simulate the heat generated by the heat source, or the heat dissipation module can be placed in an environment with a higher temperature to monitor the flow of the heat transfer medium.

[0109] The method of the embodiment of the present disclosure can effectively improve the problem that it is difficult to accurately determine the flow of the heat dissipation liquid (i.e., heat transfer medium) inside the heat dissipation module by only using simulation software for simulation during the development process of the heat dissipation module, as well as the long proofing cycle of the heat dissipation module made of metal. This method can quickly build a visual model after the design work is completed, and then directly observe or observe the flow of the heat dissipation liquid inside the heat dissipation module under a microscope, or even use high-speed photography for dynamic observation to quickly obtain the liquid flow situation. If the liquid flow situation does not meet expectations, the new design can be quickly optimized and corrected, and iterated quickly to improve the efficiency and accuracy of the design. Generally, the sample production cycle of a metal heat dissipation module takes about 7 days. Due to the use of raw materials such as rubber sheets, copper mesh, and glue in the embodiment of the present disclosure, a quick sample can be produced within 1 day. Compared with the current development work of the heat dissipation structure using samples of metal heat dissipation modules, the method of the embodiment of the present disclosure can be continuously iterated and adjusted quickly. In the stacking adjustment of terminals such as mobile phones, the heat dissipation structure can keep up with or exceed the iterative progress.

[0110] Figure 4FIG1 is a block diagram of an apparatus 800 for fabricating a heat dissipation structure according to an exemplary embodiment. For example, apparatus 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0111] Reference Figure 4 , the device 800 may include one or more of the following components: a processing component 802 , a memory 804 , a power component 806 , a multimedia component 808 , an audio component 810 , an input / output (I / O) interface 812 , a sensor component 814 , and a communication component 816 .

[0112] The processing component 802 generally controls the overall operation of the device 800, such as operations associated with display, phone calls, data communications, camera operation, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 802 may include one or more modules to facilitate interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

[0113] The memory 804 is configured to store various types of data to support the operations of the device 800. Examples of such data include instructions for any application or method operating on the device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0114] The power supply component 806 provides power to the various components of the device 800. The power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the device 800.

[0115] The multimedia component 808 includes a screen that provides an output interface between the device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor can not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0116] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), which is configured to receive external audio signals when the device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0117] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as a keyboard, click wheel, buttons, etc. These buttons may include but are not limited to: a home button, volume buttons, a start button, and a lock button.

[0118] The sensor assembly 814 includes one or more sensors for providing various aspects of the status assessment of the device 800. For example, the sensor assembly 814 can detect the open / closed state of the device 800, the relative positioning of components, such as the display and keypad of the device 800. The sensor assembly 814 can also detect changes in the position of the device 800 or a component of the device 800, the presence or absence of user contact with the device 800, the orientation or acceleration / deceleration of the device 800, and temperature changes of the device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an accelerometer, a gyroscope, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0119] The communication component 816 is configured to facilitate wired or wireless communication between the device 800 and other devices. The device 800 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0120] In an exemplary embodiment, the apparatus 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above-described method.

[0121] The methods disclosed in the several method embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method embodiments.

[0122] The features disclosed in the several product embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new product embodiments.

[0123] The features disclosed in several method or product embodiments provided in this disclosure may be arbitrarily combined without conflict to obtain new method embodiments or device embodiments.

[0124] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the claims.

[0125] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A heat dissipation module, characterized in that: include: The housing has a heat dissipation cavity therein, and at least one cavity wall of the heat dissipation cavity is transparent; a capillary structure located in the heat dissipation cavity; The heat transfer medium is in a liquid phase or a solid phase when the temperature is equal to or lower than a first preset temperature, and is in a gas phase when the temperature is higher than the first preset temperature; the heat transfer medium in the liquid phase or the solid phase is opaque; wherein the color of the heat transfer medium is different from the color of the housing and the color of the capillary structure; and the heat transfer medium contains a pigment; The housing includes a first housing and a second housing. The second housing is combined with the first housing to form the heat dissipation cavity. Both the first housing and the second housing are transparent housings made of resin material.

2. The heat dissipation module according to claim 1, characterized in that: The capillary structure is a transparent structure.

3. The heat dissipation module according to claim 1, characterized in that: The first shell and the second shell are connected by waterproof adhesive.

4. The heat dissipation module according to claim 1, wherein: The heat transfer medium includes: water mixed with pigment.

5. The heat dissipation module according to claim 1, characterized in that: The material of the capillary structure includes: resin or glass.

6. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module further includes: A support column is located in the heat dissipation cavity; The first end of the support column is connected to the first shell or the second shell, and the second end of the support column is in contact with the capillary structure; or, The first end of the support column is connected to the first shell, the support column passes through the capillary structure, and the second end of the support column abuts against the second shell; wherein the second end is the opposite end of the first end.

7. A terminal, characterized in that: Comprising the heat dissipation module and heat generation module according to any one of claims 1 to 6; The heat dissipation module is arranged adjacent to the heat generating module and is used to dissipate heat from the heat generating module.

8. A method for manufacturing a heat dissipation structure, characterized in that: include: Monitoring the flow information of the heat transfer medium of the heat dissipation module provided by any one of claims 1 to 6; wherein the color of the heat transfer medium is different from the color of the shell and the color of the capillary structure in the heat dissipation module; and the heat transfer medium is mixed with a pigment; Determining whether the heat dissipation capacity of the heat dissipation module meets the expected heat dissipation requirements based on the flow condition information; When the heat dissipation capability of the heat dissipation module meets the expected heat dissipation requirements, the structural parameters of the heat dissipation module are recorded, wherein the structural parameters are used for industrial production of the heat dissipation module.

9. The method for manufacturing a heat dissipation structure according to claim 8, wherein: The method further comprises: When the heat dissipation capacity of the heat dissipation module does not meet the expected heat dissipation requirements, the structural parameters of the heat dissipation module are adjusted until the heat dissipation capacity of the heat dissipation module after the structural parameters are adjusted meets the expected heat dissipation requirements.

10. The method for manufacturing a heat dissipation structure according to claim 8, wherein: The flow condition information includes: the flow direction, flow velocity and / or flow form of the heat transfer medium; wherein the flow form includes: laminar flow or turbulent flow.

11. The method for manufacturing a heat dissipation structure according to claim 8, wherein: The monitoring of the flow information of the heat transfer medium of the heat dissipation module provided by any one of claims 1 to 6 further includes: Monitoring flow information of a heat transfer medium of the heat dissipation module provided by any one of claims 1 to 6 placed in an environment having a second preset temperature.

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