An ultrasound assisted positioning device
By integrating a micro-ultrasound sensor array and a scalp-side sensing ring at the tip of the microneedle, the problem of positioning the brain microneedle implantation was solved by utilizing the reflection and transmission characteristics of ultrasound, thus achieving precise assisted positioning and real-time navigation.
Patent Information
- Application Number
- CN202210772993.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-30
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2042-06-30
AI Technical Summary
Existing technologies cannot effectively assist in the implantation and positioning of brain microneedles, and ultrasound positioning methods have failed to meet clinical needs.
A micro-ultrasound sensor array is integrated into the front end of the microneedle, and the sensing ring is placed on the outer side of the scalp. By emitting and receiving ultrasonic signals, combined with the imaging system to assist in positioning, the implantation position of the microneedle is determined by fitting the reflection and transmission characteristics of ultrasonic waves.
It achieves precise implantation and positioning of microneedles in the brain, improving the accuracy and reliability of implantation and providing real-time image-assisted navigation.
Smart Images

Figure CN115005946B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of brain microneedle implantation positioning, and in particular, to an ultrasound-assisted positioning device. Background Art
[0002] At present, the ultrasound positioning method can only achieve auxiliary positioning of a certain part of the body. There is no invention to assist in positioning microneedle implantation in the brain, and it cannot meet the needs of clinical brain diseases.
[0003] Ultrasound waves, which are above the human hearing threshold, have strong penetrating power in liquids and solids and possess excellent directionality. When they encounter a medium, they experience significant reflection, refraction, and scattering. Due to differences in acoustic impedance, the reflected and transmitted signals differ when ultrasound waves pass through the medium. Leveraging these reflection and transmission characteristics, we have developed a method and device for ultrasound-assisted microneedle implantation in the brain. Summary of the Invention
[0004] The present invention aims to provide an ultrasound-assisted positioning device for microneedle implantation in the brain. Micro-ultrasonic sensors are distributed on the outer side of a circle of scalp in the brain as receiving / transmitting units. In the middle, there is a micro-ultrasonic sensor array attached to the microneedles inserted into the brain as a signal transmitting / receiving unit. It can realize signal transmission and reception and assist in the positioning of microneedle implantation in the brain.
[0005] According to the first aspect of the present invention, an embodiment of the present application provides an ultrasound-assisted positioning device, comprising at least one micro-ultrasonic sensor array integrated at the front end of a microneedle and a plurality of micro-ultrasonic sensor chips distributed circumferentially and relatively forming an induction ring, the induction ring being sleeved on the outside of the scalp. During the microneedle implantation process, ultrasonic waves are emitted by the micro-ultrasonic sensor array, and the induction ring can receive the ultrasonic waves emitted by the microneedle and fit to determine the implantation position of the microneedle.
[0006] Preferably, the micro-ultrasonic sensor chip is composed of a single or multiple micro-ultrasonic sensor unit arrays, and the number of the micro-ultrasonic sensor chips is at least three.
[0007] Preferably, the multiple micro ultrasonic sensor chips on the induction ring are in the same plane and are evenly distributed.
[0008] Preferably, the multiple micro ultrasonic sensor chips on the induction ring are located in multiple planes, and each plane includes at least three micro ultrasonic sensor chips.
[0009] Preferably, there is a height difference between the target implantation depth of the microneedle and the sleeve position of the induction ring, so that there is always a displacement difference between the micro-ultrasonic sensor array on the microneedle and each micro-ultrasonic sensor chip on the induction ring.
[0010] Preferably, an imaging system is further included, and the imaging system is electrically connected to each of the micro-ultrasonic sensor chips on the induction ring.
[0011] Preferably, the imaging system includes a display screen for displaying real-time images to assist in navigation of microneedle implantation in the brain.
[0012] Preferably, the ultrasonic propagation direction of the micro ultrasonic sensor array on the microneedle is consistent with the axial direction of the microneedle.
[0013] According to a second aspect of the present invention, an embodiment of the present application provides an ultrasound-assisted positioning method, comprising:
[0014] An induction loop is placed on the outside of the scalp of the brain to emit ultrasonic signals, and a spatial coordinate system is established based on the induction loop to fit the spatial model of the brain;
[0015] When an ultrasonic signal emitted by the micro-ultrasonic sensor array on the microneedle is detected, the identification information of each micro-ultrasonic sensor chip on the induction ring is associated and bound with the detected signal data; the identification information includes the number of the micro-ultrasonic sensor within the ring and the relative position within the ring;
[0016] The position of the microneedle in the spatial model is fitted according to the detected signal data and displayed.
[0017] Preferably, after detecting the ultrasonic signal emitted by the micro-ultrasonic sensor array on the microneedle, the method further includes identifying the type of the ultrasonic signal, specifically including:
[0018] The parameters of the ultrasonic signal emitted by the micro-ultrasonic sensor array on the microneedle are obtained, compared with the detected signal data, and the emission signal and the projection signal of the ultrasonic signal are identified.
[0019] The beneficial effects of the present invention are:
[0020] This invention is an ultrasound-assisted positioning device that utilizes the transmission and projection properties of ultrasound waves across a medium to assist in locating microneedles implanted in the brain. A micro-ultrasonic sensor array is integrated into the microneedle to transmit ultrasonic signals, and an induction loop is placed outside the cerebral cortex to receive the signals. This ring of micro-ultrasonic sensors collects the signals, allowing for more accurate fitting and determination of the microneedle's implanted position.
[0021] The micro-ultrasonic sensor array on the microneedle is used to analogize the entity of the microneedle. The distribution direction of the array is the same as that of the microneedle, and it can effectively fit and feedback the real data.
[0022] By performing double fitting of the reflected signal and the transmitted signal, the implantation position of the microneedle can be determined more accurately. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0024] Figure 1 A flowchart of an ultrasound-assisted positioning method provided in an embodiment of the present application;
[0025] Figure 2 A front view of an ultrasound-assisted positioning device provided in an embodiment of the present application;
[0026] Figure 3 This is a structural diagram of an ultrasound-assisted positioning device provided in an embodiment of the present application. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.
[0028] In the following introduction, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The following introduction provides multiple embodiments of the present application. Different embodiments can be replaced or combined, so the present application can also be considered to include all possible combinations of the same and / or different embodiments described. Therefore, if one embodiment includes features A, B, and C, and another embodiment includes features B and D, then the present application should also be considered to include embodiments containing one or more of all other possible combinations of A, B, C, and D, even though the embodiment may not be clearly described in the following text.
[0029] The following description provides examples and does not limit the scope, applicability, or examples set forth in the claims. Changes may be made to the function and arrangement of the elements described without departing from the scope of the present application. Various examples may appropriately omit, replace, or add various processes or components. For example, the described method may be performed in an order different from the order described, and various steps may be added, omitted, or combined. In addition, features described in some examples may be combined in other examples. Example
[0030] See also Figure 2 、 Figure 3An ultrasound-assisted positioning device provided in an embodiment of the present application mainly includes at least one micro-ultrasonic sensor array integrated at the front end of a microneedle and a plurality of micro-ultrasonic sensor chips distributed circumferentially and relatively forming an induction ring. The induction ring is sleeved on the outside of the scalp. During the microneedle implantation process, ultrasonic waves are emitted by the micro-ultrasonic sensor array. The induction ring can receive the ultrasonic waves emitted by the microneedle and fit to determine the implantation position of the microneedle.
[0031] The system also includes an imaging system, which is electrically connected to each micro-ultrasound sensor chip on the induction loop to capture the detected signal data. The imaging system includes a display screen to display real-time images and assist in locating the microneedle implant in the brain.
[0032] In the embodiments of the present application, the micro-ultrasonic sensor chip is composed of a single or multiple micro-ultrasonic sensor unit arrays. The number of units is determined by the imaging distance and resolution and can be customized according to actual needs. It is understood that the number of micro-ultrasonic sensor chips on the induction loop is at least three.
[0033] As an embodiment, the multiple micro ultrasonic sensor chips on the induction ring are distributed in the same plane to facilitate positioning and fitting.
[0034] As another embodiment, the multiple micro ultrasonic sensor chips on the induction loop are located in multiple planes, and each plane includes at least three micro ultrasonic sensor chips. The multi-layer distribution structure can collect more accurate signals.
[0035] It is understandable that there may be a height difference between the implantation depth of the microneedle and the sleeve position of the sensing ring, so that there is always a displacement difference between the micro-ultrasonic sensor array on the microneedle and each micro-ultrasonic sensor chip on the sensing ring, which is conducive to the position fitting and determination of the microneedle.
[0036] In the embodiment of the present application, the ultrasonic propagation direction of the micro ultrasonic sensor array integrated at the front end of the microneedle is consistent with the axial direction of the microneedle, which can effectively map and feedback the actual position and posture of the microneedle.
[0037] In a specific embodiment, multiple micro-ultrasonic sensor chips are first placed in a circle around the periphery of the brain to form an induction loop, which is used to receive / transmit ultrasonic signals. The micro-ultrasonic sensor array integrated on the front end of the microneedle implanted in the brain is then triggered to transmit / receive ultrasonic waves in all directions. During the propagation process, part of the ultrasonic wave is reflected back, while the other part passes through the tissue and reaches the transducer array on the other side. Therefore, the micro-ultrasonic sensor at the receiving end (induction loop) has both reflected signals and transmitted signals. The micro-ultrasonic sensor at the receiving end performs image processing through an external imaging system and displays the image. The displayed image can be used to determine the position and assist in positioning the microneedle implant in the brain. Example
[0038] See also Figure 1 , the present application provides an ultrasound-assisted positioning method, comprising:
[0039] S101. Place an induction loop on the outside of the scalp of the brain, emit ultrasonic signals, and establish a spatial coordinate system based on the induction loop to fit the spatial model of the brain.
[0040] The brain can be "imaged" through the ultrasonic sensor chip carried by the induction ring itself, and a spatial coordinate system can be established based on the position of the induction ring. The spatial model of the brain can be fitted in the spatial coordinate system to facilitate the subsequent digitization of microneedle position information.
[0041] S102 : When an ultrasonic signal emitted by the micro ultrasonic sensor array on the microneedle is detected, the identification information of each micro ultrasonic sensor chip on the induction loop is associated and bound with the detected signal data.
[0042] The micro-ultrasonic sensor array on the microneedle can be controlled by the staff to emit ultrasonic signals, while the induction loop is in a monitoring state, listening for ultrasonic signals of the corresponding frequency. By correlating the micro-ultrasonic sensor chip at each point on the induction loop with the signal data it detects, the location of the signal source can be restored based on the induction loop.
[0043] S103 , fitting the position of the microneedle in the spatial model according to the detected signal data and displaying it.
[0044] Using the induction loop as a medium, the relative position of the microneedle and the brain is determined and displayed on the imaging system's display. If necessary, the relevant coordinate data can be displayed.
[0045] In the embodiment of the present application, after detecting the ultrasonic signal emitted by the micro-ultrasonic sensor array on the microneedle, the type of the ultrasonic signal is further identified, specifically including:
[0046] The parameters of the ultrasonic signal emitted by the micro-ultrasonic sensor array on the microneedle are obtained, compared with the detected signal data, and the reflection signal and transmission signal of the ultrasonic signal are identified.
[0047] It is understandable that ultrasonic signals of the same source have different parameters after reflection and penetration. The source parameters and medium based on the ultrasonic signal can be quickly identified and distinguished; this can help the imaging system perform double fitting, forming a contrast effect to obtain more accurate position data.
[0048] Those skilled in the art will clearly understand that the technical solutions of the embodiments of the present application can be implemented with the help of software and / or hardware. "Unit" and "module" in this specification refer to software and / or hardware that can independently perform or cooperate with other components to perform specific functions, where the hardware can be, for example, a field programmable gate array (FPGA), an integrated circuit (IC), etc.
[0049] Each processing unit and / or module in the embodiments of the present application may be implemented by an analog circuit that implements the functions described in the embodiments of the present application, or may be implemented by software that executes the functions described in the embodiments of the present application.
[0050] It should be noted that for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that this application is not limited by the order of the actions described, because according to this application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by this application.
[0051] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0052] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interface, and the indirect coupling or communication connection of the device or unit can be electrical or other forms.
[0053] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.
[0054] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.
[0055] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a memory, including a number of instructions for enabling a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned memory includes: various media that can store program codes, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.
[0056] Those skilled in the art will appreciate that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable memory, which may include: a flash drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.
[0057] The above is only an exemplary embodiment of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the specification and practicing the disclosure herein, those skilled in the art will easily think of the implementation scheme of the present disclosure. This application is intended to cover any variation, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art that are not recorded in the present disclosure. The description and examples are to be regarded as exemplary only, and the scope and spirit of the present disclosure are defined by the claims.
Claims
1. An ultrasound-assisted positioning device, characterized in that: The device comprises at least one micro-ultrasonic sensor array integrated at the front end of a microneedle and a plurality of micro-ultrasonic sensor chips distributed circumferentially and forming an induction ring relative to each other. The induction ring is sleeved on the outside of the scalp. During the microneedle implantation process, ultrasonic waves are emitted by the micro-ultrasonic sensor array. The induction ring can receive the ultrasonic waves emitted by the microneedle and fit the implantation position of the microneedle. The induction loop passes through the micro-ultrasound sensor chip, establishes a spatial coordinate system based on the position of the induction loop, and fits the spatial model of the brain in the spatial coordinate system; The induction ring is used to receive the ultrasonic waves emitted by the microneedle, and the relative position of the microneedle and the spatial model is determined by fitting using the induction ring as a medium.
2. The ultrasound-assisted positioning device according to claim 1, characterized in that: The micro ultrasonic sensor chip is composed of a single or multiple micro ultrasonic sensor unit arrays, and the number of the micro ultrasonic sensor chips is at least three.
3. The ultrasound-assisted positioning device according to claim 1, characterized in that: The multiple micro ultrasonic sensor chips on the induction ring are distributed in the same plane.
4. The ultrasound-assisted positioning device according to claim 1, characterized in that: The multiple micro ultrasonic sensor chips on the induction ring are located in multiple planes, and each plane includes at least three micro ultrasonic sensor chips.
5. The ultrasound-assisted positioning device according to claim 1, characterized in that: There is a height difference between the target implantation depth of the microneedle and the sleeve position of the induction ring, so that there is always a displacement difference between the micro-ultrasonic sensor array on the microneedle and each micro-ultrasonic sensor chip on the induction ring.
6. The ultrasound-assisted positioning device according to claim 5, characterized in that: It also includes an imaging system, which is electrically connected to each of the micro-ultrasonic sensor chips on the induction ring.
7. The ultrasound-assisted positioning device according to claim 6, characterized in that: The imaging system includes a display screen for displaying real-time images to assist in navigation of microneedle implantation in the brain.
8. The ultrasound-assisted positioning device according to claim 1, characterized in that: The ultrasonic propagation direction of the micro ultrasonic sensor array on the micro needle is consistent with the axial direction of the micro needle.
Citation Information
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