Optical component, photosensitive component, camera module, optical component and photosensitive component preparation method

Abstract

The present application discloses an optical component, a photosensitive component, a camera module, an optical component and a method for preparing a photosensitive component. The optical component includes: a filter element, a bracket for carrying the filter element, and a dielectric layer, wherein the dielectric layer is arranged between the circuit board and the photosensitive chip, and has a predetermined flexibility for preventing the stress value of the filter element from exceeding a predetermined threshold. In this way, by arranging a dielectric layer between the filter element and its supporting part in the camera module, it is avoided that the stress generated by the deformation of the supporting part of the filter element is concentrated on the filter element, causing the deformation amount generated by the filter element to exceed the predetermined threshold, thereby causing the filter element to be damaged and the imaging quality of the camera module to be reduced.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and more specifically, to a method for preparing an optical component, a photosensitive component, a camera module, an optical component and a photosensitive component. Background Art

[0002] With the popularization of mobile electronic devices, the relevant technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or images) have developed and progressed rapidly, and in recent years, camera modules have been widely used in many fields such as medical treatment, security, industrial production, etc.

[0003] In order to meet the increasingly broad market demand, high pixel, large chip, small size and large aperture are the irreversible development trend of existing camera modules. The increase in chip size brings many problems, such as the chip is more easily deformed.

[0004] As the size of the photosensitive chip gradually increases, the size of the filter element that matches it also needs to increase accordingly. Those skilled in the art should know that the filter element is a sensitive and fragile component. As the size increases, its sensitivity and fragility will further increase. In actual industrial applications, many problems have arisen after the size of the filter element increases, such as the filter element is more easily damaged or even cracked, and the filter element is tilted relative to the photosensitive chip.

[0005] Therefore, an effective solution is needed to ensure the stability of the filter element. Summary of the invention

[0006] The main purpose of the present application is to provide an optical component, a photosensitive component, a camera module, an optical component and a method for preparing a photosensitive component, which prevents the stress generated by the deformation of the supporting part of the filter element from being concentrated on the filter element, causing the deformation of the filter element to exceed a predetermined threshold, thereby causing damage to the filter element and a reduction in the imaging quality of the camera module.

[0007] Another object of the present application is to provide a method for preparing an optical component, a photosensitive component, a camera module, an optical component and a photosensitive component, which avoids the reduction of imaging quality due to deformation of the photosensitive chip by setting a dielectric layer between the photosensitive chip and its supporting part in the camera module.

[0008] According to one aspect of the present application, there is provided an optical component, comprising:

[0009] Filter elements;

[0010] A support, used for carrying the filter element; and

[0011] The dielectric layer is arranged between the support and the filter element, and has a predetermined flexibility for preventing the deformation amount of the filter element from exceeding a predetermined threshold.

[0012] In the optical component according to the present application, the filter element is mounted on the bracket through the medium layer.

[0013] In the optical component according to the present application, the optical component further includes a support member, which is disposed on the bracket, and the support member and the bracket surface form a receiving cavity, wherein the medium layer is formed by curing an adhesive applied to the receiving cavity.

[0014] In the optical component according to the present application, the optical component further includes an adhesive component, and the medium layer is connected to the bracket and the filter element respectively through the adhesive component.

[0015] In the optical component according to the present application, the optical component further includes an adhesive component, wherein the medium layer is integrally formed on the bracket, and the medium layer is connected to the filter element through the adhesive component.

[0016] In the optical component according to the present application, the optical component further includes an adhesive component, wherein the medium layer is integrally formed on the lower surface of the filter element, and the medium layer is connected to the bracket through the adhesive component.

[0017] In the optical component according to the present application, the dielectric layer is made of a flexible material, and the Shore hardness of the flexible material is 10HSA-70HSA.

[0018] In the optical component according to the present application, the material of the dielectric layer is selected from any one of foam, a combination of plastic and foam, soft glue and silicone.

[0019] In the optical component according to the present application, when the medium layer is made of foam, the thickness of the medium layer is 80um-130um.

[0020] In the optical component according to the present application, when the dielectric layer is made of soft glue, the thickness of the dielectric layer is 20um-100um.

[0021] In the optical component according to the present application, the thickness of the dielectric layer is 50um-100um.

[0022] In the optical component according to the present application, the medium layer can be deformed by 5%-50% of its thickness.

[0023] In the optical component according to the present application, the medium layer can be deformed by 5%-50% of its thickness.

[0024] In the optical assembly according to the present application, the bracket includes a supporting portion and a suspension portion extending inwardly from the supporting portion, and the filter element is mounted on the suspension portion.

[0025] In the optical component according to the present application, the upper surface of the suspension portion is lower than the upper surface of the support portion, and the upper surface of the filter element is lower than the upper surface of the support portion.

[0026] According to another aspect of the present application, a photosensitive component is also provided, comprising:

[0027] Circuit board;

[0028] a photosensitive chip electrically connected to the circuit board; and

[0029] The optical component as described above, wherein the optical component is arranged on the circuit board, and the filter element is located in the photosensitive path of the photosensitive chip.

[0030] In the photosensitive component according to the present application, the photosensitive component further includes a base arranged on the circuit board, wherein the optical component is installed on the base.

[0031] According to another aspect of the present application, a camera module is also provided, comprising:

[0032] Optical lenses; and

[0033] The optical lens is held in the photosensitive path of the photosensitive component, wherein the photosensitive component includes the optical component as described above.

[0034] According to another aspect of the present application, a method for preparing an optical component is also provided, comprising:

[0035] providing a filter element and a holder; and

[0036] A dielectric layer is formed between the support and the filter element.

[0037] In the preparation method according to the present application, a dielectric layer is formed between the bracket and the filter element, including: forming the dielectric layer on the bracket; and installing the filter element on the dielectric layer.

[0038] In the preparation method according to the present application, a dielectric layer is formed between the bracket and the filter element, including: forming the dielectric layer on the lower surface of the filter element; and mounting the filter element with the dielectric layer on the bracket.

[0039] In the preparation method according to the present application, forming the dielectric layer on the bracket includes: applying an adhesive on the bracket; and attaching the dielectric layer to the adhesive to form the dielectric layer on the bracket.

[0040] In the preparation method according to the present application, forming the dielectric layer on the bracket includes: integrally forming the dielectric layer on the bracket.

[0041] In the preparation method according to the present application, installing the filter element on the dielectric layer includes:

[0042] Applying an adhesive on the dielectric layer; and mounting the filter element on the adhesive to install the filter element on the dielectric layer.

[0043] In the preparation method according to the present application, a dielectric layer is formed between the bracket and the filter element, including: arranging a support member on the bracket, the support member and the bracket surface forming a receiving cavity; applying an adhesive in the receiving cavity; mounting the filter element on the adhesive; and curing the adhesive to form a dielectric layer between the bracket and the filter element.

[0044] In the preparation method according to the present application, the method further includes: removing the support member.

[0045] According to one aspect of the present application, a photosensitive component is provided, comprising:

[0046] Circuit board;

[0047] a photosensitive chip electrically connected to the circuit board; and

[0048] The dielectric layer is arranged between the circuit board and the photosensitive chip and has a predetermined flexibility for preventing the photosensitive chip from deforming.

[0049] In the photosensitive component according to the present application, the photosensitive chip is mounted on the circuit board through the dielectric layer.

[0050] In the photosensitive component according to the present application, it further includes a support member, which is arranged on the circuit board, and the support member and the surface of the circuit board form a receiving cavity, wherein the medium layer is formed by curing the adhesive applied to the receiving cavity.

[0051] In the photosensitive component according to the present application, an adhesive is further included, and the medium layer is connected to the circuit board and the photosensitive chip respectively through the adhesive.

[0052] In the photosensitive component according to the present application, an adhesive component is further included, wherein the medium layer is integrally formed on the circuit board, and the medium layer is connected to the photosensitive chip through the adhesive component.

[0053] In the photosensitive component according to the present application, an adhesive component is further included, wherein the medium layer is integrally formed on the lower surface of the photosensitive chip, and the medium layer is connected to the circuit board through the adhesive component.

[0054] In the photosensitive component according to the present application, the dielectric layer is made of a flexible material, and the Shore hardness of the flexible material is 10HSA-70HSA.

[0055] In the photosensitive component according to the present application, the material of the medium layer is selected from any one of foam, a combination of plastic and foam, soft glue and silicone.

[0056] In the photosensitive component according to the present application, when the medium layer is made of foam, the thickness of the medium layer is 80um-130um.

[0057] In the photosensitive component according to the present application, when the medium layer is made of soft glue, the thickness of the medium layer is 20um-100um.

[0058] In the photosensitive component according to the present application, the medium layer is made of a flexible material with viscosity.

[0059] In the photosensitive component according to the present application, the thickness of the medium layer is 50um-100um.

[0060] In the photosensitive component according to the present application, the medium layer can be deformed by 5%-50% of its own thickness.

[0061] In the photosensitive component according to the present application, the medium layer can be deformed by 5%-50% of its own thickness.

[0062] According to another aspect of the present application, a camera module is also provided, comprising:

[0063] Optical lenses; and

[0064] In the photosensitive component as described above, the optical lens is maintained on the photosensitive path of the photosensitive component.

[0065] According to another aspect of the present application, there is also provided an electronic device, comprising:

[0066] an electronic device body; and

[0067] A camera module assembled on the electronic device body, wherein the camera module includes the photosensitive component as described above.

[0068] According to another aspect of the present application, a method for preparing a photosensitive component is also provided, comprising:

[0069] Provide circuit boards and photosensitive chips; and

[0070] A dielectric layer is formed between the circuit board and the photosensitive chip.

[0071] In the preparation method according to the present application, a dielectric layer is formed between the circuit board and the photosensitive chip, including:

[0072] forming the dielectric layer on the circuit board; and

[0073] The photosensitive chip is mounted on the dielectric layer.

[0074] In the preparation method according to the present application, a dielectric layer is formed between the circuit board and the photosensitive chip, including:

[0075] forming the dielectric layer on the lower surface of the photosensitive chip; and

[0076] The photosensitive chip with the dielectric layer is mounted on the circuit board.

[0077] In the preparation method according to the present application, forming the dielectric layer on the circuit board includes:

[0078] Applying an adhesive to the circuit board; and

[0079] The dielectric layer is mounted on the adhesive component to form the dielectric layer on the circuit board.

[0080] In the preparation method according to the present application, forming the dielectric layer on the circuit board includes:

[0081] The dielectric layer is integrally formed on the circuit board.

[0082] In the preparation method according to the present application, the photosensitive chip is installed on the dielectric layer, comprising:

[0083] applying an adhesive on the dielectric layer; and

[0084] The photosensitive chip is mounted on the adhesive component to install the photosensitive chip on the dielectric layer.

[0085] In the preparation method according to the present application, a dielectric layer is formed between the circuit board and the photosensitive chip, including:

[0086] A support member is arranged on the circuit board, wherein the support member and the surface of the circuit board form a receiving cavity;

[0087] applying an adhesive in the receiving cavity;

[0088] Mounting the photosensitive chip on the adhesive; and

[0089] The adhesive is cured to form the dielectric layer between the circuit board and the photosensitive chip.

[0090] In the preparation method according to the present application, the method further includes: removing the support member.

[0091] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0092] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0093] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0094] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0095] Figure 1 The figure shows a schematic diagram of a filter element in an existing camera module being tilted relative to a photosensitive chip.

[0096] Figure 2 A schematic diagram of an optical component according to an embodiment of the present application is illustrated.

[0097] Figure 3 The figure shows a deformation schematic diagram of the optical component according to an embodiment of the present application.

[0098] Figure 4 A schematic diagram of an optical component according to another embodiment of the present application is illustrated.

[0099] Figure 5 A schematic diagram of a modified embodiment of the optical component according to another embodiment of the present application is illustrated.

[0100] Figure 6FIG. 1 is a schematic diagram of another modified embodiment of the optical component according to another embodiment of the present application.

[0101] Figure 7 A schematic diagram of a camera module according to an embodiment of the present application is illustrated.

[0102] Figure 8 A schematic diagram of a deformed implementation of a camera module according to an embodiment of the present application is illustrated.

[0103] Fig. 9 The figure shows a schematic diagram of the deformation of the photosensitive chip in the existing camera module.

[0104] Fig.10 A schematic diagram of a photosensitive component according to an embodiment of the present application is illustrated.

[0105] Fig.11 The figure shows a schematic diagram of the bending of the photosensitive component according to an embodiment of the present application.

[0106] Fig.12 A schematic diagram of a photosensitive component according to another embodiment of the present application is illustrated.

[0107] Fig.13 A schematic diagram of a modified embodiment of the photosensitive component according to another embodiment of the present application is illustrated.

[0108] Fig.14 A schematic diagram of another modified embodiment of the photosensitive component according to another embodiment of the present application is illustrated.

[0109] Fig.15 A schematic diagram of a camera module according to an embodiment of the present application is illustrated.

[0110] Fig.16 A schematic diagram of a deformed implementation of a camera module according to an embodiment of the present application is illustrated.

[0111] Fig.17 A schematic diagram of an electronic device according to an embodiment of the present application is illustrated. DETAILED DESCRIPTION

[0112] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described here.

[0113] Application Overview

[0114] As mentioned above, in order to meet the increasingly broad market demand, high pixels, large chips, small sizes, and large apertures are the irreversible development trend of existing camera modules. As the size of the photosensitive chip gradually increases, the size of the filter element that matches it also needs to increase. The filter element is a sensitive and fragile component. As its size increases, its sensitivity and fragility will further increase. In actual industrial applications, many problems have arisen after the size of the filter element increases, such as the filter element is more easily damaged or even cracked, and the filter element is tilted relative to the photosensitive chip.

[0115] In a camera module (e.g., a conventional camera module, a periscope camera module, a fingerprint module, a TOF depth information camera module), the filter element 71P plays an important role in filtering and preventing stray light. As its area size increases, and the demand for miniaturization of the camera module also limits its thickness size, that is, the area of ​​the filter element 71P gradually increases, and at the same time, its thickness size tends to decrease. Therefore, the ratio of the area to the thickness of the filter element 71P will increase. In terms of physical performance, the filter element 71P with an increased area to thickness ratio is more prone to deformation and more fragile.

[0116] Since the coefficient of thermal expansion (CTE) between the bracket 72P used to support the filter element 71P and the filter element 71P is too different, when the ambient temperature changes, the stress generated by the deformation of the bracket 72P will act on the filter element 71P. When the stress on the filter element 71P exceeds a predetermined threshold and the deformation amount thereof exceeds a predetermined threshold, the filter element 71P will be damaged or even broken. According to the test, the preset threshold value of the deformation amount for damage or even breakage is 4000μe, that is, when the deformation amount exceeds 4000μe, the filter element 71P will be damaged or even broken. In addition, those skilled in the art should know that during the production process, the filter element 71P itself has microcracks, which will cause stress concentration and increase the probability of damage or breakage.

[0117] In addition, since the thermal expansion coefficient of the bracket 72P is relatively large, when the ambient temperature changes greatly, the deformation of the bracket 72P itself is often uneven, resulting in uneven deformation of the portion of the upper surface of the bracket 72P used to support the filter element 71P. That is, the plane of the portion of the bracket 72P used to mount the filter element 71P will produce a height difference due to the uneven deformation, causing the filter element 71P to tilt relative to the photosensitive chip. Figure 1 shown. Figure 1The figure shows a schematic diagram of the filter element 71P in the existing camera module being tilted relative to the photosensitive chip. The tilted filter element 71P will cause the focal length of the imaging system to change and produce image shift. In addition, the tilted filter will also cause the incident angle of the external light when it enters the filter element 71P to be different from the ideal situation, which can easily lead to an increase in stray light. In addition, the uneven surface of the bracket 72P reduces the support area of ​​the filter element 71P, increasing the risk of damage to the filter element 71P.

[0118] In response to the above technical problems, the basic concept of the present application is to prevent the filter element from being damaged and the imaging quality of the camera module from being reduced due to its own deformation by setting a dielectric layer between the filter element and its supporting part in the camera module.

[0119] Based on this, the present application proposes a photosensitive component, which includes: a filter element, a bracket for carrying the filter element, and a dielectric layer, wherein the dielectric layer is arranged between the circuit board and the photosensitive chip, and has a predetermined flexibility for preventing the deformation amount of the filter element from exceeding a predetermined threshold. In this way, by arranging a dielectric layer between the filter element and its supporting part in the camera module, it is prevented that the stress generated by the deformation of the supporting part of the filter element is concentrated on the filter element, causing the deformation amount of the filter element to exceed the predetermined threshold, thereby causing the filter element to be damaged and the imaging quality of the camera module to be reduced.

[0120] After introducing the basic principles of the present application, various non-limiting embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0121] Embodiment 1

[0122] Figure 2 FIG. 1 is a schematic diagram of an optical component according to an embodiment of the present application. Figure 2 In the illustrated optical assembly, the optical assembly 710 includes a filter element 711, a dielectric layer 712 and a bracket 713. The filter element 711 is mounted on the bracket 713 through the dielectric layer 712. The dielectric layer 712 can effectively absorb the stress on the filter element 711 caused by the deformation of the bracket 713, thereby preventing the stress generated by the deformation of the support part of the filter element 711 from being concentrated on the filter element 711, causing the deformation of the filter element 711 to exceed a predetermined threshold, thereby causing the filter element 711 to be damaged. As mentioned above, the preset threshold is 4000 μe. In other words, even if the bracket 713 of the optical assembly 710 is deformed during the heating or cooling process or the bracket is deformed due to the external stress, the dielectric layer 712 will ensure the stability of the filter element 711.

[0123] Further, in the embodiment of the present application, the dielectric layer 712 is preferably implemented as a flexible material, which has a predetermined flexibility for preventing the deformation of the filter element 711 from exceeding a predetermined threshold value, that is, the predetermined flexibility of the filter element 711 is not a specific value, and it only needs to be able to prevent the deformation of the filter element due to stress from being less than 4000μe. In particular, in the implementation of the present application, the Shore hardness of the flexible material can be selected as 10HSA-70HSA, for example, 20HSA, 30HSA, which can be compressed by 5% to 50% (preferably, 30% to 50%) of its own thickness under external force, or stretched by 5% to 50% (preferably, 30% to 50%) of its own thickness, wherein 10HSA means that the Shore hardness value measured by a type A Shore hardness tester is 10, and the same applies to 70HSA, 20HSA, and 30HSA. Furthermore, in the embodiment of the present application, the upper surface of the dielectric layer 712 corresponds to the filter element 711, and the lower surface thereof corresponds to the bracket 713. When the ambient temperature changes or external stress acts on the bracket, causing the bracket 713 to deform, the force of the deformation of the bracket 713 will drive the lower surface of the dielectric layer 712 to deform. Since the dielectric layer 712 can be compressed by 5% to 50% (preferably, 30% to 50%) of its own thickness, or stretched by 5% to 50% (preferably, 30% to 50%) of its own thickness, its upper surface will not bend and will remain close to a plane. The force of the deformation of the bracket 713 will not act on the filter element 711. Figure 3 As shown, therefore, the photosensitive surface of the filter element 711 can maintain good flatness and reduce light divergence. Here, the flatness of the photosensitive surface of the filter element 711 can be 0.701λ-0.72λ (λ is the symbol of the light wavelength), or in other words, the flatness of the photosensitive surface of the filter element 711 is below 0.716um. It can also be understood that the hardness of the filter element 711 is greater than that of the dielectric layer 712, so the deformation (bending) of the filter element 711 can be suppressed by the deformation of the dielectric layer 712.

[0124] Furthermore, in the embodiment of the present application, the material of the dielectric layer 712 can be implemented as foam, PET (polyethylene terephthalate, a type of plastic material) + PU (PU is foam), soft glue, silicone, etc., wherein PET + PU can be understood as foaming on the PET material to form a PU layer, wherein PET can also be implemented as other plastic materials, and even PET can be replaced by metal, that is, foaming on the metal to form a PU layer.

[0125] like Figure 2As shown, in the embodiment of the present application, the optical component 710 further includes at least one adhesive 714, and the medium layer 712 is connected to the bracket 713 and the filter element 711 respectively through the adhesive 714, and the adhesive 714 can be implemented as a viscous adhesive tool such as glue and double-sided tape. That is to say, in the embodiment of the present application, the adhesive 714 is firstly arranged on the medium layer 712, the filter element 711 or the bracket 713, and then the medium layer 712, the bracket 713 and the filter element 711 are fixed by the adhesive 714 to form the optical component 710.

[0126] In particular, when the dielectric layer 712 is foam, the thickness of the foam is 80-130um, preferably 100um, and at this time, the thickness of the filter element 711 is 0.715-2.75mm, preferably 1-2mm; the thickness of the adhesive 714 is 20um-40um. When the dielectric layer 712 is implemented as soft glue, the thickness of the soft glue is 20-100um, preferably 50um, and at this time, the thickness of the filter element 711 is 0.715-2.75mm, preferably 1mm-2mm.

[0127] In a variant embodiment of the above embodiment, the dielectric layer 712 can be formed integrally with the bracket 713, that is, the dielectric layer 712 and the bracket 713 are an integral structure. For example, the dielectric layer 712 can be formed on the bracket 713 by processes such as coating, spraying, printing, and foaming. For example, when the dielectric layer 712 is a foam layer, the dielectric layer 712 can be formed by presetting a material on the bracket 713 and foaming. In this way, the foam layer (that is, the dielectric layer 712) does not need to be fixed to the bracket 713 by the adhesive 714, and the error caused by the adhesive 714 can be further effectively controlled, which is conducive to improving the accuracy of the optical component 710. It is worth mentioning that in this variant embodiment, the parameters and performance of the dielectric layer 712 are the same or similar to those of the above embodiment.

[0128] That is to say, in this variant embodiment, the preparation process of the optical component 710 may be: firstly forming the dielectric layer 712 on the bracket 713 , and then fixing the filter element 711 and the dielectric layer 712 by the adhesive 714 to form the optical component 710 .

[0129] In another variation of the above embodiment, the dielectric layer 712 is formed integrally with the filter element 711, that is, the dielectric layer 712 and the filter element 711 have an integral structure. For example, the dielectric layer 712 can be formed on the filter element 711 by processes such as coating, spraying, printing, and foaming.

[0130] Furthermore, if Figure 2 As shown, in the embodiment of the present application, the bracket 713 includes a supporting portion 7131 and a hanging portion 7132 extending inwardly from the supporting portion 7131, and the filter element 711 is mounted on the hanging portion 7132. In order to protect the filter element, preferably, the upper surface of the supporting portion 7131 is higher than the upper surface height of the hanging portion 7132, that is, there is a height difference between the hanging portion 7132 and the supporting portion 7131 to form a protective cavity for accommodating the filter element 711. More preferably, when the filter element 711 is mounted in the protective cavity, the upper surface of the filter element 711 is lower than the upper surface of the supporting portion 7131.

[0131] It is worth mentioning that in the embodiment of the present application, the filter element 711 can be implemented as various types of filter elements, including but not limited to infrared cut-off filters, full-spectrum filters, and other filters or a combination of multiple filters. Specifically, for example, when the filter element 711 is implemented as a combination of an infrared cut-off filter and a full-spectrum filter, that is, the infrared cut-off filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the filter element 711, so that when used in an environment with sufficient light such as daytime, the infrared cut-off filter can be switched to the photosensitive path of the filter element 711, so that the infrared cut-off filter can be used to filter the infrared rays in the light reflected by the object entering the filter element 711, and when used in an environment with dark light such as night, the full-spectrum filter can be switched to the photosensitive path of the filter element 711 to allow the infrared rays in the light reflected by the object entering the filter element 711 to be partially transmitted.

[0132] Embodiment 2

[0133] like Figure 4As shown, in this embodiment, the optical component 710 is composed of the filter element 711, the adhesive 714 and the bracket 713, wherein the thickness of the adhesive 714 is 50um-100um (including 50um and 100um). That is, in this implementation, the role of the adhesive 714 is equivalent to the two-in-one of the medium layer 712 and the adhesive 714 in the embodiment 71, or in other words, the medium layer 712 in the embodiment 71 is implemented as being formed by curing an adhesive with a thickness of 50um-100um. It is worth mentioning that the existing adhesives such as glue cannot be applied to the filter element 711 or the bracket 713 with a thickness of 50um-100um due to its fluidity. Therefore, in this embodiment, a support member 715 is further provided. The support member 715 is arranged on the bracket 713. The support member 715 and the upper surface of the bracket 713 form a receiving cavity 7150. The adhesive member 714 (glue) is arranged in the receiving cavity 7150, and then the filter element 711 is attached to the adhesive member 714. Then, the adhesive member 714 is cured by baking and other processes to form the optical component 710. Figure 4 As shown, in this embodiment, the support member 715 includes an inner support unit 7151 and an outer support unit 7152, and the receiving cavity 7150 is formed on the support surface, between the inner side surface of the inner support unit 7151 and the inner side surface of the outer support unit 7152, and both the inner support unit 7151 and the outer support unit 7152 have an annular structure. It is worth mentioning that in this embodiment, the height of the outer support unit 7152 is higher than the height of the inner support unit 7151. Of course, the heights of the inner support unit 7151 and the outer support unit 7152 can also be equal, which is not limited by the present application.

[0134] In this embodiment, the adhesive 714 is preferably glue, which has a certain flexibility. Here, after being cured into the adhesive 714, it still has a certain flexibility. The upper surface of the adhesive 714 faces the filter element 711, and the lower surface faces the bracket 713. When the ambient temperature changes and causes the bracket 713 to deform, the force of the deformation of the bracket 713 drives the lower surface of the adhesive 714 to deform. Since the adhesive 714 has a certain flexibility and a thickness of 50um-100um, its upper surface will not be affected and bend, and it will still be close to a plane. The force of the deformation of the bracket 713 will not act on the filter element 711, so the filter element 711 can maintain a good flatness.

[0135] Further, in this embodiment, the adhesive 714 has a large deformation capacity. Specifically, the adhesive 714 can be compressed by 5% to 50% (preferably, 30% to 50%) of its own thickness, or stretched by 5% to 50% (preferably, 30% to 50%) of its own thickness when subjected to external force. Accordingly, when the ambient temperature changes and causes the bracket 713 to deform, the force of the deformation of the bracket 713 will drive the lower surface of the adhesive 714 to deform. Since the dielectric layer 712 can be compressed by 5% to 50% (preferably, 30% to 50%) of its own thickness, or stretched by 5% to 50% (preferably, 30% to 50%) of its own thickness, its upper surface will not bend and will remain close to a plane. The force of the deformation of the bracket 713 will not act on the filter element 711. Therefore, the reflective surface of the filter element 711 can maintain a good flatness and reduce light divergence.

[0136] It is worth mentioning that in the embodiment of the present application, the thickness of the adhesive member 714 is lower than the height of the support member 715. That is, during the preparation process, the thickness of the glue is smaller than the height of the support member 715, so that the glue is completely contained in the containing cavity 7150, and at the same time, the filter element 711 is also contained in the containing cavity 7150.

[0137] In a modified embodiment of the above embodiment, the thickness of the glue may also be greater than or equal to the height of the support member 715. Figure 5 As shown, in this modified embodiment, the thickness of the adhesive member 714 (glue) is greater than the height of the support member 715. It should be understood that since the glue has a certain viscosity, during the preparation process, even if the difference in thickness of the glue and the height of the support member 715 is within a certain range, the glue will not overflow from the receiving cavity 7150.

[0138] It is also worth mentioning that in other variant embodiments of the above embodiment, the support member 715 can also be removed after the glue is cured to form the adhesive member 714, that is, the optical component 710 does not include the support member 715. Figure 6 Shown

[0139] Embodiment 3

[0140] The optical components disclosed in the above-mentioned Embodiment 1 and Embodiment 2 can be applied to camera modules, for example, conventional camera modules, periscope camera modules, TOF depth information camera modules, etc. Figure 7 FIG. 1 is a schematic diagram of a camera module according to an embodiment of the present application. Figure 7As shown, the camera module includes: a photosensitive component 720 and an optical lens 730 maintained on the light-sensitive path of the optical component 720, wherein the photosensitive component 720 includes the optical component 710 disclosed in Example 71 and Example 72.

[0141] like Figure 7 As shown, in the embodiment of the present application, the photosensitive component further includes a circuit board 721, a photosensitive chip 722 electrically connected to the circuit board 721, and at least one electronic component 723 disposed on the circuit board 721, wherein the optical component 710 is disposed on the circuit board 721. More specifically, the bracket 713 of the optical component 710 is mounted on the circuit board 721, and the filter element 711 is located in the photosensitive path of the photosensitive chip 722.

[0142] Figure 8 FIG. 1 is a schematic diagram of a modified embodiment of the camera module according to an embodiment of the present application. Figure 8 As shown, in this variant embodiment, the camera module is further arranged on the base 724 of the circuit board, and the optical assembly 710 is installed on the base 724. That is, in this variant embodiment, the installation method of the optical assembly 710 is changed. In particular, in the variant embodiment, the base 724 is a molded base integrally formed on the circuit board 721 through a molding process. Of course, in other examples of the present application, the base 724 can also be implemented as other types of bases, and the position of the base 724 integrally formed on the circuit board can be adjusted.

[0143] It is worth mentioning that the camera module can be further applied to electronic devices, such as smart phones, tablet computers, etc., to serve as a front camera module or a rear camera module of the electronic device.

[0144] Embodiment 4

[0145] According to another aspect of the present application, a method for preparing an optical component 710 is also provided.

[0146] According to the relevant descriptions in Example 1 and Example 2, the method for preparing the optical component 710 according to the embodiment of the present application includes: providing a bracket 713 and a filter element 711; and forming a dielectric layer 712 between the bracket 713 and the filter element 711.

[0147] In the preparation method according to an embodiment of the present application, in one example, a dielectric layer 712 is formed between the bracket 713 and the filter element 711 , including: forming the dielectric layer 712 on the bracket 713 ; and installing the filter element 711 on the dielectric layer 712 .

[0148] In the preparation method according to an embodiment of the present application, in one example, a dielectric layer 712 is formed between the bracket 713 and the filter element 711, including: forming the dielectric layer 712 on the lower surface of the filter element 711; and mounting the filter element 711 with the dielectric layer 712 on the bracket 713.

[0149] In the preparation method according to an embodiment of the present application, in one example, forming the dielectric layer 712 on the bracket 713 includes: applying an adhesive 714 on the bracket 713; and mounting the dielectric layer 712 on the adhesive 714 to form the dielectric layer 712 on the bracket 713.

[0150] In the preparation method according to the embodiment of the present application, in one example, forming the dielectric layer 712 on the bracket 713 includes: integrally forming the dielectric layer 712 on the bracket 713 .

[0151] In the preparation method according to an embodiment of the present application, in one example, installing the filter element 711 on the dielectric layer 712 includes: applying an adhesive 714 on the dielectric layer 712; and mounting the filter element 711 on the adhesive 714 to install the filter element 711 on the dielectric layer 712.

[0152] In the preparation method according to an embodiment of the present application, in one example, a dielectric layer 712 is formed between a bracket 713 and a filter element 711, including: forming a support member 715 on the bracket 713, wherein a receiving cavity 7150 is formed between the support member 715 and the surface of the bracket 713; applying an adhesive in the receiving cavity 7150; attaching the filter element 711 to the adhesive; and curing the adhesive to form the dielectric layer 712 between the bracket 713 and the filter element 711.

[0153] In the preparation method according to the embodiment of the present application, in one example, the method further includes removing the support member 715 .

[0154] It is worth mentioning that in the embodiment of the present application, the dielectric layer 712 is made of a flexible material, and the Shore hardness of the flexible material is 10HSA-70HSA. The material of the dielectric layer 712 is selected from any one of foam, a combination of plastic and foam, soft glue and silicone. When the dielectric layer 712 is made of foam, the thickness of the dielectric layer 712 is 80um-130um. When the dielectric layer 712 is made of soft glue, the thickness of the dielectric layer 712 is 20um-100um. The deformation amount that the dielectric layer 712 can undergo is 5%-50% of its own thickness.

[0155] Application Overview

[0156] As mentioned above, as consumers have higher and higher requirements for the imaging quality of terminal devices, the size of the photosensitive chip collected by the camera module has gradually increased, which has caused a series of technical problems. Moreover, these technical problems cannot be properly solved in the existing camera module structure. Therefore, an improved camera module structure and its manufacturing scheme are needed to produce photosensitive components, camera modules, electronic devices and photosensitive component preparation methods that meet the performance requirements.

[0157] Specifically, in existing camera modules, the photosensitive chip 81P is often attached to the upper surface of the circuit board 82P through the COB (Chip on Board) process, that is, the photosensitive chip 81P is attached to the upper surface of the photosensitive chip 81P through an adhesive. Usually, the coefficient of thermal expansion (CTE) between the photosensitive chip 81P and the circuit board 82P is too different. Therefore, during operation, affected by changes in ambient temperature, the circuit board 82P will deform and cause the photosensitive chip 81P to deform. The specific deformation form is: the photosensitive chip 81P bends toward the optical lens side to form a shape similar to a "crying face", such as Fig. 9 shown. Fig. 9 The figure shows a schematic diagram of the bending of the photosensitive chip 81P in the existing camera module.

[0158] Those skilled in the art should know that even if the photosensitive chip 81P does not undergo a "crying face"-shaped deformation, due to the different optical path differences between the edge area and the center area of ​​the photosensitive chip 81P relative to the optical lens, the optical center is prone to distortion, corner light loss, and sharp angle drop when it reaches the edge of the photosensitive chip 81P, resulting in poor imaging effects. After the "crying face"-shaped deformation occurs, the poor imaging phenomenon will be further aggravated, which will more seriously affect the imaging quality. Specifically, if Fig. 9As shown, during the imaging process of the camera module, the actual focal plane forms an arc that bulges toward the circuit board 82P, that is, the actual focal plane is an arc-shaped surface. It can be seen that the "crying face"-shaped deformation is exactly opposite to the deformation mode of the actual focal plane, resulting in aggravated distortion, corner light loss, and sharp angle drop, which more seriously affects the imaging quality of the camera module.

[0159] In response to the above technical problems, the basic concept of the present application is to avoid the reduction of imaging quality due to deformation of the photosensitive chip by setting a dielectric layer between the photosensitive chip and its supporting part in the camera module.

[0160] Based on this, the present application proposes a photosensitive component, which includes: a circuit board; a photosensitive chip electrically connected to the circuit board; and a dielectric layer, which is arranged between the circuit board and the photosensitive chip and has a predetermined flexibility for preventing the photosensitive chip from deforming. In this way, by arranging a dielectric layer between the photosensitive chip and the circuit board in the camera module, the reduction in imaging quality caused by the deformation of the photosensitive chip can be avoided. After introducing the basic principles of the present application, various non-limiting embodiments of the present application will be specifically introduced with reference to the accompanying drawings.

[0161] Embodiment 1

[0162] Fig.10 FIG. 1 is a schematic diagram of a photosensitive component according to an embodiment of the present application. Fig.10 In the illustrated photosensitive component, the photosensitive component 810 includes a photosensitive chip 811, a dielectric layer 812 and a circuit board 813. The photosensitive chip 811 is mounted on the circuit board 813 through the dielectric layer 812. The photosensitive chip 811 is conductively connected to the circuit board through an electrical connection medium such as a lead, wherein the dielectric layer 812 can effectively prevent the photosensitive chip 811 from bending. In other words, even if the circuit board 813 of the photosensitive component 810 is deformed during the heating or cooling process, the dielectric layer 812 will ensure the stability of the photosensitive chip 811.

[0163] Further, in the embodiment of the present application, the dielectric layer 812 is preferably implemented as a flexible material, and the Shore hardness of the flexible material is 10HSA-70HSA, for example, 20HSA, 30HSA, which can be compressed by 5% to 50% (preferably, 30% to 50%) of its own thickness under external force, or stretched by 5% to 50% (preferably, 30% to 50%) of its own thickness, wherein 10HSA means that the Shore hardness value measured by a type A Shore hardness tester is 10, and the same is true for 70HSA, 20HSA, and 30HSA. In addition, in the embodiment of the present application, the upper surface of the dielectric layer 812 corresponds to the photosensitive chip 811, and the lower surface thereof corresponds to the circuit board 813. When the ambient temperature changes and causes the circuit board 813 to deform, the force of the deformation of the circuit board 813 will drive the lower surface of the dielectric layer 812 to deform. Since the dielectric layer 812 can be compressed by 5% to 50% (preferably 30% to 50%) of its thickness, or stretched by 5% to 50% (preferably 30% to 50%) of its thickness, its upper surface will not bend and will remain close to a plane, and the deformation force of the circuit board 813 will not act on the photosensitive chip 811. Fig.11 As shown, therefore, the photosensitive surface of the photosensitive chip 811 can maintain good flatness and reduce light divergence. Here, the flatness of the photosensitive surface of the photosensitive chip 811 can be 0.801λ-0.82λ (λ is the symbol of the light wavelength), or in other words, the flatness of the photosensitive surface of the photosensitive chip 811 is below 0.816um. It can also be understood that the hardness of the photosensitive chip 811 is greater than that of the dielectric layer 812, so the deformation (bending) of the photosensitive chip 811 can be suppressed by the deformation of the dielectric layer 812.

[0164] Furthermore, in the embodiment of the present application, the material of the dielectric layer 812 can be implemented as foam, polyethylene terephthalate (English name: Polyethylene terephthalate, abbreviated as PET) + polyurethane (English name: Polyuretha, abbreviated as PU), soft glue, silicone, etc., wherein PET+PU can be understood as foaming on the PET material to form a PU layer, wherein PET can also be implemented as other plastic materials, and even PET can be replaced by metal, that is, foaming on the metal to form a PU layer.

[0165] like Fig.10As shown, in the embodiment of the present application, the photosensitive component 810 further includes at least one adhesive 814, and the medium layer 812 is connected to the circuit board 813 and the photosensitive chip 811 respectively through the adhesive 814, and the adhesive 814 can be implemented as a viscous adhesive tool such as glue and double-sided tape. That is to say, in the embodiment of the present application, the adhesive 814 is firstly arranged on the medium layer 812, the photosensitive chip 811 or the circuit board 813, and then the medium layer 812, the circuit board 813 and the photosensitive chip 811 are fixed by the adhesive 814 to form the photosensitive component 810.

[0166] In particular, when the dielectric layer 812 is foam, the thickness of the foam is 80-130um, preferably 100um, and the thickness of the photosensitive chip 811 is 0.815-2.85mm, preferably 1-2mm; the thickness of the adhesive 814 is 20um-40um. When the dielectric layer 812 is implemented as soft glue, the thickness of the soft glue is 20-100um, preferably 50um, and the thickness of the photosensitive chip 811 is 0.815-2.85mm, preferably 1mm-2mm.

[0167] In a variant embodiment of the above embodiment, the dielectric layer 812 can be formed integrally with the circuit board 813, that is, the dielectric layer 812 and the circuit board 813 are an integral structure. For example, the dielectric layer 812 can be formed on the circuit board 813 by processes such as coating, spraying, printing, and foaming. For example, when the dielectric layer 812 is a foam layer, the dielectric layer 812 can be formed by presetting materials on the circuit board 813 and foaming. In this way, the foam layer (that is, the dielectric layer 812) does not need to be fixed to the circuit board 813 by the adhesive 814, and the error caused by the adhesive 814 can be further effectively controlled, which is conducive to improving the accuracy of the photosensitive component 810. It is worth mentioning that in this variant embodiment, the parameters and performance of the dielectric layer 812 are the same or similar to those of the above embodiment.

[0168] That is to say, in this variant embodiment, the preparation process of the photosensitive component 810 can be: first, the dielectric layer 812 is formed on the circuit board 813, and then the photosensitive chip 811 is fixed to the dielectric layer 812 by the adhesive 814 to form the photosensitive component 810.

[0169] In another variant embodiment of the above embodiment, the dielectric layer 812 is formed integrally with the photosensitive chip 811, that is, the dielectric layer 812 and the photosensitive chip 811 have an integral structure. For example, the dielectric layer 812 can be formed on the photosensitive chip 811 by processes such as coating, spraying, printing, and foaming.

[0170] Embodiment 2

[0171] like Fig.12 As shown, in this embodiment, the photosensitive component 810 is composed of the photosensitive chip 811, the adhesive 814 and the circuit board 813, wherein the thickness of the adhesive 814 is 50um-100um (including 50um and 100um). That is, in this implementation, the role of the adhesive 814 is equivalent to the two-in-one of the medium layer 812 and the adhesive 814 in embodiment 81, or in other words, the medium layer 812 in embodiment 81 is implemented as a cured adhesive with a thickness of 50um-100um. It is worth mentioning that, due to the fluidity of existing adhesives such as glue, it is impossible to apply glue with a thickness of 50um-100um on the photosensitive chip 811 or the circuit board 813. Therefore, in this embodiment, a support member 815 is further provided, and the support member 815 is set as the circuit board 813. The inner side surface of the support member 815 and the upper surface of the circuit board 813 form a receiving cavity 8150, and the adhesive member 814 (glue) is set in the receiving cavity 8150, and then the photosensitive chip 811 is attached to the adhesive member 814, and then the adhesive member 814 is cured by baking and other processes to form the photosensitive component 810. It is worth mentioning that in this embodiment, the cross section of the support member 815 can be implemented as an annular or quasi-annular.

[0172] In this embodiment, the adhesive 814 is preferably glue, which has a certain flexibility. Here, after being cured into the adhesive 814, it still has a certain flexibility. The upper surface of the adhesive 814 faces the photosensitive chip 811, and the lower surface faces the circuit board 813. When the ambient temperature changes and causes the circuit board 813 to deform, the force of the deformation of the circuit board 813 drives the lower surface of the adhesive 814 to deform. Since the adhesive 814 has a certain flexibility and a thickness of 50um-100um, its upper surface will not be affected and bend, and it will still be close to a plane. The force of the deformation of the circuit board 813 will not act on the photosensitive chip 811, so the photosensitive chip 811 can maintain a good flatness.

[0173] Further, in this embodiment, the adhesive 814 has a large deformation capacity. Specifically, the adhesive 814 can be compressed by 5% to 50% (preferably, 30% to 50%) of its own thickness, or stretched by 5% to 50% (preferably, 30% to 50%) of its own thickness when subjected to external force. Accordingly, when the ambient temperature changes and causes the circuit board 813 to deform, the force of the deformation of the circuit board 813 will drive the lower surface of the adhesive 814 to deform. Since the dielectric layer 812 can be compressed by 5% to 50% (preferably, 30% to 50%) of its own thickness, or stretched by 5% to 50% (preferably, 30% to 50%) of its own thickness, its upper surface will not bend and will remain close to a plane. The force of the deformation of the circuit board 813 will not act on the photosensitive chip 811. Therefore, the reflective surface of the photosensitive chip 811 can maintain a good flatness and reduce light divergence.

[0174] It is worth mentioning that in the embodiment of the present application, the thickness of the adhesive member 814 is lower than the height of the support member 815. That is, during the preparation process, the thickness of the glue is smaller than the height of the support member 815, so that the glue is completely contained in the containing cavity 8150, and at the same time, the photosensitive chip 811 is also contained in the containing cavity 8150.

[0175] In a modified embodiment of the above embodiment, the thickness of the glue may also be greater than or equal to the height of the support member 815. Fig.13 As shown, in this modified embodiment, the thickness of the adhesive member 814 (glue) is greater than the height of the support member 815. It should be understood that since the glue has a certain viscosity, during the preparation process, even if the difference in thickness between the glue and the height of the support member 815 is within a certain range, the glue will not overflow from the receiving cavity 8150.

[0176] It is also worth mentioning that in other variant embodiments of the above embodiment, the support member 815 can also be removed after the glue is cured to form the adhesive member 814, that is, the photosensitive component 810 does not include the support member 815. Fig.14 shown.

[0177] Embodiment 3

[0178] The photosensitive components disclosed in the above-mentioned Embodiment 1 and Embodiment 2 can be applied to camera modules, for example, conventional camera modules, periscope camera modules, TOF depth information camera modules, etc. Fig.15 FIG. 1 is a schematic diagram of a camera module according to an embodiment of the present application. Fig.15As shown, the camera module includes: the photosensitive component 810 as described above and an optical lens 820 maintained on the light-sensitive path of the photosensitive component 810 .

[0179] It should be noted that in the embodiment of the present application, the photosensitive component 810 further includes at least one electronic component 816 disposed on the circuit board 813, a bracket 817 disposed on the circuit board 813, and a filter element 818 mounted on the bracket, and the at least one electronic component includes but is not limited to a capacitor, a resistor, and an inductor. In the embodiment of the present application, the bracket 817 can be implemented as a traditional plastic bracket 817, which is prefabricated and attached to the upper surface of the circuit board 811, or the bracket 817 can be implemented as a molded bracket, which is integrally formed on the upper surface of the circuit board through a molding process, which is not limited to the present application. The filter element 818 can be implemented as different types, including but not limited to the filter element 818 can be implemented as an infrared cutoff filter, a full spectrum filter, and other filters or a combination of multiple filters. Specifically, for example, when the filter element 818 is implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 811. In this way, when used in an environment with sufficient light such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive chip 811, so that the infrared cutoff filter can be used to filter the infrared rays in the light reflected by the object and entering the photosensitive chip 811. Moreover, when used in an environment with darker light such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 811 to allow the infrared rays in the light reflected by the object and entering the photosensitive chip 811 to be partially transmitted.

[0180] Fig.16 FIG. 1 is a schematic diagram of a modified embodiment of the camera module according to an embodiment of the present application. Fig.16 As shown, in this variant embodiment, the camera module further includes a filter element bracket 819 arranged on the bracket 817 or the circuit board 813, and the filter element 818 is installed on the filter element bracket 819, that is, in this variant embodiment, the installation method of the filter element 818 is changed.

[0181] Embodiment 4

[0182] Fig.17 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application. Fig.17As shown, the electronic device 8100 includes an electronic device body 8110 and a camera module 8120 assembled on the electronic device body, wherein, in particular, the camera module 8120 includes the photosensitive component 810 disclosed in the above-mentioned embodiment and its modified embodiment.

[0183] It is worth mentioning that in this embodiment, the camera module 8120 can be implemented as a common camera module as described above. Fig.15 and Fig.16 As shown, or other types of camera modules, for example, a TOF depth information camera module. The position where the camera module 810 is installed on the electronic device body 8110 is not limited by the present application. For example, it can be installed on the front of the electronic device body 8110 to serve as a front camera module of the electronic device 8100; or, it can be installed on the back of the electronic device body 8110 to serve as a rear camera module of the electronic device 8100.

[0184] Of course, the type of the electronic device is not limited by the present application, and it can be implemented as a smart phone, a tablet computer, a laptop computer, etc.

[0185] Embodiment 5

[0186] According to another aspect of the present application, a method for preparing a photosensitive component 810 is also provided.

[0187] According to the relevant descriptions in Example 81 and Example 82, the preparation method of the photosensitive component 810 according to the embodiment of the present application includes: providing a circuit board 813 and a photosensitive chip 811; and forming a dielectric layer 812 between the circuit board 813 and the photosensitive chip 811.

[0188] In the preparation method according to an embodiment of the present application, in one example, a dielectric layer 812 is formed between the circuit board 813 and the photosensitive chip 811, including: forming the dielectric layer 812 on the circuit board 813; and installing the photosensitive chip 811 on the dielectric layer 812.

[0189] In the preparation method according to an embodiment of the present application, in one example, a dielectric layer 812 is formed between the circuit board 813 and the photosensitive chip 811, including: forming the dielectric layer 812 on the lower surface of the photosensitive chip 811; and mounting the photosensitive chip 811 with the dielectric layer 812 on the circuit board 813.

[0190] In the preparation method according to an embodiment of the present application, in one example, forming the dielectric layer 812 on the circuit board 813 includes: applying an adhesive 814 on the circuit board 813; and mounting the dielectric layer 812 on the adhesive 814 to form the dielectric layer 812 on the circuit board 813.

[0191] In the preparation method according to the embodiment of the present application, in one example, forming the dielectric layer 812 on the circuit board 813 includes: integrally forming the dielectric layer 812 on the circuit board 813 .

[0192] In the preparation method according to an embodiment of the present application, in one example, the photosensitive chip 811 is installed on the dielectric layer 812, including: applying an adhesive 814 on the dielectric layer 812; and mounting the photosensitive chip 811 on the adhesive 814 to install the photosensitive chip 811 on the dielectric layer 812.

[0193] In the preparation method according to an embodiment of the present application, in one example, a dielectric layer 812 is formed between a circuit board 813 and a photosensitive chip 811, including: forming a support member 815 on the circuit board 813, wherein the support member 815 and the surface of the circuit board 813 form a receiving cavity 8150; applying an adhesive in the receiving cavity 8150; mounting the photosensitive chip 811 on the adhesive; and curing the adhesive to form the dielectric layer 812 between the circuit board 813 and the photosensitive chip 811.

[0194] In the preparation method according to the embodiment of the present application, in one example, the method further includes removing the support member 815 .

[0195] It is worth mentioning that in the embodiment of the present application, the dielectric layer 812 is made of a flexible material, and the Shore hardness of the flexible material is 10 degrees to 70 degrees. The material of the dielectric layer 812 is selected from any one of foam, a combination of plastic and foam, soft glue and silicone. When the dielectric layer 812 is made of foam, the thickness of the dielectric layer 812 is 80um-130um. When the dielectric layer 812 is made of soft glue, the thickness of the dielectric layer 812 is 20um-100um. The deformation amount that the dielectric layer 812 can undergo is 5%-50% of its own thickness.

[0196] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. An optical component, characterized in that: include: Filter elements; A bracket, used for carrying the filter element; a dielectric layer, through which the filter element is mounted on the bracket, wherein the dielectric layer is used to prevent the force of deformation of the bracket from acting on the filter element; as well as A support member, wherein the support member is arranged on the bracket, and the support member and the bracket surface form a receiving cavity, wherein the medium layer is formed by curing an adhesive applied to the receiving cavity, wherein the support member includes an inner support unit and an outer support unit, the receiving cavity is formed between the inner side surface of the inner support unit and the inner side surface of the outer support unit, and the inner support unit and the outer support unit both have an annular structure.

2. The optical assembly according to claim 1, wherein: The hardness of the filter element is greater than that of the dielectric layer, so the deformation of the filter element can be suppressed by the deformation of the dielectric layer.

3. The optical assembly according to claim 1, wherein: The thickness of the dielectric layer is 50um-100um.

4. The optical assembly according to claim 1, wherein: The dielectric layer can be deformed by 5% to 50% of its thickness.

5. The optical assembly according to claim 1, wherein: The bracket includes a supporting portion and a suspension portion extending inwardly from the supporting portion, and the filter element is mounted on the suspension portion.

6. The optical assembly according to claim 5, wherein: The upper surface of the suspension portion is lower than the upper surface of the support portion, and the upper surface of the filter element is lower than the upper surface of the support portion.

7. A photosensitive component, characterized in that: include: Circuit board; A photosensitive chip electrically connected to the circuit board; And the optical component according to any one of claims 1-6, wherein the optical component is arranged on the circuit board, and the filter element is located in the photosensitive path of the photosensitive chip.

8. The photosensitive assembly according to claim 7, further comprising a base disposed on the circuit board, wherein: The optical component is mounted on the base.

9. A camera module, characterized in that: include: Optical lens; as well as Photosensitive component, the optical lens is maintained in the photosensitive path of the photosensitive component, wherein the photosensitive component includes the optical component according to any one of claims 1-6.

10. A method for preparing an optical component, characterized in that: include: Provide filter elements and brackets; as well as forming a dielectric layer between the support and the filter element; Wherein, a dielectric layer is formed between the bracket and the filter element, comprising: arranging a support member on the bracket, the support member and the bracket surface forming a receiving cavity, wherein the support member comprises an inner support unit and an outer support unit, the receiving cavity is formed between the inner side surface of the inner support unit and the inner side surface of the outer support unit, and both the inner support unit and the outer support unit have an annular structure; applying an adhesive in the receiving cavity; mounting the filter element on the adhesive; and curing the adhesive to form a dielectric layer between the bracket and the filter element.

11. The preparation method according to claim 10, further comprising: The support is removed.

12. A photosensitive component, characterized in that: include: Circuit board; A photosensitive chip electrically connected to the circuit board; a dielectric layer, disposed between the circuit board and the photosensitive chip, and having a predetermined flexibility for preventing the photosensitive chip from deforming; and A support member, wherein the support member is arranged on the circuit board, and the support member and the surface of the circuit board form a receiving cavity, wherein the dielectric layer is formed by curing an adhesive applied to the receiving cavity, wherein the support member includes an inner support unit and an outer support unit, the receiving cavity is formed between the inner side surface of the inner support unit and the inner side surface of the outer support unit, and both the inner support unit and the outer support unit have an annular structure.

13. The photosensitive component according to claim 12, wherein: The photosensitive chip is mounted on the circuit board through the dielectric layer.

14. The photosensitive component according to claim 12, wherein: The thickness of the dielectric layer is 50um-100um.

15. The photosensitive component according to claim 12, wherein: The dielectric layer can be deformed by 5% to 50% of its thickness.

16. A camera module, characterized in that: include: Optical lens; And a photosensitive component according to any one of claims 12-15, wherein the optical lens is maintained in the photosensitive path of the photosensitive component.

17. An electronic device, characterized in that: include: Electronic equipment body; as well as A camera module assembled on the electronic device body, wherein the camera module includes a photosensitive component according to any one of claims 12-15.

18. A method for preparing a photosensitive component, characterized in that: include: Provide circuit boards and photosensitive chips; as well as forming a dielectric layer between the circuit board and the photosensitive chip; Wherein, a dielectric layer is formed between the circuit board and the photosensitive chip, comprising: arranging a support member on the circuit board, the support member and the circuit board surface forming a receiving cavity, wherein the support member comprises an inner support unit and an outer support unit, the receiving cavity is formed between the inner side surface of the inner support unit and the inner side surface of the outer support unit, and both the inner support unit and the outer support unit have an annular structure; applying an adhesive in the receiving cavity; mounting the photosensitive chip on the adhesive; and curing the adhesive to form the dielectric layer between the circuit board and the photosensitive chip.

19. The preparation method according to claim 18, further comprising: The support is removed.

Images