Optical module and method of manufacturing the same

Abstract

A light module includes: a light element; a housing that houses the light element inside; an electrical terminal that is provided to an outer peripheral surface of the housing and is electrically connected to the inside of the housing; and a positioning portion that determines a relative position of a wiring substrate that is electrically connected to the electrical terminal from the outside of the housing. The positioning portion can also be a pin that is provided to protrude from the outer peripheral surface of the housing.

Description

Technical Field

[0001] This invention relates to optical modules and their manufacturing methods. Background Technology

[0002] In high-capacity optical communication systems, optical transceivers, which serve as optical modules for transmitting and receiving signal light, employ digital coherent transceivers. Digital coherent transceivers are configured by housing multiple optical components and electronic components within a single enclosure, while consistently striving for miniaturization. For example, Patent Document 1 discloses an optical transceiver conforming to the CFP2 standard within the MSA (Multi-Source Agreement), an agreement relating to products with interchangeable common specifications.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: JP 2016-081060 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] This module incorporates optical elements that function through electrical connections. The optical elements are electrically connected to the exterior of the housing via, for example, a wiring substrate. In this case, with the miniaturization of the optical module, the patterns (also called wiring patterns) of the electrical terminals used for electrical connections are continuously becoming more refined. Consequently, the need for high-precision positioning of the electrode patterns in the housing and the wiring substrate increases.

[0008] The present invention was made in view of the aforementioned problems, and its purpose is to provide an optical module and a method thereof capable of high-precision positioning of the wiring pattern of the frame and the wiring pattern of the wiring substrate.

[0009] Methods for solving problems

[0010] To address the aforementioned issues and achieve the objective, one aspect of the present invention is an optical module comprising: an optical element; a housing that encloses the optical element; an electrical terminal disposed on the outer peripheral surface of the housing and electrically connected to the interior of the housing; and a positioning portion that determines the relative position of a wiring substrate electrically connected from the outside of the housing to the electrical terminal to the electrical terminal.

[0011] The positioning part may also include pins that are configured to protrude from the outer peripheral surface of the frame.

[0012] The positioning part may also include non-energized pins.

[0013] The positioning part can also be connected to the ground.

[0014] The positioning part can also be connected to the ground of the wiring substrate.

[0015] The positioning part may also include a portion of the outer shape of the frame.

[0016] The positioning part may also include a convex shape portion that is part of the outer shape of the frame.

[0017] The positioning part may also include a countersunk hole shape part that is a portion of the outer shape of the frame.

[0018] The positioning part may also include a metallized pattern with a convex or concave shape on the outer peripheral surface of the frame.

[0019] The positioning part may also include a non-electrically powered metallized pattern.

[0020] The positioning part can also be connected to the ground.

[0021] The positioning part may also be formed on the same surface as the electrical terminal, protruding or recessing more than 10 μm relative to the electrical terminal.

[0022] It may also include a wiring board that is electrically connected to the electrical terminals from the outside of the frame, the wiring board having a wiring board side positioning portion corresponding to the positioning portion.

[0023] The wiring substrate is a flexible substrate.

[0024] The wiring substrate may also be configured to include polyimide, liquid crystal polymer, or polytetrafluoroethylene resin.

[0025] The electrical wiring formed on the wiring substrate can also be coplanar lines, microstrip lines or ground plane lines.

[0026] Alternatively, an organic sheet can be thermally bonded to the signal line of the wiring substrate, or the organic sheet can be bonded with resin, or a resin coating can be applied, forming a ground plane on the upper surface of the organic sheet or resin coating, and through-holes are formed between the ground planes on two or three sides with a narrow spacing of 0.03 to 5 mm.

[0027] The wiring substrate may also have a resin coating applied to all surfaces except for the conductive pads located at the substrate end further away from the joint with the outer surface of the frame.

[0028] The wiring substrate can also be machined at an angle R at the end of the substrate that is further away from the joint with the outer surface of the frame.

[0029] The junction between the wiring substrate and the outer surface of the frame can also be covered by a resin coating material that is configured to contact both a portion of the wiring substrate and a portion of the outer surface of the frame.

[0030] The Young's modulus of the resin coating material can also be below 20 GPa.

[0031] The thickness of the resin coating material can also be 10 μm or more.

[0032] Alternatively, a bonding support member can be attached to the surface or back of the wiring substrate, and the bonding support member is bonded to a portion of the outer surface of the frame by a resin adhesive.

[0033] Alternatively, a connecting support member with protrusions or rod-like portions can be connected to the surface or back of the wiring substrate, wherein the protrusions or rod-like portions of the connecting support member engage with grooves, recesses, or holes formed in the frame.

[0034] Alternatively, the protrusions or rod-shaped portions of the connecting support members may be inserted into the grooves, recesses, or holes formed in the frame and joined by resin adhesive or solder.

[0035] Alternatively, the resin adhesive may be a resin adhesive including epoxy resin, acrylic resin, silicone resin or rubber-based resin.

[0036] The optical element may also include a semiconductor laser element, a semiconductor light receiving element, a semiconductor light modulator, or a semiconductor light amplifier.

[0037] One aspect of the present invention is a method for manufacturing an optical module. In an optical module comprising an optical element, a frame housing the optical element, and electrical terminals disposed on the outer peripheral surface of the frame and electrically connected to the interior of the frame, when a wiring board is electrically connected to the electrical terminals from the outside of the frame, the relative position of the wiring board to the electrical terminals is determined by a positioning part of the frame and a wiring board-side positioning part of the wiring board.

[0038] Invention Effects

[0039] According to the present invention, a high-precision positioning effect is achieved for the electrode pattern of the frame and the electrode pattern of the wiring substrate. Attached Figure Description

[0040] Figure 1 This is a schematic diagram showing the appearance of the optical module according to Embodiment 1.

[0041] Figure 2 To express [the opinion / towards] Figure 1The diagram shows a portion of the optical module in a decomposed state.

[0042] Figure 3 To indicate Figure 1 The diagram shows the internal structure of the optical module.

[0043] Figure 4 To indicate Figure 1 A schematic diagram of a partial cross-section of the optical module shown.

[0044] Figure 5 This is a schematic diagram illustrating the pin formation method.

[0045] Figure 6 This is a schematic diagram showing the appearance of the optical module involved in Embodiment 2.

[0046] Figure 7 To express [the opinion / towards] Figure 6 The diagram shows a portion of the optical module in a decomposed state.

[0047] Figure 8 This is a schematic diagram showing the appearance of the optical module involved in Embodiment 3.

[0048] Figure 9 To express [the opinion / towards] Figure 8 The diagram shows a portion of the optical module in a decomposed state.

[0049] Figure 10A To indicate Figure 8 The diagram shows the installation method of the wiring board in the optical module, and is a diagram showing the preparation process.

[0050] Figure 10B To indicate Figure 8 The diagram shows the mounting method of the wiring board in the optical module, and is intended to illustrate... Figure 10A Diagram of the subsequent processes.

[0051] Figure 10C To indicate Figure 8 The diagram shows the mounting method of the wiring board in the optical module, and is intended to illustrate... Figure 10B Diagram of the subsequent processes.

[0052] Figure 11 This is a schematic diagram illustrating other implementation methods.

[0053] Figure 12 This is a schematic diagram illustrating another embodiment.

[0054] Figure 13 This is a schematic diagram illustrating another embodiment. Detailed Implementation

[0055] Hereinafter, embodiments will be described with reference to the accompanying drawings. However, the invention is not limited by these embodiments. Furthermore, in the accompanying drawings, the same or corresponding elements are appropriately marked with the same reference numerals. It should also be noted that the drawings are merely schematic diagrams, and the dimensional relationships and ratios of the elements may sometimes differ from reality. The drawings may also include portions with different dimensional relationships or ratios.

[0056] (Implementation Method 1)

[0057] Figure 1 This is a schematic diagram showing the appearance of the optical module according to Embodiment 1. Figure 2 To express [the opinion / towards] Figure 1 The diagram shows a portion of the optical module in a disassembled state. Figure 1 In this embodiment, to indicate direction, mutually orthogonal length, width, and height directions are defined. Furthermore, this definition of direction can also be appropriately applied to other figures in this embodiment and figures in other embodiments.

[0058] The optical module 100 includes a frame 110 and a wiring substrate 120.

[0059] The frame 110 includes a signal light output port 1a, a signal light input port 1b, a side wall portion 1c, a bottom plate portion 1d, a top cover portion 1e, and a terminal portion 1f. The side wall portion 1c is a frame-like member with four sides extending in the height, length, or width directions, each side being approximately orthogonal to the bottom plate portion 1d. The signal light output port 1a and the signal light input port 1b are located on the front side of the side wall portion 1c in the length direction. The signal light output port 1a is connected to an optical fiber for outputting signal light to the outside. The signal light input port 1b is connected to an optical fiber for inputting signal light from the outside. The bottom plate portion 1d is a plate-like member extending in both the length and width directions. The top cover portion 1e is a plate-like member opposing the bottom plate portion 1d and extending in both the length and width directions. The terminal portion 1f is located on the portion of the side wall portion 1c other than the front side in the length direction.

[0060] The base plate 1d is made of materials with high thermal conductivity, such as copper-tungsten (CuW), copper-molybdenum (CuMo), and alumina (Al2O3). Other parts of the frame 110 are made of materials with low coefficients of thermal expansion, such as Fe-Ni-Co alloy and alumina (Al2O3).

[0061] Figure 3 This schematic diagram illustrates the internal structure of the housing 110 of the optical module 100, viewed from above with the top cover 1e removed. As shown, the terminal portion 1f protrudes both inside and outside the housing 110. The terminal portion 1f comprises an insulating material, and wiring patterns including conductors are formed on its surface and inside.

[0062] Pin 1g is configured to be electrically connected to the wiring pattern of terminal portion 1f, and protrudes to the left or right side of each surface on the left and right sides of the terminal portion 1f constituting the outer peripheral surface of the frame 110 in the width direction. More specifically, pin 1g first extends upward along the surface extending in the height direction of terminal portion 1f, then bends midway and extends to the right or left side in the width direction. Pin 1g is a power-conducting pin.

[0063] Wiring pattern 1i, serving as an electrical terminal, is provided on the surface above the terminal portion 1f in the height direction of the outer peripheral surface of the frame 110. Wiring pattern 1i is formed, for example, by a metallization portion. Furthermore, pattern 1j is a pattern for bonding between the terminal portion 1f and the wiring substrate 120 caused by solder or the like, and is also formed, for example, by a metallization portion. Pattern 1j is provided on the left and right sides in the width direction, respectively, opposite to wiring pattern 1i. Pin 1g and wiring pattern 1i are electrically connected to the interior of the frame 110, and are electrically connected via the wiring substrate 120 to a controller located outside the frame 110 that controls the operation of the optical module 100. The controller is configured to include, for example, an IC (Integrated Circuit).

[0064] Furthermore, on each surface of the terminal portion 1f in the width direction (left and right sides) of the rear side in the front-rear direction, except for the pin 1g, the pin 1h protrudes upwards in the height direction. The pin 1h is a component constituting the positioning part and is normally not energized for the operation of the optical module 100. The pin 1h can also be connected to a ground pattern. If the pin 1h is connected to a ground pattern, it is possible to achieve shielding of high-frequency signals and to utilize impedance adjustment. For example, the pin 1h protrudes more than 10 μm from the wiring pattern 1i.

[0065] The optical module 100 internally houses, for example, the following components: a chip on submount 2, a lens 3, a wavelength lockout 4 serving as a wavelength detector, a photodiode (PD) array 5, a lens 6, an optical isolator 7, a beam splitter 8, a mirror 9, a lens 10, a modulator 11, a modulator driver 12, a terminator 13, lenses 14 and 15, a beam splitter 16, a polarizing beam combiner 17, monitor PDs 18 and 19, a beam splitter 20, and a monitor PD 21. Furthermore, the optical module 100 internally houses, for example, the following components: a lens 30, a coherent mixer 31, a mirror 32, a lens 33, a monitor PD 34, a balanced PD array 35, and a transimpedance amplifier (TIA) 36. Each PD is an example of a semiconductor light-receiving element, and the modulator 11 is an example of a semiconductor optical modulator.

[0066] In the optical module 100, these components are installed inside the housing 1 and hermetically sealed by the top cover 1e. Furthermore, these components, except for the modulator driver 12 and TIA36, are mounted on a substrate or temperature control element disposed inside the housing 1. The modulator driver 12 and TIA36 are mounted on the terminal section 1f.

[0067] The optical module 100 is configured as an optical transceiver that outputs output signal light from the signal light output port 1a, which serves as the light output unit, and inputs input optical signal light from the signal light input port 1b, which serves as the light input unit. The structure and function of each component will be described below.

[0068] (Light emitter)

[0069] First, the structure and function of the components that function as light emitters will be explained.

[0070] The secondary heat sink-on-chip 2, for example, includes a laser element 2a, which is a semiconductor laser element, and a secondary heat sink 2b on which the laser element 2a is mounted. The laser element 2a is, for example, a wavelength-variable laser element. The secondary heat sink 2b is made of a material with high thermal conductivity, which effectively dissipates the heat emitted by the laser element 2a to the substrate on which the secondary heat sink 2b is mounted. A semiconductor optical amplifier may also be integrated in the laser element 2a.

[0071] The laser element 2a is powered by the wiring pattern formed in the terminal portion 1f, and outputs a continuous wave (CW) linearly polarized laser L1 from the front end face located in the longitudinal direction forward. In addition, the laser element 2a outputs a wavelength-locked laser L2 from the rear end face to the longitudinal rear side.

[0072] Lens 3 focuses the laser L2 and inputs it to wavelength locker 4. Wavelength locker 4 is a known component, such as a planar lightwave circuit (PLC). Wavelength locker 4 branches the laser L2 into three beams, outputting one beam to PD array 5, and periodically changing the transmission characteristics of the other two beams relative to the wavelength, passing them through two filters with wavelength discrimination characteristics before outputting them to PD array 5. The two filters include, for example, a ring resonator and an etalon filter, and have different transmission wavelength characteristics.

[0073] The PD array 5 is configured with three PDs arranged in an array. Each of the three PDs in the PD array 5 receives one of the three lasers output from the wavelength lockout 4 and outputs a current signal corresponding to the intensity of the received light. Each current signal is sent to the controller through a wiring pattern formed at the terminal section 1f and is used for the detection and control of the wavelength of the laser L1.

[0074] The laser element 2a and the wavelength locker 4 are arranged along the length direction. Furthermore, the laser element 2a and the wavelength locker 4 are configured such that the output position of the laser L2 of the laser element 2a, which is input to the wavelength locker 4, is approximately the same as the input position of the laser L2 of the wavelength locker 4 in the width direction, and together they form a laser assembly LA.

[0075] On the other hand, lens 6 collimates the laser L1 and outputs it to optical isolator 7. Optical isolator 7 causes the laser L1 to pass through the beam splitter 8 side, blocking the passage of light traveling from the beam splitter 8 side. Thus, optical isolator 7 prevents reflected light and the like from entering the laser element 2a.

[0076] Beam splitter 8 branches the laser L1, which has passed through optical isolator 7, into lasers L11 and L12. Laser L11 travels to the right in the width direction, and laser L12 travels to the left in the width direction. Laser L12 will be described in detail later.

[0077] The reflector 9 reflects the laser L11 and changes its direction of travel to the rear of its length. The lens 10 focuses the laser L11 and inputs it into the modulator 11.

[0078] The modulator 11 is generally cuboid in shape, configured such that its length direction is approximately aligned with the length direction of the frame 1. The modulator 11 is a device for modulating laser L11 and generating modulated light. The modulator 11 is a known MZ (Mach-Zehnder) type phase modulator using, for example, InP (indium phosphorus) as the constituent material, driven by the modulator driver 12 and functioning as an IQ modulator. This phase modulator is identical to that disclosed, for example, in International Publication No. 2016 / 021163. The modulator driver 12 is configured to include, for example, an IC, and its operation is controlled by a controller. The modulator 11 and the modulator driver 12 are connected in series, approximately parallel to the length direction of the frame 1, forming the modulation section M. Furthermore, the terminator 13 electrically terminates the modulator 11 from which a high-frequency modulation signal is applied from the modulator driver 12.

[0079] Modulator 11 outputs linearly polarized light with mutually orthogonal polarization planes, and outputs IQ-modulated light L31 and L32 respectively. Here, modulator 11 has a folding structure that internally folds back the direction of travel of the input light. As a result, the input position of laser L11 and the output positions of modulated light L31 and L32 are located on the same side, in this embodiment, on the side located at the front of the modulator 11 in the longitudinal direction. Furthermore, the side located at the front of the modulator 11 in the longitudinal direction is substantially parallel to the side wall portion 1c at the front of the frame 1 in the longitudinal direction.

[0080] Lens 14 collimates the modulated light L31 and outputs it to beam splitter 16. Beam splitter 16 reflects most of the modulated light L31 toward polarizing beam combiner 17, transmits a portion, and outputs it to monitor PD18. Lens 15 collimates the modulated light L32 and outputs it to polarizing beam combiner 17. Polarizing beam combiner 17 polarizes and combines the modulated lights L31 and L32 to generate output signal light L4 including the modulated lights L31 and L32. In addition, polarizing beam combiner 17 outputs a portion of the modulated light L32 to monitor PD19.

[0081] Monitor PD18 receives a portion of the modulated light L31 input from beam splitter 16 and outputs a current signal corresponding to the intensity of the received light. This current signal is transmitted to the controller via a wiring pattern formed at terminal 1f and is used to monitor the intensity of the modulated light L31. Monitor PD19 receives a portion of the modulated light L32 input from polarizing beam combiner 17 and outputs a current signal corresponding to the intensity of the received light. This current signal is transmitted to the controller via a wiring pattern formed at terminal 1f and is used to monitor the intensity of the modulated light L32.

[0082] Beam splitter 20 transmits most of the output signal light L4, reflects a portion, and outputs it to monitor PD21. Monitor PD21 receives a portion of the output signal light L4 input from beam splitter 20 and outputs a current signal corresponding to the intensity of the received light. The current signal is sent to the controller through the wiring pattern formed at terminal 1f and is used to monitor the intensity of the output signal light L4.

[0083] The signal light output port 1a receives the output signal light L4 transmitted through the beam splitter 20 and outputs it to the outside of the frame 1.

[0084] (Optical receiver)

[0085] Next, the structure and function of the component that functions as an optical receiver will be explained.

[0086] The signal light input port 1b receives the input signal light L5 from the outside and outputs it to the lens 30. The input signal light L5 travels from the front to the rear along the length direction within the frame 1. The lens 30 focuses the input signal light L5 and outputs it to the coherent mixer 31.

[0087] On the other hand, the reflector 32 reflects the laser L12, which is branched by the beam splitter 8, changing its direction of travel from the left side in the width direction to the rear side in the length direction. The laser L12 is focused by the lens 33 and input as local light into the coherent mixer 31.

[0088] The coherent mixer 31 is approximately cuboid in shape and is configured such that its length direction is approximately aligned with the length direction of the frame 1. The input position of the input signal light L5 and the input position of the laser L12 are located on the same side of the coherent mixer 31, specifically on the side facing forward along its length in this embodiment. Furthermore, the side of the coherent mixer 31 where the input signal light L5 is input is approximately parallel to the side wall portion 1c facing forward along the length direction of the frame 1, and the side of the modulator 11 where the input position of the laser L11 is located is approximately parallel to the side where the output positions of the modulated lights L31 and L32 are located.

[0089] The coherent mixer 31 processes the input laser light L12 (as local light) and the input signal light L5 by interference to generate a processed signal light, which is then output to the balanced PD array 35. The processed signal light consists of four beams: Ix (corresponding to the I component of the X-polarized wave), Qx (corresponding to the Q component of the X-polarized wave), Iy (corresponding to the I component of the Y-polarized wave), and Qy (corresponding to the Q component of the Y-polarized wave). The coherent mixer 31 is a known device, including, for example, a PLC. Furthermore, the coherent mixer 31 is configured to branch a portion of the input signal light L5 and output it to the monitor PD 34. The monitor PD 34 receives a portion of the input signal light L5 and outputs a current signal corresponding to the intensity of the received light. This current signal is transmitted to the controller via a wiring pattern formed at the terminal portion 1f and used for intensity monitoring of the input signal light L5.

[0090] The balanced PD array 35, as an optoelectronic element, has four balanced PDs, each receiving four processed signal lights and converting them into current signals for output to the TIA 36. The TIA 36 has four TIAs, whose operation is controlled by a controller. Each TIA in the TIA 36 converts the current signals input from each of the four balanced PDs into voltage signals and outputs them. The output voltage signals are transmitted to the controller or a higher-level control device via a wiring pattern formed at the terminal section 1f, and are used for demodulation of the input signal light L5.

[0091] The coherent mixer 31, the balanced PD array 35, and the TIA 36 are connected in series in a manner that is approximately parallel to the length of the housing 1, forming the optical processing unit OP.

[0092] In this optical module 100, the laser element 2a and the wavelength locker 4 are arranged in the width direction of the frame 1 between the width direction center line CL1 of the coherent mixer 31 and the width direction center line CL2 of the modulator 11. Furthermore, the arrangement between the width direction center lines CL1 and CL2 also includes a configuration where each center line is positioned between extensions extending to the outer side of the length direction of the coherent mixer 31 or the modulator 11. Additionally, the modulator 11 has a folding structure where the direction of travel of the input light is internally folded back. Furthermore, the optical module 100 is configured such that the optical axes of the two input signal lights L5 and the laser L2 intersect.

[0093] Furthermore, the laser element 2a and the wavelength locker 4 are connected in series, approximately parallel to the length direction of the frame 1, and the output position of the laser L3 input to the wavelength locker 4 in the laser element 2a is configured such that the input position of the laser L2 in the wavelength locker 4 is approximately the same as the input position of the laser L2 in the wavelength locker 4 in the width direction of the frame 1. Additionally, the laser assembly LA, the modulation unit M, and the light processing unit OP are arranged side-by-side in the width direction of the frame 1. Furthermore, the input position of the laser L11 of the modulator 11 and the output positions of the modulated lights L31 and L32 are located on the same side. This side is approximately parallel to the side on which the input signal light L5 of the coherent mixer 31 is input. Both sides are also approximately parallel to the front sidewall portion 1c of the frame 1 in the length direction.

[0094] Here, the laser element 2a, PD array 5, modulator 11, monitors PD18, 19, 21, 34, and balanced PD array 35 are examples of optical elements that function through electrical connection. The modulator driver 12 and TIA 36 are examples of electronic elements that function through electrical connection.

[0095] Modulator 11, modulator driver 12, balanced PD array 35, and TIA 36 supply or output high-frequency signals, and are therefore directly or indirectly electrically connected to the outside via wiring pattern 1i. Additionally, bias voltages for these components are sometimes electrically connected to the outside via pin 1g. Other optical components are also electrically connected to the outside via pin 1g. The frequency of the high-frequency signal is, for example, 10 GHz or higher.

[0096] (Structure of the wiring substrate)

[0097] Return to Figure 1 The wiring substrate 120 is electrically connected to the wiring pattern 1i from the outside of the frame 110. The wiring substrate 120 is, for example, a flexible substrate, configured to include, for example, polyimide, liquid crystal polymer, or polytetrafluoroethylene resin as the main material. The wiring substrate is not limited to a flexible substrate and can also be a rigid substrate.

[0098] like Figure 2 As shown, positioning holes 121 constituting the side positioning portion of the wiring substrate are formed on the front side in the length direction and on the left and right sides in the width direction of the wiring substrate 120. Figure 4 This is a schematic diagram showing a partial cross-section of an optical module. Figure 4 This represents a portion of a cross-section cut along a surface perpendicular to the length direction, including the pin 1h and the positioning hole 121 of the wiring substrate 120. (Example) Figure 2 As shown, a wiring pattern 122, serving as an electrical wiring, is formed on the lower side of the wiring substrate 120 in the height direction (hereinafter, sometimes referred to as the back side), at a position corresponding to the wiring pattern 1i. The wiring pattern 1i and the wiring pattern 122 are connected by a conductive bonding material such as solder. The wiring pattern 122 is, for example, a coplanar line, a microstrip line, or a ground plane.

[0099] In the wiring board 120, in addition to single lines, differential lines are also considered as signal lines for transmitting high-frequency signals. Multiple transmission lines can also be arranged in an array. Furthermore, organic sheets can be thermally bonded to the signal lines, or organic sheets can be bonded with resin, or a resin coating can be applied to form ground planes on the upper surface of the organic sheet or resin coating. Through-holes are formed between the ground planes on two or three sides with a narrow spacing of 0.03 to 5 mm.

[0100] The wiring substrate 120 may also have a resin coating applied to its entire surface, except for the conductive pads provided at the substrate end further away from the bonding portion with the terminal portion 1f. Furthermore, the wiring substrate 120 may also have a resin coating applied to the substrate end further away from the bonding portion with the terminal portion 1f, i.e. Figure 1 Angle R machining is performed on the rear end of the substrate along the length direction.

[0101] When positioning the wiring substrate 120 on the frame 110, the relative positions of the wiring pattern 1i and its corresponding wiring pattern 122 are determined by inserting the pins 1h on the frame 110 side into the positioning holes 121 of the wiring substrate 120. As a result, the wiring pattern 1i and its corresponding wiring pattern 122 are correctly and easily positioned. Additionally, the pins 1h can also be electrically connected to the ground pattern of the wiring substrate 120.

[0102] Modulator 11, modulator driver 12, balanced PD array 35 and TIA 36 are electrically connected to the outside via wiring pattern 1i, wiring pattern 122 and wiring substrate 120, so as to supply or output high frequency signals with a more appropriate design for high frequency impedance, etc.

[0103] As explained above, in the optical module 100 according to Embodiment 1, the wiring pattern 1i of the frame 110 and the wiring pattern 122 of the wiring substrate 120 can be positioned with high precision through the pin 1h of the frame 110 and the positioning hole 121 of the wiring substrate 120.

[0104] like Figure 5 As shown, this pin 1h can be easily formed by mounting it on one surface of the terminal portion 1f in the same manner as pin 1g. Generally, pin 1g is positioned and set with high precision, thus achieving the same high positional accuracy with respect to pin 1h. Furthermore, pin 1g is subsequently bent together with pin 1g.

[0105] Furthermore, regarding the specifications for micro-coherent devices based on recent OIF (Optical Internetworking Forum) standards (e.g., OIF-DPC-MRX-02.0: Micro Intradyne Coherent Receiver, OIF-HB-CDM-01.0: High Bandwidth Coherent Driver Modulator), there are descriptions concerning the use of high-frequency signals and flexible substrates for high-frequency signal wiring. The optical module 100 according to Embodiment 1, or the optical modules according to other embodiments described below, can provide optical modules suitable for these specifications.

[0106] (Implementation Method 2)

[0107] Figure 6 This is a schematic diagram showing the appearance of the optical module involved in Embodiment 2. Figure 7 To indicate that Figure 6 The diagram shows a portion of the optical module in a disassembled state. The optical module 100A includes a frame 110A and a wiring substrate 120A.

[0108] The frame 110A is a structure in embodiment 110 where pin 1h is removed and a metallized pattern 1hA is added. Other common structures between frame 110A and frame 110 are omitted from the description. Frame 110A houses optical and electronic components that are the same as those in frame 110.

[0109] The metallized pattern 1hA is located on the surface of the terminal portion 1f on the outer peripheral surface of the frame 110A, above the terminal portion 1f in the height direction. On the same surface as the wiring pattern 1i, it is convex on the left and right sides in the width direction relative to the wiring pattern 1i. The metallized pattern 1hA protrudes, for example, by more than 10 μm in the height direction relative to the wiring pattern 1i. The metallized pattern 1hA constitutes a positioning part and is normally not energized for the operation of the optical module 100A. The metallized pattern 1hA can also be connected to a grounding pattern.

[0110] In Embodiment 1, the wiring substrate 120A includes a structure in which the positioning hole 121 is replaced with a positioning hole 121A constituting a positioning portion on the wiring substrate side. Other common structures of the wiring substrate 120A and the wiring substrate 120 are omitted from description.

[0111] When positioning the wiring substrate 120 on the frame 110A, the relative positions of the wiring pattern 1i and the corresponding wiring pattern 122 on the wiring substrate 120A are determined by inserting the metallized pattern 1hA on the frame 110A side into the positioning holes 121A on the wiring substrate 120A. As a result, the wiring pattern 1i and the corresponding wiring pattern 122 are correctly and easily positioned. Furthermore, the metallized pattern 1hA can also be electrically connected to the ground pattern on the wiring substrate 120A.

[0112] As explained above, in the optical module 100A according to Embodiment 2, the wiring pattern 1i of the frame 110A and the wiring pattern 122 of the wiring substrate 120A can be positioned with high precision through the metallization pattern 1hA of the frame 110A and the positioning hole 121A of the wiring substrate 120A.

[0113] This metallization pattern 1hA can be easily formed simultaneously with, for example, wiring pattern 1i. Thus, with respect to the metallization pattern 1hA, the same high positional accuracy as the wiring pattern 1i is obtained.

[0114] Alternatively, the metallized pattern 1hA protrudes relative to the wiring pattern 1i, but the metallized pattern can also be made concave to replace this. In this case, the metallized pattern is recessed in the height direction relative to the wiring pattern 1i by, for example, 10 μm or more. Furthermore, positioning protrusions are provided on the wiring substrate instead of positioning holes 121A. By inserting the positioning protrusions into each metallized pattern, the relative position of the wiring pattern 1i and its corresponding wiring pattern 122 can be determined, and positioning can be performed correctly and easily.

[0115] (Implementation Method 3)

[0116] Figure 8 This is a schematic diagram showing the appearance of the optical module involved in Embodiment 3. Figure 9 To express [the opinion / towards] Figure 8 This is a schematic diagram showing a portion of the optical module disassembled. The optical module 100B includes a frame 110B and a wiring substrate 120B.

[0117] In the housing 110 of Embodiment 1, housing 110B has a structure in which pin 1h is removed and terminal portion 1f is replaced with terminal portion 1fB. Other than this, common structures between housing 110A and housing 110 are omitted from description. Housing 110B houses optical and electronic components similar to those in housing 110.

[0118] like Figure 8 , 9 As shown, the terminal portion 1fB has a convex portion 1kB that protrudes approximately equally wide on the rear side in the front-rear direction. The width of the portion in the terminal portion 1fB where the pin 1g is formed is width W, but the width of the convex portion 1kB is width W1, which is narrower than width W. The convex portion 1kB is an example of a positioning portion structure formed by a part of the outer shape of the frame 110B.

[0119] In the wiring substrate 120 of Embodiment 1, the wiring substrate 120B has a structure that includes a removal positioning hole 121 and a convex portion 121B that protrudes with approximately equal width on the rear side in the front-rear direction. The convex portion 121B constitutes a wiring substrate-side positioning portion. Other common structures of the wiring substrate 120 and the wiring substrate 120 are omitted from description. Regarding the width of the wiring substrate 120B, the width of the convex portion 121B is width W3, but the width of other portions is width W2, which is longer than width W3.

[0120] Here, the width W1 of the convex portion 1kB of the terminal portion 1fB of the frame 110B is approximately the same as the width W3 of the convex portion 121B of the wiring substrate 120B. Therefore, when positioning the wiring substrate 120B relative to the frame 110B, the relative positions of the wiring pattern 1i and the corresponding wiring pattern 122 of the wiring substrate 120B are determined by matching the ends of the convex portion 1kB in the width direction with respect to the convex portion 1kB. As a result, the wiring pattern 1i and the corresponding wiring pattern 122 are positioned correctly and easily.

[0121] As explained above, in the optical module 100B according to Embodiment 3, the wiring pattern 1i of the frame 110B and the wiring pattern 122 of the wiring substrate 120B can be positioned with high precision by means of the convex shape portion 1kB of the frame 110B and the convex shape portion 121B of the wiring substrate 120B.

[0122] Figure 10 is a schematic diagram illustrating the mounting method of the wiring substrate in the manufacturing method of the optical module 100B. In the mounting method shown in Figure 10, as... Figure 10A As shown, heaters H1 and H2 are prepared. Heater H1 is a preheating heater, having a recess with an inner width approximately the same as the width W1 of the convex portion 1kB and the width W3 of the convex portion 121B. Heater H2 is a heating heater, having a convex portion with a width approximately the same as the width W1 of the convex portion 1kB and the width W3 of the convex portion 121B, and capable of being inserted into the recess of heater H1.

[0123] Next, as Figure 10B As shown, convex portions 1kB and 121B are inserted into the recess of heater H1 and superimposed to form convex portion 121B as the heater H1 side. At this time, a bonding material is present between wiring pattern 1i and wiring pattern 122. The relative positions of wiring pattern 1i of convex portion 1kB and wiring pattern 122 of convex portion 121B are determined and positioned. In this state, convex portions 1kB and 121B are preheated by heater H1.

[0124] Next, as Figure 10C As shown, the heater H2 is pressed from the convex part 1kB and is then heated by the heater H2. As a result, the convex part 1kB and the convex part 121B are joined together, and the wiring pattern 1i is electrically connected to the wiring pattern 122 of the convex part 121B.

[0125] (Other implementation methods)

[0126] Figure 11 This is a schematic diagram illustrating other embodiments. Figure 11 In the illustrated embodiment, the terminal portion 1fC has a countersunk hole-shaped portion 1nC. The countersunk hole-shaped portion 1nC is an example of a countersunk hole-shaped portion that is part of the outer shape of the frame. The depth h1 of the countersunk hole-shaped portion 1nC is approximately the same as the thickness t1 of the wiring substrate 120. Furthermore, the bonding support member 1m is bonded to the surface of the wiring substrate 120 using a resin adhesive. The bonding support member 1m is bonded to the terminal portion 1fC, which constitutes part of the outer surface of the frame, using a resin adhesive. The resin adhesive is, for example, a resin adhesive including epoxy resin, acrylic resin, silicone resin, or rubber-based resin. The wiring substrate 120 is disposed between the bonding support member 1m and the countersunk hole-shaped portion 1cC, and the pin 1h is inserted into the positioning hole 121.

[0127] exist Figure 11In the illustrated embodiment, positioning can be performed more accurately and simply using the countersunk hole shape 1nC, the pin 1h, and the positioning hole 121. Furthermore, the connection between the terminal portion 1fC and the wiring board 120 can be enhanced by joining the support member 1m and the countersunk hole shape 1nC.

[0128] Figure 12 The diagram is provided to further illustrate other embodiments. Figure 12 The illustrated embodiment has the following features: Figure 11 In the embodiment shown, the wiring substrate 120 is replaced with a wiring substrate 120D.

[0129] The wiring substrate 120D has a positioning hole 121D and a countersunk hole shaped portion 123D. The wiring substrate 120D forms a main body portion with a thickness t2 and a portion 124D with a thickness t1 that is thinner than the main body portion through the countersunk hole shaped portion 123D. The portion 124D with a thickness t1 is disposed between the bonding support member 1m and the wiring substrate 120D. The countersunk hole shaped portion 1nC engages with the countersunk hole shaped portion 123D.

[0130] exist Figure 12 In the illustrated embodiment, positioning can be performed more accurately and simply using the countersunk hole shapes 1nC, 123D, pins 1h, and positioning holes 121. Furthermore, the connection between the support member 1m and the countersunk hole shape 1nC and the wiring substrate 120D is enhanced by joining the terminal portion 1fC and the mounting plate 120D.

[0131] Figure 13 This is a schematic diagram illustrating another embodiment. The optical module 100E provides protrusions or rod-shaped portions 128 to a bonding support member 126 bonded to the wiring substrate 120 using a resin adhesive or the like, and engages with a terminal portion 1fE. Multiple protrusions or rod-shaped portions 128 are formed on the end face facing the terminal portion 1fE of the bonding support member 126. On the other hand, grooves, recesses, or holes 130 are also formed at corresponding positions on the end face of the terminal portion 1fE. By configuring the protrusions or rod-shaped portions 128 of the bonding support member 126 to be embedded in the grooves, recesses, or holes 130 of the terminal portion 1fE, the bonding strength can be improved. In this case, the protrusions or rod-shaped portions 128 and the holes 130, together with the pin 1h and the positioning hole 121, constitute a positioning portion. This makes alignment easier and prevents electrical characteristic degradation caused by positional misalignment. Alternatively, the protrusion or rod-shaped portion 128 can be inserted into the slot, recess, or hole-shaped cavity portion 130, and the two can be joined together by resin adhesive or solder. As described above, the bonding strength can be further improved. Furthermore, in the example shown in the figure, the wiring substrate 120 is shown to be shorter than the bonding support member 126, but the wiring substrate 120 may also be longer than the bonding support member 126.

[0132] Furthermore, in the described embodiment, the joint between the wiring substrate and the outer surface of the frame (e.g., the surface of the terminal portion) can also be covered by a resin coating material that is applied in contact with both a portion of the wiring substrate and a portion of the outer surface of the frame. Applying this resin coating material improves the bonding strength between the wiring substrate and the frame and protects the joint. This resin coating material typically has a Young's modulus of 20 GPa or less, and a thickness of 10 μm or more. Epoxy resin, silicone resin, acrylic resin, and rubber-based resin can be used as the resin coating material.

[0133] Furthermore, in this embodiment, the optical module, such as optical module 100, can employ components that are longer in the length direction than in the width direction in all components, including laser element 2a, wavelength locker 4, modulator 11, and coherent mixer 31. Moreover, by arranging them side-by-side, the width W of the housing 110 can be set to 15 mm or less in the width direction. Furthermore, the length of optical module 100 from the rear of the housing in the length direction to the optical reference plane where it abuts the end face of the optical fiber used for inputting and outputting optical signals can be set to 35 mm or less, and the height can be set to 6.5 mm or less. As a preferred example, the width is approximately 14 mm, the length is approximately 31.5 mm, and the height is approximately 4 mm. Thus, an optical transceiver conforming to the QSFP-DD standard, which is the next-generation standard in MSA, can be realized.

[0134] Furthermore, as with the optical transceiver in Patent Document 1, when components are housed in a separate housing, it is difficult to reduce the width of the optical transceiver to less than 15mm, even if these components are housed in a single housing to form an optical transceiver. For example, in the CFP2-ACO standard, the width of uITLA (Micro Integrated Tunable Laser Assembly), which serves as the light source mounted on the optical transceiver, is approximately 20mm; the width of HBPMQ (High Bandwidth Integrated Polarization Multiplexed Quadrature Modulators), which serves as the modulator, is approximately 12.5mm; and the width of uICR (Micro Intradyne Coherent Receivers), which serves as the receiver, is approximately 12.5mm. Even if these components are housed in a single housing to form an optical transceiver, it is difficult to reduce the width of the optical transceiver to less than 15mm.

[0135] Furthermore, the invention is not limited to the embodiments described herein. Cases where the various constituent elements are appropriately combined are also included in the invention. Moreover, further effects and modifications can be readily derived by those skilled in the art. Therefore, the invention is not limited to the embodiments described above, and various modifications are possible.

[0136] Industrial availability

[0137] This invention can be applied to optical modules and their manufacturing methods.

[0138] Symbol Explanation

[0139] 1. Frame

[0140] 1a Signal optical output port

[0141] 1b Signal optical input port

[0142] 1c Side wall portion

[0143] 1cC, 1nC Counterboring Shape

[0144] 1d base plate

[0145] 1e Upper cover

[0146] Terminal sections 1f, 1fB, 1fC, 1fE

[0147] 1g, 1h pins

[0148] 1hA Metallized Pattern

[0149] 1i, 122 wiring patterns

[0150] 1j pattern

[0151] 1kB convex part

[0152] 1m joint support component

[0153] Chip mounting on heat sink 2 times

[0154] 2a Laser element

[0155] 2b Secondary heat sink

[0156] Lenses 3, 6, 10, 14, 15, 30, and 33

[0157] 4 Wavelength locker

[0158] 5 PD array

[0159] 7 Optical Isolators

[0160] 8, 16, 20 beam splitters

[0161] 9.32 Reflectors

[0162] 11 Modulator

[0163] 12 Modulator Driver

[0164] 13 Terminals

[0165] 17. Polarizing Beam Combiner

[0166] 18, 19, 21, 34 monitor PD

[0167] 31 Coherent Mixer

[0168] 35 Balanced PD Array

[0169] 36. Transimpedance Amplifier (TIA)

[0170] 100, 100A, 100B, 100E optical modules

[0171] Frames of 110, 110A, and 110B

[0172] 120, 120A, 120B, 120D wiring boards

[0173] Positioning holes 121, 121A, 121D

[0174] 121B Convex part

[0175] 123D Counterboring Shape

[0176] 124D section

[0177] 126 Joint support member

[0178] 128 rod-shaped portion

[0179] 130 Hollow Section

[0180] CL1 and CL2 centerlines in the width direction

[0181] H1, H2 heaters

[0182] L1, L2, L3, L11, L12 lasers

[0183] L31, L32 Modulated Light

[0184] L4 output signal light

[0185] L5 Input Signal Light

[0186] LA laser assembly

[0187] M modulation section

[0188] OP Light Processing Department

[0189] h1 depth

[0190] Thicknesses t1 and t2

[0191] W, W1, W2, W3 widths.

Claims

1. An optical module comprising: an optical element; a housing that houses the optical element inside; an electrical terminal provided to an outer peripheral surface of the housing and electrically connected to the inside of the housing; a positioning portion that determines a relative position of a wiring board electrically connected to the electrical terminal from the outside of the housing; and a pin for energization provided to protrude from the outer peripheral surface of the housing in a width direction, wherein the positioning portion includes a positioning pin provided to protrude from the outer peripheral surface of the housing in a height direction in the width direction, and the positioning pin is provided with positional adjustment at the same positional accuracy as the pin for energization.

2. The optical module according to claim 1, wherein the positioning portion includes a pin that is not energized.

3. The optical module according to claim 1, wherein the positioning portion is connected to a ground.

4. The optical module according to claim 3, wherein the positioning portion is connected to a ground of the wiring board.

5. The optical module according to any one of claims 1 to 4, wherein the optical module includes a wiring board electrically connected to the electrical terminal from the outside of the housing, and the wiring board has a wiring board-side positioning portion corresponding to the positioning portion.

6. The optical module according to claim 5, wherein the wiring board is a flexible board.

7. The optical module according to claim 5, wherein the wiring board is configured to include polyimide or liquid crystal polymer or polytetrafluoroethylene resin.

8. The optical module according to claim 5, wherein an electrical wiring formed in the wiring board is a coplanar line, a microstrip line, or a coplanar line with a ground plane.

9. The optical module according to claim 8, wherein a sheet made of an organic substance is thermally bonded to a signal line of the wiring board, or an organic substance sheet is bonded with a resin, or a resin coating is applied, a ground plane is formed on an upper surface of the organic substance sheet or the resin coating, and a through-hole for energization is formed at a narrow pitch of 0.03 to 5 mm between the ground planes of two or three surfaces.

10. The optical module according to claim 5, wherein the wiring board is applied with a resin coating on all surfaces except for an energization pad provided at a board end farther from a joint with an outer surface of the housing.

11. The optical module according to claim 5, wherein the wiring board is subjected to R-angle processing at a board end farther from a joint with an outer surface of the housing.

12. The optical module according to claim 5, wherein a joint of the wiring board with an outer surface of the housing is covered with a resin coating material provided in contact with both a part of the wiring board and a part of the outer surface of the housing.

13. The optical module according to claim 12, wherein a Young's modulus of the resin coating material is 20 GPa or less.

14. The optical module according to claim 12 or 13, wherein a thickness of the resin coating material is 10 μm or more.

15. The optical module according to claim 5, wherein ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ An engagement support member is connected to the surface or back surface of the wiring substrate, and the engagement support member is engaged with a portion of the outer surface of the frame body by a resin adhesive.

16. The optical module according to claim 5, wherein An engagement support member having a protrusion or a rod-shaped portion is connected to the surface or back surface of the wiring substrate, and the protrusion or rod-shaped portion of the engagement support member is engaged with a groove, a pit, or a hole-shaped hollow portion formed in the frame body.

17. The optical module according to claim 16, wherein The protrusion or rod-shaped portion of the engagement support member is inserted into the groove, pit, or hole-shaped hollow portion formed in the frame body, and is engaged by a resin adhesive or solder.

18. The optical module according to claim 15 or 17, wherein The resin adhesive is a resin adhesive including an epoxy resin, an acrylic resin, a silicone resin, or a rubber-based resin.

19. The optical module according to any one of claims 1 to 4, wherein The optical element includes a semiconductor laser element, a semiconductor light-receiving element, a semiconductor optical modulator, or a semiconductor optical amplifier.

20. A method for manufacturing an optical module, In an optical module provided with an optical element, a frame body that houses the optical element inside, an electrical terminal provided on the outer circumferential surface of the frame body and electrically connected to the inside of the frame body, and a power feeding pin provided so as to protrude from the outer circumferential surface in the width direction of the frame body, when a wiring substrate is electrically connected to the electrical terminal from the outside of the frame body, the relative position of the wiring substrate to the electrical terminal is determined by a positioning portion of the frame body and a wiring substrate-side positioning portion of the wiring substrate, the positioning portion includes a positioning pin provided so as to protrude in the height direction from the outer circumferential surface in the width direction of the frame body, the positioning pin is provided so as to be positionally adjusted with the same positional accuracy as the power feeding pin.

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