Method and device for conveying wafers

Abstract

The present invention relates to a method and device for conveying wafers, and the method comprises: manually or through a control device, moving the conveying device body to the top of the wafer; starting the driving motor to make the gripping and retracting device gripping the longest stroke, slowly moving the conveying device down close to the wafer, and setting the gripping and retracting device to the maximum stroke in an idle state; the relay controls the polarity of the power supply, positively connects the electrode, controls the motor to drive the retracting device to the maximum stroke, starts the vacuum pump to adsorb the wafer on the suction cup; the retracting device clamps the wafer at the small stroke; moves the wafer to the inside of the wafer conveying box, releases the retracting device, disconnects the suction of the suction cup, and places the wafer into the inside of the wafer conveying box, completing the conveying of the wafer this time. The present invention solves the problem that the wafer production equipment cannot be taken out and scrapped due to downtime, and improves the safety of the wafer production process.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor production and processing, and in particular relates to a method and a device for conveying wafers. Background Art

[0002] With the improvement of science and technology, intelligent, integrated and user-friendly electronic products are gradually entering people's lives, constantly changing people's lives, providing us with convenience and improving our quality of life. The improvement of semiconductor chip technology nodes has contributed greatly to this. In the chip production process, providing efficient and safe production processes can help large chip manufacturers significantly increase production capacity. This is also the responsibility of every semiconductor manufacturer, and it is also inseparable from the hard work of every engineer day and night to ensure smooth chip manufacturing process. However, all equipment has an operating cycle, and equipment may crash in an emergency. When the wafer equipment crashes, the equipment will formulate different measures to recover losses according to the severity of the situation. In some crashes, the wafers can be sent back to the wafer transfer box through the equipment's own program. In some crashes, the wafers are in the process, and after the crash, the wafers cannot be sent back to the wafer transfer box through the machine's own program. These unfinished wafers must be taken out of the wafer equipment process chamber, and if they are directly scrapped, it will cause great losses to the factory. What's more serious is that the residual chemicals and charge impurities on the wafers will cause irreversible life damage to the engineers who handle the wafers. However, if they are recycled and processed, they can complete the process and become qualified wafers, which can recover this considerable loss for the factory. This design is to solve the above problems, that is, how to manually take out the unfinished wafers in the production equipment cavity through this equipment without causing secondary pollution to the wafers. The engineers who handle this process will not directly contact the wafers, which can effectively ensure the safety of the engineers. Summary of the invention

[0003] The purpose of the present invention is to provide a method and device for transferring wafers to solve the problem that the wafer cannot be transferred back to the wafer transfer box through the machine's own program and mechanism after the wafer stops during the manufacturing process, resulting in the wafer being scrapped or the residual chemical substances and charge impurities on the wafer causing irreversible life damage to the engineer handling the wafer.

[0004] The embodiment of the present invention is achieved as follows:

[0005] In a first aspect, when the present invention adopts manual control, an embodiment of the present invention provides a method for conveying a wafer, the conveying step comprising:

[0006] Step 1. Manually move the conveyor body to the top of the wafer by moving the handle;

[0007] Step 2. Start the drive motor to make the gripping and telescopic device have the longest gripping stroke, slowly move the conveyor down close to the wafer, and observe whether the suction cup is close to the wafer or whether the groove on the gripping head is parallel to the edge of the wafer. The above-mentioned gripping and telescopic device is set to the maximum stroke in an idle state;

[0008] Step 3. The relay controls the power polarity, positively connects the electrode, controls the motor to drive the telescopic device to the maximum stroke, and starts the vacuum pump to adsorb the wafer onto the suction cup;

[0009] Step 4. The reverse electrode controls the motor to drive the telescopic device to a small stroke to clamp the wafer;

[0010] Step 5. Move the wafer in step 4 into the wafer transfer box and observe the status of the wafer detection sensor;

[0011] Step 6. When the wafer detection sensor indicates that the wafer is close to the bottom of the transfer box, release the telescopic device, disconnect the suction of the suction cup, and place the wafer into the wafer transfer box to complete the transfer of this wafer.

[0012] Secondly, when the staff uses automatic control equipment or other equipment to connect with the wafer conveying device to operate the conveying device, the steps at this time are as follows:

[0013] Step 1. Move the conveyor body to above the wafer through relevant control equipment;

[0014] Step 2. Start the drive motor through the relevant control equipment, control the gripping telescopic device to have the longest gripping stroke, control the conveyor to move down slowly to approach the wafer, and observe through specific equipment whether the conveyor is close to the wafer or whether the groove on the gripping head is parallel to the edge of the wafer. At this time, the control device sets the gripping telescopic device to the maximum stroke in the idle state;

[0015] Step 3. Control the relay through the relevant control equipment, determine the power polarity, connect the positive electrode, control the motor to drive the telescopic device to the maximum stroke, and start the vacuum pump to adsorb the wafer on the suction cup;

[0016] Step 4. Control the relay through related equipment, determine the polarity of the power supply, and reverse the electrode to control the motor to drive the telescopic device to the small stroke to clamp the wafer;

[0017] Step 5. Move the wafer in step 4 into the wafer transfer box, and observe the status of the wafer detection sensor through relevant equipment;

[0018] Step 6. When the wafer detection sensor indicates that the wafer is close to the bottom of the transfer box, the telescopic device is released through the control of relevant equipment, and the suction of the suction cup is disconnected, so that the wafer is placed inside the wafer transfer box, completing the transfer of this wafer.

[0019] In certain embodiments of the present invention, when the wafer is clamped by the clamping telescopic device in the above step 4, the clamping force is 45N.

[0020] In certain embodiments of the present invention, in the above step 5, when the wafer is moved into the transport box, the wafer is placed on the card slot and the working stroke of the clamping and telescopic device is adjusted to the longest.

[0021] In some embodiments of the present invention, the circuit control involved in the above steps 1-5 is as follows: connect the PWM input lead and the power supply 0V, and connect to 0V; connect the positive power supply to 12V; leave the other wires hanging; power on to make it work at the highest speed; at this time, the air pressure of the vacuum pump is 30kpa;

[0022] For the control of the relay: the trigger voltage and the drive voltage are electrically separated to control the switching of the power polarity of the drive motor; the above power polarity control is to switch the motor to the maximum or minimum stroke.

[0023] Input part of the circuit: DC+power supply positive pole 12V; DC-connected to power supply negative pole, IN1 and IN2 are 2-way signal trigger terminals, which can be set to high level and low level trigger; this design uses high level trigger;

[0024] Output part of the circuit: NO1, 1-way relay normally open contact, suspended before the relay is energized, and connected to the common terminal COM1 after energization; NC1, 1-way relay normally closed contact, connected to COM before the relay is energized, and disconnected from COM after energization; 2, NO2, COM2, NC2 are the same as NO1, COM1, NC1.

[0025] In a third aspect, an embodiment of the present invention provides a method and device for conveying wafers, which include: a conveying device body, a conveying arm, a clamping and telescopic device, a clamping head and a suction cup, wherein a plurality of conveying arms are arranged on the conveying device body, a clamping and telescopic device is arranged inside the conveying arm, a clamping head is arranged at one end of the clamping and telescopic device, and a plurality of suction cups are arranged at one end of the conveying arm where the clamping head is arranged.

[0026] The edge of the clamping head is provided with a groove for clamping the wafer, and the width of the groove is greater than the thickness of the wafer.

[0027] The retracted length of the above-mentioned clamping and telescopic device is 65 mm. An extension rod is arranged inside the clamping and telescopic device. The length of the extension rod is 10 mm. The fully extended length of the clamping and telescopic device is 75 mm.

[0028] The main body of the above-mentioned conveying device also includes: a pneumatic one-way valve, a control main board, a control relay, a vacuum pump and a moving handle. Multiple control relays are arranged on the control main board, and the control relays are connected to the vacuum pump signal. The pneumatic one-way valve is connected to the vacuum pump through a rubber air pipe. A moving handle is arranged on one side of the conveying device body, and the vacuum pump is arranged inside the moving handle.

[0029] The working pressure of the above-mentioned vacuum pump 9 is 0-30kpa. In the present technical content, the PMW of this equipment is set to 0 and the pressure is not adjustable. Therefore, the working pressure of the vacuum pump in the present technical content is 30kpa.

[0030] In certain embodiments of the present invention, the above-mentioned clamping and telescopic device includes: a driving motor with a speed regulation function, and the working voltage of the driving motor is 12V.

[0031] In certain embodiments of the present invention, the driving motor drives the clamping head disposed on the clamping and telescopic device to perform reciprocating motion along the direction of the clamping and telescopic device.

[0032] In certain embodiments of the present invention, a wafer detection sensor for detecting whether the vacuum suction cup has sucked up the wafer is disposed at the bottom of the conveying device body, and the wafer detection sensor is connected to the control main board signal.

[0033] In certain embodiments of the present invention, the detection distance of the wafer detection sensor is 0-5 mm. This detection distance can be adjusted according to specific needs. In the wafer transfer process involved in the present invention, the detection distance of 3 mm is the optimal detection distance.

[0034] In certain embodiments of the present invention, at least four conveying arms are evenly arranged on the conveying device body, and among the four conveying arms, adjacent conveying arms are symmetrical to each other.

[0035] In certain embodiments of the present invention, at least two suction cups are symmetrically arranged at one end of the clamping head of the above-mentioned conveying arm, and the suction cups can be adjusted according to needs. In the process of wafer conveying involved in the present invention, the optimal number of suction cups is 2. When the suction cup sucks the wafer, the position where the suction cup contacts the wafer is positioned by manual positioning of the staff or control equipment.

[0036] In certain embodiments of the present invention, a conveying cross arm is provided on the conveying device body, and two suction cups are provided at both ends of the conveying cross arm. The two ends of the conveying cross arm cannot be extended or retracted, and the absolute length of the conveying cross arm is less than the length of the maximum extension stroke of the conveying arm.

[0037] In certain embodiments of the present invention, the suction cup is connected to a pneumatic one-way valve via a rubber air tube.

[0038] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0039] 1. The device involved in the present invention solves the problem that wafer production equipment crashes in an emergency, making it impossible to remove and scrap wafers, avoids the problem of wafers being scrapped due to equipment crashes, reduces the risk of wafer scrapping, further recovers the loss of wafers, and reduces the cost of wafer processing and production.

[0040] 2. The device involved in the present invention solves the safety problem caused by manual recovery of wafers due to equipment downtime, avoids the residual chemical substances and charge impurities on the wafers causing irreversible life damage to the engineers handling the wafers, and further improves the safety of the wafer production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 is a flow chart of the steps of the transmission method of the present invention;

[0043] Figure 2-Figure 7 A schematic diagram of a circuit involved in the device of the present invention;

[0044] Figure 8 It is a structural schematic diagram of the present invention;

[0045] Fig. 9 It is a schematic diagram of the three-dimensional structure of the present invention;

[0046] Fig.10 It is a side view structural schematic diagram of the present invention;

[0047] Fig.11 It is a structural schematic diagram of the back side of the present invention;

[0048] Fig.12 It is a schematic diagram of the three-dimensional structure of the back side of the present invention;

[0049] Fig.13 It is a schematic diagram of the structure of the movable handle in the present invention.

[0050] Reference numerals

[0051] 1. Conveying device body, 2. Conveying arm, 3. Clamping and telescopic device, 4. Clamping head, 5. Suction cup, 6. Pneumatic one-way valve, 7. Control main board, 8. Control relay, 9. Vacuum pump, 10. Wafer detection sensor, 11. Conveying cross arm, 12. Moving handle. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0053] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0054] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0055] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0056] In the description of the present application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0057] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0058] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0059] Example 1

[0060] Combined with Figure 1-7 In this embodiment, a method for conveying wafers is involved. When a worker manually operates a conveying device, the steps are as follows:

[0061] Step 1. Manually move the conveyor body to the top of the wafer by moving the handle;

[0062] Step 2. Start the drive motor to make the gripping and telescopic device have the longest gripping stroke, slowly move the conveyor down close to the wafer, and observe whether the suction cup is close to the wafer or whether the groove on the gripping head is parallel to the edge of the wafer. The above-mentioned gripping and telescopic device is set to the maximum stroke in an idle state;

[0063] Step 3. The relay controls the power polarity, positively connects the electrode, controls the motor to drive the telescopic device to the maximum stroke, and starts the vacuum pump to adsorb the wafer onto the suction cup;

[0064] Step 4. The reverse electrode controls the motor to drive the telescopic device to a small stroke to clamp the wafer;

[0065] Step 5. Move the wafer in step 4 into the wafer transfer box and observe the status of the wafer detection sensor;

[0066] Step 6. When the wafer detection sensor indicates that the wafer is close to the bottom of the transfer box, release the telescopic device, disconnect the suction of the suction cup, and place the wafer into the wafer transfer box to complete the transfer of this wafer.

[0067] Example 2

[0068] Combined with Figure 1-7 In this embodiment, a method for conveying wafers is involved. When a worker uses an automatic control device or other equipment to connect with a wafer conveying device to operate the conveying device, the steps at this time are as follows:

[0069] Step 1. Move the conveyor body to above the wafer through relevant control equipment;

[0070] Step 2. Start the drive motor through the relevant control equipment, control the gripping telescopic device to have the longest gripping stroke, control the conveyor to move down slowly to approach the wafer, and observe through specific equipment whether the conveyor is close to the wafer or whether the groove on the gripping head is parallel to the edge of the wafer. At this time, the control device sets the gripping telescopic device to the maximum stroke in the idle state;

[0071] Step 3. Control the relay through the relevant control equipment, determine the power polarity, connect the positive electrode, control the motor to drive the telescopic device to the maximum stroke, and start the vacuum pump to adsorb the wafer on the suction cup;

[0072] Step 4. Control the relay through related equipment, determine the polarity of the power supply, and reverse the electrode to control the motor to drive the telescopic device to the small stroke to clamp the wafer;

[0073] Step 5. Move the wafer in step 4 into the wafer transfer box, and observe the status of the wafer detection sensor through relevant equipment;

[0074] Step 6. When the wafer detection sensor indicates that the wafer is close to the bottom of the transfer box, the telescopic device is released through the control of relevant equipment, and the suction of the suction cup is disconnected, so that the wafer is placed inside the wafer transfer box, completing the transfer of this wafer.

[0075] Example 3

[0076] When the suction cup 5 sucks the wafer, the position where the suction cup 5 contacts the wafer is positioned manually by a worker or by a control device.

[0077] In this embodiment, when the clamping and retracting device 3 clamps the wafer in the above step 4, the clamping force is 45N.

[0078] In this embodiment, in the above step 5, when the wafer is moved into the conveying box, the wafer is placed on the card slot, and the relay module 8 is used to control the power polarity switching, thereby controlling the motor to run to the maximum or minimum stroke. At this time, the working stroke of the clamping and telescopic device 3 is adjusted to the longest.

[0079] In this embodiment, the circuit control involved in the above steps 1-5 is as follows: connect the PWM input lead and the power supply 0V, and connect to 0V; connect the positive power supply to 12V; leave the other wires hanging; power on to make it work at the highest speed; at this time, the air pressure of the vacuum pump 9 is 30kpa;

[0080] For the control of the relay: the trigger voltage and the drive voltage are electrically separated to control the switching of the power polarity of the drive motor;

[0081] Input part of the circuit: DC+power supply positive pole 12V; DC-connected to power supply negative pole, IN1 and IN2 are 2-way signal trigger terminals, which can be set to high level and low level trigger; this design uses high level trigger;

[0082] Output part of the circuit: NO1, 1-way relay normally open contact, suspended before the relay is energized, and connected to the common terminal COM1 after energization; NC1, 1-way relay normally closed contact, connected to COM before the relay is energized, and disconnected from COM after energization; 2, NO2, COM2, NC2 are the same as NO1, COM1, NC1.

[0083] If the functions involved in the above control method are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, and other media that can store program codes.

[0084] Example 4

[0085] Combined with Figure 8-12The present embodiment provides a device for conveying wafers, which comprises: a conveying device body 1, a conveying arm 2, a clamping and telescopic device 3, a clamping head 4 and a suction cup 5. The conveying device body 1 is provided with a plurality of conveying arms 2, the conveying arm 2 is provided with a clamping and telescopic device 3, one end of the clamping and telescopic device 3 is provided with a clamping head 4, and one end of the conveying arm 2 where the clamping head 4 is provided is provided with a plurality of suction cups 5. When the present device performs a clamping action, the negative pressure suction provided by the suction cup 5 plays an auxiliary role, and the main fixing force for the wafer is provided by the clamping head 4.

[0086] The edge of the clamping head 4 is provided with a groove for clamping the wafer, and the width of the groove is greater than the thickness of the wafer.

[0087] The retracted length of the clamping and telescopic device 3 is 65 mm. An extension rod is provided inside the clamping and telescopic device 3. The length of the extension rod is 10 mm. The fully extended length of the clamping and telescopic device 3 is 75 mm.

[0088] An elastic structure for allowing the suction cup to expand and contract is arranged inside the suction cup, and the elastic structure is a small spring.

[0089] Example 5

[0090] Combined with Figure 8-12 The conveying device body 1 provided in this embodiment also includes: a pneumatic one-way valve 6, a control main board 7, a control relay 8, a vacuum pump 9 and a moving handle 12. A plurality of control relays 8 are arranged on the control main board 7. The pneumatic one-way valve 6 is connected to the vacuum pump 9 through a rubber air pipe. A moving handle 12 is arranged on one side of the conveying device body, and the vacuum pump 9 is arranged inside the moving handle 12.

[0091] The working pressure of the above-mentioned vacuum pump 9 is 0-30kpa. In the present technical content, the PMW of this equipment is set to 0 and the pressure is not adjustable. Therefore, the working pressure of the vacuum pump in the present technical content is 30kpa.

[0092] Preferably, in this embodiment, the clamping and retracting device 3 comprises: a driving motor, the driving motor has a speed regulation function, and the working voltage of the driving motor is 12V.

[0093] Preferably, in the present embodiment, the driving motor drives the clamping head 4 disposed on the clamping and telescopic device 3 to perform reciprocating motion along the direction of the clamping and telescopic device 3 .

[0094] Preferably, in the present embodiment, a wafer detection sensor 10 for detecting whether the vacuum suction cup 5 has sucked up the wafer is disposed at the bottom of the conveying device body 1 , and the wafer detection sensor 10 is signal-connected to the control main board 7 .

[0095] Preferably, in the present embodiment, the detection distance of the wafer detection sensor 10 is 0-5 mm. The detection distance can be adjusted according to specific needs. When the detection distance is 3 mm, it is the optimal detection distance for transferring wafers.

[0096] Preferably, in the present embodiment, at least four conveying arms 2 are evenly arranged on the conveying device body 1 , and among the four conveying arms 2 , adjacent conveying arms 2 are symmetrical to each other.

[0097] Preferably, in the present embodiment, at least two suction cups 5 are symmetrically arranged at one end of the conveying arm 2 where the clamping head 4 is arranged. The number of suction cups 5 can be adjusted according to demand. In the process of wafer conveying involved in the present invention, the optimal number of suction cups 5 is 2.

[0098] Preferably, in this embodiment, a conveying cross arm 11 is provided on the conveying device body 1, and two suction cups 5 are provided at both ends of the conveying cross arm 11. The two ends of the conveying cross arm 11 cannot be extended or retracted, and the absolute length of the conveying cross arm 11 is less than the length of the maximum extension stroke of the conveying arm 2.

[0099] Preferably, in this embodiment, the suction cup 5 is connected to the pneumatic one-way valve 6 through a rubber air pipe.

[0100] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0101] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A method for conveying a wafer, characterized in that: The method is carried out by a device for conveying wafers, wherein the device for conveying wafers comprises a conveying device body, a conveying arm, a clamping and retracting device, a clamping head, a suction cup, a pneumatic one-way valve, a control main board, a control relay, a vacuum pump and a moving handle, wherein a plurality of conveying arms are arranged on the conveying device body, a clamping and retracting device is arranged inside the conveying arm, a clamping head is arranged at one end of the clamping and retracting device, a plurality of suction cups are arranged at one end of the conveying arm where the clamping head is arranged, the pneumatic one-way valve is connected to the vacuum pump through a rubber air pipe, a moving handle is arranged at one side of the conveying device body, the vacuum pump is arranged inside the moving handle, and when the suction cup sucks the wafer, the position where the suction cup contacts the wafer is positioned by manual positioning of a staff member or positioning by a control device; The clamping and telescopic device comprises: a driving motor and a clamping head, the working voltage of the driving motor is 12V, and the driving motor drives the clamping head arranged on the clamping and telescopic device to perform reciprocating motion along the direction of the clamping and telescopic device; When the staff manually operates the conveyor, the steps are as follows: Step 1.

1. Manually move the conveyor body to the top of the wafer by moving the handle; Step 1.

2. Start the drive motor to make the gripping and telescopic device have the longest gripping stroke, slowly move the conveyor down close to the wafer, and observe whether the suction cup is close to the wafer or whether the groove on the gripping head is parallel to the edge of the wafer. The above-mentioned gripping and telescopic device is set to the maximum stroke in the idle state; Step 1.

3. The relay controls the power polarity, positively connects the electrode, controls the motor to drive the telescopic device to the maximum stroke, and starts the vacuum pump to adsorb the wafer onto the suction cup; Step 1.

4. The reverse electrode controls the motor to drive the telescopic device to a small stroke to clamp the wafer; Step 1.

5. Move the wafer in step 1.4 into the wafer transfer box and observe the status of the wafer detection sensor; Step 1.

6. When the wafer detection sensor indicates that the wafer is close to the bottom of the transfer box, release the telescopic device, disconnect the suction of the suction cup, and place the wafer into the wafer transfer box to complete the transfer of this wafer.

2. A method for conveying wafers according to claim 1, characterized in that: When the staff uses the automatic control equipment to connect with the wafer conveying device to operate the conveying device, the steps at this time are as follows: Step 2.

1. Move the conveyor body to the top of the wafer by automatic control equipment; Step 2.

2. Start the drive motor through the automatic control device, control the gripping and retracting device to have the longest gripping stroke, control the conveyor to move down slowly to approach the wafer, and observe through specific equipment whether the conveyor is close to the wafer or whether the groove on the gripping head is parallel to the edge of the wafer. At this time, the control device sets the gripping and retracting device to the maximum stroke in an idle state; Step 2.

3. Control the relay through the automatic control device, determine the power polarity, connect the positive electrode, control the motor to drive the telescopic device to the maximum stroke, and start the vacuum pump to adsorb the wafer on the suction cup; Step 2.

4. Control the relay through the automatic control device, determine the polarity of the power supply, reverse the electrode to control the motor to drive the telescopic device to the small stroke to clamp the wafer; Step 2.

5. Move the wafer in step 2.4 into the wafer transfer box, and observe the status of the wafer detection sensor through the automatic control device; Step 2.

6. When the wafer detection sensor indicates that the wafer is close to the bottom of the transfer box, the automatic control device is used to release the telescopic device and disconnect the suction of the suction cup, so that the wafer is placed inside the wafer transfer box, completing the transfer of the wafer.

3. A method for conveying wafers according to claim 1, characterized in that: When the wafer is clamped by the clamping telescopic device in step 1.4, the clamping force is 45N.

4. A method for transferring wafers according to claim 1, characterized in that: The circuit control involved in steps 1.1-1.5 is as follows: connect the PWM input lead and the power supply 0V, and connect to 0V; connect the positive power supply to 12V; power it on to make it work at the highest speed; at this time, the air pressure of the vacuum pump is 30kpa; For the control of the relay: the trigger voltage and the drive voltage are electrically separated to control the switching of the power polarity of the drive motor; Input part of the circuit: DC+ connects to the positive pole of the power supply 12V; DC- connects to the negative pole of the power supply, IN1 and IN2 are 2-way signal trigger terminals, set to high level and low level trigger; this design is high level trigger; Output part of the circuit: 1 relay normally open contact NO1, which is suspended before the relay is energized and connected to the common terminal COM1 after energization; 1 relay normally closed contact NC1, which is connected to COM before the relay is energized and disconnected from COM after energization; NO2, COM2, NC2 are the same as NO1, COM1, NC1.

5. A method for transferring wafers according to claim 4, characterized in that: A wafer detection sensor is arranged at the bottom of the conveying device body for detecting whether the vacuum suction cup has sucked up the wafer.

6. A method for transferring wafers according to claim 5, characterized in that: The wafer detection sensor is connected to the control mainboard signal, and the detection distance of the wafer detection sensor is 0-5mm.

7. A method for transferring wafers according to claim 4, characterized in that: At least four conveying arms are evenly arranged on the conveying device body, at least two suction cups are symmetrically arranged at one end of the conveying arm where the clamping head is arranged, and an elastic structure for allowing the suction cup to expand and contract is arranged inside the suction cup, and the elastic structure is a small spring.

8. A method for transferring wafers according to claim 4, characterized in that: A conveying cross arm is arranged on the conveying device body, and two suction cups are arranged at both ends of the conveying cross arm. The suction cups are connected with the pneumatic one-way valve through the rubber air pipe.

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