A structure and preparation method for realizing centralized heat dissipation and sealing of electronic components

Abstract

The present invention discloses a structure and a preparation method for realizing centralized heat dissipation and sealing of electronic components, which relates to the technical field of centralized heat dissipation and sealing of electronic components of a domain controller. Among them, the structure for realizing centralized heat dissipation and sealing of electronic components includes a domain controller housing with a PCBA board installed inside; the heat pipe assembly includes a heat pipe installation base and a plurality of heat pipes connected to the heat pipe installation base; the heat dissipation assembly includes at least one radiator installed outside the upper cover of the domain controller and a fan for dissipating heat from the radiator. The heat pipes pass through the upper cover of the domain controller and are inserted into the radiator to dissipate heat through the radiator. The upper cover of the domain controller is provided with through holes for each heat pipe to pass through; the sealing seat body is connected to the upper cover of the domain controller for sealing the through holes. The present invention can enable the electronic components of the domain controller PCBA board to meet the heat dissipation requirements and enable the overall domain controller to meet the sealing requirements of dust and water prevention.

Description

Technical Field

[0001] The present invention relates to the technical field of centralized heat dissipation and sealing of electronic components of a domain controller, and particularly relates to a structure capable of realizing centralized heat dissipation and sealing of electronic components, and also relates to a preparation method. Background Art

[0002] Generally, for an in-vehicle domain controller, with the improvement of its control and interaction capabilities, higher requirements are imposed on the performance of its internal electronic components. This means that it is necessary to improve the working performance of the electronic components on the PCBA board of the in-vehicle domain controller. However, the improvement of the working performance of electronic components is often accompanied by an increase in power consumption. In addition, with the rapid development of in-vehicle domain controllers towards high efficiency, high integration, etc., and the continuous progress of electronic and information processing technologies, a series of heat dissipation problems such as narrow heat dissipation space and high heat flux density are brought to the domain controller. If the heat generated by the electronic components cannot be dissipated in time, the temperature inside the electronic components will become higher and higher, seriously affecting the service life and performance of the electronic components, and even leading to the failure of the electronic components due to excessive temperature, which is fatal to the in-vehicle domain controller.

[0003] The heat pipe heat dissipation technology is a passive two-phase heat transfer technology, known as the "superconductor of heat". Among them, a heat pipe is a heat transfer element with extremely high thermal conductivity. It transfers heat through the gas-liquid phase change of the working medium in a fully enclosed vacuum tube and has extremely high thermal conductivity. A heat pipe radiator generally includes a heat pipe mounting base, a heat pipe, and heat dissipation fins. Multiple heat dissipation fins can be arranged on the upper surface of the heat pipe mounting base, and heat pipe elements for heat conduction can also be embedded in the lower surface. The heat pipe mounting base with the embedded heat pipe elements transfers heat to the chip through a heat conduction medium. The area of the heat pipe elements not in contact with the heat pipe mounting base is connected to the vertical heat dissipation fins, and the heat dissipation fins can dissipate the heat transferred from the heat pipe. The space occupied by the traditional heat pipe radiator is relatively large compared to the entire domain controller. One reason is that the heat pipe needs space to complete bending, and the other reason is that the heat dissipation fins need space for heat dissipation. Generally speaking, for the PCBA board of the domain controller, when using the heat dissipation method combined with a heat pipe radiator, the PCBA board cannot be integrally sealed due to the space limitations of the heat pipe and the heat dissipation fins. This will directly expose the entire PCBA board to the air, which is unimaginable for a domain controller with requirements such as dust and water protection. However, the heat dissipation method combined with a heat pipe radiator has the ability to centrally dissipate heat from electronic components and plays a very important role in improving the overall heat dissipation capacity of the system. Therefore, how to make the electronic components of the domain controller PCBA board meet the heat dissipation requirements and at the same time make the entire domain controller meet the dust and water protection sealing requirements under the premise of using the heat dissipation method of a heat pipe radiator is an urgent problem to be solved. Summary of the Invention

[0004] The present invention aims to solve at least one of the above technical problems in the prior art to some extent. To this end, an embodiment of the present invention provides a structure capable of realizing centralized heat dissipation and sealing of electronic components, which can enable the electronic components of the domain controller PCBA board to meet the heat dissipation requirements and enable the overall domain controller to meet the dust and water sealing requirements.

[0005] An embodiment of the present invention further provides a preparation method for preparing a structure capable of realizing centralized heat dissipation and sealing of electronic components.

[0006] According to an embodiment of the first aspect of the present invention, there is provided a structure capable of realizing centralized heat dissipation and sealing of electronic components, including a domain controller housing with a PCBA board installed inside, the domain controller housing including a domain controller upper cover and a domain controller lower cover connected to each other; a heat pipe assembly, the heat pipe assembly including a heat pipe mounting base that conducts heat with a high-heat-generation-power chip of the PCBA board through a heat-conducting medium and a plurality of heat pipes connected to the heat pipe mounting base; a heat dissipation assembly, the heat dissipation assembly including at least one radiator installed outside the domain controller upper cover and a fan for dissipating heat from the radiator, the heat pipes passing through the domain controller upper cover and being inserted into the radiator for heat dissipation through the radiator, and the domain controller upper cover being provided with through holes for each of the heat pipes to pass through; and a sealing seat body, the sealing seat body being connected to the domain controller upper cover for sealing the through holes.

[0007] The above structure capable of realizing centralized heat dissipation and sealing of electronic components has at least the following beneficial effects:

[0008] The above technical solution can utilize heat pipes and radiators to conduct centralized heat dissipation for high-heat-generation-power chips under the condition of limited space, improve the heat dissipation capacity of the entire system, and increase the allowable operating power consumption of the chips; compared with the traditional heat dissipation method using heat pipes, the overall PCBA cannot be sealed due to the space limitation of the heat pipes and heat dissipation fins. In the embodiment of the present invention, through holes are provided in the domain controller upper cover for each heat pipe to pass through, and then a sealing seat body is used in cooperation with the radiator to seal the through holes, so as to seal the entire PCBA, avoiding the shortcoming of using heat pipes for heat dissipation, enabling the overall domain controller to achieve dust and water protection, and further enabling heat pipes to be applied to a wider heat dissipation field. While improving the heat dissipation capacity of the entire system, it can ensure a simple structure design and reduce the overall cost.

[0009] According to an embodiment of the first aspect of the present invention, the sealing seat body includes a cover plate for covering the exposed part of the heat pipe between the domain controller upper cover and the radiator, and the edge of the cover plate extends downward to form a plurality of side plates, and each side plate is connected to the domain controller upper cover, thereby sealing the through holes.

[0010] According to an embodiment of the first aspect of the present invention, two radiators are provided and distributed on the left and right sides of the through hole, and each of the heat pipes in the heat pipe assembly is alternately inserted into the two radiators in sequence.

[0011] According to an embodiment of the first aspect of the present invention, the cover plate is arranged between the two radiators, the left and right sides of the cover plate are pressed against the radiators, and side plates are respectively extended downward at both ends of the cover plate.

[0012] According to an embodiment of the first aspect of the present invention, the sealing seat body includes a plurality of connecting strip plates installed on the radiator, the connecting strip plates are connected with the cover plate, and the fan is installed on the radiator through the connecting strip plates to dissipate heat from the radiator.

[0013] According to an embodiment of the first aspect of the present invention, a heat dissipation auxiliary boss is arranged on the side of the high-heat-generation-power chip of the PCBA board, and is used for conducting more heat of the high-heat-generation-power chip of the PCBA board to the heat pipe installation base.

[0014] According to an embodiment of the first aspect of the present invention, an installation groove is arranged on the inner side of the upper cover of the domain controller for inlaying and fixing the heat pipe installation base.

[0015] According to an embodiment of the first aspect of the present invention, the distance between the heat pipe installation base and the high-heat-generation-power chip of the PCBA board is 0.2 - 0.7 mm.

[0016] According to an embodiment of the first aspect of the present invention, the upper cover of the domain controller, the lower cover of the domain controller, the heat pipe installation base, the heat dissipation auxiliary boss, the radiator, and the sealing seat body are made of materials with high thermal conductivity, and the materials with high thermal conductivity are one or more of aluminum alloy, copper alloy, aluminum, and copper.

[0017] According to an embodiment of the second aspect of the present invention, a preparation method is provided for preparing the structure capable of realizing centralized heat dissipation and sealing of electronic components according to the embodiment of the first aspect of the present invention, including the following steps:

[0018] S1, connecting the heat pipes in the heat pipe assembly with the radiator;

[0019] S2, positioning and welding the sealing seat body with the radiator, and connecting the fan with the radiator;

[0020] S3, bending the heat pipe to pass through the through hole of the upper cover of the domain controller;

[0021] S4, positioning and welding the radiator with the upper cover of the domain controller;

[0022] S5. Inlay and connect the heat pipe with the heat pipe mounting base;

[0023] S6. Inlay the heat pipe mounting base inside the upper cover of the domain controller;

[0024] S7. Assemble the upper cover of the domain controller, the lower cover of the domain controller, the fan and the sealing seat body through fasteners.

[0025] The above preparation method has at least the following beneficial effects: By first assembling the heat pipe and the radiator, then bending the heat pipe through the through hole of the upper cover of the domain controller and installing it on the upper cover of the domain controller through the heat pipe mounting base, and finally assembling the upper cover of the domain controller and the lower cover of the domain controller, a structure that can achieve centralized heat dissipation and sealing of electronic components can be prepared. Description of the Drawings

[0026] The present invention will be further described below in conjunction with the drawings and embodiments;

[0027] Figure 1 is a perspective view of an embodiment of the present invention;

[0028] Figure 2 is an exploded view of an embodiment of the present invention;

[0029] Figure 3 is an assembly schematic diagram of the upper cover of the domain controller and the heat pipe assembly in an embodiment of the present invention;

[0030] Figure 4 is a front view of the PCBA board in an embodiment of the present invention;

[0031] Figure 5 is a perspective view of the sealing seat body in an embodiment of the present invention. Detailed Embodiments

[0032] This part will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the drawings. The role of the drawings is to supplement the description in the text part of the specification, enabling people to visually and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the protection scope of the present invention.

[0033] In the description of the present invention, it should be understood that the orientation or positional relationship involved, such as up, down, front, back, left, right, etc., refers to the orientation or positional relationship based on the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of the present invention, the meaning of "a number of" is one or more, the meaning of "a plurality of" is more than two, and understandings such as "greater than", "less than", "exceeding", etc. do not include the present number, and understandings such as "above", "below", "within", etc. include the present number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, words such as "arrangement", "installation", "connection", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0036] Refer to Figures 1 to 5 , a structure capable of realizing centralized heat dissipation and sealing of electronic components, including a domain controller housing 10, a heat pipe assembly 30, a heat dissipation assembly 40, and a sealing seat body 50.

[0037] Among them, a PCBA board 21 is installed inside the domain controller housing 10. The domain controller housing 10 includes a domain controller upper cover 11 and a domain controller lower cover 12 that are connected to each other. After the domain controller upper cover 11 and the domain controller lower cover 12 are connected, a receiving cavity for installing the PCBA board 21 is formed inside. In addition to high-heat-generation-power chips 22, other low-heat-generation-power chips 23 are also provided on the PCBA board 21. In the embodiments of the present invention, the "high-heat-generation power" and "low-heat-generation power" are relative to each chip in the PCBA board 21, and those skilled in the art can understand this without any ambiguity.

[0038] The heat pipe assembly 30 includes a heat pipe mounting base 31 that conducts heat with the high-heat-generation-power chip 22 of the PCBA board 21 through a heat-conducting medium and a plurality of heat pipes 32 connected to the heat pipe mounting base 31. Further preferably, a heat dissipation auxiliary boss 14 is provided on the side of the high-heat-generation-power chip 22 of the PCBA board 21 to conduct more heat of the high-heat-generation-power chip 22 of the PCBA board 21 to the heat pipe mounting base 31, and then dissipate heat through each heat pipe 32. The setting of the heat dissipation auxiliary boss 14 is to transfer the heat on the side of the high-heat-generation-power chip 22 to the heat pipe mounting base 31 to increase the conduction of the heat of the high-heat-generation-power chip to the heat pipes 32.

[0039] The heat dissipation assembly 40 includes at least one radiator 41 installed outside the domain controller upper cover 11 and a fan 42 for dissipating heat from the radiator 41. The heat pipes 32 pass through the domain controller upper cover 11 and are inserted into the radiator 41 to dissipate heat through the radiator 41. The domain controller upper cover 11 is provided with through holes 13 for each heat pipe 32 to pass through. The radiator 41 has insertion holes 43 for the heat pipes 32 to be inserted into.

[0040] It can be understood that most of the heat of the high-heat-generation-power chip 22 is transferred from the heat pipe mounting base 31 to the heat pipe 32, and the heat pipe 32 transfers the heat to the radiator 41, and the radiator 41 dissipates heat by air cooling through the fan 42.

[0041] In this embodiment, two radiators 41 are provided and distributed on the left and right sides of the through hole 13. Each heat pipe 32 in the heat pipe assembly 30 is sequentially and staggeredly inserted into the two radiators 41. Correspondingly, two fans 42 are provided.

[0042] Preferably, the upper cover 11 of the domain controller, the lower cover 12 of the domain controller, the heat pipe mounting base 31, the heat dissipation auxiliary boss 14, the radiator 41, and the sealing seat body 50 are made of materials with high thermal conductivity. The materials with high thermal conductivity are one or more of aluminum alloy, copper alloy, aluminum, and copper. Specifically, the two radiators 41 are finned radiators. The thickness of the heat dissipation fins is 0.3 - 1 mm. The heat dissipation fins are arranged at intervals in the vertical direction, and the interval is 1.5 - 3 mm. The materials that can be used are high-thermal-conductivity materials such as pure aluminum, pure copper, aluminum alloy, and copper alloy. The processing method is the snap-in FIN process. The number of heat pipes 32 is set to at least eight. The diameter of the heat pipes 32 is 6 - 10 mm. The inside of the heat pipes 32 is filled with liquid ammonia, acetone or other working fluids, and the thermal conductivity is ≥ 10000 W / (m×K). The material of the heat pipe mounting base 31 is a high-thermal-conductivity material such as aluminum alloy and copper alloy, and can be designed and adjusted according to the actual number and diameter of the heat pipes used, the size and position of the high-heat-generation-power chip. The material of the heat dissipation auxiliary boss 14 on the side of the high-heat-generation-power chip 22 is a high-thermal-conductivity material such as aluminum alloy and copper alloy, and can be designed and adjusted according to the actual size and position of the high-power heat-generating chip.

[0043] In this embodiment, two radiators 41 are provided. Most of the heat of the high-heat-generation-power chip 22 is transferred from the heat pipe mounting base 31 to the heat pipe 32, and the heat pipe 32 transfers the heat to the radiator 41. The radiator 41 dissipates heat by air cooling through the fan 42. The heat pipe 32 transfers the heat to the two radiators 41 in the vertical direction, and the heat dissipation fins of the radiator 41 dissipate heat by air cooling through the corresponding fans 42.

[0044] Refer to Figure 2 、 Figure 3 and Figure 5, the sealing seat body 50 is connected to the upper cover 11 of the domain controller for sealing the through hole 13. Specifically, the sealing seat body 50 includes a cover plate 51 for covering the exposed part of the heat pipe 32 between the upper cover 11 of the domain controller and the radiator 41. The edge of the cover plate 51 extends downward to form a plurality of side plates 52, and each side plate 52 is connected to the upper cover 11 of the domain controller, thereby sealing the through hole 13. In this embodiment, the cover plate 51 is disposed between the two radiators 41, and the left and right sides of the cover plate 51 are pressed against the radiators 41, and the two ends of the cover plate 51 respectively extend downward to provide side plates 52.

[0045] It can be understood that, first, in order to ensure that the heat pipe 32 can transfer the heat generated by the high-heat-generation-power chip 22 to the heat dissipation fins of the radiator 41, corresponding hole-opening treatment is performed on the upper cover 11 of the domain controller, so that the heat pipe 32 can pass through the through hole 13 to pass through the upper cover 11 of the domain controller. Then, the domain controller housing 10, the sealing seat body 50, and the two radiators 41 are connected by welding. The upper cover 11 and the lower cover 12 of the domain controller can be connected and sealed by bolts, so as to ensure that dust, water, etc. will not enter the interior of the domain controller housing 10 through the through hole of the upper cover 11 of the domain controller, thereby realizing the waterproof and dustproof of the PCBA board 21.

[0046] In some other embodiments, only one radiator may be provided. One side of the cover plate of the sealing seat body is connected to the radiator, and the other three sides respectively extend downward to provide side plates, and the side plates are connected to the upper cover of the domain controller, thereby sealing the through hole. Of course, if three radiators are provided, three sides of the cover plate of the sealing seat body are respectively connected to the corresponding radiators, and the other side extends downward to provide a side plate, and the side plate is connected to the upper cover of the domain controller, thereby sealing the through hole. Those skilled in the art can adjust the cover plate and set the corresponding side plates according to the number and arrangement of the radiators.

[0047] Heat dissipation bosses 15 are provided on the inner side of the upper cover 11 of the domain controller and the inner side of the lower cover 12 of the domain controller. Other low-heat-generation-power chips 23 on the PCBA board 21 perform heat transfer with the corresponding heat dissipation bosses 15 through a heat-conducting medium, and complete heat dissipation by means of the upper cover 11 and the lower cover 12 of the domain controller, so that all electronic components of the domain controller can meet the heat dissipation requirements.

[0048] In addition, the sealing seat body 50 includes a plurality of connecting strip plates 53 installed on the radiator 41. The connecting strip plates 53 are connected to the cover plate 51, and the fan 42 is installed on the radiator 41 through the connecting strip plates 53 to dissipate heat from the radiator.

[0049] On the inner side of the upper cover 11 of the domain controller, there is an installation groove for inlaying and fixing the heat pipe installation base 31. The heat pipe installation base 31 is fixed through the installation groove. The distance between the heat pipe installation base 31 and the high-heat-generation-power chip 22 of the PCBA board 21 is 0.2 - 0.7 mm, avoiding the inability to achieve centralized heat dissipation of the high-heat-generation-power chip due to processing errors and inability to position. The length and width dimensions of the installation groove are the same as those of the embedded part of the heat pipe installation base 31, and are larger than the length and width dimensions of the high-heat-generation-power chip. The depth of the installation groove is 0.3 mm, aiming to ensure the stiffness of the upper cover of the domain controller while positioning the heat pipe installation base to ensure that the distance between the heat pipe installation base 31 and the high-heat-generation-power chip 22 of the PCBA board 21 is 0.2 - 0.7 mm.

[0050] In this embodiment, a structure that can achieve centralized heat dissipation and sealing of electronic components has an overall external dimension of 247.6 mm × 189.5 mm × 65 mm. Among them, the upper cover 11 and the lower cover 12 of the domain controller can both be manufactured by casting, milling, etc., and are made of materials with high thermal conductivity coefficients such as aluminum alloy, copper alloy, aluminum, and copper.

[0051] This embodiment also presents a preparation method for preparing the above-mentioned structure that can achieve centralized heat dissipation and sealing of electronic components, including the following steps:

[0052] S1, Connect the heat pipe 32 in the heat pipe assembly 30 to the radiator 41.

[0053] S2, Position-weld the sealing seat body 50 to the radiator 41.

[0054] S3, Bend the heat pipe 32 and pass it through the through-hole of the upper cover 11 of the domain controller.

[0055] S4, Position-weld the radiator 41 to the upper cover 11 of the domain controller.

[0056] S5, Inlay and connect the heat pipe to the heat pipe installation base.

[0057] S6, Inlay the heat pipe installation base 31 inside the upper cover 11 of the domain controller.

[0058] S7, Assemble the upper cover 11 of the domain controller, the lower cover 12 of the domain controller, the fan 42, and the sealing seat body 50 through fasteners.

[0059] The above has described the embodiments of the present invention in detail with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention within the scope of knowledge possessed by those of ordinary skill in the art.

Claims

1. A structure capable of achieving centralized heat dissipation and sealing of electronic components, characterized in that: It includes A domain controller housing with a PCBA board installed inside. The domain controller housing includes the domain controller upper cover and the domain controller lower cover that are connected to each other; A heat pipe assembly. The heat pipe assembly includes a heat pipe installation base that conducts heat with the high-heat-generation-power chips of the PCBA board through a heat-conducting medium, and a plurality of heat pipes connected to the heat pipe installation base; A heat dissipation assembly. The heat dissipation assembly includes at least one radiator installed outside the domain controller upper cover and a fan for dissipating heat from the radiator. The heat pipes pass through the domain controller upper cover and are inserted into the radiator to dissipate heat through the radiator. The domain controller upper cover is provided with through holes for each of the heat pipes to pass through; And A sealing seat body. The sealing seat body is connected to the domain controller upper cover. The sealing seat body includes a cover plate for covering the exposed part of the heat pipe between the domain controller upper cover and the radiator. The edge of the cover plate extends downward to form a plurality of side plates, and each side plate is connected to the domain controller upper cover, thereby sealing the through hole.

2. The structure capable of achieving centralized heat dissipation and sealing of electronic components according to claim 1, characterized in that: Two radiators are provided and are distributed on the left and right sides of the through hole. Each of the heat pipes in the heat pipe assembly is alternately inserted into the two radiators.

3. The structure capable of achieving centralized heat dissipation and sealing of electronic components according to claim 2, characterized in that: The cover plate is arranged between the two radiators. The left and right sides of the cover plate are pressed against the radiators, and the two ends of the cover plate respectively extend downward to provide the side plates.

4. The structure capable of achieving centralized heat dissipation and sealing of electronic components according to claim 1, characterized in that: The sealing seat body includes a plurality of connecting strip plates installed on the radiator. The connecting strip plates are connected to the cover plate, and the fan is installed on the radiator through the connecting strip plates to dissipate heat from the radiator.

5. The structure capable of achieving centralized heat dissipation and sealing of electronic components according to any one of claims 1 to 4, characterized in that: A heat dissipation auxiliary boss is arranged on the side of the high-heat-generation-power chip of the PCBA board, which is used to conduct more heat of the high-heat-generation-power chip of the PCBA board to the heat pipe installation base.

6. The structure capable of achieving centralized heat dissipation and sealing of electronic components according to claim 5, characterized in that: An installation groove is arranged on the inner side of the domain controller upper cover for inlaying and fixing the heat pipe installation base.

7. The structure capable of achieving centralized heat dissipation and sealing of electronic components according to claim 6, characterized in that: The distance between the heat pipe installation base and the high-heat-generation-power chip of the PCBA board is 0.2 to 0.7 mm.

8. The structure capable of achieving centralized heat dissipation and sealing of electronic components according to claim 5, characterized in that: The upper cover of the domain controller, the lower cover of the domain controller, the heat pipe mounting base, the heat dissipation auxiliary boss, the radiator, and the sealing seat body are made of a material with a high thermal conductivity coefficient, and the material with a high thermal conductivity coefficient is one or more of aluminum alloy, copper alloy, aluminum, and copper.

9. A preparation method for preparing the structure capable of realizing centralized heat dissipation and sealing of electronic components according to any one of claims 1 to 8, characterized in that, it includes the following steps: S1. Connect the heat pipe in the heat pipe assembly to the radiator; S2. Position-weld the sealing seat body to the radiator; S3. Bend the heat pipe and pass it through the through hole of the upper cover of the domain controller; S4. Position-weld the radiator to the upper cover of the domain controller; S5. Inlay and connect the heat pipe to the heat pipe mounting base; S6. Inlay the heat pipe mounting base inside the upper cover of the domain controller; S7. Assemble the upper cover of the domain controller, the lower cover of the domain controller, the fan and the sealing seat body through fasteners.

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