A wafer degumming machine blanking device and its blanking method

Abstract

The present invention discloses a wafer degumming machine blanking device and a blanking method in the technical field of wafer degumming, aiming to solve the problem that it is difficult to adaptively clamp wafers according to wafer sizes during degumming in the prior art. It includes a first side plate, a second side plate and two side rods. The first side plate and the second side plate are arranged opposite to each other. A plurality of connecting rods are connected between the first side plate and the second side plate. A plurality of groups of mounting holes are arranged at opposite positions below the first side plate and the second side plate. A bottom rod for placing wafers is connected between the corresponding mounting holes. The two side rods are movably arranged between the first side plate and the second side plate and are used for clamping and positioning the wafers. The present invention is used to realize the clamping and positioning work of wafers during degumming, can adaptively perform clamping and positioning work for a variety of different specifications of wafers, is simple to operate, has a good fixing effect, is not easy to cause pressure damage to wafers, and can effectively improve the product yield while improving the work efficiency.

Description

Technical Field

[0001] The present invention relates to a wafer degumming machine blanking device and a blanking method thereof, belonging to the technical field of wafer degumming. Background Art

[0002] When a crystal bar is sliced, it is generally fixed on the glass plate of the crystal carrier by glue. After multi-wire cutting is completed, the whole is placed into a degumming blanking device, sent to the loading station of the wafer degumming machine, and undergoes processes such as spraying, ultrasonic cleaning, ultrasonic pickling, and ultrasonic rinsing with clear water. The ultrasonic mechanical vibration with strong penetration force impacts the surface of the workpiece and, combined with the action of hot water, causes the wafer to separate from the plate and achieve the degumming effect. After the process is completed, the worker can directly take out the degummed wafer.

[0003] In a traditional fully automatic wafer degumming machine blanking device, partition plates are inserted on both sides of the saw teeth to assist in spacing the sliced wafers of the crystal bar to prevent side fall. A partition plate with a width of 18 mm is inserted every 60 MM, and on average, 12 partition plates are inserted for each cut of the crystal bar. By using the function of the partition plates for clamping, the wafers are prevented from tipping over. However, for the wafers limited in this way, due to the influence of their size and gravity, the local contact points of the wafers are subjected to excessive pressure. When the wafers are separated from the partition plates, they are easily damaged locally due to the rigid contact. There is no good self-adaptability for limiting wafers of different sizes. The traditional operation method of adjusting the position of the side plates to limit the wafers is also relatively troublesome and needs to be adjusted one by one according to different model specifications of the wafers, which greatly affects the work efficiency. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a wafer degumming machine blanking device and a blanking method thereof, which are used to realize the clamping and positioning of wafers during degumming, can adaptively perform clamping and positioning work for a variety of different specifications of wafers, have simple operation, good fixing effect, are not easy to cause pressure damage to the wafers, and can effectively improve the product yield while improving the work efficiency.

[0005] To achieve the above purpose, the present invention is implemented by the following technical solutions:

[0006] On the one hand, a wafer degumming machine blanking device provided by the present invention includes a first side plate, a second side plate, and two side rods. The first side plate and the second side plate are arranged opposite to each other. A plurality of connecting rods are connected between the first side plate and the second side plate. A plurality of groups of mounting holes are arranged at opposite positions below the first side plate and the second side plate. A bottom rod for placing wafers is connected between the corresponding mounting holes. The two side rods are movably arranged between the first side plate and the second side plate and are used for clamping and positioning the wafers.

[0007] Two rotating shafts are rotatably arranged on each of the first side plate and the second side plate. The four rotating shafts are all at the same height position. The two rotating shafts on the first side plate correspond to the two rotating shafts on the second side plate. A side rod fixing block is installed on each rotating shaft, and both ends of the two side rods are positioned on the corresponding side rod fixing blocks;

[0008] A first counterweight plate is slidably arranged vertically on the second side plate. Two driving shafts of the same height are arranged on both sides of the first counterweight plate. Connecting plates are fixedly installed on the two rotating shafts located on the second side plate. Chute grooves are provided on both of the two connecting plates, and the two driving shafts are arranged in the corresponding chute grooves.

[0009] Specifically, the overall structure of the side rod fixing block is U-shaped. The fixing shafts at both ends of each side rod are arranged in the U-shaped notch of the side rod fixing block. A plurality of positioning holes are opened on one side of each side rod fixing block, and the positioning holes are used for inserting locking bolts to lock the end of the side rod in the corresponding position.

[0010] Specifically, a shaft hole for inserting the rotating shaft is provided on each side rod fixing block. A positioning hole perpendicular to the axis of the shaft hole and communicating with the shaft hole is opened on one side of each side rod fixing block, and the fixing hole is used for threadedly connecting a locking bolt to lock the angular position of the side rod fixing block.

[0011] Specifically, a counterweight window is opened on the second side plate. A second counterweight plate is installed on the first counterweight plate. Sliding ports for sliding on both sides of the counterweight window are formed on both sides of the first counterweight plate after being combined with the second counterweight plate.

[0012] Specifically, the shape of the installation hole is a gourd hole, and both sides of the bottom rod are provided with I-shaped joints.

[0013] Specifically, a number of inclined guide plates are fixedly arranged on the opposite sides of the first side plate and the second side plate, and a V-shaped structure is formed between every two corresponding inclined guide plates.

[0014] Specifically, a silica gel cushion tube and a sponge ring tube are sequentially coated on the outside of the two side rods from the inside to the outside.

[0015] Specifically, through ports that can cooperate with each other are opened on the second side plate and the first counterweight plate, and a pull-ring type spring positioning pin for restricting the first counterweight plate at a corresponding height position is inserted into the through port.

[0016] Specifically, the installation holes at all the same heights on the first side plate and the second side plate are one layer, and the installation holes are not less than two layers, and the bottom rod is detachably installed in the corresponding installation holes.

[0017] On the other hand, a feeding method for wafer degumming provided by the present invention includes a wafer degumming machine feeding device described in any one of the above, and the method includes the following steps:

[0018] Lift the first counterweight plate, drive the rotation of the rotating shaft by using the chute part of the connecting plate, and make the two side rods in an open state;

[0019] Lower the crystal holder so that the crystal holder lands on the tool connecting rod;

[0020] Drive the first counterweight plate to slowly fall freely until it cannot fall any further and then release it. Use the torque generated by the gravity of the first counterweight plate on the rotating shaft to close the side rods and clamp the wafer.

[0021] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0022] 1. In the present invention, the side rods are limited by arranging a rotating shaft and a side rod fixing block on the first side plate and the second side plate, so that the two side rods can be unfolded and stored centered on the rotating shaft. When it is necessary to clamp the wafer, the two side rods are opened by lifting the first counterweight plate, and after the wafer is placed, the gravity of the first counterweight plate is used to drive the two side rods to close and clamp the wafer. At this time, the size range that the clamping action can provide is relatively large, and the clamping effect can be adapted to different wafer specifications, which simplifies the operation and effectively improves the versatility of the equipment;

[0023] 2. The clamping force of the wafer in the present invention is mainly controlled by the gravity of the first counterweight plate. The gravity of the first counterweight plate generates a torque on the rotating shaft, and based on this, the side rods clamp the side edge of the wafer. When it is necessary to take out the wafer, directly lift the first counterweight plate to open the side rods, which can effectively avoid the pressure damage caused by forcibly taking out between the side rods and effectively ensure the production yield of the product;

[0024] 3. In the present invention, an inclined guide plate is provided for guiding the crystal holder when it is lowered, so that the crystal holder can be accurately lowered through the guidance of the hypotenuse, which is beneficial to accurately clamping the wafer below;

[0025] 4. In the present invention, a plurality of positioning holes are provided on the side rod fixing block for adjusting the gear where the side rod is located, and the clamping pressure on the wafer can be further adjusted according to different wafer size requirements; in addition, a fixing hole for adjusting the initial angle of the side rod fixing block is also provided on the side rod fixing block, which can be reflected as adjusting the clamping force on wafers of different sizes by adjusting the end position of the first counterweight plate, and can effectively cope with the size specifications of a variety of different wafers to adjust the pressure on the wafer and ensure that the wafer clamping force is within a suitable range;

[0026] 5. The present invention sets a counterweight window on the blanking device, and sets a first counterweight plate and a second counterweight plate on both sides of the counterweight window to slide along the counterweight window, which is beneficial to adjusting the counterweight according to the counterweight plate specifications and can also reduce the overall weight of the blanking device, ensuring good economic benefits of the equipment. Brief Description of the Drawings

[0027] Figure 1 is a schematic internal structure diagram of a wafer debonding and blanking device provided by an embodiment of the present invention;

[0028] Figure 2 is the present invention Figure 1 a sectional view taken along the A-A direction of a wafer debonding and blanking device provided by an embodiment of the present invention;

[0029] Figure 3 is the present invention Figure 1 an enlarged view of the structure at B of a wafer debonding and blanking device provided by an embodiment of the present invention;

[0030] Figure 4 is a side view of a wafer debonding and blanking device provided by an embodiment of the present invention;

[0031] Reference Numerals: 1, first side plate; 2, second side plate; 3, rotating shaft; 4, bearing seat; 5, side rod fixing block; 6, connecting plate; 7, first counterweight plate; 8, driving shaft; 9, side rod; 10, mounting hole; 11, bottom rod; 12, fixing hole; 13, positioning hole; 14, counterweight window; 15, second counterweight plate; 16, lifting lug; 17, inclined guide plate; 18, silica gel pad tube; 19, sponge ring tube; 20, connecting rod; 21, pull-ring type spring positioning pin. Detailed Description of the Invention

[0032] The present invention will be further described below with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and cannot be used to limit the protection scope of the present invention.

[0033] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0034] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific circumstances.

[0035] Example 1:

[0036] A wafer debonding machine blanking device provided by an embodiment of the present invention is used to realize the clamping and positioning of wafers during debonding. It can adaptively perform clamping and positioning work for a variety of different specifications of wafers. The operation is simple, the fixing effect is good, and it is not easy to cause pressure damage to the wafers. It can effectively improve the product yield while improving work efficiency. To achieve the above functions, a blanking device is provided here, which includes a first side plate 1, a second side plate 2, and two side rods 9. The first side plate 1 and the second side plate 2 are arranged opposite to each other, and a plurality of connecting rods 20 are connected between the first side plate 1 and the second side plate 2 to realize the relative fixation between the first side plate 1 and the second side plate 2, forming a blanking frame. To ensure the supporting effect on the wafers, a plurality of groups of mounting holes 10 are provided at the relative positions below the first side plate 1 and the second side plate 2, and a bottom rod 11 for placing the wafers is connected between the corresponding mounting holes 10 (the number of bottom rods 11 is not less than two). By placing the wafers to be debonded on the bottom rod 11, the normal placement of the wafers after debonding can be realized. To achieve the clamping work of the wafers, the two side rods 9 are movably arranged between the first side plate 1 and the second side plate 2 to clamp and position the wafers; to provide an adaptive clamping means for the side rods 9 and make the device easy to adjust, two rotating shafts 3 are rotatably arranged on both the first side plate 1 and the second side plate 2 (bearing seats 4 can be provided as shown in Figure 3 to ensure good rotation performance). Four rotating shafts 3 are all at the same height position (as shown in Figure 1 and Figure 2 ). At this time, the two rotating shafts 3 on the first side plate 1 correspond to the two rotating shafts 3 on the second side plate 2, and a side rod fixing block 5 is installed on each rotating shaft 3. The two ends of the two side rods 9 are positioned on the corresponding side rod fixing blocks 5 (the structure of the side rod fixing block 5 is not limited. Here, the side rod fixing block 5 is used not only to fix the side rod 9 but also to provide a force arm, so the axis of the side rod 9 should not be concentric with the rotating shaft 3). When the rotating shaft 3 rotates correspondingly, the side rod fixing block 5 will drive the side rod 9 to rotate synchronously. Under the simultaneous action of the two side rods 9, it is shown as the expansion or retraction of the whole side rod 9; to provide good driving for the movement of the side rod 9, a first counterweight plate 7 is slidably arranged vertically on the second side plate 2 here. Specifically, two driving shafts 8 of the same height are provided on both sides of the first counterweight plate 7 (as shown in Figure 4As shown in the figure, connecting plates 6 are fixedly installed on both rotating shafts 3 of the second side plate 2. Chutes are provided on both connecting plates 6, and two driving shafts 8 are slidably arranged in the corresponding chutes. When the device is working, the first counterweight plate 7 is first lifted. At this time, the driving shaft 8 slides in the chute, the connecting plate 6 drives the rotating shaft 3 to rotate, and the rotating shaft 3 drives the side rod fixing block 5 to open the side rod 9. After the wafer is placed, the first counterweight plate 7 is slowly lowered, and the gravity of the first counterweight plate 7 is used to clamp the wafer with the side rod 9. This clamping method can effectively clamp wafers of different specifications and models. Because it has a certain degree of freedom, it can effectively avoid damage to the wafer caused by rigid contact when taking the wafer (the first counterweight plate 7 can also be appropriately lifted directly), which can greatly improve the product yield while simplifying the operation process and improving work efficiency.

[0037] A wafer debonding machine blanking device provided by an embodiment of the present invention specifically provides a method for improving the clamping pressure according to the wafer size. Specifically, the overall structure of the side rod fixing block 5 is set to be U-shaped, and the fixing shafts at the ends of each side rod 9 are arranged in the U-shaped notch of the side rod fixing block 5. A plurality of positioning holes 13 (preferably four here, as shown in the figure) are opened on one side of each side rod fixing block 5. The end of the side rod 9 is locked in the corresponding position by inserting a locking bolt through the positioning hole 13. When the wafer size specification changes, due to the different positions of the side rod 9, the clamping position will change, and the change of the moment and the force arm will re-change the pressure on the wafer, and the clamping pressure can be adjusted through this method. In addition to adapting to different wafer sizes, it is also beneficial to ensure a good pressure effect on the wafer. Figure 2 A wafer debonding machine blanking device provided by an embodiment of the present invention provides a more extensive adjustment means to change the pressure application effect on the wafer. Specifically, a shaft hole for inserting the rotating shaft 3 is provided on each side rod fixing block 5, and a fixing hole 12 perpendicular to the axis direction of the shaft hole and communicating with the shaft hole is opened on one side of each side rod fixing block 5 (as shown in the figure). The fixing hole 12 is used to threadedly connect a locking bolt to lock the angular position of the side rod fixing block 5. When debugging the device, the initial angular position of the side rod fixing block 5 can be adjusted first to change the initial state of the side rod 9. Since the final positions of the side rods 9 are all located on the side walls of the wafer, the final position of the connecting plate 6 will also change accordingly. When the final angles of the connecting plates 6 are different, since the mass of the first counterweight plate 7 has not changed, the moment provided to the rotating shaft 3 is also different. Therefore, the force applied to the wafer can be optimized by adjusting the initial position of the side rod fixing block 5 here.

[0038] A wafer debonding machine blanking device provided by an embodiment of the present invention provides a more extensive adjustment means to change the pressure application effect on the wafer. Specifically, a shaft hole for inserting the rotating shaft 3 is provided on each side rod fixing block 5, and a fixing hole 12 perpendicular to the axis direction of the shaft hole and communicating with the shaft hole is opened on one side of each side rod fixing block 5 (as shown in the figure). The fixing hole 12 is used to threadedly connect a locking bolt to lock the angular position of the side rod fixing block 5. When debugging the device, the initial angular position of the side rod fixing block 5 can be adjusted first to change the initial state of the side rod 9. Since the final positions of the side rods 9 are all located on the side walls of the wafer, the final position of the connecting plate 6 will also change accordingly. When the final angles of the connecting plates 6 are different, since the mass of the first counterweight plate 7 has not changed, the moment provided to the rotating shaft 3 is also different. Therefore, the force applied to the wafer can be optimized by adjusting the initial position of the side rod fixing block 5 here. Figure 2 A wafer debonding machine blanking device provided by an embodiment of the present invention provides a more extensive adjustment means to change the pressure application effect on the wafer. Specifically, a shaft hole for inserting the rotating shaft 3 is provided on each side rod fixing block 5, and a fixing hole 12 perpendicular to the axis direction of the shaft hole and communicating with the shaft hole is opened on one side of each side rod fixing block 5 (as shown in the figure). The fixing hole 12 is used to threadedly connect a locking bolt to lock the angular position of the side rod fixing block 5. When debugging the device, the initial angular position of the side rod fixing block 5 can be adjusted first to change the initial state of the side rod 9. Since the final positions of the side rods 9 are all located on the side walls of the wafer, the final position of the connecting plate 6 will also change accordingly. When the final angles of the connecting plates 6 are different, since the mass of the first counterweight plate 7 has not changed, the moment provided to the rotating shaft 3 is also different. Therefore, the force applied to the wafer can be optimized by adjusting the initial position of the side rod fixing block 5 here.

[0039] A blanking device for a wafer debonding machine provided by an embodiment of the present invention. Considering that when the first counterweight plate 7 slides alone, the thickness of the second side plate 2 required by the first counterweight plate 7 is relatively large, which not only increases the production cost but also increases the weight of the equipment and is not convenient for transportation. Therefore, a counterweight window 14 is opened on the second side plate 2, and a second counterweight plate 15 is installed on the first counterweight plate 7. The two sides after the first counterweight plate 7 is combined with the second counterweight plate 15 form sliding ports that are slidably arranged on both sides of the counterweight window 14, enabling the first counterweight plate 7 and the second counterweight plate 15 to slide on the counterweight window 14. The setting of the counterweight window 14 and the second counterweight plate 15 can not only effectively save the equipment quality but also ensure a good disassembly and assembly effect, which is beneficial to the adjustment and maintenance of the equipment counterweight in the later stage.

[0040] A blanking device for a wafer debonding machine provided by an embodiment of the present invention. Considering that the traditional method of installing the bottom rod 11 with screws will cause the screws to fail and the bottom rod 11 to become loose after long-term use, this situation will cause the wafer to turn over the frame, seriously affecting production and resulting in losses. Therefore, the shape of the installation hole 10 is a gourd hole, and both sides of the bottom rod 11 are provided with I-shaped joints. The I-shaped joints can be placed in the small holes where the gourd holes are located, and the stable placement of the bottom rod 11 is ensured by the gravity effect.

[0041] A blanking device for a wafer debonding machine provided by an embodiment of the present invention. To ensure the accurate placement of the crystal holder, a number of inclined guide plates 17 are fixedly arranged on the opposite sides of the first side plate 1 and the second side plate 2 (the inclined guide plates 17 can be installed on the connecting rod 20 for support as shown in Figure 1 ). By setting that each two corresponding inclined guide plates 17 form a V-shaped structure with each other, the crystal holder structure part can move down along the V-shaped guide structure when falling, ensuring the accuracy of the crystal holder position. In the figure, the lifting lug 16 is used to lift and adjust the position of the blanking device.

[0042] A blanking device for a wafer debonding machine provided by an embodiment of the present invention. To further improve the resistance to wafer crushing, a silica gel pad tube 18 and a sponge ring tube 19 (or a tube formed by a silica gel pad and a sponge ring) are sequentially coated and arranged on the outer sides of the two side rods 9 from the inside to the outside, protecting the contact between the wafer and the side rods 9 through flexible contact.

[0043] A blanking device for a wafer debonding machine provided by an embodiment of the present invention. For ease of operation, when the first counterweight plate 7 moves upward, the first counterweight plate 7 should be fixed to save resources. To this end, through holes that can correspond and cooperate with each other are provided on the second side plate 2 and the first counterweight plate 7, and a pull-ring type spring positioning pin 21 for restricting the first counterweight plate 7 at a corresponding height position is inserted into the through holes. The pull-ring type spring positioning pin 21 is used to ensure the height position of the first counterweight plate 7, and thereby keep the two side rods 9 in an open state all the time.

[0044] A blanking device for a wafer debonding machine provided by an embodiment of the present invention. Since wafers of different sizes require different padding heights (this embodiment can meet wafers in the range of 157 - 300 sizes, and the preferably adapted wafer size is between 182*182 - 230*230), all mounting holes 10 at the same height on the first side plate 1 and the second side plate 2 are defined as one layer. Here, by providing no less than two layers of mounting holes 10, it is convenient to adjust the placement position according to the wafer size. At this time, the bottom rod 11 should be detachably installed on the corresponding mounting hole 10 for easy adjustment (or directly use a gourd hole for placement through the above embodiment method). Taking a wafer of 182*182 size as an example, first, the bottom rod 11 for placing the wafer is adjusted to be between the relatively upper-layer mounting holes 10 (it can be directly moved and embedded through the gourd hole), then the initial angle of the side rod fixing block 5 and the gear position of the side rod 9 on the side rod fixing block 5 are adjusted to adjust the pressure required for the wafer. After the adjustment is completed, the first counterweight plate 7 is driven to move upward. After the crystal tray is inserted, the first counterweight plate 7 is slowly lowered to clamp the wafer with the side rods 9; for a larger-size wafer such as 210*210 specification, it is the same principle. First, the bottom rod 11 is adjusted to a lower position, then the initial angle of the initial side rod fixing block 5 and the gear position of the side rod 9 are readjusted according to the pressure required for the 210 wafer, and finally the above operation steps are repeated.

[0045] Embodiment Two:

[0046] A blanking method for wafer debonding provided by an embodiment of the present invention, including a blanking device for a wafer debonding machine according to any one of Embodiment One, which can provide an effective means for the use of the device. The specific setting method includes the following steps:

[0047] Lift the first counterweight plate 7, drive the rotating shaft 3 to rotate by using the chute part of the connecting plate 6, and make the two side rods 9 in an open state (at this time, the first counterweight plate 7 needs to be positioned for subsequent operations. The specific action method can be through the maintenance of mechanical actions, padding the first counterweight plate 7, or automatically locking by referring to the pull-ring type spring positioning pin 21 in the above embodiment, etc.);

[0048] Insert the crystal tray so that the crystal tray lands on the tooling connecting rod 20;

[0049] Drive the first counterweight plate 7 to slowly fall freely (when using the pull-ring type spring positioning pin 21, it is necessary to unlock the pull-ring type spring positioning pin 21 first), and release it until it can no longer fall (the driving action can be stopped in time by adapting the corresponding pressure sensor or resistance sensor to prevent mechanical pressure damage to the wafer). Use the torque generated by the gravity of the first counterweight plate 7 on the rotating shaft 3 to retract the side rod 9 and clamp the wafer.

[0050] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art of this technology, without departing from the technical principle of the present invention, several improvements and deformations can be made, and these improvements and deformations should also be regarded as the protection scope of the present invention.

Claims

1. A blanking device for a wafer debonding machine, characterized in that It includes a first side plate (1), a second side plate (2) and two side rods (9). The first side plate (1) and the second side plate (2) are arranged oppositely. A plurality of connecting rods (20) are connected between the first side plate (1) and the second side plate (2). At the relative positions below the first side plate (1) and the second side plate (2), a plurality of groups of mounting holes (10) are provided. A bottom rod (11) for placing wafers is connected between the corresponding mounting holes (10). The two side rods (9) are movably arranged between the first side plate (1) and the second side plate (2) for clamping and positioning the wafers. Two rotating shafts (3) are rotatably arranged on each of the first side plate (1) and the second side plate (2). The four rotating shafts (3) are all at the same height position. The two rotating shafts (3) on the first side plate (1) correspond to the two rotating shafts (3) on the second side plate (2). A side rod fixing block (5) is installed on each rotating shaft (3). The two ends of the two side rods (9) are positioned on the corresponding side rod fixing blocks (5). A first counterweight plate (7) is slidably arranged vertically on the second side plate (2). Two driving shafts (8) of the same height are arranged on both sides of the first counterweight plate (7). Connecting plates (6) are fixedly installed on the two rotating shafts (3) located on the second side plate (2). Two chutes are provided on each of the two connecting plates (6). The two driving shafts (8) are arranged in the corresponding chutes. A counterweight window (14) is opened on the second side plate (2). A second counterweight plate (15) is installed on the first counterweight plate (7). The two sides of the first counterweight plate (7) after being combined with the second counterweight plate (15) form sliding openings slidably arranged on both sides of the counterweight window (14). Silicone pad tubes (18) and sponge ring tubes (19) are sequentially coated on the outer sides of the two side rods (9) from inside to outside.

2. The blanking device of a wafer debonding machine according to claim 1, wherein, The overall structure of the side rod fixing block (5) is U-shaped. The fixed shafts at the ends of each side rod (9) are arranged in the U-shaped notch of the side rod fixing block (5). A plurality of positioning holes (13) are opened on one side of each side rod fixing block (5). The positioning holes (13) are used for inserting locking bolts to lock the ends of the side rod (9) in the corresponding positions.

3. The blanking device of a wafer debonding machine according to claim 1, wherein, Each side rod fixing block (5) is provided with a shaft hole for inserting the rotating shaft (3). A fixing hole (12) perpendicular to the axis direction of the shaft hole and communicating with the shaft hole is opened on one side of each side rod fixing block (5). The fixing hole (12) is used for threadedly connecting a locking bolt to lock the angular position of the side rod fixing block (5).

4. The blanking device of a wafer debonding machine according to claim 1, characterized in that The shape of the mounting hole (10) is a gourd hole. Both sides of the bottom rod (11) are provided with I-shaped joints.

5. The blanking device of a wafer debonding machine according to claim 1, characterized in that, A number of inclined guide plates (17) are fixedly arranged on the opposite sides of the first side plate (1) and the second side plate (2). Each two corresponding inclined guide plates (17) form a V-shaped structure with each other.

6. The blanking device of a wafer debonding machine according to claim 1, wherein, The second side plate (2) and the first counterweight plate (7) are provided with through openings that can correspond and cooperate with each other, and a pull-ring type spring positioning pin (21) for restricting the first counterweight plate (7) at a corresponding height position is inserted into the through openings.

7. A wafer debonding machine blanking device according to any one of claims 1-6, characterized in that, The mounting holes (10) at all the same heights on the first side plate (1) and the second side plate (2) are one layer, there are no less than two layers of the mounting holes (10), and the bottom rod (11) is detachably mounted on the corresponding mounting holes (10).

8. A blanking method for wafer de-bonding, characterized in that, Comprising a wafer debonding machine blanking device according to any one of claims 1-6, the method comprising the following steps: Lift the first counterweight plate (7), drive the rotation of the rotating shaft (3) by means of the chute part of the connecting plate (6), and make the two side rods (9) in an open state; Lower the crystal holder so that the crystal holder lands on the tool connecting rod (20); Drive the first counterweight plate (7) to slowly fall freely until it cannot fall any further and then let go, and use the torque generated by the gravity of the first counterweight plate (7) on the rotating shaft (3) to close the side rods (9) and clamp the wafer.

Images